A wafer flipping device for silicon wafer electrode printing

Abstract

The present invention relates to the technical field of silicon wafer manufacturing, and discloses a wafer flipping device for silicon wafer electrode printing, including a working platform. A support column is fixedly connected to the top of the working platform. A fixed disk is fixedly connected to the outer side of the support column. A rotating disk is movably connected to the inner wall of the fixed disk. A magnet one is fixedly connected to the inner wall of the fixed disk. An annular groove is formed in the inner wall of the fixed disk. A magnet two is fixedly connected to the inner wall of the fixed disk and close to the outer side of the annular groove. A rotating ring is movably connected to the inner side of the annular groove. In the working process of this wafer flipping device for silicon wafer electrode printing, through the arranged magnet one and magnet two, and the cooperatively arranged rotating ring, the rotation of the rotating ring is driven by the Ampere force received by the conductive rod, realizing the mechanical flipping of both sides of the silicon wafer, avoiding the need for workers to re-fix the silicon wafer, saving time and effort, improving the flipping efficiency of silicon wafer printing, and improving the production efficiency of silicon wafer printed products.

Description

Technical Field

[0001] The present invention belongs to the technical field of silicon wafer manufacturing, and specifically relates to a wafer flipping device for silicon wafer electrode printing. Background Art

[0002] Silicon wafers made of silicon materials are commonly used in computer chips in the computer field. No matter how complex the mathematical, physical, or engineering problems are, nor how large the computational workload is, as long as the staff tells the computer the problem through the computer keyboard and gives the problem-solving ideas and instructions, the computer can tell you the answer within a very short time. In this way, problems that would take years or decades to calculate manually can be solved by the computer in just a few minutes. In the existing manufacturing process of silicon wafers, it is necessary to print electrodes on the silicon wafers.

[0003] However, in the process of printing electrodes on silicon wafers in the current market, since the electrodes need to be printed on both sides of the silicon wafer, it is necessary for the staff to intermittently flip the two sides of the silicon wafer, resulting in the need for the staff to continuously re-fix the silicon wafer, which is time-consuming and laborious, reduces the flipping efficiency of silicon wafer printing, and leads to a reduction in the production efficiency of silicon wafer printing products. Summary of the Invention

[0004] In view of the above situation, in order to overcome the defects of the existing technology, the present invention provides a wafer flipping device for silicon wafer electrode printing, which effectively solves the problem that in the current market, it is necessary for the staff to intermittently flip the two sides of the silicon wafer, resulting in the need for the staff to continuously re-fix the silicon wafer, which is time-consuming and laborious, reduces the flipping efficiency of silicon wafer printing, and leads to a reduction in the production efficiency of silicon wafer printing products.

[0005] To achieve the above object, the present invention provides the following technical solution: A wafer flipping device for silicon wafer electrode printing, including a working platform, a support column is fixedly connected to the top of the working platform, a fixed disk is fixedly connected to the outside of the support column, a rotating disk is movably connected to the inner wall of the fixed disk, a magnet one is fixedly connected to the inner wall of the fixed disk, an annular groove is opened on the inner wall of the fixed disk, a magnet two is fixedly connected to the inner wall of the fixed disk and close to the outside of the annular groove, a rotating ring is movably connected to the inner side of the annular groove, the rotating ring plays a role of rotation, a ball one is movably connected to the inner side of the rotating ring, and a conductive rod is fixedly connected to the inner wall of the rotating ring, and the conductive rod plays a role of guiding the current direction;

[0006] The inner wall of the rotating disk is provided with..., and a limiting plate is elastically connected to the inner wall of the rotating disk and close to the inner side of..., the limiting plate is used for clamping the silicon wafer, a triggering mechanism is movably connected to the inner wall of the rotating disk, a micro electric push rod is fixedly connected to the inner wall of the rotating disk, a rubber plate is fixedly connected to the outer side of the micro electric push rod, the micro electric push rod is used for pushing the rubber plate to move upward, a groove is provided in the inner wall of the fixed disk, a limiting block is elastically connected to the inner wall of the groove, a second ball is movably connected to the outer side of the limiting block, a limiting groove is provided in the inner wall of the rotating disk, and a mouth groove is provided on the outer side of the rotating disk.

