Mask Frame and Deposition System Including the Same

The mask frame design addresses the issue of substrate spacing and sagging by using recessed and protruding elements to enhance material efficiency and reduce processing times in online deposition systems.

CN114196910BActive Publication Date: 2025-07-15YAS CO LTD
View PDF 2 Cites 0 Cited by

Patent Information

Application Number
CN202010908264.2
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2020-09-02
Publication Date
2025-07-15
Estimated Expiration
2040-09-02

Smart Images

  • Figure CN114196910B_ABST
    Figure CN114196910B_ABST
Patent Text Reader

Abstract

The object of the present invention is to provide a mask frame capable of shortening the distance between substrates continuously introduced into a chamber in an on-line deposition system, and which can be applied to an on-line horizontal deposition system and an on-line vertical deposition system. To achieve this object, a flat portion or a recessed portion recessed toward the inner side where the substrate is disposed is formed at an end portion of one side of the mask frame of the present invention; a blocking portion protruding outward is formed on the side of the mask frame opposite to the side where the flat portion or the recessed portion is formed, wherein the blocking portion and the flat portion or the recessed portion are formed such that the blocking portion of the first mask frame incorporated in the mask frames of substrates continuously arranged with each other maintains a state of entering the flat portion or the recessed portion of the second mask frame without contacting each other, thereby shortening the distance between substrates while blocking the evaporation material from flying toward the top side of the chamber.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The present invention relates to a mask frame for a manufacturing process of an organic light emitting element for a display and lighting, and more particularly, to a mask frame designed to be able to shorten the spacing between substrates continuously conveyed in an inline horizontal and vertical deposition system. Background Art

[0002] The manufacturing of an organic light emitting element is achieved by bonding a mask to a substrate such as glass and depositing an organic material as an evaporation source. At this time, a mask sheet is attached to a mask frame equipped with an opening portion and used as a mask. The mask frame is shown in a perspective view and a side sectional view in Figure 1 An inline system is used to implement such a deposition process. In an inline deposition system, process chambers are arranged in a line, and substrates are continuously brought into the chambers to quickly perform the process. Since the evaporation sources in the chambers for depositing substances continuously eject evaporation materials, in the inline system, the narrower the spacing between the substrates brought into the deposition chamber, the better. This can prevent waste of expensive materials and further shorten the tack time.

[0003] In addition, the end portion of the mask frame of the mask loaded with the substrate is configured to have a larger size than the substrate, so as to safely place the substrate. The evaporation materials ejected from the evaporation source have a cosine distribution and are ejected radially. At this time, in order for the evaporation materials ejected from the evaporation source not to be blocked by the end portion of the mask frame in the direction of the mask frame close to the fixed evaporation source and to be deposited on the glass substrate, the end portion of the mask frame ensures a sufficient edge portion, and the inner side of the portion constituting the corresponding edge portion is formed to have an inclination angle consistent with the incident angle of the evaporation materials. Therefore, there is inevitably a spacing between the substrates due to the end portion of the mask frame.

[0004] Moreover, since the gap between the mask frames in the substrates / masks continuously brought into the deposition chamber becomes a path for the evaporation materials ejected from the evaporation source to contaminate the top and wall surfaces of the chamber, in order to prevent this situation, the end portion of the mask frame is as shown in Figure 1Protrude as shown, and the protrusions formed at the front end and the rear end are formed in such a way that they have a height difference from each other and are arranged to fit into each other, so as not to be disturbed during movement and function as a blocking part that blocks the gap so that the evaporant cannot reach the top. However, the protrusions as described above, while having the positive function of blocking the evaporant, also have the negative function of further increasing the distance between the substrates, wasting more expensive materials, and increasing the adhesion time. That is, since the evaporant ejected from the evaporation source has an inclined angle, the end of the mask frame needs to ensure a sufficient edge part to achieve deposition to the end of the substrate, so the distance between the substrates necessarily has a predetermined length. Also, due to the protrusion of the blocking part for preventing the evaporant from flying to the top, the distance between the substrates becomes farther.

[0005] Although masks are described in a large number of bulletins other than Korean Patent Publication No. 10-2018-0047594, and the manufacture of ultra-precision masks is described in the said bulletin, the above problems have not been recognized. Summary of the Invention

[0006] An object of the present invention is to provide a mask frame capable of shortening the distance between substrates that are continuously introduced into a chamber in an on-line deposition system.

[0007] Furthermore, the present invention also expects to configure the mask frame so that the evaporant incident obliquely according to the ejection angle of the evaporant is not blocked, and at the same time provide a configuration capable of preventing the sagging phenomenon that occurs as the mask frame and the substrate are enlarged.

[0008] Furthermore, the present invention expects to configure the mask frame as described above to be able to reduce the distance between substrates, and at the same time provide a configuration capable of using the existing devices as they are in the process of stretching and welding the mask bars.

[0009] According to the above object, in the present invention, one side of the mask frame has a recessed portion image that is recessed inward where the substrate is arranged, and the opposite side has a blocking portion image that protrudes outward, so that the blocking portion of the first mask frame (the mask frame located on the front side), which is the end of the mask frame combined with the substrates arranged continuously with each other, maintains a spaced state and enters the recessed portion of the second mask frame (the mask frame located on the rear side), while reducing the distance between the substrates, the blocking portion of the mask frame blocks the evaporant from flying to the top side.

[0010] And, in the present invention, by forming the recessed portion and the blocking portion on the protruding portion that protrudes upward from the side of the mask frame, the rigidity and tension of the mask frame are strengthened to prevent the sagging phenomenon caused by the weight.

[0011] In the above content, by replacing the recessed portion with a flat portion, the blocking portion can be formed on the protruding portion protruding upward in a shape like a wing extending outward.

[0012] Moreover, in the present invention, by forming protruding portions protruding upward on all four sides of the mask frame to reduce the thickness of the mask frame other than the protruding portions, the height of the frame surface for placing the substrate is reduced, thereby reducing the distance between the substrate and the evaporation source.

