Component carrier and method for producing a component carrier

Abstract

A component carrier is disclosed, which has a first component carrier structure, which includes a first stack with at least one first electrically conductive layer structure and at least one first electrically insulating layer structure. The at least one first electrically conductive layer structure has a first contact element, which extends up to a first contact surface of the first stack. An electrically conductive connecting medium is directly connected to the first contact element by filling at least one recess of the first contact element at the first contact surface. The at least one recess has a cavity of larger size defined by a surface contour of smaller size. A method for manufacturing a component carrier is also disclosed.

Description

Technical Field

[0001] The invention relates to a component carrier. Furthermore, the invention relates to a method for producing a component carrier. Background Art

[0002] Against the background of increasing product functionality of component carriers equipped with one or more electronic components and the increasing miniaturization of such components and the increasing number of components to be mounted on component carriers such as printed circuit boards, increasingly powerful array-like components or packages with several components having a plurality of contacts or connections, wherein the spacing between these contacts is increasingly small, are used. Removing the heat generated by such components and the component carriers themselves during operation is becoming an increasingly serious problem. At the same time, component carriers should be mechanically robust and electrically reliable in order to be able to operate even under harsh conditions.

[0003] A disadvantage of laminated component carriers is that they may be susceptible to delamination, warping, and / or other phenomena that may reduce the reliability of the component carrier. Summary of the invention

[0004] A component carrier which is simple to manufacture and has a high reliability may be required.

[0005] According to an exemplary embodiment, a component carrier is provided, which comprises: a first component carrier structure, which comprises a first stack, which comprises at least one first electrically conductive layer structure and at least one first electrically insulating layer structure, wherein the at least one first electrically conductive layer structure has a first contact element, which extends up to a first contact surface of the first stack; and an electrically conductive connecting medium, which is directly connected to the first contact element by filling at least one recess of the first contact element at the first contact surface, the at least one recess comprising a larger-sized cavity defined by a smaller-sized surface contour.

[0006] According to another exemplary embodiment, a method for manufacturing a component carrier is provided, wherein the method comprises: forming a first component carrier structure, the first component carrier structure comprising a first stack, the first stack comprising at least one first electrically conductive layer structure and at least one first electrically insulating layer structure, wherein the at least one first electrically conductive layer structure has a first contact element, the first contact element extending up to a first contact surface of the first stack; and directly connecting the first contact element to an electrically conductive connecting medium by filling at least one recess of the first contact element at the first contact surface with the electrically conductive connecting medium, the at least one recess comprising a larger-sized cavity defined by a smaller-sized surface contour.

[0007] Detailed Description of Exemplary Embodiments

[0008] In the context of the present application, the term "component carrier" may particularly denote any supporting structure on which and / or in which one or more components can be accommodated for providing mechanical support and / or electrical connection. In other words, the component carrier may be configured as a mechanical carrier and / or an electronic carrier for the components. In particular, the component carrier may be one of a printed circuit board, an organic interposer and an IC (integrated circuit) substrate. The component carrier may also be a hybrid board combining different component carriers of the above-mentioned types of component carriers.

[0009] In the context of the present application, the term "component carrier structure" may particularly denote a sheet or plate that is handled and processed during the manufacture of a component carrier, such as a stacked sequence of layers, a panel or an array. A component carrier structure may also be a printed circuit board (PCB) or a sub-stack of a printed circuit board to be created. In particular, a component carrier may be manufactured by interconnecting a plurality of component carrier structures.

[0010] In the context of the present application, the term "stack" may particularly denote a plurality of planar layer structures which are mounted parallel to one another and one above the other. The layer structures of the stack may be connected by lamination, ie by applying heat and / or pressure.

[0011] In the context of the present application, the term "layer structure" may particularly denote a continuous layer, a patterned layer or more non-continuous islands in a common plane.

[0012] In the context of the present application, the term "contact surface" may particularly denote a main surface of a component-carrier structure, and in particular a main surface of at least one contact element of a component-carrier structure, at which the component-carrier structure is to be connected to a corresponding contact surface of a further body, such as another component-carrier structure or a component, and in particular a contact surface of at least one further contact element of the further body.

[0013] In the context of the present application, the term "contact element" may particularly denote a portion of at least one electrically conductive layer structure of a stack of component-carrier structures, which portion is exposed at the surface of the stack and is suitable for establishing an electrically conductive connection with another contact element by means of an electrically conductive connecting medium between it and the other contact element.

[0014] In the context of the present application, the term "recess" may particularly denote any hollow volume, indentation or blind hole at a contact surface portion of an electrically conductive contact element.

[0015] In the context of the present application, the term "a cavity of larger size defined by a surface profile of smaller size" may particularly mean that (i) the cavity has structural dimensions (such as the depth and width of the cavity) that are larger than the structural dimensions of the smaller structures defining the surface profile (such as the width and top-to-bottom distance of the alternating protrusions and recesses of the surface profile). It may also mean that (ii) the structural or spatial confinement of the cavity is defined by the surface profile, so that the wall of the cavity has the surface profile. Although the cavity may primarily define the shape and size of the recess, the surface profile may add a wave structure, oscillations, undulations, significant roughness or unevenness to the boundaries of the cavity, which may be superimposed or modulated onto the cavity. The surface profile may be a regular surface profile with a repeated series of recesses and protrusions with defined widths and heights. Alternatively, the surface profile may be an irregular surface profile with a random or disordered series of recesses and protrusions with different width and height values. In particular, the cavity may be concave in shape. The surface profile may be a series of alternating hillocks and valleys along a curved surface defining the cavity. In particular, the cavity may be a hollow space having a volume or defined by a characteristic dimension that is larger (in particular at least twice, more in particular at least three times) than the hollow volume or characteristic dimension of the structure of the surface profile.

[0016] According to an exemplary embodiment, a component carrier is provided, which includes a stacked component carrier structure having suitable adhesion and reliable electrical connectivity at the connection joint between the component carrier structure and another body (such as another component carrier structure or component). This can be achieved in the following way: an electrically conductive connecting medium such as a metal paste will bridge the hollow space between the electrically conductive contact element of the component carrier structure exposed at the contact surface of the electrically conductive connecting element and the body. Very advantageously, one or both of the opposite contact surfaces of the contact element with the other body can be provided with a recess defined by a hollow (more macroscopic) cavity, which is defined by a significantly uneven (more microscopic) surface contour. During the interconnection of the component carrier structure with the other body, the one or more recesses can be filled with the electrically conductive connecting medium, thereby establishing a reliable electrical coupling and a strong mechanical connection between the component carrier structure and the body. Advantageously, the component carrier can be made significantly more robust against shear forces which tend to promote mutual lateral movements of the interconnected component carrier structure and the further body. Thus, any tendency of delamination of the component carrier's constituent parts can be strongly suppressed. Descriptively speaking, the geometry of the described (one or more) recesses can be represented as strongly roughened dimples which overall increase the connection strength of the component carrier.

