Electronic atomization device and heating component and heating element thereof

Abstract

The present invention relates to an electronic atomization device and its heating assembly and heating body. The heating body includes a heating element and a columnar heat-conducting isolation element. The heat-conducting isolation element is a hollow structure with two ends extending through it, and a mounting for a liquid-conducting element is provided on its inner side. The heating element is arranged on the outer surface of the heat-conducting isolation element to isolate the heating element from the atomizing medium and / or the gaseous medium formed after atomization through the heat-conducting isolation element, and to conduct heat between the heating element and the atomizing medium through the heat-conducting isolation element. The heating body can avoid direct contact between the heating structure and the atomizing medium, reduce the probability of the generation of harmful substances, avoid the concentration of the atomizing medium, increase the atomization amount and the taste of the atomized gas after atomization, and can also increase the fatigue life of the heating structure and increase the number of practical uses of the atomizing device.

Description

Technical Field

[0001] The present invention relates to an atomizing device, and more particularly to an electronic atomizing device and a heating component and a heating element thereof. Background Art

[0002] The heating material in the heating element of the electronic atomization device in the related art is generally in direct contact or semi-isolated state with the atomization medium and / or the gaseous medium formed after atomization. It has the disadvantages of easily producing a burnt smell during the atomization process, concentrated atomization medium, low atomization volume, poor taste, and short life of the heating material. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide an improved heating element, and further provide an improved electronic atomization device and heating component.

[0004] The technical solution adopted by the present invention to solve the technical problem is: constructing a heating body, including a heating element and a columnar heat-conducting isolation element;

[0005] The heat-conducting isolation element is a hollow structure with two ends connected, and a mounting for the liquid-conducting element is provided on the inner side thereof;

[0006] The heating element is arranged on the outer surface of the heat-conducting isolation element to isolate the heating element from the atomized medium and / or the gaseous medium formed after atomization through the heat-conducting isolation element, and to conduct heat between the heating element and the atomized medium through the heat-conducting isolation element.

[0007] In some embodiments, the heat-generating element is arranged along the circumference of the heat-conductive isolation element.

[0008] In some embodiments, the heating element and the thermally conductive isolation element form an integral structure.

[0009] In some embodiments, the heating element is in the shape of an elongated sheet.

[0010] In some embodiments, the thermally conductive isolation element is made of a high thermal conductivity dense material, and the thermal conductivity of the thermally conductive isolation layer is greater than 90w / mk.

[0011] In some embodiments, the thermally conductive isolation element is a thermally conductive ceramic.

[0012] In some embodiments, the heating element is a heating film, and the heating film is attached to the thermally conductive isolation element through a lamination technology.

[0013] In some embodiments, a conductive element is further included, and the conductive element is disposed at one end or both ends of the thermal isolation element and is conductively connected to the heating element.

[0014] In some embodiments, the conductive element is a conductive film, and the conductive film is attached to the thermally conductive isolation element by lamination technology.

[0015] In some embodiments, the heat-conducting isolation element is provided with a heat-insulating structure to prevent heat from escaping from the heating element;

[0016] The heating element is located between the heat insulation structure and the heat conductive isolation element.

[0017] The present invention also constructs a heating assembly, comprising a columnar liquid-conducting element and the heating element of the present invention;

[0018] The liquid-conducting element is arranged through the heat-conducting isolation element of the heating element.

[0019] In some embodiments, the liquid-conducting element is a low-thermal-conductivity ceramic liquid-conducting element, and the thermal conductivity of the liquid-conducting element is less than 2 W / mK.

[0020] In some embodiments, the liquid-conducting element is a hollow structure with two ends connected, and a liquid injection channel is provided on the inner side.

[0021] In some embodiments, the liquid-conducting element is a solid structure.

[0022] In some embodiments, the liquid-conducting element includes a columnar body and a plurality of convex portions disposed on the periphery of the columnar body and spaced apart from each other;

[0023] Each of the protrusions extends toward the inner side wall of the thermally conductive isolation element;

[0024] The two adjacent convex portions and the heat-conducting isolation element surround and form an atomizing air channel.

[0025] In some embodiments, the liquid-conducting element is cylindrical.