[0013] That is, the present invention provides a mask frame, characterized in that a flat portion or a recessed portion recessed inward where the substrate is arranged is formed at an end of one side of the mask frame; a blocking portion protruding outward is formed on a side of the mask frame opposite to the side where the flat portion or the recessed portion is formed, wherein the blocking portion and the flat portion or the recessed portion are formed such that the blocking portion of the first mask frame in the mask frame combined with substrates arranged continuously maintains a state of entering the flat portion or the recessed portion of the second mask frame without contacting each other, thereby blocking the evaporation matter from flying toward the top side of the chamber while shortening the distance between the substrates.

[0014] In the above content, a mask frame is characterized in that protruding portions protruding upward are respectively formed along the sides of two sides of the mask frame where the flat portion or the recessed portion and the blocking portion are formed to prevent the mask frame from sagging.

[0015] In the above content, a mask frame is characterized in that the end of one side where the flat portion or the recessed portion is formed and the end of the side opposite thereto where the blocking portion is formed are provided with protruding portions protruding upward along the sides, and the flat portion or the recessed portion and the blocking portion are respectively formed on the protruding portions.

[0016] In the above content, a mask frame is characterized in that a blocking portion is formed at a predetermined height of the protruding portion, and a recessed portion for the blocking portion to enter is formed by digging the outer end of the protruding portion inward.

[0017] In the above content, a mask frame is characterized in that the recessed portion and the blocking portion are respectively formed at a predetermined height of the end main body of the side of the mask frame.

[0018] In the above content, a mask frame is characterized in that protruding portions protruding upward are respectively formed along the sides of the sides of the mask frame where the flat portion or the recessed portion and the blocking portion are not formed.

[0019] In the above content, a mask frame is characterized in that the protruding portion includes an opening portion for a mask bar to pass through and be fixed to the mask frame.

[0020] In the above description, a mask frame is characterized in that the portions forming the width and thickness inside the end body of the mask frame are processed to have an image inclined along the inclined direction of the material beam.

[0021] In the above description, a mask frame is characterized in that one end of the side where the flat portion or the recessed portion is formed and the end of the side opposite thereto where the blocking portion is formed is provided with a protruding portion protruding upward along the side.

[0022] In the above description, a mask frame is characterized in that a substrate is fixed by providing a substrate fixing device including one or more clamps on a flat portion at the end of the mask frame.

[0023] In the above description, a mask frame is characterized in that the inner wall of the mask frame is provided with: a first stepped portion protruding inwardly of the mask frame; and a second stepped portion continuous with the lower end of the first stepped portion, wherein the first stepped portion corresponds to a guide rail for conveying a chuck for loading onto a mask disk, and the second stepped portion corresponds to an anti-slip pad placement portion for supporting an anti-slip pad provided on the chuck. Below the mask frame, a plurality of stepped portions recessed downward are provided on four sides of the mask frame as mask bar insertion and welding portions for arranging and welding a mask bar to the mask frame.

[0024] In the above description, a mask frame is characterized in that the inner wall of the mask frame is provided with: a first stepped portion protruding inwardly of the mask frame; and a second stepped portion continuous with the lower end of the first stepped portion. A substrate fixing device including a clamp is arranged on the first stepped portion, and the second stepped portion corresponds to a support surface for supporting the substrate. Below the mask frame, a mask bar is welded and arranged on the mask frame. In order to make the mask bar closely adhere to the substrate, a substrate support surface is not formed in the portion of the substrate support surface of the second stepped portion through which the mask bar passes.

[0025] In the above description, a mask frame is characterized by further comprising: a plurality of clamp insertion grooves formed at a predetermined interval in the second stepped portion, wherein the clamp insertion grooves are spaces for receiving clamps as auxiliary units for grasping the substrate to the chuck.

[0026] In the above description, a mask frame is characterized in that a roller support surface for contacting a roller for conveying the mask is formed at the outermost edge of the lower surfaces of two opposite sides of the mask frame, and the roller support surface is formed as a recessed stepped portion on the outermost side while avoiding the mask bar insertion and welding portion.

[0027] In the above, a mask frame is characterized in that the distance between the ends of the mask frame is designed to be 10 mm to 50 mm, the distance from the inner wall of the first step portion to the end of the mask frame is designed to be 10 mm to 100 mm, and the distance between substrates is 100 mm to 300 mm.

[0028] In the above, a mask frame is characterized in that it is configured in such a way that among the thicknesses of the respective sides of the mask frame, the thickness from the lower surface of the mask frame to the guide rail mounting portion is the same for the four sides of the mask frame, and the total thickness from the lower surface of the mask frame to the upper surface of the mask frame is different for each side.

[0029] In the above, a mask frame is characterized in that it includes: the mask frame as described above; and a substrate fixed by a substrate fixing device on the flat portion of the mask frame, wherein the deposition system is configured to deposit a substance on the substrate while moving in a predetermined horizontal or vertical direction.

[0030] In the above, a mask frame is characterized in that the substrate is clamped on a chuck.

[0031] Moreover, the present invention provides a deposition system, which is characterized in that it includes: the mask frame as described above; and a chuck on which a substrate is clamped at the first step portion and the second step portion of the mask frame, and the deposition system is configured to deposit a substance on the substrate while moving in a predetermined horizontal or vertical direction.

[0032] Moreover, the present invention provides a deposition system, which is characterized in that it includes: a mask frame; and a substrate disposed on the substrate support surface of the mask frame, and the deposition system is configured to deposit a substance on the substrate while moving in a predetermined horizontal or vertical direction.

[0033] According to the present invention, since the distance between substrates that are continuously brought into and out of the process chamber is reduced, effects such as reduction of material waste, shortening of adhesion time, and reduction of the overall system size including the chamber can be obtained, and it can be equally applied to an in-line deposition apparatus using a vertical deposition method or a horizontal deposition method without being affected by the deposition direction.

[0034] Moreover, since the size of the manufactured mask frame is also reduced, the weight is also reduced, and there are also advantages in terms of materials and transportation.