[0017] Next, the effects associated with shear forces will be described in more detail based on the example of a lateral via alignment between a component carrier structure and a body embodied as a further component carrier structure (see, for example, Figure 1 and Figure 1A ): It is very advantageous that two opposing vias are perfectly aligned to avoid losing the via-via connection. Shear stress-induced sliding of the two stacks may lead to misalignment of the vias, which may affect the transmission of current and / or signals. This problem may occur in particular during lamination and may describe that the connecting surfaces of the opposing stacks (etc.) slide towards each other. As a result, the vias may generally not be correctly aligned and different layers may lose their interconnection. Due to the provision of a cavity, which may preferably be circular, stress concentrations may be avoided and alignment may be improved.

[0018] Thus, exemplary embodiments of the present invention provide a roughened recess to be filled with an electrically conductive filling medium at a connection joint of a component carrier structure for establishing a reliable and short-path z-interconnection between the component carrier structure and another body. In particular, the creation of a roughened via pad surface may be advantageous and may be established, for example, by etching using a photomask. Advantageously, a highly reliable adhesion may thus be created between the copper pad and the conductive paste. Descriptively speaking, the roughened recess may define a reverse geometry for encapsulating a conductive paste or other type of electrically conductive connection medium.

[0019] In the following, further exemplary embodiments of the component carrier and the method will be explained.

[0020] In an embodiment, the component carrier comprises a further body, wherein the electrically conductive connecting medium directly connects the first contact element with the further body by filling the first contact element at the first contact surface and optionally at least one recess of the further body. Correspondingly, the method may comprise directly connecting the first contact element with the further body by filling the first contact element at the first contact surface and optionally at least one recess of the further body with the electrically conductive connecting medium.

[0021] In an embodiment, the further body is a second component carrier structure comprising a second stack, the second stack comprising at least one second electrically conductive layer structure and at least one second electrically insulating layer structure, wherein the at least one second electrically conductive layer structure has a second contact element, which extends up to the second contact surface of the second stack. The electrically conductive connecting medium can directly connect the first contact element to the second contact element by filling at least one recess of the first contact element at the first contact surface and optionally the second contact element at the second contact surface (e.g., compare Figure 1 and Figure 1A). In the context of the present application, the term "an electrically conductive connecting medium directly connects the contact elements" may particularly mean that only or substantially only the electrically conductive connecting medium (such as a metal paste) fills the space between the opposite contact surface areas of the contact elements. For example, two printed circuit boards (PCBs) can be reliably connected in the described manner without the risk of delamination caused by shear forces.

[0022] In another embodiment, the additional body includes a component (e.g., Fig. 9 ). For example, a heat sink or a chip can be connected as such a component to a component carrier structure such as a PCB. Therefore, a connection between a component and a component carrier structure can also be established in the described manner. With such a configuration, the component can be surface mounted on a component carrier structure or embedded in a component carrier structure.

[0023] In an embodiment, the cavity has a (vertical) depth of at least 10 μm, in particular at least 15 μm. With such a dimension of the cavity, the component carrier can be made robust against shear forces that tend to unintentionally separate the interconnected component carrier structures. For example, the depth of the cavity can be less than 50 μm. The (horizontal) width of the cavity can be at least 20 μm, in particular at least 30 μm. The width can be less than 80 μm.

[0024] In an embodiment, the surface profile has an average top-to-bottom distance of at least 2 μm, in particular at least 4 μm. In particular, the term "average top-to-bottom distance" of the surface profile may denote the average vertical distance between a protrusion and directly adjacent recesses of the surface profile. The top-to-bottom distance may be determined by averaging a plurality of values ​​of said vertical distance along the surface profile of the cavity in a cross-sectional view of the component carrier. In particular, the average value may be determined taking into account at least five pairs (more particularly all) of protrusions and adjacent recesses of the cavity. Descriptively speaking, such a surface profile may establish a significant mechanical interlock between the material of the corresponding contact element and the material of the electrically conductive connecting medium that enters into the micro-troughs of the surface profile.

[0025] In an embodiment, the surface profile has an average top-to-bottom average distance of no more than 15 μm, in particular no more than 10 μm, preferably no more than 8 μm or even no more than 6 μm. Such an upper limit for the hills and valleys of the surface profile ensures that a sufficiently large amount of electrically conductive connecting medium can be present in the recesses for establishing a low-ohmic and mechanically robust connection.

[0026] For example, the surface profile may include respective values ​​of the top-to-bottom distances of adjacent recesses and protrusions of the surface profile in the range from 2 μm to 8 μm, in particular in the range from 4 μm to 6 μm. More specifically, at least 80% of the respective values ​​of the top-to-bottom distances of adjacent recesses and protrusions of the surface profile may be in the range from 2 μm to 8 μm, in particular in the range from 4 μm to 6 μm.

[0027] In an embodiment, the cavity has a generally circular shape. Advantageously, this can lead to suppression of stress concentration, since local concentration of stress at sharp edges can be prevented. The main advantage of the circular shape is that stress can be evenly distributed along the surface of the cavity. In addition, a circular cavity can ensure good interference energy, a sufficiently high contact surface and appropriate geometric stability. Alternatively, the cavity can have a generally rectangular shape, preferably with rounded corners. This can lead to appropriate packaging of the electrically conductive connecting medium and excellent properties in terms of electrical coupling and mechanical connection. Preferably, the rectangular shaped cavity can be deeply anchored in the via.

[0028] Preferably, the shape of the cavity may not have sharp edges. This can suppress stress concentration. Therefore, it is preferred to use rounded surfaces or rounded corners.

[0029] In an embodiment, a first recess is formed in the first contact element and a second recess (aligned with the first element) is formed in the second contact element or component, and wherein both the first recess and the second recess are filled with an electrically conductive connecting medium. When both contact elements are provided with recesses facing each other, a double-sided form closure between the electrically conductive connecting medium and the component carrier structure or component can be achieved. This can strengthen the electrical coupling and mechanical connection between the component carrier structure and can strongly suppress any delamination tendency, even in the case of shear forces. In addition, this can improve the alignment of the opposite contacts to maintain a proper connection. The sliding of vias and other structures caused by shear stress can ensure correct interconnection to avoid stress concentrations.

[0030] In an embodiment, the electrically conductive connecting medium is a viscous deformable medium, such as an electrically conductive paste, in particular a silver paste or a copper paste. More generally, the electrically conductive connecting medium may be a formable or paste-like or freely formable or even semi-flowable material. Metallic pastes, in particular metal pastes comprising metal particles and a solvent (which evaporates when heated) are a good choice for the electrically conductive connecting medium. This enables the electrically conductive connecting medium to reliably (and preferably completely) fill (one or more) recesses including micro-gaps of the surface profile. It is also possible that the electrically conductive connecting medium comprises an electrically conductive polymer.

