Light-emitting device

Abstract

A light-emitting device includes: a substrate; a plurality of light-emitting elements mounted on the substrate; a light-transmissive member respectively disposed on the upper surfaces of the plurality of light-emitting elements; an underfill that covers at least a part of the opposing sides of the light-transmissive member, the opposing sides of the light-emitting elements, and the upper surface of the substrate between the light-transmissive members; a covering member that covers the upper surface of the underfill and has a higher hardness than the underfill; a first convex member and a second convex member that sandwich the underfill and the covering member on the substrate.

Description

[0001] This application is a divisional application of the invention patent application with the application date of November 30, 2016, the application number of 201611079371.9, and the invention name of "Manufacturing Method of Light-Emitting Device". Technical Field

[0002] The present invention relates to a light-emitting device. Background Art

[0003] Light-emitting diodes (LEDs), which are attracting much attention as the next-generation light sources, have very good energy-saving effects compared to existing light sources and can be used for a long time. Therefore, application markets such as for backlights, for automobiles, for electro-optical panels, for traffic lights, for other general lighting lamps, etc. are expanding to the entire industry.

[0004] As a light-emitting device using an LED, there is known a light-emitting device in which a light-emitting element is mounted on a mounting substrate having wirings (for example, Patent Document 1).

[0005] Such a light-emitting device can be efficiently manufactured by the following method: mounting light-emitting elements on a single collective substrate having a plurality of substrate sizes, covering the light-emitting elements with a resin member, and then cutting the resin member and the collective substrate to be singulated.

[0006] Patent Document 1 describes the following light-emitting device: in order to ensure high front brightness, a light-emitting element, a phosphor layer, and a reflective resin are provided on a substrate, wherein the phosphor layer is disposed above the light-emitting element and is composed of a light-transmissive member containing a phosphor that converts the wavelength of light from the light-emitting element, and the reflective resin is disposed adjacent to the side surfaces of the phosphor layer and the light-emitting element.

[0007] In addition, Patent Document 1 describes manufacturing a light-emitting device in the following steps. First, a plurality of light-emitting elements are arranged in a matrix on a collective substrate having a plurality of substrate sizes, and semiconductor elements such as protection elements are arranged between the light-emitting elements. Secondly, after disposing the phosphor layer on the light-emitting elements, the side surfaces of the light-emitting elements and the phosphor layer are covered with a reflective resin. Then, the reflective resin and the collective substrate are cut between the light-emitting elements and the semiconductor elements to singulate the light-emitting device. In addition, Patent Document 1 describes forming the reflective resin as follows: using a resin discharging device to fill a liquid resin around the light-emitting elements, the phosphor layer, and the semiconductor elements, and then heating to cure the resin.

[0008] Patent Document 1: Japanese Patent Laid-Open No. 2014-112635

[0009] The manufacturing method of the light-emitting device described in Patent Document 1 can be manufactured at low cost because it does not use a mold. However, in order to suppress the depressions caused by the curing shrinkage of the resin, that is, the so-called "shrinkage holes", protective elements are arranged between the light-emitting elements.

[0010] However, there are also cases where semiconductor elements cannot be arranged at appropriate positions for suppressing "shrinkage holes" between the light-emitting elements of a light-emitting device or the like that does not require a protective element. Therefore, it is sometimes difficult to stably form the height of the reflective resin. Summary of the Invention

[0011] An object of an embodiment of the present invention is to provide a light-emitting device in which a resin member is formed into a stable shape.

[0012] A light-emitting device according to an aspect of the present invention includes: a substrate; a plurality of light-emitting elements mounted on the substrate; a light-transmissive member respectively arranged on the upper surfaces of the plurality of light-emitting elements; an underfill that covers at least a part of the opposite side surfaces of the light-transmissive members, the opposite side surfaces of the light-emitting elements, and the upper surface of the substrate between the light-transmissive members; a covering member that covers the upper surface of the underfill and is harder than the underfill; a first convex member and a second convex member that sandwich the underfill and the covering member on the substrate.

[0013] According to the light-emitting device of the present invention, the resin member, that is, the covering member, is formed into a stable shape. Brief Description of the Drawings

[0014] Figure 1A is a perspective view showing the configuration of the light-emitting device of the first embodiment;

[0015] Figure 1B is a plan view showing the configuration of the light-emitting device of the first embodiment;

[0016] Figure 1C is a cross-sectional view showing the configuration of the light-emitting device of the first embodiment, showing Figure 1B the cross-section of the IC-IC line;

[0017] Figure 1D is a cross-sectional view showing the configuration of the light-emitting device of the first embodiment, showing Figure 1B the cross-section of the ID-ID line;

[0018] Figure 2 is a flowchart showing the steps of the manufacturing method of the light-emitting device of the first embodiment;

[0019] Figure 3A is a plan view showing the semiconductor element mounting process in the manufacturing method of the light-emitting device of the first embodiment;

[0020] Figure 3B is a cross-sectional view of the semiconductor element mounting process in the manufacturing method of the light-emitting device according to the first embodiment, showing Figure 3A the cross-section of the IIIB-IIIB line;

[0021] Figure 3C is a cross-sectional view of the semiconductor element mounting process in the manufacturing method of the light-emitting device according to the first embodiment, showing Figure 3A the cross-section of the IIIC-IIIC line;

[0022] Figure 4A is a cross-sectional view of the light-transmissive member arranging process in the manufacturing method of the light-emitting device according to the first embodiment, showing the cross-section at a position corresponding to the Figure 3A IIIB-IIIB line;

[0023] Figure 4B is a cross-sectional view of the light-transmissive member arranging process in the manufacturing method of the light-emitting device according to the first embodiment, showing the cross-section at a position corresponding to the Figure 3A IIIC-IIIC line;

[0024] Figure 5A is a plan view of the convex member arranging process in the manufacturing method of the light-emitting device according to the first embodiment;

[0025] Figure 5B is a cross-sectional view of the convex member arranging process in the manufacturing method of the light-emitting device according to the first embodiment, showing Figure 5A the cross-section of the VB-VB line;

[0026] Figure 5C is a cross-sectional view of the convex member arranging process in the manufacturing method of the light-emitting device according to the first embodiment, showing Figure 5A the cross-section of the VC-VC line;

[0027] Figure 6 is a plan view showing an example of the supply method of the uncured resin materials that become the first convex member and the second convex member in the convex member arranging process in the manufacturing method of the light-emitting device according to the first embodiment;

[0028] Figure 7A is a cross-sectional view of the underfill forming process in the manufacturing method of the light-emitting device according to the first embodiment, showing the cross-section at a position corresponding to the Figure 3A IIIB-IIIB line;

[0029] Figure 7B is a cross-sectional view of the underfill forming process in the manufacturing method of the light-emitting device according to the first embodiment, showing the cross-section at a position corresponding to the Figure 3AThe cross-section at a position corresponding to the III C-IIIC line;

[0030] Figure 8A It is a cross-sectional view showing the cover member forming process in the manufacturing method of the light-emitting device of the first embodiment, showing the cross-section at a position corresponding to Figure 3A the III B-IIIB line;

[0031] Figure 8B It is a cross-sectional view showing the cover member forming process in the manufacturing method of the light-emitting device of the first embodiment, showing the cross-section at a position corresponding to Figure 3A the III C-IIIC line;

[0032] Figure 9 It is a plan view showing an example of the supply method of the uncured resin material that becomes the cover member in the cover member forming process in the manufacturing method of the light-emitting device of the first embodiment;

[0033] Figure 10A It is a plan view showing the singulation process in the manufacturing method of the light-emitting device of the first embodiment;

[0034] Figure 10B It is a cross-sectional view showing the singulation process in the manufacturing method of the light-emitting device of the first embodiment, showing the cross-section of the Figure 10A XB-XB line;

[0035] Figure 10C It is a cross-sectional view showing the singulation process in the manufacturing method of the light-emitting device of the first embodiment, showing the cross-section of the Figure 10A XC-XC line;

[0036] Figure 11A It is a perspective view showing the configuration of the light-emitting device according to a modified example of the first embodiment;

[0037] Figure 11B It is a plan view showing the configuration of the light-emitting device according to a modified example of the first embodiment;

[0038] Figure 12A It is a plan view showing the configuration of the light-emitting device of the second embodiment;

[0039] Figure 12B It is a cross-sectional view showing the bottom filling forming process in the manufacturing method of the light-emitting device of the second embodiment, showing the cross-section at a position corresponding to Figure 12A the XII B-XIIB line;

[0040] Figure 13A It is a cross-sectional view showing the bottom filling forming process in the manufacturing method of the light-emitting device of the second embodiment, showing the cross-section at a position corresponding to Figure 12A the XII B-XIIB line;

[0041] Figure 13B It is a cross-sectional view showing a step of forming a covering member in the manufacturing method of the light-emitting device of the second embodiment, showing a cross-section at a position corresponding to the XIIB-XIIB line of Figure 12A .

