Electronic components

Abstract

The present disclosure provides an electronic component. The electronic component includes: a capacitor component including a body and an external electrode disposed outside the body; a metal frame connected to the external electrode; and an encapsulant covering at least a portion of the capacitor component and at least a portion of the metal frame. The metal frame may include a surface concavo-convex portion disposed on at least a portion of an interface in contact with the encapsulant.

Description

[0001] This application claims the benefit of Korean Patent Application No. 10-2020-0117053 filed on September 11, 2020, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference. Technical Field

[0002] The present disclosure relates to an electronic assembly. Background Art

[0003] Multilayer electronic components are used in various electronic devices due to their miniaturization and high capacity. In recent years, due to the rapid rise of environmentally friendly vehicles and electric vehicles, electric drive systems in vehicles are increasing, and therefore, the demand for multilayer electronic components required for vehicles (such as multilayer capacitors) is increasing.

[0004] In order to be used as a component of a vehicle, a high level of heat resistance or electrical reliability is required, and thus the performance required of multilayer electronic components is gradually increasing. As a result, there is an increasing demand for multilayer electronic components that achieve high capacity in a limited space or have excellent durability against vibration and deformation.

[0005] In addition, in conventional multilayer capacitors, when mounting a substrate, since the ceramic body may be in direct contact with the substrate through solder bumps, it may be difficult to ensure a high level of reliability because heat or mechanical deformation generated in the substrate may be directly transferred to the capacitor.

[0006] Therefore, recently, a method has been proposed in which a metal frame is bonded to a side surface of a multilayer capacitor to secure a gap between the multilayer capacitor and a mounting substrate so that stress from the substrate is not directly transferred to the multilayer capacitor. Summary of the invention

[0007] An aspect of the present disclosure is to provide an electronic component having improved bonding strength between a metal frame and an encapsulant such as an insulating resin.

[0008] According to an electronic component of an embodiment of the present disclosure, an electronic component includes: a capacitor component including a body and an external electrode disposed outside the body; a metal frame connected to the external electrode; and an encapsulant covering at least a portion of the capacitor component and at least a portion of the metal frame. The metal frame may include a surface concavo-convex portion disposed on at least a portion of an interface in contact with the encapsulant.

[0009] According to an electronic component of an embodiment of the present disclosure, an electronic component includes: a capacitor component, including a body and an external electrode disposed on the body; an encapsulant, encapsulating at least a portion of the capacitor component; and a metal frame, including a first portion and a second portion, the first portion being embedded in the encapsulant and connected to the external electrode, the second portion extending from the first portion and disposed outside the encapsulant. The surface roughness of at least a portion of the first portion in contact with the encapsulant is greater than the surface roughness of a portion of the second portion spaced apart from the encapsulant. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The above and other aspects, features and advantages of the present disclosure will be more clearly understood through the following detailed description in conjunction with the accompanying drawings, in which:

[0011] Figure 1 schematically shows a perspective view of an electronic component according to an embodiment of the present disclosure;

[0012] Figure 2 yes Figure 1 The main view and partial enlarged view of the electronic components;

[0013] Figure 3 is a front view and a partial enlarged view of an electronic component according to another embodiment of the present disclosure;

[0014] Figure 4 is a front view and a partial enlarged view of an electronic component according to another embodiment of the present disclosure;

[0015] Figure 5 is based on Figure 3 A front view and a partially enlarged view of an electronic component of a modified example of the illustrated embodiment;

[0016] Fig. 6A and Figure 6B A partial enlarged view of a conventional structure as a comparison is shown respectively. Figure 3 A partial enlarged view of area A;

[0017] Figures 7 to 9 yes Figure 6B Partially enlarged views of different embodiments of the surface concavo-convex portions shown;

[0018] Fig.10 It shows that according to Figures 7 to 9 A graph showing the defect occurrence rate due to moisture absorption of the electronic components of the embodiment and the conventional electronic components as a comparison;

[0019] Fig.11 It shows that according to Figures 7 to 9 A graph showing the results of tensile tests on the electronic components of the embodiment and conventional electronic components for comparison; and

[0020] Fig.12 It shows that according to Figure 7 The graph shown is a graph of the results of a tensile test on the depth of the surface irregularities. DETAILED DESCRIPTION

[0021] Hereinafter, embodiments of the present disclosure will be described as follows with reference to the accompanying drawings. However, the present disclosure may be illustrated in many different forms and should not be construed as being limited to the specific embodiments set forth herein. Specifically, these embodiments are provided so that the present disclosure will be thorough and complete, and will fully convey the scope of the present disclosure to those skilled in the art. Therefore, for clarity of description, the shapes and sizes of the elements in the accompanying drawings may be exaggerated, and in the accompanying drawings, the elements represented by the same reference numerals are the same elements.

[0022] In the accompanying drawings, irrelevant descriptions will be omitted to clearly describe the present disclosure, and the thickness may be exaggerated in order to clearly express multiple layers and regions. The same reference numerals will be used to describe the same components with the same functions within the scope of the same concept. Throughout the specification, unless otherwise specifically stated, when a component is referred to as "including" or "comprising", it means that it may also include other components without excluding other components.

