Temperature averaging plate and electronic device having the same

Abstract

The present invention provides a temperature averaging plate and an electronic device having the temperature averaging plate, which are used to solve the problem of poor heat dissipation efficiency of existing electronic devices. The temperature averaging plate includes: a first sheet; a second sheet, at least one of the first sheet and the second sheet has a receiving groove, and the second sheet is combined with the first sheet to form a chamber; at least one third sheet is located in the chamber and connected to the first sheet or the second sheet, the third sheet has a groove, the opening of the groove faces the first sheet or the second sheet connected, and the first sheet or the second sheet connected covers the groove to form at least one receiving chamber; and a working liquid is filled in the chamber and the receiving chamber.

Description

Technical Field

[0001] The present invention relates to a temperature averaging plate and an electronic device, and in particular to a temperature averaging plate that can help the electronic device maintain a proper working temperature and an electronic device having the temperature averaging plate. Background Art

[0002] The chip of a general electronic device is the main heat source when it is working, and heat dissipation is not only to reduce the temperature of the chip itself so that it does not exceed the required working temperature, but also to avoid local overheating of the electronic device. At present, the heat dissipation method of electronic devices is mainly to set a temperature averaging plate inside the electronic device. The temperature averaging plate can have a tank filled with a working liquid, and the tank can be aligned with the heat source; in this way, the heat source can heat the working liquid in the temperature averaging plate and vaporize the working liquid, and use the gas-liquid phase change mechanism of the working liquid to achieve heat energy transfer to achieve the purpose of heat dissipation.

[0003] However, the above-mentioned existing temperature equalizing plate has only one groove chamber, and the temperature equalizing plate only uses the working fluid in the groove chamber to dissipate heat to the heat source. When the temperature of the heat source is too high, the heat dissipation effect of the working fluid on the heat source is limited, making it difficult for the working fluid to effectively dissipate heat to the heat source, making it impossible for the heat source to maintain an appropriate working temperature, thereby causing local overheating of the electronic device and reducing the heat dissipation efficiency inside the electronic device.

[0004] In view of this, the existing vapor chamber still needs to be improved. Summary of the invention

[0005] In order to solve the above problems, an object of the present invention is to provide a temperature homogenizing plate that can easily dissipate heat.

[0006] Another object of the present invention is to provide an electronic device having the temperature vaporizer, so as to avoid the working temperature of the electronic device being too high and achieve good heat dissipation performance.

[0007] The directions or their approximate terms described throughout the present invention, such as "front", "rear", "left", "right", "up (top)", "down (bottom)", "inside", "outside", "side", etc., mainly refer to the directions of the accompanying drawings, and each direction or its approximate terms are only used to assist in the explanation and understanding of the embodiments of the present invention, and are not used to limit the present invention.

[0008] The elements and components described throughout the present invention use the quantifiers "a" or "an" for convenience only and to provide a general meaning of the scope of the present invention; they should be interpreted in the present invention as including one or at least one, and a single concept also includes plural cases, unless it is obvious that it means otherwise.

[0009] The similar terms such as "combination", "assembly" or "assembly" described throughout the present invention mainly include the connection that can be separated without damaging the components, or the connection that makes the components inseparable, which can be selected by technicians in this field according to the materials of the components to be connected or the assembly requirements.

[0010] The temperature equalizing plate of the present invention comprises: a first sheet; a second sheet, at least one of the first sheet and the second sheet has a receiving groove, and the second sheet is combined with the first sheet to form a chamber; at least one third sheet is located in the chamber and connected to the first sheet or the second sheet, the third sheet has a groove, the opening of the groove faces the first sheet or the second sheet connected to the third sheet, and the first sheet or the second sheet connected to the third sheet covers the groove to form at least one receiving chamber; and a working liquid is filled in the chamber and the receiving chamber.

[0011] The electronic device with the temperature equalizing plate of the present invention comprises: a casing; an electronic module located in the casing and having at least one heating zone; and the aforementioned temperature equalizing plate arranged in the casing and connected to the first sheet or the second sheet of the third sheet and contacting the heating zone.

