Camera Module

Abstract

The camera module includes: a substrate including an image sensor and an electrode; a thermoelectric element disposed on the substrate and having a surface in contact with the electrode; and a first lens disposed on the other surface of the thermoelectric element.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the benefit of priority from Korean Patent Application No. 10-2020-0110711 filed on September 1, 2020, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety for all purposes by reference. Technical Field

[0003] The present disclosure relates to a camera module. Background Art

[0004] As ADAS technology develops, it is necessary to accurately sense and determine various situations that may occur during actual driving, such as technologies for distance recognition and object classification, such as cameras, LiDAR, and radar. For example, a vehicle can obtain an image of the vehicle's surroundings through a camera and process the image using software to obtain information about the physical conditions around the vehicle.

[0005] However, when condensation or frost forms on the surface of the camera lens, it may be difficult to accurately identify surrounding objects using the camera. Conventionally, a method has been used in which heat can be transferred by wrapping a heating wire around the camera, the wire can be placed on a flexible film to wrap around the lens barrel, or an additional cover glass can be added to the lens, and a transparent electrode such as ITO (indium tin oxide) or a flexible heat transfer substrate can be applied to the lens. However, there is still a degradation in camera performance (distortion, reduced viewing angle, etc.) due to sudden changes in temperature or the addition of cover glass, and the module structure may become complicated and the manufacturing cost may increase.

[0006] In addition, in addition to forming condensation or frost on the lens, the heat generated by the image sensor may cause degradation of camera performance. The heat generated by the image sensor may damage the image sensor itself or may deform the lens barrel. When the lens barrel is deformed, the arrangement of the lenses disposed therein may change, resulting in degradation of image quality. Summary of the invention

[0007] The purpose of providing this summary is to introduce a selection of inventive concepts in a concise form, and these inventive concepts will be further described in the following detailed description. This summary is not intended to identify the key features or essential features of the subject matter claimed, nor is it intended to help determine the scope of the subject matter claimed.

[0008] In one general aspect, a camera module includes: a substrate including an image sensor and an electrode; a thermoelectric element disposed on the substrate and having a surface in contact with the electrode; and a first lens disposed on another surface of the thermoelectric element.

[0009] The thermoelectric element may be configured to cool the image sensor and heat the first lens when a voltage of a first polarity is applied to the thermoelectric element through the electrode.

[0010] The thermoelectric element may be configured to cool the first lens when a voltage having a second polarity different from the first polarity is applied to the thermoelectric element through the electrode.

[0011] The camera module may further include a second lens. The thermoelectric element may include a through portion configured to accommodate the second lens.

[0012] The second lens may include a plurality of second lenses.

[0013] The substrate may include a heat transfer member disposed below the image sensor.

[0014] The thermoelectric element may include a plurality of unit thermoelectric elements stacked along the optical axis direction.

[0015] The camera module may further include at least one second lens. The thermoelectric element may include a through portion configured to accommodate the at least one second lens.

[0016] Each of the unit thermoelectric elements may include a through portion, and the at least one second lens may be accommodated in at least one of the through portions of the plurality of unit thermoelectric elements.

[0017] At least one stepped portion may be formed between the plurality of unit thermoelectric elements, and the at least one second lens may be partially supported by the stepped portion.

[0018] The electrode may have a positive electrode and a negative electrode, and the positive electrode and the negative electrode may be electrically connected to corresponding terminals provided in the thermoelectric element.

[0019] The positive electrode and the negative electrode may have an arc shape centered on the image sensor.

[0020] The thermoelectric element may have a cylindrical shape configured to accommodate the image sensor. One end of the thermoelectric element in the length direction may be in contact with the electrode, and the other end of the thermoelectric element in the length direction may be in contact with the first lens.

[0021] The thermoelectric element may include at least one P-type semiconductor and at least one N-type semiconductor that are alternately and circumferentially disposed.

[0022] In another general aspect, a camera module includes: a substrate including electrodes and an image sensor; a thermoelectric element having one end in contact with the substrate and electrically connected to the electrodes; and a lens in contact with the other end of the thermoelectric element. The one end or the other end of the thermoelectric element is configured to absorb or release heat based on a voltage applied through the electrodes.

[0023] The thermoelectric element may be electrically connected to the substrate, and the thermoelectric element may be further configured to cool the image sensor and heat the lens when a voltage of a first polarity is applied to the thermoelectric element.

[0024] The thermoelectric element may also be configured to cool the lens when a voltage of a second polarity different from the first polarity is applied to the thermoelectric element.

[0025] The camera module may include a second lens housed in the thermoelectric element.

[0026] The second lens may include a plurality of second lenses.

[0027] Other features and aspects will be apparent from the following detailed description, the accompanying drawings, and the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 is a perspective view showing an example of a camera module.