[0031] In an embodiment, at least one of the first contact element and the second contact element contributes to the electrically conductive vertical through-connection to electrically connect the first component carrier structure with the second component carrier structure in the vertical direction. For example, such an electrically conductive vertical through-connection can be an array of vertically stacked vias in one or both of the connected component carrier structures, the stacked vias being connected to the electrically conductive connecting medium. Thus, a short-path electrical connection can be established between the interconnected component carrier structures. This keeps signal losses small and ensures a compact design of the component carriers.

[0032] In an embodiment, the first contact element and / or the second contact element may be a via, more particularly a via with a tapered sidewall. For example, such a via may be a copper-filled laser via. Thus, the electrically conductive connecting medium may form an electrically conductive bridge between two opposing vias as a preferred embodiment of an interconnection contact element for a component carrier structure.

[0033] In an embodiment, the component carrier includes a dielectric sheet having at least one through hole filled with an electrically conductive connecting medium, the dielectric sheet being arranged between a first component carrier structure and a second component carrier structure or component. Each through hole may correspond to a respective pair of aligned contact elements of a component or component carrier structure to be connected. The dielectric sheet may form a planar electrically insulating substrate for providing an electrically conductive connecting medium where it is needed for forming an electrically conductive z-connection without forming an unintentional electrically conductive path elsewhere.

[0034] In an embodiment, the dielectric sheet comprises or consists of an adhesive material, in particular, the dielectric sheet comprises or consists of a prepreg or a resin. Correspondingly, the method may include: arranging the dielectric sheet to have a curable material, and, when connecting the first component carrier structure to the second component carrier structure so that the dielectric sheet is located between the first component carrier structure and the second component carrier structure, at least partially curing the curable material of the dielectric sheet. When the dielectric material of the sheet is adhesive, the sheet can adhere to a part of the component carrier structure between the contact elements to be connected by the electrically conductive connecting medium. When the uncured resin material of the dielectric sheet (such as is present in the prepreg material before curing) is cured by pressing the component carrier structure and the dielectric sheet located between the component carrier structures together with or without additional heat energy supply, the curing of the resin material can cause a sticky connection between the component carrier structures by lamination. More generally, this curing can be triggered by applying mechanical pressure and / or supplying heat energy.

[0035] In an embodiment, the method comprises: filling the electrically conductive connecting medium into at least one recess when connecting the first component carrier structure with the second component carrier structure or with the component, i.e. when connecting the first component carrier structure with the second component carrier structure or connecting the first component carrier structure with the component. Thus, connecting the component carrier structures to each other by applying mechanical pressure, preferably by laminating with a curable dielectric sheet between the component carrier structures, and moving the preferably paste-like electrically conductive connecting medium into one or more recesses can allow a reliable mechanical and electrical connection between the interconnected component carrier structures to be established. Both the electrical and mechanical connection can be created simultaneously, i.e. in one common process and thus in a fast and simple manner.

[0036] In an embodiment, the method comprises: before connecting the first component carrier structure with the second component carrier structure or connecting the first component carrier structure with the component such that the dielectric sheet (with the electrically conductive connecting medium) is located between the first component carrier structure and the second component carrier structure or between the first component carrier structure and the component, arranging the electrically conductive connecting medium in at least one through hole of the dielectric sheet. Thus, preferably, before clamping the dielectric sheet filled with metal paste between the component carrier structures to be electrically and mechanically connected, the paste-like electrically conductive connecting medium can first be inserted (e.g. dispensed) into the preformed through holes of the dielectric sheet.

[0037] In an embodiment, the method comprises: forming at least one through hole of the dielectric sheet by drilling, in particular by laser drilling. In particular, laser drilling is a simple, reliable and precise way to define the position of one or more through holes in the dielectric sheet aligned with an array of pairs of contact elements to be electrically interconnected by an electrically conductive connecting medium in the one or more through holes. As an alternative to laser drilling, mechanical drilling, punching and etching can also be used to create the through hole(s).

[0038] In an embodiment, the method comprises: filling an electrically conductive connecting medium in the form of a paste (e.g., a copper paste or a silver paste) in at least one through hole of the dielectric sheet. Such a paste-like electrically conductive filling medium may be deformable or formable so as to properly fill substantially the entire (one or more) recesses, including minute gaps constituting the surface contour. As a filling medium, electrically conductive polymers may also be used, because they have viscosity and conductivity.

[0039] In an embodiment, the method includes forming at least one recess by etching at least one of a first contact element at a first contact surface and a second contact element at a second contact surface. Thus, the cavity and the surface profile can be produced by etching. As an alternative to etching, drilling (particularly mechanical drilling or laser drilling) or grinding is also possible. The recess is most preferably formed by etching to achieve a high roughness of the surface, which promotes adhesion between the filling medium and the via surface. However, these recesses can also be produced by drilling (laser and mechanical drilling) and grinding the via surface with a small grinding (and / or drilling) head. Using the latter method, the adhesion between the filling medium and the via surface can be advantageously significant, because a rough surface profile can be obtained using these methods as well. For example, wet etching and / or plasma etching can be performed for this purpose. Isotropic and / or anisotropic etching processes can also be performed. Advantageously, adjusting etching parameters (such as etchants, additives, etching time, conditions such as etching temperature) can allow the shape and size of the surface profile and the cavity to be adjusted. For example, a more aggressive etching strategy may result in deeper recesses and / or steeper sidewalls of the recesses.

[0040] In an embodiment, the method comprises: covering a portion of the first contact surface and / or a portion of the second contact surface with an etching protection structure during etching. The etching protection structure may be a temporary etching protection structure, which may be removed from the corresponding component carrier structure after etching. Descriptively speaking, such an etching protection structure may be a patterned mask (e.g. a photomask) which defines which surface portions of the contact elements of the component carrier structures to be interconnected should be processed by etching and which other surface portions should be protected from etching attacks. In particular, dielectric surface areas of the opposite contact surfaces may be prevented from being etched. However, the corresponding contact elements may also be partially covered with an etching protection structure (e.g. selectively covering their outer annular portions), thereby appropriately defining the size and shape of the recess. As an alternative, a protective structure may be used to protect specific areas from drilling (in particular mechanical drilling or laser drilling) or grinding.

[0041] In an embodiment, the component carrier comprises a stack of at least one electrically insulating layer structure and at least one electrically conductive layer structure. For example, the component carrier may be a laminate of the mentioned (one or more) electrically insulating layer structures and (one or more) electrically conductive layer structures, in particular the laminate being formed by applying mechanical pressure and / or thermal energy. The mentioned stack may provide a plate-shaped component carrier that is able to provide a large mounting surface for further components and yet is very thin and compact. The term "layer structure" may in particular denote a continuous layer, a patterned layer or more non-continuous islands in a common plane.

