Substrate processing apparatus

Abstract

A substrate processing apparatus is provided. The substrate processing apparatus includes a support unit that supports a substrate; and a heating unit that irradiates a light beam to the substrate and heats the substrate; and the heating unit further includes an irradiation section that irradiates the light beam and a rotation section that rotates the light beam.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2020-0106800, filed with the Korean Intellectual Property Office on August 25, 2020, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The embodiments of the inventive concept described herein relate to a substrate processing apparatus. Background Technology

[0004] Typically, in the manufacturing processes of flat panel display devices or semiconductors, various processes are performed during the handling of glass substrates or wafers, such as photoresist coating, development, etching, and ashing. These processes include wet cleaning processes using chemicals or deionized water, and drying processes to remove residual chemicals or deionized water from the substrate surface to remove various contaminants adhering to the substrate.

[0005] In recent years, etching processes have been implemented that selectively remove silicon nitride and silicon oxide films using chemicals applied at high temperatures (such as sulfuric acid or phosphoric acid). As substrate processing apparatuses using high-temperature chemicals, substrate processing apparatuses that heat the substrate have been used to improve etching rates. An embodiment of the aforementioned substrate processing apparatus is disclosed in Korean Patent Application Publication No. 2014-0135127. According to the patent, the substrate processing apparatus includes a rotating chuck for supporting and rotating the substrate, and an IR lamp for heating the substrate. Furthermore, the IR lamp is mounted in a configuration where it stops rotating relative to the rotating chuck. That is, according to the patent, the IR lamp generates heat at a fixed position, and by rotating the substrate, the substrate can be uniformly heated.

[0006] However, while rotating the substrate allows for uniform heating relative to its axis of rotation, the uniformity of heating deteriorates as the substrate's rotation speed decreases. Furthermore, the substrate's rotation speed becomes a crucial factor determining the thickness of the liquid film formed by the chemicals and the chemical flow rate. In other words, the substrate's rotation speed affects all factors influencing the heating uniformity of the substrate, the flow rate of the chemicals supplied to the substrate, and the thickness of the liquid film formed on the substrate. For example, increasing the substrate's rotation speed to improve heating uniformity may not achieve the desired liquid film thickness. Conversely, adjusting the substrate's rotation speed to adjust the liquid film thickness to the desired thickness may worsen the heating uniformity of the substrate. Summary of the Invention

[0007] An embodiment of the present invention provides a substrate processing apparatus that can effectively process substrates.

[0008] Embodiments of the inventive concept also provide a substrate processing apparatus that can efficiently heat a substrate.

[0009] Embodiments of the inventive concept also provide a substrate processing apparatus that can increase heating uniformity of a substrate.

[0010] Embodiments of the inventive concept also provide a substrate processing apparatus that can increase heating uniformity of a substrate without rotating the substrate.

[0011] Embodiments of the inventive concept also provide a substrate processing apparatus that can minimize deviation in liquid film thickness formed on a substrate.

[0012] Aspects of the inventive concept are not limited to this, and other unmentioned aspects of the invention will be clearly understood from the following description by those skilled in the art.

[0013] The present disclosure provides a substrate processing apparatus. The substrate processing apparatus includes a support unit that supports a substrate, and a heating unit that irradiates a light beam to the substrate and heats the substrate, and the heating unit further includes an irradiation portion that irradiates the light beam, and a rotation portion that rotates the light beam.

[0014] According to an embodiment, the rotation portion can include a cylindrical lens that is located on a traveling path of the light beam irradiated by the irradiation portion and is rotatable.

[0015] According to an embodiment, a pair of cylindrical lenses can be provided and the rotation directions of the cylindrical lenses can be the same.

[0016] According to an embodiment, each of the cylindrical lenses can have a shape in which one surface of the cylindrical lens is a flat planar surface and the opposite surface of the cylindrical lens is a curved surface.

[0017] According to an embodiment, the planar surface of any one of the pair of cylindrical lenses and the planar surface of the other of the pair of cylindrical lenses face each other.

[0018] According to an embodiment, the heating unit can further include a reflection portion that reflects the light beam passing through the rotation portion in a direction facing the substrate.

