A radio frequency microsystem based on electromagnetic metamaterials

Abstract

The present application relates to the technical field of system-in-package, and proposes a radio frequency microsystem based on electromagnetic super material. The system comprises: a chamber; an electromagnetic radiation source arranged in the chamber, wherein the electromagnetic radiation source is configured to generate electromagnetic radiation; a thermal radiation source arranged in the chamber, wherein the thermal radiation source is configured to generate thermal radiation; and an electromagnetic super material layer configured to absorb electromagnetic radiation and thermal radiation.

Description

Technical Field

[0001] This invention generally relates to the field of system-in-package technology. Specifically, this invention relates to a radio frequency microsystem based on electromagnetic metamaterials. Background Technology

[0002] Currently, the integration of radio frequency microsystems faces many challenges due to their high-frequency, high-power characteristics and the need for miniaturization.

[0003] The increasingly faster operating frequencies of radio frequency (RF) microsystems will generate increasingly complex electromagnetic environments, and RF systems placed within these environments will be subject to corresponding electromagnetic interference. Furthermore, the RF microsystem itself is also a source of electromagnetic interference for other systems within electronic products.

[0004] Furthermore, as the operating power of RF microsystems increases, the heat generated by the chips within these microsystems also increases, leading to more severe thermal radiation within the System-in-Package (SIP) cavity. This is particularly problematic for miniaturized RF microsystems, where insufficient heat dissipation within the miniaturized SIP package cavity will result in the accumulation of increasing heat. Severe electromagnetic interference and the long-term accumulation of thermal radiation within the SIP package cavity will significantly impact the chip's stability and lifespan.

[0005] In existing technologies, electromagnetic interference (EMI) problems are typically addressed by coating the surface of radio frequency (RF) microsystems with absorbing materials to absorb electromagnetic radiation. However, current absorbing materials used in RF microsystems often suffer from low absorption rates and require thick coatings, resulting in unsatisfactory absorption performance and significantly increasing the size of the RF microsystem. Furthermore, existing technologies offer limited solutions for thermal radiation, typically relying on natural absorption and heat dissipation by air and silicon, which is highly ineffective. Summary of the Invention

[0006] To at least partially solve the above-mentioned problems in the prior art, the present invention proposes a radio frequency microsystem based on electromagnetic metamaterials, comprising:

[0007] Chamber;

[0008] An electromagnetic radiation source is arranged in the chamber, wherein the electromagnetic radiation source is configured to generate electromagnetic radiation;

[0009] A heat radiation source, disposed within the chamber, wherein the heat radiation source is configured to generate heat radiation; and

[0010] An electromagnetic metamaterial layer is configured to absorb both electromagnetic and thermal radiation.

[0011] In one embodiment of the present invention, the electromagnetic radiation source includes a chip and wire bonding.

[0012] In one embodiment of the present invention, the thermal radiation source is specified as a chip.

[0013] In one embodiment of the present invention, the electromagnetic radiation source and the thermal radiation source are arranged at the bottom of the cavity, and the electromagnetic metamaterial layer is arranged at the top of the cavity.

[0014] In one embodiment of the present invention, the electromagnetic metamaterial layer comprises:

[0015] Substrate:

[0016] A shielding metal layer disposed on a first side of the substrate, the shielding metal layer being configured to shield electromagnetic radiation and thermal radiation; and

[0017] An electromagnetic metamaterial absorbing unit is disposed on the second side of the substrate, and the electromagnetic metamaterial absorbing unit includes:

[0018] Electromagnetic radiation absorbing unit, configured to absorb electromagnetic radiation; and

[0019] A thermal radiation absorbing unit, which is configured to absorb thermal radiation.

[0020] In one embodiment of the present invention, the radio frequency microsystem based on electromagnetic metamaterials includes a plurality of electromagnetic metamaterial absorbing units, wherein the plurality of electromagnetic metamaterial absorbing units are arranged in a circular manner.

[0021] In one embodiment of the present invention, the radio frequency microsystem based on electromagnetic metamaterials includes through-silicon vias, ball grid arrays, and resistive capacitors.

[0022] In one embodiment of the present invention, the electromagnetic metamaterial layer is configured to absorb electromagnetic and thermal radiation with an absorption rate of greater than or equal to 80% in a frequency band of greater than or equal to 3 GHz.

