Galvanic coupling judgment method, galvanic coupling judgment system, electronic device, and storage medium

Abstract

The application discloses a mixed plating judgment method, a mixed plating judgment system, an electronic device and a storage medium. The mixed plating judgment method comprises the following steps: obtaining a first characteristic value according to a first graphic parameter of a first PCB; obtaining a second characteristic value according to a second graphic parameter of a second PCB; wherein the board surface pattern of the second PCB is different from the board surface pattern of the first PCB; calculating a first mixed plating maximum copper thickness according to the first characteristic value, and calculating a second mixed plating maximum copper thickness according to the second characteristic value; if the first mixed plating maximum copper thickness and the second mixed plating maximum copper thickness are both not greater than a preset maximum copper thickness, it is determined that the first PCB and the second PCB are normally mixed plated. The embodiment of the application can quantitatively judge the mixed plating of multiple PCBs, thereby avoiding the risk of errors in manual judgment to a certain extent.

Description

Technical Field

[0001] This invention relates to the field of PCB mixed plating technology, and in particular to a mixed plating judgment method, a mixed plating judgment system, an electronic device, and a storage medium. Background Technology

[0002] Currently, in order to improve production efficiency, PCBs with different surface patterns are mixed-plating processes during PCB manufacturing.

[0003] In related technologies, it is necessary to rely on human experience to determine whether PCBs with different surface patterns can be mixed-plated. Therefore, there is a certain risk of judgment error, which can affect the quality of the finished PCB. Summary of the Invention

[0004] This invention aims to at least solve one of the technical problems existing in the prior art. To this end, this invention proposes a mixed plating judgment method, a mixed plating judgment system, an electronic device, and a storage medium, which can quantify the mixed plating judgment of multiple PCBs, thereby avoiding the risk of errors that may occur during manual judgment to a certain extent.

[0005] According to a first aspect of the present invention, a method for determining mixed plating includes: obtaining a first feature value based on a first pattern parameter of a first PCB; obtaining a second feature value based on a second pattern parameter of a second PCB; wherein the board surface pattern of the second PCB is different from that of the first PCB; calculating a first maximum copper thickness for mixed plating based on the first feature value; calculating a second maximum copper thickness for mixed plating based on the second feature value; and determining that the mixed plating of the first PCB and the second PCB is normal if both the first maximum copper thickness for mixed plating and the second maximum copper thickness for mixed plating are not greater than a preset maximum copper thickness.

[0006] The mixed plating determination method according to embodiments of the present invention has at least the following beneficial effects: by comparing the first maximum copper thickness for mixed plating calculated based on a first characteristic value and the second maximum copper thickness for mixed plating calculated based on a second characteristic value with a preset maximum copper thickness, when both the first maximum copper thickness and the second maximum copper thickness are not greater than the preset maximum copper thickness, it is determined that the first PCB and the second PCB can be mixed-plated. Therefore, the mixed plating determination method provided in this application embodiment realizes a quantitative judgment of the feasibility of mixed plating of multiple PCBs, thereby avoiding the judgment error risk that occurs during manual judgment to a certain extent, and thus ensuring the finished product quality of each PCB during mixed plating.

[0007] According to some embodiments of the present invention, the first graphic parameter includes at least one of a first residual copper ratio, a first graphic spacing, and a first graphic distribution rate; the second graphic parameter includes at least one of a second residual copper ratio, a second graphic spacing, and a second graphic distribution rate.

[0008] According to some embodiments of the present invention, calculating a first maximum copper thickness for mixed plating based on the first characteristic value and calculating a second maximum copper thickness for mixed plating based on the second characteristic value includes: obtaining current density and plating time; calculating the first maximum copper thickness for mixed plating based on the first characteristic value, the current density and the plating time; and calculating the second maximum copper thickness for mixed plating based on the second characteristic value, the current density and the plating time.