[0042] In an embodiment, the component carrier is formed as a plate. This facilitates a compact design, wherein the component carrier still provides a large base for mounting components thereon. Furthermore, in particular, as an example of embedded electronic components, bare dies can be conveniently embedded in thin boards such as printed circuit boards due to their small thickness.

[0043] In an embodiment, the component carrier is configured as one of the following: a printed circuit board, a substrate (in particular an IC substrate) and an interposer.

[0044] In the context of the present application, the term "printed circuit board" (PCB) may particularly denote a plate-like component carrier, which is formed by laminating several electrically conductive layer structures with several electrically insulating layer structures, for example, by applying pressure and / or by supplying heat energy. As a preferred material for PCB technology, the electrically conductive layer structure is made of copper, and the electrically insulating layer structure may contain resin and / or glass fiber, so-called prepreg or FR4 material. Through holes passing through the laminate are formed by, for example, laser drilling or mechanical drilling, and through holes are formed as through-hole connections by filling the through holes with electrically conductive materials (particularly copper), so as to form vias. The electrically conductive layer structures can be connected to each other in a desired manner. In addition to being embedded in one or more components in the printed circuit board, the printed circuit board is generally configured to accommodate one or more components on one or both surfaces of the opposite surfaces of the plate-like printed circuit board. The one or more components may be connected to the corresponding main surface by welding. The dielectric portion of the PCB may be composed of a resin with reinforcing fibers (such as glass fibers).

[0045] In the context of the present application, the term "substrate" may particularly refer to a small component carrier. Relative to a PCB, a substrate may be a relatively small component carrier on which one or more components may be mounted, and the component may be used as a connection medium between (one or more) chips and another PCB. For example, a substrate may have approximately the same size as a component (particularly an electronic component) to be mounted on the substrate (for example, in the case of a chip-scale package (CSP)). More specifically, a substrate may be understood as a carrier for electrical connections or electrical networks and a component carrier for lateral and / or vertically arranged connections that are comparable to a printed circuit board (PCB) but have a relatively high density. The lateral connection is, for example, a conductive path, while the vertical connection may be, for example, a drill hole. These lateral connections and / or vertical connections are arranged in the substrate and may be used to provide electrical, thermal and / or mechanical connections between accommodated components or unaccommodated components (such as bare dies) (particularly IC chips) and a printed circuit board or an intermediate printed circuit board. Therefore, the term "substrate" also includes an "IC substrate". The dielectric portion of the substrate may be composed of a resin with reinforcing particles such as reinforcing spheres, particularly glass spheres.

[0046] The substrate or interposer may include or consist of at least one layer of: glass; silicon (Si); or a photoimageable or dry-etchable organic material such as an epoxy-based laminate material (such as an epoxy-based laminate film); or a polymer compound such as a polyimide, polybenzoxazole or benzocyclobutene functionalized polymer.

[0047] In an embodiment, the corresponding at least one electrically insulating layer structure comprises at least one of the following: resin (such as reinforced or non-reinforced resin, for example epoxy resin or bismaleimide-triazine resin), cyanate resin, polyphenylene derivative, glass (especially glass fiber, multilayer glass, glass-like material), prepreg material (such as FR-4 or FR-5), polyimide, polyamide, liquid crystal polymer (LCP), epoxy-based stacked film, polytetrafluoroethylene (PTFE, ), ceramics and metal oxides. Teflon is a registered trademark of The Chemours Company FC LLC of Wilmington, Delaware, USA. Reinforcement structures such as meshes, fibers or spheres made of glass (multilayer glass) may also be used. Although prepregs, especially FR4, are generally preferred for rigid PCBs, other materials may also be used, especially epoxy-based laminated films or photoimageable dielectric materials. For high-frequency applications, high-frequency materials such as polytetrafluoroethylene, liquid crystal polymers and / or cyanate resins, low-temperature co-fired ceramics (LTCC) or other low, very low or ultra-low DK materials may be implemented in the component carrier as an electrical insulating layer structure.

[0048] In an embodiment, the respective at least one electrically conductive layer structure comprises at least one of: copper, aluminum, nickel, silver, gold, palladium and tungsten. Although copper is generally preferred, other materials or coated forms thereof are also possible, in particular materials coated with superconducting materials such as graphene.

[0049] At least one component that can be embedded in the stack can be selected from the following: a non-electrically conductive inlay (such as a ceramic inlay, preferably comprising aluminum nitride or aluminum oxide), an electrically conductive inlay (such as a metal inlay, preferably comprising copper or aluminum), a heat transfer unit (such as a heat pipe), a light-conducting element (such as an optical waveguide or optical conductor connector), an optical element (such as a lens), an electronic component or a combination of the above. For example, the component can be an active electronic component, a passive electronic component, an electronic chip, a storage device (such as a DRAM or other data storage), a filter, an integrated circuit, a signal processing component, a power management component, an optoelectronic interface element, a light-emitting diode, an optocoupler, a voltage converter (such as a DC / DC converter or an AC / DC converter), a cryptographic component, a transmitter and / or a receiver, an electromechanical converter, a sensor, an actuator, a micro-electromechanical system (MEMS), a microprocessor, a capacitor, a resistor, an inductor, a battery, a switch, a camera, an antenna, a logic chip and an energy harvesting unit. However, other components can also be embedded in the component carrier. For example, a magnetic element can be used as a component. Such a magnetic element may be a permanent magnetic element (such as a ferromagnetic element, an antiferromagnetic element, a multiferroic element or a ferrimagnetic element, for example a ferrite core) or may be a paramagnetic element. However, the component may also be, for example, a substrate, an intermediate layer or another component carrier in a plate-in-plate configuration. The component may be surface mounted on the component carrier and / or may be embedded in the interior of the component carrier. In addition, other components may also be used as components.

[0050] In an embodiment, the component carrier is a laminated component carrier. In such an embodiment, the component carrier is a composite of multiple layers stacked and connected together by applying pressure and / or heat.

[0051] After the internal layer structure of the component carrier has been processed, one or both of the opposite main surfaces of the processed layer structure can be symmetrically or asymmetrically covered (in particular by lamination) with one or more further electrically insulating layer structures and / or electrically conductive layer structures. In other words, the lamination can be continued until the desired number of layers is obtained.

[0052] After the formation of the stack of electrically insulating layer structures and electrically conductive layer structures has been completed, the obtained layer structure or component carrier can be subjected to a surface treatment.

