Substrate cleaning apparatus, substrate processing apparatus, and substrate cleaning method

Abstract

This invention relates to a substrate cleaning apparatus, a substrate processing apparatus, and a substrate cleaning method. A first substrate holding part holds the outer peripheral end of a substrate. A second substrate holding part, positioned below the first substrate holding part, holds the central region of the lower surface of the substrate. A lower surface brush moves up and down between a position contacting the lower surface of the substrate held by the first substrate holding part and a position contacting the lower surface of the substrate held by the second substrate holding part. The second substrate holding part and the lower surface brush are mounted on a movable stage capable of horizontal movement. The movable stage moves between a position where the lower surface brush faces the outer region of the lower surface of the substrate and a position where the lower surface brush faces the central region of the lower surface of the substrate. The central region of the lower surface of the substrate held by the first substrate holding part is cleaned. At this time, the height of the substrate is higher than the upper end of the processing cup. The outer region of the lower surface of the substrate held by the second substrate holding part is cleaned. At this time, the height of the substrate is lower than the upper end of the processing cup.

Description

TECHNICAL FIELD

[0001] The present application relates to a substrate cleaning apparatus, a substrate processing apparatus, and a substrate cleaning method for processing a substrate. BACKGROUND

[0002] A substrate processing apparatus is used to perform various processes on various substrates such as a substrate for a flat panel display (FPD) used for a liquid crystal display device or an organic EL (Electro Luminescence) display device, a semiconductor substrate, a substrate for an optical disc, a substrate for a magnetic disc, a substrate for an optical magnetic disc, a substrate for a photomask, a ceramic substrate, or a substrate for a solar battery. A substrate cleaning apparatus is used to clean a substrate.

[0003] A substrate cleaning apparatus described in Japanese Patent No. 5904169 has two chuck pads that hold a wafer at a peripheral portion of the back surface, a rotary chuck that holds the wafer at a central portion of the back surface, and a brush that cleans the back surface of the wafer. The two chuck pads hold the wafer and move laterally. In this state, the central portion of the back surface of the wafer is cleaned by the brush. Thereafter, the rotary chuck receives the wafer from the chuck pads, the rotary chuck holds the central portion of the back surface of the wafer and rotates. In this state, the peripheral portion of the back surface of the wafer is cleaned by the brush. SUMMARY

[0004] A substrate cleaning apparatus is desired to be downsized in order to reduce the floor area occupied by the substrate cleaning apparatus in a clean room. However, in the substrate cleaning apparatus, a large member (specifically, an upper cup) that surrounds the wafer moves laterally together with the wafer when the wafer moves laterally. Therefore, it is difficult to downsize the substrate cleaning apparatus in the horizontal direction.

[0005] An object of the present application is to provide a substrate cleaning apparatus and a substrate cleaning method that can reduce an increase in floor area and clean the entire lower surface of a substrate.

[0006] In addition, the upper cup is used to catch cleaning liquid scattered from the wafer when the wafer is cleaned. Therefore, if the upper cup is removed in order to downsize the substrate cleaning apparatus described in Japanese Patent No. 5904169, the cleaning liquid containing contaminant substances cannot be prevented from being scattered. In this case, the cleanliness of the substrate cleaning apparatus cannot be maintained high.

[0007] Another object of the present application is to provide a substrate cleaning apparatus and a substrate processing apparatus including the same that can reduce an increase in floor area, clean the entire lower surface of a substrate, and maintain the cleanliness high.

[0008] (1) A substrate cleaning apparatus according to one embodiment of the present application includes: a first substrate holding section that holds a peripheral end portion of a substrate; a second substrate holding section that adsorbs and holds a central portion of a lower surface of the substrate at a position below the first substrate holding section; a moving section that moves the substrate between the first substrate holding section and the second substrate holding section; a cleaning tool that cleans the lower surface of the substrate by contacting the lower surface of the substrate; a cleaning tool elevating section that supports the cleaning tool from below and elevates the cleaning tool between a first height position at which the cleaning tool contacts the lower surface of the substrate held by the first substrate holding section and a second height position at which the cleaning tool contacts the lower surface of the substrate held by the second substrate holding section; a rotary driving section that supports the second substrate holding section from below and rotates the second substrate holding section about an axis in a vertical direction; a pedestal section that supports the cleaning tool elevating section and the rotary driving section in such a manner that the cleaning tool and the second substrate holding section are apart from each other in a plan view; and a pedestal moving section that moves the pedestal section between a first horizontal position at which the second substrate holding section faces the central portion of the lower surface of the substrate and the cleaning tool faces a lower surface outer side region of the substrate that surrounds the central portion of the lower surface of the substrate and a second horizontal position at which the second substrate holding section faces the lower surface outer side region of the substrate and the cleaning tool faces the central portion of the lower surface of the substrate, in a state in which the substrate is held by the first substrate holding section.

[0009] In the substrate cleaning apparatus, in a state in which the peripheral end portion of the substrate is held by the first substrate holding section, the pedestal section is moved to the second horizontal position. In a state in which the pedestal section is at the second horizontal position, the second substrate holding section faces the lower surface outer side region of the substrate and the cleaning tool faces the central portion of the lower surface of the substrate. In this case, the cleaning tool is elevated to the first height position by the cleaning tool elevating section, and the central portion of the lower surface of the substrate held by the first substrate holding section can be cleaned by the cleaning tool.

[0010] On the other hand, in a state in which the peripheral end portion of the substrate is held by the first substrate holding section, the pedestal section is moved to the first horizontal position. In a state in which the pedestal section is at the first horizontal position, the second substrate holding section faces the central portion of the lower surface of the substrate and the cleaning tool faces the lower surface outer side region of the substrate. In this case, the substrate is moved from the first substrate holding section to the second substrate holding section by the moving section, and the central portion of the lower surface of the substrate can be adsorbed and held by the second substrate holding section without horizontal movement of the substrate. At this time, the lower surface outer side region of the substrate held by the second substrate holding section can be cleaned by the cleaning tool by rotating the second substrate holding section about the axis in the vertical direction and elevating the cleaning tool to the second height position by the cleaning tool elevating section.

[0011] Thus, according to the substrate cleaning apparatus according to one embodiment of the present application, the central portion of the lower surface of the substrate and the lower surface outer side region of the substrate can be cleaned without horizontal movement of the substrate. Therefore, an increase in floor space can be reduced and the entire lower surface of the substrate can be cleaned.

[0012] (2) The substrate cleaning apparatus can further include a mounted member on which the cleaning tool is mounted, and the cleaning tool lifting section can support the cleaning tool by being able to lift the mounted member. Thus, the cleaning tool can be supported by the cleaning tool lifting section by being able to lift via the mounted member.

[0013] (3) The substrate cleaning apparatus can further include a cleaning liquid supply section mounted to the mounted member, and the cleaning liquid supply section can supply a cleaning liquid to the lower surface of the substrate when the lower surface of the substrate is cleaned by the cleaning tool.

[0014] In this case, the cleaning liquid can be effectively supplied to the portion of the lower surface of the substrate cleaned by the cleaning tool from a position in the vicinity of the cleaning tool. Thus, the consumption of the cleaning liquid can be reduced and the excessive scattering of the cleaning liquid can be suppressed.

[0015] (4) The mounted member can have an upper surface inclined downward in a direction away from the second substrate holding section. In this case, when the contaminant removed from the lower surface of the substrate by the cleaning tool falls on the upper surface of the mounted member, the contaminant caught by the upper surface of the mounted member is guided along the inclined upper surface in the direction away from the second substrate holding section. Thus, when the lower surface of the substrate held by the first substrate holding section is cleaned, the generation of contamination of the second substrate holding section can be reduced.

[0016] (5) The substrate cleaning apparatus can further include an air flow generating section that generates a band-shaped air flow between the cleaning tool and the second substrate holding section.

[0017] In this case, when the lower surface of the substrate held by the first substrate holding section is cleaned, the contaminant removed from the lower surface of the substrate is prevented from scattering toward the second substrate holding section by the air flow generated from the air flow generating section. Thus, the generation of contamination of the second substrate holding section can be further reduced.

[0018] (6) The air flow generating section can be further mounted to the mounted member. In this case, the air flow generating section is provided integrally with the cleaning tool. Therefore, by appropriately setting the positional relationship between the air flow generating section and the cleaning tool, the contaminant removed from the lower surface of the substrate can be further prevented from scattering toward the second substrate holding section. Thus, the generation of contamination of the second substrate holding section can be further reduced.

[0019] (7) The air flow generating section can form a gas curtain between the cleaning tool and the second substrate holding section by jetting a band-shaped gas toward the lower surface of the substrate.

[0020] In this case, because the gas curtain is formed between the cleaning tool and the second substrate holding section, the contaminant removed from the lower surface of the substrate by the cleaning tool can be prevented from scattering toward the second substrate holding section. Thus, the generation of contamination of the second substrate holding section can be further reduced.

[0021] (8) The area of the contact portion of the cleaning tool in contact with the lower surface of the substrate can also be larger than the area of the adsorption portion of the second substrate holding portion that adsorbs and holds the central portion of the lower surface of the substrate.

[0022] In this case, the cleaning tool can be brought into contact with the lower surface of the substrate in a manner that covers the portion of the lower surface of the substrate that is adsorbed and held by the second substrate holding portion, in a state in which the pedestal is located at the second horizontal position. Thus, the portion of the substrate that is cleaned by the second substrate holding portion can be cleaned without moving the cleaning tool in the horizontal direction.

[0023] (9) The cleaning tool elevating portion can be supported so as to be movable in the horizontal direction with respect to the second substrate holding portion in the pedestal portion, and the substrate cleaning apparatus can further include a movement drive portion that moves the cleaning tool elevating portion in the horizontal direction with respect to the second substrate holding portion in the pedestal portion.

[0024] In this case, the cleaning tool elevating portion can be moved in the horizontal direction with respect to the second substrate holding portion when cleaning the region outside the lower surface of the substrate that is held by the second substrate holding portion. Thus, even in a case in which the contact area of the cleaning tool in contact with the lower surface of the substrate is small compared to the region outside the lower surface of the substrate, the lower surface of the substrate can be cleaned over a wide range by moving the cleaning tool elevating portion in the horizontal direction with respect to the second substrate holding portion.

[0025] (10) The substrate cleaning apparatus can further include a cleaning tool rotating drive portion that rotates the cleaning tool around an axis that extends in the vertical direction. In this case, the contaminant adhering to the lower surface of the substrate can be physically removed by rotating the cleaning tool in a state in which the cleaning tool is in contact with the lower surface of the substrate, without moving the cleaning tool in the horizontal direction.

[0026] (11) The substrate cleaning apparatus according to the present application includes: a first substrate holding section that holds the peripheral end portion of the substrate at a first height position without rotating the substrate; a second substrate holding section that adsorbs and holds the central portion of the lower surface of the substrate at a second height position below the first height position and rotates around an up-down direction axis; a substrate moving section that moves the substrate between the first height position and the second height position; a cleaning tool that cleans the lower surface of the substrate by contacting the lower surface of the substrate; a cleaning tool lifting section that shifts the cleaning tool between a first state in which the cleaning tool contacts the lower surface of the substrate held by the first substrate holding section and a second state in which the cleaning tool contacts the lower surface of the substrate held by the second substrate holding section by lifting the cleaning tool; a cleaning tool moving section that moves the cleaning tool in a horizontal direction with respect to the substrate at a position below the substrate held by the first or second substrate holding section; a cleaning liquid supplying section that supplies the cleaning liquid to the lower surface of the substrate; and a process cup that is provided so as to surround the second substrate holding section in a plan view and catches the cleaning liquid scattered from the substrate when the cleaning liquid is supplied from the cleaning liquid supplying section to the substrate adsorbed and held by the second substrate holding section and rotated, and the first height position is higher than the upper end portion of the process cup, and the second height position is lower than the upper end portion of the process cup when the lower surface of the substrate held by the second substrate holding section is cleaned by the cleaning tool.

[0027] In the substrate cleaning apparatus, the substrate is moved between the first height position and the second height position by the substrate moving section. In a state in which the substrate is positioned at the first height position, the peripheral end portion of the substrate is held by the first substrate holding section. The cleaning tool is shifted to the first state by lifting the cleaning tool by the cleaning tool lifting section. The cleaning liquid is supplied to the lower surface of the substrate.

[0028] Here, the first height position is higher than the upper end portion of the process cup. Even in this case, since the substrate does not rotate in a state in which the substrate is held by the first substrate holding section, the cleaning liquid supplied to the substrate is not easily scattered to the outside of the substrate. Thus, it is possible to prevent interference of the first substrate holding section with the process cup, and to reduce scattering of the cleaning liquid and to clean the central portion of the lower surface of the substrate held by the first substrate holding section by the cleaning tool.

[0029] On the other hand, in a state in which the substrate is positioned at the second height position, the central portion of the lower surface of the substrate is adsorbed and held by the second substrate holding section, and the substrate is rotated. The center of the substrate held by the second substrate holding section is positioned below the substrate held by the first substrate holding section at the first height position. The cleaning tool is shifted to the second state by lifting the cleaning tool by the cleaning tool lifting section. The cleaning liquid is supplied to the lower surface of the substrate.

[0030] Here, because the 2nd height position is lower than the upper end portion of the processing cup, the cleaning liquid supplied to the substrate and scattered from the substrate is caught by the processing cup in a state where the substrate is held by the 2nd substrate holder at the 2nd height position and rotated. Thus, the decrease in cleanliness of the substrate cleaning apparatus due to the cleaning liquid scattered from the substrate can be suppressed, and the lower surface outer side region of the substrate held by the 2nd substrate holder is cleaned by the cleaning tool.

[0031] As described above, according to the substrate cleaning apparatus according to the aspect of the present application, the lower surface central portion and the lower surface outer side region of the substrate are cleaned respectively without moving the substrate in the horizontal direction. Further, when the lower surface central portion and the lower surface outer side region of the substrate are cleaned, the cleaning liquid supplied to the lower surface of the substrate is less likely to be scattered to the outside of the substrate. As a result, the substrate cleaning apparatus capable of reducing the increase in floor space and cleaning the entire lower surface of the substrate while maintaining the cleanliness at a high level can be realized.

