Connectors for electronic components

Abstract

A connector (1) for an electronic component comprises a base (3) having at least two electrical feedthroughs (5), each electrical feedthrough comprising a feedthrough pin (6) within the feedthrough extending through the base (3) and electrically insulated from the base (3), the connector (1) further comprising at least one base (7) connected to the base (3) and two bases (9), each base (9) comprising a carrier (11) having a structured conductor coating (13), the conductor coating (13) comprising at least two conductor tracks (130, 131, 132, 133), one of the conductor tracks (130, 131, 132, 133) of each base (9) being electrically connected to the feedthrough pin (6), wherein the bases (9) are formed uniformly but mounted in different orientations.

Description

Technical Field

[0001] The present invention generally relates to the packaging of electronic components. In particular, the present invention relates to the design of connectors, preferably transistor outline connectors (TO-connectors), for mounting electronic devices. The present invention is particularly suitable for laser diodes as electronic devices. Background Art

[0002] For some optoelectronic applications, the wavelength of the light beam emitted by the laser chip must be precisely controlled. Since the wavelength of the laser is temperature-dependent, the temperature of the laser should be stable within a narrow temperature range. To achieve this, it is known to use a thermoelectric cooler (TEC). The TEC can be included in a housing for the laser diode, such as a transistor outline (TO) package. The TEC can be connected in series with a modulated laser (DML) directly for medium distances. The cost of a DML is lower than that of an externally modulated laser (EML). However, many laser driver ICs drive the DML with a differential signal. In this case, the connector requires two RF signal lines. These two signal lines should preferably have a characteristic impedance of Z0=25 or 50 ohms to avoid signal attenuation caused by reflections other than the DML.

[0003] Furthermore, the TEC has a hot end and a cold end. The hot end is connected to the header to dissipate heat. The DML is mounted on the cold end. The cold end should be thermally insulated from the hot end to prevent thermal feedback and self-heating effects. On the other hand, two RF lines must be connected to the DML. A well-known concept is to use two separate RF lines. Each RF line includes a small printed wiring board (base base) to transmit the signal to the DML in the header. Each base base can be mounted on a separate base. Usually, the eyelet or base of the base and the header are made integrally in one stamping process.

[0004] In existing designs, the RF line can be a ground referenced microstrip line, the signal line is on the top of the base pedestal and the ground is on the bottom of the base pedestal. To connect the DML mounted on the carrier to the cold side of the TEC, bond wires are used because of their very low thermal conductivity. To connect the bond wire interconnects to ground, two vias can be used in each base pedestal. The vias provide an interconnect from the bottom to the top of the base pedestal. Using two vias enables a ground-signal-ground (GSG) bond wire configuration, which has better RF performance than a simple ground-signal configuration. Summary of the invention

[0005] Since the two RF lines arrive at the DML from opposite directions, the two base bases have different metal patterns, which complicates assembly. Therefore, the object of the present invention is to provide a design for a joint that is easy to assemble and still provides good RF performance. This object is achieved by the subject matter of the claims. Therefore, a joint for an electronic component is provided, which includes a substrate having at least two electrical feedthroughs, each of which includes a feedthrough pin within the feedthrough that extends through the substrate and is electrically insulated from the substrate. The joint also includes at least one base connected to the substrate and two bases. Each base includes a carrier or substrate having a structured conductor coating, the conductor coating including at least two conductor traces. One of the conductor traces of each base is electrically connected to one of the feedthrough pins. The bases are formed identically. However, the bases are mounted in different orientations to enable contacting the electronic device from opposite directions.

[0006] It is advantageous if two bases are provided. Each base then carries a base and the base is connected to the base body with a gap in between. In this gap, the mount with the electronic components can be positioned and fixed to the base body.

[0007] In a preferred refinement of this embodiment, the base is mounted to at least one of the bases so that the respective ends of those conductor traces connected to the feed-through pins face each other. The conductor traces connected to the feed-through pins are typically signal-carrying conductors. Thus, using a configuration in which the ends away from the feed-through pins face each other, the distance to the electronic device can be reduced.

[0008] In a preferred embodiment, the pattern of the structured conductor coating of the base has a mirror symmetry. This makes it possible to use bases that are mounted with different ends pointing to the base, and whereby the ends of the conductor tracks face each other. Therefore, according to a preferred embodiment, the base has two opposite ends and is mounted with one end facing the base, and wherein the symmetry plane of the mirror-symmetrical conductor coating is located between the ends. In particular, the base can have two opposite ends, in particular ends that are distinguishable from each other, wherein one base is attached to the base with one end facing the base and the other base is attached to the base with the opposite end facing the base. In this way, the left base and the right base are of the same type, but only one of the bases needs to be rotated 180° for installation. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The present invention is described in more detail below with reference to the accompanying drawings.