[0023] In the drawings, the X direction may be defined as a first direction, L direction or length direction, the Y direction may be defined as a second direction, W direction or width direction, and the Z direction may be defined as a third direction, stacking direction, T direction or thickness direction.

[0024] Figure 1 A perspective view schematically shows an electronic component according to an embodiment of the present disclosure, and Figure 2 yes Figure 1 The main view and partial enlarged view of the electronic components.

[0025] Reference Figure 1 and Figure 2 The electronic component 100 according to the present embodiment includes a capacitor component including a body 110 and external electrodes 131 and 132 , and metal frames 310 and 320 .

[0026] The body 110 is disposed between the metal frames 310 and 320 and is formed by alternately stacking a plurality of dielectric layers 111 and internal electrodes 120, such as Figure 2 shown.

[0027] Although the shape of the body 110 is not particularly limited, for example, Figure 1As shown, the body 110 may be formed in a hexahedral shape or the like. In addition, due to the shrinkage of the ceramic powder included in the body 110 during the sintering process, the body 110 may have a substantially hexahedral shape rather than a completely straight parallelepiped shape.

[0028] The plurality of dielectric layers 111 forming the body 110 are in a sintered state, and adjacent dielectric layers 111 may be integrated so that it is difficult to confirm a boundary therebetween without using a scanning electron microscope (SEM).

[0029] The raw material used to form the dielectric layer 111 is not particularly limited as long as sufficient electrostatic capacitance can be obtained. For example, the dielectric layer 111 can be formed using a barium titanate-based material, a lead composite perovskite-based material, a strontium titanate-based material, etc. In addition, according to the purpose of the present disclosure, the material used to form the dielectric layer 111 can be a material formed by mixing various ceramic additives, organic solvents, plasticizers, adhesives, dispersants, etc. with ceramic powders such as barium titanate (BaTiO3).

[0030] The internal electrodes 120 and the dielectric layers 111 are alternately stacked. Figure 2 As shown, a plurality of internal electrodes 120 are alternately disposed to face each other with the dielectric layer 111 interposed therebetween, thereby forming the body 110 , and each of the internal electrodes 120 may be exposed at one of both ends of the body 110 .

[0031] In this case, adjacent internal electrodes 120 may be electrically isolated from each other by the dielectric layer 111 disposed therebetween. The body 110 may be formed by alternately stacking ceramic green sheets on which the internal electrodes 120 having different polarities are printed, and then sintering them.

[0032] The material forming the internal electrode 120 is not particularly limited, and for example, may be formed using a conductive paste made of a noble metal material such as palladium (Pd), palladium-silver (Pd-Ag) alloy, and one or more materials of nickel (Ni) and copper (Cu).

[0033] The printing method of the conductive paste may be a screen printing method or a gravure printing method, and the present disclosure is not limited thereto.

[0034] The external electrodes 131 and 132 are disposed outside the body 110 and may include a first external electrode 131 and a second external electrode 132. In this case, the external electrodes 131 and 132 may be connected to the plurality of internal electrodes 120 that are alternately stacked. For example, voltages having different polarities may be applied to the first external electrode 131 and the second external electrode 132, and the first external electrode 131 and the second external electrode 132 may be electrically connected to the internal electrodes 120 having different polarities, respectively.

[0035] The external electrodes 131 and 132 may be formed using various materials having conductivity such as metal, and a specific material may be determined in consideration of electrical characteristics or structural stability, and in addition, the external electrodes 131 and 132 may have a multi-layered structure.

[0036] For example, the external electrodes 131 and 132 may include an electrode layer disposed on the body 110 and a plating layer formed on the electrode layer. More specifically, the electrode layer may be a sintered electrode including a conductive metal and glass, and the conductive metal may be Cu. In addition, the electrode layer may be a conductive resin-based electrode including a plurality of metal particles and a resin.

[0037] As for a more specific example of the plating layer, the plating layer may be a Ni plating layer or a Sn plating layer, or may have a form in which a Ni plating layer and a Sn plating layer are sequentially formed on an electrode layer, or may further include a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0038] The first external electrode 131 may include a head portion 131a and a band portion 131b, and the second external electrode 132 may include a head portion 132a and a band portion 132b, the head portion 131a and the head portion 132a are respectively formed on two side surfaces of the body 110 in the first direction, and the band portion 131b and the band portion 132b extend from the head portion 131a and the head portion 132a to a portion of the other surface of the body 110.

[0039] The head portion 131a of the first external electrode 131 may be disposed to be spaced apart from the side surface frame 311 of the metal frame 310, and the head portion 132a of the second external electrode 132 may be disposed to be spaced apart from the side surface frame 321 of the metal frame 320. In addition, the band portion 131b of the first external electrode 131 may be disposed to be spaced apart from the upper surface frame 312 and the lower surface frame 313 of the metal frame 310, and the band portion 132b of the second external electrode 132 may be disposed to be spaced apart from the upper surface frame 322 and the lower surface frame 323 of the metal frame 320.