[0007] Preferably, the opposite surfaces of the first magnet and the second magnet have opposite magnetic polarities, the number of the first magnets is the same as that of the second magnets, and the first magnets and the second magnets play a role in generating a magnetic field.

[0008] Preferably, the first balls are evenly distributed on the inner side of the rotating ring, the conductive rods are evenly distributed on the inner wall of the rotating ring, and the first balls play a role in reducing friction.

[0009] Preferably, the limiting plates are symmetrically distributed on the inner wall of the rotating disk, the rotating disk is fixedly connected to the rotating ring, and the limiting plates play a role in clamping.

[0010] Preferably, the triggering mechanism includes a sliding groove, a pressing rod, a conductive block and an electrical contact. The sliding groove is provided in the inner wall of the rotating disk, the pressing rod is elastically connected to the inner wall of the sliding groove, the conductive block is fixedly connected to the bottom of the pressing rod, and the electrical contact is fixedly connected to the inner wall of the sliding groove.

[0011] Preferably, the electrical contact is connected in series with an external power switch, the conductive block is connected in series with the micro electric push rod, the conductive block is connected in series with the conductive rod, and the conductive block plays a role in connecting the circuit.

[0012] Preferably, the size of the limiting block is adapted to the size of the limiting groove, the limiting block is clamped with the limiting groove, the limiting blocks are evenly distributed on the inner wall of the fixed disk, the limiting grooves are evenly distributed on the inner wall of the rotating disk, and the limiting block and the limiting groove play a role in clamping.

[0013] Preferably, the second ball has a spherical structure, and the second ball is used for reducing the friction between the limiting block and the rotating disk in contact.

[0014] Compared with the prior art, the beneficial effects of the present invention are:

[0015] 1), During work, through the set magnet one and magnet two, and the cooperatively set rotating ring, the rotation of the rotating ring is driven by the Ampere force received by the conductive rod, realizing the flipping of both sides of the silicon wafer by the machine, avoiding the need for workers to refix the silicon wafer, saving time and effort, improving the flipping efficiency of silicon wafer printing, and enhancing the production efficiency of silicon wafer printing products.

[0016] 2), Through the set limiting plate and the cooperatively set triggering mechanism, the limiting plate is fixed by the connection of the circuit in the triggering mechanism, realizing the fixation of the silicon wafer, improving the degree of automation, saving time and effort, and at the same time facilitating the automatic fixation of silicon wafers of different sizes, enhancing the practicability of the rotating disk 4 and the diversity of the use of the wafer flipping device. Description of the Drawings

[0017] The drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation to the present invention. In the drawings:

[0018] Figure 1 is the front view structural schematic diagram of the whole of the present invention;

[0019] Figure 2 is the sectional structural schematic diagram of the fixed disk of the present invention;

[0020] Figure 3 is the sectional structural schematic diagram of the limiting block of the present invention;

[0021] Figure 4 is the side view structural schematic diagram of the rotating disk of the present invention;

[0022] Figure 5 is the sectional structural schematic diagram of the rotating disk of the present invention;

[0023] Figure 6 is the present invention Figure 5 partial enlarged structural schematic diagram of part A in.