[0035] Moreover, in the present invention, while reducing the distance between substrates as described above, the rigidity and tension of the protruding portion can be enhanced to prevent the sagging phenomenon of the mask frame.

[0036] Moreover, in the mask frame provided by the present invention, not only is the distance between substrates reduced, but also the distance between the substrate and the evaporation source is reduced, thereby additionally improving the usage efficiency of the deposition material and reducing sagging.

[0037] Moreover, while shortening the distance between substrates as described above, the present invention forms a plurality of mask bar insertion and welding parts on the lower surface of the mask frame in the form of recessed stepped parts, so that the stretching and welding processes of the mask bars can be easily implemented with conventional equipment.

[0038] Moreover, the present invention forms stepped parts for placing the chuck on the inner wall of the mask frame like two steps, so that the rail and the anti-slip pad can be placed on the mask frame in accordance with their respective heights. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 are a perspective view and a sectional view showing the structure of a currently used mask frame.

[0040] Figure 2 is a sectional view showing the end structure of a mask frame having a recessed part on one side and a protruding blocking part on the other side in order to shorten the distance between substrates according to an embodiment of the present invention.

[0041] Figure 3 shows Figure 2 the perspective view, side view and sectional view of the mask frame.

[0042] Figure 4 shows regarding Figure 3 the simulation result diagram of the degree of the sagging phenomenon caused by the mold frame in the deposition process environment.

[0043] Figure 5 is a sectional view showing the end structure of a mask frame forming a recessed part and a blocking part for reducing the distance between substrates on a protruding part protruding upward according to another embodiment of the present invention.

[0044] Figure 6 shows Figure 5 substantially similar but Figure 5 the perspective view, side view and sectional view of the mask frame with a slightly deformed shape of the recessed part and the blocking part.

[0045] Figure 7 shows regarding Figure 6 the simulation result diagram of the degree of the sagging phenomenon caused by the mold frame in the deposition process environment.

[0046] Figure 8 is shown as being designed to be in Figure 2Side view and cross-sectional view of a mask frame that increases the spacing between substrates slightly but reduces the sag amount in terms of its structure.

[0047] Figure 9 It shows regarding Figure 8 The figure showing the simulation result of the degree of the sag phenomenon caused by the mold frame in the deposition process environment.

[0048] Figure 10 It is a side view and cross-sectional view showing the end configuration of a mask frame in which a recessed portion and a blocking portion are formed in the end body of the mask frame as another embodiment of the present invention.

[0049] Figure 11 It shows regarding Figure 10 The figure showing the simulation result of the degree of the sag phenomenon caused by the mold frame in the deposition process environment.

[0050] Figure 12 It is a side view and cross-sectional view showing the end configuration of a mask frame in which a recessed portion and a blocking portion are formed in the end body of the mask frame and convex portions protruding upward are provided on two sides opposite to the mask frame as another embodiment of the present invention.

[0051] Figure 13 It shows in a perspective view the situation where an opening 270 for passing a mask bar is formed in the protruding convex portion body in the end of the Figure 12 mask frame.

[0052] Figure 14 It shows regarding Figure 12 The figure showing the simulation result of the degree of the sag phenomenon occurring in the mold frame in the deposition process environment.

[0053] Figure 15 It shows as Figures 12 to 13 The front view, side view, and cross-sectional view of the situation where convex portions protruding upward are provided on all four sides of the mask frame as a modified embodiment.

[0054] Figure 16 It is Figure 15 The perspective view of the mask frame.

[0055] Figure 17 It shows regarding Figure 15 The figure showing the simulation result of the degree of the sag phenomenon caused by the mold frame in the deposition process environment.

[0056] Figure 18 It shows the simulation result of the situation where the structure is the same as that of the Figure 15 mask frame but the size is changed to slightly increase the spacing between substrates and increase the length of the frame part to reduce the sag amount.

[0057] Figure 19 Shows the case where the structure of the mask frame is the same as that of Figure 12 , but the size is changed to reduce the spacing between substrates, and the amount of sag is further reduced.

[0058] Figure 20 Is a diagram showing the simulation results of the mask frame regarding Figure 19 .

[0059] Figure 21 Is Figure 15 A modified embodiment, showing the case where the detailed dimensions of each part constituting the mask frame are adjusted to reduce the spacing between substrates and minimize the amount of sag.

[0060] Figure 22 Is a diagram showing the simulation results of the mask frame regarding Figure 21 .

[0061] Figure 23 And Figure 24 Are embodiments showing an asymmetric structure with protrusions formed only on the edges on one side.

[0062] Figure 25 Is a cross-sectional view of an embodiment showing the case where a mask bar is stretched and welded to the lower part of a mask frame.

[0063] Figure 26 Is an enlarged cross-sectional view showing an overlapping part of a recessed part and a blocking part of masks arranged before and after in a deposition system in an enlarged manner.

[0064] Figure 27 Is a 3D view of a mask frame of an embodiment regarding the case where a mask bar is stretched and welded to the lower part of a mask frame.

[0065] Figure 28a Is a front view showing the case where a mask frame is located on a roller shaft 600 in a horizontal deposition process as observed in the traveling direction.

[0066] Figure 28b Is a front view showing the case where a mask frame is located on a roller shaft 600 in a vertical deposition process as observed in the traveling direction.

[0067] Figure 29 Is a perspective view showing the case where the thickness is changed according to the side edges of a mask frame as a modified embodiment of the present invention.

[0068] Figure 30 Is a perspective view showing an image where a mask bar 450 is welded and fixed to a mask frame in this embodiment.

[0069] Figure 31 Is in the case where a substrate is fixed to a mask frame using only a substrate fixing device such as pliers and used for a deposition process, Figure 27Embodiments of the implementation example of the deformation.

[0070]

Symbol Explanation

[0071] 20, 30, 220: Blocking part 200: Mask frame

[0072] 210: Concave part 230, 235: Convex part

[0073] 250: End part body 270: Opening part

[0074] 280: Mask bar insertion welding part 300: Tilted cross-section

[0075] 400, 410: Placement part 450: Mask bar

[0076] 500: Chuck 510: Anti-slip pad

[0077] 520: Guide rail 501: Step part

[0078] 511: Forceps 521: Substrate support surface Detailed implementation method

[0079] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0080] Figure 1 It is a perspective view and a cross-sectional view showing the structure of a currently used mask frame.