[0040] In this case, a conductive adhesive layer 510 may be further disposed in at least a portion of a space where the first external electrode 131 and the metal frame 310 are spaced apart from each other, and a conductive adhesive layer 520 may be further disposed in at least a portion of a space where the second external electrode 132 and the metal frame 320 are spaced apart from each other. That is, the conductive adhesive layers 510 and 520 may structurally and electrically connect the external electrodes 131 and 132 and the metal frames 310 and 320 to each other.

[0041] The metal frame 310 is connected to the first external electrode 131 and includes a side surface frame 311 extending in the third direction, an upper surface frame 312 extending in the first direction, and a lower surface frame 313. The metal frame 320 is connected to the second external electrode 132 and includes a side surface frame 321 extending in the third direction, and an upper surface frame 322 and a lower surface frame 323 extending in the first direction.

[0042] The side surface frames 311 and 321 are arranged to face two side surfaces of the capacitor assembly respectively, and the upper surface frames 312 and 322 extend from the upper ends of the side surface frames 311 and 321 respectively to face the upper surface of the capacitor assembly, and the lower surface frames 313 and 323 extend from the lower ends of the side surface frames 311 and 321 respectively to face the lower surface of the capacitor assembly.

[0043] In this case, the connection angle between the side surface frame 311 and the upper surface frame 312 and the connection angle between the side surface frame 321 and the upper surface frame 322 can each be formed to be 90°, or if necessary, can be formed to be less than 90°, so that the lower surface frames 313 and 323 can be set below the external electrodes 131 and 132.

[0044] exist Figure 1 In the figure, the encapsulant 200 is omitted to describe the overall shape of the electronic component 100, but as shown in FIG. Figure 2 As shown, the electronic component 100 according to the embodiment of the present disclosure further includes an encapsulant 200. The encapsulant 200 may be formed using an insulator such as an insulating resin, and may be formed to surround at least a portion of the remaining structure of the electronic component 100. That is, the encapsulant 200 may be configured to mold the exterior of the electronic component 100.

[0045] More specifically, the encapsulant 200 may cover at least a portion of the capacitor assembly and at least a portion of the metal frames 310 and 320. Therefore, the encapsulant 200 protects the product from external impact or moisture while maintaining the bonding state of the body 110, the external electrodes 131 and 132, and the metal frames 310 and 320, so that the reliability of the electronic component 100 can be improved.

[0046] In this case, the side surface frames 311 and 321 and the lower surface frames 313 and 323 are exposed to the outside, so that a gap can be maintained between the lower portion of the encapsulant 200 and the lower surface frames 313 and 323. Therefore, when the metal frames 310 and 320 are deformed due to an external force, free deformation of the metal frames 310 and 320 can be maintained while protecting the electronic component 100 from external stress.

[0047] Reference Figure 1 and Figure 2 , the electronic component 100 according to the embodiment of the present disclosure may further include conductive adhesive layers 510 and 520. In this case, the arrangement positions of the conductive adhesive layers 510 and 520 may be changed, and Figure 1 and Figure 2 The positions shown in are examples only.

[0048] For example, the conductive adhesive layers 510 and 520 may be provided between the upper surface of the band portion 131b of the first external electrode 131 and the upper surface frame 312 of the metal frame 310 and between the upper surface of the band portion 132b of the second external electrode 132 and the upper surface frame 322 of the metal frame 320, respectively. In this case, the external electrodes 131 and 132 and the metal frames 310 and 320 are spaced apart from each other in the portion where the conductive adhesive layers 510 and 520 are not provided. Since there are the portions spaced apart from each other as described above, when the electronic component 100 is mounted on the substrate, the deformation stress of the substrate, etc. can be prevented from being directly transferred to the body 110.

[0049] In addition, the conductive adhesive layers 510 and 520 are disposed on the upper portion (relatively away from the mounting surface) of the electronic component 100, so that the lower portion of the metal frames 310 and 320 can be used as an elastic portion for absorbing impact. That is, the metal frames 310 and 320 can more effectively absorb external stress caused by deformation of the substrate.

[0050] Reference Figure 2 , the metal frames 310 and 320 according to the embodiment of the present disclosure include a surface concavo-convex portion 400 formed on at least a portion of an interface with the encapsulant 200.

[0051] The surface unevenness 400 means that a plurality of protrusions and depressions are repeated on the surfaces of the metal frames 310 and 320. Therefore, the portion where the surface unevenness 400 is formed exhibits that the surface roughness of the portion is greater than the surface roughness of the portion where the surface unevenness 400 is not formed. Here, the pattern of the unevenness of the surface unevenness 400 may be regular or irregular. The portion where the surface unevenness 400 is not formed may include, for example, Figure 2 The upper surfaces of the upper surface frames 312 and 322 , a portion of the side surface frames 311 and 321 , and / or a portion of the lower surface frames 313 and 323 .

