An ultraviolet packaging device

Abstract

The present invention relates to the field of ultraviolet LED packaging technology, and relates to an ultraviolet packaging device. The ultraviolet packaging device includes a substrate, an inner shell, an outer shell, and a lens. The inner shell is arranged around the substrate, the inner surface of the inner shell is attached to the upper surface of the substrate, the inner shell forms a mounting groove on the upper surface of the substrate, the outer shell is arranged around the outside of the substrate and the inner shell, and is attached to the upper surface of the inner shell, the outer shell is provided with a lens above the inner shell, and the lens seals the mounting groove, wherein the ultraviolet LED is arranged in the mounting groove, and the inner shell and the outer shell are formed of ultraviolet reflective material. By coating the substrate with the inner shell and the outer shell layer by layer, a narrow mounting groove is formed on the substrate, so that the ultraviolet LED is arranged in the mounting groove, the absorption probability of deep ultraviolet light is reduced, the light loss is reduced, and the light extraction efficiency is improved.

Description

Technical Field

[0001] The invention relates to the technical field of ultraviolet LED packaging, and in particular to an ultraviolet packaging device. Background Art

[0002] Ultraviolet (UV) is the general term for radiation with a wavelength of 100nm to 400nm in the electromagnetic spectrum. The packaging technology of light-emitting diodes (LEDs) greatly restricts their light extraction efficiency. Ultraviolet LEDs are used in curing, ink printing, medical treatment, sterilization, disinfection and other fields, and are becoming more and more widely used in today's daily life and industrial applications.

[0003] Deep ultraviolet LEDs have attracted attention due to their potential applications in air disinfection, water purification, biochemical detection, and optical communications. However, the low light extraction efficiency of deep ultraviolet LEDs still cannot meet current application requirements.

[0004] The above contents are only used to assist in understanding the technical solution of the present application and do not constitute an admission that the above contents are prior art. Summary of the invention

[0005] The main purpose of the present invention is to provide an ultraviolet packaging device, aiming to improve the light extraction efficiency of deep ultraviolet.

[0006] To achieve the above object, the present invention provides an ultraviolet packaging device, which includes: a substrate;

[0007] An inner shell, the inner shell is disposed around the base plate, the inner surface of the inner shell is attached to the upper surface of the base plate, and a mounting groove is formed on the upper surface of the base plate;

[0008] an outer shell, the outer shell being disposed around the substrate and the inner shell and being attached to the upper surface of the inner shell, and

[0009] A lens, wherein the outer shell is provided with the lens above the inner shell, and the lens seals the mounting groove;

[0010] Wherein, the ultraviolet LED is arranged in the installation groove, and the inner shell and the outer shell are formed of ultraviolet reflective material.

[0011] Optionally, a first gap is provided between the groove wall of the mounting groove and the ultraviolet LED;

[0012] The groove wall of the mounting groove comprises a first groove wall close to the substrate and a second groove wall away from the substrate, wherein the second groove wall extends from the groove bottom of the mounting groove toward the groove opening and is inclined in a direction away from the ultraviolet LED;

[0013] A reflective layer is disposed on the surfaces of the first groove wall and the second groove wall.

[0014] Optionally, the angle α formed by the plane where the second groove wall is located and the plane where the substrate is located is 30 degrees to 75 degrees;

[0015] And / or, the first groove wall extends from the groove bottom of the mounting groove toward the groove opening and is inclined in a direction away from the ultraviolet LED, and an angle β formed by a plane where the first groove wall is located and a plane where the substrate is located is 75 degrees to 90 degrees;

[0016] And / or, the reflection layer provided on the second groove wall is a specular reflection layer or a scattering reflection layer;

[0017] And / or, the reflection layer provided on the first groove wall is a scattering reflection layer;

[0018] And / or, the ultraviolet LED is disposed on the substrate via a connecting layer, a height of the first groove wall is defined as H1, a height of the connecting layer is defined as H2, a height of the light-emitting layer of the ultraviolet LED is defined as H3, and H2≤H1≤H3 is satisfied;

[0019] And / or, define the distance between the first groove wall and the UV LED as D1, satisfying 0um <D1<50um;

[0020] And / or, a height of the inner shell on the substrate is defined as H4, a height of the ultraviolet LED on the substrate is defined as H5, and H4>H5 is satisfied;

[0021] The height of the inner shell on the substrate is H4, satisfying 200um≤H4≤600um.