[0032] (12) The substrate cleaning apparatus can further include a control unit that controls the 1st substrate holder, the 2nd substrate holder, the substrate moving unit, the cleaning tool elevating unit, the cleaning tool moving unit, and the cleaning liquid supplying unit. The control unit controls the 1st substrate holder, the cleaning tool elevating unit, and the cleaning liquid supplying unit so that the lower surface central portion of the substrate held by the 1st substrate holder is cleaned by the cleaning tool when the lower surface central portion of the substrate is cleaned. The control unit controls the 2nd substrate holder, the cleaning tool elevating unit, the cleaning tool moving unit, and the cleaning liquid supplying unit so that the cleaning liquid is supplied to the lower surface of the substrate held by the 2nd substrate holder and the lower surface outer side region of the substrate is cleaned by the cleaning tool when the lower surface outer side region surrounding the lower surface central portion of the substrate is cleaned. The control unit controls the 1st substrate holder, the 2nd substrate holder, and the substrate moving unit so that the substrate is moved between the 1st substrate holder and the 2nd substrate holder.

[0033] In this case, the lower surface central portion of the substrate held by the 1st substrate holder is cleaned by the cleaning tool. Further, the lower surface outer side region of the substrate held by the 2nd substrate holder is cleaned by the cleaning tool. The substrate is moved between the 1st substrate holder and the 2nd substrate holder by the substrate moving unit. Thus, the entire lower surface of the substrate can be cleaned smoothly.

[0034] (13) The cleaning tool moving unit can move the cleaning tool relative to the substrate in the horizontal direction in at least one of a state where the cleaning tool contacts the lower surface of the substrate held by the 1st substrate holder and a state where the cleaning tool contacts the lower surface of the substrate held by the 2nd substrate holder.

[0035] According to the configuration, the area of the lower surface of the substrate that can be cleaned is enlarged in at least one of a state in which the lower surface of the substrate held by the first substrate holding section is contacted with the cleaning tool and a state in which the lower surface of the substrate held by the second substrate holding section is contacted with the cleaning tool.

[0036] (14) The substrate cleaning apparatus can further include a gas supply section configured to supply a gas to the lower surface of the substrate held by the first substrate holding section and to the lower surface of the substrate held by the second substrate holding section.

[0037] In this case, after cleaning the lower surface of the substrate held by the first substrate holding section and after cleaning the lower surface of the substrate held by the second substrate holding section, the lower surface of the substrate is dried by the gas supplied from the gas supply section to the substrate.

[0038] (15) The substrate cleaning apparatus can further include a cleaning tool rotation drive section that rotates the cleaning tool about an axis in the vertical direction.

[0039] In this case, by rotating the cleaning tool while the cleaning tool is in contact with the lower surface of the substrate, the contaminant adhering to the lower surface of the substrate can be physically removed without moving the cleaning tool in the horizontal direction.

[0040] (16) The area of the contact portion of the cleaning tool that contacts the lower surface of the substrate can be larger than the area of the adsorption portion of the second substrate holding section that adsorbs and holds the central portion of the lower surface of the substrate.

[0041] In this case, in a state in which the substrate is held by the first substrate holding section, the cleaning tool can be brought into contact with the lower surface of the substrate in a manner that covers the portion of the lower surface of the substrate that is adsorbed and held by the second substrate holding section. Thus, the portion of the substrate that is adsorbed and held by the second substrate holding section can be cleaned without moving the cleaning tool in the horizontal direction.

[0042] (17) The substrate cleaning apparatus can further include a process cup drive section that raises and lowers the process cup between an upper cup position in which the upper end portion of the process cup is higher than the second height position and a lower cup position in which the upper end portion of the process cup is lower than the second height position, and the process cup drive section holds the process cup at the upper cup position when the substrate held by the second substrate holding section is cleaned by the cleaning tool and holds the process cup at the lower cup position before or after cleaning the substrate held by the second substrate holding section.

[0043] In this case, the process cup is held in the upper cup position when the substrate held by the second substrate holding section is cleaned. Thus, the cleaning liquid scattered from the substrate is caught by the process cup. On the other hand, the process cup is held in the lower cup position before or after the cleaning of the substrate held by the second substrate holding section. Thus, horizontal access to the second substrate holding section is possible. Therefore, the substrate can be exchanged with the second substrate holding section from the outside of the substrate cleaning apparatus.

[0044] (18) The substrate cleaning apparatus according to further another aspect of the present application includes: a first substrate holding section holding a peripheral end portion of a substrate; a second substrate holding section holding a central region of a lower surface of the substrate at a position below the first substrate holding section; an exchange section exchanging the substrate between the first substrate holding section and the second substrate holding section; a cleaning tool cleaning the lower surface of the substrate by contacting the lower surface of the substrate; and a cleaning control section controlling the cleaning tool in a manner that the central region of the lower surface of the substrate is cleaned when the center of the substrate is located at a first position with the substrate held by the first substrate holding section, and a region of the lower surface outside the central region of the lower surface of the substrate is cleaned when the center of the substrate is located at a second position below the first position with the substrate held by the second substrate holding section.

[0045] In the substrate cleaning apparatus, the substrate is exchanged between the first substrate holding section and the second substrate holding section by the exchange section. The central region of the lower surface of the substrate is cleaned by the cleaning tool when the center of the substrate is located at the first position with the substrate held by the first substrate holding section. The region of the lower surface outside the central region of the lower surface of the substrate is cleaned by the cleaning tool when the center of the substrate is located at the second position below the first position with the substrate held by the second substrate holding section. Thus, the central region of the lower surface of the substrate and the region of the lower surface outside the central region of the substrate are cleaned without moving the substrate horizontally. Therefore, the increase in floor space can be reduced and the entire lower surface of the substrate can be cleaned.

[0046] (19) The substrate cleaning apparatus can further include an exchange control section controlling the exchange section in a manner that the substrate whose central region of the lower surface is cleaned in the first substrate holding section is transferred to the second substrate holding section. In this case, the entire lower surface of the substrate can be easily cleaned.

[0047] (20) The exchange control section can further control the exchange section in a manner that the substrate whose region of the lower surface outside the central region is cleaned in the second substrate holding section is transferred again to the first substrate holding section, and the cleaning control section controls the cleaning tool in a manner that the central region of the lower surface of the substrate held by the first substrate holding section is cleaned again. In this case, the central region of the lower surface of the substrate held by the second substrate holding section is cleaned again in the first substrate holding section. Thus, the substrate can be more appropriately cleaned.

[0048] (21) The substrate cleaning apparatus can further include an exchange control section that controls the exchange section so as to transfer the substrate whose lower surface outer side region is cleaned in the second substrate holding section to the first substrate holding section. In this case, the lower surface central region of the substrate held by the second substrate holding section is cleaned in the first substrate holding section. Thus, the substrate can be cleaned more appropriately and efficiently.

[0049] (22) The substrate cleaning apparatus can be configured to selectively operate in a first cleaning mode and a second cleaning mode. The cleaning control section controls the cleaning tool in the first cleaning mode so as to clean the lower surface central region of the substrate when the substrate is held by the first substrate holding section and clean the lower surface outer side region of the substrate when the substrate is held by the second substrate holding section. The cleaning control section controls the cleaning tool in the second cleaning mode so as to not clean the substrate when the substrate is held by the first substrate holding section and clean the lower surface outer side region of the substrate when the substrate is held by the second substrate holding section.

[0050] In this case, the entire lower surface of the substrate can be cleaned by causing the substrate cleaning apparatus to operate in the first cleaning mode. On the other hand, when the lower surface central region of the substrate does not need to be cleaned, the lower surface outer side region of the substrate can be efficiently cleaned by causing the substrate cleaning apparatus to operate in the second cleaning mode.

[0051] (23) The second substrate holding section is configured to hold a substrate and rotate. The substrate cleaning apparatus can further include a pedestal section that supports the cleaning tool and the second substrate holding section; a pedestal drive section that moves the pedestal section between a first state in which the cleaning tool is positioned below the center of the substrate to be held by the first substrate holding section and a second state in which the center of rotation of the second substrate holding section is positioned below the center of the substrate to be held by the first substrate holding section; and a pedestal control section that controls the pedestal drive section so that the pedestal section is in the first state when the substrate held by the first substrate holding section is cleaned and the pedestal section is in the second state when the substrate is exchanged between the first substrate holding section and the second substrate holding section.

[0052] In this case, the substrate can be easily exchanged between the first substrate holding section and the second substrate holding section, and the lower surface central region of the substrate held by the first substrate holding section and the lower surface outer side region of the substrate held by the second substrate holding section can be easily cleaned by the common cleaning tool.

[0053] (24) A substrate processing apparatus according to further another aspect of the present application includes the substrate cleaning apparatus and a substrate transfer section including a first transfer holding section configured to hold a substrate and a second transfer holding section configured to hold a substrate below the first transfer holding section. The first transfer holding section exchanges a substrate with the first substrate holding section of the substrate cleaning apparatus, and the second transfer holding section exchanges a substrate with the second substrate holding section of the substrate cleaning apparatus.

[0054] In this case, the substrate is transferred between the first transfer holding unit and the first substrate holding unit (hereinafter, referred to as first transfer). At this time, the first transfer holding unit needs to be moved to the first height position.

[0055] In addition, the substrate is transferred between the second transfer holding unit and the second substrate holding unit (hereinafter, referred to as second transfer). At this time, the second transfer holding unit needs to be moved to the second height position.

[0056] As described above, the first and second transfer holding units are arranged in a manner that each corresponds to the first and second substrate holding units, and are arranged in a spaced-apart manner in the vertical direction. Therefore, in the case where the first and second transfers are performed at different height positions, the time required for moving each transfer holding unit in the vertical direction is shortened. Therefore, the throughput of the substrate processing apparatus is improved.

[0057] (25) A further aspect of the substrate cleaning method according to the present application includes the steps of: cleaning a central region of a lower surface of a substrate with a cleaning tool while the substrate is held by a first substrate holding unit at an outer peripheral end portion of the substrate, in a state where a center of the substrate is positioned at a first position; cleaning a region of the lower surface of the substrate outside the central region of the lower surface with the cleaning tool while the central region of the lower surface of the substrate is held by a second substrate holding unit at a position below the first substrate holding unit, in a state where the center of the substrate is positioned at a second position below the first position; and transferring the substrate between the first substrate holding unit and the second substrate holding unit.

[0058] According to the substrate cleaning method, the central region of the lower surface of the substrate and the region of the lower surface outside the central region are cleaned without moving the substrate in the horizontal direction. Therefore, it is possible to reduce an increase in floor space and clean the entire lower surface of the substrate.

[0059] (26) The step of transferring the substrate can also include transferring the substrate, on which the central region of the lower surface is cleaned in the first substrate holding unit, to the second substrate holding unit. In this case, it is possible to easily clean the entire lower surface of the substrate.

[0060] (27) The substrate cleaning method can also include the steps of: transferring the substrate, on which the region of the lower surface outside the central region is cleaned in the second substrate holding unit, again to the first substrate holding unit; and cleaning the central region of the lower surface of the substrate, which is transferred from the second substrate holding unit and held by the first substrate holding unit, with the cleaning tool again. In this case, the central region of the lower surface of the substrate, which is held by the second substrate holding unit, is cleaned again in the first substrate holding unit. Therefore, it is possible to more appropriately clean the substrate.

[0061] (28) The step of transferring the substrate can also include transferring the substrate having the lower surface outer region cleaned in the second substrate holding section to the first substrate holding section. In this case, the lower surface central region of the substrate held by the second substrate holding section is cleaned in the first substrate holding section. Thus, the substrate can be cleaned more appropriately and efficiently.

[0062] (29) The step of cleaning the lower surface central region of the substrate can also include cleaning the lower surface central region of the substrate in the first cleaning mode, and the step of cleaning the lower surface outer region of the substrate can include cleaning the lower surface outer region of the substrate in the first and second cleaning modes.

[0063] In this case, the entire lower surface of the substrate can be cleaned in the first cleaning mode. On the other hand, the lower surface outer region of the substrate can be cleaned efficiently in the second cleaning mode without cleaning the lower surface central region of the substrate.

[0064] (30) The step of cleaning the lower surface central region of the substrate can also include setting a pedestal section supporting the cleaning tool and the second substrate holding section to a first state, the step of cleaning the lower surface outer region of the substrate can include setting the pedestal section to a second state, the second substrate holding section can be configured to hold the substrate and rotate, the cleaning tool can be located below the center of the substrate to be held by the first substrate holding section in the first state, and the center of rotation of the second substrate holding section can be located below the center of the substrate to be held by the first substrate holding section in the second state.

[0065] In this case, the substrate can be easily transferred between the first substrate holding section and the second substrate holding section, and the lower surface central region of the substrate held by the first substrate holding section and the lower surface outer region of the substrate held by the second substrate holding section can be easily cleaned by the common cleaning tool. BRIEF DESCRIPTION OF DRAWINGS

[0066] Figure 1 is a schematic plan view of a substrate cleaning apparatus according to an embodiment of the present application.

[0067] Figure 2 is an appearance perspective view showing the internal configuration of the substrate cleaning apparatus of Figure 1

[0068] Figure 3 is a block diagram showing the configuration of a control system of the substrate cleaning apparatus according to an embodiment of the present application.

[0069] Figure 4 is a schematic view for explaining an example of the operation of the substrate cleaning apparatus of Figure 1

[0070] Figure 5 ​​is a schematic view for explaining an example of the operation of the substrate cleaning apparatus of Figure 1

[0071] Figure 6 is a schematic view for explaining an example of the operation of the substrate cleaning apparatus of Figure 1

[0072] Figure 7 is a schematic view for explaining an example of the operation of the substrate cleaning apparatus of Figure 1

[0073] Figure 8 is a schematic view for explaining an example of the operation of the substrate cleaning apparatus of Figure 1

[0074] Figure 9 is a schematic view for explaining an example of the operation of the substrate cleaning apparatus of Figure 1

[0075] Figure 10 is a schematic view for explaining an example of the operation of the substrate cleaning apparatus of Figure 1

[0076] Figure 11 is a schematic view for explaining an example of the operation of the substrate cleaning apparatus of Figure 1

[0077] Figure 12 is a schematic view for explaining an example of the operation of the substrate cleaning apparatus of Figure 1

[0078] Figure 13 is a schematic view for explaining an example of the operation of the substrate cleaning apparatus of Figure 1

[0079] Figure 14 is a schematic view for explaining an example of the operation of the substrate cleaning apparatus of Figure 1

[0080] Figure 15 is a schematic view for explaining an example of the operation of the substrate cleaning apparatus of Figure 1

[0081] Figure 16 is a flowchart showing the substrate cleaning process of the control device of Figure 3

[0082] Figure 17 is a flowchart showing the substrate cleaning process of the first modification example.

[0083] Figure 18 is a flowchart showing the substrate cleaning process of the second modification example.