[0081] On the end of one side of the mask frame, a protruding blocking part 20 is formed, and on the end of the opposite side, a protruding blocking part 30 is formed. The blocking part 30 does not collide with the blocking part 20 due to the different heights and can be located at an overlapping position in the vertical direction. As described above, such a blocking part serves to block the evaporation substance so as not to contaminate the top of the chamber. The path of the evaporation substance reaching the end of the substrate is shown by thick lines. Considering this inclination, the inner contour of the end part body of the mask frame is formed along the thin lines 215 and 225 so that the material beam will not be blocked by the inside of the mask frame body. That is, due to the inclination angle of the material beam, the width w and thickness t of the end part body of the mask frame are formed with limited dimensions, and the length of the edge width L (from the end of the substrate to the starting point of the blocking part) needs to have a predetermined level due to the inclination angle of the material beam. For example, w and t are 50 mm or more, and L is 150 mm or more. Here, due to the presence of the protruding blocking parts 20 and 30 for blocking the material, the distance between the substrates must be 2L + the length of the blocking part or more. In an eighth-generation deposition device, the distance D between the substrates can be 400 mm or more. The problems of waste of material, adhesion time delay, and increase in chamber size caused by the distance between the substrates have been described. However, the presence of the protruding blocking part is necessary in the continuous process of the on-line system.

[0082] Figure 2 In the case of attempting to reduce the distance between substrates to improve the Figure 1 blocking portion configuration. Figure 3 It is a perspective view, side view, and sectional view of a mask frame that can be more easily understood Figure 2 thereof.

[0083] A recessed portion 210 is formed on one side of the mask frame 200, and a blocking portion 220 protruding like a wing is formed on the other side, such that the end of the protruding blocking portion 220 enters the recessed portion 210 but there is still a gap between them and they are in a non-contact state with each other. And, the end of the mask frame is processed such that the edge width extending from the end of the substrate is reduced, and the portion forming the width and thickness inside the end body of the mask frame has an inclined shape according to the inclination of the material beam. With this mask frame configuration, the distance between substrates continuously introduced into the chamber is reduced by more than 40% compared to Figure 1 before, the material usage is decreased by about 5%. The adhesion time is also shortened by 5 - 6%.

[0084] In addition, in a deposition process environment, the mask frame may undergo deformation due to its own weight. For example, if the longer side of the mask frame is placed on a roller and supported during the process, then a phenomenon such as the sagging of the center portion of the shorter side of the mask open frame occurs. Figure 4 It is a diagram showing the simulation result of the degree of sagging phenomenon that occurs in the mask frame Figure 3 in a deposition process environment. In the case of Figure 1 as such, according to the simulation, a sagging amount of about 1.87 is generated, Figure 2 and the sagging amount of the mask frame of

[0085] Figure 5 is 3.57, showing a case where the sagging amount increases. The reason can be speculated as follows: Instead of reducing the edge width, in order to reduce the length, the thickness and width portions inside the end body 250 are cut into an inclined section 300, thus resulting in a decrease in the weight and rigidity of the sides constituting the frame. Accordingly, the present invention provides another embodiment to strengthen the weight and rigidity of the mask frame end. Figure 6 It shows that Figure 5 is almost the same configuration as the mask frame of Figure 6 but Figure 5 is a perspective view, side view, and sectional view showing a case where the shapes of the recessed portion and the blocking portion are slightly modified. That is, Figure 2The inclined shape on the inner side of the end body of the mask frame, but the recessed portion 210 and the protruding blocking portion 220 formed at the end are not formed on the end plane of the mask frame, but on the protruding portions 230, 235 that protrude upward. This configuration of the protruding portion can compensate for the reduction in weight and rigidity caused by the portion cut off to form the inclined section 300 on the inner side of the end body 250. Even if Figure 5 the recessed portion is deformed into a flat portion, the same effect can be obtained as long as the end of the blocking portion 220 can enter the inner side of the end of the flat portion.

[0086] Also, the blocking portion 220 can be formed at a predetermined height of the protruding portion as Figure 6 shown, and the outer end of the protruding portion is dug inward to form a recessed portion 210 into which the blocking portion 220 can enter.

[0087] Figure 7 is a diagram showing the simulation results of the degree of sagging phenomenon that occurs in the deposition process environment of the Figure 6 die frame. Figure 5 The mask frame of Figure 1 and Figure 2 can also obtain almost the same results through this simulation. The simulation result shows that the sagging amount is 1.01, which is much smaller than the sagging amounts of Figure 13 and

[0088] Figure 8 Since the spacing between the substrates is maintained at 215 mm while further reducing the sagging amount, it is advantageous in various aspects. However, since the mask bar cannot be mounted on the mask frame as in the past due to the protruding portion, an opening 270 through which the mask bar can pass needs to be formed in the protruding portion. The opening 270 can be formed as Figure 13 shown.

[0088] Figure 8 is a side view and a cross-sectional view showing a mask frame that is designed in the Figure 2 configuration to make the spacing between the substrates slightly farther while reducing the sagging amount. That is, by making the edge of the mask frame end slightly longer, the weight and rigidity of the frame itself are strengthened to prevent the sagging phenomenon. In this embodiment, the spacing between the substrates is 255 mm, which is longer than the case in Figure 2 .

[0089] Figure 9 is a diagram showing the simulation results of the degree of sagging phenomenon that occurs in the deposition process environment of the Figure 8 die frame. The sagging amount is 2.45, which is smaller than the case in Figure 2 (3.57).