[0024] In the figure: 1, working platform; 2, support column; 3, fixed disk; 4, rotating disk; 5, magnet one; 6, ring groove; 7, magnet two; 8, rotating ring; 9, ball one; 10, conductive rod; 11, limiting plate; 12, micro electric push rod; 13, rubber plate; 14, triggering mechanism; 15, limiting groove; 16, groove; 17, limiting block; 18, ball two; 19, mouth groove; 141, chute; 142, extrusion rod; 143, conductive block; 144, electric contact. Detailed Embodiments

[0025] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments; based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0026] Embodiment 1 is given by Figure 1-6 The present invention includes a wafer turning device for silicon wafer electrode printing, which includes a working platform 1. A support column 2 is fixedly connected to the top of the working platform 1. A fixed disk 3 is fixedly connected to the outside of the support column 2. A rotating disk 4 is movably connected to the inner wall of the fixed disk 3. A magnet 1 5 is fixedly connected to the inner wall of the fixed disk 3. An annular groove 6 is opened on the inner wall of the fixed disk 3. A magnet 2 7 is fixedly connected to the inner wall of the fixed disk 3 and near the outside of the annular groove 6. The opposite surfaces of the magnet 1 5 and the magnet 2 7 have opposite magnetic polarities. The number of the magnet 1 5 is the same as that of the magnet 2 7. The magnet 1 5 and the magnet 2 7 play a role in generating a magnetic field;

[0027] A rotating ring 8 is movably connected to the inside of the annular groove 6. The rotating ring 8 plays a role in rotation. A ball 1 9 is movably connected to the inside of the rotating ring 8. The ball 1 9 is evenly distributed on the inside of the rotating ring 8. Conductive rods 10 are evenly distributed on the inner wall of the rotating ring 8. The ball 1 9 plays a role in reducing friction. The conductive rods 10 are fixedly connected to the inner wall of the rotating ring 8. The conductive rods 10 play a role in guiding the direction of the current;

[0028] An opening groove 19 is opened on the inner wall of the rotating disk 4. A limiting plate 11 is elastically connected to the inner wall of the rotating disk 4 and near the inside of the opening groove 19. The limiting plates 11 are symmetrically distributed on the inner wall of the rotating disk 4. The rotating disk 4 is fixedly connected to the rotating ring 8. The limiting plate 11 plays a role in clamping. The limiting plate 11 is used to clamp the silicon wafer. A trigger mechanism 14 is movably connected to the inner wall of the rotating disk 4. The trigger mechanism 14 includes a chute 141, a pressing rod 142, a conductive block 143 and an electrical contact 144. A chute 141 is opened on the inner wall of the rotating disk 4. The pressing rod 142 is elastically connected to the inner wall of the chute 141. The bottom of the pressing rod 142 is fixedly connected to the conductive block 143. The electrical contact 144 is fixedly connected to the inner wall of the chute 141. The electrical contact 144 is connected in series with an external power switch. The conductive block 143 is connected in series with a micro electric push rod 12. The conductive block 143 is connected in series with the conductive rod 10. The conductive block 143 plays a role in connecting the circuit;

[0029] The silicon wafer is inserted into the inner side of the rotating disk 4. At this time, the silicon wafer will enter the inner side of the rotating disk 4 along the inner wall of the mouth groove 19. The silicon wafer will squeeze the limiting plate 11, causing the limiting plate 11 to move inward along the inner wall of the rotating disk 4 under the action of the squeezing force. At the same time, the inserted silicon wafer will squeeze the triggering mechanism 14. At this moment, the extrusion rod 142 will move downward along the inner wall of the sliding groove 141 under the action of the squeezing force, thereby driving the conductive block 143 to contact the electrical contact 144, so that the micro-electric push rod 12 connected in series with the conductive block 143 will have current passing through.

[0030] Embodiment 2. On the basis of Embodiment 1, the present invention includes a wafer turning device for silicon wafer electrode printing, including a working platform 1. A support column 2 is fixedly connected to the top of the working platform 1. A fixed disk 3 is fixedly connected to the outer side of the support column 2. A rotating disk 4 is movably connected to the inner wall of the fixed disk 3. A magnet 5 is fixedly connected to the inner wall of the fixed disk 3. An annular groove 6 is opened on the inner wall of the fixed disk 3. A magnet 7 is fixedly connected to the inner wall of the fixed disk 3 and close to the outer side of the annular groove 6. The opposite surfaces of the magnet 5 and the magnet 7 have opposite magnetic properties. The number of the magnets 5 is the same as the number of the magnets 7. The magnets 5 and the magnets 7 play a role in generating a magnetic field.

