Multi-head multi-wavelength PCB laser drilling device and method

Abstract

The present invention discloses a multi-head multi-wavelength PCB laser drilling device and method, comprising a base, on which a plurality of PCB processing lines are arranged in parallel; the PCB processing line comprises a Y-axis fixedly mounted on the base, and a first X-axis and a second X-axis are arranged above the Y-axis in parallel; the movement direction of the first X-axis and the second X-axis is perpendicular to the movement direction of the Y-axis; a first drilling module is fixedly mounted on the first X-axis, and a second drilling module is fixedly mounted on the second X-axis; the first drilling module comprises a first laser component, and the second drilling module comprises a second laser component; the first drilling module and the second drilling module both comprise a positioning monitoring component. The present invention has a compact structure and a reasonable layout, can complete the drilling process of a circuit board at one time, does not require multiple clamping, has high drilling efficiency, small drilling error, and high drilling accuracy, greatly improves the processing and production efficiency of circuit boards, and meets market demand.

Description

Technical Field

[0001] The invention relates to the technical field of PCB processing and manufacturing equipment, and in particular to a multi-head multi-wavelength PCB laser drilling device and method. Background Art

[0002] In recent years, the high-function of electronic products such as mobile phones, notebooks and digital cameras has developed rapidly. In order to achieve the high-function of these electronic products, the miniaturization and high-performance of the semiconductor electronic components installed, the high-density and multi-layer PCBs on which these electronic components are installed, and the small diameter and high precision of the via holes are indispensable.

[0003] With the development of HDI (high-density interconnect) PCB technology, mechanical drilling technology can no longer meet the market demand for smaller diameter, higher precision and higher efficiency. Therefore, laser drilling has gradually replaced mechanical drilling.

[0004] As drilling requirements vary, most laser drilling equipment on the market currently uses a dual-head single-wavelength processing mode, which cannot meet the PCB drilling efficiency requirements. When processing different copper foil layers and resin layers, thinning and blackening pre-treatment are required, which reduces the drilling efficiency and drilling accuracy. Therefore, there is an urgent need for a multi-head multi-wavelength PCB laser drilling equipment with high drilling efficiency and high drilling accuracy to solve the above problems. Summary of the invention

[0005] The purpose of the present invention is to provide a multi-head multi-wavelength PCB laser drilling device and method to solve the problems existing in the above-mentioned prior art.

[0006] To achieve the above object, the present invention provides the following solution: The present invention provides a multi-head multi-wavelength PCB laser drilling device, comprising a base, on which a plurality of PCB processing lines are arranged in parallel;

[0007] The PCB processing line comprises a Y-axis fixedly mounted on the base, a first X-axis and a second X-axis are arranged above the Y-axis in parallel; the movement directions of the first X-axis and the second X-axis are perpendicular to the movement direction of the Y-axis;

[0008] A first drilling module is fixedly installed on the first X-axis, and a second drilling module is fixedly installed on the second X-axis; the first drilling module and the second drilling module are respectively arranged corresponding to the Y-axis;

[0009] The first drilling module includes a first laser assembly, which is fixedly mounted on the first X-axis and corresponds to the Y-axis; the second drilling module includes a second laser assembly, which is fixedly mounted on the second X-axis and corresponds to the Y-axis;

[0010] The first drilling module and the second drilling module both include a positioning monitoring component.

[0011] Preferably, the base includes a pedestal, and the Y-axis is fixedly mounted on the top surface of the pedestal; a gantry beam perpendicular to the Y-axis is arranged at the center position of the pedestal; the first X-axis and the second X-axis are respectively arranged on both sides of the gantry beam.

[0012] Preferably, the first laser assembly includes an ultraviolet laser fixedly mounted on the top surface of the base and an ultraviolet optical system fixedly mounted on the first X-axis, the ultraviolet laser is connected to the ultraviolet optical system; the ultraviolet optical system is arranged corresponding to the Y-axis; the second laser assembly includes a carbon dioxide laser fixedly mounted on the top of the gantry beam and a carbon dioxide optical system fixedly mounted on the first X-axis, the carbon dioxide laser is connected to the carbon dioxide optical system; the carbon dioxide optical system is arranged corresponding to the Y-axis.