[0026] The inner surface of the heat-conducting isolation element is convex and has a plurality of ridges arranged at intervals, and the ridges are arranged to protrude toward the outer surface of the liquid-conducting element;

[0027] The two adjacent ridges and the liquid-guiding element are arranged to form an atomizing airway.

[0028] In some embodiments, the liquid-conducting element and the wall surface opposite to the heating element form an atomizing surface.

[0029] In some embodiments, the atomizing surface includes a first atomizing zone that contacts the heating element so that the atomizing medium is directly heated and atomized by the heating element.

[0030] In some embodiments, the atomizing surface further includes a second atomizing area that is not in contact with the heating element so that the atomizing medium is radiated and atomized by the heating element.

[0031] The present invention also constructs an electronic atomization device, comprising the heating element described in the present invention and a power supply component electrically connected to the heating element.

[0032] The electronic atomization device and its heating component and heating body implemented in the present invention have the following beneficial effects: the heating body is provided with a mounting hole for the liquid conducting element to be rotated into the heat-conducting isolation element, and a heating element is provided on the outer surface of the heat-conducting isolation element, so that the heating element can be isolated from the atomizing medium and / or the gaseous medium formed after atomization through the heat-conducting isolation element, and the heating structure and the atomizing medium are heat-conducted through the heat-conducting isolation element, thereby avoiding direct contact between the heating structure and the atomizing medium, reducing the probability of harmful substances being generated, avoiding the concentration of the atomizing medium, and increasing the atomization amount and the taste of the atomized gas after atomization. It can also increase the fatigue life of the heating structure and increase the practical times of the atomizing device. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The present invention will be further described below with reference to the accompanying drawings and embodiments, in which:

[0034] Figure 1 is a schematic structural diagram of a heating component of an electronic atomization device in some embodiments of the present invention;

[0035] Figure 2 yes Figure 1 A partial structural diagram of the heating component of the electronic atomization device shown. DETAILED DESCRIPTION

[0036] In order to have a clearer understanding of the technical features, purposes and effects of the present invention, specific embodiments of the present invention are now described in detail with reference to the accompanying drawings.

[0037] Figure 1 and Figure 2 Some preferred embodiments of the electronic atomization device of the present invention are shown. This electronic atomization device can be used to heat and atomize a liquid atomization medium, generating atomized gas for inhalation by the user. In some embodiments, this electronic atomization device has the advantages of a simple structure, high atomization efficiency, good atomization taste, long service life, low manufacturing cost, and ease of implementation.

[0038] like Figure 1 and Figure 2As shown, further, in this embodiment, the electronic atomization device may include an atomization housing, a heating component, and a power supply component. The heating component and the power supply component may be accommodated in the atomization housing. The heating component may be used to heat the atomized atomized medium. The power supply component is mechanically and electrically connected to the heating component for supplying power to the heating component.

[0039] Furthermore, in this embodiment, the heating component may include a liquid-conducting element 20 and a heating element 10. The heating element 10 is sleeved on the periphery of the liquid-conducting element 20 and can be electrically connected to the power supply component and powered by the power supply component. The heating element 10 can be used to heat and atomize the atomizing medium on the liquid-conducting element 20. The atomizing medium can be a liquid atomizing medium. The liquid-conducting element 20 is arranged in the heating element 10 and can be connected to the liquid storage chamber in the atomizing shell to absorb the atomizing medium in the liquid storage chamber.

[0040] Furthermore, in this embodiment, the heating element 10 may be columnar as a whole. Specifically, in some embodiments, the heating element 10 may be cylindrical as a whole. In some embodiments, the heating element 10 may include a heating element 11 and a heat-conducting isolation element 12. The heating element 11 may be arranged on the outer surface of the heat-conducting isolation element 12 and may be integrally formed with the heat-conducting isolation element 12. The heating element 11 may be used to generate heat and transfer the heat directly to the heat-conducting isolation element 12. The heat-conducting isolation element 12 may be used to isolate the heating element 11 from the atomized medium and / or the gaseous medium formed after atomization, and may transfer the heat conducted from the heating element 11 to the atomized medium on the liquid-conducting element 20, thereby heating the atomized medium.