[0010] Figure 1 A perspective view of a joint with two bases is shown.

[0011] Figure 2 A top view of the two mounts is shown.

[0012] Figure 3The connector of the mount provided with the electronic components is shown.

[0013] Figure 4 Electronic components with connectors are shown.

[0014] Figure 5 and Figure 6 A base for a pedestal is shown.

[0015] Figure 7 Another embodiment of a base is shown.

[0016] Figure 8 Shows Figure 6 The base and Figure 7 Assembly of the base.

[0017] Fig. 9 A base having both an L-shaped and a U-shaped profile is shown.

[0018] Fig.10 An L-shaped base is shown.

[0019] Fig.11 is a top view of the joint.

[0020] Fig.12 Shows Figure 1 In a variation of an embodiment, the feed-through pin has a connector.

[0021] Fig.13 is a cross-sectional view of a portion of a joint. DETAILED DESCRIPTION

[0022] Figure 1 The connector 1 shown comprises a base body 3 having two or more electrical feedthroughs 5. The feedthroughs are used to transmit electrical signals into or out of the connector 1. Each feedthrough 5 comprises a feedthrough pin 6 extending through the base body 3 and electrically insulated therefrom. For this purpose, the base body 3 comprises an eyelet 8 filled with an insulating material, preferably glass, in which the feedthrough pins 6 are fixed. In a preferred embodiment, the diameter of the pins 6 ranges from 0.15 mm to 1.0 mm. The protrusion ("column height") of the pins on one side of the base body 3 bearing base 7 may range from 0 mm to 1 mm. According to an example, the feedthrough pins 6 have a diameter of 0.25 mm and a column height of 0.4 mm.

[0023] Two bases 7 are connected to the base 3 and protrude from the base 3. Without being limited to the specific example shown, in a preferred embodiment, the bases 7 are arranged at intervals with gaps 12 therebetween. The gaps 12 are used to accommodate additional components, in particular, components for carrying electronic devices as further described below.

[0024] A base 9 is attached to each base 7. Generally, without limiting the features of the specific exemplary embodiment shown in the figure, it is envisaged that the base 7 and the substrate 3 are separate components, connected together by brazing or welding or more generally by a conductive joint. This has a technical advantage, namely that the stamping process without the joint of the two bases is easier. There are many methods for manufacturing the separate bases, such as stamping, metal drawing or extrusion. In addition, since the complexity of the design is reduced by separating the manufacture of the joint and the base, additional features can be implemented in the base. A very advantageous feature is the increased freedom of designing the profile of the base. Specifically, the base can have an L-shaped or U-shaped profile. Profiles of this shape can be particularly advantageous because they provide a stop for the base, which helps to position the base. In addition, the protrusions of the L-shaped or U-shaped base can provide additional shielding of the signal path. In addition, a rounded or chamfered edge can be provided on the base base mounting side of the base.

[0025] Each base 9 comprises a carrier 11. Without being limited to other features of the example shown, the carrier 11 is electrically insulating.

[0026] The base pedestal 9 is preferably made of a ceramic material. Suitable materials are aluminum oxide (Al2O3) and aluminum nitride (ALN). If thermal conductivity is not too important, the base pedestal 9 can also be made of glass, for example.

[0027] According to a preferred embodiment, the thickness of the base pedestal 9 is between 0.1 mm and 0.5 mm. A typical thickness is 0.2 mm. In case of focused electro-optical devices as electronic devices to be accommodated on the connector, the length of the base pedestal can be selected based on the focal length of the lens. For example, the lens can couple light from the DML into the glass fiber. A typical base pedestal length is between 1.0 mm and 3 mm, for example 2.13 mm or 2.5 mm. According to another preferred embodiment, the width of the base pedestal 9 is between 0.5 mm and 1 mm. A typical width is 0.77 mm.

[0028] From a manufacturing point of view, there are many advantages to having only one type of base substrate 9 which can be used for both bases 7. To achieve this, the base substrate is symmetrical about the middle of its length. Therefore, as described above, a mirror symmetry plane extends between the ends of the base 9. This means that the metal pattern on the top is symmetrical about this line. However, the electrical interconnections at both ends of the base substrate may be different. At the substrate side, the RF pins can be connected to the base substrate 9 by solder joints 23. At the other end, the connection is a bond wire interconnect with a ground-signal-ground configuration. In order to achieve this with the same metal pattern at both ends of the base substrate, the metal shapes are connected to different nets depending on whether the base substrate is used on the left or right base.