[0042] Mark Explanation

[0043] 1, 1A: Mounting substrate

[0044] 10: Aggregation substrate

[0045] 11: Support member

[0046] 12: Wiring

[0047] 12a: External connection portion

[0048] 2: Light-emitting element

[0049] 3, 3A: Light-transmissive member

[0050] 4: Protection element (semiconductor element different from the light-emitting element)

[0051] 51: Bonding member

[0052] 52: Bonding member

[0053] 61: First convex member

[0054] 62, 62B, 62a, 62b: Second convex member

[0055] 7, 7B: Underfill

[0056] 8, 8A, 8B: Covering member

[0057] 100, 100A, 100B: Light-emitting device

[0058] BD1, BD2, BD3: Boundary line

[0059] H1: Upper surface position of the light-emitting element

[0060] H2: Upper end position of the second convex member

[0061] H3: Upper end position of the first convex member

[0062] H4: Upper surface position of the light-transmissive member Detailed Embodiment

[0063] Hereinafter, the light-emitting device according to the embodiment will be described with reference to the drawings. It should be noted that the dimensions and positional relationships of the components shown in the respective drawings are enlarged for clarity of explanation. In addition, in the plan view and the corresponding sectional view, the dimensions or arrangement relationships of the components are not exactly the same. In the following description, for the same names and marks, in principle, they represent the same or substantially the same components, and detailed descriptions will be appropriately omitted.

[0064] <First Embodiment>

[0065] [Configuration of Light-Emitting Device]

[0066] Refer to Figures 1A to 1D The configuration of the light-emitting device according to the first embodiment will be described.

[0067] Figure 1A FIG. is a perspective view showing the configuration of the light-emitting device according to the first embodiment. Figure 1B FIG. is a plan view showing the configuration of the light-emitting device according to the first embodiment. Figure 1C FIG. is a sectional view showing the configuration of the light-emitting device according to the first embodiment, showing Figure 1B the cross-section of the IC-IC line. Figure 1D FIG. is a sectional view showing the configuration of the light-emitting device according to the first embodiment, showing Figure 1B the cross-section of the ID-ID line.

[0068] The light-emitting device 100 according to the first embodiment mainly includes: a mounting substrate 1 having a substantially rectangular flat plate shape in a plan view; four light-emitting elements 2 having a substantially rectangular shape in a plan view and mounted on the upper surface side of the mounting substrate 1; four light-transmitting members 3 having a substantially rectangular shape in a plan view and provided on the upper surfaces of the respective light-emitting elements 2; and a covering member 8 provided on the upper surface of the mounting substrate 1 and covering the sides of the light-emitting elements 2 and the light-transmitting members 3. The outer shape of the light-emitting device 100 is substantially a rectangular parallelepiped, and there is a region on a part of the upper surface of the mounting substrate 1 where the covering member 8 is not provided, and an external connection portion 12a, which is a terminal for connecting to an external power source, is provided in this region.

[0069] In a plan view, at the outer edge portion of the substantially rectangular covering member 8, a first convex member 61 is disposed on one side of the rectangular shape, and second convex members 62 are disposed on the other three sides. That is, in Figure 1B , a first convex member 61 is disposed on the lower outer edge of the substantially rectangular covering member 8, a second convex member 62a is disposed on the upper side, and second convex members 62b are disposed on the right side and the left side. The covering member 8 is formed of a light-shielding material, preferably formed of a reflective resin, and the upper surface of the light-transmitting member 3 is the light extraction surface (i.e., the light-emitting surface) of the light-emitting device 100.

[0070] The light-emitting device 100 of the first embodiment includes a plurality of light-emitting elements 2, and each of the upper surfaces of the plurality of light-emitting elements 2 is further provided with a light-transmissive member 3. That is, the light-emitting device 100 includes a plurality of light-emitting surfaces, and a covering member 8 is disposed between the plurality of light-transmissive members 3 in a plan view. Thereby, light leakage between adjacent light-emitting surfaces can be suppressed when the plurality of light-emitting elements 2 are individually lit.

[0071] Hereinafter, each component will be described in detail.

[0072] (Mounting substrate)

[0073] The mounting substrate 1 is configured to include a flat support member 11 and wirings 12 disposed on the upper surface of the support member 11. The mounting substrate 1 mounts the light-emitting elements 2 and the protection elements 4, and the wirings 12 are arranged to form a prescribed circuit. A part of the wiring 12 is exposed from the covering member 8, and this exposed portion serves as an external connection portion 12a which is a terminal for external connection. In the present embodiment, five external connection portions 12a are provided, and the wiring 12 is configured such that the four light-emitting elements 2 mounted on the mounting substrate 1 can be individually driven by controlling the voltage applied to these external connection portions 12a.

[0074] The support member 11 is preferably made of an insulating material and preferably made of a material through which light emitted from the light-emitting element 2 or external light is difficult to transmit. In addition, a material having a certain degree of strength is preferably used. Specifically, ceramics such as alumina, aluminum nitride, and mullite, and resins such as phenolic resin, epoxy resin, polyimide resin, BT resin (bismaleimide triazine resin), and polyphthalamide (PPA) can be cited. In addition, at least the region of the upper surface of the support member 11 where the light-emitting element 2 is mounted preferably has good reflectivity. For example, a reflective layer using a metal such as Ag or Al, or a white resin containing a white pigment can also be provided.

[0075] The wiring 12 is disposed on the upper surface of the support member 11 and can be formed using, for example, a metal such as Cu, Ag, Au, Al, Pt, Ti, W, Pd, Fe, Ni or an alloy thereof. Such a wiring 12 can be formed by electrolytic plating, electroless plating, evaporation plating, sputtering, or the like. In addition, for example, when Au bumps are used in the mounting of the light-emitting element 2, the bonding property with the light-emitting element is improved by using Au on the outermost surface of the wiring.

[0076] Note that the number of light-emitting elements 2 mounted on the mounting substrate 1 only needs to be one or more. In addition, even when a plurality of light-emitting elements 2 are mounted, the wiring 12 can be provided with, for example, two external connection portions 12a as a pair of wiring patterns, and a plurality of light-emitting elements 2 are connected in series or in parallel between the two external connection portions 12a.

[0077] (Light-emitting element)

[0078] The light-emitting element 2 has, for example, a substantially rectangular top view shape, and includes a light-transmissive substrate and a semiconductor laminate, and a pair of electrodes are provided on the surface of the semiconductor laminate.

[0079] The light-emitting element 2 preferably has a pair of positive and negative electrodes on the same surface side. Thus, the light-emitting element 2 can be flip-chip mounted on the mounting substrate 1. In this case, the surface opposite to the surface on which the pair of electrodes are formed becomes the main light extraction surface of the light-emitting element. In addition, when the light-emitting element 2 is mounted face up on the mounting substrate 1, the surface on which the pair of electrodes are formed becomes the main light extraction surface of the light-emitting element.

[0080] The light-emitting element 2 can be a component of any wavelength. For example, as the blue-green light-emitting element 2, a component using ZnSe or a nitride semiconductor (In X Al Y Ga 1－X－Y N, 0≤X, 0≤Y, X + Y≤1), GaP can be selected. In addition, as the red light-emitting element 2, a nitride semiconductor represented by GaAlAs or AlInGaP can be preferably used. In addition, a semiconductor light-emitting element composed of materials other than the above can also be used. The composition, light-emitting color, size, number, etc. of the light-emitting element 2 used can be appropriately selected according to the purpose.

[0081] (Light-transmissive component)

[0082] The light-transmissive component 3 is joined to the upper surface of the light-emitting element 2 by a light-transmissive joining component 52. The light-transmissive component 3 is made of a material that can transmit the light emitted from the light-emitting element 2 and extract it to the outside. In addition, the side surface of the light-transmissive component 3 is covered by a covering component 8, and when the covering component 8 has light-shielding properties, the upper surface of the light-transmissive component 3 becomes the light extraction surface (light-emitting surface) of the light-emitting device 100.

[0083] In the present embodiment, the light-transmissive member 3 is a substantially rectangular shape larger than the light-emitting element 2 in plan view, and is arranged so as to include the region where the light-emitting element 2 is arranged. In addition, although the upper surface side of the light-transmissive member 3 may be formed in a lens shape, it is preferably a plate shape that is not easily climbed by the covering member 8 that covers the side surface. A lens may also be provided on the upper surface of the plate-shaped light-transmissive member 3. In addition, as the light-transmissive member 3, for example, a member smaller than the light-emitting element 2 in plan view can be used.