[0019] According to an embodiment, the reflection portion can include a mirror having a surface with a flat or deflected shape into which the light beam is input.

[0020] According to an embodiment, the heating unit can further include a dispersion portion that disperses the light beam reflected by the reflection portion.

[0021] According to an embodiment, the dispersing part can include a lens barrel and one or more dispersing lenses accommodated in the lens barrel.

[0022] According to an embodiment, a plurality of dispersing lenses can be provided, and the relative distance of the plurality of dispersing lenses can be variable.

[0023] According to an embodiment, the support unit can further include a transmission plate formed of a transparent material, and a chuck pin which chucks the substrate with the upper surface of the transmission plate and the lower surface of the substrate spaced apart from each other, and can irradiate the light beam irradiated by the irradiation part to the lower surface of the substrate.

[0024] According to an embodiment, the support unit can further include a support member which supports the edge of the transmission plate, and a rotation member which rotates the support member.

[0025] The present disclosure provides a substrate processing apparatus. The substrate processing apparatus includes a support unit which supports and optionally rotates a substrate, a liquid supply unit which supplies the processing liquid to the substrate, and a heating unit which irradiates a light beam to the substrate and heats the substrate, and the heating unit includes an irradiation part which irradiates the light beam and a rotation part which rotates the light beam.

[0026] According to an embodiment, the support unit can further include a transmission plate formed of a transparent material, and a chuck pin which chucks the substrate with the upper surface of the transmission plate and the lower surface of the substrate spaced apart from each other, and can irradiate the light beam irradiated by the irradiation part to the lower surface of the substrate.

[0027] According to an embodiment, the support unit can further include a support member which supports the edge of the transmission plate, and a rotation member which rotates the support member.

[0028] According to an embodiment, the rotation part can include a cylindrical lens which is located on the travel path of the light beam irradiated by the irradiation part, and which is rotatable.

[0029] According to an embodiment, a pair of cylindrical lenses is provided and the rotation direction of the cylindrical lenses can be the same.

[0030] According to an embodiment, each of the cylindrical lenses can have a shape in which one surface of the cylindrical lens is a flat planar surface and the opposite surface of the cylindrical lens is a curved surface.

[0031] This disclosure provides a substrate processing apparatus. The substrate processing apparatus includes a support member that supports a substrate and is formed of a transparent material; and a heating unit that heats the substrate by irradiating a laser beam onto the lower surface of the substrate supported by the support member; the heating unit includes an irradiation section for irradiating the laser beam and a rotation section for rotating the laser beam; the rotation section includes a cylindrical lens located on the path of the laser beam irradiated by the irradiation section and the cylindrical lens is rotatable.

[0032] According to one embodiment, the cylindrical lenses may rotate in the same direction, and each cylindrical lens may have the following shape: one surface of the cylindrical lens is a flat planar surface, and the opposite surface of the cylindrical lens is a curved surface. Attached Figure Description

[0033] Referring to the following figures, the above and other objects and features will become apparent from the following description, wherein, unless otherwise stated, the same reference numerals refer to the same parts throughout the figures, and wherein:

[0034] Figure 1 A view showing a substrate processing apparatus according to an embodiment of the present invention;

[0035] Figure 2 To decompose Figure 1 An exploded perspective view of a portion of the substrate processing apparatus;

[0036] Figure 3 for Figure 1 A cross-sectional view of the substrate processing apparatus;

[0037] Figure 4 To show Figure 3 A view of the heating unit;

[0038] Figure 5 To show Figure 4 A view of a cylindrical lens;

[0039] Figure 6 For when Figure 4 The view obtained by observing the light beam in the cross section A-A' when the cylindrical lens is not rotated;

[0040] Figure 7 For when Figure 4 The view obtained by observing the light beam in the cross section A-A' when the cylindrical lens is rotated;

[0041] Figure 8 This is a conceptual view showing the travel of the light beam when the cylindrical lens is rotated 0 degrees;

[0042] Figure 9 In order to observeFigure 8 a cross-sectional view of a light beam obtained by observing the cross-section A-A' of the light beam;

[0043] Figure 10 is a conceptual diagram illustrating the progress of a light beam when the cylindrical lens is rotated by 45 degrees;

