Temperature measuring device

Abstract

A temperature measuring device is provided, which is composed of a flexible printed wiring board having a wiring, a heat sensitive element, a heat collecting plate, and a pressing member, the flexible printed wiring board is mounted on a cover which is fixed to a measured object, the heat sensitive element is electrically connected with the wiring, the heat collecting plate is arranged to be pressed on a temperature measuring position of the measured object on the side opposite to the heat sensitive element through the flexible printed wiring board, the pressing member is composed of a foam material and is compressed to press the heat collecting plate on the measured object when the cover is fixed to the measured object.

Description

[0001] Cross-reference of related applications

[0002] This application is based on Japanese Patent Application No. 2020-133935, filed with the Japan Patent Office on August 6, 2020, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This invention relates to a temperature measuring device. Background Technology

[0004] Temperature measuring devices for measuring the temperature of an object are known to the public. For example, battery packs installed in electric vehicles are equipped with devices for measuring the temperature of the battery pack. In such devices, the batteries within the battery pack need to be in reliable contact with the thermistor mounting portion. For example, a method of attaching the thermistor mounting portion with adhesive tape is known. However, this method is prone to peeling due to adhesive deterioration. Therefore, this method lacks reliability. Therefore, conventionally, mechanisms have been used to press the thermistor mounting portion onto the battery more reliably using springs such as coil springs or leaf springs, regardless of the dimensional tolerances of various components. Using such a mechanism allows for stable temperature measurement (see Japanese Patent Publication No. 2019-74327). However, using such a mechanism increases the number of components. Therefore, not only does assembly time increase, but the installation space also expands, leading to higher costs. Therefore, a simpler and more stable temperature measuring device is desired. Summary of the Invention

[0005] The purpose of this embodiment is to provide a temperature measuring device that can reduce the number of components and can stably measure temperature.

[0006] In this embodiment, the following apparatus is used to solve the above problems.

[0007] That is, the temperature measuring device of the present invention comprises a flexible printed wiring board with wiring, a thermistor, a heat collection plate, and a pressing member. The flexible printed wiring board is mounted on an outer cover fixed to the object being measured. The thermistor is electrically connected to the wiring. The heat collection plate is configured to be pressed onto the temperature measuring position of the object being measured on the side opposite to the thermistor via the flexible printed wiring board. The pressing member is made of foam material. When the outer cover is fixed to the object being measured, the pressing member is compressed, pressing the heat collection plate onto the object being measured.

[0008] According to the present embodiment, the pressing member made of a foam material is compressed when the housing is fixed to the measured object. Thus, the heat collecting plate is pressed against the measured object. Further, only the pressing member is provided, and the heat collecting plate can press the measured object with a small number of members. In addition, the heat collecting plate is pressed against the measured object. Therefore, the heat collecting plate can be brought into contact with the measured object regardless of dimensional tolerances of various members. Thus, temperature can be stably measured.

[0009] Further, the temperature measuring device of the other invention is composed of a flexible printed wiring board having a wiring, a thermosensitive element, and a pressing member, the flexible printed wiring board being mounted on a housing fixed to a measured object, the thermosensitive element being electrically connected to the wiring, the pressing member being made of a foam material and being compressed when the housing is fixed to the measured object, and the flexible printed wiring board being pressed against the measured object.

[0010] According to the present embodiment, the pressing member made of a foam material is compressed when the housing is fixed to the measured object. Thus, the heat collecting plate is pressed against the measured object. Further, only the pressing member is provided, and the heat collecting plate can press the measured object with a small number of members. In addition, the heat collecting plate is pressed against the measured object. Therefore, the heat collecting plate can be brought into contact with the measured object regardless of dimensional tolerances of various members. Thus, temperature can be stably measured.

[0011] The flexible printed wiring board can also have the wiring connected to the thermosensitive element, and a wiring for measuring a voltage of the measured object.

[0012] Thus, it is not necessary to separately provide a wiring member for voltage measurement and a wiring member for temperature measurement. Therefore, the number of members can be further reduced.

[0013] The pressing member has a cavity portion in which the thermosensitive element is disposed, and is fixed to the housing and the flexible printed wiring board, respectively.

[0014] Further, the pressing member preferably has a reinforcing plate, and is fixed to the housing and the reinforcing plate, respectively, the reinforcing plate having a cavity portion in which the thermosensitive element is disposed and being fixed to the flexible printed wiring board.

[0015] Further, the temperature measuring device further includes a reinforcing plate having a cavity portion in which the thermosensitive element is disposed and being fixed to the flexible printed wiring board, and a cover covering the cavity portion of the reinforcing plate, and the pressing member is preferably fixed to the housing and the cover, respectively.