[0041] Furthermore, in this embodiment, the heating element 11 can be a heating film, which can be a longitudinal sheet structure and can be arranged along the circumference of the thermally conductive isolation element 12. The heating element 11 can be covered on the outer surface of the thermally conductive isolation element 12 by a coating technology, and form an integral structure with the thermally conductive isolation element 12. Specifically, in some embodiments, the heating film can be produced by silk screen technology or other forms of technology, and the use of a heating film can improve the heating efficiency and heat conduction efficiency. In some embodiments, the shape and size of the heating film can be freely designed into a variety of shapes according to the power and atomization performance requirements of the expected design.

[0042] Furthermore, in this embodiment, the thermally conductive isolation element 12 may be a hollow structure with both ends extending through it. The thermally conductive isolation element 12 may be cylindrical. Of course, it is understood that in other embodiments, the thermally conductive isolation element 12 is not limited to a cylindrical shape and may be a rectangular column or other shape. In some embodiments, the thermally conductive isolation element 12 may have a mounting hole 121 formed inside it, which may be used to mount the liquid-conducting element 20.

[0043] In this embodiment, the thermally conductive isolation element 12 can be a high thermal conductivity dense material. Specifically, in some embodiments, it can be selected that the thermally conductive isolation element 12 can be a thermally conductive ceramic material. The thermal conductivity coefficient of the thermally conductive isolation element 12 is greater than 90w / mk, it can be heated instantly and has the characteristics of high heat transfer efficiency, and its heat transfer loss can be reduced to less than 5%. In addition, the thermally conductive ceramic material used not only plays the role of oil isolation, but also has unique infrared radiation characteristics. The atomized atomized gas has the advantages of being delicate, pure, safe and healthy. In addition, its thermal efficiency loss and conduction are almost unaffected; its uniform thermal radiation electromagnetic wavelength is about 5-20 microns, which is the mid-infrared electromagnetic wavelength range, and is the functional characteristic absorption spectrum of most organic matter, which will bring great benefits to the uniform atomization and taste of the atomized medium.

[0044] Furthermore, in the present embodiment, the heating element 10 may further include a conductive element 13, which may be used to electrically connect the heating element 11 to the electrode of the power supply assembly. In the present embodiment, the conductive element 13 may be provided on the thermally conductive isolation element 12 and conductively connected to the heating element 11. Of course, it is understandable that in some other embodiments, the conductive element 13 may not be limited to being provided on the thermally conductive isolation element 12, and it may also be provided on the heating element 11. In some embodiments, the conductive element 13 may include a first conductive element and a second conductive element, and the first conductive element and the second conductive element may be spaced apart and provided at one end of the thermally conductive isolation element 12. In some embodiments, the first conductive element and the second conductive element may be located on the outer surface of the thermally conductive isolation element 12 and be provided near one end of the thermally conductive isolation element 12. Of course, it is understandable that in some other embodiments, the first conductive element and the second conductive element 132 may also be distributed at both ends of the thermally conductive isolation structure. In some embodiments, the conductive element 13 may be a conductive sheet, which may be attached to the outer surface or end surface of the thermally conductive isolation element 12, or may be inserted into the thermally conductive isolation element 12. In some embodiments, the conductive element 13 is not limited to a conductive sheet. In other embodiments, the conductive element 13 may also be a conductive film, which may be applied to the inner surface of the thermally conductive isolation element 12 using a lamination technique and may be positioned near the end of the conductive isolation element 12. In other embodiments, the conductive element 13 may also be a lead.

[0045] In some embodiments, a thermal insulation structure 14 may be provided on the thermally conductive isolation element 12. This thermal insulation structure 14 may be positioned around the periphery of the thermally conductive isolation element 12 to prevent heat from escaping from the heating element 11. In some embodiments, the thermal insulation structure 14 may cover the outer layer of the heating element 11 and have a thermal conductivity of less than 2 W / mK. The provision of this thermal insulation structure 14 may effectively improve heating efficiency. In some embodiments, the thermal insulation structure 14 may be made of high-temperature-resistant silicone.

[0046] Furthermore, in this embodiment, the liquid-conducting element 20 can be inserted into the mounting hole 121 of the heating element 10, and can be made of low-thermal-conductivity ceramic. Specifically, the liquid-conducting element 20 can be a low-thermal-conductivity ceramic liquid-conducting element, and its thermal conductivity coefficient can be less than 2w / mk. By installing the liquid-conducting element 20 in the mounting hole 121 and isolating the heating element 11 from the atomized medium and / or the gaseous medium formed after atomization through the thermal isolation element 12, the fatigue resistance of the heating material can be improved, and problems such as local concentration of the atomized medium, low smoke volume, and poor taste consistency can be avoided.