[0012] Therefore, the temperature equalizing plate and the electronic device having the temperature equalizing plate of the present invention, the temperature equalizing plate can be placed in the casing of the electronic device, and the chamber is located in the cavity, and the cavity and the chamber are both filled with the working liquid. The temperature equalizing plate can absorb heat energy from the working liquid in the chamber, and the working liquid in the chamber can evaporate from liquid to gas. Then, the working liquid in the chamber can quickly absorb the heat energy in the chamber, so that the working liquid in the chamber can quickly condense from gas to liquid to absorb heat, so that the working liquid in the chamber can further cool the working liquid in the chamber, thereby helping the electronic module to dissipate heat to maintain an appropriate working temperature, which can prevent the working temperature of the electronic module from being too high and achieve the effect of providing good heat dissipation performance.

[0013] The maximum width of the chamber may be 1 / 4 to 3 / 4 of the maximum width of the cavity, so that the chamber can be filled with sufficient working liquid, which has the effect of improving the heat dissipation effect.

[0014] There may be more than one third sheet, so that each third sheet can be aligned with a different heating zone, thereby improving the heat dissipation efficiency.

[0015] The ratio of the total area of ​​the plurality of chambers to the area of ​​the cavity can be 1 / 5 to 4 / 5. In this way, the plurality of chambers can have enough space to be filled with the working liquid, which has the effect of improving the heat dissipation effect.

[0016] At least two of the plurality of chambers may be filled with different working liquids, so that the circulation speed of the gas-liquid phase of the working liquid can be increased, providing a better heat dissipation effect.

[0017] The plurality of grooves may not be connected to each other, so as to avoid the working fluids from flowing into each other.

[0018] The working liquids in the chamber and the containing chamber may be different. In this way, working liquids with different boiling points can correspond to heat sources in different heating zones. When the heat dissipation requirement is not high, a relatively cheap working liquid can be selected, which has the effect of saving costs.

[0019] The specific heat of the working liquid in the chamber can be greater than the specific heat of the working liquid in the receiving chamber. In this way, a large amount of heat energy transferred from the receiving chamber to the chamber can be absorbed, and the working liquid in the receiving chamber can be accelerated to condense from gas to liquid to absorb heat, thereby achieving rapid heat removal.

[0020] The chamber may be filled with two kinds of working liquids. Thus, by virtue of the different boiling points of the working liquids, the circulation speed of the gas-liquid phase of the working liquids may be increased, thereby providing a better heat dissipation effect.

[0021] At least one of the chambers can be filled with two working liquids. Thus, by virtue of the different boiling points of the working liquids, the circulation speed of the gas-liquid phase of each working liquid can be increased, thereby providing a better heat dissipation effect.

[0022] The chamber may not be connected to the chamber outside the third sheet body, so as to prevent the working liquid in the chamber from flowing out.

[0023] At least one of the third sheets can be aligned with at least one of the heating zones, and at least one of the groove openings of the third sheets can face at least one of the heating zones, so that the working liquid can fully absorb the heat energy of at least one of the heating zones, thereby improving the heat dissipation efficiency.

[0024] The area ratio of the groove to the heating area may be 1 to 4. In this way, the working liquid can have enough evaporation space, ensuring that the working liquid in the chamber can dissipate heat to the entire heating area, thereby improving the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 : An exploded perspective view of a first embodiment of the present invention;

[0026] Figure 2 : A top view of the assembly of the first embodiment of the present invention;

[0027] Figure 3 :along Figure 2 AA line profile of

[0028] Figure 4 : An exploded perspective view of the first embodiment of the present invention and an electronic device;

[0029] Figure 5 : An exploded perspective view of a second embodiment of the present invention;

[0030] Figure 6 : A top view of a combination of the second embodiment of the present invention;

[0031] Figure 7 :along Figure 6 BB line profile of;

[0032] Figure 8 : An exploded perspective view of the second embodiment of the present invention and an electronic device.