[0090] Figure 10 is a side view and a cross-sectional view showing the end configuration of the mask frame. In this mask frame, in order to make the spacing between the substrates the same as that in Figure 8The spacing in it is the same or smaller, and the amount of sag is reduced, and the recessed portion 210 and the blocking portion 220 are formed on the end body of the mask frame. The recessed portion 210 is formed on the vertical surface of the end body on one side of the mask frame, and the protruding blocking portion 220 that enters the recessed portion 210 is formed on the end vertical surface on the other side. The blocking portion 220 can be arranged to fit with the recessed portion 210 to reduce the spacing between the substrates, and a gap is maintained in such a way that the blocking portion and the recessed portion do not contact each other.

[0091] Figure 11 is a diagram showing Figure 10 the degree of the sag phenomenon that occurs in the mold frame during the deposition process environment. The amount of sag is 2.21, which is smaller than the amount of sag Figure 8 in it.

[0092] Figure 12 is a front view, a side view, and a sectional view showing the end constitution of the mask frame. In this mask frame, in order to reduce the amount of sag, a protruding portion that bulges upward is further provided on the basis of the Figure 10 mask frame, and the spacing between the substrates is further reduced. Due to the upward protruding portions 230 and 235, it is difficult to mount the mask bar to the mask frame, so openings 270 are formed in the protruding portions 230 and 235. Here, the spacing between the substrates is 215 mm, which is the same as the spacing Figure 2 in it.

[0093] Figure 13 is a perspective view showing the case where an opening 270 for passing the mask bar is formed in the protruding portion body that protrudes in the end of the Figure 12 mask frame.

[0094] Figure 14 is a diagram showing Figure 12 the degree of the sag phenomenon that occurs in the mold frame during the deposition process environment. Due to the protruding portion, the amount of sag is reduced to 1.64.

[0095] Figure 15 is a front view, a side view, and a sectional view showing the case where upward protruding portions are provided on all four sides of the mask frame as a Figures 12 to 13 variant embodiment, Figure 16 is its perspective view, and the state where the protruding portions are formed on the four sides can be observed more easily. Thus, by forming protruding portions not only on the upper part of the side where the recessed portion 210 and the blocking portion 220 are formed but also on other sides, the thickness of the mask frame can be further reduced while suppressing sag, and the spacing between the substrates can be further reduced. The thickness in this embodiment is 40 mm, and the spacing between the substrates is 165 mm. Figure 1In the past, the thickness of the mask frame was usually 50 mm or more. In this embodiment, the thickness is reduced by more than 10 mm. If the thickness of the mask frame other than the protruding portion is reduced, the distance between the substrate placed on the mask frame and the evaporation source will be shortened, and it is expected to improve the usage efficiency of the deposition raw material. If such a structure is applied, a considerable part of the weight can also be reduced.

[0096] That is, protruding portions protruding upward can be formed on all four sides of the mask frame. The thickness of the mask frame other than the protruding portions can be reduced by about 10% to 30% compared to the case without the protruding portions, reducing the height of the frame surface for placing the substrate and shortening the distance between the substrate and the evaporation source. As described above, since the distance between the substrate and the evaporation source is shortened, the material efficiency is improved and the shadow effect of the evaporated material beam is reduced, which is advantageous.

[0097] Figure 17 is a diagram showing the simulation results of the degree of sagging phenomenon that occurs in the mask frame regarding Figure 15 in the deposition process environment. In this case, although the distance between the substrates is reduced to about 165 nm, the sagging amount is predicted to increase to 3.83. Since the distance between the substrates is small, effects such as reduction of wasted material, shortening of the adhesion time, and reduction of space can be obtained.

[0098] Figure 18 shows the case where the detailed dimensions of Figure 15 are adjusted to further reduce the sagging amount. That is, Figure 18 is a diagram showing the following simulation results: Although the mask frame structure is the same as that of Figure 15 , the distance between the substrates is made slightly farther by changing the dimensions, and the length of the frame part is increased while the sagging amount is reduced. When adjusting the dimensions, the distance between the substrates is increased to 215 mm, but the sagging amount is reduced to 2.7.

[0099] The case where the situation is returned to forming protruding portions only on two sides for optimization and the detailed dimensions are adjusted is shown in Figure 19 .

[0100] Figure 19 For Figure 12 , the mask frame structure is the same (protruding portions are formed on two sides), but the height h of the protruding portions is increased, and the distance between the substrates is shortened to 165 mm.

[0101] Figure 20 shows the simulation results regarding Figure 19 of the mask frame, and the sagging amount is predicted to be further reduced to 1.59.

[0102] According to Figure 20As a result, in order to obtain better results, the detailed dimensions were also optimized for the case where protrusions were formed on all four sides.

[0103] Figure 21 For Figure 15 a modified embodiment, which shows a case where the height h of the protrusions formed on the four sides is increased to compensate for the thinned mask frame thickness, and the detailed dimensions of each part constituting the mask frame are adjusted to shorten the distance between the substrates, minimizing the sag amount. That is, the dimensions were adjusted such that the height h of the upwardly protruding protrusions was increased, and its width w1 was slightly narrowed, and the horizontal component length of the blocking portion was slightly shortened, etc., so that the distance between the substrates became closer. The mask frame thickness was thinned to 40 mm, and the distance between the substrates was 165 mm.

[0104] Figure 22 Shows regarding Figure 21 the simulation results of the mask frame, predicting that the sag amount will be optimized to 1.09. By applying this structure, the deposition material usage efficiency can be improved by virtue of the effects of reducing the distance between the substrates and the distance between the substrate-evaporation source, and the deformation of the mask frame can be suppressed while improving the overall system efficiency.

[0105] Figure 23 is a perspective view of a modified embodiment in which upwardly protruding protrusions are formed only on one side where the recessed portion or the blocking portion is formed, Figure 24 and this is its cross-sectional view. The upwardly protruding protrusions are formed asymmetrically, Figure 23 showing a case where the protrusions are formed on the side with the recessed portion. This configuration can reduce the distance between the substrates, reduce the sag amount of the mask frame, and can be further simplified in terms of the structure. The asymmetric structure can be applied to all of the above embodiments.

[0106] Figure 25 Shows an embodiment in which the mask bar is stretched and welded to the lower part of the mask frame.

