Chip Local Coating Device

Abstract

The embodiment of the present invention provides a local coating device for a chip, which belongs to the technical field of chip analysis and processing equipment. The device includes: a chassis, a coating device, a stage and a microscope. A coating operation port is opened on one side of the chassis. The coating device includes a coating probe. The coating device is installed inside the chassis, and the coating probe extends from the coating operation port to the outside of the chassis. The microscope and the stage are fixedly installed on the chassis on the upper and lower sides of the coating operation port, and the stage is located below the coating operation port, and the microscope is located above the coating operation port. The coating device is used to coat the chip with a covering material on the chip with pits or fewer layers, and the shielding and adhesion properties of the covering material are used to form a protective film on the chip with pits or fewer layers, so that only the parts with more layers are delayered during the dry etching and wet etching delayering process, so that the chips are at the same level.

Description

Technical Field

[0001] The present invention relates to the technical field of chip analysis and processing equipment, and particularly to a chip partial coating device. Background Art

[0002] A chip is mainly composed of a device layer, various metal layers, and dielectric layers. Chip delayer analysis is mainly applied to chip failure analysis and reverse engineering. Chip delayer analysis mainly includes specific technical means such as passivation layer / insulation layer removal, aluminum wire / copper wire removal, barrier layer removal, and dielectric layer etching. Among them, the delayer technology requires the complete removal of the insulating layer between metal wires layer by layer, and just right to expose the next layer of metal wires. Sometimes, it is also necessary to retain the via holes between metal wires, or remove the adhesion layer, which is a challenging technology in failure analysis. During the chip delayer process, due to uneven polishing or improper metal reaction, the metal layers of the chip are at different levels, which is called: "misalignment". After misalignment occurs, during chip reverse analysis, it affects the overall circuit analysis of the chip; during chip failure analysis, it will cause the chip failure to be unable to be observed synchronously, and it is easy to miss key information. The chip area itself is relatively small, the operating space is limited, and the metal layer and dielectric layer are between 100nm - 1um, and the longitudinally tolerable polishing space is also very small. Therefore, once misalignment occurs during the chip delayer process, it is almost completely impossible to remedy in the case of the existing technology. Summary of the Invention

[0003] An object of an embodiment of the present invention is to provide a chip partial coating device. The device uses a microscope magnification as an observation means, coats a covering material on the pitted or less-layered parts of the chip through a coating device, and forms a protective film on the pitted or less-layered parts of the chip by using the shielding and adhesion of the covering material, so as to achieve only delaminating the parts with more layers during the dry etching and wet etching delayer processes, and making the chip at the same level.

[0004] To achieve the above object, an embodiment of the present invention provides a chip partial coating device, the device includes: a chassis, a coating device, a stage, and a microscope. A coating operation port is provided on one side of the chassis. The coating device includes a coating probe. The coating device is installed inside the chassis, and the coating probe extends from the coating operation port to the outside of the chassis. Both the microscope and the stage are fixedly installed on the chassis, and the stage is located below the coating operation port, and the microscope is located above the coating operation port.

[0005] Optionally, the coating device further includes a peristaltic pump and a silicone grease storage tank;

[0006] The silicone grease storage tank is connected to the feed port of the peristaltic pump through a silicone grease transfer pipe, and the discharge port of the peristaltic pump is connected to the feed port of the coating probe through a silicone grease transfer pipe. The silicone grease storage tank is used to store silicone grease for coating the pitted or less-layered parts of the chip. The peristaltic pump supplies silicone grease to the coating probe to achieve the discharge of the probe.

[0007] Optionally, the coating device further includes a coating control button, which is connected to the control end of the peristaltic pump through a cable and is used to control the peristaltic pump to perform corresponding actions.

[0008] Optionally, the microscope includes a fixing frame, a microscope body, a light source assembly, an eyepiece and an objective lens;

[0009] The microscope body is fixed on the chassis through the fixing frame. The objective lens is fixedly installed at the bottom of the microscope body, the eyepiece is fixedly installed at the upper part of the microscope body, and the light source assembly is fixed on the objective lens. The microscope fixed on the chassis can achieve a magnification of 30 - 100 times, which is convenient for clearly observing the coating position and coating state during the coating process.