[0016] According to such a configuration, entry of foreign matter and the like into the cavity portion in which the heat-sensitive element is disposed can be suppressed.

[0017] Further, it is preferable that the pressing member have waterproof properties.

[0018] Further, the heat-sensitive element is preferably embedded in a sealing material.

[0019] Further, the above-described configurations can be combined as much as possible.

[0020] As described above, according to the present embodiment, the number of components can be reduced and temperature can be stably measured. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 is a plan view of a battery pack used in the present embodiment.

[0022] Figure 2 is a side view of a battery pack used in the present embodiment.

[0023] Figure 3 is a plan view showing a voltage monitoring device used in the present embodiment mounted on a battery pack.

[0024] Figure 4 is a side view showing a voltage monitoring device used in the present embodiment mounted on a battery pack.

[0025] Figures 5A-5B is a schematic cross-sectional view of a voltage monitoring device in the vicinity of a temperature measuring device in Embodiment 1.

[0026] Figures 6A-6C is a schematic configuration view of a temperature measuring device in Embodiment 1.

[0027] Figures 7A-7C is a schematic configuration view of a temperature measuring device in Embodiment 2.

[0028] Figures 8A-8C is a schematic configuration view of a temperature measuring device in Embodiment 3.

[0029] Figures 9A-9C is a schematic configuration view of a temperature measuring device in Embodiment 4.

[0030] Figures 10A-10C is a schematic configuration view of a temperature measuring device in Embodiment 5.

[0031] Figures 11A-11C is a schematic configuration view of a temperature measuring device in Embodiment 6.

[0032] Figures 12A-12C is a schematic configuration view of a temperature measuring device in Embodiment 7.

[0033] Figures 13A-13C is a brief configuration diagram of the temperature measuring device in Embodiment 8. DETAILED DESCRIPTION

[0034] In the following detailed description, for the purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the disclosed embodiments. It will be apparent, however, that one or more embodiments can be practiced without these specific details. In other instances, well-known structures and devices are schematically shown in order to simplify the drawing.

[0035] The present embodiments are described in detail below with reference to the attached drawings. However, the present embodiments are not intended to be limited to the embodiments described herein, but are to be accorded the full scope shared by the claims. The same reference numbers in different drawings identify the same or similar elements.

[0036] In the following embodiments, as an example, a temperature measuring device for a voltage monitoring device for a battery pack mounted on an electric vehicle or the like is described. However, the temperature measuring device in the present embodiments can be applied to measure the temperature of various measurement targets.

[0037] (Outline of the battery pack and the voltage monitoring device)

[0038] Before describing the temperature measuring device of the present embodiments, the outline of the battery pack and the voltage monitoring device is described with reference to Figures 1-4 Figure 1 is a plan view (view from above) showing the brief structure of the battery pack used in the present embodiments. Figure 2 is a side view showing the brief structure of the battery pack of the present embodiments. Figure 3 is a plan view (view from above) briefly showing the voltage monitoring device used in the present embodiments mounted on the battery pack. Figure 4 is a side view briefly showing the voltage monitoring device used in the present embodiments mounted on the battery pack.

[0039] The battery pack 200 includes a plurality of batteries 210. The plurality of batteries 210 are arranged with the positive electrode 211 and the negative electrode 212 adjacent to each other. In addition, the plurality of batteries 210 are electrically connected with the adjacent positive electrode 211 and negative electrode 212 by the bus bars 131, 132. Thus, the plurality of batteries 210 are connected in series. Further, for the purpose of explanation, the illustrated mode shows the battery pack 200 including six batteries 210. However, generally, the battery pack mounted on an electric vehicle or the like includes more batteries.

[0040] As shown in Figure 3 ​As shown, the voltage monitoring device 100 includes a flexible printed wiring board (hereinafter referred to as FPC) 110, a housing 120 on which the FPC 110 is mounted, and the busbars 131 and 132 mounted on the housing 120. Figure 4 As shown, connector 150 is mounted on the front end of FPC 110. That is, connector 150 connects to measuring device 300, which measures the voltage and temperature of the batteries 210 included in battery pack 200 and performs various controls, and FPC 110. Furthermore, Figure 4 This indicates a method of measuring voltage and temperature using a single measuring device 300. However, in other configurations, the wiring of the FPC110 can also be branched into wiring for voltage measurement and wiring for temperature measurement. In this case, each end is provided with a connector. One of these connectors connects to the device used for voltage measurement, while the other connectors connect to the device used for temperature measurement.