[0013] Preferably, a Y-axis mover is movably provided on the Y-axis, and a negative pressure suction cup is fixedly mounted on the Y-axis mover; a first X-axis mover is provided on the first X-axis, and the ultraviolet optical system is fixedly mounted on the first X-axis mover; a second X-axis mover is provided on the second X-axis, and the carbon dioxide optical system is fixedly mounted on the second X-axis mover.

[0014] Preferably, the positioning monitoring component includes a laser power probe fixedly mounted on the side wall of the negative pressure suction cup; the laser power probe is respectively arranged corresponding to the ultraviolet optical system and the carbon dioxide optical system.

[0015] Preferably, the positioning monitoring component also includes a CCD positioning component, and the CCD positioning component is fixedly mounted on the first X-axis mover and the second X-axis mover, respectively, and the CCD positioning component is arranged corresponding to the circuit board sucked and fixedly connected to the negative pressure suction cup.

[0016] Preferably, the negative pressure suction cup comprises a shell fixedly mounted on the Y-axis mover, and a honeycomb panel is provided on the top surface of the shell; and the laser power probe is fixedly mounted on the side wall of the shell.

[0017] Preferably, a Z-axis focusing device is arranged between the ultraviolet optical system and the first X-axis mover, the fixed end of the Z-axis focusing device is fixedly connected to the first X-axis mover, and the movable end of the Z-axis focusing device is fixedly connected to the ultraviolet optical system; the Z-axis focusing device is also arranged between the carbon dioxide optical system and the second X-axis mover.

[0018] The multi-head multi-wavelength PCB laser drilling method comprises the following steps:

[0019] Step S1, fixing and installing the circuit board to be drilled;

[0020] Step S2, transporting the circuit board for the first time;

[0021] Step S3, positioning the circuit board and drilling holes for the first time;

[0022] Step S4, transporting the circuit board for the second time;

[0023] Step S5, positioning the circuit board for the second time and drilling holes;

[0024] Step S6, transferring the circuit board for the third time;

[0025] Step S7, positioning the circuit board for the third time and drilling holes;

[0026] Step S8: inspect and transfer the processed circuit board.

[0027] Preferably, when the hole drilled in the circuit board is a blind hole, step S6 and step S7 are skipped, and step S8 is directly executed.

[0028] The present invention discloses the following technical effects: The present invention discloses a multi-head multi-wavelength PCB laser drilling device and method, wherein a plurality of PCB processing lines are arranged on a base, and drilling operations are performed independently at the same time, which greatly improves the drilling efficiency; a single PCB production line includes a Y-axis and a first X-axis and a second X-axis, and various forms of drilling of circuit boards can be completed by one installation, without the need for disassembly and re-clamping in the middle, which reduces the positioning error caused by re-clamping, improves the drilling accuracy and the quality of the final product; an independent optical system and a positioning monitoring component are arranged in a supporting manner, which is convenient for detecting the table power, ensuring the consistency of the drilling power, and thus ensuring the consistency of the drilling. The present invention has a compact structure and a reasonable layout, can complete the drilling process of the circuit board at one time, does not require multiple clamping, has high drilling efficiency, small drilling error, and high drilling accuracy, and realizes four-head, six-head, eight-head, ten-head or even more-head drilling by increasing the number of Y-axis and the number of drilling modules, which greatly improves the processing and production efficiency of the circuit board and meets market demand. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0030] Figure 1This is an axial view of the multi-head multi-wavelength PCB laser drilling device of the present invention;

[0031] Figure 2 A top view of the multi-head multi-wavelength PCB laser drilling device of the present invention;

[0032] Figure 3 This is a front view of the multi-head multi-wavelength PCB laser drilling device of the present invention;

[0033] Figure 4 It is an axial view of the ultraviolet optical system of the present invention;

[0034] Figure 5 for Figure 4 A partial enlarged view of middle A;