[0029] Figure 2 It is shown Figure 1 An exploded perspective view of the camera module shown in FIG.

[0030] Figure 3 It is along Figure 1 A cross-sectional view taken along line II in FIG.

[0031] Figure 4 is a diagram showing an example of the operation of a thermoelectric element.

[0032] Figure 5 is a diagram showing an example of a thermoelectric element in which semiconductors are connected in series to each other.

[0033] Figure 6 It is shown Figure 5 FIG. 4 is a diagram of an example in which the thermoelectric element is configured to have a hollow cylindrical shape.

[0034] Figure 7 is a diagram showing an example of a thermoelectric element including a through portion therein.

[0035] Figure 8 is a diagram showing an example in which a plurality of thermoelectric elements form a single thermoelectric element.

[0036] Fig. 9 is a diagram showing an example of a circuit configuration related to the operation of a thermoelectric element.

[0037] In all drawings and detailed description, the same reference numerals refer to the same elements. The drawings may not be drawn to scale, and the relative sizes, proportions, and depictions of elements in the drawings may be exaggerated for clarity, illustration, and convenience. DETAILED DESCRIPTION

[0038] The following specific embodiments are provided to help the reader obtain a comprehensive understanding of the methods, devices and / or systems described herein. However, after understanding the disclosure of the present application, various changes, modifications and equivalences of the methods, devices and / or systems described herein will be apparent. For example, except for the operations that must occur in a specific order, the order of operations described herein is merely an example and is not limited to the order set forth herein, but changes that will be apparent after understanding the disclosure of the present application may be made. In addition, for greater clarity and brevity, the description of features known in the art may be omitted.

[0039] The features described herein may be implemented in different forms and should not be construed as being limited to the examples described herein. Rather, the examples described herein are provided merely to illustrate some of the many possible ways of implementing the methods, devices, and / or systems described herein, which will be apparent after understanding the disclosure of the present application.

[0040] Throughout the specification, when an element such as a layer, a region, or a substrate is described as being “on,” “connected to,” or “coupled to” another element, the element may be directly “on,” “connected to,” or “coupled to” the other element, or one or more other elements may be present between the element and the other element. Conversely, when an element is described as being “directly on,” “directly connected to,” or “directly coupled to” another element, no other elements may be present between the element and the other element.

[0041] As used herein, the term "and / or" includes any one of the associated listed items and any combination of any two or more.

[0042] Although terms such as "first", "second" and "third" may be used herein to describe various members, components, regions, layers or portions, these members, components, regions, layers or portions are not limited by these terms. Rather, these terms are only used to distinguish one member, component, region, layer or portion from another member, component, region, layer or portion. Therefore, without departing from the teachings of the examples described herein, the first member, first component, first region, first layer or first portion mentioned in the examples may also be referred to as the second member, second component, second region, second layer or second portion.

[0043] Spatially relative terms such as "above", "higher", "below", and "lower" may be used herein for descriptive convenience to describe the relationship of one element relative to another element as shown in the accompanying drawings. In addition to covering the orientations depicted in the accompanying drawings, these spatially relative terms are intended to also cover different orientations of the device in use or operation. For example, if the device in the accompanying drawings is flipped, an element described as being "above" or "higher" relative to another element will be "below" or "lower" relative to another element. Therefore, depending on the spatial orientation of the device, the term "above" covers both "above" and "below" orientations. The device may also be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and the spatially relative terms used herein should be interpreted accordingly.

[0044] The terms used in this application are only used to describe various examples and are not used to limit the present disclosure. Unless the context clearly indicates otherwise, the articles "a", "an" and "the" are intended to also include plural forms. The words "include", "comprise" and "have" indicate the presence of the features, numbers, operations, components, elements and / or combinations thereof, but do not exclude the presence or addition of one or more other features, numbers, operations, components, elements and / or combinations thereof.

[0045] Variations in the shapes shown in the drawings may occur due to manufacturing techniques and / or tolerances. Therefore, the examples described herein are not limited to the specific shapes shown in the drawings but include variations in shapes that occur during manufacturing.

[0046] The features of the examples described herein can be combined in various ways that will be apparent after understanding the disclosure of the present application. In addition, although the examples described herein have multiple configurations, other configurations that will be apparent after understanding the disclosure of the present application are also feasible.

[0047] An aspect of the present disclosure is to provide an apparatus for removing condensation or frost formed on a camera lens according to surrounding conditions and preventing an image sensor from being damaged or a lens barrel from being deformed due to heat generated from a sensor surface.

[0048] Figure 1 is a perspective view showing an example of the camera module 100 . Figure 2 It is shown Figure 1 An exploded perspective view of the camera module 100 is shown in FIG. Figure 3 It is along Figure 1 A cross-sectional view taken along line II in FIG.