[0033] Description of Reference Numerals

[0034] 1: The first piece

[0035] 11: Container

[0036] 12: Edge

[0037] 2: The second piece

[0038] 20: Inner surface

[0039] 21: Container

[0040] 22: Edge

[0041] 3: The third piece

[0042] 31: Groove

[0043] 31a: Opening

[0044] 4: Working fluid

[0045] 5: Casing

[0046] 6: Electronic module

[0047] 61: Fever area

[0048] D1: Maximum width

[0049] D2: Maximum width

[0050] E: Electronic devices

[0051] J: Temperature plate

[0052] S: Chamber

[0053] T: Room. DETAILED DESCRIPTION

[0054] In order to make the above and other purposes, features and advantages of the present invention more clearly understood, preferred embodiments of the present invention are listed below and described in detail with reference to the accompanying drawings as follows:

[0055] Please refer to Figure 1 , Figure 3 As shown, it is a first embodiment of the temperature equalizing plate J of the present invention, including a first sheet 1, a second sheet 2, at least one third sheet 3 and a working liquid 4. The second sheet 2 is combined with the first sheet 1 to form a chamber S, at least one third sheet 3 is combined with the first sheet 1 or the second sheet 2 to form a containing chamber T, and the working liquid 4 is filled in the chamber S and the containing chamber T.

[0056] Please refer to Figure 1 As shown, the first sheet 1 can be made of a material with thermal conductivity, such as copper, titanium, stainless steel or aluminum. The first sheet 1 has a groove 11. The groove 11 can be formed by stamping, die-casting, dry etching, wet etching or plasma etching, so that the periphery of the groove 11 has a ring edge 12, and the present invention is not limited thereto; in this way, the groove 11 can be simply formed on the first sheet 1, and the depth of the groove 11 can be accurately controlled in units of less than mm by etching. For example, in small electronic products, the thickness of the thinned temperature equalizing plate J is less than or equal to 1 mm. The groove 11 can be formed in the thinned temperature equalizing plate J by etching, which has the effect of reducing the difficulty of processing.

[0057] Please refer to Figure 1 , Figure 2 As shown, the second sheet 2 can be made of a thermally conductive material such as copper, titanium, stainless steel or aluminum. The second sheet 2 has an inner surface 20, which faces the first sheet 1. The second sheet 2 can be combined with the annular edge 12 of the first sheet 1. The second sheet 2 can cover the groove 11 to form the chamber S.

[0058] In addition, the present invention does not limit the method of combining the second sheet 2 and the first sheet 1. For example, the second sheet 2 can be combined with the first sheet 1 by gluing, embedding or locking. In the present embodiment, the inner surface 20 of the second sheet 2 is laser welded to the first sheet 1 so that the first sheet 1 and the second sheet 2 can be welded together without generating gaps, so that the chamber S can be sealed and the structural strength of the temperature equalizing plate J can be improved.

[0059] Please refer to Figure 2 , Figure 3As shown, at least one third sheet 3 can be made of a material with thermal conductivity, such as copper, titanium, stainless steel or aluminum. At least one third sheet 3 is located in the chamber S. At least one third sheet 3 can be connected to the first sheet 1 or the second sheet 2. At least one third sheet 3 has a groove 31. The opening 31a of the groove 31 can face the receiving groove 11 of the first sheet 1 or the inner surface 20 of the second sheet 2. In the present embodiment, at least one third sheet 3 is connected to the second sheet 2. The opening 31a of the groove 31 faces the inner surface 20 of the second sheet 2. The second sheet 2 can cover the groove 31 to form the receiving chamber T. Among them, the chamber T is preferably not connected to the chamber S outside the third plate 3 to prevent the working liquid 4 in the chamber T from flowing out; and the specific heat (i.e., heat capacity) of the working liquid 4 in the chamber S can be greater than the specific heat of the working liquid 4 in the chamber T. In this way, the heat capacity of the working liquid 4 in the chamber S is large, and a large amount of heat energy transferred from the chamber T to the chamber S can be absorbed, which can accelerate the condensation of the working liquid 4 in the chamber T from gas to liquid to absorb heat, and achieve the effect of rapid heat removal.

[0060] In addition, the present invention does not limit the combination method of at least one third sheet 3 and the second sheet 2. For example, at least one third sheet 3 can be combined with the second sheet 2 by bonding, embedding or locking. In this embodiment, the inner surface 20 of the second sheet 2 is laser welded to at least one third sheet 3, so that at least one third sheet 3 and the second sheet 2 can be welded together without generating gaps, so that the chamber T can be sealed, and the structural strength of the temperature plate J can be improved. The maximum width D2 of the chamber T is preferably 1 / 4 to 3 / 4 of the maximum width D1 of the chamber S, so that the chamber T can be filled with enough working liquid 4.