[0029] The carrier 11 carries a structured conductor coating 13 with conductor tracks 130, 131, 132, 133. For both bases 9, the conductor tracks 130 are electrically connected to the feed-through pins 6 of the electrical feed-throughs 5 in order to transmit the HF signal to the electronic components to be mounted in the gap 12. Figure 1 It can be clearly seen that the ends 135 of the conductor tracks 130 facing each other away from the feed-through pin 6. In addition, the structural design of the conductor plating 13 is such that the two bases 9 including the conductor tracks 130, 131, 132, 133 are identical. However, the bases 9 are mounted so that the orientation of one base 9 is flipped relative to the other base 9. Specifically, one base 9 is rotated relative to the other base 9 around an axis perpendicular to the face of the carrier 11 carrying the conductor plating 13. In this way, although the pattern of the conductor plating 13 is the same, the ends 135 of the conductor tracks 130 point to each other.

[0030] Furthermore, the conductor traces 131, 132, 133 serve as ground conductors. Thus, the signal-carrying conductor trace 130 is flanked by the ground conductor to provide shielding and good RF performance. Thus, specifically and without limitation to the specific example shown, at least one conductor trace of the conductor plating 13 may be grounded. Furthermore, typically, a ground connection to the conductor trace may be established by at least one bonding wire connection 21. In order to provide a good connection, also as shown in FIG. Figure 1 As shown, two or more bond wire connections 21 may be attached in parallel to a conductor trace to provide a low impedance connection.

[0031] Figure 2 A top view of the arrangement of the conductor coating 13 on two substrates 9 is shown. Figure 2 This is also an example of a preferred embodiment, according to which the pattern of the structured conductor coating 13 of the base 9 has a mirror symmetry. Figure 2 The symmetry plane 15 for the two bases 9 is shown. According to a further development of this embodiment, the base 9 has two opposite ends 90, 91 and is mounted with one end 90, 91 facing the base 3. Figure 2 The symmetry plane 15 of the mirror-symmetrical conductor coating 13 is located between the ends 90 , 91 or extends between them, respectively. Two identical bases 9 are shown in their relative orientation, wherein they are attached to a base 7 .

[0032] According to another embodiment, the bases 9 are assembled so that the mirror extends between the bases 9. Thus, Figure 1 and 2 The arrangement of the base and preferably also of the substructure is shown symmetrical with respect to two mirror planes, namely a plane extending between the ends 90 , 91 of the base and a plane midway between the base 9 and substructure 7 .

[0033] from Figure 2 It is evident that, in general, the base 9 may have two opposite ends 90, 91 which are distinguishable with respect to the pattern of the conductor plating. One base 9 may then be attached to the base with the end 90 facing the base 3, while the other base 9 may be attached to the base with the opposite end 91 facing the base 3. Due to this orientation and the shape of the conductor traces 130, their respective ends 135 face each other, as can be seen from Figure 2 Obviously.

[0034] Furthermore, it is advantageous if a conductor track of the structured conductor coating 13 is U-shaped. Figure 2 In the example of , this feature is implemented for the conductor track 130. Specifically, one of the limbs 137 of the U-shaped conductor track 130 forms an end 135 that faces the end 135 of the conductor track 130 of the other base 9.

[0035] According to a refinement of this embodiment, further conductor tracks are arranged between the limbs 137 of the U-shaped conductor track 130. Figure 2 In the example of , this is the case with the D-shaped conductor track 131 .

[0036] from Figure 1 and Figure 2 As can be seen from the example of FIG. 1 , each base 9 has four conductor tracks 130, 131, 132, 133. The conductor track 130 is on both side portions of the signal line.

[0037] According to a further development of the embodiment with a U-shaped conductor track, the conductor track is arranged between the limbs 137 of the U-shaped conductor track 130 and the ends 90, 91 of the base 9 close to the limbs. Figure 2 In the example shown, this applies to conductor tracks 132 and 133 .

[0038] As in Figure 1 In the example of , the ground conductor traces 131, 132, 133 can be connected by bonding wires. According to another alternative or additional embodiment, the base 9 includes at least one electrical via 16, which connects the conductor traces 130, 131, 132, 133 to the side of the carrier 11 opposite to the side with the structured conductor coating 13. Since this opposite side rests on the base, a ground connection can be established from the base through the via 16 to the conductor trace. On both bases, the D-shaped conductor trace 131 is connected to the ground (ground pad). This can be achieved by Figure 1 In the example of bonding wire connection 21 or by Figure 2 The via 16 shown is realized. Through the via 16, the conductor track 131 is grounded because the via 16 establishes an electrical contact with the base 7. If it is assumed that Figure 2The respective lower ends 91, 90 of the middle base 9 face the base 3, then the conductor track 132 of the left base 9 is grounded, while on the right, the conductor track 132 is part of the signal line. This can be achieved if the solder joint to the feed-through pin 6 contacts the conductor track 130 in addition to the conductor track 133. Conversely, the conductor track 133 is part of the signal line on the left and is connected to the ground on the right. Thus, the conductor tracks 132, 133 change the network depending on the base 7 on which the base 9 is mounted.