[0052] The method of forming the surface unevenness 400 on the metal frames 310 and 320 may be various methods, and for example, the surface unevenness 400 may be formed using a method such as a press process, etching, photolithography, a knurling process, or the like.

[0053] Since the surface concavo-convex part 400 is formed as described above, the interface area between the metal frames 310 and 320 and the encapsulant 200 can be increased. In addition, the slope of the concavo-convex pattern of the interface may not be constant, and the concavo-convex pattern may be repeatedly arranged or may be changed. Therefore, the interface bonding force between the metal frames 310 and 320 and the encapsulant 200 can be improved, and the channel through which moisture permeates can be extended, so that moisture resistance can be improved.

[0054] Specifically, according to Figure 2 In the embodiment of the present disclosure shown, the surface concavo-convex part 400 may be formed on at least one area of ​​the lower surface of the upper surface frames 312 and 322. That is, the surface concavo-convex part 400 may be formed on the upper surface frames 312 and 322 of the metal frames 310 and 320 having an interface in contact with the encapsulant 200. For example, the surface concavo-convex part 400 may be formed on the lower surface of the upper surface frames 312 and 322. In addition, as an example, the portion of the lower surface of the upper surface frames 312 and 322 having the surface concavo-convex part 400 may be formed to face the external electrodes 131 and 132.

[0055] Here, the lower surfaces of the upper surface frames 312 and 322 and the "body 110 and the external electrodes 131 and 132" are spaced apart from each other to face each other, and the possibility of external heat or moisture penetrating into the spaced area is high. Therefore, the surface concavo-convex part 400 may be formed on the lower surfaces of the upper surface frames 312 and 322 to improve the interface bonding force, thereby improving the heat dissipation effect and moisture-proof effect of the electronic component 100.

[0056] In addition, the surface unevenness 400 may be formed adjacent to the conductive adhesive layers 510 and 520. In this case, the encapsulant 200 may be more firmly bonded to the structure in which the external electrodes 131 and 132, the conductive adhesive layers 510 and 520, and the metal frames 310 and 320 are connected to each other, thereby improving the stability of the structure. Then, even if an external force acts on the electronic component 100, its durability may be maintained.

[0057] Figure 3 is a front view and a partially enlarged view of an electronic component according to another embodiment of the present disclosure, and Figure 4 1 is a front view and a partially enlarged view of an electronic component according to another embodiment of the present disclosure.

[0058] according to Figure 3 and Figure 4 In other embodiments of the present disclosure shown, the surface concavo-convex portion 400 may also be formed on at least one region of the upper surface of the upper surface frames 312 and 322 .

[0059] That is, the surface concavo-convex parts 400 may be simultaneously formed on the upper and lower surfaces of the upper surface frames 312 and 322 of the metal frames 310 and 320 .

[0060] First, refer to Figure 3 , the surface concavo-convex part 410 may be formed in an area between the conductive adhesive layer 510 and the side surface frame 311 on the upper surface frame 312 and in an area between the conductive adhesive layer 520 and the side surface frame 321 on the upper surface frame 322. Here, the surface concavo-convex part 410 may include a first surface concavo-convex part 411 formed on the lower surface of the upper surface frames 312 and 322 and a second surface concavo-convex part 412 formed on the upper surface of the upper surface frames 312 and 322.

[0061] Reference Figure 4 , the surface concavo-convex part 420 may be formed on the upper surface and the lower surface of the upper surface frames 312 and 322. Here, the surface concavo-convex part 420 may include a 1-1 surface concavo-convex part 421 formed on the outer area (the area adjacent to the side surface frame 311 or 321) of the lower surface of the upper surface frames 312 and 322, a 2-1 surface concavo-convex part 422 formed on the upper surface, and a 3-1 surface concavo-convex part 423 formed on the inner area of ​​the lower surface.

[0062] In this manner, by forming the surface concavo-convex portions 411, 412, 421, 422, and 423 on the upper and lower surfaces of the upper surface frames 312 and 322, the bonding force between the metal frames 310 and 320 and the encapsulant 200 can be strengthened. In addition, the penetration of heat or moisture in all directions with respect to the interface between the metal frames 310 and 320 and the encapsulant 200 can be more effectively prevented.

[0063] Figure 5 is based on Figure 3 A front view and a partially enlarged view of an electronic component of a modified example of the illustrated embodiment.

[0064] More specifically, Figure 5 , and in this embodiment, the capacitance of the electronic component can be increased. In addition, even in the embodiment of stacking multiple capacitor components, the surface concavo-convex part can be formed at the interface between the metal frame and the encapsulant.

[0065] according to Figure 5 In the embodiment shown, the electronic component 100 may include a plurality of capacitor assemblies, and each capacitor assembly includes a body and an outer electrode. In this case, one of the plurality of capacitor assemblies is disposed below the upper surface frames 312 and 322. The remaining capacitor assemblies may be stacked and disposed above the upper surface frames 312 and 322.