[0084] ​​​​​​​​​​​​Figure 19 It means possessing Figure 1 A schematic top view of an example of a substrate processing apparatus of a substrate cleaning device.

[0085] Figure 20 It is used to explain Figure 16 The diagram shows a specific example of the main robot moving substrates into and out of the substrate cleaning device.

[0086] Figure 21 This diagram illustrates other configuration examples of the gas ejection section.

[0087] Figure 22 This diagram is used to illustrate other configuration examples of the gas ejection section. Detailed Implementation

[0088] Hereinafter, the substrate cleaning apparatus, substrate processing apparatus, and substrate cleaning method according to embodiments of the present invention will be described with reference to the accompanying drawings. In the following description, "substrate" refers to a semiconductor substrate (wafer), a substrate for FPD (Flat Panel Display) such as a liquid crystal display device or an organic EL (Electro Luminescence) display device, a substrate for an optical disc, a substrate for a magnetic disk, a substrate for an optical disk, a substrate for a photomask, a ceramic substrate, or a substrate for a solar cell, etc. Furthermore, in this embodiment, the upper surface of the substrate is the circuit formation surface (surface), and the lower surface of the substrate is the surface opposite to the circuit formation surface (back surface). Additionally, in this embodiment, the substrate has a circular shape except for the notch.

[0089] [1] Composition of substrate cleaning device

[0090] Figure 1 This is a schematic top view of a substrate cleaning apparatus according to an embodiment of the present invention. Figure 2 It means Figure 1 A perspective view of the internal structure of the substrate cleaning apparatus 1. In the substrate cleaning apparatus 1 of this embodiment, the X, Y, and Z directions, which are orthogonal to each other, are defined to clarify their positional relationships. Figure 1 and Figure 2 In subsequent specific diagrams, arrows will be used to indicate the X, Y, and Z directions as appropriate. The X and Y directions are orthogonal to each other in the horizontal plane, and the Z direction is equivalent to the vertical direction.

[0091] like Figure 1 As shown, the substrate cleaning apparatus 1 includes upper holding devices 10A and 10B, a lower holding device 20, a platform device 30, a transfer device 40, a lower surface cleaning device 50, a cup device 60, an upper surface cleaning device 70, an end cleaning device 80, and a switching device 90. These components are housed within the unit frame 2. Figure 2 In the middle, the unit frame 2 is represented by a dashed line.

[0092] The unit frame 2 has a rectangular bottom surface portion 2a, four side wall portions 2b, 2c, 2d, 2e extending upward from the four sides of the bottom surface portion 2a. The side wall portions 2b, 2c face each other, and the side wall portions 2d, 2e face each other. In the central portion of the side wall portion 2b, a rectangular opening is formed. The opening is a substrate W carrying-in / out port 2x, and is used when the substrate W is carried into and carried out of the unit frame 2. In Figure 2 the following description, the direction in the Y direction from the inside of the unit frame 2 through the substrate W carrying-in / out port 2x toward the outside of the unit frame 2 (the direction from the side wall portion 2c toward the side wall portion 2b) is referred to as the front direction, and the opposite direction (the direction from the side wall portion 2b toward the side wall portion 2c) is referred to as the rear direction.

[0093] In the region of the side wall portion 2b in the vicinity of the substrate W carrying-in / out port 2x, a shutter device 90 is provided. The shutter device 90 includes a shutter 91 configured to be able to open and close the substrate W carrying-in / out port 2x, and a shutter drive portion 92 that drives the shutter 91. In Figure 2 the following description, the shutter 91 is indicated by a thick double-dotted line. The shutter drive portion 92 drives the shutter 91 in such a manner that the substrate W carrying-in / out port 2x is opened when the substrate W is carried into and carried out of the substrate cleaning device 1, and the substrate W carrying-in / out port 2x is closed when the substrate W is subjected to cleaning processing by the substrate cleaning device 1.

[0094] In the central portion of the bottom surface portion 2a, a stage device 30 is provided. The stage device 30 includes a linear guide 31, a movable stage 32, and a stage drive portion 33. The linear guide 31 includes two tracks, and is disposed in such a manner that it extends in the Y direction from the vicinity of the side wall portion 2b to the vicinity of the side wall portion 2c in a plan view. The movable stage 32 is provided so as to be able to move in the Y direction on the two tracks of the linear guide 31. The stage drive portion 33 includes, for example, a pulse motor, and moves the movable stage 32 in the Y direction on the linear guide 31.

[0095] On the movable stage 32, the lower side holding device 20 and the lower surface cleaning device 50 are disposed in such a manner that they are aligned in the Y direction. The lower side holding device 20 includes a suction holding portion 21 and a suction holding drive portion 22. The suction holding portion 21 is a so-called rotary chuck having a circular suction surface that is able to suction and hold the lower surface of the substrate W, and is configured to be able to rotate around an axis (an axis in the Z direction) that extends in the vertical direction. In Figure 1In the following description, when the substrate W is adsorptively held by the adsorptive holding portion 21, the region of the lower surface of the substrate W to which the adsorbing surface of the adsorptive holding portion 21 should adsorb is referred to as a lower surface central region. On the other hand, the region of the lower surface of the substrate W that surrounds the lower surface central region is referred to as a lower surface outer region. Further, the lower surface central region corresponds to the lower surface central portion and the lower surface central region of the present application.

[0096] The adsorptive holding drive portion 22 includes a motor. The motor of the adsorptive holding drive portion 22 is disposed on the movable pedestal 32 in such a manner that the rotational axis thereof protrudes upward. The adsorptive holding portion 21 is attached to the upper end portion of the rotational axis of the adsorptive holding drive portion 22. In addition, an attraction path for adsorptively holding the substrate W in the adsorptive holding portion 21 is formed in the rotational axis of the adsorptive holding drive portion 22. The attraction path is connected to a not-shown suction device. The adsorptive holding drive portion 22 rotates the adsorptive holding portion 21 about the rotational axis.

[0097] In the movable pedestal 32, a handover device 40 is also disposed in the vicinity of the lower side holding device 20. The handover device 40 includes a plurality of (three in this case) support pins 41, a pin linking member 42, and a pin elevation drive portion 43. The pin linking member 42 is formed in such a manner that it surrounds the adsorptive holding portion 21 in plan view, and links the plurality of support pins 41. The plurality of support pins 41 extend upward from the pin linking member 42 by a certain length in a state of being linked to each other by the pin linking member 42. The pin elevation drive portion 43 elevates and lowers the pin linking member 42 on the movable pedestal 32. Thus, the plurality of support pins 41 are relatively elevated and lowered with respect to the adsorptive holding portion 21.

[0098] The lower surface cleaning device 50 includes a lower surface brush 51, two liquid nozzles 52, a gas ejection portion 53, an elevation support portion 54, a movement support portion 55, a lower surface brush rotation drive portion 55a, a lower surface brush elevation drive portion 55b, and a lower surface brush movement drive portion 55c. The movement support portion 55 is disposed so as to be movable in the Y direction with respect to the lower side holding device 20 within a certain region on the movable pedestal 32. As shown in FIG. 6, the elevation support portion 54 is disposed so as to be elevatable and lowerable on the movement support portion 55. The elevation support portion 54 has an upper surface 54u that is inclined downward in a direction away from the adsorptive holding portion 21 (rearward in this case). Figure 2 As shown in FIG. 6, the lower surface brush 51 is disposed so as to be movable in the X direction with respect to the elevation support portion 54 within a certain region on the movement support portion 55. The lower surface brush 51 is disposed so as to be rotatable on the movement support portion 55. The lower surface brush rotation drive portion 55a rotates the lower surface brush 51 about the X axis. The lower surface brush elevation drive portion 55b elevates and lowers the lower surface brush 51 on the movement support portion 55. The lower surface brush movement drive portion 55c moves the lower surface brush 51 in the X direction with respect to the elevation support portion 54.

[0099] As shown in FIG. 6, the lower surface brush 51 is disposed so as to be movable in the X direction with respect to the elevation support portion 54 within a certain region on the movement support portion 55. The lower surface brush 51 is disposed so as to be rotatable on the movement support portion 55. The lower surface brush rotation drive portion 55a rotates the lower surface brush 51 about the X axis. The lower surface brush elevation drive portion 55b elevates and lowers the lower surface brush 51 on the movement support portion 55. The lower surface brush movement drive portion 55c moves the lower surface brush 51 in the X direction with respect to the elevation support portion 54. Figure 1As shown, the lower surface brush 51 is formed of, for example, a PVA (polyvinyl alcohol) sponge or a PVA sponge in which abrasive grains are dispersed, and has a circular cleaning surface that can come into contact with the lower surface of the substrate W. In addition, the lower surface brush 51 is attached to the upper surface 54u of the lift support portion 54 in a manner such that the cleaning surface faces upward and is rotatable about an axis extending in the vertical direction through the center of the cleaning surface. The area of the cleaning surface of the lower surface brush 51 is larger than the area of the adsorption surface of the adsorption holding portion 21.

[0100] Each of the two liquid nozzles 52 is attached to the upper surface 54u of the lift support portion 54 in a manner such that it is located in the vicinity of the lower surface brush 51 and the liquid ejection port faces upward. In the liquid nozzle 52, a lower surface cleaning liquid supply portion 56 Figure 3 ) is connected. The lower surface cleaning liquid supply portion 56 supplies a cleaning liquid to the liquid nozzle 52. The liquid nozzle 52 supplies the cleaning liquid supplied from the lower surface cleaning liquid supply portion 56 to the lower surface of the substrate W when the substrate W is cleaned by the lower surface brush 51. In the present embodiment, pure water (deionized water) is used as the cleaning liquid supplied to the liquid nozzle 52. In addition, instead of pure water, carbonated water, ozone water, hydrogen water, electrolytic ion water, SC1 (a mixed solution of ammonia and hydrogen peroxide water), or TMAH (tetramethylammonium hydroxide) can also be used as the cleaning liquid supplied to the liquid nozzle 52.

[0101] The gas ejection portion 53 is a slit-shaped gas jet nozzle having a gas ejection port extending in one direction. The gas ejection portion 53 is attached to the upper surface 54u of the lift support portion 54 in a manner such that it is located below the lower surface brush 51 and the adsorption holding portion 21 in plan view and the gas ejection port faces upward. In the gas ejection portion 53, a gas ejection gas supply portion 57 Figure 3 ) is connected. The gas ejection gas supply portion 57 supplies a gas to the gas ejection portion 53. In the present embodiment, nitrogen gas is used as the gas supplied to the gas ejection portion 53. The gas ejection portion 53 ejects the gas supplied from the gas ejection gas supply portion 57 to the lower surface of the substrate W when the substrate W is cleaned by the lower surface brush 51 and when the lower surface of the substrate W is dried, which will be described later. In this case, a band-shaped gas curtain extending in the X direction is formed between the lower surface brush 51 and the adsorption holding portion 21. Instead of nitrogen gas, an inert gas such as argon gas or helium gas can also be used as the gas supplied to the gas ejection portion 53.

[0102] The lower surface brush rotary drive section 55a includes a motor that rotates the lower surface brush 51 when cleaning the substrate W with the lower surface brush 51. The lower surface brush elevation drive section 55b includes a stepping motor or a cylinder that elevates the elevation support section 54 relative to the moving support section 55. The lower surface brush moving drive section 55c includes a motor that moves the moving support section 55 in the Y direction on the movable stage 32. Here, the lower side holding device 20 is fixed in position on the lower side of the movable stage 32. Therefore, when the moving support section 55 is moved in the Y direction with the lower surface brush moving drive section 55c, the moving support section 55 moves relative to the lower side holding device 20. In the following description, the position of the lower surface cleaning device 50 when the movable stage 32 is closest to the lower side holding device 20 is referred to as the close position, and the position of the lower surface cleaning device 50 when the movable stage 32 is farthest from the lower side holding device 20 is referred to as the apart position.

[0103] In the central portion of the bottom surface portion 2a, a cup device 60 is also provided. The cup device 60 includes a processing cup 61 and a cup drive section 62. The processing cup 61 is provided so as to surround the lower side holding device 20 and the stage device 30 in plan view and is capable of elevation. In Figure 2 The processing cup 61 is indicated by a dashed line in FIG. 6. The cup drive section 62 moves the processing cup 61 between a lower cup position and an upper cup position depending on which portion of the lower surface of the substrate W is cleaned by the lower surface brush 51. The lower cup position is a height position at which the upper end portion of the processing cup 61 is positioned below the substrate W held by the suction holding section 21. The upper cup position is a height position at which the upper end portion of the processing cup 61 is positioned above the suction holding section 21.

[0104] A pair of upper side holding devices 10A and 10B are provided in plan view so as to sandwich the stage device 30 in opposition above the processing cup 61. The upper side holding device 10A includes a lower chuck 11A, an upper chuck 12A, a lower chuck drive section 13A, and an upper chuck drive section 14A. The upper side holding device 10B includes a lower chuck 11B, an upper chuck 12B, a lower chuck drive section 13B, and an upper chuck drive section 14B.

[0105] The lower chucks 11A and 11B are arranged in plan view so as to be symmetrical about a vertical plane extending in the Y direction (front-rear direction) through the center of the suction holding section 21 and are provided so as to be movable in the X direction in a common horizontal plane. Each of the lower chucks 11A and 11B has two support pieces that can support the lower surface peripheral portion of the substrate W from below. The lower chuck drive sections 13A and 13B move the lower chucks 11A and 11B toward each other or away from each other.

[0106] Like the lower chucks 11A and 11B, the upper chucks 12A and 12B are arranged vertically symmetrically about the center of the adsorption holding part 21 in the Y direction (front-back direction) when viewed from above, and are movable in the X direction within a common horizontal plane. Each of the upper chucks 12A and 12B has two holding tabs configured to abut against two portions of the outer peripheral end of the substrate W and to hold the outer peripheral end of the substrate W. The upper chuck drive parts 14A and 14B move the upper chucks 12A and 12B either by bringing them closer together or by moving them further apart.

[0107] like Figure 1 As shown, a top surface cleaning device 70 is provided on one side of the processing cup 61, near the upper holding device 10B in a top view. The top surface cleaning device 70 includes a rotating support shaft 71, an arm 72, a spray nozzle 73, and a top surface cleaning drive unit 74.

[0108] The rotating support shaft 71 is supported on the bottom surface 2a by the upper surface cleaning drive unit 74, extending vertically and capable of being raised, lowered, and rotated. For example... Figure 2 As shown, the arm 72 is positioned above the upper holding device 10B, extending horizontally from the upper end of the rotating support shaft 71. A spray nozzle 73 is mounted at the front end of the arm 72.