[0022] Optionally, the material of the reflective layer is a mixture of one or more of BN nanoparticle material, SiO2 nanoparticle material, ZrO nanoparticle material, AlN nanoparticle material, and TiO2 nanoparticle material;

[0023] Or, the ultraviolet reflective material forming the inner shell and the outer shell is made of polytetrafluoroethylene;

[0024] Or, the material of the substrate is an inorganic insulating material, and the material of the lens is a deep ultraviolet transparent material;

[0025] Alternatively, the upper surface of the inner shell is further provided with another mounting groove on the upper surface of the substrate, the other mounting groove is covered by the outer shell attached to the upper surface of the inner shell, and a protective element is provided in the other mounting groove.

[0026] Optionally, two opposite side surfaces of the outer periphery of the inner shell are provided with a through first plug-in inlet, so that the substrate can be positioned and accommodated in the inner cavity of the inner shell through the first plug-in inlet;

[0027] A through second insertion inlet is formed on two opposite side surfaces of the outer periphery of the outer shell, so that the substrate and the inner shell are limitedly accommodated in the inner cavity of the outer shell through the second insertion inlet; or,

[0028] A first plug-in inlet is provided on a side surface of the outer periphery of the inner shell, so that the substrate can be positioned and accommodated in the inner cavity of the inner shell through the first plug-in inlet;

[0029] A second plug-in inlet is provided on one side of the outer periphery of the outer shell, so that the substrate and the inner shell are limitedly accommodated in the inner cavity of the outer shell through the second plug-in inlet.

[0030] Optionally, a slot is provided on the side surface of the substrate, the outer periphery of the inner shell is bent toward the side surface of the substrate to form a first buckle, and the outer periphery of the outer shell is bent toward the side surface of the substrate to form a second buckle, and the first buckle and the second buckle are snapped into the slot.

[0031] Optionally, the card slot includes a first card slot and a second card slot, and the first card slot and the second card slot are arranged at intervals from top to bottom on the side circumference of the substrate;

[0032] The first card slot is engaged with the first card buckle, and the second card slot is engaged with the second card buckle.

[0033] Optionally, the substrate is defined to have a left-right direction and a front-back direction perpendicular to the up-down direction, the first card slot is arranged in the left-right direction of the side circumference of the substrate, and the second card slot is arranged in the front-back direction of the side circumference of the substrate.

[0034] Optionally, the first buckle and the second buckle are snapped into the slot, the first buckle is limitedly abutted between the bottom of the slot and the second buckle, and the sum of the thickness of the first buckle and the second buckle is equal to the depth of the slot.

[0035] Optionally, a metal coating is provided on the substrate, the inner surface of the inner shell is attached to the metal coating, the ultraviolet LED is electrically connected to the metal coating, and the metal coating is used to connect the circuit;

[0036] The metal coating comprises:

[0037] A positive electrode coating, used for connecting the positive electrode of the ultraviolet LED; and

[0038] A cathode plating layer, used for connecting the cathode of the ultraviolet LED;

[0039] An isolation region is provided between the positive electrode coating and the negative electrode coating;

[0040] The metal plating layer is composed of a multi-layer plating layer, and the plating layer at least includes a copper layer and a nickel layer and a gold layer arranged on the surface of the copper layer;

[0041] The copper layer has a thickness of 50um to 100um, the nickel layer has a thickness of 3um to 6um, and the gold layer has a thickness of 0.05um to 1um;

[0042] The substrate is provided with two through holes, the two through holes are filled with conductive materials, one side of the two through holes is electrically connected to the positive electrode plating layer and the negative electrode plating layer respectively, and the other side of the two through holes is electrically connected to the metal circuit outside the substrate respectively.

[0043] The technical solution of the present invention is to sequentially arrange an inner shell and an outer shell on a substrate, the inner shell is arranged around the substrate, the inner surface of the inner shell is attached to the upper surface of the substrate, and the inner shell forms a mounting groove on the upper surface of the substrate, the outer shell is arranged around the substrate and the outside of the inner shell, and is attached to the upper surface of the inner shell, the outer shell is provided with the lens above the inner shell, and the lens seals the mounting groove; so that the inner shell and the outer shell are layered on the substrate, the inner shell and the outer shell are formed of ultraviolet reflective material, and the mounting groove is sealed by the lens, so that a narrow mounting groove is formed on the substrate, and an ultraviolet LED is arranged in the mounting groove, the narrow mounting groove helps to reduce the absorption probability of deep ultraviolet light, and the light emitted through the lens may be totally reflected due to the emission angle, so that part of the light cannot be emitted through the lens, and the light changes the angle through the lens through the setting of the mounting groove, thereby reducing the total reflection of the light in the process of being emitted through the lens, reducing light loss, and thus improving the light extraction efficiency. In addition, the inner surface of the inner shell and the outer shell is provided with a reflective layer, which can better improve the light extraction efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0045] Figure 1 It is a structural schematic diagram of an embodiment of an ultraviolet packaging device of the present invention;