[0066] Although the number of capacitor assemblies stacked above the upper surface frames 312 and 322 may vary, it is preferred that the electronic assembly 100 is stacked to such an extent that the electronic assembly 100 can be stably mounted on the substrate. For example, the electronic assembly 100 may include Figure 5 Hereinafter, in this specification, an electronic component 100 including two capacitor components will be exemplarily described.

[0067] Reference Figure 5 , one capacitor assembly included in the electronic assembly 100 is disposed below the upper surface frames 312 and 322 and may include a body 110-1 (including an inner electrode 120-1 and a dielectric layer 111-1) and a first outer electrode 131-1 and a second outer electrode 132-1. Another capacitor assembly is disposed above the upper surface frames 312 and 322 and includes a body 110-2 (including an inner electrode 120-2 and a dielectric layer 111-2) and a first outer electrode 131-2 and a second outer electrode 132-2.

[0068] In addition, the encapsulant 200 may cover at least a portion of the two capacitor components and at least a portion of the metal frames 310 and 320. Figure 5 As shown, the encapsulant 200 may cover the bodies 110 - 1 and 110 - 2 , the external electrodes 131 - 1 , 132 - 1 , 131 - 2 , and 132 - 2 , and some areas of the upper surface frames 312 and 322 of the two capacitor assemblies together.

[0069] In this case, the conductive adhesive layers may be respectively disposed between the external electrodes of the plurality of capacitor assemblies and the upper surface frames 312 and 322. For example, the conductive adhesive layers 510-1 and 520-1 may be disposed between the external electrodes 131-1 and 132-1 of the capacitor assemblies disposed below the upper surface frames 312 and 322 and the upper surface frames 312 and 322. The conductive adhesive layers 510-2 and 520-2 may also be disposed between the external electrodes 131-2 and 132-2 of the capacitor assemblies disposed above the upper surface frames 312 and 322 and the upper surface frames 312 and 322.

[0070] In the present embodiment, the surface concavo-convex parts 400 may be formed on the upper surface frames 312 and 322 of the metal frames 310 and 320 having the interface in contact with the encapsulant 200 .

[0071] As an example, Figure 5 As shown, the surface concavo-convex parts 400 - 1 and 400 - 2 may be formed on the lower surface and the upper surface of the upper surface frames 312 and 322 , respectively.

[0072] Here, first observing the capacitor assembly disposed below the upper surface frames 312 and 322, the lower surfaces of the upper surface frames 312 and 322 are spaced apart from and face the "body 110-1 and the external electrodes 131-1 and 132-1", and there is a high possibility that external heat or moisture penetrates into the spaced area.

[0073] Therefore, the surface concavo-convex part 400 - 1 may be formed on the lower surface of the upper surface frames 312 and 322 to improve the interface bonding strength between the upper surface frames 312 and 322 and the encapsulant 200 , thereby improving the heat dissipation and moisture-proof effects of the electronic component 100 .

[0074] Similarly, observing the capacitor assembly disposed above the upper surface frames 312 and 322, the upper surfaces of the upper surface frames 312 and 322 are spaced apart from and face the "body 110-2 and the external electrodes 131-2 and 132-2", and there is a high possibility that external heat or moisture penetrates into the spaced area.

[0075] Therefore, the surface concavo-convex part 400 - 2 may also be formed on the upper surface of the upper surface frames 312 and 322 to improve the interface bonding strength between the upper surface frames 312 and 322 and the encapsulant 200 , thereby improving the heat dissipation and moisture-proof effects of the electronic component 100 .

[0076] Furthermore, compared to a structure including only one capacitor component, e.g. Figure 5 The structure in which a plurality of capacitor components are stacked has a problem of deteriorated stability when mounted on a substrate.

[0077] In this case, by providing the surface concavo-convex parts 400 - 1 and 400 - 2 on the surfaces of the metal frames 310 and 320 according to the embodiment of the present disclosure, it is also useful to improve the stability of the structure.

[0078] That is, when the bonding force between the encapsulant 200 and the metal frames 310 and 320 is strengthened due to the surface concavo-convex portions 400 - 1 and 400 - 2 , the bonding force between the plurality of capacitor assemblies may be correspondingly strengthened.

[0079] Therefore, compared with a conventional stack structure in which the surface concavo-convex portions 400 - 1 and 400 - 2 are not provided, the durability of the electronic component 100 may be improved, and thus, the stability of the electronic component 100 mounted on the substrate may also be improved.

[0080] For example, each of the surface concavo-convex portions 400 - 1 and 400 - 2 may be formed adjacent to the conductive adhesive layers 510 - 1 , 520 - 1 , 510 - 2 , and 520 - 2 .

[0081] In this case, the encapsulant 200 may be more firmly bonded to the bonding structure including the upper surface frames 312 and 322, the corresponding conductive adhesive layers 510-1, 520-1, 510-2 and 520-2, and the corresponding external electrodes 131-1, 132-1, 131-2 and 132-2, thereby also improving the stability of the bonding structure.