[0035] Among them, 1. base; 2. Y-axis; 3. Y-axis mover; 4. first X-axis; 5. first X-axis mover; 6. second X-axis; 7. second X-axis mover; 8. base; 9. gantry beam; 10. ultraviolet laser; 11. ultraviolet optical system; 12. carbon dioxide laser; 13. carbon dioxide optical system; 14. negative pressure suction cup; 15. laser power sensor; 16. Z-axis focusing device; 17. CCD positioning assembly; 18. shell; 19. honeycomb board; 20. circuit board. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0038] Reference Figure 1-5 , the present invention provides a multi-head multi-wavelength PCB laser drilling device, comprising a base 1, on which a plurality of PCB processing lines are arranged in parallel;

[0039] The PCB processing line includes a Y-axis 2 fixedly mounted on a base 1, and a first X-axis 4 and a second X-axis 6 are arranged above the Y-axis 2 in parallel; the movement directions of the first X-axis 4 and the second X-axis 6 are perpendicular to the movement direction of the Y-axis 2;

[0040] A first drilling module is fixedly mounted on the first X-axis 4, and a second drilling module is fixedly mounted on the second X-axis 6; the first drilling module and the second drilling module are respectively arranged corresponding to the Y-axis 2;

[0041] The first drilling module includes a first laser assembly, which is fixedly mounted on the first X-axis 4 and corresponds to the Y-axis 2; the second drilling module includes a second laser assembly, which is fixedly mounted on the second X-axis 6 and corresponds to the Y-axis 2;

[0042] The first drilling module and the second drilling module both include a positioning monitoring component.

[0043] The multi-head multi-wavelength PCB laser drilling device and method disclosed in the present invention are provided with a plurality of PCB processing lines on a base 1, and drilling operations are performed independently at the same time, thereby greatly improving the drilling efficiency; a single PCB production line includes a Y-axis 2, a first X-axis 4, and a second X-axis 6, and various forms of drilling of a circuit board 20 can be completed in one installation without disassembly and re-clamping in the middle, thereby reducing the positioning error caused by re-clamping, and improving the drilling accuracy and the quality of the final product; an independent optical system and a positioning monitoring component are provided to facilitate the detection of table power, ensure the consistency of drilling power, and thus ensure the consistency of drilling.

[0044] According to a further optimized solution, the base 1 includes a base 8, and the Y-axis 2 is fixedly mounted on the top surface of the base 8; a gantry beam 9 perpendicular to the Y-axis 2 is arranged at the center of the base 8; and the first X-axis 4 and the second X-axis 6 are respectively arranged on both sides of the gantry beam 9. The Y-axis 2 is fixedly mounted on the top surface of the base 8, and the Y-axis 2 passes through the gap between the gantry beam 9 and the base 8. The first X-axis 4 and the second X-axis 6 are respectively arranged on the front and rear sides of the gantry beam 9 in the same direction of movement of the Y-axis 2, and the first X-axis 4 and the second X-axis 6 are both located above the Y-axis 2. The Y-axis 2 drives the circuit board 20 to move, and when passing through the first X-axis 4 and the second X-axis 6 during the movement, the first drilling module and the second drilling module drill holes in the circuit board 20 in sequence.

[0045] A further optimized solution is as follows: the first laser assembly includes an ultraviolet laser 10 fixedly mounted on the top surface of the base 8 and an ultraviolet optical system 11 fixedly mounted on the first X-axis 4, the ultraviolet laser 10 is connected to the ultraviolet optical system 11; the ultraviolet optical system 11 is arranged corresponding to the Y-axis 2; the second laser assembly includes a carbon dioxide laser 12 fixedly mounted on the top of the gantry beam 9 and a carbon dioxide optical system 13 fixedly mounted on the first X-axis 4, the carbon dioxide laser 12 is connected to the carbon dioxide optical system 13; the carbon dioxide optical system 13 is arranged corresponding to the Y-axis 2. When the circuit board 20 passes under the ultraviolet optical system 11 driven by the Y-axis 2, the first X-axis 4 drives the ultraviolet optical system 11 to position, and then the ultraviolet laser 10 emits a high-power laser, which is incident on the ultraviolet optical system 11 and then outputted to drill a hole in the copper foil on the surface of the circuit board 20, exposing the resin underneath; the Y-axis 2 drives the circuit board 20 to continue to move forward to under the carbon dioxide optical system 13, and the second X-axis 6 drives the carbon dioxide optical system 13 to position the hole drilled by the ultraviolet optical system 11, and then the carbon dioxide laser 12 excites the laser, which is emitted from the carbon dioxide optical system 13 and falls on the positioning point, removing the resin under the copper foil to form the required hole;