[0041] Furthermore, as described above, the voltage monitoring device 100 measures not only voltage but also temperature. Therefore, it is equipped with a temperature measuring device 140. Figure 3 The ellipse shows a partially enlarged top view of the area near the temperature measuring device 140 when the outer casing 120 is removed. The FPC 110 has wiring 111 for measuring voltage and wiring 112 for measuring temperature. Furthermore, the structure of the FPC 110 is known technology; therefore, its detailed description is omitted. Generally, the FPC 110 includes, for example, a base film, wiring formed by etching copper foil onto the base film, and a cover film covering the wiring. Additionally, the voltage of all the batteries 210 included in the battery pack 200 is monitored. However, it is not necessary to monitor the temperature of all the batteries 210. Figure 3 This indicates a case where only one temperature measuring device 140 is installed. However, typically, temperature is monitored at multiple locations using temperature measuring devices installed in multiple locations.

[0042] As described above, the voltage monitoring device 100 used in this embodiment has both functions as a voltage measuring device and as a temperature measuring device. Hereinafter, several embodiments of the temperature measuring device that functions as a temperature measuring device will be shown.

[0043] (Implementation Method 1)

[0044] Reference Figures 5A-5B as well as Figures 6A-6C The temperature measuring device of Embodiment 1 will be described below. Figures 5A-5B This is a schematic cross-sectional view of the voltage monitoring device 100 near the temperature measuring device in Embodiment 1. Figures 5A-5BA cross section obtained when the voltage monitoring device 100 and the battery 210 are cut along the long direction of the battery 210 in the vicinity where the temperature measuring device is provided is schematically shown. Figure 5A A case where the voltage monitoring device 100 is fixed to the battery pack 200 (battery 210) is shown. Figure 5B The voltage monitoring device 100 fixed to the battery pack 200 is shown. Figures 6A-6C is a schematic configuration view of the temperature measuring device of Embodiment 1. Further, Figure 6A is a plan view of the temperature measuring device. Figure 6B is Figure 6A is an AA cross-sectional view in Figure 6C is Figure 6A is a BB cross-sectional view in

[0045] The temperature measuring device 140 of the present embodiment is provided with the above-described FPC 110 mounted on the housing 120, and a thermosensitive element 141 electrically connected to the wiring 112 provided in the FPC 110. The housing 120 is fixed to the battery pack 200 (battery 210) which is the object to be measured. The housing 120 is provided with a through hole 121. An electrode (only the positive electrode 211 is shown) provided on the battery 210 is inserted into the through hole 121. A bus bar 132 is provided on a part of the through hole 121. Thus, the housing 120 is configured so that the electrode and the bus bar 132 are electrically connected. Figures 5A-5B

[0046] Further, the temperature measuring device 140 is provided with a heat collecting plate 142. The heat collecting plate 142 is disposed on the side opposite to the thermosensitive element 141 by the FPC 110. The heat collecting plate 142 is crimped to the temperature measuring position of the battery 210. The heat collecting plate 142 is configured of a plate material such as aluminum. Further, the heat collecting plate 142 can be adhered to the FPC 110 by double-sided tape or the like.

[0047] Further, the temperature measuring device 140 of the present embodiment further includes a pressing member 143. The pressing member 143 is provided between the housing 120 and the FPC 110. That is, the pressing member 143 is mounted to the housing 120 by fitting the one end side thereof into the fitting portion 122 provided on the housing 120. However, various fixing methods can be employed as the fixing method of the pressing member 143 to the housing 120. Further, the other end of the pressing member 143 is fixed to the FPC 110. For example, the other end can be fixed by double-sided tape. Further, the pressing member 143 is configured of, for example, a foamed material. As the foamed material, a foamed rubber-based material or a foamed polyurethane-based material can be preferably used.

[0048] ​The pressing member 143, as described above, is compressed when the outer cover 120 is fixed to the battery pack 200 (battery 210), thus functioning to press the heat collection plate 142 toward the battery pack 200 (see reference). Figure 5B Furthermore, the pressing member 143 used in this embodiment is composed of a cylindrical member. A thermal element 141 is disposed in the cavity inside the cylinder. However, the pressing member 143 does not necessarily have to be composed of a cylindrical member. The thermal element 141 may also be disposed in the cavity formed as a recess on a part of the pressing member 143.

[0049] (Advantages of the temperature measuring device in this embodiment)

[0050] According to the temperature measuring device (temperature measuring device 140) of this embodiment, when the outer cover 120 is fixed to the battery pack 200 (battery 210), the pressing member 143 made of foam material is compressed, pressing the heat collection plate 142 against the battery pack 200. Furthermore, since only the pressing member 143 is provided between the outer cover 120 and the FPC 110, the heat collection plate 142 can be pressed onto the battery pack 200 with fewer components. Additionally, the heat collection plate 142 is pressed onto the battery pack 200. Therefore, the heat collection plate 142 can contact the battery pack 200 regardless of the dimensional tolerances of the various components. Thus, stable temperature measurement is possible. In this way, the temperature measuring device according to this embodiment can reduce the number of components and achieve stable temperature measurement. Furthermore, by reducing the number of components, not only assembly time can be reduced, but costs can also be reduced.