[0082] Therefore, even if external force acts on the electronic component 100, its durability can be maintained.

[0083] In order to describe the heat dissipation and moisture-proof effects in more detail, the following will refer to Fig. 6A and Figure 6B Give a description. Fig. 6A and Figure 6B The local enlarged view and Figure 3 A partial enlarged view of area A.

[0084] Reference Fig. 6A In the conventional structure where the surface unevenness 400 is not formed, there is a flat interface between the encapsulant 20 and the metal frame 30, so Fig. 6A In the local enlarged view obtained from the front side, the boundary of the interface also appears as a straight line.

[0085] In this case, moisture can enter the electronic component from outside (i.e., from Fig. 6A The upper or left portion of the metal frame 30 in the figure) penetrates into the interface between the metal frame 30 and the encapsulant 20.

[0086] When moisture penetrates into a region adjacent to the conductive adhesive layer 50 , the metal frame 30 , the external electrode, and the conductive adhesive layer 50 may be separated from each other even with a small external force.

[0087] Therefore, the durability of electronic components decreases and the incidence of product defects thereof increases.

[0088] For example, in a structure in which inner electrodes of different polarities are alternately stacked, each inner electrode is connected to one of the outer electrodes located on both sides. In this case, the area where the inner electrode and the outer electrode are not connected to each other must be electrically insulated so that the function of the electronic component can be performed normally. In addition, in some cases, moisture that has penetrated into the damaged part may penetrate into the area of ​​the internal structure of the electronic component to be kept electrically insulated. Then, the moisture serves as an electrical path in the area in an insulating state, and causes unnecessary current to appear.

[0089] However, when moisture penetrates into the corresponding regions, current may occur between the inner and outer electrodes that should not be connected to each other, thereby causing defects in the electronic component.

[0090] In contrast, when the surface concavo-convex parts 400 according to the embodiment of the present disclosure are formed on the upper and lower surfaces of the upper surface frame 312, the interface between the encapsulant 200 and the upper surface frame 312 may not be flat. Figure 6B As shown, in Figure 6B In the partial enlarged view obtained from the front side, the boundary of the interface also appears uneven. Therefore, the effect of increasing the interface area between the encapsulant 200 and the upper surface frame 312 is obtained, thereby also enhancing the bonding force of the two structures.

[0091] In addition, moisture may penetrate into the interface between the upper surface frame 312 and the encapsulant 200 from the upper portion or the left portion of the upper surface frame 312, and in this case, the interface is uneven and the path for moisture penetration is extended, which can inhibit the transfer of moisture to the inside of the electronic component 100. That is, there is an effect of improving the moisture resistance of the electronic component 100.

[0092] Figures 7 to 9 They are Figure 6B A partial enlarged view of different embodiments of the surface relief portions shown in FIG. Fig.10 is a conventional electronic component shown as a comparison and according to Figures 7 to 9 A graph showing the defect rate of electronic components due to moisture absorption of an embodiment of the present invention.

[0093] first, Figure 7 and Figure 8 Corresponding to Figure 6B Similar shows Figure 3 Various embodiments of the front view of a partial enlarged view of area A.

[0094] according to Figure 7 In the embodiment shown, the surface concavo-convex portion 400 may include a repeatedly arranged concavo-convex portion 401 having a sawtooth-shaped cross section. Figure 8 In the embodiment shown, the surface concavo-convex portion 400 may have at least one linear groove, thereby forming a concavo-convex portion 402. Figure 7 and Figure 8 In the illustrated embodiment, the surface unevenness 400 can be formed by, for example, laser processing, etching, photolithography, etc.

[0095] Next, Fig. 9 A partially enlarged view corresponding to a plan view of an embodiment of a structure including the encapsulant 200, the upper surface frame 312, and the conductive adhesive layer 510 when viewed in the third direction (Z direction). Fig. 9 In the embodiment shown, the surface concavoconvex portion 400 may include a concavoconvex portion 403 formed by repeatedly arranging unit cone-shaped (eg, pyramid-shaped) protrusions, and the center of the unit cone-shaped protrusions is convex. Fig. 9 In the illustrated embodiment, the surface relief 400 may be formed by, for example, a knurling method.

[0096] In addition, refer to Fig.10 It is confirmed that, compared with the conventional structure without the surface concavo-convex part 400, according to Figures 7 to 9 The defect rate of each embodiment shown is reduced.

[0097] More specifically, Fig.10 The graph shows the results of an experiment for evaluating the reliability of an electronic component.

[0098] Here, the reliability evaluation experiment refers to a complex accelerated reliability experiment in which a constant temperature and humidity environment is maintained for 1000 hours after a thermal cycle (TC) test in which a fluctuation cycle of a low temperature environment and a high temperature environment is repeated 1000 times within a certain period of time.

[0099] The low temperature environment used in this TC test was -55° C., and the high temperature environment used therein was 125° C. In addition, the constant temperature and humidity environment was set to maintain a temperature of 85° C. and a humidity of 85% RH.