[0046] Furthermore, if the required hole is a through hole, the resin at the position to be drilled between the two layers of copper foil is completely removed, and the Y-axis 2 is driven to move in the opposite direction to the bottom of the ultraviolet optical system 11 to remove the other layer of copper foil to form a through hole; if the required hole is a blind hole, the resin is removed from under the carbon dioxide optical system 13 without drilling through, so as to form a blind hole with the hole drilled on the copper foil by the ultraviolet optical system 11.

[0047] Furthermore, the ultraviolet laser 10 is preferably a high-power nanosecond ultraviolet laser, and the ultraviolet optical system 11 is composed of an ultraviolet optical galvanometer and an ultraviolet telecentric lens; the carbon dioxide laser 12 is preferably a radio frequency carbon dioxide laser, and the carbon dioxide optical system 13 is composed of a carbon dioxide optical galvanometer and a carbon dioxide telecentric lens; the above-mentioned components are all commonly used optical elements, and their working principles and usage methods are all existing technologies, which will not be repeated here.

[0048] Further optimized solution, a Y-axis mover 3 is movably arranged on the Y-axis 2, and a negative pressure suction cup 14 is fixedly installed on the Y-axis mover 3; a first X-axis mover 5 is arranged on the first X-axis 4, and the ultraviolet optical system 11 is fixedly installed on the first X-axis mover 5; a second X-axis mover 7 is arranged on the second X-axis 6, and the carbon dioxide optical system 13 is fixedly installed on the second X-axis mover 7. The Y-axis mover 3 translates along the Y-axis 2, thereby driving the negative pressure suction cup 14 to move together, so as to realize the movement of the circuit board 20 along the production line direction during the drilling process of the circuit board 20; the first X-axis mover 5 drives the ultraviolet optical system 11 to translate vertically with the Y-axis 2, and cooperates with the movement of the negative pressure suction cup 14 along the Y-axis 2, so that the ultraviolet optical system 11 can drill holes at any position on the top surface of the circuit board 20 and remove the surface copper foil; the second X-axis mover 7 drives the carbon dioxide optical system 13 to translate along the X-axis direction, and can locate the hole drilled by the ultraviolet optical system 11 on the copper foil, and then drill holes in the resin below.

[0049] Furthermore, the Y-axis 2, the first X-axis 4 and the second X-axis 6 all adopt double-motor linear motors, so that the Y-axis mover 3, the first X-axis mover 5 and the second X-axis mover 7 can translate stably with high movement accuracy and small error. It is suitable for drilling processing of high-precision components such as circuit boards 20. It is a conventional technology and will not be described in detail here.

[0050] Further optimizing the scheme, the positioning monitoring component includes a laser power probe 15 fixedly mounted on the side wall of the negative pressure suction cup 14; the laser power probe 15 is respectively set corresponding to the ultraviolet optical system 11 and the carbon dioxide optical system 13. The main function of the positioning monitoring component is to control the accuracy of drilling; the laser power probe 15 monitors the power of the laser emitted by the corresponding optical system during drilling, that is, to ensure the consistency of the drilling power, thereby ensuring the consistency of drilling.

[0051] Further optimizing the scheme, the positioning monitoring assembly also includes a CCD positioning assembly 17, which is fixedly mounted on the first X-axis mover 5 and the second X-axis mover 7, respectively, and the CCD positioning assembly 17 is arranged corresponding to the circuit board 20 fixedly attached to the negative pressure suction cup 14. The CCD positioning assembly 17 is used to locate the relationship between the optical system and the drilling position of the circuit board 20, and then obtain the distance that the optical system needs to move. It is a commonly used positioning method and positioning device in mechanical processing, and its technology and working principle are both existing technologies.