[0051] Furthermore, in this embodiment, the FPC110 has multiple wirings. For example, in addition to the wiring 112 connected to the thermistor 141, a wiring 111 for measuring the voltage of the battery pack 200 is also provided. Therefore, it is not necessary to provide separate wiring components for voltage measurement and wiring components for temperature measurement. As a result, the number of components can be further reduced. In addition, according to this embodiment, the various components constituting the temperature measuring device 140A, including the outer cover 120 and the FPC110, can be integrated into one unit. Moreover, this integrated unit can be installed on the battery pack 200. Therefore, installation operations are easy.

[0052] (Implementation Method 2)

[0053] Figures 7A-7C This is embodiment 2. In this embodiment, the structure of the temperature measuring device, which differs from that of embodiment 1 described above, is shown. The basic structure and function are the same as in embodiment 1. Therefore, the same reference numerals are used for the same components, and their descriptions are omitted.

[0054] Figures 7A-7C This is a simplified structural diagram of the temperature measuring device in Embodiment 2. Furthermore,Figure 7A is a plan view of the temperature measuring device. Figure 7B is Figure 7A is a cross-sectional view of AA in Figure 7C is Figure 7A is a cross-sectional view of BB in

[0055] In the present embodiment, only the temperature measuring device 140A has a different structure from the temperature measuring device 140 of Embodiment 1 described above. The other configurations of the housing 120 and the like are the same as those of Embodiment 1 described above. Therefore, the description thereof is omitted.

[0056] The temperature measuring device 140A of the present embodiment also has the FPC 110, the thermosensitive element 141 electrically connected to the wiring 112 provided in the FPC 110, and the heat collecting plate 142, like Embodiment 1 described above.

[0057] In addition, in the temperature measuring device 140A of the present embodiment, the pressing member 143A provided between the housing 120 and the FPC 110 is also provided. Further, the temperature measuring device 140A of the present embodiment has the reinforcing plate 144 fixed to the FPC 110. In addition, as the material of the reinforcing plate 144, various materials such as metal and resin can be used. The reinforcing plate 144 is constituted by a cylindrical member. Further, the cavity portion is demarcated by the inner circumferential surface 144a thereof. Further, the thermosensitive element 141 is disposed in the cavity portion. The pressing member 143A is fixed to the housing 120 and the reinforcing plate 144, respectively. The fixing method of the pressing member 143A to the housing 120 is as described in Embodiment 1 described above. In addition, as an example of the fixing method of the pressing member 143A to the reinforcing plate 144, the use of double-sided tape can be given. Like Embodiment 1, the pressing member 143A is constituted by a foamed material.

[0058] Even with the temperature measuring device in the present embodiment constituted as described above, the same effects as those of Embodiment 1 described above can be obtained. When it is intended to thin the thickness of the pressing member 143A, like the present embodiment, by using the reinforcing plate 144, it is possible to adjust the thickness of the pressing member 143A. In addition, in the present embodiment, the thermosensitive element 141 is disposed in the cavity portion provided on the reinforcing plate 144. Therefore, it is not necessary to provide the cavity portion on the pressing member 143A. However, since the elastic reaction force required when the pressing member 143A is compressed, like Embodiment 1, a cylindrical member can also be used as the pressing member 143A.

[0059] (Embodiment 3)

[0060] Figures 8A-8CAn embodiment 3 of the present application is shown. In this embodiment, a structure of the temperature measuring device different from the above-described embodiment 1 is shown. The basic structure and the function are the same as those of the embodiment 1. Therefore, the same reference numerals are given to the same constituent parts, and the description thereof is omitted.

[0061] Figures 8A-8C A brief configuration diagram of the temperature measuring device of the embodiment 3 of the present application is shown. Further, Figure 8A is a plan view of the temperature measuring device. Figure 8B is Figure 8A an AA cross-sectional view in the Figure 8C is Figure 8A a BB cross-sectional view in the

[0062] In this embodiment, only the temperature measuring device 140B has a structure different from the temperature measuring device 140 of the above-described embodiment 1. The other configurations of the housing 120 and the like are the same as those of the above-described embodiment 1. Therefore, the description thereof is omitted.

[0063] The temperature measuring device 140B in this embodiment also has the FPC 110, the thermosensitive element 141 electrically connected to the wiring 112 provided in the FPC 110, and the heat collecting plate 142, like the above-described embodiment 1.