[0049] exist Figures 1 to 3In an example, the camera module 100 may include a substrate 110 and a lens assembly 120 mounted to the substrate 110 .

[0050] In an example, the lens assembly 120 may include a thermoelectric element 121 and at least one lens 122 and 123 coupled to the thermoelectric element 121. In an example, the thermoelectric element 121 may be configured to align the at least one lens 122 and 123 with the image sensor 130. When the thermoelectric element 121 is assembled to the substrate 110, the at least one lens 122 and 123 coupled to the thermoelectric element 121 may be aligned with the image sensor 130.

[0051] In an example, the thermoelectric element 121 may extend from a bottom surface 121b (or first surface) opposite to the substrate 110 in the optical axis direction to an upper end surface 121a (or second surface). The upper end surface 121a may be defined as a surface of the thermoelectric element 121 oriented in a first direction 101 parallel to the optical axis, and the bottom surface 121b may be defined as a surface of the thermoelectric element 121 oriented in a second direction 102 opposite to the first direction 101.

[0052] In an example, the frontmost lens 122 may be disposed on the upper end surface 121a of the thermoelectric element 121. The frontmost lens 122 may be defined as a lens disposed closest to the object or a lens disposed farthest from the substrate among the lenses disposed in the lens assembly 120. In an example, a portion of a lower surface 122a of the frontmost lens 122 may contact the upper end surface 121a of the thermoelectric element 121.

[0053] In an example, the thermoelectric element 121 may include a through portion 121c configured to accommodate at least one lens 123. In an example, the through portion 121c of the thermoelectric element 121 may be configured to align at least one lens 123 disposed therein when the thermoelectric element 121 is coupled to the substrate 110. For example, the thermoelectric element 121 may have a hollow cylindrical shape, and at least one lens may be disposed in an inner space (through portion 121c) of the cylindrical shape. In the illustrated example, only the frontmost lens 122 disposed on the upper end surface 121a of the thermoelectric element 121 is illustrated, but another lens (e.g., Figure 3 at least one lens 123 in it).

[0054] The element referred to as a lens in the example can be implemented by a light-transmitting material, and the lens does not necessarily have a curved surface. For example, the description of the front lens 122 in the example can also be applied to a cover glass having a flat surface.

[0055] In an example, the image sensor 130 may be mounted on the substrate 110. The image sensor 130 may generate a signal including image information in response to light passing through the lens assembly 120.

[0056] In an example, the substrate 110 may include electrodes disposed on a surface on which the image sensor 130 is mounted. The electrodes may include a positive electrode 141 (or a first electrode) and a negative electrode 142 (or a second electrode).

[0057] In an example, each of the first electrode 141 and the second electrode 142 may have an arc shape centered on the image sensor 130. However, the shape of the electrode is not limited to the example shown, and the electrode may have various shapes in other examples. For example, the electrode may have a quadrilateral shape or a circular shape.

[0058] In an example, the lens assembly 120 may be directly disposed on the substrate 110. For example, the bottom surface 121b (or first surface) of the thermoelectric element 121 may contact the substrate 110. As another example, the bottom surface 121b of the thermoelectric element 121 may contact the electrodes 141 and 142 disposed on the substrate 110. In an example, the thermoelectric element 121 may be assembled to the substrate 110 by a conductive adhesive member or solder.

[0059] In an example, the electrode may be electrically connected to the thermoelectric element 121. In an example, the electrode may be in contact with the bottom surface 121b of the thermoelectric element 121. A voltage may be applied to the thermoelectric element 121 through the electrode, and current may flow in the thermoelectric element 121 according to the applied voltage. When current flows in the thermoelectric element 121, the upper end surface 121a (or second surface) and the bottom surface 121b (or first surface) of the thermoelectric element 121 may emit heat or may absorb heat. Figure 4 The operation and characteristics of the thermoelectric element 121 are described in more detail.

[0060] In an example, the substrate 110 may include a heat transfer member 150 disposed under the image sensor 130. The heat transfer member 150 may effectively dissipate heat generated from the image sensor 130 to a surrounding area. However, in an example, the heat transfer member 150 may not be disposed in the camera module 100.

[0061] Although not shown in the drawings, in an example, the camera module 100 may further include a housing configured to protect the lens assembly 120 or the substrate 110 from external impact.

[0062] Even when the camera module 100 is arranged in a variety of different environments, the camera module 100 may need to maintain a certain level of performance. When the camera module 100 implements a driving assistance function for a driver, the performance reliability of the camera module 100 may be desired because the reliability may be directly related to the safety of the driver. Generally, when the camera module 100 is exposed to low temperature air, the camera lens (e.g., Figure 1 Water vapor in the air surrounding the frontmost lens 122 in the camera may condense on the cold camera lens surface. Condensation or frost formed on the lens surface may reduce image quality. Water vapor condensed on the lens surface may be removed by heating the lens.