[0053] In particular, with regard to surface treatment, an electrically insulating solder resist may be applied to one or both of the opposing main surfaces of a layer stack or component carrier. For example, such a solder resist may be formed over the entire main surface and the layer of solder resist may then be patterned to expose one or more electrically conductive surface portions that will be used to electrically couple the component carrier to an electronic peripheral. Surface portions of the component carrier that remain covered by the solder resist, in particular surface portions containing copper, may be effectively protected from oxidation or corrosion.

[0054] As far as surface treatment is concerned, surface modification can also be selectively applied to the exposed electrically conductive surface portions of the component carrier. Such surface modification can be an electrically conductive covering material on the exposed electrically conductive layer structure (such as a pad, a conductive track, etc., in particular including or consisting of copper) on the surface of the component carrier. If such an exposed electrically conductive layer structure is not protected, the exposed electrically conductive component carrier material (in particular copper) may be oxidized, thereby reducing the reliability of the component carrier. The surface modification portion can then be formed as a joint between, for example, a surface mounted component and a component carrier. The surface modification portion has the function of protecting the exposed electrically conductive layer structure (in particular a copper circuit) and enabling a connection process with one or more components to be achieved, for example, by welding. Examples of suitable materials for the surface modification portion are organic solderability preservatives (OSP), chemical nickel immersion gold (ENIG), gold (in particular hard gold), chemical tin, nickel gold, nickel palladium, chemical nickel immersion palladium immersion gold (ENIPIG), etc.

[0055] The aspects defined above and further aspects of the invention are apparent from the examples of embodiment to be described hereinafter and are explained with reference to these examples of embodiment. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] Figure 1 A cross-sectional view of a structure obtained during the performance of a method for producing a component carrier by connecting a component carrier structure to a further component carrier structure according to an exemplary embodiment is shown.

[0057] Figure 1A Shown according to Figure 1 A cross-sectional view of a larger portion of a component carrier structure of a structure.

[0058] Figure 2 A cross-sectional view of a component carrier according to an exemplary embodiment is shown.

[0059] Figure 3 A sectional view of a component carrier according to a further exemplary embodiment is shown.

[0060] Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8 A cross-sectional view of a structure obtained during performance of a method for producing a component carrier according to an exemplary embodiment is shown.

[0061] Fig. 9 A cross-sectional view of a structure obtained during the performance of a method for producing a component carrier by connecting a component carrier structure with a component according to an exemplary embodiment is shown. DETAILED DESCRIPTION

[0062] The illustrations in the drawings are represented schematically. In different drawings, similar or identical elements are provided with the same reference signs.

[0063] Before describing the exemplary embodiments in more detail with reference to the drawings, some basic considerations based on which the exemplary embodiments of the invention have been developed will be summarized.

[0064] According to an exemplary embodiment of the present invention, at least one electrically conductive contact element at a contact surface of a component carrier structure to be electrically and mechanically connected to another component carrier structure can be configured as a roughened recess, which can be partially or completely filled with a preferably paste-like electrically conductive connecting medium for establishing a reliable z-interconnection between the component carrier structures. As a result, a component carrier such as a printed circuit board (PCB) can be obtained, which has short paths and therefore low-loss and compact vertical electrical connections, while at the same time providing reliable protection against undesired delamination of the interconnected component carrier structures, especially in the case of horizontal shear forces. The described interconnection technology can reduce internal stresses in the component carrier and can convert shear stresses into multi-directional stresses, while at the same time ensuring appropriate electrical performance.

[0065] Descriptively, the prepreg sheet may be laser drilled for forming at least one through hole, which may then be filled with the metal (e.g. copper) paste or the like. One or both of the opposing main surfaces of two or more component carrier structures (such as PCBs or laminated stacks) may be subjected to a selective etching process for defining one or more recesses in the aligned electrically conductive contact elements of the component carrier structures to be connected. Preferably, such respective recesses may be defined by a concave cavity having a surface contour structure of smaller dimensions formed on the walls defining the cavity compared to the dimensions of the cavity. The prepreg sheet having one or more portions filled with the metal paste may then be clamped between the component carrier structures such that the one or more recesses are aligned with the one or more portions of the metal paste, thereby pressing the metal paste into the one or more recesses. The component carrier structures and the dielectric sheet located between the component carrier structures may then be interconnected by lamination, i.e. by mechanical pressure, preferably with elevated temperature. As a result, a component carrier (eg a PCB) having short vertical electrical connections and reliable mechanical integrity may be obtained.

[0066] The main challenges in developing z-interconnects in component carriers are to overcome delamination (i.e., separation in the joint between interconnected component carrier structures or substructures) and slipping vias. In particular, these two defects are believed to occur primarily due to poor surface adhesion between the metal paste and the board-to-via surface, especially when stress levels are high.

[0067] In order to overcome these and / or other problems, exemplary embodiments of the present invention produce rough pits or uneven cavities on (one or more via pads) to be interconnected, thereby ensuring high surface adhesion and high stability of mechanical barriers. For example, the generation of such rough pits can be performed by a photolithography process, by which the entire plate or other component carrier structure is covered by a photoresist, while only one or more z-interconnection pads or other contact elements remain uncovered. Once the photolithography process is completed, the component carrier structure can be subjected to an etching process (or another alternative, such as a bonding process) so that a part of (one or more) contact elements is etched, thereby producing a rough surface profile in the cavity. The preferred result of this process can be a circular rough pit shape or a rectangular or trapezoidal cavity that can properly accommodate a metal paste (or another electrically conductive connection medium) after pressing. For the roughening, any desired etching process can be adopted accordingly. However, other adhesion promoters, such as bonding processes, etc., can also be used. Furthermore, the contact element can be mechanically processed (for example by drilling, in particular mechanical drilling or laser drilling, or by grinding) in order to produce the recess(es).

[0068] For example, embodiments of the present invention are particularly suitable for large-sized component carriers, such as those used in space applications.Exemplary embodiments of the present invention can provide a component carrier that has high reliability and can be manufactured with high yield.

[0069] Figure 1 The following is a diagram showing a process for performing manufacturing of a component carrier 100 ( Figure 2 Cross-sectional view of the structure obtained during the method shown in ). Figure 1A Shown according to Figure 1 104, 112. In other words, Figure 1 It roughly shows Figure 1A 138. More specifically, Figure 1A Two daughter boards, laminated layer stacks or even printed circuit boards (PCBs) are shown to be interconnected for obtaining a highly reliable, high performance vertical electrical coupling without risk of delamination and at the same time a robust mechanical connection in the horizontal plane. Figure 1 Approximately shows Figure 1A Details of portion 138 are shown in FIG.