[0044] Figure 11 is a cross-sectional view of a light beam obtained by observing the cross-section A-A' of the light beam; Figure 10

[0045] Figure 12 is a conceptual diagram illustrating the progress of a light beam when the cylindrical lens is rotated by 90 degrees;

[0046] Figure 13 is a cross-sectional view of a light beam obtained by observing the cross-section A-A' of the light beam; Figure 12

[0047] Figure 14 is a conceptual diagram illustrating the progress of a light beam when the cylindrical lens is rotated by 135 degrees;

[0048] Figure 15 is a cross-sectional view of a light beam obtained by observing the cross-section A-A' of the light beam; Figure 14

[0049] Figure 16 is a view illustrating a state in which a substrate processing apparatus according to an embodiment of the inventive concept supplies a processing liquid to a substrate; and

[0050] Figure 17 is a view illustrating a state in which a substrate processing apparatus according to an embodiment of the inventive concept heats a substrate by irradiating a light beam to the substrate. DETAILED DESCRIPTION

[0051] Hereinafter, exemplary embodiments of the inventive concept will be described in detail with reference to the accompanying drawings so that the inventive concept can be easily practiced by those skilled in the art. The inventive concept may, however, be implemented in various different forms and thus the inventive concept should not be construed as being limited to the embodiments set forth herein. In addition, in describing the embodiments of the inventive concept, detailed description of known functions and configurations incorporated herein will be omitted when it can make the nature of the inventive concept unnecessarily unclear.

[0052] ​​​Unless there is a clear contradiction, the expression "comprising" certain elements means that other elements can be further included without being excluded. In detail, the terms "comprising" and "having" are used to indicate that the features, numbers, steps, operations, elements, components, or combinations thereof described in the specification are present, and it can be understood that one or more other features, numbers, steps, operations, elements, components, or combinations thereof can be added.

[0053] Unless otherwise specified, the singular form of the term can include the plural form. Also, in the drawings, the shape and size of elements can be exaggerated for clarity of explanation.

[0054] Hereinafter, an embodiment of the inventive concept will be described with reference to Figures 1 to 17 An embodiment of the inventive concept will be described.

[0055] Figure 1 A view of a substrate processing apparatus according to an embodiment of the inventive concept is shown. Figure 2 An exploded perspective view of a portion of a substrate processing apparatus is shown. Figure 1 A cross-sectional view of a substrate processing apparatus is shown. Figure 3 A cross-sectional view of a substrate processing apparatus is shown. Figure 1 A cross-sectional view of a substrate processing apparatus is shown. With reference to Figures 1 to 3 The substrate processing apparatus 100 according to an embodiment of the inventive concept can supply a processing liquid to a substrate "S" and process the substrate "S" with the liquid. Also, the substrate processing apparatus 100 can heat the substrate "S" by irradiating a laser beam "L" to the substrate "S".

[0056] The substrate processing apparatus 100 can include a support unit 110, a liquid supply unit 120, a bowl 130, a heating unit 140, and a housing 150.

[0057] The support unit 110 can support the substrate "S". The support unit 110 can rotate the substrate "S". The support unit 110 can include a support member 111, a rotating member 112, a transmission plate 113, and a chuck pin 114.

[0058] The support member 111 can have a barrel shape, the upper side and the lower side of which are open. The support member 111 can have a shape having an upper side having a larger diameter than that of the lower side. For example, when viewed from the upper side to the lower side, the support member 111 can have a shape including a portion having a constant diameter, a portion in which the diameter is gradually reduced, and a portion again having a constant diameter. Also, the transmission plate 113 to be described below can be positioned at the upper end of the support member 111. Also, the lower end of the support member 111 can be coupled to the rotating member 112, which will be described below.

[0059] The rotation member 112 can rotate the support member 111. The rotation member 112 can generate a driving force that rotates the support member 111. Further, the rotation member 112 can have a hollow ring shape when viewed from the top. For example, the rotation member 112 can be a hollow motor. The rotation member 112 can include a rotor 112a, a stator 112b, and a bearing 112c.