[0047] Furthermore, in this embodiment, the liquid-conducting element 20 may be cylindrical, or may be a hollow structure with both ends connected, with an injection channel 201 formed on its inner side. The injection channel 201 may be connected to the liquid storage chamber in the atomizing shell for injecting liquid atomized medium directly into the liquid-conducting element 20. In some embodiments, the injection channel 201 may be a circular hole. It is understandable that in other embodiments, the injection channel 201 may not be limited to a cylindrical shape, but may also be a square column or other shape. In other embodiments, the injection channel 201 may be omitted. The liquid-conducting element 20 may be a solid structure.

[0048] Furthermore, in this embodiment, the liquid-conducting element 20 may include a columnar body 20a and a plurality of protrusions 20b. The columnar body 20a may be cylindrical, and the injection channel 201 may be arranged at the central axis of the columnar body 20a. The plurality of protrusions 20b may be arranged on the outer periphery of the columnar body 20a and may be arranged at intervals. Each protrusion 20b may extend radially toward the inner side wall of the heat-conducting isolation element 12 of the columnar body 20a and may be integrally formed with the columnar body 20a. In this embodiment, two adjacent protrusions 20b and the heat-conducting isolation element 12 may be arranged to form an atomizing air duct 21. When in use, the heating film may generate heat after being connected to a power source through the conductive element 13. The heat may be radiated through the heat-conducting isolation element 12 to heat the atomizing medium on the atomizing liquid-conducting element 20. The atomizing medium may be heated in the atomizing air duct 21 to form smoke, which may be drawn into the user's mouth through the atomizing air duct 21. It is understandable that in some other embodiments, the protrusion 20b can be omitted. In some other embodiments, the liquid-conducting element 20 can be cylindrical, and the inner surface of the thermally conductive isolation element 12 can be convex and have multiple ridges spaced apart. The multiple ridges can protrude radially toward the outer surface of the liquid-conducting element 20, and two adjacent ridges can be enclosed with the liquid-conducting element 20 to form an atomizing airway 21.

[0049] Furthermore, in this embodiment, the wall surface of the liquid-guiding element 20 opposite to the heating element 10 in the mounting hole 121 can form an atomizing surface 22. When the electronic atomization device atomizes, the atomizing medium can flow from the liquid storage chamber to the inner surface of the liquid-guiding element 20 and penetrate into the liquid-guiding element 20 until reaching the atomizing surface 22. The structure of the liquid-guiding element 20 can effectively ensure a balance between directional liquid inflow and atomization.

[0050] In some embodiments, the atomization surface 22 can be divided into a first atomization area 221 and a second atomization area 222. The first atomization area 221 can be in direct contact with the heating element 10, and can be located on the side of the convex portion 20b away from the columnar body 20a. The first atomization area 221 forms a high-temperature atomization area. In the first atomization area 221, the heating element 10 can directly heat and atomize the liquid-conducting element 20. The second atomization area 222 is located in the atomization airway 21. The second atomization area 222 has no direct contact with the heating element 10, forming a low-temperature atomization area. In the second atomization area 222, the heating element 10 can atomize the atomization medium on the liquid-conducting element 20 by spatial radiation heat transfer. By dividing the atomization surface 22 into the first atomization area 221 and the second atomization area 222, the heating component can have an atomization environment with a three-dimensional spatial temperature gradient, and the unique three-dimensional temperature atomization environment will greatly improve the smoking taste.

[0051] The electronic atomization device of this embodiment not only solves the problem of direct contact between the atomizing medium and the heating element 11, making the heating material safe, long-lasting, and not easily contaminated, but also has a simple structure, convenient parts manufacturing, easy assembly, and is convenient for automated production and practical application.

[0052] It is understandable that the above embodiments only express the preferred implementation modes of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the patent scope of the present invention. It should be pointed out that for ordinary technicians in this field, without departing from the concept of the present invention, the above technical features can be freely combined, and several deformations and improvements can be made, all of which fall within the scope of protection of the present invention. Therefore, all equivalent changes and modifications made to the scope of the claims of the present invention should fall within the scope of coverage of the claims of the present invention.