[0063] The performance of the sensor may deteriorate when the image sensor 130 is heated by a high temperature environment or by driving the image sensor 130. By maintaining the temperature of the image sensor 130 at an appropriate level using a device (or structure) for cooling the heat of the image sensor 130, the degradation of the camera performance may be reduced or prevented.

[0064] The lens may deform according to temperature changes, resulting in a potential decrease in image quality. Therefore, it may be necessary to maintain the temperature of the lens at an appropriate level. In addition, when the camera lens is formed of plastic, the degree of deformation of the lens caused by temperature changes may be relatively greater than that of a glass lens. By preventing or reducing lens deformation caused by overheating, the performance of the camera module 100 can be kept constant.

[0065] A portion of the thermoelectric element 121 may emit heat based on current flowing therein, while another portion of the thermoelectric element 121 may absorb heat. Therefore, the thermoelectric element 121 may be configured so that the heat absorbing portion and the heat radiating portion may be arranged in or near an object to be cooled or heated (e.g., the image sensor 130 and the frontmost lens 122).

[0066] For example, heat may be emitted or absorbed by both ends of the thermoelectric element 121, and one end of the thermoelectric element 121 may be disposed on the substrate 110. The other end of the thermoelectric element 121 may contact a portion of the frontmost lens 122. For example, the thermoelectric element 121 may be configured so that the upper end surface 121a on which the frontmost lens 122 is disposed or the bottom surface 121b in contact with the substrate 110 may absorb or emit heat.

[0067] For example, the thermoelectric element 121 may be configured to emit heat from the upper end surface 121a. When current flows in the thermoelectric element 121, the thermoelectric element 121 may absorb heat through the bottom surface 121b. In this case, the frontmost lens 122 disposed on the upper end surface 121a may be heated, and the image sensor 130 adjacent to the bottom surface 121b may be cooled. When the temperature of the frontmost lens 122 disposed on the upper end surface 121a decreases or the temperature of the image sensor 130 increases, the thermoelectric element 121 may heat the frontmost lens 122 and may cool the image sensor 130.

[0068] As another example, the thermoelectric element 121 may be configured to absorb heat through the upper end surface 121a and release heat from the bottom surface 121b when current flows in the thermoelectric element 121. When the temperature of the foremost lens 122 disposed on the upper end surface 121a increases, the thermoelectric element 121 may cool the foremost lens 122 disposed on the upper end surface 121a.

[0069] According to the example, since the thermoelectric element 121 is configured to align the lens with the image sensor 130, the thermoelectric element 121 in the example can be used as a lens barrel. That is, the thermoelectric element 121 in the example can work as a lens barrel and can also heat or cool the components provided in the camera module 100 (for example, the frontmost lens 122 and the image sensor 130), which can help reduce the size of the camera module 100.

[0070] Figure 4 is a diagram showing an example of the operation of a thermoelectric element.

[0071] The thermoelectric element 121 may include a P-type semiconductor 211, an N-type semiconductor 212, and a connection portion 231 for connecting the P-type semiconductor 211 to the N-type semiconductor 212. The connection portion 231 may electrically connect the P-type semiconductor 211 to the N-type semiconductor 212. The thermoelectric element 121 may include a first terminal 221 connected to a lower end of the P-type semiconductor 211 and a second terminal 222 connected to a lower end of the N-type semiconductor 212. In an example, the connection portion 231 and the terminals may include at least one of a doped semiconductor, a metal, and a metal compound.

[0072] When the negative electrode and the positive electrode of the DC power supply are connected to the first terminal 221 and the second terminal 222, respectively, the current can flow in the direction of the arrow 201. When the current flows in the direction of the arrow 201, the positive holes 202 in the P-type semiconductor 211 can move toward the first terminal 221, and the electrons 203 in the N-type semiconductor 212 can move toward the second terminal 222. The heat in the thermoelectric element 121 can move in the direction of the arrow 204 by the Peltier effect. The connecting portion 231 can absorb the heat, and the first terminal 221 and the second terminal 222 can release the heat. Therefore, the object 250 in contact with the connecting portion 231 can be cooled, and the object 240 in contact with the electrode can be heated.

[0073] Unlike the illustrated example, when the positive electrode and the negative electrode of the DC power source are connected to the first terminal 221 and the second terminal 222, respectively, the current flows in the direction opposite to the direction of the arrow 201. The direction of heat transfer may also be opposite to the direction of the arrow 204, and the connection portion 231 may emit heat and the first terminal 221 and the second terminal 222 may absorb heat. Therefore, the object 250 in contact with the connection portion 231 may be heated, and the object 240 in contact with the electrode may be cooled.