[0009] According to some embodiments of the present invention, the method further includes: if either the first maximum copper thickness or the second maximum copper thickness is greater than the preset maximum copper thickness, the first PCB and the second PCB are determined to be abnormally mixed-plated.

[0010] According to a second aspect of the present invention, a mixed plating judgment system includes: a feature value calculation module, configured to obtain a first feature value based on a first pattern parameter of a first PCB, and a second feature value based on a second pattern parameter of a second PCB; wherein the board surface pattern of the second PCB is different from that of the first PCB; a mixed plating copper thickness calculation module, configured to calculate a first maximum mixed plating copper thickness based on the first feature value, and a second maximum mixed plating copper thickness based on the second feature value; and a judgment module, configured to determine that the mixed plating of the first PCB and the second PCB is normal when both the first maximum mixed plating copper thickness and the second maximum mixed plating copper thickness are not greater than a preset maximum copper thickness.

[0011] According to some embodiments of the present invention, the mixed-plating copper thickness calculation module includes: a parameter acquisition unit for acquiring current density and plating time; and a sub-calculation unit for calculating the first maximum mixed-plating copper thickness based on the first feature value, the current density and the plating time, and calculating the second maximum mixed-plating copper thickness based on the second feature value, the current density and the plating time.

[0012] According to some embodiments of the present invention, the determination module is further configured to determine that the first PCB and the second PCB have an abnormal mixed plating when either the first maximum copper thickness or the second maximum copper thickness is greater than the preset maximum copper thickness.

[0013] An electronic device according to a third aspect of the present invention includes: at least one processor; at least one memory for storing at least one program; and when the at least one program is executed by the at least one processor, the at least one processor implements the mixed plating determination method as described in any of the first aspects.

[0014] A computer-readable storage medium according to a fourth aspect of the present invention stores processor-executable instructions, wherein the processor-executable instructions, when executed by a processor, are used to implement the mixed plating determination method as described in the first aspect.

[0015] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0016] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0017] Figure 1 This is a flowchart illustrating a method for determining mixed plating according to an embodiment of the present invention;

[0018] Figure 2 This is another flowchart illustrating the mixed plating determination method according to an embodiment of the present invention;

[0019] Figure 3 This is a block diagram of a module of the mixed plating judgment system according to an embodiment of the present invention. Detailed Implementation

[0020] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0021] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0022] In the description of this invention, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0023] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0024] In the description of this invention, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0025] Reference Figure 1 This application provides a method for determining mixed plating. The method includes the following steps:

[0026] S110. Obtain the first feature value based on the first graphic parameters of the first PCB;

[0027] S120. Obtain the second feature value based on the second graphic parameters of the second PCB;

[0028] S130. Calculate the first maximum copper thickness of mixed plating based on the first characteristic value, and calculate the second maximum copper thickness of mixed plating based on the second characteristic value.

[0029] S140. If the maximum copper thickness of the first mixed plating and the maximum copper thickness of the second mixed plating are both not greater than the preset maximum copper thickness, it is determined that the mixed plating of the first PCB and the second PCB is normal.

[0030] Specifically, the first PCB and the second PCB are two PCBs with different surface patterns. Each PCB includes patterned and non-patterned areas, with the surface pattern referring to the circuits, pads, etc., within the patterned area. Therefore, different surface patterns indicate different circuit layouts and pad layouts in the patterned areas of the first and second PCBs. First pattern parameters of the first PCB and second pattern parameters of the second PCB are obtained. The first pattern parameters represent parameters related to the circuit and pad layouts of the first PCB, and the second pattern parameters represent parameters related to the circuit and pad layouts of the second PCB. A first characteristic value that uniformly represents the corresponding parameters is calculated based on the first pattern parameters, and a second characteristic value that uniformly represents the corresponding parameters is calculated based on the second pattern parameters. Then, the first maximum copper thickness for mixed plating on the first PCB surface is calculated based on the first characteristic value; the second maximum copper thickness for mixed plating on the second PCB surface is calculated based on the second characteristic value. The maximum allowable copper thickness (i.e., the preset maximum copper thickness) for mixed plating is set according to the process capability, which is determined by the preparation range of the electroplating equipment, the electrolyte, the electroplating stencil, and etching requirements. The first and second maximum copper thicknesses are compared with the preset maximum copper thickness. When both the first and second maximum copper thicknesses are not greater than the preset maximum copper thickness, it indicates that the process capability can simultaneously meet the copper thickness requirements of the first PCB and the second PCB. Therefore, the first PCB and the second PCB can undergo mixed plating. It is understood that although the above embodiments use two PCBs as examples, the embodiments of this application do not impose specific limitations on the number of PCBs to be mixed-plated.