[0109] The upper surface cleaning fluid supply unit 75 is connected to the spray nozzle 73. Figure 3 The upper surface cleaning fluid supply unit 75 supplies cleaning fluid and gas to the spray nozzle 73. In this embodiment, clean water is used as the cleaning fluid supplied to the spray nozzle 73, and nitrogen is used as the gas supplied to the spray nozzle 73. When the spray nozzle 73 cleans the upper surface of the substrate W, it mixes the cleaning fluid supplied from the upper surface cleaning fluid supply unit 75 with the gas to generate a mixed fluid, and sprays the generated mixed fluid downward.

[0110] Furthermore, the cleaning fluid supplied to the spray nozzle 73 can also replace purified water, such as carbonated water, ozone water, hydrogen water, electrolyzed ionized water, SC1 (a mixed solution of ammonia and hydrogen peroxide), or TMAH (tetramethylammonium hydroxide). Additionally, the gas supplied to the spray nozzle 73 can also replace nitrogen, such as inert gases like argon or helium.

[0111] The upper surface cleaning drive unit 74 includes one or more pulse motors and cylinders, which raise and lower the rotating support shaft 71 and rotate the rotating support shaft 71. According to the above configuration, the entire upper surface of the substrate W can be cleaned by moving the spray nozzle 73 in an arc shape on the upper surface of the substrate W, which is held and rotated by the adsorption holding unit 21.

[0112] likeFigure 1 As shown in the figure, on the other side of the processing cup 61, an end portion cleaning device 80 is provided in a manner that is located near the upper side holding device 10A in a top view. The end portion cleaning device 80 includes a rotary support shaft 81, an arm 82, an inclined angle brush 83, and an inclined angle brush driving portion 84.

[0113] The rotary support shaft 81 is supported on the floor portion 2a in a manner that extends in the up and down direction and is capable of being lifted and rotated by the inclined angle brush driving portion 84. As shown in the figure, the arm 82 is provided in a manner that extends from the upper end portion of the rotary support shaft 81 in the horizontal direction at a position above the upper side holding device 10A. At the front end portion of the arm 82, the inclined angle brush 83 is provided in a manner that protrudes downward and is capable of rotating around an axis in the up and down direction. Figure 2

[0114] The inclined angle brush 83 is formed of, for example, a PVA sponge or a PVA sponge in which abrasive grains are dispersed, and has a shape in which the upper half has an inverted conical frustum shape and the lower half has a conical frustum shape. According to the inclined angle brush 83, it is possible to clean the outer peripheral end portion of the substrate W at the central portion in the up and down direction of the outer peripheral surface.

[0115] The inclined angle brush driving portion 84 includes one or a plurality of pulse motors and air cylinders or the like, and lifts and rotates the rotary support shaft 81. According to the configuration, it is possible to clean the entire outer peripheral end portion of the substrate W by causing the central portion of the outer peripheral surface of the inclined angle brush 83 to contact the outer peripheral end portion of the substrate W that is held and rotated by the adsorption holding portion 21.

[0116] Here, the inclined angle brush driving portion 84 also includes a motor that is built in the arm 82. The motor rotates the inclined angle brush 83 that is provided at the front end portion of the arm 82 around an axis in the up and down direction. Therefore, when the outer peripheral end portion of the substrate W is cleaned, the cleaning force of the inclined angle brush 83 at the outer peripheral end portion of the substrate W is improved by the rotation of the inclined angle brush 83.

[0117] Figure 3 is a block diagram that shows the configuration of a control system of the substrate cleaning device 1 according to an embodiment of the present application. Figure 3 The control device 9 includes a CPU (Central Processing Unit), a RAM (Random Access Memory), a ROM (Read Only Memory), and a storage device. The RAM is used as a work area of the CPU. The ROM stores a system program. The storage device stores a control program.

[0118] As shown in the figure, the control device 9 is connected to the substrate holding device 1, the substrate processing device 2, the substrate transfer device 3, the substrate cleaning device 4, the substrate drying device 5, the substrate transfer device 6, the substrate transfer device 7, the substrate transfer device 8, and the substrate transfer device 10. Figure 3 ​As shown, the control device 9 includes a chuck control unit 9A, an adsorption control unit 9B, a platform control unit 9C, a transfer control unit 9D, a lower surface cleaning control unit 9E, a cup control unit 9F, an upper surface cleaning control unit 9G, an angled cleaning control unit 9H, and a loading / unloading control unit 9I as functional units. The functional units of the control device 9 are implemented by the CPU executing a substrate cleaning program stored in the storage device on the RAM. Some or all of the functional units of the control device 9 can also be implemented using hardware such as electronic circuits.

[0119] like Figure 3 As shown, the chuck control unit 9A receives the substrate W that is loaded into the substrate cleaning apparatus 1 and holds it above the adsorption holding unit 21, and controls the lower chuck drive units 13A and 13B and the upper chuck drive units 14A and 14B. Additionally, the adsorption control unit 9B controls the adsorption holding drive unit 22 to adsorb and hold the substrate W using the adsorption holding unit 21 and to rotate the adsorbed and held substrate W.

[0120] The stage control unit 9C controls the stage drive unit 33 to move the movable stage 32 relative to the substrate W held by the upper holding devices 10A and 10B. The transfer control unit 9D controls the pin lifting drive unit 43 to move the substrate W between the height position of the substrate W held by the upper holding devices 10A and 10B and the height position of the substrate W held by the adsorption holding unit 21.

[0121] The lower surface cleaning control unit 9E cleans the lower surface of the substrate W and controls the lower surface brush rotation drive unit 55a, the lower surface brush lifting drive unit 55b, the lower surface brush moving drive unit 55c, the lower surface cleaning liquid supply unit 56, and the ejected gas supply unit 57. The cup control unit 9F controls the cup drive unit 62 to catch the cleaning liquid that splashes from the substrate W when cleaning the substrate W held by the adsorption and holding unit 21.

[0122] The upper surface cleaning control unit 9G cleans the upper surface of the substrate W held by the adsorption and holding unit 21, and controls the upper surface cleaning drive unit 74 and the upper surface cleaning fluid supply unit 75. The angled cleaning control unit 9H cleans the outer peripheral end of the substrate W held by the adsorption and holding unit 21, and controls the angled brush drive unit 84. The loading and unloading control unit 9I switches the loading and unloading outlet 2x of the unit frame 2 when the substrate W is loaded into and unloaded from the substrate cleaning apparatus 1, and controls the gate drive unit 92.

[0123] [2] Operation of substrate cleaning device 1

[0124] Figures 4-15 It is used to explain Figure 1 A schematic diagram illustrating an example of the operation of the substrate cleaning apparatus 1. Figures 4-15In each of the drawings, the upper stage indicates a plan view of the substrate cleaning apparatus 1. In addition, the middle stage indicates a side view of the lower holding device 20 and its peripheral portion as viewed in the Y direction, and the lower stage indicates a side view of the lower holding device 20 and its peripheral portion as viewed in the X direction. The side view of the middle stage corresponds to a side view of the A-A line of Figure 1 , and the side view of the lower stage corresponds to a side view of the B-B line of Figure 1 . Furthermore, in order to easily understand the shapes and the state of operation of the respective constituent elements of the substrate cleaning apparatus 1, the scale of a part of the constituent elements is different between the plan view of the upper stage and the side views of the middle and lower stages. In addition, in the drawings, Figures 4-15 , the processing cup 61 is indicated by a double-dot chain line, and the outline of the substrate W is indicated by a thicker single-dot chain line.

[0125] In an initial state before the substrate W is carried into the substrate cleaning apparatus 1, the shutter 91 of the gate device 90 blocks the carrying-in / out port 2x. In addition, as shown in Figure 1 , the lower chucks 11A, 11B maintain a state in which the distance between the lower chucks 11A, 11B is sufficiently larger than the diameter of the substrate W. In addition, the upper chucks 12A, 12B also maintain a state in which the distance between the upper chucks 12A, 12B is sufficiently larger than the diameter of the substrate W. In addition, the movable stage 32 of the pedestal device 30 is disposed in a manner such that the center of the lower suction holding portion 21 is located at the center of the processing cup 61 in plan view. In addition, the lower surface cleaning device 50 is disposed on the movable stage 32 in a close position. In addition, the lifting support portion 54 of the lower surface cleaning device 50 is in a state in which the cleaning surface (upper end portion) of the lower surface brush 51 is located below the suction holding portion 21. In addition, the transfer device 40 is in a state in which the plurality of support pins 41 are located below the suction holding portion 21. Furthermore, in the cup device 60, the processing cup 61 is in a lower cup position. In the following description, the position of the center of the processing cup 61 in plan view will be referred to as a plan reference position rp. In addition, the position of the movable stage 32 on the bottom surface portion 2a when the center of the suction holding portion 21 is located at the plan reference position rp in plan view will be referred to as a first horizontal position.

[0126] The substrate W is carried into the unit frame 2 of the substrate cleaning apparatus 1. Specifically, the shutter 91 is opened just before the substrate W is carried in, and the carrying-in / out port 2x is opened. Thereafter, as shown by a thick solid arrow a1 in Figure 4 , a hand (substrate holding portion) RH of a substrate carrying robot (not shown) carries the substrate W into a position substantially at the center of the unit frame 2 through the carrying-in / out port 2x. At this time, the substrate W held by the hand RH is located between the lower chuck 11A and the upper chuck 12A and the lower chuck 11B and the upper chuck 12B as shown in Figure 4 .

[0127] Next, as shown in Figure 5As indicated by the thicker solid arrow a2, the lower chucks 11A and 11B are positioned such that their multiple support tabs are located below the peripheral portion of the lower surface of the substrate W, with the lower chucks 11A and 11B close to each other. In this state, the hand RH descends and exits from the loading / unloading outlet 2x. Thus, multiple portions of the peripheral portion of the lower surface of the substrate W held by the hand RH are supported by the multiple support tabs of the lower chucks 11A and 11B. After the hand RH exits, the gate 91 closes the loading / unloading outlet 2x.

[0128] Next, as Figure 6 As shown by the thicker solid arrow a3, the upper chucks 12A and 12B approach each other by abutting against the outer periphery of the substrate W through the multiple retaining tabs of the upper chucks 12A and 12B. The substrate W, supported by the lower chucks 11A and 11B, is also held by the upper chucks 12A and 12B through the abutting of multiple portions of the outer periphery of the substrate W by the multiple retaining tabs of the upper chucks 12A and 12B. Thus, the center of the substrate W held by the upper holding devices 10A and 10B overlaps or approximately overlaps with the planar reference position rp when viewed from above. At this time, as... Figure 6 As shown in the side view of the middle section, the height position of the substrate W held by the upper chucks 12A and 12B corresponds to the first height position of the present invention. Additionally, as... Figure 6 As indicated by the thicker solid arrow a4, the movable platform 32 moves forward from the first horizontal position with the adsorption holding part 21 offset from the plane reference position rp by a specific distance and the center of the lower surface brush 51 located at the plane reference position rp. At this time, the position of the movable platform 32 located on the bottom part 2a is referred to as the second horizontal position.

[0129] Next, as Figure 7 As indicated by the thicker solid arrow a5, the lifting support 54 rises by contacting the cleaning surface of the lower surface brush 51 with the central region of the lower surface of the substrate W. Additionally, as... Figure 7 As indicated by the thicker solid arrow a6, the lower surface brush 51 rotates (spins) about its vertical axis. This physically removes contaminants adhering to the central region of the lower surface of the substrate W using the lower surface brush 51. Figure 7 As shown in the side view below, the height position of the lower surface brush 51 when in contact with the lower surface of the substrate W held by the upper holding devices 10A and 10B corresponds to the first cleaning height position of the present invention.

[0130] exist Figure 7lower surface brush 51 and the lower surface of the substrate W. As shown in the white frame, in the state where the lower surface brush 51 is in contact with the substrate W, the liquid nozzle 52 and the gas spouting portion 53 are held at a position close to the lower surface of the substrate W. At this time, the liquid nozzle 52 spouts the cleaning liquid toward the lower surface of the substrate W at a position in the vicinity of the lower surface brush 51 as shown by the white arrow a51. Thereby, by guiding the cleaning liquid supplied from the liquid nozzle 52 to the lower surface of the substrate W to the contact portion of the lower surface brush 51 and the substrate W, the cleaning liquid is used to flush the contaminant removed from the back surface of the substrate W by the lower surface brush 51. In this way, in the lower surface cleaning device 50, the liquid nozzle 52 is installed together with the lower surface brush 51 to the lift support portion 54. Thereby, it is possible to efficiently supply the cleaning liquid to the portion of the lower surface of the substrate W cleaned by the lower surface brush 51. Therefore, the consumption amount of the cleaning liquid is reduced and the excessive scattering of the cleaning liquid is suppressed.

[0131] Further, the rotation speed of the lower surface brush 51 at the time of cleaning the lower surface of the substrate W is maintained at a speed at which the cleaning liquid supplied from the liquid nozzle 52 to the lower surface of the substrate W does not scatter to the side of the lower surface brush 51.

[0132] Here, the upper surface 54u of the lift support portion 54 is inclined to the obliquely downward direction in a direction away from the adsorption holding portion 21. In this case, in the case where the cleaning liquid containing the contaminant falls from the lower surface of the substrate W to the lift support portion 54, the cleaning liquid caught by the upper surface 54u is guided to the direction away from the adsorption holding portion 21.

[0133] Further, at the time of cleaning the lower surface of the substrate W by the lower surface brush 51, the gas spouting portion 53 spouts the gas toward the lower surface of the substrate W at a position between the lower surface brush 51 and the adsorption holding portion 21 as shown by the white arrow a52 in the white frame. Figure 7 In this embodiment, the gas spouting portion 53 is installed on the lift support portion 54 in a manner that the gas spouting port extends in the X direction. In this case, when the gas is spouted from the gas spouting portion 53 toward the lower surface of the substrate W, a band-shaped gas curtain extending in the X direction is formed between the lower surface brush 51 and the adsorption holding portion 21. Thereby, at the time of cleaning the lower surface of the substrate W by the lower surface brush 51, the scattering of the cleaning liquid containing the contaminant to the adsorption holding portion 21 is prevented. Therefore, at the time of cleaning the lower surface of the substrate W by the lower surface brush 51, the cleaning liquid containing the contaminant is prevented from adhering to the adsorption holding portion 21, and the adsorption surface of the adsorption holding portion 21 is kept clean.