[0074] Therefore, using the thermoelectric element 121, a partial area can be heated while another area is cooled. The degree of heating or cooling can be adjusted by adjusting the intensity of the current flowing in the thermoelectric element 121. In addition, a specific area can be heated or cooled by adjusting the direction of current flow in the thermoelectric element 121.

[0075] Figure 5 is a diagram showing an example of a thermoelectric element 300 in which semiconductors are connected in series to each other. Figure 6 It is shown Figure 5 FIG. 4 is a diagram of an example in which the thermoelectric element 300 is configured to have a hollow cylindrical shape. Figure 7 is a diagram showing an example of a thermoelectric element 500 including a through portion therein.

[0076] exist Figure 5 In the thermoelectric element 300 , N-type semiconductors and P-type semiconductors may be alternately connected in series.

[0077] For example, the lower end of the first N-type semiconductor 311 may be connected to the first terminal 321, and the upper end may be connected to the upper end of the first P-type semiconductor 312 through the first connection portion 331. The lower end of the first P-type semiconductor 312 may be connected to the lower end of the second N-type semiconductor 313 through the second connection portion 322. The upper end of the second N-type semiconductor 313 may be connected to the upper end of the second P-type semiconductor 314 through the third connection portion 332. The lower end of the second P-type semiconductor 314 may be connected to the lower end of the third N-type semiconductor 315 through the fourth connection portion 323. The upper end of the third N-type semiconductor 315 may be connected to the upper end of the third P-type semiconductor 316 through the fifth connection portion 333. The lower end of the third P-type semiconductor 316 may be connected to the lower end of the fourth N-type semiconductor 317 through the sixth connection portion 324. The upper end of the fourth N-type semiconductor 317 may be connected to the upper end of the fourth P-type semiconductor 318 through the seventh connection portion 334. The lower end of the fourth P-type semiconductor 318 may be connected to the second terminal 325.

[0078] In an example, an air gap or insulating member 340 may be provided between semiconductors. In an example, when a voltage is applied between the first terminal 321 and the second terminal 325, a current may flow in the thermoelectric element 300, and the terminals 321 and 325 and the connecting portions 322, 323, and 324 provided below the semiconductor may emit or absorb heat by the Peltier effect. For example, when the positive electrode and the negative electrode of a DC power source are connected to the first terminal 321 and the second terminal 325, respectively, the first region 360 connected to the lower portion of the semiconductor may be heated, and the second region 350 connected to the upper portion of the semiconductor may be cooled. As another example, when the negative electrode and the positive electrode of a DC power source are connected to the first terminal 321 and the second terminal 325, respectively, the first region 360 may be cooled, and the second region 350 may be heated.

[0079] In the example, Figure 5 The thermoelectric element 300 in the embodiment may have a hollow cylindrical shape. In an example, at least one P-type semiconductor and at least one N-type semiconductor may be alternately arranged in at least a portion of the cross section along the circumferential direction of the cylinder. In an example, the alternately arranged N-type semiconductors and P-type semiconductors may be connected by a conductive member (e.g., Figure 5 The first connection parts 331) in the circuit are connected in series with each other.

[0080] exist Figure 6 In an example, the thermoelectric element 300 can be configured to include a space therein. Figure 5 The configured thermoelectric element 300 may have a hollow cylindrical shape. It is understood that Figure 6 The thermoelectric element 300 may be formed by bending around an axis Figure 5Another example of implementing the thermoelectric element 300 in such a way that the first N-type semiconductor 311 is adjacent to the fourth P-type semiconductor 318 is shown.

[0081] exist Figure 7 , the semiconductors in the thermoelectric element can be connected in parallel. The first terminal 521 can be connected to the lower end of the first N-type semiconductor 511 and the lower end of the second N-type semiconductor 518. The upper end of the first N-type semiconductor 511 can be connected to the upper end of the first P-type semiconductor 512 through the first connection part 531, and the upper end of the second N-type semiconductor 518 can be connected to the upper end of the second P-type semiconductor 517 through the second connection part 534. The lower end of the first P-type semiconductor 512 can be connected to the lower end of the third N-type semiconductor 513 through the third connection part 522. The upper end of the third N-type semiconductor 513 can be connected to the upper end of the third P-type semiconductor 514 through the fifth connection part 532. The lower end of the second P-type semiconductor 517 can be connected to the lower end of the fourth N-type semiconductor 516 through the fourth connection part 524. The upper end of the fourth N-type semiconductor 516 can be connected to the upper end of the fourth P-type semiconductor 515 through the sixth connection part 533. A lower end of the third P-type semiconductor 514 and a lower end of the fourth P-type semiconductor 515 may be connected to the second terminal 523 .