[0064] In addition, in the temperature measuring device 140B of this embodiment, the pressing member 143B provided between the housing 120 and the FPC 110 is also provided. Further, the temperature measuring device 140B of this embodiment has the reinforcing plate 144 fixed to the FPC 110, like the above-described embodiment 2. The configuration of the reinforcing plate 144 is as described in the above-described embodiment 2. Therefore, the description thereof is omitted. Further, the temperature measuring device 140B of this embodiment has the cover 145 covering the cavity portion of the reinforcing plate 144. The cover 145 is configured of various materials such as metal or resin, and is fixed to the reinforcing plate 144 by double-sided tape or the like. In this embodiment, the pressing member 143B is fixed to the housing 120 and the cover 145, respectively. The fixing method of the pressing member 143B to the housing 120 is as described in the above-described embodiment 1. In addition, as an example of the fixing method of the pressing member 143B to the cover 145, fixing by double-sided tape can be given. Like the embodiment 1, the pressing member 143B is configured of a foamed material.

[0065] The same effects as those of Embodiment 1 and Embodiment 2 can be obtained even by the temperature measuring device of the present embodiment configured as described above. In the present embodiment, the thermosensitive element 141 is provided in the sealed space. Therefore, entry of water or foreign matter into the sealed space can be suppressed. Thus, deterioration of the thermosensitive element 141 can be suppressed. Further, it is not necessary to provide the cavity portion on the pressing member 143B, and the pressing member 143B can be a cylindrical member, as described in Embodiment 2.

[0066] (Embodiment 4)

[0067] Figures 9A-9C Embodiment 4 is shown in FIG. 34. In the present embodiment, a structure of a temperature measuring device different from that of Embodiment 1 is shown. The basic structure and the function are the same as those of Embodiment 1. Therefore, the same reference numerals are given to the same constituent parts, and the description thereof is omitted.

[0068] Figures 9A-9C is a brief configuration diagram of the temperature measuring device of Embodiment 4. Further, Figure 9A is a plan view of the temperature measuring device, Figure 9B is Figure 9A is a cross-sectional view of AA in Figure 9C is Figure 9A is a cross-sectional view of BB in

[0069] In the present embodiment, only the temperature measuring device 140C has a structure different from that of the temperature measuring device 140 of Embodiment 1. The configuration of the other housing 120 and the like is the same as that of Embodiment 1. Therefore, the description thereof is omitted.

[0070] The temperature measuring device 140C of the present embodiment also has the FPC 110, the thermosensitive element 141 electrically connected to the wiring 112 provided in the FPC 110, and the heat collecting plate 142, as in Embodiment 1.

[0071] In addition, in the temperature measuring device 140C of the present embodiment, a pressing member 143C is provided between the housing 120 and the FPC 110. Further, the temperature measuring device 140C of the present embodiment has a reinforcing plate 144 fixed to the FPC 110, like the above-described Embodiment 2. The reinforcing plate 144 is configured as described in the above-described Embodiment 2. Therefore, the description thereof is omitted. Further, the temperature measuring device 140C of the present embodiment fills the cavity portion of the reinforcing plate 144 with a sealing material 146. Thus, the thermosensitive element 141 is buried in the sealing material 146. Various materials such as an epoxy resin can be used as the sealing material 146. In the present embodiment, the pressing member 143C is fixed to the housing 120 and the reinforcing plate 144, respectively. The fixing method of the pressing member 143C to the housing 120 is as described in the above-described Embodiment 1. In addition, as an example of the fixing method of the pressing member 143C to the reinforcing plate 144, fixing with double-sided tape can be given. Like Embodiment 1, the pressing member 143C is configured of a foamed material.

[0072] Even with the temperature measuring device of the present embodiment configured as described above, the same effects as those of the above-described Embodiment 1 and Embodiment 2 can be obtained. In the present embodiment, the thermosensitive element 141 is buried in the sealing material 146. Therefore, it is possible to avoid attachment of water or foreign matter to the thermosensitive element 141. Thus, it is possible to suppress deterioration of the thermosensitive element 141. Further, it is not necessary to provide the cavity portion in the pressing member 143C, and the pressing member 143C can be a cylindrical member, like Embodiment 2.

[0073] (Embodiment 5)

[0074] Figures 10A-10C Embodiment 5 of the present application is shown. In the present embodiment, a structure of a temperature measuring device different from that of the above-described Embodiment 1 is shown. The basic structure and the effects are the same as those of Embodiment 1. Therefore, the same reference numerals are given to the same constituent parts, and the description thereof is omitted.

[0075] Figures 10A-10C is a brief configuration diagram of the temperature measuring device of Embodiment 5 of the present application. Further, Figure 10A is a plan view of the temperature measuring device, Figure 10B is Figure 10A is a cross-sectional view of AA in Figure 10C is Figure 10A is a cross-sectional view of BB in

[0076] In the present embodiment, only the temperature measuring device 140D has a structure different from that of the temperature measuring device 140 of the above-described Embodiment 1. The configurations of the other housing 120 and the like are the same as those of the above-described Embodiment 1. Therefore, the description thereof is omitted.