Claims

1. A heating element, characterized in that: It comprises a heating element (11) and a columnar heat-conducting isolation element (12); The heat-conducting isolation element (12) is a hollow structure with two ends through, and a mounting hole (121) is provided on the inner side thereof; the mounting hole (121) is configured to receive a liquid-conducting element (20) having a liquid injection channel (201) on the inner side; The liquid-conducting element (20) comprises a columnar body (20a) and a plurality of convex portions (20b) arranged at intervals on the periphery of the columnar body (20a); each of the convex portions (20b) extends toward the inner side wall of the heat-conducting isolation element (12); two adjacent convex portions (20b) and the heat-conducting isolation element (12) are arranged to form an atomizing air channel (21); or the inner surface of the heat-conducting isolation element (12) is protruding and has a plurality of convex ridges arranged at intervals, and the convex ridges are arranged to protrude toward the outer surface of the liquid-conducting element (20); two adjacent convex ridges and the liquid-conducting element (20) are arranged to form an atomizing air channel (21); The heating element (11) is arranged on the outer surface of the heat-conducting isolation element (12), forming an integral structure with the heat-conducting isolation element (12), and is isolated from the atomized medium and the gaseous medium formed after atomization by the heat-conducting isolation element (12), and heat is conducted between the heating element (11) and the atomized medium by the heat-conducting isolation element (12).

2. The heating element according to claim 1, characterized in that The heating element (11) is arranged along the circumference of the heat-conducting isolation element (12).

3. The heating element according to claim 1, characterized in that The heating element (11) is in the shape of a longitudinal sheet.

4. The heating element according to claim 1, characterized in that The heat-conducting isolation element (12) is made of a high-heat-conducting dense material, and the heat-conducting isolation element (12) has a heat conductivity coefficient greater than 90 W / mK.

5. The heating element according to claim 4, characterized in that The heat-conducting isolation element (12) is heat-conducting ceramic.

6. The heating element according to claim 1, characterized in that The heating element (11) is a heating film, and the heating film is attached to the heat-conducting isolation element (12) by laminating technology.

7. The heating element according to claim 1, characterized in that It also includes a conductive element (13), which is arranged at one end or both ends of the heat-conducting isolation element (12) and is conductively connected to the heating element (11).

8. The heating element according to claim 7, characterized in that The conductive element (13) is a conductive film, and the conductive film is attached to the thermally conductive isolation element (12) by a coating technology.

9. The heating element according to claim 1, wherein The heat-conducting isolation element (12) is provided with a heat-insulating structure (14) for preventing heat from the heating element (11) from escaping. The heating element (11) is located between the heat insulation structure (14) and the heat-conducting isolation element (12).

10. A heating component, characterized in that: Comprising a columnar liquid-conducting element (20) and a heating element (10) according to any one of claims 1 to 9; The liquid-conducting element (20) is disposed through the heat-conducting isolation element (12) of the heating element (10).

11. The heating component according to claim 10, characterized in that: The liquid-conducting element (20) is a ceramic liquid-conducting element with low thermal conductivity, and the thermal conductivity coefficient of the liquid-conducting element (20) is less than 2 W / mK.

12. The heating component according to claim 10, characterized in that: The liquid-conducting element (20) is a hollow structure with two ends connected, and a liquid injection channel (201) is provided on the inner side thereof.

13. The heating component according to claim 10, characterized in that The liquid-conducting element (20) is a solid structure.

14. The heating component according to claim 10, characterized in that The liquid-conducting element (20) is cylindrical.

15. The heating component according to claim 10, characterized in that: The liquid-conducting element (20) and the wall surface of the heating element (10) arranged opposite to each other form an atomizing surface (22).

16. The heating component according to claim 15, characterized in that: The atomizing surface (22) comprises a first atomizing area (221) in contact with the heating element (10) so that the atomizing medium is directly heated and atomized by the heating element (10).

17. The heating component according to claim 15, characterized in that The atomizing surface (22) further includes a second atomizing area (222) that is not in contact with the heating element (10) so that the atomizing medium is radiated and atomized through the heating element (10).

18. An electronic atomization device, characterized in that: It comprises the heating element (10) according to any one of claims 1 to 9, and a power supply component electrically connected to the heating element (10).

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