[0082] When the positive electrode is connected to the first terminal 521, the current flowing into the first terminal 521 can be divided and flow into the first N-type semiconductor 511 and the second N-type semiconductor 518, and can be merged in the second terminal 523. The electrons in the N-type semiconductor and the holes in the P-type semiconductor can move from the upper end to the lower end, so the heat can also move from the upper end to the lower end. When the negative electrode is connected to the first terminal 521, the heat can move from the lower end to the upper end.

[0083] when Figure 2 The thermoelectric element 121 in the embodiment is implemented as Figure 6 or Figure 7 When the thermoelectric element 300 or 500 shown in FIG. 1 is used, the upper end surface 121a and the bottom surface 121b of the thermoelectric element 121 can absorb or release heat. For example, when Figure 2 The thermoelectric element 121 in the embodiment is implemented as Figure 5 When the thermoelectric element 300 shown in FIG. 3 is formed, the surface of the thermoelectric element 300 in contact with the first region 360 and the surface in contact with the second region 350 may be configured as follows: Figure 2 Also, the first region 360 and the second region 350 may correspond to the substrate 110 and the frontmost lens 122, respectively.

[0084] By Figure 2The first electrode 141 and the second electrode 142 of the substrate 110 are shown to be connected to the first terminals 321 and 521 and the second terminals 325 and 523 of the thermoelectric elements 300 and 500, respectively, and a voltage can be applied to the thermoelectric elements 300 and 500.

[0085] In an example, the thermoelectric elements 300 and 500 may further include a protective layer. The protective layer may be configured to protect the semiconductor or the connection portion. The protective layer may be disposed on the inner circumferential surface and / or the outer circumferential surface of the thermoelectric elements 300 and 500. The protective layer may be formed of metal or plastic. When the protective layer includes metal, the protective layer may be configured not to be electrically conductive with the terminal and the connection portion.

[0086] Figure 8 is a diagram showing an example in which a plurality of thermoelectric elements form a single thermoelectric element.

[0087] exist Figure 8 In the example, since the thermoelectric element 121 can be used as a lens barrel, the thermoelectric element 121 can accommodate a plurality of lenses (eg, Figure 3 In this case, the thermoelectric element 121 may need to have a height corresponding to the length of the plurality of lenses in the optical axis direction. However, since the thickness of the wafer (semiconductor raw material) may be generally less than 1 mm, Figures 5 to 7 The thermoelectric element 121 shown may typically have a relatively low height (3 mm to 4 mm). Figures 5 to 7 The thermoelectric element 121 shown in FIG. 1 may not be large enough to accommodate multiple lenses.

[0088] In an example, by stacking a plurality of unit thermoelectric elements in the optical axis direction, a thermoelectric element 121 having a length in the optical axis direction sufficient to accommodate a plurality of lenses may be implemented. A plurality of stacked unit thermoelectric elements may be used as a single thermoelectric element 121 .

[0089] In an example, a unit thermoelectric element may have Figures 5 to 7 The illustrated thermoelectric elements 300 and 500 are the same or similar elements. In an example, an insulating member may be provided between a plurality of unit thermoelectric elements so that a terminal (or connection portion) provided in a unit thermoelectric element may not be electrically connected to a terminal (or connection portion) of an adjacent thermoelectric element.

[0090] In an example, a plurality of unit thermoelectric elements included in the thermoelectric element 121 may have different shapes. For example, the plurality of unit thermoelectric elements may have different heights and / or inner diameters.

[0091] exist Figure 8In the embodiment, five unit thermoelectric elements 121a, 121b, 121c, 121d and 121e can be stacked along the optical axis direction. The first unit thermoelectric element 121a can be disposed on the substrate 110, and the second unit thermoelectric element 121b, the third unit thermoelectric element 121c, the fourth unit thermoelectric element 121d and the fifth unit thermoelectric element 121e can be stacked in sequence on the first unit thermoelectric element 121a.

[0092] In an example, each unit thermoelectric element may include a through portion therein. For example, each unit thermoelectric element may have a ring shape including a through hole therein. In an example, when the unit thermoelectric elements are stacked side by side in the central axis direction, at least one lens may be accommodated in a space defined by the through portion of the unit thermoelectric element. When the thermoelectric element 121 is coupled to the substrate 110, at least one lens accommodated in the thermoelectric element 121 may be aligned with the image sensor 130.

[0093] In an example, the inner circumferential surface of the thermoelectric element 121 may include a step portion along the optical axis direction. In an example, the step portion along the optical axis direction may exist between at least two unit thermoelectric elements among the plurality of unit thermoelectric elements. The step portion may be implemented by stacking unit thermoelectric elements having different inner circumferential diameters. Figure 8 , the third unit thermoelectric element 121c may have an inner diameter greater than that of the second unit thermoelectric element 121b, and a step portion 124a may be formed between the unit thermoelectric elements. The fourth unit thermoelectric element 121d may have an inner diameter less than that of the third unit thermoelectric element 121c, and a step portion 124b may be formed between the unit thermoelectric elements.