[0010] Optionally, the light source assembly is an annular LED lamp assembly.

[0011] Optionally, the stage includes a stage plate, a bracket and a bottom plate stacked vertically;

[0012] The stage plate is connected to the bracket through a first moving component, so that the stage plate can move horizontally in a direction perpendicular to the bracket;

[0013] The bracket is connected to the bottom plate through a second moving component, so that the bracket can move horizontally in a direction parallel to the bracket, thereby driving the stage plate to move horizontally in a direction parallel to the bracket;

[0014] The bottom plate is sleeved on a vertically arranged lead screw through a threaded hole opened on the bottom plate, so that the bottom plate can move up and down in the vertical direction, thereby driving the bracket and the stage plate to move up and down in the vertical direction. The stage can move in three axes, which is convenient for adjusting the position of the chip to adapt to the tip position of the coating probe.

[0015] Optionally, the bracket includes a plurality of support rods arranged in parallel; the first moving component includes a first gear and a first rack. The first gear is fixed at the bottom of the stage plate, and the first rack is fixed on the bracket and perpendicular to each support rod; the second moving component includes a second gear and a second rack. The second gear is fixed at the bottom of the bracket, and the second rack is fixed on the upper surface of the bottom plate and parallel to the support rod. The structure of the gear and rack is used to realize the horizontal movement of the stage plate.

[0016] Optionally, the coated probe is fixed on a probe fixing base.

[0017] Optionally, the probe fixing base includes a three-axis movement assembly. The coated probe is fixed on a fixing plate, and the fixing plate is mounted on the three-axis movement assembly so that the fixing plate can move in the X-axis, Y-axis, and Z-axis directions through the three-axis movement assembly. The three-axis movement assembly can realize the movement of the fixing plate in the three-axis directions, facilitating the adjustment of the position of the coated probe.

[0018] Optionally, the inner diameter of the coated probe is 5 - 10 μm, and the outer diameter is 10 - 15 μm. The diameter of the silicone grease flowing out of the coated probe is less than 12 μm, which can effectively coat the pitted or less-layered parts of the chip.

[0019] Through the above technical solution, the device uses microscope magnification as the observation means, coats the covering material on the pitted or less-layered parts of the chip through the coating device, and forms a protective film on the pitted or less-layered parts of the chip by using the shielding and adhesiveness of the covering material, so as to realize that only the parts with more layers are removed during the dry etching and wet etching delamination processes, making the chip at the same level.

[0020] Other features and advantages of the embodiments of the present invention will be described in detail in the subsequent specific implementation part. Brief Description of the Drawings

[0021] The drawings are used to provide a further understanding of the embodiments of the present invention, and constitute a part of the specification. They are used together with the following specific implementation to explain the embodiments of the present invention, but do not constitute a limitation to the embodiments of the present invention. In the drawings:

[0022] Figure 1 is a schematic structural diagram of a chip partial coating device provided by an embodiment of the present invention;

[0023] Figure 2 is a schematic top view of the chassis of a chip partial coating device provided by an embodiment of the present invention;

[0024] Figure 3 is an exploded view of the stage provided by an embodiment of the present invention.

[0025] Description of the Reference Numerals

[0026] 1 - Chassis, 101 - Coating probe, 102 - Stage, 1021 - Stage plate, 1022 - First moving component, 1023 - Bracket, 1024 - Second moving component, 1025 - Lead screw, 1026 - Base plate, 103 - Peristaltic pump, 104 - Grease storage tank, 105 - Grease transfer tube, 106 - Coating control button, 107 - Probe fixing seat, 2 - Microscope, 201 - Light source assembly, 202 - Fixing bracket, 203 - Eyepiece, 204 - Microscope body, 205 - Objective lens. Detailed implementation manners

[0027] The following details the specific implementation manners of the embodiments of the present invention in conjunction with the accompanying drawings. It should be understood that the specific implementation manners described herein are only for the purpose of illustrating and explaining the embodiments of the present invention, and are not used to limit the embodiments of the present invention.

[0028] In the embodiments of the present invention, unless otherwise stated, the orientation terms such as "upper, lower, left, right" usually refer to the orientation or position relationship based on the orientation shown in the drawings, or the orientation or position relationship in which the invention product is usually placed when in use.