[0060] The rotor 112a can be coupled to a lower end of the support member 111 to rotate together with the support member 111. The stator 112b can be fixedly coupled to an upper end of the housing 150, which will be described below. The stator 112b can generate a driving force that rotates the rotor 112a. Also, the bearing 112c can be disposed between the stator 112b and the rotor 112a to smoothly relatively rotate the stator 112b and the rotor 112a.

[0061] The transmission plate 113 can be positioned on an upper end of the support member 111. The transmission plate 113 can be coupled to the support member 111. For example, edges of the transmission plate 113 can be supported by the support member 111. Also, the transmission plate 113 can be formed of a transparent material. The transmission plate 113 can be formed of a material having excellent chemical resistance with respect to a treatment liquid supplied by the liquid supply unit 120. For example, the transmission plate 113 can be formed of a quartz or glass material.

[0062] The chuck pin 114 can clamp the substrate "S". The chuck pin 114 can clamp the substrate "S" in a state in which a lower surface of the substrate "S" is spaced apart from an upper surface of the transmission plate 113. Also, the chuck pin 114 can support the lower surface and / or sides of the substrate "S". The chuck pin 114 can be installed in the support member 111. The chuck pin 114 can be installed in an upper end of the support member 111. Further, a plurality of chuck pins 114 can be provided. Also, the chuck pins 114 can be installed in the support member 111 to be spaced apart from each other. Also, the chuck pins 114 can be installed in the support member 111 so as to be spaced apart from each other at the same interval.

[0063] The liquid supply unit 120 can supply a treatment liquid to the substrate "S". The liquid supply unit 120 can include a nozzle that discharges the treatment liquid. The liquid supply unit 120 can supply a heated treatment liquid to the substrate "S". Also, the treatment liquid can be a chemical that processes a surface of the substrate "S". For example, the chemical can be a chemical that etches a surface of the substrate "S". For example, the chemical can be a treatment liquid including at least any one of sulfuric acid, nitric acid, phosphoric acid, a mixed solution of sulfuric acid and phosphoric acid, ammonium hydroxide, oxygen-containing water, and water.

[0064] The bowl 130 can recover the process liquid supplied by the liquid supply unit 120. For example, the bowl 130 can recover the process liquid splashed from the substrate "S". Also, the bowl 130 can be a multi-stage bowl. For example, the bowl 130 can include an outer container, an intermediate container, and an inner container. Each container can include a bottom, a sidewall extending in a direction perpendicular to the bottom, and an inclined portion extending upward toward a direction in which the sidewall faces the support unit 110. Also, the inclined portions of adjacent containers can define an inlet 131 through which the process liquid is introduced. The bowl 130 is a multi-stage bowl, and thus, a plurality of inlets 131 can be formed. The process liquid introduced through the inlet 131 can be supplied to an external liquid recovery portion (not shown) through a recovery line (not shown) to be reused. The liquid recovery portion can be a device that recovers the process liquid to reuse the process liquid by adjusting the concentration of the used process liquid, adjusting the temperature of the used process liquid, and filtering out contaminants.

[0065] Also, the bowl 130 can move upward and downward. Thus, the bowl 130 can recover the process liquid in a case where the inlets 131 are determined differently according to different process liquids to be recovered. For example, when a first process liquid is to be recovered, the bowl 130 can be moved so that the inlet 131 defined by the inclined portions of the outer container and the inner container is located outside the edge of the substrate "S". For example, when a second process liquid is to be recovered, the bowl 130 can be moved so that the inlet 131 defined by the inclined portions of the intermediate container and the inner container is located outside the edge of the substrate "S". Although it has been described as an example, in the above-described embodiment, the bowl 130 moves upward and downward, but the disclosure is not limited thereto. For example, the disclosure can be modified to various embodiments for changing the relative height between the bowl 130 and the support unit 110.

[0066] The heating unit 140 can heat the substrate "S". The heating unit 140 can heat the substrate "S" by irradiating a laser beam to the substrate "S". The upper side of at least some configurations of the heating unit 140 can be open, and can be disposed in a housing 150 disposed below the support unit 110. Thus, the heating unit 140 can irradiate a beam to the lower surface of the substrate "S". For example, the laser beam "L" irradiated by the irradiation portion 141 of the heating unit 140 to be described below can be irradiated to the lower surface of the substrate "S".