[0134] Further, at the time of cleaning the lower surface of the substrate W by the lower surface brush 51, the gas spouting portion 53 spouts the gas toward the lower surface of the substrate W at a position between the lower surface brush 51 and the adsorption holding portion 21 as shown by the white arrow a52 in the white frame. Figure 7In the example, as shown by the white arrow a52, gas is ejected from the gas ejection section 53 diagonally upwards and downwards from the lower surface brush 51, but the present invention is not limited to this. The gas ejection section 53 may also eject gas from the gas ejection section 53 towards the lower surface of the substrate W along the Z direction.

[0135] Next, in Figure 7 In this state, if the cleaning of the central region of the lower surface of the substrate W is completed, the rotation of the lower surface brush 51 is stopped, and the lifting support 54 is lowered such that the cleaning surface of the lower surface brush 51 is separated from the substrate W by a specific distance (greater than 0 mm and less than 10 mm, for example, about 5 mm). Additionally, the spraying of cleaning liquid from the liquid nozzle 52 onto the substrate W stops. At this time, gas continues to be sprayed onto the substrate W from the gas ejection section 53.

[0136] After that, as Figure 8 As indicated by the thicker solid arrow a7, the movable stage 32 moves rearward with the adsorption holding part 21 positioned at the planar reference position rp. That is, the movable stage 32 moves from the second horizontal position to the first horizontal position. At this time, by continuing to spray gas from the gas ejection part 53 onto the substrate W, the central region of the lower surface of the substrate W is sequentially dried by the gas curtain.

[0137] Next, as Figure 9 As indicated by the thicker solid arrow a8, the lifting support 54 descends with the cleaning surface of the lower surface brush 51 located below the adsorption surface (upper end) of the adsorption holding part 21. Additionally, as... Figure 9 As indicated by the thicker solid arrow a9, the upper chucks 12A and 12B are separated from the outer periphery of the substrate W, with the upper chucks 12A and 12B moving away from each other. At this time, the substrate W is supported by the lower chucks 11A and 11B.

[0138] After that, as Figure 9 As indicated by the thicker solid arrow a10, the pin connecting member 42 rises with the upper ends of the multiple support pins 41 positioned slightly above the lower chucks 11A and 11B. Thus, the substrate W, supported by the lower chucks 11A and 11B, is received by the multiple support pins 41.

[0139] Next, as Figure 10 As indicated by the thicker solid arrow a11, the lower chucks 11A and 11B move away from each other. At this point, the lower chucks 11A and 11B move to a position that, from a top-down view, does not overlap with the substrate W supported by the multiple support pins 41. Consequently, the upper holding devices 10A and 10B return to their initial state.

[0140] Next, as Figure 11As indicated by the thicker solid arrow a12, the pin connecting member 42 descends with the upper ends of the multiple support pins 41 positioned below the adsorption and holding portion 21. Consequently, the substrate W supported on the multiple support pins 41 is received by the adsorption and holding portion 21. In this state, the adsorption and holding portion 21 adsorbs and holds the central region of the lower surface of the substrate W. Thus, the center of the substrate W adsorbed and held by the lower holding device 20 overlaps or substantially overlaps with the planar reference position rp when viewed from above. At this time, as... Figure 11 As shown in the side views of the middle and lower sections, the height position of the substrate W held by the adsorption and holding part 21 corresponds to the second height position of the present invention. Simultaneously with or after the descent of the pin connecting member 42, as... Figure 11 As indicated by the thicker solid arrow a13, the processing cup 61 rises from the lower cup position to the upper cup position. Thus, the substrate W, at the second height position, is located below the upper end of the processing cup 61.

[0141] Next, as Figure 12 As shown by the thicker solid arrow a14, the adsorption holding portion 21 rotates about an axis in the vertical direction (the axis of rotation of the adsorption holding drive portion 22). As a result, the substrate W adsorbed and held in the adsorption holding portion 21 rotates in a horizontal position.

[0142] Next, the rotating support shaft 71 of the upper surface cleaning device 70 rotates and descends. Thus, as... Figure 12 As indicated by the thicker solid arrow a15, the spray nozzle 73 moves to a position above the substrate W and descends such that the distance between the spray nozzle 73 and the substrate W becomes a predetermined distance. In this state, the spray nozzle 73 sprays a mixture of cleaning liquid and gas onto the upper surface of the substrate W. Additionally, the rotation support shaft 71 rotates. Thus, as... Figure 12 As indicated by the thicker solid arrow a16, the spray nozzle 73 moves to a position above the rotating substrate W. The entire upper surface of the substrate W is cleaned by spraying the mixed fluid onto it.

[0143] Furthermore, when the upper surface of the substrate W is cleaned using the spray nozzle 73, the rotating support shaft 81 of the end cleaning device 80 also rotates and descends. Thus, as... Figure 12 As indicated by the thicker solid arrow a17, the angled brush 83 moves to a position above the outer peripheral end of the substrate W. Furthermore, the central portion of the outer peripheral surface of the angled brush 83 descends to contact the outer peripheral end of the substrate W. In this state, the angled brush 83 rotates (spins) about an axis in the vertical direction. Thus, the angled brush 83 physically removes contaminants adhering to the outer peripheral end of the substrate W. The contaminants removed from the outer peripheral end of the substrate W are then rinsed by a cleaning solution of a mixed fluid sprayed from the spray nozzle 73 onto the substrate W.

[0144] Furthermore, when the upper surface of the substrate W is cleaned by the spray nozzle 73, the lift support portion 54 is raised in a manner that the cleaning surface of the lower surface brush 51 is in contact with the outer side region of the lower surface of the substrate W. In addition, as shown by the thick solid arrow a17 in FIG. 7, the spray nozzle 73 is moved to the position on the other side of the processing cup 61 (the position of the initial state). Furthermore, as shown by the thick solid arrow a18 in FIG. 7, the lower surface brush 51 is rotated (rotated on its own axis) about the vertical axis. Furthermore, the liquid nozzle 52 sprays the cleaning liquid to the lower surface of the substrate W, and the gas jet portion 53 jets the gas to the lower surface of the substrate W. In this state, as shown by the thick solid arrow a19 in FIG. 7, the moving support portion 55 is moved on the movable base 32 between the approach position and the separation position. Thus, by moving the lower surface brush 51 in the horizontal direction in a manner that the lower surface brush 51 is in contact with the lower surface of the substrate W by the moving support portion 55, the range of the lower surface of the substrate W that can be cleaned by the lower surface brush 51 is enlarged. Thus, the outer side region of the lower surface of the substrate W that is held and rotated by the adsorption holding portion 21 is cleaned by the lower surface brush 51. As shown by the thick solid arrow a20 in FIG. 7, the spray nozzle 73 is moved to the position on the other side of the processing cup 61 (the position of the initial state). Furthermore, as shown by the thick solid arrow a21 in FIG. 7, the oblique angle brush 83 is moved to the position on the other side of the processing cup 61 (the position of the initial state). Furthermore, the rotation of the lower surface brush 51 is stopped, and the lift support portion 54 is lowered in a manner that the cleaning surface of the lower surface brush 51 is separated from the substrate W by a certain distance. In addition, the spraying of the cleaning liquid from the liquid nozzle 52 to the substrate W and the jetting of the gas from the gas jet portion 53 to the substrate W are stopped. In this state, the substrate W is dried by the high-speed rotation of the adsorption holding portion 21 to remove the cleaning liquid adhered to the substrate W. Figure 12 Figure 12 Figure 12

[0145] Next, if the cleaning of the upper surface, the outer peripheral end portion, and the outer side region of the lower surface of the substrate W is completed, the jetting of the mixed fluid from the spray nozzle 73 to the substrate W is stopped. In addition, as shown by the thick solid arrow a20 in FIG. 7, the spray nozzle 73 is moved to the position on the other side of the processing cup 61 (the position of the initial state). Furthermore, as shown by the thick solid arrow a21 in FIG. 7, the oblique angle brush 83 is moved to the position on the other side of the processing cup 61 (the position of the initial state). Furthermore, the rotation of the lower surface brush 51 is stopped, and the lift support portion 54 is lowered in a manner that the cleaning surface of the lower surface brush 51 is separated from the substrate W by a certain distance. In addition, the spraying of the cleaning liquid from the liquid nozzle 52 to the substrate W and the jetting of the gas from the gas jet portion 53 to the substrate W are stopped. In this state, the substrate W is dried by the high-speed rotation of the adsorption holding portion 21 to remove the cleaning liquid adhered to the substrate W. Figure 13 Figure 13

[0146] Next, as shown by the thick solid arrow a22 in FIG. 7, the processing cup 61 is lowered from the upper cup position to the lower cup position. Thus, the substrate W at the second height position is positioned above the upper end portion of the processing cup 61. In addition, a new substrate W is prepared to be carried into the unit frame 2, and as shown by the thick solid arrow a23 in FIG. 7, the lower chucks 11A and 11B are moved to approach each other to the position at which the new substrate W can be supported. Figure 14 Figure 14

[0147] ​​​​​​​Finally, the substrate W is carried out of the unit housing 2 of the substrate cleaning apparatus 1. Specifically, just before the substrate W is carried out, the gate 91 opens the carry-in / out port 2x. Thereafter, as shown by a thick solid arrow a24, a hand (substrate holding portion) RH of a substrate carrying robot, which is not shown, enters the unit housing 2 through the carry-in / out port 2x. Next, the hand RH receives the substrate W on the suction holding portion 21 and exits from the carry-in / out port 2x. After the hand RH exits, the gate 91 closes the carry-in / out port 2x. Figure 15

[0148] [3] Effects of the substrate cleaning apparatus 1

[0149] (1) In the substrate cleaning apparatus 1 of the present embodiment, the movable stage 32 is moved to the second horizontal position in a state where the peripheral end portions of the substrate W are held by the upper holding apparatuses 10A, 10B. In a state where the movable stage 32 is at the second horizontal position, the suction holding portion 21 faces the lower surface outer region of the substrate W and the lower surface brush 51 faces the lower surface central region of the substrate W. In this case, the elevation support portion 54 is elevated in such a manner that the lower surface brush 51 comes into contact with the lower surface of the substrate W. Thus, the lower surface central region of the substrate W held by the upper holding apparatuses 10A, 10B is cleaned by the lower surface brush 51.

[0150] On the other hand, the movable stage 32 is moved to the first horizontal position in a state where the peripheral end portions of the substrate W are held by the upper holding apparatuses 10A, 10B. In a state where the movable stage 32 is at the first horizontal position, the suction holding portion 21 faces the lower surface central region of the substrate W and the lower surface brush 51 faces the lower surface outer region of the substrate W. In this case, the substrate W is moved on the suction holding portion 21 by the transfer apparatus 40 without horizontal movement of the substrate W, and the lower surface central region of the substrate W can be held in suction by the suction holding portion 21. In a state where the substrate W held in suction by the suction holding portion 21 is rotated, the elevation support portion 54 is elevated in such a manner that the lower surface brush 51 comes into contact with the lower surface of the substrate W. Thus, the lower surface outer region of the substrate W held in suction by the suction holding portion 21 is cleaned by the lower surface brush 51.

[0151] Thus, according to the substrate cleaning apparatus 1 of the present embodiment, the lower surface central region and the lower surface outer region of the substrate W are cleaned respectively without horizontal movement of the substrate W. Therefore, it is possible to reduce an increase in floor space and clean the entire lower surface of the substrate W.

[0152] ​(2) In the substrate cleaning apparatus 1 of the present embodiment, the lower surface brush 51 is raised and lowered by the raising and lowering support portion 54 in a state where the substrate W is held by the upper holding apparatuses 10A, 10B, and the lower surface brush 51 is brought into contact with the lower surface of the substrate W. In this state, the lower surface brush 51 is rotated to supply the cleaning liquid to the lower surface of the substrate W.

[0153] Here, the height position of the substrate W held by the upper holding apparatuses 10A, 10B is higher than the upper end portion of the process cup 61. Even in this case, since the substrate W is not rotated in a state where the substrate W is held by the upper holding apparatuses 10A, 10B, the cleaning liquid supplied to the substrate W is not easily scattered to the outside of the substrate W. Thus, it is possible to prevent interference of the upper holding apparatuses 10A, 10B with the process cup 61, and to reduce scattering of the cleaning liquid and clean the central region of the lower surface of the substrate W by the lower surface brush 51.

[0154] On the other hand, the lower surface brush 51 is raised and lowered by the raising and lowering support portion 54 in a state where the substrate W is held by the adsorption holding portion 21, and the lower surface brush 51 is brought into contact with the lower surface of the substrate W. In this state, the substrate W is also rotated together with the adsorption holding portion 21 to supply the cleaning liquid to the lower surface of the substrate W.

[0155] Here, the height position of the substrate W held by the adsorption holding portion 21 is lower than the upper end portion of the process cup 61 when the central region of the lower surface of the substrate W is cleaned by the lower surface brush 51. Therefore, the cleaning liquid supplied to the lower surface of the substrate W rotated by the adsorption holding portion 21 and scattered to the outside of the substrate W is caught by the process cup 61. Thus, it is possible to suppress reduction in cleanliness due to the scattered cleaning liquid, and to clean the outer region of the lower surface of the substrate W held by the adsorption holding portion 21 by the lower surface brush 51.

[0156] Between the upper holding apparatuses 10A, 10B and the adsorption holding portion 21, the substrate W is exchanged by the exchange apparatus 40 by raising and lowering the substrate W in the Z direction. Thus, the substrate W in the state held by the upper holding apparatuses 10A, 10B and the substrate W in the state held by the lower holding apparatus 20 mostly overlap in plan view. In this way, in the substrate cleaning apparatus 1, it is not necessary to move the substrate W in the horizontal direction in order to clean the central region of the lower surface and the outer region of the lower surface of the substrate W, respectively. In addition, when the central region of the lower surface and the outer region of the lower surface of the substrate W are cleaned, scattering of the cleaning liquid supplied to the lower surface of the substrate W to the outside of the substrate W is reduced. As a result, it is possible to reduce increase in floor space and to clean the entire lower surface of the substrate W while maintaining a high level of cleanliness.

[0157] (3) As described above, in the substrate cleaning apparatus 1 of the present embodiment, the area of the cleaning surface of the lower surface brush 51 is larger than the area of the adsorption surface of the adsorption holding portion 21.

[0158] In this case, with the movable stage 32 in the first horizontal position, the lower surface brush 51 can be brought into contact with the lower surface of the substrate W in such a way that it covers the portion of the substrate W held by the adsorption and holding portion 21. Therefore, the portion of the substrate W held by the adsorption and holding portion 21 can be cleaned without the lower surface brush 51 moving in the horizontal direction.