[0070] As the basis of the manufacturing process, Figure 1 and Figure 1A , a first component carrier structure 104 including a first laminated layer stack 102 is shown. The first laminated layer stack 102 is composed of a plurality of first electrically conductive layer structures 106 and a plurality of first electrically insulating layer structures 108. The first electrically conductive layer structures 106 have a plurality of first contact elements 107, which extend up to a first contact surface 109 of the first stack 102. When a component 130, such as a semiconductor chip, is embedded in the first stack 102, the first component carrier structure 104 has an extended function. However, then, the first component carrier structure 104 with the embedded component 130 may be more susceptible to internal stresses, such as thermal stresses, which may lead to undesirable phenomena, such as delamination and / or warping. However, in particular, as described in further detail below, delamination can be strongly suppressed by the interconnection technology according to exemplary embodiments of the present invention.

[0071] Furthermore, an additional basis for the described manufacturing process is a second component carrier structure 112, which comprises a second laminated layer stack 110, which comprises a plurality of second electrically conductive layer structures 114 and a plurality of second electrically insulating layer structures 116. The second electrically conductive layer structures 114 have second contact elements 115, which extend up to a second contact surface 117 of the second stack 110. In the embodiment shown, each of the contact elements 107, 115 has a copper-filled laser via with a tapered sidewall 132. Later during the manufacturing process, the component carrier structures 104, 112 will be interconnected at their opposite contact surfaces 109, 117. Optionally, further components 130, such as semiconductor chips, can be embedded in the second stack 110, which can lead to the above-mentioned advantages in terms of extended functionality, as well as avoiding or reducing problems in terms of delamination, warping, etc.

[0072] In particular, each of the first component carrier structure 104 on the bottom side and the second component carrier structure 112 on the top side can be implemented as an IC (integrated circuit) substrate or a printed circuit board (PCB). Therefore, the first component carrier structure 104 can be a plate-like laminated layer stack 102, and the second component carrier structure 112 can be another plate-like laminated layer stack 110. For example, the corresponding electrically conductive layer structures 106, 114 can include patterned copper structures and vertical through-connections, such as copper-filled laser vias. The electrically insulating layer structures 108, 116 can include resin (such as epoxy resin) and optional reinforcing particles (such as glass fibers or glass balls) therein. For example, the electrically insulating layer structures 108, 116 can be made of FR4 or ABF.

[0073] like Figure 1A As best seen in the drawings, a planar dielectric sheet 126 can be arranged between the still separated component carrier structures 104, 112. The dielectric sheet 126 can be embodied as, for example, including or consisting of a curable material, such as an uncured epoxy resin. For example, reinforcing particles such as glass fibers can be incorporated into the resin matrix. For example, the dielectric sheet 126 can be an epoxy resin sheet or a prepreg sheet. The described construction of the dielectric sheet 126 makes it possible for the dielectric sheet 126 to become flowable and viscous when mechanically pressed between the component carrier structures 104, 112, preferably accompanied by the supply of thermal energy. Therefore, mechanical pressure and / or increased temperature can trigger the curing of the previously uncured resin material of the dielectric sheet 126, so that the resin is at least partially cured to thereby cause adhesion between the component carrier structures 104, 112.

[0074] like Figure 1AAs shown in , a plurality of through holes can be formed in the dielectric sheet 126. This can be achieved, for example, by drilling, in particular by laser drilling. As a result, a dielectric sheet 126 with perforations can be obtained. After the perforations, still before the first component carrier structure 104 is connected to the second component carrier structure 112 and the dielectric sheet 126 has an electrically conductive connecting medium 118 located between the first component carrier structure 104 and the second component carrier structure 112, the electrically conductive connecting medium 118 can be inserted (for example printed or dispensed) in each of the drilled through holes of the dielectric sheet 126. Preferably, such an electrically conductive connecting medium 118 can be freely formable, highly viscous or even semi-flowable, so that it can be reliably retained inside the through hole without falling out of the through hole. However, the electrically conductive connecting medium 118 can be sufficiently deformable at the same time so that it can be reliably pressed into the contact surfaces 109, 117 formed and in the dielectric sheet 126. Figure 1 Preferably, the electrically conductive connecting medium 118 is an electrically conductive paste, such as a copper paste or a silver paste.

[0075] Reference again Figure 1 , a corresponding recess 120 may be formed in each of the exposed first contact elements 107. Figure 1 As shown in , such a recess 120 comprises a cavity 122 of larger dimensions bounded by a surface profile 124 of smaller dimensions. Correspondingly, a corresponding recess 120' may be formed in each of the exposed second contact elements 115. Furthermore, the recess 120' may comprise a cavity 122 of larger dimensions bounded by a surface profile 124 of smaller dimensions on the walls bounding the cavity 122. The recesses 120, 120' may be formed by etching the contact elements 107, 115, wherein adjustment of etching parameters and conditions allows defining geometrical parameters, shapes and dimensions of the cavity 122 and the surface profile 124. As a result of such a controlled etching process, a via having a rough pit may be obtained, such as Figure 1 as shown in .

[0076] Likewise Figure 1 and Figure 1A As shown in the figure, the component carrier structures 104, 112 and the dielectric sheet 126 with the electrically conductive connecting medium 118 located in the through holes of the dielectric sheet 126 can be positioned relative to each other in such a way that each storage portion of the electrically conductive connecting medium 118 in the dielectric sheet 126 is aligned with two corresponding aligned contact elements 107, 115 of the component carrier structures 104, 112 before the component carrier structures 104, 112 are interconnected and arranged between these two contact elements 107, 115.

[0077] Figure 2 A cross-sectional view of a component carrier 100 according to an exemplary embodiment is shown.

[0078] To obtain Figure 2 In the component carrier 100 shown in FIG. 1 , the first contact element 107 at the first contact surface 109 can be connected to the second contact element 115 at the second contact surface 117 by filling the recesses 120, 120' with an electrically conductive connecting medium 118. This can be achieved by connecting the first component carrier structure 104 to the second component carrier structure 112 and the dielectric sheet 126 having a storage portion of the electrically conductive contact medium 118 of the dielectric sheet located between the first component carrier structure 104 and the second component carrier structure 112. The process can involve mechanically pressing the component carrier structure 104, 112 and the dielectric sheet 126 together. Advantageously, the pressing process can be accompanied by thermal energy. During the pressing process, the deformable viscous paste-like electrically conductive connecting medium 118 can be pressed into the recesses 120, 120'. At the same time, when a pressure connection is established between the first component carrier structure 104 and the second component carrier structure 112 with the dielectric sheet 126 located therebetween, the application of pressure and heat energy will trigger the curing (e.g., by becoming flowable, cross-linking, and resolidifying) of the curable resin material of the dielectric sheet 126. Thus, except for the area where the electrical connection is established through the electrically conductive connecting medium 118, the cured epoxy resin (or another suitable curable material) will mechanically bond the component carrier structures 104, 112.