[0052] Furthermore, the device is also provided with a control center (not shown in the figure), which controls the operation of each component, receives data sent back by the CCD positioning component 17 and the laser power probe 15, and performs corresponding regulation on the operation of each component to ensure the drilling accuracy. The control center is a commonly used mechanical processing control center, which is a prior art. Its control of each component and processing of each feedback data are all prior art, which will not be repeated here.

[0053] Further optimizing the scheme, the negative pressure suction cup 14 includes a housing 18 fixedly mounted on the Y-axis mover 3, and a honeycomb panel 19 is provided on the top surface of the housing 18; the laser power probe 15 is fixedly mounted on the side wall of the housing 18. When in use, the surface of the circuit board 20 to be drilled faces the optical system, and the back surface is sucked into the honeycomb panel 19 to ensure the flatness and stability of the circuit board 20 during processing, thereby achieving the requirement of consistent drilling effect.

[0054] Further optimization scheme, a Z-axis focusing device 16 is provided between the ultraviolet optical system 11 and the first X-axis mover 5, the fixed end of the Z-axis focusing device 16 is fixedly connected to the first X-axis mover 5, and the movable end of the Z-axis focusing device 16 is fixedly connected to the ultraviolet optical system 11; a Z-axis focusing device 16 is also provided between the carbon dioxide optical system 13 and the second X-axis mover 7. The Z-axis focusing device 16 is used to adjust the focus height of the optical system, and cooperates with the CCD positioning component 17 to make up for the problem of inconsistent drilling effects caused by the focal length deviation of the two optical systems.

[0055] The multi-head multi-wavelength PCB laser drilling method comprises the following steps:

[0056] Step S1, fix and install the circuit board 20 to be drilled; put the circuit board 20 into the shell 18 of the negative pressure suction cup 14 with the surface to be drilled facing upward through the feeding device, and the bottom surface is sucked together with the top surface of the honeycomb panel 19 to complete the fixation.

[0057] Step S2 , transferring the circuit board 20 for the first time; starting the Y-axis mover 3 to drive the negative pressure suction cup 14 and the circuit board 20 to move to the bottom of the ultraviolet optical system 11 .

[0058] Step S3, positioning the circuit board 20 for the first time and drilling holes; starting the CCD positioning component 17 on the ultraviolet optical system 11 to position the circuit board 20, and then transmitting the positioning information to the control center, the control center controls the first X-axis mover 5, the Y-axis mover 3 and the ultraviolet optical system 11 to work in conjunction, and aligns the lens focus of the ultraviolet optical system 11 with the position to be drilled; starting the ultraviolet laser 10, and removing the copper foil on the surface of the circuit board 20 at the focus position of the circuit board 20; when the circuit board 20 needs to drill multiple holes, repeat the above positioning and drilling process multiple times until the copper foil at all the positions to be drilled is removed.

[0059] Step S4, transferring the circuit board 20 for the second time; starting the Y-axis mover 3 again to drive the negative pressure suction cup 14 and the circuit board 20 to move below the carbon dioxide optical system 13.

[0060] Step S5, positioning the circuit board 20 for the second time and drilling holes; starting the CCD positioning component 17 on the carbon dioxide optical system 13 to position the circuit board 20, and then transmitting the positioning information to the control center, the control center controls the second X-axis mover 7, the Y-axis mover 3 and the carbon dioxide optical system 13 to work in conjunction, and align the lens focus of the carbon dioxide optical system 13 with the position on the circuit board 20 where the copper foil has been removed; starting the carbon dioxide laser 12 to remove the resin at the focus position of the drilled hole on the circuit board 20; repeating the above positioning and drilling process to drill all the hole positions.

[0061] Step S6, transferring the circuit board 20 for the third time; when the drilled hole is a through hole, start the Y-axis mover 3 and move it in the reverse direction, driving the negative pressure suction cup 14 and the circuit board 20 to return to the bottom of the ultraviolet optical system 11.