[0031] The mixed plating determination method provided in this application compares the first maximum copper thickness calculated based on a first characteristic value and the second maximum copper thickness calculated based on a second characteristic value with a preset maximum copper thickness. When both the first and second maximum copper thicknesses are not greater than the preset maximum copper thickness, it is determined that the first PCB and the second PCB can be mixed-plated. Therefore, the mixed plating determination method provided in this application achieves a quantitative judgment of the feasibility of mixed plating multiple PCBs, thereby avoiding the risk of judgment errors that occur during manual judgment to a certain extent, and thus ensuring the finished product quality of each PCB during mixed plating.

[0032] In some embodiments, the first pattern parameter includes at least one of a first residual copper ratio, a first pattern spacing, and a first pattern distribution rate; the second pattern parameter includes at least one of a second residual copper ratio, a second pattern spacing, and a second pattern distribution rate. Specifically, the residual copper ratio (including the first residual copper ratio and the second residual copper ratio) represents the ratio of the copper-clad area of ​​the PCB board surface to the total surface area of ​​the board; the pattern spacing (including the first pattern spacing and the second pattern spacing) represents the spacing between adjacent traces in the PCB; the pattern distribution rate (including the first pattern distribution rate and the second pattern distribution rate) represents the density of the traces in the PCB, i.e., whether the traces are sparsely or densely distributed. It can be understood that the minimum pattern spacing can be selected to calculate the feature value, i.e., the feature value is calculated based on the minimum spacing between adjacent traces in the PCB.

[0033] The feature values ​​(including the first feature value and the second feature value) can be accurately calculated based on the above graphic parameters (including the first graphic parameters and the second graphic parameters); alternatively, different intervals can be set, with each interval corresponding to a feature value, i.e., the feature value is determined based on the interval into which the graphic parameters fall.

[0034] Reference Figure 2 Step S130 includes the following sub-steps:

[0035] S210, Obtain current density and electroplating time;

[0036] S220. The first maximum copper thickness of mixed plating is calculated based on the first characteristic value, current density and plating time.

[0037] S230. The second maximum copper thickness of mixed plating is calculated based on the second characteristic value, current density and plating time.

[0038] Specifically, the production parameters for mixed plating, including current density and plating time, are obtained, and the first maximum copper thickness for mixed plating is calculated according to the following formula (1), and the second maximum copper thickness for mixed plating is calculated according to the following formula (2):

[0039] The maximum copper thickness of the first mixed plating is equal to (current density * plating time / 42) * first characteristic value... Equation (1)

[0040] The second maximum copper thickness in mixed plating = (current density * plating time / 42) * second characteristic value ... Equation (2)

[0041] Wherein, "current density * plating time / 42" is the film thickness calculated according to Faraday's law. Therefore, this film thickness is multiplied by the first characteristic value and the second characteristic value respectively to obtain the first maximum copper thickness of the first PCB and the second maximum copper thickness of the second PCB under the same current density and plating time. When both the first maximum copper thickness and the second maximum copper thickness are not greater than the preset maximum copper thickness, it indicates that the process capability can meet the copper thickness requirements of each PCB, so the first PCB and the second PCB can be mixed-plated. When either the first maximum copper thickness or the second maximum copper thickness is greater than the preset maximum copper thickness, it indicates that the process capability cannot meet the copper thickness requirements of the corresponding PCB. Therefore, in order to ensure the finished quality of the PCB and not affect subsequent processes, it is determined that the first PCB and the second PCB cannot be mixed-plated.