[0039] However, the via 16 is optional. If the via 16 is omitted, a thinner base 9 can be used. For example, the thickness can be reduced from 0.2 mm with a via to 0.15 mm without a via. Because laser drilling is not required, the base 9 is not subject to hard stress. With a thinner base 9, the line width of the microstrip line can be reduced for the same line impedance Z0. For a line impedance Z0 = 25 ohms, the line width can be reduced from 0.67 mm to 0.50 mm using a thinner base 9. The difference is 0.16 mm. This is a great advantage in a compact, fully encapsulated TO connector assembly.

[0040] Usually, as in Figure 1 In the example of FIG. 1 , the grounding of these conductor tracks 132, 133 can be achieved by a bonding wire connection 21. In particular, as shown, two bonding wires can be used in each case. In addition, the bonding wires are connected to the raised side walls or rib-like protrusions of the base 7. Due to the protrusions, the base 7 has an L-shaped cross section.

[0041] Since the grounded D-shaped conductor trace 131 and the conductor traces 132 , 133 surround the signal conductor, ie, the U-shaped conductor trace 130 , a coplanar waveguide structure is established at least at the ends 135 facing the corresponding ends 135 of the conductor trace 130 on the opposite base 9 .

[0042] For example, four bond wires are used to connect shape D to the sidewall of the L-shaped base. The bond wires span the signal path shape C. Because the bond wires are exactly perpendicular to the signal propagation direction, no signal coupling occurs. The signal remains undisturbed. The spanning bond wire interconnection produces two technical advantages.

[0043] Multiple bond wire connections 21 may be advantageous for achieving low impedance. In addition, the bond wire array on the microstrip line established by the conductor trace enables a smaller line width for the same line impedance than without the bond wire array. This is very important because the line width of the microstrip line becomes narrower due to the space required for the conductor trace 131. The bond wire array is like a ground plane above the microstrip. In this section, the RF line is a mix of a microstrip line and a suspended RF line.

[0044] The effect of the ground plane above the RF signal conductor trace increases the capacitance of the RF line. Therefore, the line width can be reduced to maintain the same line impedance Z0. r =1, so the line impedance does not strongly depend on the distance between the RF line and the bonding wire array.

[0045] In addition, the dense array of bond wires provides shielding over the microstrip line or more generally over the conductor plating 13 forming the high frequency signal line. This shielding prevents unwanted signals from coupling to other components within the connector. For example, a monitoring diode or NTC resistor (thermistor) used to measure temperature may be affected by electromagnetic radiation from the signal line.

[0046] Figure 3 The further assembled joint 1 is shown. Typically, a carrier 17 for an electronic device 19 is arranged between two bases 9 , wherein ends 135 of conductor tracks 130 of the bases 9 , preferably ends 135 facing each other, are provided with bond wire connections 21 for connecting the electronic device 19 .

[0047] Preferably, the electronic device 19 is mounted on a further base. The device base 25 is attached to the carrier 17. The device base 25 also has a structured conductor coating 13.

[0048] Preferably, the carrier 17 is not fixed directly to the base 3. Instead, the carrier 17 is attached to the thermoelectric cooler 18, wherein the thermoelectric cooler 18 is coupled to the base 3 to dissipate heat to the base 3. There is a remaining gap between the carrier 17 and the base 7 to avoid thermal short circuits. However, as shown, the carrier 17 can be electrically grounded to the base 7 through an additional bonding wire connection 21.

[0049] The bonding wire connection from the base 9 to the device base 25 is advantageous for interconnections with very low thermal conductivity. On the other hand, the bonding wire interconnection has a high parasitic inductance, which particularly reduces high frequency signals. However, by means of a ground-signal-ground (GSG) bonding wire configuration, the parasitic inductance can be significantly reduced. Grounding, which in this case can also be referred to as a return path, is achieved by two ground conductors constituting the signal conductor. In particular, such a GSG configuration is implemented on the base 9 and the device base 25 to achieve good RF performance. Therefore, according to a preferred embodiment, the base 9 has a structured conductor plating 13, which has a signal-carrying conductor trace 130 connected to the corresponding feed-through pin 6 and which is at least partially located on the wing side of the ground conductor, preferably the ground conductor trace 131, 132, 133 on two edges, and wherein the signal-carrying conductor trace 130 is connected to a signal conductor trace 170 on a mounting base 17 for an electronic device, wherein the signal conductor trace 170 on the mounting base 17 is also located on the wing side of the ground conductor trace 171, 172 on two edges. Preferably, as in Figure 3 In the illustrated embodiment, the conductor tracks 170 , 171 , 172 are not arranged directly on the mounting base 17 , but are placed on the device base 25 .