[0107] As a view observed from the side in the traveling direction of the mask frame in the deposition process, the recessed portion 210 at the right end and the protruding blocking portion 220 at the left end overlap each other like a fit, just as described before, for different masks, thus blocking the passage of the deposition material.

[0108] As Figure 25 shown in the cross-sectional view of the left half side, stepped placement portions 400, 410 are formed by intaglio on the inner side of the mask frame to place the chuck. The first stepped portion is a guide rail placement portion 400 for placing the guide rail 520 for conveyance located at the edge of the chuck, and the second stepped portion is an anti-slip pad placement portion 410 for supporting the anti-slip pads 510 formed at a predetermined interval along the inner edge of the chuck guide rail.

[0109] The structure as described above is the same as the above embodiment in that the lengths of the front and rear ends of the mask frame can be shortened and optimized to reduce the distance between substrates and improve the material usage efficiency of the deposition system.

[0110] Since the chuck is placed in the placement parts 400 and 410 that are engraved on the inner side of the mask frame, the distance between the substrate and the evaporation source is reduced compared with the previous mass production method, and the material deposition efficiency can be additionally improved.

[0111] The mask bar is stretched and welded to the mask bar insertion welding portion 280 (shown only on the right half of the figure for convenience) under the frame. When the mask frame is turned over and placed with the bottom of the mask frame facing upward and the welding process is performed, there is an advantage that the same stretcher equipment and manufacturing method used in the conventional mask manufacturing process can be applied. Figures 12 to 24 The upper part of the mask frame is applied with a structure having a protrusion. Since the rods need to be welded to the mask frame in order to avoid the protrusion, the stretcher equipment previously used in the mask manufacturing process cannot be used for the rod stretching process. It is necessary to change the stretcher for the rod loading and stretching process. However, this embodiment does not have such a problem.

[0112] A roller support surface 420 is arranged at the edge of the mask frame to contact and support a driving part such as a roller in order to transfer the mask from the deposition system.

[0113] Figure 26 1 is an enlarged cross-sectional view showing in enlarged form the overlapped portion of the recessed portion 210 and the blocking portion 220 of the mask frames arranged front and back in the deposition system.

[0114] The chuck 500 is shown together with the placement parts 400 and 410. The substrate 100 is attached to the lower part of the chuck, and the lower part of the substrate can be adjusted in a manner that the height of the anti-slip pad 510 is adjusted to be consistent with the position of the mask bar. Figure 30 As exemplarily shown in FIG. 4 , the mask bar 450 may be fixed to the surface of the mask bar insertion welding part 280 by welding.

[0115] In this embodiment, the distance G to G between substrates can be reduced and optimized compared to the prior art by adjusting dimensions such as the distance W from the inside of the rail mounting portion 400 to the end of the mask frame, the front and rear mask frame end spacings g and L (the distance from the substrate end to the end of the original mask frame except for the blocking portion), etc. If W is adjusted within a range of approximately 10 to 100 mm and g is adjusted within a range of 10 to 50 mm, the distance G to G between substrates can be optimized to be between 100 mm and 300 mm. To ensure rigidity, it can be used within a range where the frame thicknesses t1 and t2 are in the range of several tens of mm without significantly increasing the weight of the mask frame.

[0116] The thicknesses t1 (the thickness from the bottom surface of the mask frame to the rail mounting portion 400) and t2 (the total thickness from the bottom surface to the top surface of the mask frame) of the mask frame can be designed as predetermined values within a range where rigidity can be ensured and the weight increase is not significant.

[0117] Figure 27 It is a 3D view of the mask frame according to this embodiment.

[0118] The previously described chuck mounting portions 400 and 410 are shown in detail in the enlarged view of the top surface of the mask frame. The clamp insertion groove 430 formed in a part of the anti-slip pad mounting portion 410 is used to ensure a space for accommodating the clamp when the chuck is placed in the case where the clamp is an auxiliary technical means for supporting the substrate, and it can be removed according to whether the clamp is used.

[0119] The mask frame has no mask bar welding portion on the top surface, and a large number of mask bar insertion and welding portions 280 for arranging and welding the bars to the frame are formed on the four sides of the bottom surface.

[0120] In this embodiment, the mask bar insertion and welding portions 280 are formed at a total of 24 locations. The mask bar insertion and welding portions 280 can be stepped surfaces of depressions dug out with a predetermined thickness, and the mask bars can be fixed by welding using a part of the other surface (bottom surface) of the mask frame.

[0121] A roller support surface 420 can be formed at the edge of the outermost contour portion of the bottom surface of the mask frame. The roller support surface 420 is used to support the roller for conveying the mask as it passes through. The roller support surface 420 is located on the outermost side, avoiding the mask bar insertion and welding portions 280.

[0122] Figure 28a It is a front view of observing the mask frame on the roller 600 in the horizontal deposition process in the traveling direction. The mask frame is conveyed while the roller 600 contacts the roller support surface 420 of the mask frame to support the mask frame.

[0123] Although the thickness t1 from the bottom of the mask frame to the guide rail mounting portion 400 is the same for the four sides of the mask frame, the height protruding upward to the guide rail mounting portion 400 can be independently set differently for each side of the mask frame.

[0124] Figure 28b FIG. 4 is a front view seen in the traveling direction when the mask frame is located on the roller 600 in the vertical deposition process. The inclined mask frame can be conveyed by the rollers 600 placed along its upper and lower sides. Even in this case, the blocking portion can be formed on the side of the mask frame that does not contact the roller to achieve effects such as preventing material waste between adjacent mask frames.

[0125] Figure 29 FIG. 8 is a perspective view showing a case where the thickness is changed according to the side of the mask frame as a modified embodiment of the present invention.

[0126] In the embodiment figure, a case is shown where the overall thickness t1 + B of each of the two sides supported by the driving portion such as the roller in the mask frame is smaller than the overall thickness t1 + A of each of the two sides on the overlapping side of the front and rear blocking portions and the recessed portions in the traveling direction of the mask frame. Here, A is the thickness from the guide rail mounting portion 400 of the side where the blocking portion or the recessed portion is formed to the upper surface of the mask frame, and B is the thickness from the mounting portion 400 of the side where there is no blocking portion or recessed portion to the upper surface of the mask frame.