[0061] Please refer to Figure 3 As shown, the working liquid 4 can be water, alcohol or other liquids with a low boiling point; preferably, the working liquid 4 can be a non-conductive liquid, and the working liquid 4 can absorb heat energy from the liquid state and evaporate into a gaseous state, and then utilize the gas-liquid phase change mechanism of the working liquid 4 to achieve heat energy transfer; and by virtue of the closed state of the chamber S and the chamber T, it is possible to prevent the working liquid 4 from being lost after it forms a gaseous state, and to prevent the internal space from being compressed to the space after the working liquid 4 forms a gaseous state due to the occupation of air, thereby affecting the heat dissipation efficiency.

[0062] Please refer to Figure 3 , Figure 4As shown, the assembled temperature equalization plate J can be placed in a housing 5 of an electronic device E, and the first sheet 1 or the second sheet 2 contacts a heating zone 61 of an electronic module 6 located in the housing 5. In this embodiment, the second sheet 2 contacts the heating zone 61 of the electronic module 6, and at least one third sheet 3 can be aligned with at least one heating zone 61, and the opening 31a of at least one groove 31 can face at least one heating zone 61 to ensure that the working liquid 4 in the chamber T can fully absorb the heat energy of at least one heating zone 61, which has the effect of improving the heat dissipation efficiency. Preferably, the area ratio of the groove 31 to the heating zone 61 can be 1 to 4, so that the working liquid 4 has sufficient evaporation space, ensuring that the working liquid 4 in the chamber T can dissipate heat to the entire heating zone 61.

[0063] During the operation of the electronic device E, when the temperature of at least one heating zone 61 rises, the working liquid 4 in the chamber T can absorb heat energy from the liquid state and evaporate into a gas state, so that the working liquid 4 in the chamber T absorbs the heat energy of at least one heating zone 61; and because the chamber T is located in the cavity S, the working liquid 4 in the cavity S can quickly absorb the heat energy in the chamber T, so that the working liquid 4 in the chamber T can quickly condense from the gas state to the liquid state to absorb heat, so that the working liquid 4 in the cavity S can further cool the working liquid 4 in the chamber T, and can effectively take away the heat energy of at least one heating zone 61, thereby helping the electronic module 6 to dissipate heat to maintain an appropriate operating temperature, which can prevent the operating temperature of the electronic module 6 from being too high and can provide good heat dissipation performance. In addition, since the specific heat of the working liquid 4 in the chamber S is greater than the specific heat of the working liquid 4 in the chamber T, a large amount of heat energy transferred from the chamber T to the chamber S can be absorbed, thereby accelerating the condensation of the working liquid 4 in the chamber T from gas to liquid to absorb heat, and achieving the effect of rapid heat removal. The electronic device E to which the temperature plate J is applicable may be, for example, but not limited to, a mobile phone, a tablet computer, a handheld game console, a notebook computer, a desktop computer, a camera, a smart wearable device, AR / VR glasses, or an electronic medical device.

[0064] It is particularly noted that the working liquid 4 in the chamber T can be filled with working liquids 4 of different boiling points according to the needs of at least one heating zone 61; in this way, working liquids 4 of different boiling points can correspond to the heat sources of different heating zones 61. When the heat dissipation demand is not high, a relatively cheap working liquid 4 can be selected to achieve the effect of saving costs. In addition, the chamber S can be filled with two kinds of working liquids 4, or the chamber T can also be filled with two kinds of working liquids 4; in this way, by virtue of the different boiling points of the working liquids 4, the circulation speed of the gas-liquid phase of the working liquid 4 can be increased, and a better heat dissipation effect can be provided.

[0065] Please refer to Figure 5 , Figure 6 , Figure 7 As shown, it is a second embodiment of the temperature equalizing plate J of the present invention, the second sheet 2 may also have a groove 21, and the groove 21 may also be formed by stamping, die-casting or the above-mentioned etching process, so that a ring edge 22 is formed around the groove 21, and the ring edge 22 of the second sheet 2 may overlap with the ring edge 12 of the first sheet 1, so that the groove 21 of the second sheet 2 and the groove 11 of the first sheet 1 may form the chamber S together.