[0050] Figure 4 An electronic component 30 having a connector 1 as described herein is shown. The electronic component 30 according to the present invention is understood to be a component having a housing for accommodating an electronic device, and terminals for electrically connecting the electronic device in the housing. Figure 4 According to a specific example, an electronic component 30 having a housing 32 is provided. The housing 32 surrounds the electronic device 19 and includes a connector 1 according to the present invention. The electronic device 19 is mounted on the connector 1. In addition, the housing 32 includes a cap 33, which is attached to the connector 1 to provide a cavity 38, wherein the electronic device 19 is arranged in the cavity 38.

[0051] In a preferred embodiment, the electronic device 19 is an optoelectronic device for sending or receiving optical signals. For this application, the housing 32 includes a transparent member 34 to transmit the optical signal into or out of the housing 32. Figure 4 In the exemplary embodiment of the present invention, the transparent member 34 is a glass window inserted into the opening of the cap. However, other transparent members, such as light guides or lenses, may be used depending on the application.

[0052] Typically and not limited to the illustrated embodiment, the optoelectronic device may be a laser diode, preferably a directly modulated laser diode (DML), which transmits emitted laser light through the transparent member 34. The DML may be operated by differential signals or single ended so that two signal paths are used, wherein a conductor trace on each base 9 is connected to a feed-through pin 6 to transmit a portion of the differential signal.

[0053] Figure 5 The base 7 is shown, which is also Figure 1 and Figure 3 The base 7 has two end faces 70, 71. The base 7 is mounted to the substrate 3 with one of its end faces 70, 71. The fixing of the base 7 to the substrate 3 is preferably accomplished by soldering, for example using AuSn solder or AuGe solder. Due to lateral protrusions 74 in the form of ribs or strips, the profile of the base 7 has an L-shape. The protrusions 74 extend laterally along the mounting surface 73. The mounting surface 73 is used to mount and fix the corresponding base. Although the profile of the base 7 is not symmetrical, the base 7 has a mirror symmetry, and the mirror extends between the two end faces 70, 71. The intersection of the mirror with the surface of the base 7 is indicated by a hatched line 75. This symmetry feature is similar to the symmetry feature of the base 9. Therefore, it is not limited to Figure 5 The preferred embodiment of the joint is based on the feature that two identical bases 7 are provided, each base 7 carrying one of the bases 9, wherein the bases 7 on the base 3 have a mirror symmetry. Moreover, similar to the orientation of the bases 9, one base 7 is attached to the base 3 via an end face 70, while the other base 7 is attached to the base 3 via an opposite end face 71.

[0054] Since both the base and the pedestal 9 can be mounted with their opposite sides facing the base, it is possible to assemble the pedestal 9 and the pedestal 7 to obtain the same base assembly and fix the base assembly with their opposite end faces facing the base 3 .

[0055] In a preferred embodiment, the protrusion 74 may have the same height as the base 9, or the ratio of the height of the protrusion 74 to the height of the base 9 is between 0.5 and 1.5. The height of the protrusion is preferably between 0.1 mm and 0.5 mm. A typical height is about 0.2 mm. The width of the protrusion may be between 0.1 mm and 0.3 mm. A typical width is 0.175 mm. The L-shaped profile has several advantages. The ground is easily accessible from the top of the base base. Because the protrusion is solid metal and is as long as the base base 9 itself, the ground area has low inductance and is therefore preferred for RF applications.

[0056] Furthermore, the protrusion acts as an electromagnetic shield. The electromagnetic field within the base pedestal 9 cannot extend beyond the base in the negative x-direction, which is possible without the side walls. In this way, the metal cap of the housing can be placed closer to the base without electromagnetic coupling with the cap. Furthermore, the protrusion acts as an alignment tool during the base pedestal assembly. The base pedestal can be assembled more precisely.

[0057] Another implementation is of course a flat base 7. In other words, in this case, the side of the base 7 with the mounting surface 73 is flat. In this case, the bonding wire 21 must reach down to the base surface to contact the ground. This makes the bonding wire longer. This may not be advantageous for very high frequency applications. On the other hand, this design is simple and also allows the use of two identical bases. This embodiment is particularly suitable for applications with lower signal rates to save costs.