[0023] The present invention has at least the following beneficial effects: Based on the wave absorption properties of electromagnetic metamaterials, the present invention proposes a radio frequency microsystem based on electromagnetic metamaterials. The electromagnetic metamaterial absorbing unit in the system includes two resonant units, wherein the larger resonant unit has a lower resonant frequency and can absorb radio frequency radiation in a specific frequency band, and the smaller resonant unit has a higher resonant frequency and can absorb thermal radiation. The two electromagnetic metamaterial absorbing units, which are partially combined, can simultaneously absorb electromagnetic radiation and thermal radiation. While meeting the size requirements of the radio frequency microsystem, the electromagnetic environment and thermal radiation temperature rise in the radio frequency microsystem can be significantly improved. Attached Figure Description

[0024] To further illustrate the advantages and other features of the various embodiments of the present invention, a more specific description of the embodiments of the present invention will be presented with reference to the accompanying drawings. It is understood that these drawings depict only typical embodiments of the invention and are therefore not intended to limit its scope. In the drawings, identical or corresponding parts will be indicated by the same or similar reference numerals for clarity.

[0025] Figure 1 A schematic diagram of a radio frequency microsystem based on electromagnetic metamaterials in one embodiment of the present invention is shown.

[0026] Figure 2 A partial schematic diagram of an electromagnetic metamaterial layer in one embodiment of the present invention is shown.

[0027] Figure 3 A schematic diagram of the arrangement of electromagnetic metamaterial absorbing units in one embodiment of the present invention is shown.

[0028] Figure 4 The absorption rate curve of the electromagnetic metamaterial layer described in one embodiment of the present invention is shown. Detailed Implementation

[0029] It should be noted that the components in the various figures may be shown exaggeratedly for illustrative purposes and are not necessarily to scale. In the various figures, the same reference numerals are used for components that are identical or have the same function.

[0030] In this invention, unless otherwise specified, "arranged on," "arranged above," and "arranged on" do not exclude the possibility of an intermediate element between them. Furthermore, "arranged on or above" merely indicates the relative positional relationship between two components, and in certain cases, such as when the product orientation is reversed, it can also be converted to "arranged below or under," and vice versa.

[0031] In this invention, the various embodiments are merely intended to illustrate the solutions of the invention and should not be construed as limiting.

[0032] In this invention, unless otherwise specified, the quantifiers “a” and “one” do not exclude scenarios involving multiple elements.

[0033] It should also be noted that, in the embodiments of the present invention, only a portion of the components or parts may be shown for clarity and simplicity. However, those skilled in the art will understand that, under the teachings of the present invention, necessary components or parts can be added as needed for specific scenarios. Furthermore, unless otherwise stated, features in different embodiments of the present invention can be combined with each other. For example, a feature in the second embodiment can replace a corresponding or functionally identical or similar feature in the first embodiment, and the resulting embodiment will also fall within the scope of disclosure or description of this application.

[0034] It should also be noted that, within the scope of this invention, the terms "same," "equal," and "equal to" do not imply that the two values ​​are absolutely equal, but rather allow for a certain reasonable margin of error. In other words, the terms also encompass "substantially the same," "substantially equal," and "substantially equal to." Similarly, in this invention, the directional terms "perpendicular to," "parallel to," etc., also encompass the meanings of "substantially perpendicular to" and "substantially parallel to."

[0035] Furthermore, the numbering of the steps in the methods of the present invention does not limit the execution order of the method steps. Unless otherwise specified, the method steps may be executed in different orders.

[0036] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0037] Figure 1 A schematic diagram of a radio frequency microsystem based on electromagnetic metamaterials according to one embodiment of the present invention is shown. Figure 1 As shown, the system may include a chamber 101, an electromagnetic metamaterial absorbing unit 102, a substrate 103, a metal shielding layer 104, a chip 105, a wire bond 106, a through silicon via (TSV) 107, a resistive and capacitive device 108, and a ball grid array (BGA) 109.

[0038] The chip 105 and the wire bonding 106 can be arranged at the bottom of the chamber 101. The chip 105 can constitute a heat radiation source, generating heat radiation during operation, and the accumulation of a large amount of heat radiation will increase the temperature inside the chamber 101. The chip 105 and the wire bonding 106 can also constitute an electromagnetic radiation source, generating electromagnetic radiation and polluting the electromagnetic environment inside the chamber 101.

[0039] The electromagnetic metamaterial absorbing unit 102, the substrate 103, and the metal shielding layer 104 can constitute an electromagnetic metamaterial layer. The electromagnetic metamaterial layer can be arranged on the top of the cavity 101. The electromagnetic metamaterial layer can absorb thermal radiation and electromagnetic radiation.

[0040] Figure 2 A partial schematic diagram of an electromagnetic metamaterial layer in one embodiment of the present invention is shown. Figure 2 As shown, the substrate 201 can be a silicon substrate, the shielding metal layer 202 can be disposed on a first side of the substrate 201, and the electromagnetic metamaterial absorbing unit 203 can be disposed on a second side of the substrate 201. The shielding metal layer 202 can shield electromagnetic radiation and thermal radiation to prevent electromagnetic radiation and thermal radiation from escaping, and the electromagnetic metamaterial absorbing unit 203 can absorb thermal radiation and electromagnetic radiation. This indicates the absorption efficiency of the electromagnetic metamaterial absorbing unit 203. The absorption efficiency of the metal shielding layer 202 can be expressed as the absorption rate of the electromagnetic metamaterial layer. The metal shielding layer 202 has Therefore, the absorption rate can be expressed as: Figure 4 The absorption rate curve of the electromagnetic metamaterial layer described in one embodiment of the present invention is shown. Figure 4 As shown, in this embodiment, the electromagnetic metamaterial layer can achieve absorption in multiple frequency bands, wherein the bandwidth with an absorption rate greater than 80% can be greater than or equal to 3GHz.