[0077] The temperature measuring device 140D of the present embodiment also has the same configuration as the above-described embodiment 1, and includes the FPC 110, the thermosensitive element 141 electrically connected to the wiring 112 included in the FPC 110, and the heat collecting plate 142.

[0078] The temperature measuring device 140D of the present embodiment has a larger heat collecting plate 142 relative to the front end portion of the FPC 110 than the above-described respective embodiments. Further, the pressing member 143D is provided between the housing 120, the FPC 110, and the heat collecting plate 142. The pressing member 143D is composed of a cylindrical member, as in embodiment 1. The thermosensitive element 141 is disposed in the cavity portion in the cylinder. However, the pressing member 143D is not necessarily composed of a cylindrical member. The thermosensitive element 141 can be disposed in the cavity portion formed as a recess in a portion of the pressing member 143D. In the present embodiment, the pressing member 143D is fixed to the housing 120, the FPC 110, and the heat collecting plate 142, respectively. The method of fixing the pressing member 143D to the housing 120 is as described in the above-described embodiment 1. As examples of the method of fixing the pressing member 143D to the FPC 110 and the heat collecting plate 142, double-sided tape can be given. As in embodiment 1, the pressing member 143D is composed of a foam material.

[0079] As described above, the configuration of the temperature measuring device of the present embodiment differs from the configuration of the temperature measuring device of embodiment 1 in that the pressing member 143D is disposed at a position that directly presses both the FPC 110 and the heat collecting plate 142. Of course, the same effects as in the above-described embodiment 1 can be obtained even in the temperature measuring device of the present embodiment configured in this way. Further, the present embodiment can employ the configuration including the reinforcing plate shown in the above-described embodiment 2, the configuration including the reinforcing plate and the cover shown in the above-described embodiment 3, or the configuration including the reinforcing plate, and the cavity portion of the reinforcing plate filled with the sealing material shown in the above-described embodiment 4. When these configurations are employed, the reinforcing plate directly presses both the FPC 110 and the heat collecting plate 142.

[0080] (Embodiment 6)

[0081] Figures 11A-11C Embodiment 6 of the present application is shown. In the present embodiment, the structure of the temperature measuring device different from the above-described embodiment 1 is shown. The basic structure and the function are the same as in embodiment 1. Therefore, the same reference numerals are given to the same constituent parts, and the description thereof is omitted.

[0082] Figures 11A-11C is a schematic configuration view of the temperature measuring device of embodiment 6 of the present application. Further, Figure 11A is a plan view of the temperature measuring device. Figure 11B is Figure 11Athe AA cross-sectional view in FIG. 1. Figure 11C is Figure 11A the BB cross-sectional view in FIG. 1.

[0083] The temperature measuring device of the present embodiment is different from the temperature measuring device 140 of Embodiment 1 only in the configuration of the temperature measuring device 140E. The other configurations of the temperature measuring device 140E are the same as those of the temperature measuring device 140 of Embodiment 1. Therefore, the description thereof is omitted.

[0084] The temperature measuring device 140E of the present embodiment is the same as the temperature measuring device 140 of Embodiment 1 in that the temperature measuring device 140E is provided with the FPC 110, the thermosensitive element 141, and the heat collecting plate 142. The thermosensitive element 141 is electrically connected to the wiring 112 of the FPC 110.

[0085] In the temperature measuring device 140E of the present embodiment, the heat collecting plate 142 is larger than the heat collecting plate 142 of Embodiments 1 to 4 with respect to the front end portion of the FPC 110. Further, the pressing member 143E of the temperature measuring device 140E of the present embodiment is disposed between the housing 120 and the heat collecting plate 142. The pressing member 143E surrounds a part of the front end of the FPC 110. In the present embodiment, the pressing member 143E is fixed to the housing 120 and the heat collecting plate 142, respectively. The fixing method of the pressing member 143E to the housing 120 is the same as that described in Embodiment 1. As an example of the fixing method of the pressing member 143E to the heat collecting plate 142, the fixing by double-sided tape can be given. The pressing member 143E is made of a foamed material, like the pressing member 143 of Embodiment 1.

[0086] As described above, in the temperature measuring device of the present embodiment, the pressing member 143E does not contact the FPC 110. Further, the pressing member 143E is disposed at a position that directly presses the heat collecting plate 142. In these respects, the configuration of the temperature measuring device of the present embodiment is different from that of the temperature measuring device of Embodiment 1. Of course, the same effects as those of Embodiment 1 can be obtained even by the temperature measuring device of the present embodiment. Further, the configuration including the reinforcing plate described in Embodiment 2 can be employed in the present embodiment. That is, the configuration including the reinforcing plate disposed between the heat collecting plate 142 and the pressing member 143E can be employed. When such a configuration is employed, the reinforcing plate directly presses the heat collecting plate 142.