[0031] A rotating ring 8 is movably connected to the inner side of the annular groove 6. The rotating ring 8 plays a role in rotation. A first ball 9 is movably connected to the inner side of the rotating ring 8. The first balls 9 are evenly distributed on the inner side of the rotating ring 8. Conductive rods 10 are evenly distributed on the inner wall of the rotating ring 8. The first balls 9 play a role in reducing friction. The conductive rods 10 are fixedly connected to the inner wall of the rotating ring 8. The conductive rods 10 play a role in guiding the direction of the current.

[0032] A mouth groove 19 is opened on the inner wall of the rotating disk 4. A limiting plate 11 is elastically connected to the inner side of the rotating disk 4 and close to the mouth groove 19. The limiting plates 11 are symmetrically distributed on the inner wall of the rotating disk 4. The rotating disk 4 is fixedly connected to the rotating ring 8. The limiting plate 11 plays a role in clamping. The limiting plate 11 is used to clamp the silicon wafer. A triggering mechanism 14 is movably connected to the inner wall of the rotating disk 4. The triggering mechanism 14 includes a sliding groove 141, an extrusion rod 142, a conductive block 143 and an electrical contact 144. A sliding groove 141 is opened on the inner wall of the rotating disk 4. The extrusion rod 142 is elastically connected to the inner wall of the sliding groove 141. The bottom of the extrusion rod 142 is fixedly connected to the conductive block 143. The electrical contact 144 is fixedly connected to the inner wall of the sliding groove 141. The electrical contact 144 is connected in series with an external power switch. The conductive block 143 is connected in series with the micro-electric push rod 12. The conductive block 143 is connected in series with the conductive rod 10. The conductive block 143 plays a role in connecting the circuit.

[0033] The silicon wafer is inserted into the inner side of the rotating disk 4. At this time, the silicon wafer will enter the inner side of the rotating disk 4 along the inner wall of the mouth groove 19. The silicon wafer will squeeze the limiting plate 11, so that the limiting plate 11 moves inward along the inner wall of the rotating disk 4 under the action of the squeezing force. At the same time, the inserted silicon wafer will squeeze the triggering mechanism 14. At this moment, the extrusion rod 142 will move downward along the inner wall of the sliding groove 141 under the action of the squeezing force, thereby driving the conductive block 143 to contact the electrical contact 144, so that the micro-electric push rod 12 connected in series with the conductive block 143 will have current passing through;

[0034] The inner wall of the rotating disk 4 is fixedly connected with a micro-electric push rod 12. The outer side of the micro-electric push rod 12 is fixedly connected with a rubber plate 13. The micro-electric push rod 12 is used to push the rubber plate 13 to move upward. A groove 16 is opened on the inner wall of the fixed disk 3. The inner wall of the groove 16 is elastically connected with a limiting block 17. The size of the limiting block 17 is adapted to the size of the limiting groove 15. The limiting block 17 is clamped with the limiting groove 15. The limiting blocks 17 are evenly distributed on the inner wall of the fixed disk 3. The limiting grooves 15 are evenly distributed on the inner wall of the rotating disk 4. The limiting block 17 and the limiting groove 15 play a role of clamping. The outer side of the limiting block 17 is movably connected with a second ball 18. The structure of the second ball 18 is a spherical structure. The second ball 18 is used to reduce the frictional force between the limiting block 17 and the rotating disk 4. The inner wall of the rotating disk 4 is provided with a limiting groove 15. An opening groove 19 is opened on the outer side of the rotating disk 4.