[0084] The light-transmissive member 3 may also contain a light-diffusing material, or a wavelength-converting substance (such as a phosphor) that converts at least a part of the light incident from the light-emitting element 2 into light of a different wavelength. As the light-transmissive member 3 containing a wavelength-converting substance, specifically, there can be cited members such as a sintered body of a phosphor or YAG glass that contains phosphor powder in resin, glass, other inorganic substances, etc. The sintered body of the phosphor can be formed by sintering only the phosphor, or by sintering a mixture of the phosphor and a sintering aid. In the case of sintering a mixture of the phosphor and a sintering aid, as the sintering aid, an inorganic material such as silicon oxide, aluminum oxide, or titanium oxide is preferably used. Thereby, even when the light-emitting element 2 has a high output power, discoloration or deformation of the sintering aid due to light or heat can be suppressed.

[0085] The light-transmissive member 3 preferably has high transparency. The thickness of the light-transmissive member 3 is not particularly limited and can be appropriately changed. For example, it can be set to about 50 to 300 μm.

[0086] As the phosphor, a phosphor used in the art can be appropriately selected. For example, as a phosphor that can be excited by a blue light-emitting element or an ultraviolet light-emitting element, there can be cited a cerium-activated yttrium-aluminum-garnet-based phosphor (Ce:YAG), a cerium-activated lutetium-aluminum-garnet-based phosphor (Ce:LAG), an europium- and / or chromium-activated calcium aluminosilicate-based phosphor (CaO-Al2O3-SiO2), an europium-activated silicate-based phosphor ((Sr,Ba)2SiO4), a β-sialon phosphor, a CASN phosphor, an SCASN phosphor and other nitride-based phosphors, a KSF phosphor (K2SiF6:Mn), a sulfide-based phosphor, a quantum dot phosphor, etc. By combining these phosphors with a blue light-emitting element or an ultraviolet light-emitting element, various color light-emitting devices (such as a white light-emitting device) can be manufactured. In the case of forming a light-emitting device 100 that can emit white light, it is adjusted to be white according to the type and concentration of the phosphor contained in the light-transmissive member 3. The concentration of the phosphor contained in the light-transmissive member 3 is, for example, about 5 to 50 mass%.

[0087] As the light-diffusing material that can be contained in the light-transmissive member 3, for example, titanium oxide, barium titanate, aluminum oxide, silicon oxide, etc. can be used.

[0088] (Protecting element)

[0089] The light-emitting device 100 may also include a semiconductor element (such as a protecting element) different from the light-emitting element 2. The protecting element 4 is provided to protect the light-emitting element 2 from the influence of electrostatic discharge. The protecting element 4 is preferably a Zener diode. One protecting element 4 is provided corresponding to each light-emitting element 2, but only one may be provided, or the protecting element 4 may not be provided depending on the use of the light-emitting device, etc.

[0090] When other semiconductor elements such as the protecting element 4 or a transistor for driving and controlling the light-emitting element 2 are provided on the mounting substrate 1, it is preferable to arrange these other semiconductor elements between the light-emitting element 2 and the first convex member 61 or the second convex member 62. In particular, by arranging them at the most separated position between the light-transmitting member 3 and the first convex member 61 or the second convex member 62, when forming the covering member 8, the lowering of the liquid surface of the uncured resin material for forming the covering member 8 can be more effectively suppressed.

[0091] (Bonding member)

[0092] The bonding member 51 is a conductive member for mechanically and electrically bonding the light-emitting element 2 to the wiring 12 provided on the upper surface of the mounting substrate 1.

[0093] When the light-emitting element 2 is flip-chip mounted on the mounting substrate 1, as the bonding member 51, a metal bump made of a metal material such as Au, Ag, Cu, Al, etc., such as a wire bump or an electroplated bump, can be used. Before bonding the light-emitting element 2 to the mounting substrate 1, a metal bump can also be provided to be previously bonded to the n-side electrode and p-side electrode of the light-emitting element 2, or each wiring 12. In this case, the light-emitting element 2 and the mounting substrate 1 can be bonded by an ultrasonic bonding method.

[0094] In addition, as the bonding member 51, a solder such as an AuSn-based alloy or a lead-free solder of Sn can also be used. In this case, the light-emitting element 2 and the mounting substrate 1 can be bonded by a reflow soldering method.

[0095] In addition, as the bonding member 51, a conductive adhesive containing conductive particles in a resin can also be used.

[0096] In addition, when the light-emitting element 2 is mounted face up on the mounting substrate 1, it is not necessarily required to use a conductive member when bonding the light-emitting element 2 to the mounting substrate 1, and a light-transmitting resin such as silicone resin can be used to bond the light-emitting element 2 to the mounting substrate 1. In this case, a pair of electrodes of the light-emitting element 2 are electrically bonded to the wiring 12 by using a conductive lead, etc.

[0097] The bonding member 52 is a member for bonding the light-transmissive member 3 to the upper surface of the light-emitting element 2. As the bonding member 52, it is preferably light-transmissive, and an organic adhesive such as silicone resin or epoxy resin, or an inorganic adhesive such as low-melting glass can be used. In addition, the bonding member 52 is disposed not only on the upper surface of the light-emitting element 2 but also on the side surface of the light-emitting element 2, so that the light emitted from the side surface of the light-emitting element 2 enters the light-transmissive member 3 via the bonding member 52, thereby improving the light extraction efficiency.

[0098] It should be noted that the bonding of the light-emitting element 2 and the light-transmissive member 3 can also be a direct bonding method as follows, that is, a direct bonding method such as crimping, sintering, hydroxyl bonding method, surface activation bonding method, atomic diffusion bonding method, etc.

[0099] (First convex member)

[0100] The first convex member 61 forms one side of a rectangle of the covering member 8 formed in a substantially rectangular shape in plan view on the upper surface of the mounting substrate 1. Specifically, in Figure 1B , the first convex member 61 is provided on the lower side of the covering member 8 formed in a substantially rectangular shape in plan view. As shown in Figure 1C and Figure 1D , the first convex member 61 is formed in such a manner that the height-direction position H3 at the upper end of the first convex member 61 is higher than the height-direction position H1 at the upper surface of the light-emitting element 2 and higher than the height-direction position H2 at the upper end of the second convex member 62. In addition, the height-direction position H3 at the upper end of the first convex member 61 is preferably formed to be lower than the height-direction position H4 at the upper surface of the light-transmissive member 3. By forming the first convex member 61 in such a configuration, when the covering member 8 is disposed between the first convex member 61 and the light-transmissive member 3, it is possible to prevent the covering member 8 from being higher than the upper surface of the light-transmissive member 3 and obstructing the emission of light.

[0101] The first convex member 61 can be formed using a resin material. As the resin material, a thermosetting resin such as epoxy resin or silicone resin can be used. In addition, the resin material forming the first convex member 61 can be a transparent resin, and as a light-shielding substance, a white resin containing a light-reflective substance such as a white pigment or a black resin containing a light-absorbing substance such as a black pigment can also be used.

[0102] It should be noted that in the manufacturing method of the light-emitting device 100 described later, the first convex member 61 is a part of a frame configured to surround the region where a plurality of light-emitting elements 2 are disposed on an aggregate of a plurality of mounting substrates 1, that is, an aggregate substrate. The first convex member 61 is used as a frame for blocking the expansion of the uncured liquid resin material when forming the covering member 8 and is formed in close contact with the covering member 8.

[0103] (Second convex member)

[0104] As Figure 1B shown, the second convex member 62 is provided on the upper surface of the mounting substrate 1 on the upper side, right side, and left side of the covering member 8 which is substantially rectangular in plan view. As Figure 1C and Figure 1D shown, the second convex member 62 is formed in such a manner that the height-direction position H2 at its upper end is higher than the height-direction position H1 at the upper surface of the light-emitting element 2 and lower than the height-direction position H3 at the upper end of the first convex member 61.

[0105] In addition, the upper end of the second convex member 62 is covered by the covering member 8, and the second convex member 62 is formed to be harder than the material of the covering member 8.

[0106] By using a resin different from that of the covering member 8 for the second convex member 62 or increasing the amount of filler contained in the resin, the viscosity of the second convex member 62 before curing is adjusted to be higher than the viscosity of the covering member 8 before curing. Thereby, the hardness of the cured second convex member 62 can be made higher than the hardness of the cured covering member 8.

[0107] In addition, similar to the first convex member 61, the second convex member 62 can use the above-mentioned transparent resin, white resin, or black resin.