[0159] (4) In the substrate cleaning apparatus 1 of this embodiment, the lifting support 54 moves relative to the lower holding device 20 on the movable stage 32. As a result, even when the contact area of ​​the lower surface brush 51 that contacts the lower surface of the substrate W is smaller than the outer region of the lower surface of the substrate W, the lower surface of the substrate W can be cleaned over a wide area by moving the lifting support 54 horizontally on the movable stage 32.

[0160] [4] Substrate cleaning treatment

[0161] Figure 16 It means Figure 3 The flowchart of the substrate cleaning process of the control device 9. Figure 16 The substrate cleaning process is performed by the CPU of the control device 9 executing a substrate cleaning program stored in the storage device on the RAM. Hereinafter, using... Figure 3 Control device 9 Figures 4-15 Substrate cleaning apparatus 1 and Figure 16 The flowchart illustrates the substrate cleaning process.

[0162] First, the loading / unloading control unit 9I, through the control gate drive unit 92, loads the substrate W into the cell frame 2. Figure 4 , Figure 5 And step S1). Next, the chuck control unit 9A controls the lower chuck drive units 13A, 13B and the upper chuck drive units 14A, 14B, and uses the upper holding devices 10A, 10B to hold the substrate W ( Figure 5 , Figure 6 and step S2).

[0163] Next, the platform control unit 9C controls the platform drive unit 33 to move the movable platform 32 from the first horizontal position to the second horizontal position. Figure 6 (and step S3). At this time, the center of the substrate W held by the upper holding devices 10A and 10B is in the first position, and the center of the lower surface brush 51 is below the first position. Then, the lower surface cleaning control unit 9E cleans the central area of ​​the lower surface of the substrate W while the center of the substrate W is in the first position by controlling the lower surface brush rotation drive unit 55a, the lower surface brush lifting drive unit 55b, the lower surface brush moving drive unit 55c, the lower surface cleaning liquid supply unit 56, and the ejected gas supply unit 57.Figure 7 and step S4).

[0164] Next, the lower surface cleaning control section 9E dries the central region of the lower surface of the substrate W by controlling the blow gas supply section 57 ( Figure 8 and step S5). Further, the pedestal control section 9C moves the movable pedestal 32 from the second horizontal position to the first horizontal position by controlling the pedestal drive section 33 ( Figure 8 and step S6). At this time, the rotation center of the adsorption holding section 21 of the lower side holding device 20 is positioned below the first position. In this example, steps S5 and S6 are performed almost simultaneously. Thus, the central region of the lower surface of the substrate W is dried in sequence.

[0165] Next, the substrate W is transferred from the upper side holding devices 10A and 10B to the lower side holding device 20 by controlling the lower chuck drive sections 13A and 13B and the upper chuck drive sections 14A and 14B by the chuck control section 9A, and controlling the pin lift drive section 43 by the transfer control section 9D ( Figures 8-11 and step S7). At this time, the center of the substrate W is positioned at the second position below the first position. In this state, the substrate W is held by the lower side holding device 20 by controlling the adsorption holding drive section 22 so as to adsorb the central region of the lower surface of the substrate W by the adsorption control section 9B ( Figure 11 and step S8).

[0166] After that, the entire upper surface of the substrate W is cleaned by the upper surface cleaning control section 9G by controlling the upper surface cleaning drive section 74 and the upper surface cleaning fluid supply section 75 ( Figure 12 and step S9). Further, the peripheral end portion of the substrate W is cleaned by the oblique angle cleaning control section 9H by controlling the oblique angle brush drive section 84 ( Figure 12 and step S10). Furthermore, the outer side region of the lower surface of the substrate W is cleaned by the lower surface cleaning control section 9E by controlling the lower surface brush rotation drive section 55a, the lower surface brush lift drive section 55b, the lower surface brush movement drive section 55c, the lower surface cleaning fluid supply section 56, and the blow gas supply section 57 in a state where the center of the substrate W is positioned at the second position ( Figure 12 and step S11).

[0167] Steps S9 to S11 are performed almost simultaneously. While steps S9 to S11 are performed, the substrate W is rotated around the axis of the rotation axis of the adsorption holding drive section 22 by the adsorption control section 9B by controlling the adsorption holding drive section 22. Further, the cup 61 is raised from the lower cup position to the upper cup position by the cup control section 9F by controlling the cup drive section 62.

[0168] After the cleaning is completed, the entire substrate W is dried by the adsorption control section 9B by controlling the adsorption holding drive section 22 so as to rotate the adsorption holding section 21 at high speed ( Figure 13 ​and step S12). After the cleaning is completed, the upper side holding devices 10A, 10B and the cup 61 and the like are returned to the initial state (step S13) and the substrate cleaning process is completed. Figure 14 Finally, the in / out control section 9I moves the substrate W out of the cell frame 2 by controlling the gate drive section 92 (step S13) and the substrate cleaning process is completed. Figure 15 and step S13), the substrate cleaning process is completed.

[0169] [5] Effect of the substrate cleaning process

[0170] In the substrate cleaning apparatus 1 of the present embodiment, the substrate W is transferred between the upper side holding devices 10A, 10B and the lower side holding device 20 by the transfer device 40. While the substrate W is held by the upper side holding devices 10A, 10B, the central region of the lower surface of the substrate W is cleaned by the lower surface brush 51 in a state where the center of the substrate W is located at the first position. While the substrate W is held by the lower side holding device 20, the outer region of the lower surface of the substrate W is cleaned by the lower surface brush 51 in a state where the center of the substrate W is located at the second position below the first position.

[0171] According to the above-described configuration, the central region and the outer region of the lower surface of the substrate W are cleaned without moving the substrate W horizontally. Therefore, the increase in floor space can be reduced and the entire lower surface of the substrate W can be easily cleaned.

[0172] Further, the pedestal drive section 33 is controlled so that the movable pedestal 32 is in the first state when the substrate W held by the upper side holding devices 10A, 10B is cleaned and the movable pedestal 32 is in the second state when the substrate W is transferred between the upper side holding devices 10A, 10B and the lower side holding device 20. Here, in the first state, the lower surface brush 51 is located below the center of the substrate W held by the upper side holding devices 10A, 10B. In the second state, the center of rotation of the lower side holding device 20 is located below the center of the substrate W held by the upper side holding devices 10A, 10B.

[0173] In this case, the substrate W can be easily transferred between the upper side holding devices 10A, 10B and the lower side holding device 20 and the central region of the lower surface of the substrate W held by the upper side holding devices 10A, 10B and the outer region of the lower surface of the substrate W held by the lower side holding device 20 can be easily cleaned by the common lower surface brush 51.

[0174] [6] Variation of the substrate cleaning process

[0175] In the present embodiment, the cleaning is completed after the outer region of the lower surface of the substrate W is cleaned by the lower surface cleaning device 50 and the substrate W is moved out of the cell frame 2, but the present embodiment is not limited to this. Figure 17 is a flowchart showing the substrate cleaning process of the first variation. As shown inFigure 17 As shown, in this example, steps S14 to S19 are executed between the step S12 and the step S13 of the substrate cleaning process.

[0176] Specifically, after the step S12, the handover control section 9D again hands over the substrate W from the lower holding means 20 to the upper holding means 10A, 10B by controlling the pin lift driving section 43 (step S14). At this time, the center of the substrate W is at the first position. In this state, the chuck control section 9A holds the substrate W by the upper holding means 10A, 10B by controlling the lower chuck driving sections 13A, 13B and the upper chuck driving sections 14A, 14B (step S15).

[0177] Next, the pedestal control section 9C moves the movable pedestal 32 from the first horizontal position to the second horizontal position by controlling the pedestal driving section 33 (step S16). At this time, the center of the lower surface brush 51 is below the first position. Then, the lower surface cleaning control section 9E again cleans the central region of the lower surface of the substrate W in the state where the center of the substrate W is at the first position by controlling the lower surface brush rotation driving section 55a, the lower surface brush lift driving section 55b, the lower surface brush moving driving section 55c, the lower surface cleaning liquid supply section 56, and the spouting gas supply section 57 (step S17).

[0178] After that, the lower surface cleaning control section 9E dries the substrate W by controlling the spouting gas supply section 57 (step S18). In addition, the pedestal control section 9C moves the movable pedestal 32 from the second horizontal position to the first horizontal position by controlling the pedestal driving section 33 (step S19). In this example, the steps S18, S19 are executed almost simultaneously. Thus, the central region of the lower surface of the substrate W is sequentially dried. Finally, the carry-in / out control section 91 carries out the substrate W from the cell frame 2 by controlling the gate driving section 92 (step S13), and the substrate cleaning process is completed.

[0179] According to the first modification example, the central region of the lower surface of the substrate W held by the lower holding means 20 is again cleaned in the upper holding means 10A, 10B. Thus, the substrate W can be more properly cleaned.

[0180] Figure 18 is a flowchart showing a substrate cleaning process of a second modification example. The substrate cleaning process of the second modification example is different from the substrate cleaning process of the first modification example in the following points. In the substrate cleaning process of the second modification example, the execution of the steps S3 to S6 is omitted. That is, the cleaning of the central region of the lower surface of the substrate W is not performed before the cleaning of the outer side region of the lower surface of the substrate W, but is performed only after the cleaning of the outer side region of the lower surface of the substrate W.

[0181] According to the 2nd variation, the central region of the lower surface of the substrate W held by the lower holding device 20 is cleaned in the upper holding devices 10A, 10B. The cleaning of the central region of the lower surface of the substrate W is not performed until the outer region of the lower surface of the substrate W is cleaned. Thus, the substrate W can be cleaned more appropriately and efficiently.

[0182] In the 2nd variation, the substrate W carried into the cell frame 2 is transferred to the lower holding device 20 by the plurality of support pins 41 after being held by the upper holding devices 10A, 10B, but the embodiment is not limited to this. The substrate W carried into the cell frame 2 can also be directly transferred to the lower holding device 20 without passing through the upper holding devices 10A, 10B and the plurality of support pins 41. In this case, the execution of the steps S2, S7 of Figure 18 is also omitted.

[0183] [7] Substrate processing apparatus provided with substrate cleaning device 1

[0184] Figure 19 is a schematic plan view showing an example of a substrate processing apparatus provided with Figure 1 the substrate cleaning device 1. As shown in Figure 19 , the substrate processing apparatus 100 of the present embodiment has an indexing block 110 and a processing block 120. The indexing block 110 and the processing block 120 are disposed in a manner of being adjacent to each other.

[0185] The indexing block 110 includes a plurality of (4 in this example) carrier placement stages 140 and a conveyance section 150. The plurality of carrier placement stages 140 are connected to the conveyance section 150. On each carrier placement stage 140, a carrier C that houses a plurality of substrates W is placed. In the conveyance section 150, an indexing robot IR and a control section 111 are provided. The indexing robot IR is configured to be movable within the conveyance section 150, and is configured to be rotatable around a vertical axis and to be liftable and lowerable. The indexing robot IR has a plurality of hands for handing the substrates W. The plurality of hands can be 2 or 4, and are supported in a manner of being arranged in the up-down direction with intervals. Thus, the indexing robot IR can simultaneously convey a plurality of substrates W using the plurality of hands. The control section 111 includes a computer or the like including a CPU, a ROM, and a RAM, and controls each constituent section within the substrate processing apparatus 100.

[0186] The processing block 120 includes cleaning sections 161, 162 and a conveyance section 163. The cleaning sections 161, 163 and the cleaning section 162 are arranged in a manner of being adjacent to the conveyance section 150 and being arranged in the order. In the cleaning sections 161, 162, a plurality of (for example, 3) substrate cleaning devices 1 are stacked in the up-down direction.

[0187] A main robot MR is provided in the conveyance section 163. The main robot MR is configured to be rotatable around a vertical axis and to be vertically movable. The main robot MR has a plurality of hands for handing over the substrate W. The hands of the main robot MR correspond to the hands RH.

[0188] A plurality of (for example, about 20) substrate placement sections PASS for handing over the substrate W between the indexing robot IR and the main robot MR are arranged in layers above and below between the indexing block 110 and the processing block 120.

[0189] In the substrate processing apparatus 100, the indexing robot IR takes out an unprocessed substrate W from any one of a plurality of cassettes C placed on a plurality of cassette placement tables 140. In addition, the indexing robot IR places the taken-out unprocessed substrate W on any one of a plurality of substrate placement sections PASS. Further, the indexing robot IR receives a processed substrate W placed on any one of the plurality of substrate placement sections PASS and accommodates it in one cassette C.

[0190] In addition, the main robot MR receives an unprocessed substrate W placed on any one of the plurality of substrate placement sections PASS and conveys it into any one of a plurality of substrate cleaning apparatuses 1 of the cleaning sections 161, 162. Further, if the cleaning processing ends in any one of the plurality of substrate cleaning apparatuses 1, the main robot MR conveys out a processed substrate W from the substrate cleaning apparatus 1 and places it on any one of the plurality of substrate placement sections PASS.

[0191] As described above, Figure 19 The substrate processing apparatus 100 has a plurality of Figure 1 The substrate cleaning apparatus 1. Thereby, it is possible to clean the upper surface and the lower surface of the substrate W in one substrate cleaning apparatus 1 without turning over the substrate W. Therefore, the throughput of the cleaning processing of the substrate W is improved. In addition, by providing a plurality of substrate cleaning apparatuses 1, the increase in floor space is sufficiently reduced.

[0192] As described above, in the substrate cleaning apparatus 1 of the present embodiment, the height position of the substrate W held by the upper holding apparatuses 10A, 10B is different from the height position of the substrate W held by the lower holding apparatus 20. Therefore, Figure 19 The main robot MR has one hand (hereinafter, referred to as an upper hand) corresponding to the upper holding apparatuses 10A, 10B and another hand (hereinafter, referred to as a lower hand) corresponding to the lower holding apparatus 20.

[0193] Figure 20 is a view for explaining Figure 19 A specific example of the main robot MR conveying in and out the substrate W to and from the substrate cleaning apparatus 1. In Figure 20In the present embodiment, the substrate Wl, W2 is represented by a plurality of side views in time series for the substrate carrying-in and carrying-out operation of the substrate cleaning apparatus 1. In each side view, the upper holding apparatuses 10A, 10B and the lower holding apparatus 20 of the substrate cleaning apparatus 1, and the upper hand RHl and the lower hand RH2 of the main robot MR are schematically shown. In the main robot MR, the upper hand RHl and the lower hand RH2 are moved by the carrying movement section RM. The carrying movement section RM includes a motor and a cylinder or the like as a driving source for moving the upper hand RHl and the lower hand RH2.