[0067] Figure 4 A view of the heating unit is shown. Figure 3 Referring to Figure 4 , the heating unit 140 can include an irradiation portion 141, a dispersion portion 142, an optical fiber 143, a reflection portion 145, an imaging portion 146, a detection portion 147, and a rotation portion 148.

[0068] The irradiation section 141 can irradiate a light beam. The light beam irradiated by the irradiation section 141 can be a laser beam. The irradiation section 141 can change the wavelength of the light beam. For example, the irradiation section 141 can irradiate a light beam having a wavelength at which the absorption rate to the substrate “S” is high. For example, when the substrate “S” is a wafer formed of a material including Si, the irradiation section 141 can irradiate a light beam having a high absorption rate to Si.

[0069] The dispersion section 142 can disperse the light beam irradiated by the irradiation section 141. For example, the dispersion section 142 can be a beam shaper or an optical system. The dispersion section 142 can disperse the light beam, which will be described below and is received by the dispersion section 142, after transmitting the light beam irradiated by the irradiation section 141 to the reflection section 145. The dispersion section 142 can adjust the dispersion of the laser beam. For example, the dispersion section 142 can adjust the amplification of the laser beam, the radial dispersion of the light beam, etc. For example, the dispersion section 142 can refract the light beam. The dispersion section 142 can include a plurality of dispersion lenses 142a and a lens barrel 142b. The plurality of dispersion lenses 142a can be accommodated in the lens barrel 142b. Also, the relative distance between the dispersion lenses 142a can vary. Accordingly, the laser beam “L” irradiated by the irradiation section 141 can be refracted as it passes through the dispersion section 142, and can be uniformly irradiated to the lower surface of the substrate “S”.

[0070] Figure 4 Two dispersion lenses 142a are shown as an example, but the present disclosure is not limited thereto. For example, the number of dispersion lenses 142a and the kind of dispersion lenses 142a (convex lens, concave lens, etc.) can be variously selected according to design.

[0071] The optical fiber 143 can transmit the laser beam generated by the irradiation section 141 to the rotation section 148, which will be described below.

[0072] The reflection section 145 can include a mirror 145a that reflects the laser beam passing through the rotation section 148. The mirror 145a can be installed to be rotated at an angle of 45 degrees with respect to the input direction of the light beam. The mirror 145a can have a flat shape in which the surface of the mirror 145a to which the light beam is input is flat, or have a curved shape in which the surface of the mirror 145a to which the light beam is input is deflected. Also, a part of the light beam input to the mirror 145a can be transmitted to the dispersion section 142 after being reflected, and another part of the light beam input to the mirror 145a can be transmitted to the imaging section 146.

[0073] The imaging unit 146 can be coupled to the reflecting unit 145, and can capture the laser beam passing through the reflecting unit 145 and convert the captured image into image data. The imaging unit 146 can perform an inspection by analyzing the image data to determine whether the laser beam output from the irradiation unit 141 is suitable for the design.

[0074] The detection unit 147 can be coupled to the reflector 145 and can detect the intensity (output) of the laser beam input to the reflector 145. For example, the detection unit 147 can be a photodetector. When the output of the laser beam is too strong, the substrate "S" can be heated rapidly. Furthermore, when the output of the laser beam is too weak, it may take a long time to heat the substrate "S". The detection unit 147 can determine whether the output of the laser beam is an appropriate value.

[0075] The rotating part 148 can rotate the laser beam "L" generated by the irradiation part 141. The rotating part 148 may include a pair of cylindrical lenses 149a and 149b.

[0076] The pair of cylindrical lenses 149a and 149b can be located on the travel path of the laser beam "L" illuminated by the irradiation unit 141. The pair of cylindrical lenses 149a and 149b can be configured to rotate by a rotating mechanism (not shown). The rotation directions of the pair of cylindrical lenses 149a and 149b can be the same. The pair of cylindrical lenses 149a and 149b can have the same axis of rotation. Figure 5 As shown, one surface of each of the cylindrical lenses in the pair can have a flat planar surface, and the opposite surface of one surface of the cylindrical lens in the pair can have a curved surface shape. The planar surface of any one of the cylindrical lenses 149a and 149b and the planar surface of the other one of the cylindrical lenses 149a and 149b can face each other.