[0108] It should be noted that in the manufacturing method of the light-emitting device 100 described later, the second convex member 62 is disposed between the light-emitting elements 2 that are adjacent to each other across the imaginary line (i.e., the boundary line) that divides the light-emitting device 100 within the region of the first convex member 61 formed as the above-mentioned frame body on the aggregate substrate which is an aggregate of a plurality of mounting substrates 1. By disposing the second convex member 62 between the light-emitting elements 2 that are adjacent to each other across the boundary line of a plurality of light-emitting devices 100, compared with the case where the second convex member 62 is not disposed, when forming the covering member 8, a decrease in the liquid level of the liquid (i.e., uncured) resin material can be suppressed. In addition, by disposing the second convex member 62, the position of the upper surface of the covering member 8 can be increased, and the occurrence of depressions (so-called "shrinkage holes") caused by the curing shrinkage of the resin material can be effectively suppressed. In addition, when the light-emitting device 100 is made into a single chip, since a part of the covering member 8 that should be cut in the thickness direction is replaced with the second convex member 62 that is harder than the material of the covering member 8, it can be cut into a more stable shape.

[0109] The hardness of the covering member 8 and the second convex member 62 can be compared, for example, by using the Shore A hardness value measured by a Type A durometer and the Shore D hardness value measured by a Type D durometer when the covering member 8 and the second convex member 62 are made of a resin material. For example, the Shore A hardness of the cured covering member 8 is A50 to A65, and the Shore A hardness of the cured second convex member 62 is A70 to A85. In this case, it can be said that the material of the second convex member 62 is harder than the material of the covering member 8.

[0110] (Underfill)

[0111] The underfill 7 is filled into the space between the upper surface of the mounting substrate 1 and the lower surface of the light-emitting element 2, and is set to a height that covers a part of the side surface of the light-emitting element 2. The underfill 7 is preferably formed of a white resin having reflectivity by incorporating particles of a light-emitting substance in a resin having good light transmittance such as silicone resin or epoxy resin. As the reflective substance, for example, titanium oxide, aluminum oxide, zinc oxide, barium carbonate, barium sulfate, boron nitride, aluminum nitride, glass filler, etc. can be preferably used.

[0112] (Covering member)

[0113] The covering member 8 is a member that is provided in the region surrounded by the first convex member 61 and covers the side surfaces of the light-emitting element 2 and the light-transmitting member 3. The covering member 8 is provided to seal the light-emitting element 2 to protect the light-emitting element 2 from external forces, dust, gas, etc., and to improve the heat resistance, weather resistance, and light resistance of the light-emitting element 2, etc.

[0114] In addition, the covering member 8 preferably has light-shielding properties.

[0115] When the covering member 8 has reflectivity as a light-shielding property, the light emitted from the side surfaces of the light-emitting element 2 and the light-transmitting member 3 can be reflected and emitted from the light-emitting surface of the light-emitting device, that is, the upper surface of the light-transmitting member 3. Therefore, the light extraction efficiency of the light-emitting device 100 can be improved.

[0116] When the covering member 8 has light-absorbing properties as a light-shielding property, the light emitted from the side surfaces of the light-emitting element 2 and the light-transmitting member 3 can be absorbed to suppress light extraction from surfaces other than the light-emitting surface. Therefore, a light-emitting device 100 can be formed in which the brightness difference between the light-emitting portion (the light-emitting surface of the light-emitting device) and the non-light-emitting portion (the upper surface of the covering member 8) is clear and the light emission color unevenness is small.

[0117] In addition, near the light-transmitting member 3 made of YAG glass or the like, if the difference in the thermal expansion rate between these members is large, stress will be generated and cracks will easily occur. Therefore, the covering member 8 preferably uses a soft resin with low elasticity and good shape followability.

[0118] As the material of the covering member 8, a resin material having good transparency and insulation properties, such as a thermosetting resin such as epoxy resin or silicone resin, is preferably used. In addition, by dispersing particles of the same reflective substance as the material used in the bottom filling 7 in the resin serving as the matrix to form a white resin, its reflectivity can be imparted. Further, by dispersing particles of a light-absorbing substance such as carbon black or graphite in the resin serving as the matrix to form a black resin, its light-absorbing property can be imparted.

[0119] In addition, the covering member 8 is preferably made of the same type of resin as the first convex member 61, the second convex member 62, and the bottom filling 7. By using the same type of resin as these members, the close adhesion between the respective members can be improved.

[0120] [Manufacturing method of light-emitting device]

[0121] Next, with reference to Figures 2 to 10C the manufacturing method of the light-emitting device according to the first embodiment will be described.

[0122] In Figure 3A only the external connection portion 12a of the wiring 12 is described, and the wiring pattern extending from the external connection portion 12a to the support member 11 is omitted. In Figures 3A to 10C the imaginary lines BD1, BD2, and BD3 that divide the formation-predetermined regions of the plurality of light-emitting devices 100, that is, the boundary lines, are indicated by dashed lines. Figure 6 And Figure 9 are views showing a part of the region on the collective substrate 10 removed.

[0123] The manufacturing method of the light-emitting device according to the present embodiment includes: a collective substrate preparation step S11, a light-emitting element mounting step S12, a light-transmitting member arrangement step S13, a convex member arrangement step S14, a bottom filling formation step S15, a covering member formation step S16, and a singulation step S17.

[0124] In addition, the convex member arrangement step S14 includes a first convex member arrangement step S141 and a second convex member arrangement step S142.

[0125] The collective substrate preparation step S11 is a step of preparing a collective substrate 10 in which a plurality of mounting substrates 1 are continuously formed. The collective substrate 10 can be manufactured by forming a wiring 12 having a predetermined pattern on a flat support member 11 having an area of the size of a plurality of light-emitting devices.

[0126] The wiring 12 can be formed by attaching metal foils such as Cu and Al, applying metal powder pastes such as Cu and Ag, plating Cu, etc. In addition, the wiring 12 can be patterned by an etching method, a printing method, or the like.

[0127] In addition, the collective substrate preparation process S11 is not limited to manufacturing the collective substrate 10 by the above method, and also includes obtaining it by purchase or the like.

[0128] The light-emitting element mounting process S12 is a process of mounting a plurality of light-emitting elements 2 on the collective substrate 10. For the light-emitting element 2 of the present embodiment, metal bumps are provided in advance as bonding members 51 on the electrodes of the light-emitting element, and the light-emitting element 2 is flip-chip mounted at a specified position on the wiring 12 by an ultrasonic bonding method. In addition, in this process, the protection element 4 is also mounted on the collective substrate 10.

[0129] In addition, the mounting method is not particularly limited. For example, solder paste can also be used as the bonding member 51, and the light-emitting element 2 can be mounted by a reflow soldering method.

[0130] In the present embodiment, for each formation predetermined area of the light-emitting device divided by the boundary line BD1, the boundary line BD2, and the boundary line BD3, four light-emitting elements 2 and four protection elements 4 are mounted. Here, the boundary lines BD1 and BD2 are imaginary lines in the long side direction that divide the formation predetermined area of the light-emitting device, and the boundary line BD3 is an imaginary line in the short side direction that divides the formation predetermined area of the light-emitting device. As shown in the arrangement position of the external connection portion 12a of the wiring 12, the formation predetermined areas of the light-emitting devices arranged in the short side direction ( Figure 3A longitudinally in this case) are arranged in such a manner that the orientation in the up-down direction alternates in each row. That is, in the present embodiment, the formation predetermined areas of the light-emitting devices are arranged to be substantially line-symmetric with the boundary line BD2 as the axis of symmetry in a top view. Therefore, the light-emitting elements 2 are arranged on the collective substrate 10 to be substantially line-symmetric with the boundary line BD2 as the axis of symmetry.

[0131] In each formation predetermined area of the light-emitting device, four light-emitting elements 2 having a substantially square top view shape are arranged in a row along the length direction at the substantially central portion in the short side direction. In addition, the four protection elements 4 are located at the substantially center of each light-emitting element 2 in the long side direction ( Figure 3A transversely in this case), and are arranged on the opposite side of each light-emitting element 2 in the short side direction ( Figure 3A longitudinally in this case) opposite to the side where the external connection portion 12a is provided.

[0132] The light-transmissive member arrangement process S13 is a process of arranging at least one light-transmissive member 3 for each light-emitting device on the upper surfaces of the plurality of light-emitting elements 2. The light-transmissive member 3 is bonded to the light-emitting element 2 using a bonding member 52 such as a light-transmissive resin.