[0087] (Embodiment 7)

[0088] Figures 12A-12C Embodiment 7 of the present application is shown. In the present embodiment, the structure of the temperature measuring device different from Embodiment 1 is shown. The basic structure and the function are the same as those of Embodiment 1. Therefore, the same reference numerals are given to the same configuration parts, and the description thereof is omitted.

[0089] Figures 12A-12Cis a diagram showing a brief configuration of the temperature measuring device according to Embodiment 7 of the present application. Further, Figure 12A is a plan view of the temperature measuring device. Figure 12B is Figure 12A is a cross-sectional view of AA in Figure 12C is Figure 12A is a cross-sectional view of BB in

[0090] In the present embodiment, only the temperature measuring device 140F has a different structure from the temperature measuring device 140 of Embodiment 1 described above. The other configurations of the housing 120 and the like are the same as those of Embodiment 1 described above. Therefore, the description thereof is omitted.

[0091] The temperature measuring device 140F of the present embodiment also has the FPC 110, the thermosensitive element 141 electrically connected to the wiring 112 provided in the FPC 110, and the heat collecting plate 142, like Embodiment 1 described above.

[0092] In comparison with Embodiments 1 to 4 described above, the heat collecting plate 142 of the temperature measuring device 140F of the present embodiment is large with respect to the front end portion of the FPC 110. Further, the temperature measuring device 140F of the present embodiment is provided with two pressing members 143F between the housing 120 and the heat collecting plate 142. The pressing members 143F are respectively provided on both sides of the front end of the FPC 110. In the present embodiment, the pressing members 143F are respectively fixed to the housing 120 and the heat collecting plate 142. The fixing method of the pressing members 143F to the housing 120 is as described in Embodiment 1 described above. In addition, as an example of the fixing method of the pressing members 143F to the heat collecting plate 142, double-sided tape can be exemplified. Like Embodiment 1, the pressing members 143F are constituted of a foamed material.

[0093] As described above, in the temperature measuring device of the present embodiment, the pressing members 143F do not come into contact with the FPC 110. In addition, the pressing members 143F are arranged at positions directly pressing the heat collecting plate 142. In these respects, the configuration of the temperature measuring device of the present embodiment is different from that of Embodiment 1. Of course, even with the temperature measuring device of the present embodiment thus configured, the same effects as those of Embodiment 1 described above can be obtained. Further, the present embodiment can employ the configuration including the reinforcing plate as described in Embodiment 2 described above. That is, the configuration including the reinforcing plate provided between the heat collecting plate 142 and the pressing members 143F can be employed. When such a configuration is employed, the reinforcing plate directly presses the heat collecting plate 142.

[0094] (Embodiment 8)

[0095] Figures 13A-13CFIG. 8 is a schematic configuration diagram of the temperature measuring device according to Embodiment 8 of the present application. In this embodiment, the structure of the temperature measuring device is different from that of Embodiment 1. The basic structure and the function are the same as those of Embodiment 1. Therefore, the same reference numerals are given to the same constituent parts, and the description thereof is omitted.

[0096] Figures 13A-13C FIG. 8 is a schematic configuration diagram of the temperature measuring device according to Embodiment 8 of the present application. In this embodiment, the structure of the temperature measuring device is different from that of Embodiment 1. The basic structure and the function are the same as those of Embodiment 1. Therefore, the same reference numerals are given to the same constituent parts, and the description thereof is omitted. Figure 13A Figure 13B Figure 13A is a cross-sectional view of AA in FIG. 8. Figure 13C Figure 13A is a cross-sectional view of BB in FIG. 8.

[0097] In this embodiment, only the temperature measuring device 140G has a structure different from that of the temperature measuring device 140 of Embodiment 1. The other constitution of the housing 120 and the like is the same as that of Embodiment 1. Therefore, the description thereof is omitted.

[0098] The temperature measuring device 140G of this embodiment also has the FPC 110 and the thermosensitive element 141 electrically connected to the wiring 112 provided in the FPC 110, like Embodiment 1. However, the temperature measuring device 140G of this embodiment is different from each of the above embodiments, and does not have the heat collecting plate.