[0042] For example, taking three PCBs A, B, and C as an example, the mixed plating judgment method provided in the embodiments of this application is used to determine whether A and B, and A and C, can be mixed plating. Here, it is assumed that the characteristic value of A is 1.6, the characteristic value of B is 1.2, the characteristic value of C is 2.0, the current density is 10 ASF, the plating time is 80 min, and the preset maximum copper thickness is 35 μm.

[0043] Therefore, according to equation (1) or equation (2), the following can be calculated:

[0044] The maximum copper thickness of plating A is 10*80 / 42*1.6 = 30.47μm.

[0045] The maximum copper thickness of plating B is 10*80 / 42*1.2 = 22.85μm.

[0046] The maximum copper thickness for C plating is 10*80 / 42*2.0 = 38.09 μm.

[0047] Therefore, when A and B are combined, the maximum copper thickness of both A and B is less than the preset maximum copper thickness, indicating that A and B can be mixed-plated. When A and C are combined, the maximum copper thickness of C is greater than the preset maximum copper thickness, meaning the process capability cannot meet the copper thickness requirement of C, therefore A and C cannot be mixed-plated. It can be understood that when A and B are combined, the characteristic value of A is equivalent to the first characteristic value, the characteristic value of B is equivalent to the second characteristic value, the maximum copper thickness of A is equivalent to the first maximum copper thickness, and the maximum copper thickness of B is equivalent to the second maximum copper thickness. When A and C are combined, the characteristic value of A is equivalent to the first characteristic value, the characteristic value of C is equivalent to the second characteristic value, the maximum copper thickness of A is equivalent to the first maximum copper thickness, and the maximum copper thickness of C is equivalent to the second maximum copper thickness.

[0048] Reference Figure 3This application also provides a mixed plating judgment system. The mixed plating judgment system includes a feature value calculation module 100, a mixed plating copper thickness calculation module 200, and a judgment module 300. The feature value calculation module 100 is used to obtain a first feature value based on a first graphic parameter of a first PCB, and a second feature value based on a second graphic parameter of a second PCB. The mixed plating copper thickness calculation module 200 is used to calculate a first maximum mixed plating copper thickness based on the first feature value, and a second maximum mixed plating copper thickness based on the second feature value. The judgment module 300 is used to determine that the mixed plating of the first PCB and the second PCB is normal when both the first maximum mixed plating copper thickness and the second maximum mixed plating copper thickness are not greater than a preset maximum copper thickness; and to determine that the mixed plating of the first PCB and the second PCB is abnormal when either the first maximum mixed plating copper thickness or the second maximum copper thickness is greater than the preset maximum copper thickness.

[0049] The mixed-plating copper thickness calculation module 200 includes a parameter acquisition unit 210 and a sub-calculation unit 220. The parameter acquisition unit 210 is used to acquire the current density and plating time. The sub-calculation unit 220 is used to calculate the first maximum mixed-plating copper thickness based on the first characteristic value, current density, and plating time, and to calculate the second maximum mixed-plating copper thickness based on the second characteristic value, current density, and plating time.

[0050] It is evident that the content of the above mixed plating judgment method embodiments is applicable to the embodiments of this mixed plating judgment system. The specific functions implemented by the embodiments of this mixed plating judgment system are the same as those of the above mixed plating judgment method embodiments, and the beneficial effects achieved are also the same as those achieved by the above mixed plating judgment method embodiments.

[0051] This application also provides an electronic device, comprising: at least one processor and a memory communicatively connected to the at least one processor. The memory stores instructions that are executed by the at least one processor to cause the at least one processor to implement the mixed plating determination method as described in any of the above embodiments when executing the instructions.

[0052] This application provides a computer-readable storage medium storing computer-executable instructions, which are used to execute the mixed plating determination method described in any of the above embodiments.