[0133] In addition, when the light-transmissive member 3 is joined to each of the plurality of light-emitting elements 2 one by one, the light-emitting element mounting step S12 and the light-transmissive member step S13 may be alternately performed until a predetermined number of light-emitting elements 2 and light-transmissive members 3 are respectively mounted. That is, the light-transmissive member 3 may also be joined to the upper surface of each light-emitting element 2 when one light-emitting element 2 is mounted. Thereby, the time from mounting the light-emitting element 2 to joining the light-transmissive member 3 can be shortened, and the possibility of foreign matters such as dust being mixed into the upper surface of the light-emitting element 2 can be reduced.

[0134] The convex member arranging step S14 is a step of arranging the first convex member 61 and the second convex member 62 in a predetermined area on the collective substrate 10. This step includes a first convex member arranging step S141 and a second convex member arranging step S142. However, when a plurality of first convex members 61 are arranged on one collective substrate 10, the first convex member arranging step S141 and the second convex member arranging step S142 may also be alternately performed.

[0135] The first convex member arranging step S141 is a step of arranging the first convex member 61 that surrounds the plurality of light-emitting elements 2 to be arranged on the collective substrate 10 on the upper surface of the collective substrate 10. The first convex member 61 is arranged on the upper surface of the collective substrate 10 so as to surround the outer edge of the area where the light-emitting elements 2 are arranged.

[0136] The first convex member 61 is provided as a frame for the following purpose, that is, in the covering member forming step S16, when supplying the uncured resin material for forming the covering member 8, it blocks the spread of the resin material on the upper surface of the collective substrate 10.

[0137] Taking the upper surface of the mounting substrate 1 as a reference, the first convex member 61 is formed such that its upper end is higher than the upper surface of the light-emitting element 2 and also higher than the upper end of the second convex member 62. Thereby, when supplying the uncured resin material for forming the covering member 8 into the area surrounded by the first convex member 61, it can be filled in such a manner that the liquid level of the resin material is higher than the upper surface of the light-emitting element 2.

[0138] In addition, taking the upper surface of the mounting substrate 1 as a reference, the first convex member 61 is preferably formed such that its upper end is lower than the upper surface of the light-transmissive member 3. Thereby, when supplying the uncured resin material for forming the covering member 8, it is possible to suppress the resin material from climbing up to the upper surface of the light-transmissive member 3 and obstructing the light emission. In addition, since the first convex member 61 is lower than the upper surface of the light-transmissive member 3, it is possible to suppress the brightness unevenness caused by the light emitted from the upper surface of the light-transmissive member 3 being reflected by the upper surface of the covering member 8.

[0139] The first convex member 61 is arranged along the outer edge of the formation predetermined area of the covering member 8 in the formation predetermined area of each of a predetermined number of light-emitting devices 100.

[0140] As Figure 5A shown, in the present embodiment, in each area of the formation predetermined areas of eight light-emitting devices 100 in total, four horizontally and two vertically, the first convex member 61 is arranged so as to surround the periphery of the 32 light-emitting elements 2 installed in the formation predetermined areas of the eight light-emitting devices 100. Further, in the present embodiment, three first convex members 61 are arranged on the upper surface of one collective substrate 10.

[0141] The first convex member 61 is preferably formed of a thermosetting resin. In this case, first, by using a dispensing device or the like, the resin material is arranged on the upper surface of the collective substrate 10 in a manner of depicting the resin material along the outer edge of the area constituted by the formation predetermined areas of a predetermined number of covering members 8. The viscosity of the uncured resin material used at this time is adjusted to a suitable viscosity suitable for the width and height so that the upper end of the arranged resin material can be formed higher than the upper surface of the light-emitting element 2. Thereafter, a heat treatment is performed to cure the resin material, thereby forming the first convex member 61.

[0142] Further, the viscosity of the uncured resin material can be adjusted by the amount of solvent used in the resin material or the addition amount of an appropriate filler.

[0143] Further, in this step, arranging the first convex member 61 includes the case of arranging the uncured or preferably temporarily cured resin material, and is not limited to the case of being completed to full cure.

[0144] The second convex member arranging step S142 is a step of arranging the second convex member 62 between a plurality of light-emitting elements 2 on the upper surface of the collective substrate 10. In the area on the upper surface of the collective substrate 10 where the first convex member 61 is arranged, the second convex member 62 is arranged between a plurality of light-emitting elements 2 adjacent to each other across the boundary lines BD2 and BD3 dividing the formation predetermined areas of the light-emitting devices 100.

[0145] The second convex member 62 is provided for the purpose of suppressing the lowering of the liquid level of the resin material for forming the covering member 8 provided around the light-emitting element 2 and the light-transmitting member 3 when the uncured resin material for forming the covering member 8 is supplied in the covering member forming step S16. For this purpose, the upper end of the second convex member 62 is formed higher than the upper surface of the light-emitting element 2 and lower than the upper end of the first convex member 61.

[0146] In addition, as described above, in order to prevent cracks from occurring, the covering member 8 is made of a soft resin. However, since the soft resin is soft and easily stretchable, when the covering member 8 is cut in the singulation process S17, the formation of the cut surface becomes unstable.

[0147] Therefore, at the position where the covering member 8 is cut in the singulation process S17, a second convex member 62 harder than the material of the covering member 8 is disposed at a part in the thickness direction of the covering member 8. Thereby, the stability of the shape of the cut surface can be improved.

[0148] In addition, by making the second convex member 62 lower than the outer frame, i.e., the first convex member 61, it is possible to easily fill the resin material for forming the covering member 8 into the formation predetermined regions of the respective light-emitting devices 100. That is, the covering member 8 can be supplied to a plurality of light-emitting devices 100 each having a plurality of light-emitting elements surrounded by the first convex member 61. Thereby, the manufacturing process is simplified.

[0149] Here, a specific example of the height of each member will be described.

[0150] Based on the upper surface of the integrated substrate 10, the height of the upper surface of the light-emitting element 2 is set to 170 μm, and the height of the upper surface of the light-transmissive member 3 is set to 350 μm. At this time, the height of the upper end of the first convex member 61 is preferably about 10 to 100 μm lower than the upper surface of the light-transmissive member 3. In addition, the height of the upper end of the second convex member 62 is preferably about 30 to 80 μm higher than the upper surface of the light-emitting element 2. Thereby, the lowering of the liquid level of the uncured resin material for forming the covering member 8 can be effectively suppressed.

[0151] Similar to the first convex member 61, the second convex member 62 is preferably formed of a thermosetting resin in the same method and steps.

[0152] In addition, in the singulation process S17, the second convex member 62 is formed to have an appropriate width so as to be cut by a cutting blade or the like. Therefore, the resin material is adjusted to a suitable viscosity corresponding to its width and height. In addition, an appropriate resin can be selected, or the resin material can be adjusted by containing a filler at an appropriate content rate so that the cured second convex member 62 is harder than the cured covering member 8. The viscosity of the second convex member 62 before curing can be set to, for example, 300 Pa·S or more and 500 Pa·S or less.

[0153] The first convex member 61 and the second convex member 62a can be integrally formed using the same resin material. Figure 6 This example is shown in.

[0154] First, the position that will become the contact point of the first convex member 61 and the second convex member 62a (atFigure 6 Taking the left end side (the middle is the left end side) as the starting point, while moving the nozzle of the dispensing device annularly two weeks in the order of arrows D1 to D5, the resin material is supplied, and thus the first convex member 61 is arranged. That is, the uncured resin material is supplied in a manner of overlapping two layers on the assembly substrate 10, and thus the first convex member 61 is arranged.

[0155] Next, while moving the nozzle of the dispensing device along arrow D6 from the position as the starting point of resin material supply, the resin material is supplied, and thus the second convex member 62a is arranged. That is, by supplying one layer of the uncured resin material onto the assembly substrate 10, the second convex member 62a with a height lower than that of the first convex member 61 where the resin material is overlapped in two layers is arranged.

[0156] Thereby, the first convex member 61 and the second convex member 62a with different heights can be integrally formed continuously in one stroke, and the efficiency of the process can be improved.

[0157] In addition, the supply of the resin material for forming the second convex member 62a can also be performed between the supply of the first layer (i.e., the first week) and the second layer (i.e., the second week) of the first convex member 61, or can also be performed before the supply of the first layer (i.e., the first week) of the first convex member 61. Even so, the first convex member 61 and the second convex member 62a with different heights can be continuously arranged in one stroke.

[0158] After that, the nozzle of the dispensing device is moved to supply the resin material on a plurality of boundary lines BD3, and thus the second convex member 62b is arranged.

[0159] In addition, in the present embodiment, the second convex member 62a and the second convex member 62b are arranged in the region that becomes the outer edge portion of the covering member 8 in each light-emitting device 100 except for the outer edge portion of the covering member 8 provided with the first convex member 61, but a part of it can also be omitted.