[0127] In this case, the overall thickness of each of the two sides on the overlapping side becomes thicker than the overall thickness of each of the two sides supported by the roller by A - B. Thus, a structure can be achieved in which the sag of the mask frame is reduced during the deposition process while the thickness of the two sides supported by the roller that do not sag is thinner, thereby also reducing the thickness of the mask frame.

[0128] In addition to the above embodiment, the thickness of each side of the mask frame can be set in various combinations.

[0129] Figure 30 FIG. 21 is a perspective view showing an image in which the mask bar 450 is welded and fixed to the mask frame in this embodiment. A case is shown where the end portion of the mask bar 450 is welded to the mask bar insertion welding portion 280 under the mask frame.

[0130] In the Figure 30 The arrangement of the mask bars shown is only an example. It is obvious that the mask bars can be arranged in various configurations with different numbers and attachment positions according to the deposition model. And, in the Figures 25 to 31 embodiment shown, the structure for blocking the deposited material is not limited to the examples of the recessed portion 210 and the blocking portion 220 shown in the figure, and can be applied in the same way Figure 2 、 Figure 5 、Figure 7 A deposition material blocking structure such as in the previous embodiments of the present invention. (For example, a deposition material blocking structure combining a flat portion and a blocking portion).

[0131] The mask developed using the present invention can be used in both the case of depositing while attaching glass to a chuck plate and the case of depositing using only a glass substrate. In the case of using only a glass substrate, a device for fixing the glass substrate can be fixed onto the mask and used ( Figures 2 - 24 as shown in the embodiment). In Figures 25 - 30 the embodiment shown, although a device for fixing the glass substrate can also be set at the positions of the placement portions 400 and 410 to fix the substrate, since the fixing may not be firm, the support surface for supporting the substrate can also be formed by the mask frame to stably support and fix. In Figure 31 FIG. shows an embodiment thereof in a schematic plan view and a cross-sectional view corresponding to A - A'. Similar to the case of using a chuck plate, there are two stepped portions engraved in the inner side of the mask frame. The first stepped portion (the first stepped portion) located on the outer side is a stepped portion 501 for setting a substrate fixing device such as a clamp, and the second stepped portion (the second stepped portion) inside it is a stepped portion that becomes a support surface 521 for supporting the substrate. There is a clamp 511 for fixing the substrate 100 on the first stepped portion 501, and the edge position of the substrate is stably fixed by the clamp 511 in a state of being supported by the substrate support surface 521. Since the mask bar 450 needs to be in close contact with the substrate at the portion where the mask bar 450 passes, the substrate support surface 521 is not formed. As described above, the mask bar is welded to the mask frame. For convenience, stepped portions with recesses dug out can be formed on the four sides of the mask frame, or it can be welded to the end of the mask frame without the dug - out recessed stepped portions.

[0132] In addition, as described above, in the mask frame embodiment, one or more clamps for fixing the glass substrate can be provided on the flat end portion on the mask frame ( Figures 2 - 24 as shown in the embodiment) or on the inner stepped portion 501 of the mask frame ( Figures 25 - 30 as shown in the embodiment). That is, one or more clamps can be arranged at positions such as the flat surface for placing the substrate, the upper end of the protruding portion that bulges upward, the inside of the protruding portion main body, or the stepped portion 501 for setting the substrate fixing device.

[0133] Accordingly, a deposition system can be realized in which a glass substrate placed on the flat end portion of the mask frame or on the inner stepped surface dug out by engraving is fixed to the mask frame by a clamp and moved.

[0134] Furthermore, in the above description, a glass substrate can also be placed on other units other than the chuck, and fixed by a fixing device other than the clamp to restrict the movement of the glass substrate, thereby constituting a linear deposition system capable of depositing while moving in one direction.

[0135] According to the present invention, compared with the prior art, it is possible to reduce deposition materials such as organic substances and metals by 3% to 7%, reduce the adhesion time by 5% to 7%, and obtain direct / indirect chain effects such as reduced material and processing costs and occupied area due to the reduced weight and size of the mask frame and the reduced chamber size.

[0136] The rights of the present invention are not limited to the embodiments described above, but are defined by the claims. It is obvious that those with ordinary knowledge in the field of the present invention can make various deformations and modifications within the scope described in the claims.

Claims

1. A mask frame, fixed with a mask bonded to a substrate, characterized in that, a recessed portion recessed inward toward the side where the substrate is disposed is formed on a first side of the mask frame; a blocking portion protruding outward is formed on a second side of the mask frame opposite to the first side where the recessed portion is formed, wherein the blocking portion and the recessed portion are formed such that the blocking portion of the first mask frame in the mask frames bonded to substrates disposed continuously with each other maintains a state of entering the recessed portion of the second mask frame without contacting each other, thereby blocking the evaporation material from flying toward the top side of the chamber while shortening the distance between the substrates, the first side and the second side are provided with protruding portions protruding upward along the sides.

2. The mask frame according to claim 1, characterized in that, the recessed portion and the blocking portion are respectively formed at a predetermined height on the first side and the second side of the mask frame.

3. The mask frame according to claim 2, characterized in that, the recessed portion and the blocking portion are respectively formed at the end portions of the first side and the second side of the mask frame.

4. The mask frame according to any one of claims 1 to 3, characterized in that, the portion forming the width and thickness inside the end body of the mask frame is processed to have an image inclined along the inclination direction of the material beam.

5. The mask frame according to claim 1, characterized in that, the substrate is fixed by providing a substrate fixing device including one or more clamps on a flat portion at the end of the mask frame.

6. The mask frame according to claim 1, characterized in that, the inner wall of the mask frame is provided with: a first stepped portion protruding inward of the mask frame; and a second stepped portion continuous with the lower end of the first stepped portion, wherein the first stepped portion becomes a guide rail placement portion for placing a guide rail, and the guide rail is located at the edge of the chuck for transporting the chuck loaded on the mask frame, the second stepped portion becomes an anti-slip pad placement portion for supporting an anti-slip pad provided at the edge of the guide rail located at the edge of the chuck, below the mask frame, a plurality of stepped portions recessed downward are provided on the four sides of the mask frame as a mask bar insertion and welding portion for arranging and welding a mask bar to the mask frame.