[0029] The terms "first", "second", "third", etc. are only used for distinguishing descriptions, and cannot be understood as indicating or implying relative importance.

[0030] The terms "horizontal", "vertical", "overhanging", etc. do not mean that the components are required to be absolutely horizontal, vertical or overhanging, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0031] In the description of the present invention, it should also be noted that unless otherwise clearly specified and limited, the terms "set", "install", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected, or indirectly connected through an intermediate medium, and can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0032] Embodiment 1

[0033] In an embodiment of the present invention, a chip partial coating device is provided, as Figures 1 - 3As shown in the figure, the device includes: a chassis 1, a coating device, a stage 102, and a microscope 2. One side of the chassis 1 is provided with a coating operation port. The coating device includes a coating probe 101. The coating device is installed inside the chassis 1, and the coating probe 101 extends from the coating operation port to the outside of the chassis 1. The microscope 2 and the stage 102 are both fixedly installed on the chassis 1, and the stage 102 is located below the coating operation port, and the microscope 2 is located above the coating operation port.

[0034] In this embodiment, the coating device further includes a peristaltic pump 103 and a silicone grease storage tank 104;

[0035] The silicone grease storage tank 104 is communicated with the feed port of the peristaltic pump 103 through a silicone grease transfer pipe 105, and the discharge port of the peristaltic pump 103 is communicated with the feed port of the coating probe 101 through a silicone grease transfer pipe 105. The silicone grease storage tank is used to store the silicone grease for coating the pitted or less-layered parts of the chip. The peristaltic pump 103 supplies the silicone grease to the coating probe 101 to realize the discharge of the probe. The silicone grease has very good shielding and adhesion properties, and can form a protective film on the pitted or less-layered parts of the chip.

[0036] In the chip partial coating device provided in this application, among the five surfaces of the front, back, left, right, and top of the chassis 1, at least one surface can be opened. The silicone grease can be added to the silicone grease storage tank 104 from the opened surface, and the peristaltic pump 103, the silicone grease storage tank 104, etc. can also be repaired from the opened surface.

[0037] In this embodiment, the coating device further includes a coating control button 106;

[0038] The coating control button 106 is connected to the control end of the peristaltic pump 103 through a cable, and is used to control the peristaltic pump 103 to perform corresponding actions.

[0039] In this embodiment, the microscope 2 includes a fixing frame 202, a microscope body 204, a light source assembly 201, an eyepiece 203, and an objective lens 205;

[0040] The microscope body 204 is fixed on the chassis 1 through the fixing frame 202. The objective lens 205 is fixedly installed at the bottom of the microscope body 204, the eyepiece 203 is fixedly installed at the upper part of the microscope body 204, and the light source assembly 201 is fixed on the objective lens 205. The microscope 2 fixed on the chassis 1 can achieve a magnification of 30 - 100 times, which is convenient for clearly observing the coating position and coating state during the coating process.

[0041] In some embodiments, the light source assembly 201 is an annular LED lamp assembly.

[0042] In this embodiment, the stage 102 includes a stage plate 1021, a bracket 1023, and a bottom plate 1026 that are stacked in the vertical direction;

[0043] The stage plate 1021 is connected to the bracket 1023 through a first moving component 1022, so that the stage plate 1021 can move horizontally in a direction perpendicular to the bracket 1023;

[0044] The bracket 1023 is connected to the bottom plate 1026 through a second moving component 1024, so that the bracket 1023 can move horizontally in a direction parallel to the bracket 1023, thereby driving the stage plate 1021 to move horizontally in a direction parallel to the bracket 1023;

[0045] The bottom plate 1026 is sleeved on a vertically arranged lead screw 1025 through a threaded hole formed in the bottom plate 1026, so that the bottom plate 1026 can move up and down in the vertical direction, thereby driving the bracket 1023 and the stage plate 1021 to move up and down in the vertical direction. The stage 102 can move in three axes, which is convenient for adjusting the position of the chip to adapt to the tip position of the coating probe 101.