[0160] For example, when the light-transmitting member 3 is arranged near the outer edge of the light-emitting device 100, that is, when the interval between the light-transmitting members 3 sandwiching the boundary line BD3 is narrow, in the covering member forming step S16, when the uncured resin material is supplied, the decrease in the liquid level of the resin material between the light-transmitting members 3 is small. Therefore, in order to ensure the sufficient height of the covering member 8, the second convex member 62b can also be omitted.

[0161] In addition, as the resin materials for the first convex member 61 and the second convex member 62, when a thermosetting resin is used, after the first convex member 61 and the second convex member 62 that should be disposed on the assembly substrate 10 are completely arranged, a heat treatment for completely curing the first convex member 61 and the second convex member 62 can be performed. Further, as the resin material for the covering member 8 described later, when a thermosetting resin is used, after the uncured resin material for forming the covering member 8 is supplied into the region where the first convex member 61 is disposed, a heat treatment for complete curing can be performed on the first convex member 61, the second convex member 62, and the covering member 8 together. By performing the heat treatment for complete curing together, the process efficiency can be improved, and the close adhesion between the members to be completely cured can be enhanced, which is thus preferred.

[0162] The underfill formation process S15 is a process of forming the underfill 7 in such a manner as to fill the space between the lower surface of the light-emitting element 2 and the upper surface of the mounting substrate 1. The underfill 7 is preferably provided up to a height that covers a part of the side surface of the light-emitting element 2. Further, it is preferably provided in such a manner as to cover an area near the outside of the light-emitting element 2 in a top view.

[0163] The underfill 7 is preferably formed as follows: a white resin imparted with reflectivity due to containing a reflective substance is supplied to the area around the light-emitting element 2 by using a dispensing device or the like.

[0164] Although the underfill 7 can be omitted depending on the bonding method between the light-emitting element 2 and the mounting substrate 1 or the like, it is preferred because the light extracted from the lower surface side of the light-emitting element 2 is returned to the light-emitting element 2 to improve the light extraction efficiency.

[0165] In addition, although the underfill formation process S15 can be performed before the convex member arrangement process S14, it is preferably performed after the convex member arrangement process S14. By performing the convex member arrangement process S14 first, the first convex member 61, the second convex member 62, and the mounting substrate 1 can be better closely adhered without sandwiching the underfill 7.

[0166] The covering member formation process S16 is a process of forming the covering member 8 in the region surrounded by the first convex member 61 after the convex member arrangement process S14. The covering member 8 is formed to cover the side surfaces of the light-emitting element 2 and the light-transmitting member 3.

[0167] The covering member 8 of the present embodiment is formed of a white resin that uses a resin with translucency and contains particles of a reflective substance as a light-shielding substance. However, depending on the purpose, it may also contain a wavelength conversion substance or coloring particles for adjusting the hue, a filler for adjusting the viscosity, or other fillers as a substitute or supplement for the reflective substance. Additionally, a black resin containing particles of a light-absorbing substance may be used.

[0168] As the resin, a thermosetting resin is preferably used. In this case, an uncured resin material containing the above-mentioned filler according to the purpose can be supplied into the area where the first convex member 61 is disposed by a casting method using a dispensing device, and heat treatment is performed to cure the thermosetting resin, thereby forming the covering member 8.

[0169] In addition, the viscosity and supply amount of the uncured resin material for forming the covering member 8 are adjusted so that the resin material covers the side surface of the translucent member 3, preferably covers up to its upper end, covers the upper end of the second convex member 62, bulges without exceeding the upper surface of the translucent member 3, and does not overflow from the outer frame, i.e., the first convex member 61, that restricts the expansion of the resin material. The viscosity of the covering member 8 before curing can be set, for example, to 1 Pa·s or more and 20 Pa·s or less.

[0170] Between the translucent member 3 disposed at the end in the long side direction (lateral direction) and the outer frame, i.e., the first convex member 61 (see Figure 8A ), or between the translucent members 3 adjacent in the short side direction (longitudinal direction) (see Figure 8B ), when the distance between the members that restricts the liquid level height of the uncured resin material is long like this, it is preferable to dispose the second convex members 62 (62a, 62b). Thereby, the liquid level of the uncured resin material disposed between the translucent members 3 can be set to not be lower than the upper end of the second convex member 62.

[0171] In addition, when the light-emitting device 100 includes other semiconductor elements in addition to the light-emitting element 2 having a certain height such as the protection element 4, it is preferable to dispose the other semiconductor elements near the translucent member 3. Thereby, it is possible to suppress the liquid level of the resin material from dropping near the side surface of the translucent member 3. By cooperating with the disposition of the second convex members 62, disposing other semiconductor elements between the translucent members 3 with a large distance can more effectively suppress the lowering of the liquid level of the uncured resin material.

[0172] In addition, in the present embodiment, from Figure 9Near a boundary line BD2 of a formation predetermined area of a light-emitting device that is adjacently divided in the vertical direction, an uncured resin material for forming a covering member 8 is supplied. In this way, the uncured resin material is preferably supplied from a position separated from any of the light-transmissive members 3 within the area where the first convex member 61 is disposed. Thereby, when the uncured resin material is supplied, it is possible to prevent the resin material from adhering to the upper surface of the light-transmissive member 3.

[0173] In addition, as Figure 9 shown by the arrow marks in, while moving the nozzle of the dispensing device in a manner such that it continuously bends across both sides of the formation predetermined area of the light-emitting device with the second convex member 62a disposed along the boundary line BD2 interposed therebetween, the uncured resin material is supplied from above. In this way, while the nozzle supplies the resin material, it moves in a manner that continuously bends across the boundary line BD2, whereby it is possible to continuously supply the resin material to a plurality of areas sandwiching the boundary line BD2. The position of the upper end of the second convex member 62a on the boundary line BD2 is lower than the position of the upper end of the first convex member 61, so the uncured resin material for forming the covering member 8 buries the second convex member 62 and is uniformly disposed within the area surrounded by the first convex member 61. In this way, it is possible to uniformly supply the resin material within each formation predetermined area of the light-emitting device surrounded by the first convex member 61.

[0174] In addition, by supplying the uncured resin material along the direction (the extending direction of the boundary line BD2) in which the formation predetermined area of more light-emitting devices is divided, it is possible to reduce the movement amount of the nozzle of the dispensing device and shorten the time of this process.

[0175] The singulation process S17 is a process of dividing the covering member 8, the second convex member 62, and the assembly substrate 10 at a position including the second convex member 62. The division of the light-emitting device 100 is preferably performed by cutting using a cutting blade. In the cutting area, a second convex member 62 (62a, 62b) harder than the material of the covering member 8 is provided in the lower layer portion of the covering member 8, so compared with the case where only the covering member 8 is formed, it is possible to perform the division in a stable shape.

[0176] In addition, when a material such as ceramics, which has different properties from resin, is used as the support member 11 of the mounting substrate 1, when singulating the light-emitting device 100, the process can also be divided into cutting the resin layer composed of the covering member 8 and the second convex member 62 and cutting the assembly substrate 10, and cutting is performed using cutting blades suitable for them respectively.

[0177] Alternatively, the end portion of the collective substrate 10 may be retained and cut. In this way, the light-emitting device 100 is connected until both the boundary lines BD1 and BD2 extending in the lateral direction and the boundary line BD3 extending in the longitudinal direction are cut, so it is easy to handle.

[0178] In addition, in the present embodiment, although the cutting order may start from any one of the boundary lines BD1, BD2, and BD3, it is preferably to start dividing from a boundary line that is difficult to cut, such as a region where a relatively soft material is used due to differences in materials or environment, or a region that is asymmetric with respect to the boundary line. Thereby, the division can be performed with higher precision.

[0179] By performing the above steps, the light-emitting device 100 can be manufactured.

[0180] <Modification Example>

[0181] Next, with reference to Figure 11A and Figure 11B a light-emitting device according to a modification example of the above-described first embodiment will be described.

[0182] Figure 11A is a perspective view showing the configuration of a light-emitting device according to a modification example of the first embodiment. Figure 11B is a plan view showing the configuration of a light-emitting device according to a modification example of the first embodiment.

[0183] In the light-emitting device 100A of this modification example, all sides (four sides) of the outer edge of the rectangular covering member 8A are made to coincide with the outer edge of the mounting substrate 1A in a top view. Therefore, the second convex members 62 (62a, 62b) are provided along all sides of the outer edge of the mounting substrate 1A.

[0184] In addition, in the light-emitting device 100A of the modification example, four light-emitting elements 2 are arranged in a row in the same manner as in the light-emitting device 100, but instead of four light-transmitting members 3, one light-transmitting member 3A is provided, and the light-transmitting member 3A has a horizontal length that completely includes the upper surfaces of the four light-emitting elements 2. In this way, it is possible to configure the number of light-emitting elements and the number of light-transmitting members to be different.