[0194] As shown in the uppermost side view, in the initial state, the substrate Wl which has been cleaned and processed is held by the lower holding apparatus 20. In addition, the substrate W2 which has not been processed is held by the upper hand RHl of the main robot MR. Further, in the initial state, the lower hand RH2 is arranged so as to face the lower holding apparatus 20 at a position slightly below the upper end portion of the lower holding apparatus 20. In addition, the upper hand RHl is arranged so as to face the upper holding apparatuses 10A, 10B at a position slightly below the upper end portions of the upper holding apparatuses 10A, 10B.

[0195] Here, the distance between the height position of the portion holding the substrate in the upper holding apparatuses 10A, 10B and the height position of the portion holding the substrate in the lower holding apparatus 20 is referred to as a first distance Dl. In addition, the distance between the height position of the substrate held by the upper hand RHl and the height position of the substrate held by the lower hand RH2 is referred to as a second distance D2. The first distance Dl and the second distance D2 are each a fixed value.

[0196] First, the substrate Wl held by the lower holding apparatus 20 is carried out. In this case, as shown in the second paragraph of Figure 20 , the lower hand RH2 is initially advanced to a position below the substrate Wl held by the lower holding apparatus 20.

[0197] Next, as shown in the third paragraph of Figure 20 , the lower hand RH2 is raised to receive the substrate Wl held by the lower holding apparatus 20. In addition, the lower hand RH2 receiving the substrate Wl is retreated from the substrate cleaning apparatus 1, as shown in the fourth paragraph of Figure 20 , to carry out the substrate Wl from the substrate cleaning apparatus 1. Further, the upper hand RHl is raised to a position slightly above the upper holding apparatuses 10A, 10B.

[0198] Next, as shown in the fifth paragraph of Figure 20 , the upper hand RHl is advanced so that the substrate W2 is positioned above the upper holding apparatuses 10A, 10B. In addition, the upper hand RHl is lowered, as shown in the sixth paragraph of Figure 20The substrate W2 held by the upper hand RH1 is transferred to the upper holding devices 10A, 10B as shown in paragraph 6 of the above description. Thereafter, the substrate W2 is held by the upper holding devices 10A, 10B, and the upper hand RH1 retreats from the substrate cleaning device 1 as shown in paragraph 7 of the above description. Figure 20

[0199] In the substrate processing device 100 of the above description, the handover of the substrate Wl is performed between the upper hand RHl and the upper holding devices 10A, 10B corresponding to each other. In this case, the upper hand RHl needs to be positioned at substantially the same height position as the upper holding devices 10A, 10B. Further, the handover of the substrate W2 is performed between the lower hand RH2 and the lower holding devices 20 corresponding to each other. In this case, the lower hand RH2 needs to be positioned at substantially the same height position as the lower holding devices 20. Figure 20

[0200] As described above, the upper hand RHl and the lower hand RH2 are arranged in a manner that they are separated by the second distance D2 and arranged in the up-and-down direction. Therefore, in the case where the handover of the processed substrate Wl and the handover of the unprocessed substrate W2 are performed at different height positions, the distance required for the movement of the upper hand RHl and the lower hand RH2 in the up-and-down direction is shortened. Specifically, the distance of the movement of the upper hand RHl and the lower hand RH2 in the up-and-down direction is shortened to the difference between the first distance Dl and the second distance D2 or so. Thus, the time required for the substrate Wl to be carried out of the substrate cleaning device 1 and the substrate W2 to be carried into the substrate cleaning device 1 is shortened. Therefore, the throughput of the substrate processing by the substrate processing device 100 is improved.

[0201] [8] Other Embodiments

[0202] (1) The gas ejection portion 53 of the above embodiment is a slit-shaped gas ejection nozzle having a gas ejection port extending in one direction, and is arranged between the lower surface brush 51 and the adsorption holding portion 21, but the present application is not limited to this. The gas ejection portion 53 can also have the following configurations.

[0203] Figure 21 FIG. 6 is a view for explaining another configuration example of the gas ejection portion 53, Figure 22 FIG. 7 is a view for explaining still another configuration example of the gas ejection portion 53. In Figure 21 Figure 22

[0204] Figure 21 The gas ejection portion 53 of the above embodiment is formed in a manner that it extends along the outer peripheral end portion of the lower surface brush 51 in an arc shape between the lower surface brush 51 and the adsorption holding portion 21. In this case, since the gas curtain can be formed along the outer shape of the lower surface brush 51, the scattering of the contaminant from the lower surface brush 51 to the adsorption holding portion 21 can be more appropriately prevented.​​​​

[0205] Further, Figure 22 The gas ejection portion 53 has a configuration in which the gas ejection portion 53 is divided Figure 21 Even in such a configuration, it is possible to form a gas curtain in at least a part of the region between the lower surface brush 51 and the adsorption holding portion 21. Thus, it is possible to reduce the scattering of contaminant substances from the lower surface brush 51 toward the adsorption holding portion 21. Further, according to Figure 22 According to the configuration, the gas ejection portion 53 is not present in the region closest to the lower surface brush 51 and the adsorption holding portion 21. Thus, it is possible to suppress the interference of the lower surface brush 51 and the adsorption holding portion 21 and shorten the distance between the adsorption holding portion 21 and the lower surface brush 51.

[0206] (2) In the lower surface cleaning device 50 of the embodiment, the two liquid nozzles 52 are provided on the upper surface 54u of the elevation support portion 54 at positions in front of the center of the lower surface brush 51. Not limited thereto, the two liquid nozzles 52 can be provided at positions behind the center of the lower surface brush 51. Further, the number of the liquid nozzles 52 provided in the lower surface cleaning device 50 is not limited to two, and can be one or more than three.

[0207] Further, the liquid nozzles 52 of the embodiment are installed on the upper surface 54u of the elevation support portion 54 in a manner facing upward, but can be installed in a manner facing obliquely upward toward the lower surface brush 51.

[0208] (3) In the substrate cleaning device 1 of the embodiment, the upper surface of the substrate W is cleaned by the mixed fluid ejected from the spray nozzles 73, but the present application is not limited thereto. The substrate cleaning device 1 can have a configuration in which the upper surface of the substrate W is physically cleaned using a brush. Or, in the substrate cleaning device 1, the oblique angle brush 83 can clean the upper surface of the substrate W. Further, when the substrate W is cleaned using a brush, a cleaning liquid supply portion that supplies a cleaning liquid to the upper surface of the substrate W is required.

[0209] (4) In the substrate cleaning device 1 of the embodiment, the handover device 40 performs the handover of the substrate W between the upper side holding devices 10A, 10B and the lower side holding device 20, but the present application is not limited thereto. In the case where at least one of the upper side holding devices 10A, 10B and the lower side holding device 20 is configured to be elevatable, the handover device 40 can not be provided. In the case, by elevating at least one of the upper side holding devices 10A, 10B and the lower side holding device 20, it is possible to move the substrate W between the upper side holding devices 10A, 10B and the lower side holding device 20.

[0210] For example, in a case where the upper side holding devices 10A, 10B are configured to be movable in the vertical direction and to directly exchange the substrate W with the lower side holding device 20, the substrate cleaning apparatus 1 can not include the exchange device 40. In the configuration, the upper side holding devices 10A, 10B become the exchange section, and the chuck control section 9A that controls the operation of the upper side holding devices 10A, 10B becomes the exchange control section.

[0211] Alternatively, in a case where the lower side holding device 20 is configured to be movable in the vertical direction and to directly exchange the substrate W with the upper side holding devices 10A, 10B, the substrate cleaning apparatus 1 can not include the exchange device 40. In the configuration, the lower side holding device 20 becomes the exchange section, and the adsorption control section 9B that controls the operation of the lower side holding device 20 becomes the exchange control section.

[0212] (5) In the lower surface cleaning device 50 of the embodiment, the upper surface 54u of the elevation support section 54 is inclined with respect to the horizontal plane, but the upper surface 54u can be horizontally configured.

[0213] (6) In the substrate cleaning apparatus 1 of the embodiment, the lower surface of the substrate W is cleaned in the order of the lower surface central region and the lower surface outer region, but the present application is not limited to this.

[0214] In the substrate cleaning apparatus 1, the lower surface of the substrate W can be cleaned in the order of the lower surface outer region and the lower surface central region. In this case, for example, the substrate carried into the substrate cleaning apparatus 1 is cleaned in the state where it is adsorptively held by the lower side holding device 20, the lower surface central region, the outer peripheral end portion, and the upper surface of the substrate are cleaned. Thereafter, the substrate W held by the lower side holding device 20 is received and held by the upper side holding devices 10A, 10B. In this state, the lower surface central region of the substrate W is cleaned. The cleaned substrate W is carried out from the upper side holding devices 10A, 10B to the outside of the cell frame 2.

[0215] (7) In the substrate cleaning apparatus 1 of the embodiment, the movement of the movable stage 32 and the moving support section 55 in the Y direction is stopped in the cleaning of the lower surface central region of the substrate W, but the present application is not limited to this. At least one of the movable stage 32 and the moving support section 55 can be moved in the Y direction in the cleaning of the lower surface central region of the substrate W. In this case, when the lower surface central region of the substrate W is cleaned by the lower surface brush 51, it is possible to clean a wider range of the lower surface of the substrate W.

[0216] (8) In the substrate cleaning apparatus 1 of the embodiment, the processing cup 61 is arranged at the lower cup position when the central region of the lower surface of the substrate W held by the upper holding means 10A, 10B is cleaned, but the present application is not limited to this. If the processing cup 61 does not interfere with the upper holding means 10A, 10B in a state where the processing cup 61 is at the upper cup position, the processing cup 61 can also be arranged at the upper cup position when the central region of the lower surface of the substrate W is cleaned.

[0217] (9) In the substrate cleaning apparatus 1 of the embodiment, the lower surface of the substrate W is supplied with the cleaning liquid from the liquid nozzle 52 when the central region of the lower surface of the substrate W held by the upper holding means 10A, 10B is cleaned, but the present application is not limited to this. Instead of supplying the lower surface of the substrate W with the cleaning liquid from the liquid nozzle 52 when the central region of the lower surface of the substrate W is cleaned, the lower surface brush 51 can be supplied with the cleaning liquid from the liquid nozzle 52 in a manner that the brush is dipped in a certain amount of the cleaning liquid before the central region of the lower surface of the substrate W is cleaned. In this case, the lower surface of the substrate W does not need to be supplied with the cleaning liquid when the central region of the lower surface of the substrate W is cleaned. Therefore, the cleaning liquid can be prevented from being scattered when the central region of the lower surface of the substrate W is cleaned.

[0218] (10) In the embodiment, the substrate cleaning apparatus 1 is configured to clean the central region of the lower surface of the substrate W when the substrate W is held by the upper holding means 10A, 10B, but the embodiment is not limited to this. For example, the substrate cleaning apparatus 1 can be configured to selectively operate in a first cleaning mode and a second cleaning mode.

[0219] In the first cleaning mode, the lower surface cleaning control section 9E controls the lower surface cleaning apparatus 50 to clean the central region of the lower surface of the substrate W when the substrate W is held by the upper holding means 10A, 10B and to clean the outer region of the lower surface of the substrate W when the substrate W is held by the lower holding means 20. On the other hand, in the second cleaning mode, the lower surface cleaning control section 9E controls the lower surface cleaning apparatus 50 to not clean the substrate W when the substrate W is held by the upper holding means 10A, 10B and to clean the outer region of the lower surface of the substrate W when the substrate W is held by the lower holding means 20.

[0220] In this case, the entire lower surface of the substrate W can be cleaned by causing the substrate cleaning apparatus 1 to operate in the first cleaning mode. On the other hand, in a case where the central region of the lower surface of the substrate W does not need to be cleaned, the outer region of the lower surface of the substrate W can be efficiently cleaned by causing the substrate cleaning apparatus 1 to operate in the second cleaning mode.

[0221] (11) In the embodiment, the substrate cleaning apparatus 1 includes the upper surface cleaning apparatus 70 and the end cleaning apparatus 80, but the embodiment is not limited to the same. In a case where the upper surface of the substrate W can not be cleaned, the substrate cleaning apparatus 1 can not include the upper surface cleaning apparatus 70. In addition, in a case where the peripheral end of the substrate W can not be cleaned, the substrate cleaning apparatus 1 can not include the end cleaning apparatus 80 either.

[0222] [9] Correspondence between each component of claims and each component of embodiments

[0223] Hereinafter, examples of correspondence between each component of claims and each component of embodiments will be described. (1)

[0225] In the embodiment, the upper side holding apparatuses 10A, 10B are examples of the first substrate holding section, the lower side holding apparatus 20 is an example of the second substrate holding section, the transfer apparatus 40 is an example of the moving section, the lower surface brush 51 is an example of the cleaning tool, and the lift support section 54 is an example of the cleaning tool lift section.

[0226] In addition, the adsorption holding driving section 22 is an example of the rotary driving section, the movable stage 32 is an example of the stage section, the linear guide rail 31 and the stage driving section 33 are examples of the stage moving section, and the substrate cleaning apparatus 1 is an example of the substrate cleaning apparatus.

[0227] In addition, the lower surface brush moving driving section 55c is an example of the moving driving section, the lower surface brush rotary driving section 55a is an example of the cleaning tool rotary driving section, the lift support section 54 is an example of the mounted member, the liquid nozzle 52 is an example of the cleaning liquid supply section, the upper surface 54u is an example of the upper surface of the mounted member, and the gas ejection section 53 is an example of the gas flow generation section. (2)

[0229] In the embodiment, the upper side holding apparatuses 10A, 10B are examples of the first substrate holding section, the lower side holding apparatus 20 is an example of the second substrate holding section, the transfer apparatus 40 is an example of the substrate moving section, the lower surface brush 51 is an example of the cleaning tool, and the lift support section 54 is an example of the cleaning tool lift section.

[0230] In addition, the stage apparatus 30, the moving support section 55, and the lower surface brush moving driving section 55c are examples of the cleaning tool moving section, the liquid nozzle 52 is an example of the cleaning liquid supply section, the process cup 61 is an example of the process cup, and the substrate cleaning apparatus 1 is an example of the substrate cleaning apparatus.