[0041] Figure 3 A schematic diagram of the arrangement of the electromagnetic metamaterial absorbing unit in one embodiment of the present invention is shown. Figure 3 As shown, there may be multiple electromagnetic metamaterial absorbing units 300, which can be arranged in a circular pattern on the substrate. Each electromagnetic metamaterial absorbing unit 300 may include an electromagnetic radiation absorbing unit 301 and a thermal radiation absorbing unit 302.

[0042] The electromagnetic radiation absorbing unit 301 is relatively large, with a lower absorption frequency band and a center frequency in the radio frequency band, capable of absorbing radio frequency electromagnetic waves of a specific frequency band. The thermal radiation absorbing unit 302 is relatively small, with a higher absorption frequency band and a center frequency in the infrared band, capable of absorbing thermal radiation waves of a specific frequency band. By combining the electromagnetic radiation absorbing unit 301 and the thermal radiation absorbing unit 302, the electromagnetic metamaterial absorbing unit 300 can simultaneously absorb both electromagnetic and thermal radiation, improving the electromagnetic environment and reducing thermal radiation temperature rise within the encapsulation cavity.

[0043] Although various embodiments of the invention have been described above, it should be understood that they are presented by way of example only and not as limitations. It will be apparent to those skilled in the art that various combinations, modifications, and alterations can be made without departing from the spirit and scope of the invention. Therefore, the breadth and scope of the invention disclosed herein should not be limited by the exemplary embodiments disclosed above, but should be defined solely by the appended claims and their equivalents.

Claims

1. A radio frequency microsystem based on electromagnetic metamaterials, characterized in that, include: Chamber; An electromagnetic radiation source is arranged in the chamber, wherein the electromagnetic radiation source is configured to generate electromagnetic radiation; A thermal radiation source is arranged in the chamber, wherein the thermal radiation source is configured to generate thermal radiation; as well as An electromagnetic metamaterial layer, configured to absorb electromagnetic radiation. The electromagnetic metamaterial layer includes: Substrate: A shielding metal layer disposed on a first side of the substrate, the shielding metal layer being configured to shield electromagnetic radiation and thermal radiation; and An electromagnetic metamaterial absorbing unit is disposed on the second side of the substrate, and the electromagnetic metamaterial absorbing unit includes: Electromagnetic radiation absorbing unit, configured to absorb electromagnetic radiation; and A thermal radiation absorbing unit, configured to absorb thermal radiation. The electromagnetic radiation absorbing unit is larger than the thermal radiation absorbing unit and surrounds the thermal radiation absorbing unit. The center frequency of the absorption band of the electromagnetic radiation absorbing unit is in the radio frequency band, absorbing radio frequency electromagnetic waves. The center frequency of the absorption band of the thermal radiation absorbing unit is in the infrared band, absorbing thermal radiation waves. Through the combination of the electromagnetic radiation absorbing unit and the thermal radiation absorbing unit, the electromagnetic metamaterial absorbing unit achieves simultaneous absorption of electromagnetic radiation and thermal radiation.

2. The radio frequency microsystem based on electromagnetic metamaterials according to claim 1, characterized in that, The electromagnetic radiation source includes a chip and wire bonding.

3. The radio frequency microsystem based on electromagnetic metamaterials according to claim 2, characterized in that, The heat radiation source includes a chip.

4. The radio frequency microsystem based on electromagnetic metamaterials according to claim 1, characterized in that, The electromagnetic radiation source and the thermal radiation source are arranged at the bottom of the chamber, and the electromagnetic metamaterial layer is arranged at the top of the chamber.

5. The radio frequency microsystem based on electromagnetic metamaterials according to claim 1, characterized in that, It includes multiple electromagnetic metamaterial absorbing units, wherein the multiple electromagnetic metamaterial absorbing units are arranged in a circular arrangement.

6. The radio frequency microsystem based on electromagnetic metamaterials according to claim 1, characterized in that, This includes through-silicon vias, ball grid arrays, and resistive capacitors.

7. The radio frequency microsystem based on electromagnetic metamaterials according to claim 1, characterized in that, The electromagnetic metamaterial layer is configured to absorb electromagnetic and thermal radiation with an absorption rate of ≥80% in a frequency band of ≥3 GHz.

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