[0099] Also, like Embodiment 1, the temperature measuring device 140G of this embodiment has the pressing member 143G provided between the housing 120 and the FPC 110. The pressing member 143G is constituted by a cylindrical member, like Embodiment 1. The thermosensitive element 141 is disposed in the cavity portion in the cylinder. However, it is not necessary that the pressing member 143G is constituted by a cylindrical member. The thermosensitive element 141 can be disposed in the cavity portion formed as a recess in a part of the pressing member 143G. Also, in this embodiment, like Embodiment 1, the pressing member 143G is fixed to the housing 120 and the FPC 110, respectively. The fixing method of the pressing member 143G to the housing 120 is as described in Embodiment 1. As an example of the fixing method of the pressing member 143G to the FPC 110, double-sided tape can be given. Like Embodiment 1, the pressing member 143G is constituted by a foamed material.

[0100] ​​​In the temperature measuring device of the present embodiment configured as described above, when the case 120 is fixed to the battery pack 200 (batteries 210), the pressing member 143G composed of a foamed material is compressed to press the FPC 110 against the battery pack 200. Also, by the pressing member 143G provided between the case 120 and the FPC 110, the FPC 110 is pressed against the battery pack 200 with a small number of components. In addition, the FPC 110 is pressed against the battery pack 200. Therefore, the FPC 110 can be brought into contact with the battery pack 200 regardless of dimensional tolerances of various components. Thus, the temperature can be stably measured. In this way, the same effects as those of Embodiment 1 described above can be obtained even by the temperature measuring device of the present embodiment.

[0101] Further, the present embodiment can also employ the configuration including the reinforcing plate shown in Embodiment 2 described above, the configuration including the reinforcing plate and the cover shown in Embodiment 3 described above, or the configuration including the reinforcing plate, and the cavity portion of the reinforcing plate filled with the sealing material shown in Embodiment 4 described above. When such a configuration is employed, the reinforcing plate directly presses the FPC 110.

[0102] (Other)

[0103] In Embodiments 1 to 5 and 8 described above, as the material of the pressing member 143, 143A, 143B, 143C, 143D, 140G composed of a foamed material, a waterproof standard (waterproof property) is preferable. Thus, a waterproof function is exerted by the pressing member 143, 143A, 143B, 143C, 143D, 140G. Therefore, it is possible to suppress water from adhering to the thermosensitive element 141. In particular, in Embodiments 1 and 2, the waterproof property can be obtained with a simple configuration without providing the cover 145 of Embodiment 3, or the sealing material 146 of Embodiment 4. Further, the foamed material includes a material in which a foamed state is an independent bubble, and a material in which a foamed state is a continuous bubble. By employing the former foamed material as the foamed material, it is possible to realize a waterproof function.

[0104] The detailed description has been given for the purpose of illustration and description. Many variations and modifications are possible in light of the above teachings. The detailed description is not meant to be limiting or to be exhaustive. Although the subject matter has been described in language specific to structural features and / or methodological acts, it is to be understood that the subject matter defined in the claims is not necessarily limited to the specific features or acts described. Rather, the specific features and acts described are disclosed as example implementations of the claims.

Claims

1. A temperature measuring device, characterized in that, It consists of a flexible printed wiring board with wiring, a thermistor, a heat collection plate, a pressing component, and a reinforcing plate. The flexible printed wiring board is mounted on the outer cover of the object being measured. The thermal element is electrically connected to the wiring. The heat collection plate is configured to be pressed onto the temperature measurement position of the object being measured, on the side opposite to the thermistor, via the flexible printed wiring board. The pressing component is made of foam material, and when the outer cover is fixed to the object being measured, the pressing component is compressed, pressing the heat collection plate onto the object being measured. The reinforcing plate has a cavity for arranging the thermal element and is fixed to the flexible printed wiring board. The pressing components are fixed to the outer cover and the reinforcing plate, respectively.

2. A temperature measuring device, characterized in that, It consists of a flexible printed wiring board with wiring, a thermal element, a pressing component, and a reinforcing plate. The flexible printed wiring board is mounted on the outer cover of the object being measured. The thermal element is electrically connected to the wiring. The pressing component is made of foam material, and when the outer cover is fixed to the object being measured, the pressing component is compressed, pressing the flexible printed wiring board onto the object being measured. The reinforcing plate has a cavity for arranging the thermal element and is fixed to the flexible printed wiring board. The pressing components are fixed to the outer cover and the reinforcing plate, respectively.

3. The temperature measuring device according to claim 1 or 2, characterized in that, The flexible printed wiring board has wiring connected to the thermistor and wiring for measuring the voltage of the object being measured.

4. The temperature measuring device according to claim 1 or 2, characterized in that, Also includes the lid, The cover covers the cavity portion of the reinforcing plate. The pressing components are respectively fixed to the outer cover and the cover.

5. The temperature measuring device according to claim 1 or 2, characterized in that, The pressing component is waterproof.

6. The temperature measuring device according to claim 1 or 2, characterized in that, The thermal element is embedded in a sealing material.

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