[0035] Working principle: When the wafer turning device works, first, the wafer turning device is supported on the ground through the working platform 1. Under the connection of the support column 2, the fixed disk 3 is connected to the outer side of the working platform 1. Then, the external power switch is turned on, and the silicon wafer is inserted into the inner side of the rotating disk 4. At this time, the silicon wafer will enter the inner side of the rotating disk 4 along the inner wall of the mouth groove 19. The silicon wafer will squeeze the limiting plate 11, so that the limiting plate 11 moves inward along the inner wall of the rotating disk 4 under the action of the squeezing force. At the same time, the inserted silicon wafer will squeeze the triggering mechanism 14. At this moment, the extrusion rod 142 will move downward along the inner wall of the sliding groove 141 under the action of the squeezing force, thereby driving the conductive block 143 to contact the electrical contact 144, so that the micro-electric push rod 12 connected in series with the conductive block 143 will have current passing through. Then, the micro-electric push rod 12 will extend, and then push the rubber plate 13 to move upward. At this time, a squeezing force is generated between the rubber plate 13 and the limiting plate 11, thereby restricting the shaking of the limiting plate 11, thus realizing the fixation of the silicon wafer, improving the automation degree, saving time and effort. At the same time, it is convenient to automatically fix silicon wafers of different sizes, improving the practicability of the rotating disk 4 and the diversity of the use of the wafer turning device;

[0036] Meanwhile, a current flowing from the inside to the outside passes through the conductive rod 10 connected in series with the conductive block 143. At this time, the conductive rod 10 will be under the action of the Ampere force in the magnetic field generated by the magnet one 5 and the magnet two 7. The basis for judging the Ampere force is the left-hand rule. Stretch out the left hand, let the magnetic induction lines pass through the palm, the four fingers point to the direction of the current, and the thumb is the direction of the Ampere force. From this, it can be judged that the direction of the Ampere force is along the tangent direction of the rotating ring 8. Under the rotation of the ball one 9, the conductive rod 10 drives the rotating ring 8 to rotate counterclockwise. Since the rotating ring 8 is fixedly connected to the rotating disk 4, the rotating disk 4 is driven to rotate counterclockwise. At the same time, the limiting block 17 on the inner side of the fixed disk 3 is engaged with the limiting groove 15 on the inner side of the rotating disk 4, so that the Ampere pull received by the rotating disk 4 is less than the clamping force between the rotating disk 4 and the fixed disk 3;

[0037] When the printing on one side of the silicon wafer is completed by the machine, the staff manually applies a counterclockwise rotational force to the rotating disk 4. At this time, under the action of the external force, the limiting groove 15 is separated from the limiting block 17 on the inner wall of the groove 16. At this time, under the action of the Ampere force, the rotating disk 4 will rotate counterclockwise. At this time, under the action of the ball two 18, the limiting block 17 will slide along the inner wall of the rotating disk 4. When the rotating disk 4 rotates half a turn, the limiting block 17 is engaged with the limiting groove 15 again, so that the Ampere pull received by the rotating disk 4 is less than the clamping force between the rotating disk 4 and the fixed disk 3, causing the rotating disk 4 to stop rotating again. When the printing of the silicon wafer is completed, the external power supply switch is disconnected, and the silicon wafer can be taken out. This realizes the flipping of both sides of the silicon wafer by the machine, avoiding the need for the staff to re-fix the silicon wafer, saving time and effort, improving the flipping efficiency of the silicon wafer printing, and improving the production efficiency of the silicon wafer printing products.

[0038] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device.