[0046] Figure 2 for Figure 1 Schematic diagram of the exploded structure of the UV packaging device;

[0047] Figure 3 It is a schematic structural diagram of a top view of an embodiment of a housing of the present invention;

[0048] Figure 4 It is a schematic structural diagram of a top view of an embodiment of the inner shell combined with a substrate of the present invention;

[0049] Figure 5 It is a schematic structural diagram of a top view of an embodiment of the present invention in which an outer shell and an inner shell are combined with a substrate;

[0050] Figure 6 It is a structural schematic diagram of another embodiment of an ultraviolet packaging device of the present invention;

[0051] Figure 7 It is a structural schematic diagram of an assembled state of an embodiment of a UV packaging device of the present invention;

[0052] Figure 8 It is a structural schematic diagram of an assembled state of another embodiment of a UV packaging device of the present invention;

[0053] Fig. 9 The figure is a schematic structural diagram of another embodiment of an ultraviolet packaging device of the present invention.

[0054] Description of Figure Numbers:

[0055] Label name Label name 100 UV packaging devices 31 Mounting groove 10 substrate 311 First groove wall 11 Card slot 313 Second groove wall 111 First card slot 312 Stairs 113 Second card slot 32 First gap 13 Metal coating 33 First buckle 130 Isolation Area 34 First plug-in entry 131 Positive electrode coating 35 Another mounting groove 133 Negative electrode coating 50 shell 15 Through Hole 51 Second buckle 20 Reflective layer 54 Second plug-in port 21 First reflective layer 70 lens 24 Second reflective layer 90 UV LED 25 The third reflective layer 91 Connection Layer 27 Fourth reflective layer 93 Luminescent layer 30 Inner shell

[0056] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0057] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0058] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0059] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0060] In addition, in the present invention, descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text is to include three parallel solutions. Taking "A and / or B as an example", it includes solution A, or solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0061] Figure 1 and Figure 8 It is a schematic structural diagram of an embodiment of a UV packaging device 100 of the present invention.

[0062] Ultraviolet LED90 is widely used in sterilization, curing, ink printing, medical and other fields due to its small luminous area, high luminous efficiency, low power consumption, high-intensity radiation light intensity and other characteristics. It has gained a large market share and has high R&D value.

[0063] For example, deep ultraviolet LEDs have attracted attention due to their potential applications in air disinfection, water purification, biochemical detection, and optical communications. However, the low light extraction efficiency of deep ultraviolet LEDs still cannot meet current application requirements.

[0064] In order to improve the efficiency of ultraviolet light extraction, the present application provides an ultraviolet packaging device 100. The ultraviolet packaging device 100 includes a substrate 10, an inner shell 30, an outer shell 50, and a lens 70. The inner shell 30 is arranged around the substrate 10, the inner surface of the inner shell 30 is attached to the upper surface of the substrate 10, and a mounting groove 31 is formed on the upper surface of the substrate 10. The outer shell 50 is arranged around the substrate 10 and the inner shell 30, and is attached to the upper surface of the inner shell 30. The outer shell 50 is provided with a lens 70 above the inner shell 30, and the lens 70 seals the mounting groove 31. Among them, the ultraviolet LED 90 is arranged in the mounting groove 31, and the inner surfaces of the inner shell 30 and the outer shell 50 are provided with a reflective layer.

[0065] like Figure 1 and Figure 2 As shown, the technical solution of the present application is to sequentially arrange an inner shell 30 and an outer shell 50 on a substrate 10, wherein the inner shell 30 is arranged around the substrate 10, so that the inner surface of the inner shell 30 is attached to the upper surface of the substrate 10, and the inner shell 30 forms a mounting groove 31 on the upper surface of the substrate 10, and the outer shell 50 is arranged around the substrate 10 and the inner shell 30, and is attached to the upper surface of the inner shell 30, and the outer shell 50 is provided with a lens 70 above the inner shell 30, and the lens 70 seals the mounting groove 31; so that the inner shell 30 and the outer shell 50 are layered on the substrate 10, and the inner shell 30 and the outer shell 50 are formed of ultraviolet reflective material, and through the mirror The sheet 70 seals the mounting groove 31, so that a narrow mounting groove 31 is formed on the substrate 10, and the ultraviolet LED 90 is arranged in the mounting groove 31. The narrow mounting groove 31 helps to reduce the absorption probability of deep ultraviolet light, and the light emitted through the lens may be totally reflected due to the emission angle, so that part of the light cannot be emitted through the lens 70. Through the setting of the mounting groove 31, the light changes the angle to pass through the lens, thereby reducing the total reflection of the light in the process of being emitted through the lens 70, reducing light loss, and thus improving the light extraction efficiency. In addition, the inner surface of the inner shell 30 and the outer shell 50 is provided with a reflective layer, which can better improve the light extraction efficiency.