[0062] Step S7, positioning the circuit board 20 for the third time and drilling; repeating the positioning process of step S5, positioning the position where the through hole needs to be drilled on the circuit board 20, and then removing the copper foil on the lower end surface of the circuit board 20 from the hole where the resin has been removed in turn to form a through hole.

[0063] Step S8, inspecting and transferring the processed circuit board 20. The quality inspection component (not shown) inspects the quality of the processed and drilled circuit board 20, and if qualified, it is transferred to the next process by the unloading component (not shown).

[0064] The present invention has a compact structure and a reasonable layout. It can complete the drilling process of the circuit board 20 at one time without multiple clamping. It has high drilling efficiency, small drilling error and high drilling accuracy. By increasing the number of Y-axis and the number of drilling modules, four-head, six-head, eight-head, ten-head or even more-head drilling can be achieved, which greatly improves the processing and production efficiency of the circuit board 20 and meets market demand.

[0065] In the description of the present invention, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0066] The above embodiments are only descriptions of the preferred modes of the present invention, and are not intended to limit the scope of the present invention. Without departing from the design spirit of the present invention, various modifications and improvements made to the technical solutions of the present invention by ordinary technicians in this field should all fall within the protection scope determined by the claims of the present invention.

Claims

1. Multi-head multi-wavelength PCB laser drilling device, characterized by: It comprises a base (1), on which a plurality of PCB processing lines are arranged in parallel; The single PCB processing line comprises a Y-axis (2) fixedly mounted on the base (1), and a plurality of parallel first X-axis (4) and second X-axis (6) are arranged above the Y-axis (2); the movement direction of the first X-axis (4) and the second X-axis (6) is perpendicular to the movement direction of the Y-axis (2); A first drilling module is fixedly mounted on the first X-axis (4), and a second drilling module is fixedly mounted on the second X-axis (6); the first drilling module and the second drilling module are respectively arranged corresponding to the Y-axis (2), and each Y-axis (2) corresponds to a group of the first drilling module and the second drilling module; The first drilling module comprises a first laser assembly, the first laser assembly is fixedly mounted on the first X-axis (4) and corresponds to the Y-axis (2); the second drilling module comprises a second laser assembly, the second laser assembly is fixedly mounted on the second X-axis (6) and corresponds to the Y-axis (2); The first drilling module and the second drilling module both include a positioning monitoring component; The base (1) comprises a pedestal (8), the Y-axis (2) being fixedly mounted on the top surface of the pedestal (8); a gantry beam (9) perpendicular to the Y-axis (2) is arranged at the center of the pedestal (8); the first X-axis (4) and the second X-axis (6) are respectively arranged on two side edges of the gantry beam (9); The first laser assembly comprises an ultraviolet laser (10) fixedly mounted on the top surface of the base (8) and an ultraviolet optical system (11) fixedly mounted on the first X-axis (4), the ultraviolet laser (10) and the ultraviolet optical system (11) being connected; the ultraviolet optical system (11) being arranged corresponding to the Y-axis (2); the second laser assembly comprises a carbon dioxide laser (12) fixedly mounted on the top of the gantry beam (9) and a carbon dioxide optical system (13) fixedly mounted on the second X-axis (6), the carbon dioxide laser (12) and the carbon dioxide optical system (13) being connected; the carbon dioxide optical system (13) being arranged corresponding to the Y-axis (2); If the required hole is a through hole, the resin at the position to be drilled between the two layers of copper foil is completely removed, and the Y-axis (2) is driven to move in the opposite direction to the bottom of the ultraviolet optical system (11), and the other layer of copper foil is removed to form a through hole; if the required hole is a blind hole, the resin is removed below the carbon dioxide optical system (13) without drilling through, so that a blind hole can be formed with the hole drilled on the copper foil by the ultraviolet optical system (11); A Y-axis mover (3) is movably arranged on the Y-axis (2), and a negative pressure suction cup (14) is fixedly mounted on the Y-axis mover (3); a first X-axis mover (5) is arranged on the first X-axis (4), and the ultraviolet optical system (11) is fixedly mounted on the first X-axis mover (5); a second X-axis mover (7) is arranged on the