[0058] Figure 6 An alternative embodiment of the base 7 is shown. Figure 5 Unlike the embodiment of the embodiment having a U-shaped profile, the protrusion 74 extends along the opposite side of the mounting surface 73. According to an embodiment, which is also realized by a U-shaped profile, the base 7 can generally have a mirror-symmetrical profile. In this case, the mirror plane extends through the center of the profile parallel to the protrusion. Figure 6 The intersection 75 of the two symmetry planes is shown in FIG. In this case with double mirror symmetry, the base 7 can be attached to the base body 3 with the end face 70 or 71 without changing the design.

[0059] Also in Figure 5 In the example of , these protrusions 74 can also be used to provide a ground-signal-ground configuration. Specifically, in the embodiment with the L-shaped profile of the base 7, the protrusion 74 is a ground conductor, which is located on the wing side of the C-shaped conductor trace 130 opposite to the side facing the D-shaped conductor trace 131. Figure 6 In the embodiment of FIG. 5 , the signal conductor traces may be located on both sides of the flanks of the protrusion 74. Therefore, the Figure 5 D-shaped conductor trace 131 in the example.

[0060] Figure 7 A base 9 is shown which fits into a U-shaped base 7. As an embodiment with a C-shaped conductor track, a symmetry plane 15 extends between the ends 90,91.

[0061] Figure 8 Shows Figure 6 Base 7 and Figure 7 The assembly of the base 9. Figure 7The example of the base 9 of has no additional mirror symmetry plane in a direction parallel to the sides 92, 93, so that the assembly lacks a second symmetry plane defined by the symmetry of the profile of the base 7. However, similar to the L-shaped base 7, the assembly can be pre-assembled and mounted to the base 3 with the corresponding end faces 70, 71. Similarly, although the assembly is identical, it is arranged on the base 3 in a mirror symmetric manner. Therefore, for the embodiment with an L-shaped base, the bases 9 are identical and have two opposite ends 90, 91, wherein one base 9 is attached to the base 7 with one end 90 facing the base 3, and the other base 9 is attached to the base with the other end 90 facing the base 3.

[0062] Fig. 9 An embodiment is shown in which the base 7 has an L-shaped profile at the end 70 and a U-shaped profile at the opposite end 71. The different profiles are caused by one protrusion being shorter than the other protrusion 74. Due to this design, the mounting surface 73 is L-shaped. Obviously, this embodiment has no mirror symmetry. However, according to Fig.10 The L-shaped base 9 is adapted to Fig. 9 The L-shaped mounting surface 73 of the base can still have mirror symmetry. This allows the left base 9 and the right base 9 to be manufactured as the same component. Specifically, a structured conductive coating 13 can be arranged on two opposite sides of the carrier 11, wherein the conductive coating 13 has mirror symmetry, and the symmetry plane extends centrally between the sides of the base 9 or the carrier 11, respectively. Of course, this feature is not limited to Fig.10 In contrast, in all embodiments of the base 9 disclosed herein, there may be front and back plating. Fig.10 is a top view of one of the sides of the carrier 11. Therefore, the mirror symmetry plane is parallel to Fig.10 side shown and is therefore parallel to Fig.10 Therefore, according to one embodiment, a joint 1 is provided, which further comprises at least one base 7 connected to the base body 3, and two identical bases 9, each base 9 comprising a carrier 11 with a conductor coating 13 on two opposite sides, wherein the mirror symmetry plane is parallel to the two opposite sides and extends between them.

[0063] According to another advantageous embodiment, the end 135 of the conductor track 130 which is remote from the end connected to the feed-through pin 6 is widened. Widening is understood to mean that the width of the conductor track widens toward the end remote from the feed-through pin 6. This embodiment is also Figure 1 , 23 and 4. Generally, the widening can be achieved by providing a protruding edge 136 at the end 135 away from the end connected to the feed-through pin. Preferably, also in the embodiment shown, the widening is only performed on one side of the end of the conductor track 130 connected to the feed-through pin. Therefore, there is only one protruding edge at the end 135 of the conductor track 130. This is preferred in the case of limited space.

[0064] Fig.11 is a top view of the connector 1. For simplicity, the mounting base 17 and the thermoelectric cooler are not shown. The conductor pattern of the device base 25 has a ground-signal-ground configuration similar to the conductor pattern 13 on the base 9. Specifically, the signal conductor trace 130 on the base 9 is connected to the signal conductor trace 170 on the device base 25, and the ground conductor traces 131, 132, 133 on the base 9 are connected to the ground conductor traces 171, 172 on the device base 25. The connection is established by the bonding wire connection 21.