[0066] Since the larger the space where the ultraviolet LED 90 is located, the longer the optical path of its light emission, the greater the probability of absorption, and part of the light is lost in this process. Therefore, the present application wraps the substrate 10 layer by layer with the inner shell 30 and the outer shell 50, and forms a mounting groove 31 on the surface of the substrate 10 through the inner shell 30, which is beneficial to reducing the space of the mounting groove 31, and directly uses ultraviolet reflective material as the shell, thereby reducing the light loss of the ultraviolet LED 90 and improving the light extraction efficiency.

[0067] The inner shell 30 and the outer shell 50 are made of polytetrafluoroethylene. Polytetrafluoroethylene has excellent light reflectivity, stable material properties, and is resistant to UV aging, which has outstanding advantages. A reflective layer is coated on the inner surface of the inner shell 30 to further enhance the light extraction efficiency. The reflective layer is made of a mixture of one or more of BN nanoparticle material, SiO2 nanoparticle material, ZrO nanoparticle material, AlN nanoparticle material, and TiO2 nanoparticle material, and is not specifically limited.

[0068] The conventional substrate 10 usually adopts a metal dam, which is arranged around the substrate 10. The reflectivity of the metal dam is not high, and it is difficult to apply the polytetrafluoroethylene coating to the substrate 10. Therefore, the present application sets an inner shell 30, which can be coated with polytetrafluoroethylene on the surface, or directly formed by polytetrafluoroethylene material. Polytetrafluoroethylene is suitable for mold forming, and can be made into a desired shape, which is convenient for the manufacturing process. The inner shell 30 is tightly fitted to the substrate 10, so that the inner shell 30 forms a mounting groove 31 on the upper surface of the substrate 10. The size of the mounting groove 31 is only for accommodating and installing the ultraviolet LED 90 to reduce the light loss of the ultraviolet LED 90, and further a shell 50 is set. The shell 50 can tightly cover the substrate 10 and the inner shell 30 to reduce the light loss of the ultraviolet LED 90.

[0069] Further, in one embodiment, if Figure 7 and Figure 8 As shown, two opposite side surfaces of the outer periphery of the inner shell 30 are provided with a through first insertion inlet 34, so that the substrate 10 is limitedly accommodated in the inner cavity of the inner shell 30 through the first insertion inlet 34. Figure 7 and Figure 8 As shown, the first buckle 33 can be plugged into the first slot 111 .

[0070] A through second insertion inlet 54 is formed on two opposite side surfaces of the outer periphery of the outer shell 50, so that the substrate 10 and the inner shell 30 are limitedly accommodated in the inner cavity of the outer shell 50 through the second insertion inlet 54. Figure 7 and Figure 8 As shown, the second buckle 51 is inserted into the second slot 113 .

[0071] like Figure 7 As shown, the inner shell 30 and the outer shell 50 can be cross-engaged in the slot 11 of the base plate 10. Figure 8 As shown, the inner shell 30 and the outer shell 50 can be inserted into the slot 11 of the substrate 10 on the same side of the substrate 10. A through first plug-in inlet 34 and a second plug-in inlet 54 are formed on two opposite sides, which is conducive to simplifying the assembly operation process. At the same time, during the assembly of the substrate 10, the inner shell 30, and the outer shell 50, a sealing material can be applied between the outer peripheral surfaces of the two adjacent ones to seal any gaps that may exist. The sealing material can be silicone, resin, etc.

[0072] Further, in another embodiment, if Figure 7 and Figure 8 As shown, a first insertion inlet 34 is provided on a side surface of the outer periphery of the inner shell 30 to allow the substrate 10 to be limitedly accommodated in the inner cavity of the inner shell 30 through the first insertion inlet 34. Furthermore, the first buckle 33 can be inserted into the first slot 111; in this way, the inner shell 30 tightly covers the substrate 10.

[0073] A second plug-in inlet 54 is provided on one side of the outer periphery of the outer shell 50, so that the substrate 10 and the inner shell 30 are limitedly accommodated in the inner cavity of the outer shell 50 through the second plug-in inlet 54. Furthermore, the second clip 51 is plugged into the second slot 113, so that the outer shell 50 tightly covers the inner shell 30 and the substrate 10, and the three are tightly covered layer by layer to improve the stability of the structure.

[0074] Furthermore, since a first plug-in inlet 34 is provided on one side of the outer periphery of the inner shell 30 and a second plug-in inlet 54 is provided on one side of the outer periphery of the outer shell 50, when the inner shell 30 is wrapped around the substrate 10, three side surfaces of the substrate 10 can be covered. Meanwhile, when the outer shell 50 is wrapped around the inner shell 30, three side surfaces of the outer periphery of the inner shell 30 can be covered, which is more conducive to achieving the sealing of the entire structure.