[0077] Figure 6 For when Figure 4 The view obtained by observing the light beam in cross section A-A' when the cylindrical lens is not rotated. (Refer to...) Figure 6 When the cylindrical lenses 149a and 149b do not rotate, the laser beam “L” passing through the cross section A-A' can be asymmetrical with respect to the optical axis of the laser beam “L”, and can be a non-uniform laser beam “L”.

[0078] Figure 7 For when Figure 4 The view obtained by observing the light beam in cross section A-A' when the cylindrical lens is rotated. (Refer to...) Figure 7When the cylindrical lenses 149a and 149b rotate, the laser beam "L" passing through the cross-section A-A' can be symmetrical with respect to the optical axis of the laser beam "L" and can be a uniform laser beam "L". That is, as the cylindrical lenses 149a and 149b rotate, the laser beam "L" rotates. That is, according to the embodiment of the inventive concept, because the non-uniform laser beam "L" that is asymmetrical with respect to the optical axis is also input to the reflection part 145 in the state of the uniform laser beam "L" that is symmetrical with respect to the optical axis, uniform cumulative heating can be performed on the substrate "S".

[0079] In addition, Figures 8 to 15 A state in which the beam is observed in the cross-section A-A' according to the angle at which the cylindrical lenses 149a and 149b rotate is shown. Referring to Figures 8 to 15 It can be seen that, when the cylindrical lenses 149a and 149b rotate one cycle, the laser beam "L" rotates two cycles. For example, Figure 8 A state in which the cylindrical lenses 149a and 149b rotate 0 degrees is shown, and Figure 9 A state in which the beam is observed in the cross-section A-A' when the cylindrical lenses 149a and 149b rotate 0 degrees is shown. In addition, Figure 10 A state in which the cylindrical lenses 149a and 149b rotate 45 degrees is shown, and Figure 11 A state in which the beam is observed in the cross-section A-A' when the cylindrical lenses 149a and 149b rotate 45 degrees is shown. As a comparison Figures 9 to 11 It can be seen that, when the cylindrical lenses 149a and 149b rotate 45 degrees, the beam rotation of 90 degrees can be identified. Similarly, referring to Figure 12 and Figure 13 When the cylindrical lenses 149a and 149b rotate 90 degrees, the beam rotation of 180 degrees can be identified. In addition, referring to Figure 14 and Figure 15 When the cylindrical lenses 149a and 149b rotate 135 degrees, the beam rotation of 270 degrees can be identified. This is because a pair of cylindrical lenses 149a and 149b are provided.

[0080] That is, according to the embodiment of the inventive concept, the rotation speed of the beam corresponds to twice the rotation speed of the lenses 149a and 149b. That is, as the rotation speed of the beam becomes higher, it is possible to further maximize the heating uniformity of the substrate "S".

[0081] Figure 16 A view showing a state in which a substrate processing apparatus according to the embodiment of the inventive concept supplies a processing liquid to a substrate is shown. Referring to Figure 16According to an embodiment of the present invention, the substrate processing apparatus 100 can supply processing liquid to the upper surface of a substrate "S" and process the substrate "S" with the liquid. The liquid supply unit 120 can supply processing liquid to the upper surface of the substrate "S". When the liquid supply unit 120 supplies processing liquid, the rotating member 112 can rotate the support member 111. When the support member 111 rotates, the substrate "S", supported by the chuck pin 114 mounted in the support member 111, can rotate. The processing liquid supplied to the rotating substrate "S" may splash out from the substrate "S". The processing liquid splashed from the substrate "S" can be recovered through the inlet 131 of the bowl-shaped structure.