[0094] In an example, at least one lens 123 may be partially supported by the step portions 124a and 124b of the thermoelectric element 121. For example, the outer diameter of at least one lens 123 may be larger than the inner diameter of the second unit thermoelectric element 121b, and may be smaller than the inner diameter of the third unit thermoelectric element 121c. In this case, at least one lens 123 may be supported by the step portion 124a disposed between the second unit thermoelectric element 121b and the third unit thermoelectric element 121c.

[0095] In an example, a portion of at least one lens 123 may be disposed in a stepped portion of the thermoelectric element 121. For example, the edge of the lens 123 may be disposed on a stepped portion 124a disposed between the second unit thermoelectric element 121b and the third unit thermoelectric element 121c. In an example, the thickness of the portion (outer portion) adjacent to the edge of the lens 123 may correspond to the height of the third unit thermoelectric element 121c. Therefore, the upper end of the outer portion of the lens 123 may be disposed on a stepped portion 124b disposed between the third unit thermoelectric element 121c and the fourth unit thermoelectric element 121d. The lower end of the outer portion of the lens 123 may be disposed on a stepped portion 124a disposed between the second unit thermoelectric element 121b and the third unit thermoelectric element 121c.

[0096] The examples shown are merely examples, and various types of thermoelectric elements 121 may be implemented. For example, the thickness of the outer portion of the lens 123 may be less than the distance between the step portions 124a and 124b. As another example, a spacer configured to adjust the distance between two or more lenses and / or lenses may be provided between the step portions 124a and 124b. As another example, a unit thermoelectric element disposed closer to the image sensor 130 may have a larger inner circumferential diameter. As another example, the thermoelectric element 121 may include less than or more than five unit thermoelectric elements.

[0097] Fig. 9 is a diagram showing an example of a circuit configuration related to the operation of the thermoelectric element 121 .

[0098] In an example, the camera module 100 may include an image sensor 130 , a thermoelectric element 121 , and a processor 172 (eg, a microcontroller) for controlling a current provided to the thermoelectric element 121 .

[0099] In an example, the processor 172 may determine a voltage to be applied to the thermoelectric element 121 based on a sensed external temperature or a sensed temperature of the camera module 100. In an example, the temperature sensor may be configured to measure a temperature of the image sensor 130 of the camera module 100 or a surrounding temperature of the image sensor 130. In an example, the temperature sensor may be configured as a component of the camera module 100 or a component of a device different from the camera module 100.

[0100] In an example, the processor 172 may be configured to determine the direction or strength of the current (or voltage) provided to the thermoelectric element 121 based on the temperature information. For example, the processor 172 may determine a current (or voltage) control value corresponding to a specific temperature range, and may transmit the determined control value to the electrode (e.g., Figure 2 , Figure 3 and Figure 8The electrodes 141 and 142 in the thermoelectric element 121 are connected to each other.

[0101] In an example, the processor 172 may determine whether the lens (or sensor unit) needs to be cooled or heated based on the temperature information. For example, the processor 172 may determine whether the temperature measured by the temperature sensor exceeds a specific range. When the measured temperature exceeds the specific range, the processor 172 may apply a current to the thermoelectric element 121 to heat or cool the target object (e.g., Figure 2 For example, when the temperature of the lens is lower than a predetermined threshold, the processor 172 may heat the lens by applying a current in a first direction to the thermoelectric element 121. As another example, when the temperature of the image sensor 130 exceeds a certain threshold, the processor 172 may apply a current to the thermoelectric element 121 to reduce the temperature of the image sensor 130. In another example, when the temperature of the lens is higher than the threshold, a current in a second direction may be applied to the thermoelectric element 121 to cool the lens.

[0102] In an example, power may be supplied to thermoelectric element 121 directly from connector 174 , or may be supplied through processor 172 of camera module 100 .

[0103] In an example, the camera module 100 may include a memory 171. The memory 171 may store basic information required for the operation of the camera, and the processor 172 may perform various operations required for the camera based on the information obtained from the memory 171. For example, a temperature threshold may be stored in the memory 171 as a criterion for determining the direction or intensity of the current applied to the thermoelectric element 121.

[0104] In an example, the processor 172 or the temperature sensor may be provided as a component of the camera module 100. In another example embodiment, the processor 172 or the temperature sensor may be separately provided in an electronic device including the camera module 100.

[0105] In an example, the camera module 100 may include a signal processing unit 173 (eg, a serializer) configured to process an image signal generated by the image sensor 130. The image signal may be transmitted to an external entity through a connector 174.