[0100] like Fig.10 As shown in the experimental results, in the case of the conventional structure (without the surface concavo-convex part 400), the defect occurrence rate due to moisture absorption is about 8% (due to Fig.10 When the surface unevenness 400 is not formed, it is understood that a large amount of deformation of the interface occurs due to thermal expansion, and more moisture has penetrated into the inside of the electronic component. That is, it is understood that the short circuit phenomenon of the inner electrode layer occurs more frequently due to moisture absorption, and thus the defect incidence rate is high.

[0101] In contrast, in the case of each embodiment (conical, linear, sawtooth) of forming the surface concavo-convex part 400, it can be seen that the defect rate is 1% or less. This is because: when the surface concavo-convex part 400 of various embodiments is formed, the interface bonding force between the metal frames 310 and 320 and the encapsulant 200 is stronger, so that less moisture penetrates into the inside of the electronic component 100. That is, it can be understood that the effect of reducing the defect rate caused by moisture absorption is exhibited by forming the surface concavo-convex part 400.

[0102] Fig.11 It shows that according to Figures 7 to 9 A graph showing tensile test results of an electronic component of an embodiment and a conventional electronic component for comparison.

[0103] More specifically, Fig.11The graph of FIG. 1 shows the results of a tensile test on a metal frame using a universal testing machine (UTM). In this case, the tensile test is performed according to the standard "ASTM E8" known to those skilled in the art, and a 200N load cell is used. As an example, the test sample for the tensile test can be a metal sheet. Fig.11 , when compared with a conventional structure (original structure whose surface is not processed) in which the surface unevenness 400 is not formed, it can be confirmed that even in the case where the surface unevenness 400 is formed according to various embodiments of the present disclosure (conical shape, linear shape, sawtooth shape), the tensile strength of the metal frames 310 and 320 is not significantly reduced. That is, even if a part of the surface of the metal frames 310 and 320 is cut or corroded to form the surface unevenness 400, the durability is not significantly reduced.

[0104] Therefore, the electronic component 100 in which the surface concavo-convex portion 400 is formed according to the embodiment of the present disclosure has advantages in that moisture-proof reliability is improved and loss of mechanical strength is small.

[0105] Fig.12 It shows that according to Figure 7 The graph of the tensile test results of the surface unevenness and depth of the unevenness. That is, Fig.12 The graph of φ shows the result of measuring the tensile strength of the metal frames 310 and 320 according to the depth of the concavo-convex portion 401 when the surface concavo-convex portion 400 has the concavo-convex portion 401 of a repeated sawtooth type.

[0106] Here, when the thickness of the metal frames 310 and 320 is defined as t, and the depth of the concavo-convex portion 401 included in the surface concavo-convex portion 400 is defined as h, as the value of h approaches the value of 0.5×t, it can be seen that the tensile strength decreases. That is, as the depth h of the concavo-convex portion 401 increases, the tensile strength of the metal frames 310 and 320 gradually decreases. The thickness t of the metal frame 310 may refer to: an optical microscope image or a scanning electron microscope (SEM) image of a cross section in the length-thickness direction (XZ) of the central part of the electronic component 100 in the width direction, and the arithmetic mean of the thickness at different measuring points of the metal frame 310. The number of measuring points of the metal frame 310 may be, for example, 5, 10, or other numbers recognizable to a person of ordinary skill in the art, and adjacent measuring points may have equal intervals. The thickness t of the metal frame 320 may be obtained similarly. The depth h of the concavoconvex portion 401 included in the surface concavoconvex portion 400 may refer to: based on an optical microscope image or a scanning electron microscope (SEM) image for measuring the thickness t, the arithmetic mean of the depth of the unit structure constituting the concavoconvex portion 401 (the height difference between the highest point of the unit structure and the lowest point of the unit structure). The number of unit structures selected in the measurement may be, for example, 5, 10, or other numbers recognizable to a person of ordinary skill in the art. Even if not described in the present disclosure, other methods and / or tools understood by a person of ordinary skill in the art may also be used.

[0107] In this case, even if the surface concavo-convex part 400 is formed, since the present disclosure is to minimize the loss of durability, Fig.12 In the curve diagram, before the slope changes sharply, the depth of the concave-convex portion 401 is limited to "h≤0.1×t (i.e. Fig.12 Therefore, preferably, the depth h of the concavo-convex portion 401 included in the surface concavo-convex portion 400 may be 0.1×t or less.

[0108] In addition, Fig.12 In the embodiment, only the sawtooth-shaped surface concavo-convex part 400 is shown, but in the surface concavo-convex part 400 according to another embodiment of the present disclosure, when the depth h of the concavo-convex part is 0.1×t or less, the loss of durability can be minimized. Therefore, preferably, the maximum depth h of the concavo-convex part included in the surface concavo-convex part 400 can be 0.1×t or less.

[0109] As described above, according to the embodiments of the present disclosure, the bonding force between the metal frame and the encapsulant such as an insulating resin may be improved, so that the durability of the electronic component against external forces may be improved.