[0082] Figure 17 This is a view illustrating a substrate processing apparatus according to an embodiment of the present invention, in which a substrate is heated by irradiating a substrate with a light beam. (Refer to...) Figure 17 The heating unit 140 of the substrate processing apparatus 100 heats the substrate "S" by irradiating the lower surface of the substrate "S" with a laser beam "L". The laser beam "L" irradiated by the heating unit 140 can be transmitted to the lower surface of the substrate "S" after passing through the transmission plate 113. When the liquid supply unit 120 supplies processing liquid or after the liquid supply unit 120 has finished supplying processing liquid, the heating unit 140 can irradiate the lower surface of the substrate "S" with the laser beam "L". Then, as described above, the cylindrical lenses 149a and 149b can be rotated. Therefore, the laser beam "L" can also be rotated, and uniform heating of the substrate "S" can be achieved.

[0083] A typical substrate processing apparatus includes a rotating chuck and a fixed heating lamp. The rotating chuck supports and rotates the substrate, while the fixed heating lamp is independent of the rotation of the rotating chuck. The typical substrate processing apparatus utilizes the heating lamp to generate infrared radiation and achieves uniform heating of the substrate by rotating it. That is, the uniformity of substrate heating is affected by the substrate rotation.

[0084] However, according to the embodiment of the present inventive concept, the laser beam "L" rotates as the cylindrical lenses 149a and 149b rotate. Thus, because the laser beam "L" rotates even if the substrate "S" does not rotate, the substrate "S" and the laser beam "L" can rotate relative to each other. That is, in the embodiment of the present inventive concept, the heating uniformity of the substrate "S" does not depend on the rotation of the substrate "S". Thus, the rotation speed of the substrate "S" can be freely adjusted regardless of the heating uniformity of the substrate "S". Because the rotation speed of the substrate "S" can be freely adjusted, the thickness of a liquid film formed by a process liquid supplied onto the substrate "S" can be adjusted to a desired thickness. Further, the flow rate of the process liquid supplied onto the substrate "S" can be adjusted to a desired flow rate. That is, according to the embodiment of the present inventive concept, because the uniformity of heating can be maintained regardless of the rotation speed of the substrate "S" (e.g., a wafer), there is a very good advantage in the development process of a process sensitive to the rotation speed of the substrate "S".

[0085] Although it has been described as an example, in the above-described example, the planar surfaces of the cylindrical lenses 149a and 149b are configured to face each other, but the present disclosure is not limited thereto. For example, the curved surfaces of the cylindrical lenses 149a and 149b can be configured to face each other. Unlike this, any one planar surface of the cylindrical lenses 149a and 149b and the other curved surface of the cylindrical lenses 149a and 149b can be configured to face each other.

[0086] According to the embodiment of the present inventive concept, a substrate can be effectively processed.

[0087] Further, according to the embodiment of the present inventive concept, a substrate can be effectively heated.

[0088] In addition, according to the embodiment of the present inventive concept, the heating uniformity of a substrate can be increased.

[0089] In addition, according to the embodiment of the present inventive concept, the heating uniformity of a substrate can be increased without rotating the substrate.

[0090] In addition, according to the embodiment of the present inventive concept, the generation of thickness deviation of a liquid film formed on a substrate can be minimized.

[0091] Effects of the present inventive concept are not limited to the above-mentioned effects and those skilled in the art to which the present inventive concept pertains can understand from the specification and the accompanying drawings that other unmentioned effects can be included.

[0092] The above detailed description illustrates the inventive concept. Further, the above-described content describes exemplary embodiments of the inventive concept, and the inventive concept can be used in various other combinations, modifications, and environments. That is, the inventive concept can be modified and corrected without departing from the scope of the inventive concept disclosed in the specification, the scope equivalent to the written disclosure, and / or the scope of the technology or knowledge of those skilled in the art. The written embodiment describes the best state for implementing the technical spirit of the inventive concept, and various changes necessary in the specific application field and purpose of the inventive concept can be made. Therefore, the detailed description of the inventive concept is not intended to limit the inventive concept to the disclosed embodiment state. Further, it is understood that the appended claims include other embodiments.

Claims

1. A substrate processing apparatus comprising: a support unit configured to support a substrate; and a heating unit configured to irradiate a light beam to the substrate and heat the substrate, wherein the heating unit further comprises: an irradiation portion configured to irradiate the light beam; and a rotation portion configured to rotate the light beam; wherein the rotation portion comprises: a cylindrical lens located on a traveling path of the light beam irradiated by the irradiation portion, and configured to be rotatable; wherein a pair of cylindrical lenses are provided and the rotation directions of the cylindrical lenses are the same.