[0065] As about Fig.10 As described above, it is advantageous to widen the ends 135 of the signal-carrying conductor traces 130 on the base 9. In addition, the signal conductor traces 170 on the device base 25 are also widened at their respective ends 173, by means of which they are connected to the conductor traces 130 via the bonding wire connections 21. The widening of the ends 135 and 173 increases the line capacitance. This design is advantageous because the increase in capacitance reduces the effective impedance of the bonding wire connections 21. Specifically, the widening of the signal-carrying conductor traces 130, 170 can at least partially compensate for the increase in line impedance caused by the bonding wire connections. Therefore, in addition to the feature that the ends 135 of the conductor traces 130 of each base 9, which are away from the ends connected to the feedthrough pins 6, are widened, both ends of the signal conductor traces on the bases 9, 25 can be widened. Thus, a connector 1 having a device base 25 for mounting an electronic device 19 is provided, wherein a conductor trace 130 on the base 9 is connected to a feed-through pin 6, and wherein the conductor trace 130 is connected to a signal conductor trace 250 on the device base 25, wherein a connection is established via at least one bonding wire connection 21 bridging a gap 27 between the base 9 and the device base 25, and wherein the ends 135, 173 of the conductor traces 130, 170 connected via the bonding wire connection 21 are widened.

[0066] Fig.12 A portion of a joint 1 having a base 7 is shown and represents Figure 1 In particular, the variation involves the feed-through pin 6 being electrically connected to the signal conductor trace 130. Figure 1In the embodiment of the feed-through pin 6, the feed-through pin is a cylindrical or linear member. However, according to an embodiment, the feed-through pin 6 includes a head 60, wherein the head 60 is formed and arranged or positioned to reduce the distance of the pin 6 to the conductor plating 13 of the base 9. Reducing the distance is conducive to reducing the insertion loss at the junction between the pin 6 and the base 9. According to the improvement implemented in the example shown, the head has a shape similar to a golf club. The shape of the pin 6 can also be described as having a shaft 59 and a head 60, the head 60 having a wing 61 extending transversely to the longitudinal direction of the pin 6, so that the end of the wing 61 protrudes on the circumferential surface of the shaft 59. In particular, the wing 61 can then be oriented so as to reduce the distance to the conductive plating 13 on the base 9. In addition, the head 60 can be used to bridge the conductor trace 133 closest to the substrate 3. Then, the conductor trace 133 can be grounded to the protrusion 74 of the base 7 using a bonding wire connection 21, for example as shown in the figure.

[0067] Fig.13 is a cross-sectional view of a portion of the connector 1 and illustrates an example of an alternative embodiment of the feedthrough 5. Generally, for all embodiments disclosed herein, the feedthrough 5 may include a glass insulator 36 to secure the feedthrough pin 6 within the opening or eyelet 8. Fig.12 In the example of FIG. 6 , the feed-through pin 6 has a head 60 . In addition, Fig.13 is an example of an embodiment having at least one of the following features:

[0068] (i) the diameter of the head 60 is greater than the diameter of the shaft 59 of the pin 6,

[0069] (ii) the head 60 does not protrude from the eyelet 8,

[0070] (iii) the glass insulator 36 is embedded in the eyelet 8 so that the head 60 protrudes from the glass insulator 36 in the eyelet 8,

[0071] (iv) Viewed in the longitudinal direction of the pin 6 , the base 9 covers a portion of the eyelet 8 or the head 60 .

[0072] In other words, feature (iv) means that the surface of the base 9 with the structured conductive plating 13 is at the height where it intersects the eyelet 8 or even the head 60 if viewed along the axis 59 of the pin 6. Due to this configuration or the configuration according to feature (ii), the conductive plating 13 can be positioned very close to the head 60, thereby reducing insertion losses. The embedded glass insulator 36 further ensures that the insulating material does not protrude outside the eyelet 8 due to tolerances in manufacturing. Protruding glass parts would prevent the base 9 from being placed on the eyelet 8. In addition, the embedded glass together with the increased diameter of the head leads to improved impedance matching.