[0075] Furthermore, when the inner shell 30 and the outer shell 50 are cross-connected to the substrate 10, after the inner shell 30 is wrapped around the substrate 10, the outer shell 50 can cover the first insertion inlet 34 of the inner shell 30, further improving the sealing of the entire structure. Of course, the two may not be cross-connected.

[0076] Furthermore, if Figure 1 , Figure 2 and Figure 6 As shown, a slot 11 is provided on the side surface of the substrate 10, the outer periphery of the inner shell 30 is bent toward the side surface of the substrate 10 to form a first buckle 33, and the outer periphery of the outer shell 50 is bent toward the side surface of the substrate 10 to form a second buckle 51, and the first buckle 33 and the second buckle 51 are snapped into the slot 11.

[0077] The inner shell 30 and the outer shell 50 are assembled layer by layer on the substrate 10 by means of a snap connection. During the assembly process, the inner shell 30 is first snapped onto the substrate 10 so that the inner surface of the inner shell 30 fits on the upper surface of the substrate 10, leaving no gap between the two, reducing the size of the space formed by the inner shell 30 on the substrate 10, and reducing the loss of ultraviolet light. Then the outer shell 50 is assembled onto the inner shell 30 and the substrate 10, and the outer shell 50 fits on the upper surface of the inner shell 30, leaving no gap between the two, reducing the size of the space formed by the outer shell 50 on the inner shell 30, and reducing the loss of ultraviolet light. At the same time, the outer shell 50 is coated on the inner shell 30 and the substrate 10, and the inner shell 30 is clamped between the outer shell 50 and the substrate 10, which strengthens the tightness of the connection and helps to improve the stability of the overall structure.

[0078] Further, in one embodiment, if Figure 1 , Figure 2 , Figure 7 and Figure 8As shown, the card slot 11 includes a first card slot 111 and a second card slot 113, and the first card slot 111 and the second card slot 113 are arranged at intervals from top to bottom on the side circumference of the substrate 10; the first card slot 111 is clamped with the first buckle 33, and the second card slot 113 is clamped with the second buckle 51. The first buckle 33 is clamped to the first card slot 111 and the second buckle 51 is clamped to the second card slot 113 to improve the reliability of their respective installations and avoid problems with one of the buckles directly affecting the clamping stability of the other buckle.

[0079] Among them, Figure 7 and Figure 8 As shown, the inner shell 30 and the outer shell 50 can be inserted into the base plate 10 at the same side, or they can be inserted into the base plate 10 from different directions.

[0080] Further, in one embodiment, if Figure 7 As shown, the substrate 10 is defined to have a left-right direction and a front-back direction perpendicular to the up-down direction, the first clamping slot 111 is provided in the left-right direction of the side circumference of the substrate 10, and the second clamping slot 113 is provided in the front-back direction of the side circumference of the substrate 10. That is, the substrate 10 is clamped and limited in all directions by adopting a cross clamping method, thereby improving the clamping stability of the inner shell 30, the outer shell 50 and the substrate 10. It is avoided that when clamping in the same direction, there is only one clamping limit in the side circumference of the substrate 10.

[0081] Furthermore, if Figure 6 As shown, in one embodiment, the first buckle 33 and the second buckle 51 are clamped in the same clamping slot 11, and the first buckle 33 is limited to abut between the bottom of the clamping slot 11 and the second buckle 51, so that the inner shell 30 is tightly wrapped on the substrate 10, and the outer shell 50 is tightly wrapped on the inner shell 30, so that the overall structure is tightly connected and the stability is improved. And the sum of the thickness of the first buckle 33 and the second buckle 51 is equal to the depth of the clamping slot 11, so as to ensure that the first buckle 33 and the second buckle 51 are limited in the clamping slot 11 to avoid slipping out and improve the clamping stability. At the same time, when the clamping slot 11 is clamped with the first buckle 33 and the second buckle 51, the gap can be filled with sealing material to further improve the sealing and stability.

[0082] Furthermore, if Figure 1 As shown, a first gap 32 is provided between the groove wall of the mounting groove 31 and the ultraviolet LED 90; in this way, the ultraviolet LED 90 is prevented from contacting the groove wall of the mounting groove 31, making it difficult to operate the ultraviolet LED 90 when it is arranged on the substrate 10 in the mounting groove 31. For example, when the ultraviolet LED 90 is welded on the substrate 10, poor welding may result.