[0185] In addition, when the external connection portion is not provided on the upper surface of the mounting substrate 1A as in this modification example, the external connection portion of the mounting substrate 1A can be provided so as to be exposed on the back side of the mounting substrate 1A, for example. The wiring portion for mounting the light-emitting element 2 and the protection element 4 can be provided in the same manner as the above-described mounting substrate. In addition, the wiring portion provided on the upper surface side of the mounting substrate 1A and the external connection portion provided on the lower surface side can be configured such that, for example, a through hole that penetrates the support member in the thickness direction is provided, and a conductive material such as metal is filled in the through hole to make it conductive.

[0186] The light-emitting device 100A of the modified example can be manufactured by changing the manufacturing method of the above-described light-emitting device 100 as follows.

[0187] In the collective substrate preparation step S11, a collective substrate in a state where the mounting substrate 1A having the above-described configuration is connected is prepared.

[0188] In the light-transmissive member arrangement step S13, one light-transmissive member 3A is joined to the upper surfaces of a specified number (four) of light-emitting elements 2.

[0189] In the first convex member arrangement step S141, Figure 5A The first convex member 61 is arranged so as to further surround from the outside the region surrounded by the upper end boundary line BD1 and the lower end boundary line BD2, and the left end boundary line BD3 and the right end boundary line BD3. That is, one first convex member 61 is arranged as an outer frame for supplying an uncured resin material for forming the covering member 8A. Then, in the second convex member arrangement step S142, the second convex member 62 is arranged along the boundary line BD1, the boundary line BD2, and the boundary line BD3 within the region where the first convex member 61 is arranged. That is, the second convex member 62 is arranged on all the boundary lines that divide the formation planned regions of the respective light-emitting devices.

[0190] In the singulation step S17, the covering member 8A, the second convex member 62, and the mounting substrate 1 are cut along the boundary line BD1, the boundary line BD2, and the boundary line BD3, thereby singulating the light-emitting device 100A.

[0191] The other steps are carried out in the same manner as the manufacturing method of the light-emitting device 100, whereby the light-emitting device 100A can be manufactured.

[0192] <Second Embodiment>

[0193] [Configuration of Light-Emitting Device]

[0194] Next, Figure 12A and Figure 12B the light-emitting device of the second embodiment will be described.

[0195] Figure 12A is a plan view showing the configuration of the light-emitting device of the second embodiment. Figure 12B is a cross-sectional view showing the configuration of the light-emitting device of the second embodiment, showing Figure 12A the cross-section taken along line XIIB - XIIB of

[0196] In addition, Figure 12A the cross-section taken along line ID - ID of Figure 1D is substantially the same as the cross-section of the light-emitting device 100 shown in

[0197] The light-emitting device 100B of the second embodiment is different from the light-emitting device 100 of the first embodiment in that it does not have the second convex member 62b at the end in the long side direction (the lateral direction in Figure 12A ), is provided with a bottom filling member 7B instead of the bottom filling member 7, and is provided with a covering member 8B instead of the covering member 8.

[0198] In addition, the bottom filling member 7B and the covering member 8B can be formed of the same materials as the bottom filling member 7 and the covering member 8, respectively.

[0199] Regarding the second convex member 62B in this embodiment, one end in the short side direction (the longitudinal direction in Figure 12A ) of the light-emitting device 100B is provided with the second convex member 62a, but the second convex member 62b is not provided at the lateral end of the light-emitting device 100B (see Figure 1C ).

[0200] As described above, the second convex members 62a and 62b are used to suppress the "shrinkage holes" of the resin in the covering member forming step S16 during manufacturing (see Figure 2 ), but since the intervals between the light-emitting elements 2 and between the light-transmitting members 3 are narrowed, the "shrinkage holes" of the resin can be suppressed even if they are omitted.

[0201] The light-emitting device 100B of this embodiment omits the second convex member 62b by narrowing the intervals between the light-emitting elements 2 and between the light-transmitting members 3 arranged with the lateral boundary line BD3 (see Figure 13B ) in between.

[0202] For example, when the viscosity of the resin is about 1 to 20 Pa·s, as a standard, when the interval between the light-transmitting members 3 is less than or equal to about half of the side length of the light-transmitting member 3, the arrangement of the second convex member 62b can be omitted.

[0203] More specifically, in order to omit the arrangement of the second convex member 62b, the interval between the light-transmitting members 3 is preferably about 800 μm or less, and more preferably about 400 μm to 600 μm.

[0204] The bottom filling member 7B is filled in the space between the upper surface of the mounting substrate 1 and the lower surface of the light-emitting element 2. The bottom filling member 7B is provided to a height covering the vicinity of the upper end of the side surface of the light-transmitting member 3 between the light-emitting elements 2 and between the light-transmitting members 3. In addition, the bottom filling member 7B is provided to a height covering the vicinity of the upper end of the side surface of the light-emitting element 2 at the lateral end of the light-emitting device 100B.

[0205] In addition, at the lateral end of the light-emitting device 100B, the bottom filler 7B only needs to fill the space between the upper surface of the mounting substrate 1 and the lower surface of the light-emitting element 2, and can also be set to a height that covers a part of the side surface of the light-emitting element 2.

[0206] The covering member 8B is a member that covers the side surfaces of the light-emitting element 2 and the light-transmitting member 3, and seals the light-emitting element 2 together with the bottom filler 7B. In addition, the covering member 8B and the bottom filler 7B can suppress light leakage from the side surfaces of a set of the light-emitting element 2 and the light-transmitting member 3 to the side surfaces of other adjacent sets of the light-emitting element 2 and the light-transmitting member 3.

[0207] The covering member 8B is disposed between the light-transmitting members 3 so as to overlap the bottom filler 7B, and is set to a height that covers the side surface of the light-transmitting member 3 to approximately the upper end. In the present embodiment, since the second convex member 62B is not provided at the lateral end of the light-emitting device 100B, the covering member 8B is set to a height that covers approximately the upper end of the side surface of the light-transmitting member 3 from the upper surface of the mounting substrate 1 at the lateral end of the light-emitting device 100B.

[0208] In addition, at the lateral end of the light-emitting device 100B, the bottom filler 7B may be provided on the upper surface of the mounting substrate 1. In this case, the covering member 8B is disposed to overlap the bottom filler 7B.

[0209] In addition, in the light-emitting device 100B of the present embodiment, at the longitudinal end, similarly to the bottom filler 7 and the covering member 8 of the light-emitting device 100 of the first embodiment, the bottom filler 7B and the covering member 8B are provided in the region sandwiched between the first convex member 61 and the second convex member 62a.

[0210] Both the bottom filler 7B and the covering member 8B are formed of a resin material, but cracks may occur in the region in contact with the light-emitting element 2 and the light-transmitting member 3 due to light or thermal stress from the light-emitting element 2 and the light-transmitting member 3. In particular, light and heat from two directions are concentrated between the light-emitting elements 2 and between the light-transmitting members 3, so cracks are more likely to occur. In the present embodiment, the bottom filler 7B on the lower layer side is disposed between the light-emitting elements 2 and between the light-transmitting members 3 so as to cover the side surface of the light-transmitting member 3, and the covering member 8B on the upper layer side is disposed so as to cover the bottom filler 7B and be in contact with the vicinity of the upper end of the light-transmitting member 3.

[0211] Here, an interface of a substance is formed between the base material filling member 7B and the covering member 8B. Therefore, even if cracks occur in the base material filling member 7B, the development of the cracks stops at the interface between the base material filling member 7B and the covering member 8, so it is difficult for the covering member 8 to generate cracks. That is, it is difficult for the cracks to develop to the surface of the light-emitting device 100B, so the function as a sealing member or a light-shielding member composed of the base material filling member 7B and the covering member 8B can be maintained.

[0212] In addition, by setting the refractive indices of the base material filling member 7B and the covering member 8B to be different, an optical interface can be formed between the light-transmitting members 3, near the upper ends of the light-transmitting members 3, and between the base material filling member 7B and the covering member 8B. Furthermore, since capillary action is utilized when forming the base material filling member 7B, the interface is formed to be bent downward. Therefore, the light emitted from the side surface of one light-transmitting member 3 and passing horizontally through the base material filling member 7B can be reflected downward at the interface.

[0213] That is, the light emitted from the side surface of one light-transmitting member 3 is difficult to propagate to the adjacent light-transmitting member 3. Therefore, when independently controlling the light emission of a plurality of light-emitting elements 2, the independence of the brightness of the light-emitting surface can be improved.