7. The mask frame according to claim 1, characterized in that, the inner wall of the mask frame is provided with: a first stepped portion protruding inward of the mask frame; and a second stepped portion continuous with the lower end of the first stepped portion, a substrate fixing device including a clamp is arranged on the first stepped portion, the second stepped portion is used to support the substrate, below the mask frame, the mask bar is welded and arranged to the mask frame. In order to make the mask bar close to the substrate, the portion of the substrate support surface of the second stepped portion where the mask bar passes is not formed with a substrate support surface.

8. The mask frame according to claim 6 or 7, characterized in that, the distance between the ends of the mask frame is designed to be 10 mm to 50 mm, the distance from the inner wall of the first stepped portion to the end of the mask frame is designed to be 10 mm to 100 mm, and the distance between the substrates is 100 mm to 300 mm.

9. The mask frame according to claim 6 or 7, characterized in that it is configured in the following manner: among the thicknesses of the respective sides of the mask frame, the thickness from the lower surface of the mask frame to the guide rail mounting portion is the same for the four sides of the mask frame, and the total thickness from the lower surface of the mask frame to the upper surface of the mask frame is different for each side.

10. A deposition system, characterized in that, Comprising: the mask frame according to claim 1; and a substrate, fixed by a substrate fixing device on the flat portion of the mask frame, wherein the deposition system is configured to deposit a substance on the substrate while moving in a predetermined horizontal or vertical direction.

11. The deposition system according to claim 10, characterized in that the substrate is clamped on a chuck.

12. A mask frame, fixed with a mask bonded to a substrate, characterized in that a first protrusion and a second protrusion protruding upward from the end along the side are respectively provided on the first side and the second side facing each other, a recessed portion recessed inward toward the side where the substrate is arranged is formed in the first protrusion, a blocking portion protruding outward toward the first protrusion is formed in the second protrusion, wherein the blocking portion and the recessed portion are formed such that the blocking portion of the first mask frame in the mask frame bonded to the substrates arranged continuously with each other maintains a state of entering the recessed portion of the second mask frame without contacting each other, thereby blocking the evaporation matter from flying toward the top side of the chamber while shortening the distance between the substrates.

13. The mask frame according to claim 12, characterized in that the first protrusion and the second protrusion include openings for a mask bar to pass through and be fixed to the mask frame.

14. The mask frame according to claim 12, characterized in that the portions of the width and thickness inside the end body of the first side and the second side forming the mask frame are processed to have an image inclined along the inclination direction of the material beam.

15. The mask frame according to claim 12, characterized in that the substrate is fixed by providing a substrate fixing device including one or more clamps on the flat portion at the end of the mask frame.

16. The mask frame according to claim 12, characterized in that the inner wall of the mask frame is provided with: a first stepped portion protruding inward of the mask frame; and a second stepped portion continuous with the lower end of the first stepped portion, wherein the first stepped portion becomes a guide rail mounting portion for arranging a guide rail, and the guide rail is located at the edge of the chuck for conveying the chuck loaded on the mask frame, the second stepped portion becomes an anti-slip pad mounting portion for supporting an anti-slip pad provided at the edge of the guide rail located at the edge of the chuck, on the lower surface of the mask frame, a plurality of stepped portions recessed downward are provided on the four sides of the mask frame as mask bar insertion and welding portions for arranging a mask bar and welding it to the mask frame.

17. The mask frame according to claim 12, characterized in that the inner wall of the mask frame is provided with: a first stepped portion protruding inward of the mask frame; and a second stepped portion continuous with the lower end of the first stepped portion, a substrate fixing device including a clamp is arranged on the first stepped portion, the second stepped portion is for supporting the substrate, Below the mask frame, mask bars are welded and arranged to the mask frame. In order to make the mask bars closely adhere to the substrate, the portion of the substrate support surface of the second stepped portion through which the mask bars pass is not formed with the substrate support surface.

18. The mask frame according to claim 16, characterized in that, It further includes: Clamp insertion grooves, a plurality of which are formed at a predetermined interval in the second stepped portion, wherein the clamp insertion grooves are spaces for receiving clamps which are auxiliary units for gripping the substrate to the chuck.

19. The mask frame according to claim 16, characterized in that On the outermost edge of the lower surfaces of two opposite sides of the mask frame, a roller support surface for contacting the roller for conveying the mask is formed. The roller support surface is formed as a recessed stepped portion on the outermost side while avoiding the mask bar insertion and welding portion.

20. The mask frame according to claim 16 or 17, characterized in that The distance between the ends of the mask frame is designed to be 10 mm to 50 mm, the distance from the inner wall of the first stepped portion to the end of the mask frame is designed to be 10 mm to 100 mm, and the distance between substrates is 100 mm to 300 mm.

21. The mask frame according to claim 16 or 17, characterized in that It is configured in such a way that: in the thickness of each side of the mask frame, the thickness from the lower surface of the mask frame to the guide rail placement portion is the same for the four sides of the mask frame, and the total thickness from the lower surface of the mask frame to the upper surface of the mask frame is different for each side.

22. A deposition system, characterized in that, It includes: The mask frame according to claim 16; and A chuck, on which substrates are clamped at the first stepped portion and the second stepped portion of the mask frame, The deposition system is configured to deposit substances on the substrate while moving in a predetermined horizontal or vertical direction.

23. A deposition system, characterized in that, It includes: The mask frame according to claim 17; and A substrate, arranged on the substrate support surface of the mask frame, The deposition system is configured to deposit substances on the substrate while moving in a predetermined horizontal or vertical direction.

Citation Information

Patent Citations

  • Mask for thin film deposition, manufacturing method thereof, and manufacturing method of organic emitting display device using the same

    KR1020180047594A

  • Mask and method for forming film using mask

    CN102131949A