[0083] Furthermore, if Figure 1 and Figure 2As shown, the groove wall of the mounting groove 31 includes a first groove wall 311 close to the substrate 10, and a second groove wall 313 away from the substrate 10, the second groove wall 313 extends from the groove bottom of the mounting groove 31 to the groove opening, and is inclined in a direction away from the ultraviolet LED 90; the inclined second groove wall 313 is conducive to better reflection of light. The surfaces of the first groove wall 311 and the second groove wall 313 can be provided with a reflective layer to further improve the reflection of light.

[0084] Furthermore, if Figure 2 As shown, the angle α formed by the plane where the second groove wall 313 is located and the plane where the substrate 10 is located is 30° to 75°, so that the light reflected from the second groove wall 313 can be emitted through the lens 70. If the angle is too large or too small, it is easy to cause a decrease in light extraction efficiency.

[0085] like Figure 2 As shown, the first groove wall 311 extends from the bottom of the mounting groove 31 toward the groove opening and is inclined in a direction away from the ultraviolet LED 90. The angle β formed by the plane where the first groove wall 311 is located and the plane where the substrate 10 is located is 75° to 90°, so that the light reflected from the first groove wall 311 can be emitted through the lens 70.

[0086] The reflection layer disposed on the second groove wall 313 is a specular reflection layer or a diffuse reflection layer, and the light irradiated to the second groove wall 313 can be extracted through specular reflection or diffuse reflection.

[0087] The reflective layer disposed on the first groove wall 311 is a scattering reflective layer, which can extract the light irradiated to the first groove wall 311 through diffuse reflection.

[0088] The material of the reflective layer can be a mixture of one or more of BN nanoparticle material, SiO2 nanoparticle material, ZrO nanoparticle material, AlN nanoparticle material, and TiO2 nanoparticle material.

[0089] Furthermore, if Figure 2 As shown, the ultraviolet LED 90 is arranged on the substrate 10 through the connecting layer 91, and the connecting layer 91 can be welded by welding. The height of the first groove wall 311 is defined as H1, the height of the connecting layer 91 is defined as H2, and the height of the light-emitting layer 93 of the ultraviolet LED 90 is defined as H3, satisfying H2≤H1≤H3; in this way, the height of the first groove wall 311 is higher than the height of the connecting layer 91, preventing the light of the ultraviolet LED 90 from being absorbed by the connecting layer 91. At the same time, the height of the first groove wall 311 is lower than the height of the light-emitting layer 93 of the ultraviolet LED 90, so as to avoid the first groove wall 311 covering the light-emitting layer 93, which is not conducive to the emission of light from the ultraviolet LED 90.

[0090] Furthermore, if Figure 1As shown, define the distance between the first groove wall 311 and the UV LED 90 as D1, satisfying 0um < D1 < 50um; the setting of the first groove wall 311 facilitates the emission of light. At the same time, setting the distance between the first groove wall 311 and the UV LED 90 as D1 within 0um < D1 < 50um can avoid poor soldering of the UV LED 90 due to too small a distance, and too large a distance will reduce the light extraction efficiency.

[0091] Further, as Figure 1 and Figure 2 shown, define the height of the inner shell 30 on the substrate 10 as H4, and define the height of the UV LED 90 on the substrate 10 as H5, satisfying H4 > H5; that is, the inner shell 30 protruding from the substrate 10 cannot be too low and should be higher than the height of the UV LED 90, but it cannot be too high either. Too high will increase the cavity space and is not conducive to the reliability of the whole structure. Then set the height of the inner shell 30 on the substrate 10 as H4, satisfying 200um ≤ H4 ≤ 600um.

[0092] Or, the UV reflective material forming the inner shell 30 and the outer shell 50 is polytetrafluoroethylene; polytetrafluoroethylene has excellent light reflectivity, stable material properties, can resist UV aging, and has outstanding advantages. Using polytetrafluoroethylene to make the inner shell 30 and the outer shell 50 can further enhance the light extraction efficiency.

[0093] Further, the material of the substrate 10 is an inorganic insulating material, such as a ceramic material, which can be aluminum nitride or aluminum oxide. The material of the lens 70 is a deep UV light-transmitting material, such as sapphire or quartz glass.

[0094] Further, as Figure 3 、 Figure 4 and Figure 5 shown, another mounting groove 35 is provided on the upper surface of the inner shell 30 on the substrate 10, and a protection element is provided in the another mounting groove 35; the mounting groove 31 and the another mounting groove 35 are separated, separating the protection element from the UV LED 90. Because the protection element may also absorb some light, and the presence of the protection element will also cause unevenness of the light emission field. Therefore, separating the mounting groove 31 and the another mounting groove 35 can effectively improve the light extraction efficiency.

[0095] And, as Figure 4 and Figure 5 shown, the another mounting groove 35 is covered by the outer shell 50 attached to the upper surface of the inner shell 30. In this way, the protection element is covered by the outer shell 50, avoiding the protection element from affecting the light extraction.