2. The substrate processing apparatus according to claim 1, wherein Each of the cylindrical lenses has a shape in which one surface thereof is a flat planar surface and an opposite surface thereof is a curved surface.

3. The substrate processing apparatus according to claim 2, wherein The planar surface of any one of the pair of cylindrical lenses and the planar surface of the other one of the pair of cylindrical lenses face each other.

4. The substrate processing apparatus according to any one of claims 1 to 3, wherein The heating unit further comprises: a reflection portion configured to reflect the light beam passing through the rotation portion in a direction facing the substrate.

5. The substrate processing apparatus according to claim 4, wherein The reflection portion comprises: a mirror having a surface with a flat or deflected shape into which the light beam is input.

6. The substrate processing apparatus according to claim 5, wherein The heating unit further comprises: a dispersion portion configured to disperse the light beam reflected by the reflection portion.

7. The substrate processing apparatus according to claim 6, wherein The dispersion portion comprises: a lens barrel; and one or more dispersion lenses accommodated in the lens barrel.

8. The substrate processing apparatus according to claim 7, wherein A plurality of dispersion lenses are provided and the relative distances of the plurality of dispersion lenses are variable.

9. The substrate processing apparatus according to any one of claims 1 to 3, 5 to 8, wherein, The support unit further comprises: a transmission plate formed of a transparent material; and a chuck pin configured to chuck the substrate with an upper surface of the transmission plate and a lower surface of the substrate spaced apart from each other, and wherein the light beam irradiated by the irradiation portion is irradiated to the lower surface of the substrate.

10. The substrate processing apparatus according to claim 9, wherein The support unit further comprises: a support member configured to support an edge of the transmission plate; and a rotation member configured to rotate the support member. 11.A substrate processing apparatus comprising: a support unit configured to support a substrate and optionally rotate the substrate; a liquid supply unit configured to supply a processing liquid to the substrate, and a heating unit configured to irradiate a light beam to the substrate and heat the substrate, and wherein the heating unit comprises: an irradiation portion configured to irradiate the light beam; and a rotation portion configured to rotate the light beam; wherein the rotation portion comprises: a cylindrical lens located on a traveling path of the light beam irradiated by the irradiation portion, and configured to be rotatable; wherein a pair of cylindrical lenses are provided and the rotation directions of the cylindrical lenses are the same.

12. The substrate processing apparatus of claim 11, wherein, The support unit further comprises: a transmission plate formed of a transparent material; and a chuck pin configured to chuck the substrate with an upper surface of the transmission plate and a lower surface of the substrate spaced apart from each other, and wherein the light beam irradiated by the irradiation portion is irradiated to the lower surface of the substrate. a chuck pin configured to chuck the substrate with the upper surface of the transmission plate and the lower surface of the substrate spaced apart from each other, and wherein the light beam irradiated by the irradiation section is irradiated to the lower surface of the substrate.

13. The substrate processing apparatus of claim 12, wherein, The support unit further includes: a support member configured to support an edge of the transmission plate; and a rotation member configured to rotate the support member.

14. The substrate processing apparatus of claim 11, wherein, Each of the cylindrical lenses has a shape in which one surface of the cylindrical lens is a flat planar surface and an opposite surface of the cylindrical lens is a curved surface.

15. A substrate processing apparatus including: a support member configured to support a substrate and formed of a transparent material; and a heating unit configured to heat the substrate by irradiating a laser light beam to a lower surface of the substrate supported by the support member, wherein the heating unit includes: an irradiation section configured to irradiate the laser light beam; and a rotation section configured to rotate the laser light beam, and wherein the rotation section includes: cylindrical lenses located on a traveling path of the laser light beam irradiated by the irradiation section and configured to be rotatable; wherein the rotation directions of the cylindrical lenses are the same.

16. The substrate processing apparatus of claim 15, wherein, Each of the cylindrical lenses has a shape in which one surface of the cylindrical lens is a flat planar surface and an opposite surface of the cylindrical lens is a curved surface.

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