[0214] Considering the above control of crack development and suppression of light passing through to adjacent light-emitting surfaces, the base material filling member 7B preferably covers at least a part of the opposite side surfaces of the adjacent light-transmitting members 3 between the light-emitting elements 2 and between the light-transmitting members 3, and more preferably is provided to a height that covers the upper end vicinity of the side surface of the light-transmitting member 3. In addition, at this time, the interface between the base material filling member 7B and the covering member 8B is preferably a curved surface protruding toward the mounting substrate 1 side.

[0215] In addition, since the base material filling member 7B is provided below the light-emitting elements 2, between the light-emitting elements 2, and between the light-transmitting members 3, thermal stress is likely to occur. Therefore, in order to suppress the generation of cracks, the base material filling member 7B is preferably lower in elasticity (softer) than the covering member 8B.

[0216] In addition, when cutting with a cutting blade or the like, the lower the elasticity (softer) of the resin, the more likely resin burrs are to be generated. The base material filling member 7B and the covering member 8B disposed near the lateral ends of the light-emitting device 100B are cut in the singulation process S17 (refer to Figure 2 ). Therefore, the base material filling member 7B is preferably not disposed near the lateral ends, but can also be disposed near the lateral ends in the form of a thin film to such an extent that resin burrs are not substantially generated during cutting. In addition, the thickness of such a thin film is, for example, a thickness equal to or less than that of the wiring 12 of the mounting substrate 1, and more specifically, is preferably 10 μm or less.

[0217] Method for manufacturing a light-emitting device

[0218] Next, with reference to Figure 2 , Figure 13A and Figure 13B the method for manufacturing the light-emitting device 100B of the second embodiment will be described.

[0219] Figure 13A is a cross-sectional view showing the underfill formation process in the method for manufacturing the light-emitting device of the second embodiment, showing a cross-section at a position corresponding to the XIIB-XIIB line of Figure 12A . Figure 13B is a cross-sectional view showing the cover member formation process in the method for manufacturing the light-emitting device of the second embodiment, showing a cross-section at a position corresponding to the XIIB-XIIB line of Figure 12A .

[0220] The light-emitting device 100B of the second embodiment can be manufactured by changing the method for manufacturing the light-emitting device 100 of the first embodiment shown in Figure 2 as follows.

[0221] In the light-emitting element mounting process S12 and the light-transmitting member arranging process S13, the light-emitting element 2 and the light-transmitting member 3 separated by the boundary line BD3 are arranged on the assembly substrate 10 at an interval that can omit the second convex member 62b.

[0222] In the convex member arranging process S14, a first convex member arranging process S141 and a second convex member arranging process S142 are performed. In the present embodiment, in the second convex member arranging process S142, the second convex member 62a is arranged on the boundary line BD2 on the upper surface of the assembly substrate 10, and the second convex member 62b is not arranged on the boundary line BD3.

[0223] In addition, in the first convex member arranging process S141, as shown in Figure 13A , the first convex member 61 is arranged such that an interval is formed between the light-emitting element 2 and the light-transmitting member 3 arranged at the lateral end of the assembly substrate 10 and the first convex member 61, which allows the uncured resin for forming the cover member 8B to be filled well. This interval is the same as the interval between the light-transmitting members 3 separated by the boundary line BD3.

[0224] In the base material filling member forming step S15, uncured resin, which is the material constituting the base material filling member 7B, is filled between the light-emitting elements 2 and the collective substrate 10, between the light-emitting elements 2, and between the light-transmissive members 3. By supplying uncured resin, which has been adjusted to an appropriate viscosity, around the light-emitting elements 2, the resin can be filled near the upper ends of the light-transmissive members 3 in these spaces by capillary action. In addition, a space for disposing the covering member 8B is left at the uppermost part of these spaces. Thereafter, the resin is cured by heat treatment, whereby the base material filling member 7B can be formed. The base material filling member forming step S15 is performed before the covering member forming step S16.

[0225] Since the base material filling member 7B is filled between the light-emitting elements 2 and the mounting substrate 1, thermal stress caused by heat from the light-emitting elements 2 is likely to occur. Therefore, in order to suppress the generation of cracks, it is preferable to use a resin having a lower elasticity, that is, a softer resin, for the base material filling member 7B than for the covering member 8B. For example, when the Shore A hardness of the cured covering member 8B is set to A60, the Shore A hardness of the cured base material filling member 7B can be set to about A50.

[0226] On the other hand, the lower the elasticity of the resin, the more likely resin burrs are to be generated when cutting is performed by a cutting method or the like, and the more difficult it is to stabilize the shape of the cut surface. Therefore, it is preferable not to form the base material filling member 7B on the cutting line, that is, the boundary line BD3. In addition, even when the base material filling member 7B is formed on the boundary line BD3, it is preferably formed as a thin film having a thickness equal to or less than that of the wiring 12 described above. Thereby, it is possible to suppress defects such as the generation of resin burrs.

[0227] In the covering member forming step S16, an uncured resin material for forming the covering member 8B is supplied to the upper layer portions of the spaces between the light-emitting elements 2 and between the light-transmissive members 3, and to the spaces sandwiching the boundary line BD3. Thereafter, the resin is cured by heat treatment, whereby the covering member 8B can be formed.

[0228] In the singulation step S17, the covering member 8B, the second convex member 62b, and the collective substrate 10 are cut along the boundary line BD2 (see Figure 10A ) and the boundary line BD3. Since the softer base material filling member 7B than the covering member 8B is not provided on the boundary line BD3, cutting can be performed in a stable shape. In addition, as in the first embodiment, since the harder second convex member 62a than the material of the covering member 8B is provided on the boundary line BD2, cutting can be performed in an even more stable shape.

[0229] By performing the above steps, the light-emitting device 100B can be manufactured.

[0230] As described above, the light-emitting device and the method for manufacturing the same according to the present invention have been described by the mode for carrying out the invention, but the gist of the present invention is not limited to these descriptions and must be broadly interpreted based on the descriptions in the claims. In addition, various changes, alterations, etc. made based on these descriptions are clearly included in the gist of the present invention.

[0231] Industrial Applicability

[0232] The light-emitting device according to the embodiment of the present invention can be used for various lighting fixtures such as LED bulbs or spotlights, backlight sources such as liquid crystal displays, large displays, various display devices such as advertisements or destination guides, and various light sources such as various image reading devices such as digital cameras, fax machines, copiers, scanners, and projection devices.

Claims

1. A light-emitting device, comprising: a substrate; a plurality of light-emitting elements mounted on the substrate; a light-transmissive member respectively disposed on the upper surfaces of the plurality of light-emitting elements; an underfill that covers at least a part of the opposite side surfaces of the light-transmissive members, the opposite side surfaces of the light-emitting elements, and the upper surface of the substrate between the light-transmissive members; a covering member that covers the upper surface of the underfill and is harder than the underfill; a first convex member and a second convex member that sandwich the plurality of light-emitting elements, the underfill, and the covering member on the substrate; the covering member is substantially rectangular in plan view, the first convex member is disposed on one side of the rectangle, and the second convex member is disposed at least on the other side opposite to the first convex member; the height-direction position at the upper end of the second convex member is higher than the height-direction position at the upper surface of the light-emitting element and lower than the height-direction position at the upper end of the first convex member; the second convex member is harder in material than the covering member; in plan view, at least a part of the outer edge of the covering member coincides with the outer edge of the substrate.

2. The light-emitting device according to claim 1, wherein the covering member covers the upper end of the second convex member.

3. The light-emitting device according to claim 1, wherein the second convex member is disposed along the outer edge of the substrate.

4. The light-emitting device according to any one of claims 1 to 3, wherein the interface between the underfill between the light-transmissive members and the covering member has a curved surface protruding toward the substrate side.

5. The light-emitting device according to any one of claims 1 to 3, wherein the underfill is also disposed between the light-emitting element and the substrate.

6. The light-emitting device according to any one of claims 1 to 3, wherein the thickness of the film of the underfill disposed at the outer edge of the covering member that coincides with the substrate is 10 μm or less.

7. The light-emitting device according to any one of claims 1 to 3, wherein the underfill contains a light-reflective substance.

8. The light-emitting device according to any one of claims 1 to 3, wherein the light-transmissive member contains a phosphor.

9. The light-emitting device according to any one of claims 1 to 3, wherein a light-transmissive bonding member is provided between the light-emitting element and the light-transmissive member.

10. The light-emitting device according to any one of claims 1 to 3, wherein the substrate includes a flat support member and wirings disposed on the upper surface of the support member, and a part of the wirings is exposed from the first convex member, the second convex member, the underfill, and the covering member.

11. The light-emitting device according to any one of claims 1 to 3, wherein a protection element for protecting the light-emitting element is further provided on the substrate.

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