[0110] In addition, according to the embodiments of the present disclosure, the moisture-proof reliability and heat dissipation effect of the electronic component can be improved. In addition, interlayer short circuit failures caused by moisture absorption of the electronic component can be prevented.

[0111] However, various advantageous advantages and effects of the present disclosure are not limited to the above description and will be more easily understood in the course of describing specific embodiments of the present disclosure.

[0112] While exemplary embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations can be made without departing from the spirit and scope of the present disclosure as defined by the following claims.

Claims

1. An electronic component comprising: A capacitor assembly, comprising a main body and an outer electrode disposed outside the main body; a metal frame connected to the outer electrodes and including an upper surface frame facing an upper surface of the capacitor assembly; as well as an encapsulant covering at least a portion of the capacitor assembly and at least a portion of the metal frame, wherein the metal frame comprises a surface concavo-convex portion disposed on at least a portion of an interface in contact with the encapsulant, and Wherein, the encapsulant at least partially covers the upper surface frame.

2. The electronic component according to claim 1, wherein: The metal frame also includes: a side surface frame disposed to face a side surface of the capacitor assembly in a first direction; and a lower surface frame extending from a lower end of the side surface frame to face a lower surface of the capacitor assembly, Wherein, the upper surface frame extends from the upper end of the side surface frame.

3. The electronic component according to claim 2, wherein: The external electrode includes a head portion and a band portion, the head portion being disposed on the side surface of the main body in the first direction; and the band portion extending from the head portion to a portion of the other surface of the main body.

4. The electronic component according to claim 2, wherein: The surface concavo-convex portion is provided on at least one region of the lower surface of the upper surface frame.

5. The electronic component according to claim 4, wherein: The surface concavo-convex portion is also provided on at least one region of the upper surface of the upper surface frame. 6 . The electronic component of claim 3 , further comprising a conductive adhesive layer between an upper surface of the tape portion and the upper surface frame.

7. The electronic component according to claim 6, wherein: The surface concavo-convex portion is disposed adjacent to the conductive adhesive layer.

8. The electronic component according to claim 6, wherein: The surface concavo-convex portion is provided in a region of the upper surface frame between the conductive adhesive layer and the side surface frame.

9. The electronic component according to any one of claims 1 to 8, wherein: The surface concavo-convex portion has at least one linear groove.

10. The electronic component according to any one of claims 1 to 8, wherein: The surface concavo-convex part has repeatedly arranged concavo-convex parts with a sawtooth shape in cross section.

11. The electronic component according to any one of claims 1 to 8, wherein: The surface unevenness includes an unevenness formed by repeatedly arranged pyramidal protrusions on the at least a portion of the interface.

12. The electronic component according to any one of claims 2 to 5, wherein: The capacitor assembly is disposed below the upper surface frame, and The electronic assembly also includes another capacitor assembly disposed above the upper surface frame.

13. The electronic assembly of claim 12, further comprising: a first conductive adhesive layer disposed between the outer electrode of the capacitor assembly and the upper surface frame; as well as A second conductive adhesive layer is disposed between the outer electrode of the other capacitor component and the upper surface frame.

14. The electronic component according to any one of claims 1 to 8, wherein: The encapsulant includes an insulating resin.

15. The electronic component according to any one of claims 1 to 8, wherein: h is 0.1×t or less, where h is the maximum depth of the concavoconvex portion included in the surface concavoconvex portion, and t is the thickness of the metal frame.

16. An electronic assembly comprising: A capacitor assembly comprising a main body and an outer electrode disposed on the main body; an encapsulant encapsulating at least a portion of the capacitor assembly; as well as a metal frame including a first portion and a second portion, the first portion being embedded in the encapsulant and connected to the external electrode, the second portion extending from the first portion and disposed outside the encapsulant, The surface roughness of at least a portion of the first portion in contact with the encapsulant is greater than the surface roughness of a portion of the second portion spaced apart from the encapsulant.

17. The electronic component of claim 16, wherein: The at least a portion of the first portion faces the outer electrode.

18. The electronic component of claim 16, further comprising a conductive adhesive layer connecting the first portion and the external electrode to each other, and in, The at least a portion of the first portion is disposed between the second portion and the conductive adhesive layer.

19. The electronic assembly of claim 16, further comprising another capacitor assembly, at least a portion of the other capacitor assembly being embedded in the encapsulant, in, The first portion is disposed between the capacitor assembly and the other capacitor assembly.

20. The electronic component according to any one of claims 16 to 19, wherein: The at least a portion of the first portion includes convex portions and concave portions arranged alternately.

21. The electronic assembly of any one of claims 16 to 19, wherein: The second portion includes a side surface frame disposed to face a side surface of the capacitor assembly and a lower surface frame extending from a lower end of the side surface frame to face a lower surface of the capacitor assembly, and The first portion is included in an upper surface frame of the metal frame, and the upper surface frame faces an upper surface of the capacitor assembly.

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