[0079] As a result of the described manufacturing process, it is possible to obtain Figure 2 Component carrier 100 is partially shown in FIG. The component carrier 100 comprises: a first component carrier structure 104 having a first stack 102 as described above; a second component carrier structure 112 comprising a second stack 110 as described above; and the above-described dielectric sheet 126 having through holes filled with an electrically conductive connecting medium 118 located between the interconnected component carrier structures 104, 112.

[0080] More specifically, each of the islands of the electrically conductive connecting medium 118 directly connects a corresponding first contact element of the first contact elements 107 at the first contact surface 109 with a corresponding second contact element of the second contact elements 115 at the second contact surface 117 by filling a designated recess 120, 120' of the first contact element 107 and the second contact element 115. As described above, each of the recesses 120, 120' includes a larger-sized cavity 122 bounded by a smaller-sized surface contour 124.

[0081] exist Figure 2In an embodiment, the cavity 122 has a circular shape, such as a substantially annular shape. Advantageously, this can result in favorable interference energy, a sufficiently large contact surface, and appropriate geometric stability.

[0082] The direct electrically conductive path established by the island of electrically conductive connecting medium 118 located between the respective first contact element 107, the respective second contact element 115 and the first contact element 118 helps the electrically conductive vertical through-connection to connect the first component carrier 104 with the second component carrier structure 112 vertically with a short path. This keeps the losses of the electrical signals propagating along the path small and allows the component carrier 100 to be manufactured with less space consumption. Even in the presence of high internal stresses (e.g. caused by uneven thermal expansion within the component carrier 100, taking into account the different thermal expansion coefficients of the semiconductor material of the embedded component 130 and the copper and resin materials of the stack 102, 110), the component carrier 100 shown does not show a significant tendency to delamination or warping. Moreover, taking into account the shape closure between the electrically conductive connecting medium 118 and the stack 102, 110 due to the said geometry of the recesses 120, 120', shear forces acting in the horizontal direction (in Figure 2 150 ) is inhibited or even prevented from delaminating the component carrier 100 .

[0083] Figure 3 A sectional view of a component carrier 100 according to a further exemplary embodiment is shown.

[0084] according to Figure 3 , the cavity 122 has a substantially rectangular shape, resulting in a suitable encapsulation of the electrically conductive connecting medium 118. With this shape, a suitable geometric stability and a high contact surface can be achieved.

[0085] Still reference Figure 3 , each of the cavities 122 may have a depth D of, for example, 15 μm and a width L of, for example, 30 μm. This may result in a significant shape closure between the electrically conductive connecting medium 118 located in the cavity 122 and the stack 104, 110, which may significantly suppress undesired delamination, even in the event of shear forces 150. In addition, the surface profile 124 has an average top-to-bottom distance d of, for example, 5 μm. To determine the average top-to-bottom distance, the vertical distance between a protrusion of the surface profile 124 and an adjacent recess should be determined for a distance along the surface profile 124 according to Figure 3The extension of the cavity 122 in the cross section of the component carrier 100 is averaged over at least five, in particular all, protrusions and directly adjacent recesses constituting the surface profile 124. Thus, the mechanical interlock between the material of the contact elements 107, 115 forming the protrusions delimiting the surface profile 124 of the recesses 120, 120' and the metal paste-filled recesses of the surface profile 124 can provide additional protection against delamination. The synergistic combination of the advantageous effects of the large dimensions of the cavity 122 and the small dimensions of the surface profile 124 can lead to a significant increase in the strength of the connection.

[0086] Figures 4 to 8 A cross-sectional view of a structure obtained during performance of a method for manufacturing a component carrier 100 according to an exemplary embodiment is shown.

[0087] Reference Figure 4 , showing the reference before forming the recess 120 Figure 1 and Figure 1A The first stack 102 of the first component carrier structure 104 is described in detail. Figure 4 , the upper main surface of the first stack 102 is covered by a layer of photoresist as an etch protection structure 134. Thereafter, the photoresist can be patterned, for example, by photolithography and etching. As a result, only a portion of the first contact surface 109 (and a portion of the second contact surface 117) remains covered with the etch protection structure 134, which is embodied as a patterned photoresist layer.

[0088] refer to Figure 5 The circular recess 120 is formed in the exposed window of the etch protection structure 134 by etching the exposed surface portion of the first contact element 107 at the first contact surface 109 .

[0089] To obtain Figure 6 , the etch protection structure 134 is removed from the first stack 102 after etching, such as by stripping or another etching process.

[0090] Figure 7 and Figure 8 The structure shown in Figures 4 to 6 The structure shown in FIG. 1 is manufactured in a manner corresponding to that shown in FIG. 1 , wherein the difference is that according to Figure 7 and Figure 8 A rectangular (rather than circular) recess 120 is formed. Figure 6 The circular concave portion 120 and the Figure 8 Different geometric shapes of the rectangular recess 120 are produced by different etching parameters. Figures 4 to 6 Compared with the etching process, Figure 7 and Figure 8The etching process is more aggressive and exhibits another level of anisotropy. For example, wet etching and / or plasma etching can be used alone or in combination. Etching agent composition, etchant additives and / or etching time are examples of parameters that can be modified to adjust the characteristics of cavity 122 and surface profile 124.

[0091] Fig. 9 1 shows a cross-sectional view of a structure obtained during the execution of a method for manufacturing a component carrier 100 by connecting a component carrier structure 104 with a component 140 according to an exemplary embodiment. In general, Fig. 9 The implementation method and Figure 1 The embodiment of 104 differs in that a component 140 with a recess is connected to the first component carrier structure 104 instead of the second component carrier structure 112. The component 140 may be a heat sink or a semiconductor chip, for example.

[0092] It should be pointed out that the term "comprising" does not exclude other elements or steps and the article "a" or "an" does not exclude a plurality. Furthermore, elements described in association with different embodiments may be combined.

[0093] The embodiments of the invention are not limited to the preferred embodiments shown in the figures and described above. On the contrary, a number of variants using the solutions shown and according to the principles of the invention are possible, even in the case of fundamentally different embodiments.

Claims

1. A component carrier (100), the component carrier (100) comprising: a first component carrier structure (104), the first component carrier structure (104) comprising a laminated first stack (102), the first laminated stack (102) comprising at least one first electrically conductive layer structure and at least one first electrically insulating layer structure, wherein the at least one first electrically conductive layer structure has a first contact element (107), the first contact element extending up to a first contact surface (109) of the first laminated stack (102); and an electrically conductive connecting medium (118) filled into the through hole (128) of the dielectric sheet (126), the electrically conductive connecting medium being directly connected to the first contact element (107) by filling at least one recess (120) of the first contact element (107) at the first contact surface (109), the at least one recess (120) comprising a cavity of larger size defined by a surface contour of smaller size; and a second component carrier structure (112), the second component carrier structure (112) comprising a second stack (110), the second stack (110) comprising at least one second electrically conductive layer structure (114) and at least one second electrically insulating layer structure (116), wherein the at least one second electrically conductive layer structure (114) has a second contact element (115), the second contact element (115) extending as far as a second contact surface (117) of the second stack (110); wherein the electrically conductive connecting medium (118) in the through hole of the dielectric sheet (126) connects the first contact element (107) at the first contact surface (109) to the second contact element (115) at the second contact surface (117) of the second stack (110), wherein the at least one recess (120) of the first contact element (107) is aligned with the at least one recess (120') of the second contact element (115), Wherein, the electrically conductive connecting medium (108) comprises an electrically conductive paste.