second X-axis (6), and the carbon dioxide optical system (13) is fixedly mounted on the second X-axis mover (7); The positioning monitoring component comprises a CCD positioning component (17), the CCD positioning component (17) being fixedly mounted on the first X-axis mover (5) and the second X-axis mover (7), respectively, and the CCD positioning component (17) being arranged corresponding to a circuit board (20) sucked and fixedly connected to the negative pressure suction cup (14); A drilling method based on a multi-head multi-wavelength PCB laser drilling device comprises the following steps: Step S1, fixing and installing the circuit board (20) to be drilled; Step S2, transferring the circuit board (20) for the first time; starting the Y-axis mover (3) to drive the negative pressure suction cup (14) and the circuit board (20) to move below the ultraviolet optical system (11); Step S3, positioning the circuit board (20) for the first time and drilling holes; starting the CCD positioning component (17) on the ultraviolet optical system (11) to position the circuit board (20), and then transmitting the positioning information to the control center, the control center controls the first X-axis mover (5), the Y-axis mover (3) and the ultraviolet optical system (11) to work in conjunction, and aligns the lens focus of the ultraviolet optical system (11) to the position to be drilled; starting the ultraviolet laser (10) to remove the copper foil on the surface of the circuit board (20) at the focus position of the circuit board (20); when the circuit board (20) needs to drill multiple holes, repeat the above positioning and drilling process multiple times until the copper foil at all the positions to be drilled is removed; Step S4, transferring the circuit board (20) for the second time; starting the Y-axis mover (3) again, driving the negative pressure suction cup (14) and the circuit board (20) to move below the carbon dioxide optical system (13); Step S5, positioning the circuit board (20) for the second time and drilling holes; starting the CCD positioning component (17) on the carbon dioxide optical system (13) to position the circuit board (20), and then transmitting the positioning information to the control center, the control center controls the second X-axis mover (7), the Y-axis mover (3) and the carbon dioxide optical system (13) to work in conjunction, and aligns the lens focus of the carbon dioxide optical system (13) to the position on the circuit board (20) where the copper foil has been removed; starting the carbon dioxide laser (12) to remove the resin at the focus position of the circuit board (20) where the hole has been drilled; repeating the above positioning and drilling process to drill all the hole positions; Step S6, transferring the circuit board (20) for the third time; when the drilled hole is a through hole, starting the Y-axis mover (3) and moving it in the reverse direction, driving the negative pressure suction cup (14) and the circuit board (20) to return to the bottom of the ultraviolet optical system (11); Step S7, positioning the circuit board (20) for the third time and drilling holes; positioning the position on the circuit board (20) where the through hole needs to be drilled, and then removing the copper foil on the lower end surface of the circuit board (20) from the hole from which the resin has been removed, to form a through hole; Step S8, inspecting and transferring the processed circuit board (20); When the hole drilled in the circuit board (20) is a blind hole, step S6 and step S7 are skipped, and step S8 is directly executed.

2. The multi-head multi-wavelength PCB laser drilling device according to claim 1, characterized in that: The positioning monitoring component also includes a laser power probe (15) fixedly mounted on the side wall of the negative pressure suction cup (14); the laser power probe (15) is respectively arranged corresponding to the ultraviolet optical system (11) and the carbon dioxide optical system (13).

3. The multi-head multi-wavelength PCB laser drilling device according to claim 2, characterized in that: The negative pressure suction cup (14) comprises a shell (18) fixedly mounted on the Y-axis mover (3), the top surface of the shell (18) being provided with a honeycomb panel (19); and the laser power probe (15) is fixedly mounted on a side wall of the shell (18).

4. The multi-head multi-wavelength PCB laser drilling device according to claim 1, characterized in that: A Z-axis focusing device (16) is arranged between the ultraviolet optical system (11) and the first X-axis mover (5); a fixed end of the Z-axis focusing device (16) is fixedly connected to the first X-axis mover (5), and a movable end of the Z-axis focusing device (16) is fixedly connected to the ultraviolet optical system (11); the Z-axis focusing device (16) is also arranged between the carbon dioxide optical system (13) and the second X-axis mover (7).

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