[0046] In some embodiments, the bracket 1023 includes a plurality of support rods arranged in parallel; the first moving component 1022 includes a first gear and a first rack. The first gear is fixed to the bottom of the stage plate 1021, and the first rack is fixed to the bracket 1023 and perpendicular to each support rod. The cooperation of the first gear and the first rack can realize the movement of the stage plate 1021 in a direction close to or away from the chassis 1. The second moving component 1024 includes a second gear and a second rack. The second gear is fixed to the bottom of the bracket 1023, and the second rack is fixed to the upper surface of the bottom plate 1026 and parallel to the support rod. The cooperation of the second gear and the second rack can realize the movement of the bracket 1023 and the stage plate 1021 on the bracket 1023 in a direction parallel to the long side of the chassis 1. The structure of the gear and rack is used to realize the horizontal movement of the stage plate 1021.

[0047] In this embodiment, the bracket 1023 includes two support rods arranged parallel to the long side of the chassis 1. In some other embodiments, the gear in the gear-rack structure is connected to a knob, and the gear is manually controlled by rotating the knob. In some other embodiments, multiple gears can be set according to the principle of gear step-down to control the stroke of the gear after rotating the knob to achieve micro-step control.

[0048] In other embodiments, the bracket 1023 may be a plurality of support rods perpendicular to the long side of the chassis 1.

[0049] In this embodiment, the coating probe 101 is fixed on the probe fixing base 107.

[0050] In some embodiments, the inner diameter of the coating probe 101 is 5 - 10 um, and the outer diameter is 10 - 15 um. The diameter of the silicone grease flowing out of the coating probe 101 is less than 12 um, which can effectively coat the pitted or less-layered parts of the chip.

[0051] Embodiment Two

[0052] In an embodiment of the present invention, a chip partial coating device is provided. As Figures 1 - 2 shown, the device includes: a chassis 1, a coating device, a stage 102, and a microscope 2. A coating operation port is provided on one side of the chassis 1. The coating device includes a coating probe 101. The coating device is installed inside the chassis 1, and the coating probe 101 extends out of the chassis 1 from the coating operation port. The microscope 2 and the stage 102 are both fixedly installed on the chassis 1, and the stage 102 is located below the coating operation port, and the microscope 2 is located above the coating operation port.

[0053] In this embodiment, the coating device further includes a peristaltic pump 103 and a silicone grease storage tank 104; the silicone grease storage tank 104 is communicated with the feed port of the peristaltic pump 103 through a silicone grease transfer pipe 105, and the discharge port of the peristaltic pump 103 is communicated with the feed port of the coating probe 101 through a silicone grease transfer pipe 105. The silicone grease storage tank is used to store the silicone grease for coating the pitted or less-layered parts of the chip. The peristaltic pump 103 supplies silicone grease to the coating probe 101 to achieve probe discharging. The silicone grease has very good shielding and adhesion properties, and can form a protective film on the pitted or less-layered parts of the chip.

[0054] In the chip partial coating device provided in this application, at least one of the five faces of the front, back, left, right, and top of the chassis 1 can be opened. Silicone grease can be added to the silicone grease storage tank 104 from the opened face, and the peristaltic pump 103, silicone grease storage tank 104, etc. can also be repaired from the opened face.

[0055] In this embodiment, the coating device further includes a coating control button 106;

[0056] The coating control button 106 is connected to the control end of the peristaltic pump 103 through a cable, and is used to control the peristaltic pump 103 to perform corresponding actions.

[0057] In this embodiment, the microscope 2 includes a fixing frame 202, a microscope body 204, a light source assembly 201, an eyepiece 203, and an objective lens 205;

[0058] The microscope body 204 is fixed on the chassis 1 through a fixing bracket 202. The objective lens 205 is fixedly installed at the bottom of the microscope body 204, the eyepiece 203 is fixedly installed at the upper part of the microscope body 204, and the light source assembly 201 is fixed on the objective lens 205. The microscope 2 fixed on the chassis 1 can achieve a magnification of 30 - 100 times, which is convenient for clearly observing the coating position and coating state during the coating process.

[0059] In some embodiments, the light source assembly 201 is an annular LED lamp assembly.