[0053] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0054] It will be understood by those skilled in the art that all or some of the steps and systems in the methods disclosed above can be implemented as software, firmware, hardware, and suitable combinations thereof. Some or all of the physical components can be implemented as software executed by a processor, such as a central processing unit, digital signal processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application-specific integrated circuit. Such software can be distributed on a computer-readable medium, which can include computer storage media (or non-transitory media) and communication media (or transient media). As is known to those skilled in the art, the term computer storage media includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information (such as computer-readable instructions, data structures, program modules, or other data). Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technologies, CD-ROM, digital versatile disc (DVD) or other optical disc storage, magnetic cartridges, magnetic tape, disk storage or other magnetic storage devices, or any other medium that can be used to store desired information and is accessible to a computer. Furthermore, as is known to those skilled in the art, communication media typically contain computer-readable instructions, data structures, program modules, or other data in modulated data signals such as carrier waves or other transmission mechanisms, and may include any information delivery medium.

[0055] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments, and various changes can be made within the scope of knowledge possessed by those skilled in the art without departing from the spirit of the present invention. Furthermore, the embodiments of the present invention and the features thereof can be combined with each other unless otherwise specified.

Claims

1. A method for determining mixed plating, characterized in that, include: A first feature value is obtained based on the first pattern parameters of the first PCB; wherein, the first pattern parameters include at least one of the first residual copper ratio, the first pattern spacing, and the first pattern distribution rate; The second feature value is obtained based on the second pattern parameters of the second PCB; wherein the board pattern of the second PCB is different from the board pattern of the first PCB; the second pattern parameters include at least one of the second residual copper ratio, the second pattern spacing, and the second pattern distribution rate; Obtain current density and electroplating time; The first maximum copper thickness for mixed plating is calculated based on the first characteristic value, the current density, and the plating time. The second maximum copper thickness for mixed plating is calculated based on the second characteristic value, the current density, and the plating time. If both the first maximum copper thickness and the second maximum copper thickness are not greater than the preset maximum copper thickness, it is determined that the first PCB and the second PCB are properly mixed-plated.

2. The method for determining mixed plating according to claim 1, characterized in that, Also includes: If either the first maximum copper thickness or the second maximum copper thickness is greater than the preset maximum copper thickness, the first PCB and the second PCB are determined to have an abnormal copper plating.

3. A mixed plating judgment system, characterized in that, include: The feature value calculation module is used to obtain a first feature value based on the first graphic parameters of the first PCB and a second feature value based on the second graphic parameters of the second PCB; wherein the board surface pattern of the second PCB is different from that of the first PCB, the first graphic parameters include at least one of a first residual copper ratio, a first graphic spacing, and a first graphic distribution rate, and the second graphic parameters include at least one of a second residual copper ratio, a second graphic spacing, and a second graphic distribution rate. The parameter acquisition unit is used to acquire current density and electroplating time; The sub-calculation unit is used to calculate the first maximum copper thickness of mixed plating based on the first feature value, the current density and the plating time, and to calculate the second maximum copper thickness of mixed plating based on the second feature value, the current density and the plating time. The judgment module is used to determine that the plating of the first PCB and the second PCB is normal when both the first maximum copper thickness and the second maximum copper thickness are not greater than the preset maximum copper thickness.

4. The mixed plating judgment system according to claim 3, characterized in that, The judgment module is also used to determine that the first PCB and the second PCB have an abnormal mixed plating when either the first maximum copper thickness or the second maximum copper thickness is greater than the preset maximum copper thickness.

5. An electronic device, characterized in that, include: At least one processor; At least one memory for storing at least one program; When the at least one program is executed by the at least one processor, the at least one processor implements the mixed plating determination method as described in any one of claims 1 to 2.

6. A computer-readable storage medium storing processor-executable instructions, characterized in that, The processor-executable instructions, when executed by the processor, are used to implement the mixed plating determination method as described in any one of claims 1 to 2.

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