[0106] According to the above examples, condensation or frost can be prevented from forming on the camera lens, and condensation or frost can be effectively removed when it is formed. In addition, according to these examples, degradation of camera performance caused by overheating of the image sensor can be prevented or reduced. In addition, thermal deformation of the camera lens can be prevented or reduced.

[0107] Although the present disclosure includes specific examples, it will be apparent after understanding the disclosure of the present application that various changes in form and detail may be made to these examples without departing from the spirit and scope of the claims and their equivalents. The examples described herein should be interpreted in a descriptive sense only, and not for limiting purposes. The description of the features or aspects in each example should be considered applicable to similar features or aspects in other examples. Suitable results may also be obtained if the described techniques are performed in a different order, and / or if the components in the described system, architecture, device or circuit are combined in a different manner and / or replaced or supplemented with other components or their equivalents. Therefore, the scope of the present disclosure is not limited by specific embodiments, but by the claims and their equivalents, and all variations within the scope of the claims and their equivalents should be understood to be included in the present disclosure.

Claims

1. A camera module, comprising: a substrate including an image sensor and electrodes; a thermoelectric element disposed on the substrate and having a first surface in contact with the electrode; as well as A first lens is disposed on the second surface of the thermoelectric element, wherein the thermoelectric element is configured so that the first lens is aligned with the image sensor, wherein the first surface and the second surface of the thermoelectric element are arranged opposite to each other along the optical axis direction, and The first surface or the second surface of the thermoelectric element is configured to absorb or release heat based on a voltage applied through the electrode.

2. The camera module according to claim 1, wherein: The thermoelectric element is configured to cool the image sensor and heat the first lens when a voltage of a first polarity is applied to the thermoelectric element through the electrode.

3. The camera module according to claim 2, wherein: The thermoelectric element is configured to cool the first lens when a voltage having a second polarity different from the first polarity is applied to the thermoelectric element through the electrode.

4. The camera module according to claim 1, further comprising: The second lens, Wherein, the thermoelectric element includes a through portion configured to accommodate the second lens.

5. The camera module according to claim 4, wherein: The second lens includes a plurality of second lenses.

6. The camera module according to claim 1, wherein: The substrate includes a heat transfer member disposed below the image sensor.

7. The camera module according to claim 1, wherein: The thermoelectric element includes a plurality of unit thermoelectric elements stacked along an optical axis direction.

8. The camera module according to claim 7, further comprising: at least one second lens, Wherein, the thermoelectric element comprises a through portion configured to accommodate the at least one second lens.

9. The camera module according to claim 8, wherein: Each of the unit thermoelectric elements includes a through portion, and the at least one second lens is accommodated in at least one of the through portions of the plurality of unit thermoelectric elements.

10. The camera module according to claim 9, wherein: At least one step portion is formed between the plurality of unit thermoelectric elements, and the at least one second lens is partially supported by the step portion.

11. The camera module according to claim 1, wherein: The electrodes have a positive electrode and a negative electrode, and the positive electrode and the negative electrode are electrically connected to corresponding terminals provided in the thermoelectric element.

12. The camera module according to claim 11, wherein: The positive electrode and the negative electrode have an arc shape centered on the image sensor.

13. The camera module according to claim 1, wherein: The thermoelectric element has a cylindrical shape configured to accommodate the image sensor, one end of the thermoelectric element in a length direction is in contact with the electrode, and the other end of the thermoelectric element in the length direction is in contact with the first lens.

14. The camera module according to claim 13, wherein: The thermoelectric element includes at least one P-type semiconductor and at least one N-type semiconductor which are alternately arranged circumferentially.

15. A camera module, comprising: a substrate including electrodes and an image sensor; a thermoelectric element having a first surface in contact with the substrate and electrically connected to the electrode; as well as a lens in contact with the second surface of the thermoelectric element, The first surface and the second surface of the thermoelectric element are arranged opposite to each other along the optical axis direction. wherein the first surface or the second surface of the thermoelectric element is configured to absorb or release heat based on a voltage applied through the electrode, and Wherein, the thermoelectric element is configured to align the lens with the image sensor.

16. The camera module according to claim 15, in, The thermoelectric element is electrically connected to the substrate, and Wherein, the thermoelectric element is further configured to cool the image sensor and heat the lens when a voltage of a first polarity is applied to the thermoelectric element.

17. The camera module according to claim 16, wherein: The thermoelectric element is also configured to cool the lens when a voltage of a second polarity different from the first polarity is applied to the thermoelectric element.

18. The camera module of claim 17, further comprising a second lens housed in the thermoelectric element.

19. The camera module according to claim 18, wherein: The second lens includes a plurality of second lenses.

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