[0073] Reference numerals list

[0074]

[0075]

Claims

1. A connector (1) for an electronic component, comprising a base (3) having at least two electrical feedthroughs (5), each electrical feedthrough comprising a feedthrough pin (6) within the electrical feedthrough (5), the feedthrough pin (6) extending through the base (3) and being electrically insulated from the base (3), the connector (1) further comprising at least one base (7) connected to the base (3) and protruding from the base (3) and two bases (9), each base (9) comprising a carrier (11) having a structured conductor coating (13), the conductor coating (13) comprising at least two conductor tracks (130, 131, 132, 133), one of the conductor tracks (130, 131, 132, 133) of each base (9) being electrically connected to one of the feedthrough pins (6), in, The two bases (9) have the same structure but are mounted on at least one base (7) so that one base (9) is flipped relative to the other base (9), wherein the pattern of the structured conductor coating (13) of each base (9) has mirror symmetry with respect to the symmetry plane (15); and The plane of symmetry (15) is located between two opposite ends (90, 91) of each base (9).

2. The connector (1) according to claim 1, in, The base (9) is mounted to at least one chassis (7) such that the respective ends (135) of those conductor tracks (130, 131, 132, 133) connected to the feed-through pins (6) face each other.

3. The connector (1) according to claim 1 or 2, in, The base (9) is installed with one end (90, 91) facing the base (3).

4. The joint (1) according to claim 1 or 2, in, One of the two bases (9) is attached to the base with one end (90) facing the base (3), while the other of the two bases (9) is attached to the base with the other end (91) facing the base (3).

5. The joint (1) according to claim 1 or 2, in, A conductor track (130) of the structured conductor coating (13) is U-shaped, one of the limbs (137) of the U-shaped conductor track (130) forming an end (135) of the conductor track (130) facing the other substrate (9).

6. The connector (1) according to claim 5, in, The connector (1) is characterized by having at least one of the following features: - a further conductor track (131) is arranged between the limbs (137) of the U-shaped conductor track (130), - a conductor track (132) is arranged between a limb (137) of the U-shaped conductor track (130) and an end (90, 91) of the base (9) close to the limb, - the end (135) of the conductor track (130) of the base (9) remote from the end connected to the feed-through pin (6) is widened, - A connector (1) comprising a device base (25) for mounting an electronic device (19), wherein a conductor track (130) on the base (9) is connected to a feed-through pin (6), and wherein the conductor track (130) is connected to a signal conductor track (170) on the device base (25), wherein the connection is established by at least one bonding wire connection (21) bridging a gap (27) between the base (9) and the device base (25), and wherein an end (135) of the conductor track (130) and an end (173) of the signal conductor track (170) connected by the bonding wire connection (21) are widened, - The feed-through pin (6) comprises a head (60), wherein the head (60) is formed and positioned to reduce the distance of the feed-through pin (6) to the conductor plating (13) of the base (9).

7. The joint (1) according to claim 1 or 2, in, The base (9) comprises at least one through-hole (16) which connects a conductor track (130, 131, 132, 133) to the side of the carrier (11) opposite to the side having the structured conductor coating (13).

8. The joint (1) according to claim 1 or 2, in, Two bases (7) are provided, each base (7) carries a base (9), and the bases (7) are connected to the base (3) with a gap therebetween.

9. The joint (1) according to claim 1 or 2, in, A mount (17) for an electronic component (19) is arranged between two bases (9), wherein the ends (135) of the conductor tracks (130, 131, 132, 133) of the bases (9) are provided with bonding wire connections (21) for connecting the electronic component (19).

10. The joint (1) according to claim 1 or 2, in, The mount (17) is attached to a thermoelectric cooler (18), wherein the thermoelectric cooler (18) is coupled to the substrate (3) to dissipate heat to the substrate (3).

11. The joint (1) according to claim 1 or 2, in, The base (9) has a structured conductor coating (13) having a signal-carrying conductor trace (130) connected to a corresponding feed-through pin (6) and grounding conductor traces (131, 132, 133) located at two edges of the signal-carrying conductor trace (130), wherein the signal-carrying conductor trace (130) is connected to a signal conductor trace (170) on a mounting seat (17) for an electronic device (19), wherein the signal conductor trace (170) on the mounting seat (17) is located on both edges to the side of the grounding conductor traces (171, 172).

12. The joint (1) according to claim 1 or 2, in, Two bases (7) are provided, each base (7) carrying a base (9), and wherein the bases (7) on the base body (3) have mirror symmetry.

13. An electronic component (30) having a housing (32), the housing (32) enclosing an electronic device and comprising a connector (1) according to any one of claims 1 to 12, the electronic device (19) being mounted on the connector (1); and a cap (36), the cap (36) being attached to the connector (1) so as to provide a cavity (38), the electronic device (19) being arranged in the cavity (38).

14. The electronic component (30) according to claim 13, in, The electronic device (19) is an optoelectronic device for sending or receiving optical signals, and wherein the housing (32) includes a transparent member (34) to transmit the optical signal into or out of the housing.

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