[0096] Further, as Figure 2As shown, a metal coating 13 is provided on the substrate 10, the inner surface of the inner shell 30 is attached to the metal coating 13, the ultraviolet LED 90 is electrically connected to the metal coating 13, and the metal coating 13 is used to connect the circuit; the metal coating 13 includes: a positive electrode coating 131, which is used to connect the positive electrode of the ultraviolet LED 90; and a negative electrode coating 133, which is used to connect the negative electrode of the ultraviolet LED 90; an isolation area 130 is provided between the positive electrode coating 131 and the negative electrode coating 133, and the isolation area 130 is provided with polytetrafluoroethylene, which is beneficial to improve the reflection of light.

[0097] Furthermore, the metal plating layer 13 is composed of multiple plating layers, which at least include a copper layer, a nickel layer and a gold layer disposed on the surface of the copper layer. The thickness of the copper layer is 50um to 100um, the thickness of the nickel layer is 3um to 6um, and the thickness of the gold layer is 0.05um to 1um, so as to ensure sufficient plating connection strength.

[0098] The substrate 10 is provided with two through holes 15, and the two through holes 15 are filled with conductive materials. One side of the two through holes 15 is electrically connected to the positive electrode plating layer 131 and the negative electrode plating layer 133, respectively, and the other side of the two through holes 13 is electrically connected to the metal circuit outside the substrate 10. The two through holes 15 electrically connect the external circuit with the ultraviolet LED 90 in the mounting groove 31 and the protection element in the other mounting groove 35.

[0099] Further, in one embodiment, if Fig. 9 As shown, a step 312 is formed between the first groove wall 311 and the second groove wall 313 . The step 312 is used to prevent light from being scattered onto the substrate 10 , so as to improve light extraction efficiency. The width D2 of the step 312 is 0 um to 100 um.

[0100] In one embodiment of the present application, an electronic device is provided, and the electronic device includes an ultraviolet encapsulation device 100. Since the ultraviolet encapsulation device 100 adopts all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be described one by one here. The electronic device can be a sterilization electronic device for sterilization with the ultraviolet encapsulation device 100, or a curing electronic device for curing, which is not specifically limited.

[0101] The above are only preferred embodiments of the present invention, and are not intended to limit the patent scope of the present invention. All equivalent structural changes made using the contents of the present invention's specification and drawings, or directly / indirectly applied in other related technical fields, are included in the patent protection scope of the present invention.

Claims

1. A UV packaging device, characterized in that: The ultraviolet packaging device comprises: base(10); An inner shell (30), the inner shell (30) being arranged around the base plate (10), the inner surface of the inner shell (30) being in contact with the upper surface of the base plate (10), and forming a mounting groove (31) on the upper surface of the base plate (10); an outer shell (50), the outer shell (50) being disposed around the substrate (10) and the inner shell (30) and being attached to the upper surface of the inner shell (30); and A lens (70), wherein the outer shell (50) is provided with the lens (70) above the inner shell (30), and the lens (70) seals the mounting groove (31); Wherein, the ultraviolet LED (90) is arranged in the installation groove (31), and the inner shell (30) and the outer shell (50) are formed of ultraviolet reflective material; Two opposite side surfaces of the outer periphery of the inner shell (30) are provided with a through first plug-in inlet (34), so that the substrate (10) can be positioned and accommodated in the inner cavity of the inner shell (30) through the first plug-in inlet (34); Two opposite side surfaces of the outer periphery of the outer shell (50) are provided with a through second plug-in inlet (54), so that the substrate (10) and the inner shell (30) are positioned and accommodated in the inner cavity of the outer shell (50) through the second plug-in inlet (54); or, A first plug-in inlet (34) is provided on a side surface of the outer periphery of the inner shell (30), so that the substrate (10) is positioned and accommodated in the inner cavity of the inner shell (30) through the first plug-in inlet (34); A second plug-in inlet (54) is provided on a side surface of the outer periphery of the outer shell (50), so that the substrate (10) and the inner shell (30) are positioned and accommodated in the inner cavity of the outer shell (50) through the second plug-in inlet (54); A first gap (32) is provided between the groove wall of the mounting groove (31) and the ultraviolet LED (90); The groove wall of the mounting groove (31) comprises a first groove wall (311) close to the substrate (10), and a second groove wall (313) away from the substrate (10), wherein the second groove wall (313) extends from the groove bottom of the mounting groove (31) toward the groove opening and is inclined in a direction away from the ultraviolet LED (90); A reflective layer is provided on the surface of the first groove wall (311) and the second groove wall (313); A slot (11) is provided on the side circumference of the substrate (10); the outer circumference of the inner shell (30) is bent toward the side circumference of the substrate (10) to form a first snap buckle (33); the outer circumference of the outer shell (50) is bent toward the side circumference of the substrate (10) to form a second snap buckle (51); the first snap buckle (33) and the second snap buckle (51) are snapped into the slot (11).