[0231] Further, the control device 9 is an example of a control section, the lower surface brush rotation drive section 55a is an example of a cleaning tool rotation drive section, the cup drive section 62 is an example of a processing cup drive section, the main robot MR is an example of a substrate conveyance section, the upper hand RH1 is an example of a first conveyance holding section, the lower hand RH2 is an example of a second conveyance holding section, and the substrate processing device 100 is an example of a substrate processing device. (3)

[0233] In the embodiment, the substrate W is an example of a substrate, the upper side holding device 10A, 10B is an example of a first substrate holding section, the lower side holding device 20 is an example of a second substrate holding section, the handover device 40 is an example of a handover section, the lower surface brush 51 is an example of a cleaning tool, and the lower surface cleaning control section 9E is an example of a cleaning control section. The substrate cleaning device 1 is an example of a substrate cleaning device, the handover control section 9D is an example of a handover control section, the movable stage 32 is an example of a stage section, the stage drive section 33 is an example of a stage drive section, and the stage control section 9C is an example of a stage control section.

[0234] As each component of the claim, other various components having the configuration or function described in the claim can also be used.

Claims

1. A substrate cleaning apparatus, comprising: The first substrate holding portion holds the outer peripheral end of the substrate; The second substrate holding portion is located below the first substrate holding portion and holds the central portion of the lower surface of the substrate. The moving part moves the substrate between the first substrate holding part and the second substrate holding part; A cleaning tool is used to clean the lower surface of the substrate by contacting it. The washing instrument lifting part supports the washing instrument from below and allows the washing instrument to move up and down between a first washing height position where the washing instrument contacts the lower surface of the substrate held by the first substrate holding part and a second washing height position where the washing instrument contacts the lower surface of the substrate held by the second substrate holding part. A rotation drive unit supports the second substrate holding unit from below and causes the second substrate holding unit to rotate about an axis in the vertical direction; The pedestal portion supports the washing device lifting portion and the rotation drive portion in a manner that, when viewed from above, the washing device and the second substrate holding portion are separated from each other. and The platform moving part moves between a first horizontal position where the second substrate holding part faces the center of the lower surface of the substrate and the cleaning device faces the outer region of the lower surface surrounding the center of the lower surface of the substrate, and a second horizontal position where the second substrate holding part faces the outer region of the lower surface of the substrate and the cleaning device faces the center of the lower surface of the substrate, while the substrate is held by the first substrate holding part.

2. The substrate cleaning apparatus according to claim 1, further comprising a mounting component for mounting the cleaning fixture, wherein the cleaning fixture lifting part supports the cleaning fixture by vertically supporting the mounting component.

3. The substrate cleaning apparatus according to claim 2, further comprising: a cleaning liquid supply unit, installed on the mounted component, for supplying cleaning liquid to the lower surface of the substrate when the lower surface of the substrate is cleaned using the cleaning tool.

4. The substrate cleaning apparatus according to claim 2 or 3, wherein the mounted component has an upper surface that is inclined downward in a direction away from the second substrate holding portion.

5. The substrate cleaning apparatus according to claim 2 or 3, further comprising an airflow generating section for generating a ribbon-like airflow between the cleaning fixture and the second substrate holding section.

6. The substrate cleaning apparatus according to claim 5, wherein the airflow generating unit is further installed on the mounted component.

7. The substrate cleaning apparatus according to claim 5, wherein the airflow generating unit forms a gas curtain between the cleaning fixture and the second substrate holding unit by spraying a strip of gas onto the lower surface of the substrate.

8. The substrate cleaning apparatus according to any one of claims 1 to 3, wherein the contact area of ​​the cleaning fixture in contact with the lower surface of the substrate is greater than the adsorption area of ​​the second substrate holding portion that adsorbs and holds the central portion of the lower surface of the substrate.

9. The substrate cleaning apparatus according to any one of claims 1 to 3, wherein the cleaning fixture lifting portion is supported in the pedestal portion in a horizontally movable manner relative to the second substrate holding portion, the substrate cleaning apparatus further comprising: The moving drive unit moves the washing instrument lifting unit horizontally relative to the second substrate holding unit within the base unit.

10. The substrate cleaning apparatus according to any one of claims 1 to 3, further comprising a cleaning fixture rotation drive unit for rotating the cleaning fixture about an axis extending in the vertical direction.

11. A substrate cleaning apparatus, comprising: The first substrate holding portion holds the outer peripheral end of the substrate at a first height position without rotating the substrate; The second substrate holding part is attached to and holds the center of the lower surface of the substrate at a second height position below the first height position and rotates about the vertical axis. A substrate moving part moves the substrate between the first height position and the second height position; A cleaning tool is used to clean the lower surface of the substrate by contacting it. The washing instrument lifting unit moves the washing instrument up and down, thereby transferring the washing instrument to a first state in which the washing instrument is in contact with the lower surface of the substrate held by the first substrate holding part, and to a second state in which the washing instrument is in contact with the lower surface of the substrate held by the second substrate holding part. The cleaning device moving part moves the cleaning device horizontally relative to the substrate at a position below the substrate held by the first or second substrate holding part; The cleaning solution supply unit supplies cleaning solution to the lower surface of the substrate; and A processing cup, arranged to surround the second substrate holding portion from a top view, catches the cleaning liquid that spills from the substrate when cleaning liquid is supplied from the cleaning liquid supply portion to the substrate, which is adsorbed, held, and rotated by the second substrate holding portion; and The first height position is higher than the upper end of the processing cup; The second height position is lower than the upper end of the processing cup when the substrate is held by the second substrate holding part and is washed by the washing vessel.

12. The substrate cleaning apparatus according to claim 11, further comprising a control unit for controlling the first substrate holding section, the second substrate holding section, the substrate moving section, the cleaning fixture lifting section, the cleaning fixture moving section, and the cleaning liquid supply section. The control unit When cleaning the central portion of the lower surface of the substrate, the first substrate holding part, the cleaning tool lifting part, and the cleaning solution supply part are controlled in such a way that the cleaning tool is used to clean the central portion of the lower surface of the substrate held by the first substrate holding part. When cleaning the area outside the lower surface surrounding the central portion of the lower surface of the substrate, the second substrate holding part, the cleaning device lifting part, the cleaning device moving part, and the cleaning solution supply part are controlled in such a manner that cleaning solution is supplied to the lower surface of the substrate held by the second substrate holding part and the cleaning device is used to clean the area outside the lower surface. The first substrate holding portion, the second substrate holding portion, and the substrate moving portion are controlled in such a way that the substrate is moved between the first substrate holding portion and the second substrate holding portion.

13. The substrate cleaning apparatus according to claim 11 or 12, wherein the cleaning device moving part moves the cleaning device horizontally relative to the substrate in at least one of the states in which the cleaning device contacts the lower surface of the substrate held by the first substrate holding part and the states in which the cleaning device contacts the lower surface of the substrate held by the second substrate holding part.

14. The substrate cleaning apparatus according to claim 11 or 12, further comprising: a gas supply unit configured to supply gas to the lower surface of the substrate held by the first substrate holding unit, and to supply gas to the lower surface of the substrate held by the second substrate holding unit.

15. The substrate cleaning apparatus according to claim 11 or 12, further comprising a cleaning fixture rotation drive unit for rotating the cleaning fixture about an axis in the vertical direction.

16. The substrate cleaning apparatus according to claim 11 or 12, wherein the contact area of ​​the cleaning fixture that contacts the lower surface of the substrate is greater than the adsorption area of ​​the second substrate holding portion that adsorbs and holds the central portion of the lower surface of the substrate.

17. The substrate cleaning apparatus according to claim 11 or 12, further comprising: a processing cup driving unit, which moves the processing cup up and down between an upper cup position where the upper end of the processing cup is above the second height position and a lower cup position where the upper end of the processing cup is below the second height position; and The processing cup driving unit holds the processing cup in the upper cup position when the substrate is held by the second substrate holding unit and is washed by the washing device, and holds the processing cup in the lower cup position before or after washing the substrate held by the second substrate holding unit.

18. A substrate cleaning apparatus, comprising: The first substrate holding portion holds the outer peripheral end of the substrate; The second substrate holding portion holds the central region of the lower surface of the substrate at a position below the first substrate holding portion; The junction is where the substrate is transferred between the first substrate holding portion and the second substrate holding portion; A cleaning tool is used to clean the lower surface of the substrate by contacting it. A cleaning control unit controls the cleaning apparatus to clean the central region of the lower surface of the substrate when the substrate is held by the first substrate holding part and the center of the substrate is in a first position, and to clean the outer region of the lower surface surrounding the central region of the lower surface of the substrate when the substrate is held by the second substrate holding part and the center of the substrate is in a second position below the first position; and to control the cleaning apparatus in such a manner that the cleaning apparatus cleans the central region of the lower surface of the substrate when the substrate is held by the second substrate holding part and the center of the substrate is in a second position below the first position. The pedestal portion is configured to support the washing instrument and the second substrate holding portion, and is movable integrally with the washing instrument and the second substrate holding portion.

19. The substrate cleaning apparatus according to claim 18, further comprising: a transfer control unit for controlling the transfer unit in such a way that the substrate in the first substrate holding unit, in which the central region of the lower surface has been cleaned, is transferred to the second substrate holding unit.

20. The substrate cleaning apparatus according to claim 19, wherein the transfer control unit further controls the transfer unit in such a manner that the substrate in the second substrate holding unit, in which the outer region of the lower surface has been cleaned, is transferred again to the first substrate holding unit. The cleaning control unit controls the cleaning device to clean the central region of the lower surface of the substrate held by the first substrate holding unit again.

21. The substrate cleaning apparatus according to claim 18, further comprising: a transfer control unit for controlling the transfer unit to transfer the substrate in the second substrate holding unit, in which the outer region of the lower surface has been cleaned, to the first substrate holding unit.

22. The substrate cleaning apparatus according to any one of claims 18 to 21, wherein the substrate cleaning apparatus is configured to operate selectively in a first cleaning mode and a second cleaning mode. The cleaning control unit In the first cleaning mode, the cleaning apparatus is controlled to clean the central region of the lower surface of the substrate when the substrate is held by the first substrate holding portion, and to clean the outer region of the lower surface of the substrate when the substrate is held by the second substrate holding portion. In the second cleaning mode, the cleaning apparatus is controlled such that the substrate is not cleaned when it is held by the first substrate holding portion, but the outer region of the lower surface of the substrate is cleaned when it is held by the second substrate holding portion.

23. A substrate cleaning apparatus, comprising: The first substrate holding portion holds the outer peripheral end of the substrate; The second substrate holding portion is configured to hold the central region of the lower surface of the substrate at a position below the first substrate holding portion and rotate it; The junction is where the substrate is transferred between the first substrate holding portion and the second substrate holding portion; A cleaning tool is used to clean the lower surface of the substrate by contacting it. The cleaning control unit controls the cleaning apparatus in such a way that the center region of the lower surface of the substrate is cleaned when the substrate is held by the first substrate holding part and the center region of the lower surface surrounding the center region of the lower surface of the substrate is cleaned when the substrate is held by the second substrate holding part and the center region of the substrate is below the first position. The pedestal portion supports the cleaning device and the second substrate holding portion; The platform drive unit moves the platform between a first state in which the cleaning appliance is located below the center of the substrate that should be held by the first substrate holding unit, and a second state in which the rotation center of the second substrate holding unit is located below the center of the substrate that should be held by the first substrate holding unit. and The platform control unit controls the platform drive unit in such a way that the platform is in the first state when the substrate of the first substrate holding unit is being cleaned, and the platform is in the second state when the substrate is being transferred between the first substrate holding unit and the second substrate holding unit.

24. A substrate processing apparatus comprising: The substrate cleaning apparatus according to any one of claims 11 to 17; and The substrate conveying section includes a first conveying and holding section configured to hold a substrate and a second conveying and holding section configured to hold the substrate below the first conveying and holding section; and The first conveying and holding section transfers the substrate to the first substrate holding section of the substrate cleaning apparatus; The second conveying and holding section transfers the substrate to the second substrate holding section of the substrate cleaning apparatus.

25. A substrate cleaning method, comprising the following steps: When the outer peripheral end of the substrate is held by the first substrate holding part, the central area of ​​the lower surface of the substrate is cleaned by a cleaning tool that is in contact with the lower surface of the substrate while the center of the substrate is in the first position. When the central region of the lower surface of the substrate is held by the second substrate holding portion at a position below the first substrate holding portion, the outer region of the lower surface surrounding the central region of the lower surface of the substrate is cleaned using the cleaning apparatus in a second position where the center of the substrate is below the first position; and The substrate is transferred between the first substrate holding portion and the second substrate holding portion; and The cleaning device and the second substrate holding part are supported by the base part and move integrally with the base part.

26. The substrate cleaning method according to claim 25, wherein the step of transferring the substrate comprises transferring the substrate in the first substrate holding portion, in which the central region of the lower surface has been cleaned, to the second substrate holding portion.

27. The substrate cleaning method according to claim 26, further comprising the following steps: The substrate, whose outer region of the lower surface has been cleaned in the second substrate holding section, is then transferred back to the first substrate holding section; and The central region of the lower surface of the substrate, which is transferred from the second substrate holding portion and held by the first substrate holding portion, is washed again using the cleaning device.

28. The substrate cleaning method according to claim 25, wherein the step of transferring the substrate comprises transferring the substrate in the second substrate holding portion, in which the outer region of the lower surface has been cleaned, to the first substrate holding portion.

29. The substrate cleaning method according to any one of claims 25 to 28, wherein the step of cleaning the central region of the lower surface of the substrate includes cleaning the central region of the lower surface of the substrate in a first cleaning mode, and not cleaning the substrate in a second cleaning mode, and The step of cleaning the outer region of the lower surface includes cleaning the outer region of the lower surface of the substrate in the first and second cleaning modes.

30. A substrate cleaning method, comprising the following steps: When the outer peripheral end of the substrate is held by the first substrate holding part, the central area of ​​the lower surface of the substrate is cleaned by a cleaning tool that is in contact with the lower surface of the substrate while the center of the substrate is in the first position. When the central region of the lower surface of the substrate is held by the second substrate holding part at a position below the first substrate holding part, the outer region of the lower surface surrounding the central region of the lower surface of the substrate is cleaned using the cleaning tool in a state where the center of the substrate is located below the first position. The substrate is transferred between the first substrate holding portion and the second substrate holding portion; The step of cleaning the central region of the lower surface of the substrate includes setting the pedestal portion supporting the cleaning fixture and the second substrate holding portion to a first state. The step of cleaning the outer region of the lower surface includes setting the pedestal portion to a second state. The second substrate holding portion is configured to hold the substrate and rotate it. In the first state, the cleaning device is located below the center of the substrate that should be held by the first substrate holding portion. In the second state, the rotation center of the second substrate holding portion is located below the center of the substrate that should be held by the first substrate holding portion.

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