[0066] In addition, the number of the third sheets 3 is multiple, so that each third sheet 3 can be aligned with different heating zones 61 respectively, so that the working liquid 4 in each chamber T can dissipate heat to different heating zones 61 respectively, which can improve the heat dissipation efficiency. In this embodiment, the number of the third sheets 3 is two for illustration; wherein, the shape of each third sheet 3 is based on the principle that each groove 31 is not connected to avoid the circulation of each working liquid phase, and the present invention is not limited to this, nor is it limited to the diagram disclosed in this embodiment. In addition, the sum of the areas of the multiple chambers T and the area of ​​the chamber S is preferably 1 / 5 to 4 / 5, so that there can be enough space in the multiple chambers T to fill the working liquid 4. In addition, the multiple chambers T can also be filled with different working liquids 4 respectively, which can increase the circulation speed of the gas-liquid phase of the working liquid 4 and provide a better heat dissipation effect.

[0067] Please refer to Figure 7 , Figure 8 As shown, in this way, multiple third sheets 3 can be aligned with multiple heating zones 61, the opening 31a of each groove portion 31 can face the multiple heating zones 61, the working liquid 4 in each chamber T absorbs the heat energy of each heating zone 61, and the working liquid 4 in the chamber S can further cool the working liquid 4 in each chamber T, so that the working liquid 4 in the multiple third sheets 3 can effectively dissipate heat for the multiple heating zones 61 respectively, which can avoid the working temperature of the electronic module 6 being too high and can provide good heat dissipation performance.

[0068] In summary, the temperature equalizing plate and the electronic device having the temperature equalizing plate of the present invention, the temperature equalizing plate can be placed in the casing of the electronic device, and the chamber is located in the cavity, and the cavity and the chamber are both filled with the working liquid. The temperature equalizing plate can absorb heat energy from the working liquid in the chamber, and the working liquid in the chamber can evaporate from liquid to gas. Then, the working liquid in the chamber can quickly absorb the heat energy in the chamber, so that the working liquid in the chamber can quickly condense from gas to liquid to absorb heat, so that the working liquid in the chamber can further cool the working liquid in the chamber, thereby helping the electronic module to dissipate heat to maintain an appropriate working temperature, which can prevent the working temperature of the electronic module from being too high and can provide good heat dissipation performance.

Claims

1. An electronic device, characterized in that: include: a housing; an electronic module located in the housing and having at least one heating zone; and A temperature averaging plate, the temperature averaging plate comprising: a first sheet; A second sheet, at least one of the first sheet and the second sheet has a receiving groove, and the second sheet is combined with the first sheet to form a chamber; at least one third sheet, located in the cavity and connected to the first sheet or the second sheet, the third sheet having a groove, the opening of the groove facing the first sheet or the second sheet connected to the third sheet, the first sheet or the second sheet connected to the third sheet covers the groove to form at least one receiving chamber, the receiving chamber is not connected to the cavity outside the third sheet, and the maximum width of the receiving chamber is 1 / 4 to 3 / 4 of the maximum width of the cavity; and A working liquid is filled in the chamber and the containing chamber, the temperature equalizing plate is arranged in the housing, and the first sheet or the second sheet connected to the third sheet contacts the heating zone, at least one of the third sheets is aligned with at least one of the heating zones, and at least one of the openings of the grooves faces at least one of the heating zones.

2. The electronic device according to claim 1, wherein: The number of at least one third sheet is plural.

3. The electronic device according to claim 2, wherein: The ratio of the total area of ​​the plurality of chambers to the area of ​​the cavity is 1 / 5 to 4 / 5.

4. The electronic device as claimed in claim 2, characterized in that: At least two of the plurality of chambers are filled with different working fluids.

5. The electronic device as claimed in claim 2, characterized in that: The plurality of grooves are not connected to each other.

6. The electronic device as claimed in claim 1, characterized in that: The working fluids in the chamber and the containing chamber are different.

7. The electronic device according to claim 6, wherein: The specific heat of the working fluid in the chamber is greater than the specific heat of the working fluid in the containing chamber.

8. The electronic device as claimed in claim 1, wherein: The chamber is filled with two working fluids.

9. The electronic device as claimed in claim 1, wherein: At least one of the chambers is filled with two working fluids.

10. The electronic device according to claim 1, wherein: The area ratio of the groove portion to the heating area is 1-4.

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