2. The component carrier according to claim 1, in, The electrically conductive connecting medium directly connects the first contact element with the second contact element by filling at least one recess of the first contact element at the first contact surface and of the second contact element at the second contact surface.

3. The component carrier according to claim 1, further comprising: part; The electrically conductive connecting medium directly connects the first contact element to the component by filling the first contact element at the first contact surface and at least one recess of the component.

4. The component carrier according to claim 1, comprising at least one of the following features: in, The cavity has a depth of at least 10 μm; wherein the cavity has a width of at least 20 μm; wherein the surface profile has an average top to bottom distance of at least 2 μm; Wherein the surface profile has an average top to bottom distance of no more than 15 μm.

5. The component carrier according to claim 1, comprising at least one of the following features: in, The cavity has a depth of at least 15 μm; wherein the cavity has a width of at least 30 μm; wherein the surface profile has an average top to bottom distance of at least 4 μm; Wherein the surface profile has an average top to bottom distance of no more than 10 μm.

6. The component carrier according to claim 1, comprising at least one of the following features: in, The cavity has a circular shape; wherein the cavity has a rectangular shape; Wherein, the cavity does not have sharp edges.

7. The component carrier according to claim 1, wherein: The cavity has at least one of an annular shape, an elliptical shape, and a cylindrical shape.

8. The component carrier according to claim 6, wherein: The rectangular shape has rounded corners.

9. The component carrier according to claim 3, wherein: A first recess is formed in the first contact element and a second recess is formed in the second contact element or the component, and wherein both the first recess and the second recess are filled with the electrically conductive connecting medium.

10. The component carrier according to claim 1, wherein: The electrically conductive connection medium includes a viscous deformable medium.

11. The component carrier according to claim 1, wherein: The electrically conductive connection medium includes silver paste or copper paste.

12. The component carrier according to claim 1, wherein: The electrically conductive connecting medium comprises an electrically conductive polymer.

13. The component carrier according to claim 2, wherein: At least one of the first contact element and the second contact element contributes to an electrically conductive vertical through-connection electrically connecting the first component carrier structure with the second component carrier structure in a vertical direction.

14. The component carrier according to claim 1, wherein: At least one of the first contact element and the second contact element includes or consists of a via.

15. The component carrier according to claim 1, wherein: At least one of the first contact element and the second contact element includes or consists of a via having tapered sidewalls.

16. The component carrier according to claim 3, wherein: The dielectric sheet has at least one through-hole which is filled with the electrically conductive connecting medium, the dielectric sheet being arranged between the first component carrier structure and the second component carrier structure or the component.

17. The component carrier according to claim 16, wherein: The dielectric sheet includes or consists of an adhesive material.

18. The component carrier according to claim 16, wherein: The dielectric sheet includes or consists of a prepreg or a resin.

19. A method of manufacturing a component carrier, the method comprising: forming a first component carrier structure, the first component carrier structure comprising a first stack, the first stack comprising at least one first electrically conductive layer structure and at least one first electrically insulating layer structure, wherein the at least one first electrically conductive layer structure has a first contact element, which extends up to a first contact surface of the first stack; and directly connecting the first contact element to the electrically conductive connecting medium by filling at least one recess of the first contact element at the first contact surface with the electrically conductive connecting medium, the at least one recess comprising a cavity of larger size defined by a surface contour of smaller size, forming a second component carrier structure (112), the second component carrier structure (112) comprising a second stack (110), the second stack (110) comprising at least one second electrically conductive layer structure (114) and at least one second electrically insulating layer structure (116), wherein the at least one second electrically conductive layer structure (114) has a second contact element (115), the second contact element (115) extending as far as a second contact surface (117) of the second stack (110); The electrically conductive connecting medium is filled into the through hole (128) of the dielectric sheet (126), the electrically conductive connecting medium (118) in the through hole of the dielectric sheet (126) connects the first contact element (107) at the first contact surface (109) with the second contact element (115) at the second contact surface (117) of the second stack (110), wherein the at least one recess (120) of the first contact element (107) is aligned with the at least one recess (120′) of the second contact element (115), and the electrically conductive connecting medium (108) comprises an electrically conductive paste.

20. The method according to claim 19, further comprising: The first contact element and the second contact element are directly connected by filling at least one recess of the first contact element at the first contact surface and of the second contact element at the second contact surface with the electrically conductive connecting medium.

21. The method according to claim 20, further comprising: Provide parts; as well as The first contact element is directly connected to the component by filling the first contact element at the first contact surface and at least one recess of the component with the electrically conductive connecting medium.

22. The method according to claim 21, wherein: The method comprises filling the at least one recess with the electrically conductive connecting medium when connecting the first component carrier structure to the second component carrier structure or when connecting the first component carrier structure to the component.

23. The method according to claim 21, wherein: The method comprises: arranging the electrically conductive connecting medium in at least one through hole of a dielectric sheet and subsequently connecting the first component carrier structure to the second component carrier structure or connecting the first component carrier structure to the component so that: the dielectric sheet is located between the first component carrier structure and the second component carrier structure or between the first component carrier structure and the component.

24. The method of claim 23, comprising at least one of the following features: in, The method comprises: providing the dielectric sheet with a curable material and, when connecting the first component carrier structure to the second component carrier structure or connecting the first component carrier structure to the component so that the dielectric sheet is located between the first component carrier structure and the second component carrier structure or between the first component carrier structure and the component, at least partially curing the curable material of the dielectric sheet; Wherein, the method comprises: forming the at least one through hole of the dielectric sheet by one of the group consisting of drilling, punching, and etching; The method comprises: filling the electrically conductive connecting medium into the at least one through hole of the dielectric sheet.

25. The method according to claim 24, in, The drilling is laser drilling or mechanical drilling.

26. The method of claim 19, wherein: The method includes forming the at least one recess by etching, drilling, or grinding at least one of the first contact element at the first contact surface and the second contact element at the second contact surface.

27. The method according to claim 26, wherein: The drilling is mechanical drilling or laser drilling.

28. The method according to claim 26, wherein: The method includes covering at least one of a portion of the first contact surface and a portion of the second contact surface with a protective structure during etching, drilling, or grinding.

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