2. The ultraviolet packaging device according to claim 1, characterized in that: The angle α formed by the plane where the second groove wall (313) is located and the plane where the substrate (10) is located is 30 degrees to 75 degrees; and / or the first groove wall (311) extends from the groove bottom of the mounting groove (31) in the direction toward the groove opening and is inclined in a direction away from the ultraviolet LED (90), and an angle β formed by a plane where the first groove wall (311) is located and a plane where the substrate (10) is located is 75 degrees to 90 degrees; And / or, the reflection layer provided on the second groove wall (313) is a specular reflection layer or a scattering reflection layer; And / or, the reflection layer provided on the first slot wall (311) is a scattering reflection layer; And / or, the ultraviolet LED (90) is disposed on the substrate (10) via a connecting layer (91), the height of the first groove wall (311) is defined as H1, the height of the connecting layer (91) is defined as H2, and the height of the light-emitting layer (93) of the ultraviolet LED (90) is defined as H3, satisfying H2≤H1≤H3; And / or, define the distance between the first groove wall (311) and the ultraviolet LED (90) as D1, satisfying 0 um <D1<50um; and / or, defining a height of the inner shell (30) on the substrate (10) as H4, defining a height of the ultraviolet LED (90) on the substrate (10) as H5, and satisfying H4>H5; The height of the inner shell (30) on the substrate (10) is H4, satisfying 200um≤H4≤600um.

3. The ultraviolet packaging device according to claim 2, characterized in that: The material of the reflective layer is a mixture of one or more of BN nanoparticle material, SiO2 nanoparticle material, ZrO nanoparticle material, AlN nanoparticle material, and TiO2 nanoparticle material; Or, the ultraviolet reflective material forming the inner shell (30) and the outer shell (50) is made of polytetrafluoroethylene; Alternatively, the substrate (10) is made of an inorganic insulating material, and the lens (70) is made of a deep ultraviolet light-transmitting material; Alternatively, the upper surface of the inner shell (30) is further provided with another mounting groove (35) on the upper surface of the substrate (10), the other mounting groove (35) is covered by the outer shell (50) attached to the upper surface of the inner shell (30), and a protective element is provided in the other mounting groove (35).

4. The ultraviolet packaging device according to claim 1, characterized in that: The card slot (11) comprises a first card slot (111) and a second card slot (113), wherein the first card slot (111) and the second card slot (113) are arranged at intervals from top to bottom on the side circumferential surface of the substrate (10); The first clamping slot (111) is clamped to the first clamping buckle (33), and the second clamping slot (113) is clamped to the second clamping buckle (51).

5. The ultraviolet packaging device according to claim 4, characterized in that: The substrate (10) is defined as having a left-right direction and a front-back direction perpendicular to the up-down direction, the first card slot (111) being arranged in the left-right direction of the side circumference of the substrate (10), and the second card slot (113) being arranged in the front-back direction of the side circumference of the substrate (10).

6. The ultraviolet packaging device according to claim 1, characterized in that: The first clip (33) and the second clip (51) are clipped into the slot (11); the first clip (33) is limitedly abutted between the bottom of the slot (11) and the second clip (51); and the sum of the thickness of the first clip (33) and the second clip (51) is equal to the depth of the slot (11).

7. The ultraviolet packaging device according to any one of claims 1 to 6, characterized in that: The substrate (10) is provided with a metal coating (13), the inner surface of the inner shell (30) is attached to the metal coating (13), the ultraviolet LED (90) is electrically connected to the metal coating (13), and the metal coating (13) is used to connect the circuit; The metal coating (13) comprises: A positive electrode coating (131), used for connecting the positive electrode of the ultraviolet LED (90); as well as A cathode coating (133) used for connecting to the cathode of the ultraviolet LED (90); An isolation region (130) is provided between the positive electrode coating (131) and the negative electrode coating (133); The metal plating layer (13) is composed of a multi-layer plating layer, wherein the plating layer at least includes a copper layer and a nickel layer and a gold layer arranged on the surface of the copper layer; The copper layer has a thickness of 50um to 100um, the nickel layer has a thickness of 3um to 6um, and the gold layer has a thickness of 0.05um to 1um; The substrate (10) is provided with two through holes (15), the two through holes (15) are filled with conductive material, one side of the two through holes (15) is electrically connected to the positive electrode coating (131) and the negative electrode coating (133), and the other side of the two through holes (15) is electrically connected to a metal circuit outside the substrate (10).

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