[0039] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer flipping device for silicon wafer electrode printing, comprising a working platform (1), characterized in that: A support column (2) is fixedly connected to the top of the working platform (1). A fixed disk (3) is fixedly connected to the outer side of the support column (2). A rotating disk (4) is movably connected to the inner wall of the fixed disk (3). A first magnet (5) is fixedly connected to the inner wall of the fixed disk (3). A ring groove (6) is formed in the inner wall of the fixed disk (3). A second magnet (7) is fixedly connected to the inner wall of the fixed disk (3) and near the outer side of the ring groove (6). A rotating ring (8) is movably connected to the inner side of the ring groove (6). The rotating ring (8) plays a role in rotation. A first ball (9) is movably connected to the inner side of the rotating ring (8). A conductive rod (10) is fixedly connected to the inner wall of the rotating ring (8). The conductive rod (10) plays a role in guiding the direction of the current. The rotating disk (4) is fixedly connected to the rotating ring (8). An opening groove (19) is formed in the inner wall of the rotating disk (4). A limiting plate (11) is elastically connected to the inner side of the rotating disk (4) and near the opening groove (19). The limiting plate (11) is used for clamping a silicon wafer. A triggering mechanism (14) is movably connected to the inner wall of the rotating disk (4). A micro electric push rod (12) is fixedly connected to the inner wall of the rotating disk (4). A rubber plate (13) is fixedly connected to the outer side of the micro electric push rod (12). The micro electric push rod (12) is used for pushing the rubber plate (13) to move upward. A groove (16) is formed in the inner wall of the fixed disk (3). A limiting block (17) is elastically connected to the inner wall of the groove (16). A second ball (18) is movably connected to the outer side of the limiting block (17). A limiting groove (15) is formed in the inner wall of the rotating disk (4). The triggering mechanism (14) includes a sliding groove (141), a pressing rod (142), a conductive block (143) and an electrical contact (144). The sliding groove (141) is formed in the inner wall of the rotating disc (4). The pressing rod (142) is elastically connected to the inner wall of the sliding groove (141). The bottom of the pressing rod (142) is fixedly connected to the conductive block (143). The electrical contact (144) is fixedly connected to the inner wall of the sliding groove (141). First, the turning device is supported on the ground by the working platform (1). Under the connection of the support column (2), the fixed disc (3) is connected to the outside of the working platform (1). Then, the external power switch is turned on, and the silicon wafer is inserted into the inner side of the rotating disc (4). At this time, the silicon wafer will enter the inner side of the rotating disc (4) along the inner wall of the mouth groove (19). The silicon wafer will press the limiting plate (11), so that the limiting plate (11) moves inward along the inner wall of the rotating disc (4) under the action of the pressing force. At the same time, the inserted silicon wafer will press the triggering mechanism (14). At this moment, the pressing rod (142) will move downward along the inner wall of the sliding groove (141) under the action of the pressing force, thereby driving the conductive block (143) to contact the electrical contact (144), so that the micro-electric push rod (12) connected in series with the conductive block (143) will have current passing through, and then the micro-electric push rod (12) will extend, thereby pushing the rubber plate (13) upward. At this time, a pressing force is generated between the rubber plate (13) and the limiting plate (11), thereby restricting the shaking of the limiting plate (11). The electrical contact (144) is connected in series with the external power switch. The conductive block (143) is connected in series with the micro-electric push rod (12). The conductive block (143) is connected in series with the conductive rod (10).

2. The wafer flipping device for silicon wafer electrode printing according to claim 1, characterized in that: The opposite surfaces of the first magnet (5) and the second magnet (7) have opposite magnetic polarities. The number of the first magnets (5) is the same as that of the second magnets (7).

3. A wafer flipping device for silicon wafer electrode printing according to claim 1, characterized in that: The first balls (9) are evenly distributed inside the rotating ring (8). The conductive rods (10) are evenly distributed on the inner wall of the rotating ring (8).

4. A wafer flipping device for silicon wafer electrode printing according to claim 1, characterized in that: The limiting plates (11) are symmetrically distributed on the inner wall of the rotating disc (4).

5. A wafer flipping device for silicon wafer electrode printing according to claim 1, characterized in that: The size of the limiting block (17) is adapted to the size of the limiting groove (15). The limiting block (17) is clamped with the limiting groove (15). The limiting blocks (17) are evenly distributed on the inner wall of the fixed disc (3). The limiting grooves (15) are evenly distributed on the inner wall of the rotating disc (4).

6. A wafer flipping device for silicon wafer electrode printing according to claim 1, characterized in that: The second balls (18) are spherical in structure. The second balls (18) are used to reduce the frictional force between the limiting block (17) and the rotating disc (4) during contact.

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