[0060] In this embodiment, the probe fixing base 107 includes a three-axis moving assembly. The coating probe 101 is fixed on the fixing plate, and the fixing plate is installed on the three-axis moving assembly, so that the fixing plate can move in the X-axis, Y-axis, and Z-axis directions through the three-axis moving assembly. The three-axis moving assembly can realize the movement of the fixing plate in the three-axis directions, which is convenient for adjusting the position of the coating probe 101. The three-axis moving assembly can be a component composed of a gear-rack structure combination, or other structures that can achieve three-axis displacement.

[0061] In this embodiment, the coating probe 101 is fixed on the probe fixing base 107.

[0062] In some embodiments, the inner diameter of the coating probe 101 is 5 - 10 um, and the outer diameter is 10 - 15 um. The diameter of the silicone grease flowing out of the coating probe 101 is less than 12 um, which can effectively coat the pitted or less-layered parts of the chip.

[0063] The chip local coating device provided by the present invention uses the magnification of the microscope 2 as an observation means, coats the covering material on the pitted or less-layered parts of the chip through the coating device, and uses the shielding property and adhesion of the covering material to form a protective film on the pitted or less-layered parts of the chip, so as to achieve only removing the parts with more layers during the dry etching and wet etching delamination processes, and making the chip at the same level.

[0064] The optional implementation manners of the embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the embodiments of the present invention are not limited to the specific details in the above implementation manners. Within the technical concept scope of the embodiments of the present invention, various simple modifications can be made to the technical solutions of the embodiments of the present invention, and these simple modifications all belong to the protection scope of the embodiments of the present invention.

[0065] In addition, it should be noted that, in the above specific implementation manners, the various specific technical features described can be combined in any suitable manner without contradiction. To avoid unnecessary repetition, the embodiments of the present invention do not separately describe various possible combination manners.

[0066] Those skilled in the art can understand that all or part of the steps in implementing the methods of the above embodiments can be completed by instructing relevant hardware through a program, and the program is stored in a storage medium, including several instructions for causing a single-chip microcomputer, a chip or a processor to execute all or part of the steps of the methods described in various embodiments of the present application. The aforementioned storage medium includes: various media such as USB flash drives, mobile hard disks, read-only memories (ROMs), random access memories (RAMs), magnetic disks, or optical discs that can store program codes.

[0067] In addition, any combination can be made among various different implementation manners of the embodiments of the present invention, as long as it does not violate the idea of the embodiments of the present invention, and it should also be regarded as the content disclosed by the embodiments of the present invention.

Claims

1. A chip partial coating device, characterized in that, the device includes: a chassis, a coating device, a stage and a microscope. There is a coating operation opening on one side of the chassis. The coating device includes a coating probe. The coating device is installed inside the chassis, and the coating probe extends out of the chassis through the coating operation opening. The microscope and the stage are both fixedly installed on the chassis, and the stage is located below the coating operation opening, and the microscope is located above the coating operation opening; the coating device further includes a peristaltic pump and a silicone grease storage tank; the silicone grease storage tank is communicated with the feed port of the peristaltic pump through a silicone grease transfer pipe, and the discharge port of the peristaltic pump is communicated with the feed port of the coating probe through a silicone grease transfer pipe; the coating probe is fixed on a probe fixing seat.

2. The chip partial coating device according to claim 1, characterized in that, the coating device further includes a coating control button; the coating control button is connected to the control end of the peristaltic pump through a cable, and is used to control the peristaltic pump to perform corresponding actions.

3. The chip partial coating device according to claim 1, characterized in that, the microscope includes a fixing frame, a microscope body, a light source assembly, an eyepiece and an objective lens; the microscope body is fixed on the chassis through the fixing frame, the objective lens is fixedly installed at the bottom of the microscope body, the eyepiece is fixedly installed at the upper part of the microscope body, and the light source assembly is fixed on the objective lens.

4. The chip partial coating device according to claim 3, characterized in that, the light source assembly is an annular LED lamp assembly.

5. The chip partial coating device according to claim 1, characterized in that, the stage includes a stage plate, a bracket and a bottom plate stacked vertically; the stage plate is connected to the bracket through a first moving component, so that the stage plate can horizontally move in a direction perpendicular to the bracket; the bracket is connected to the bottom plate through a second moving component, so that the bracket can horizontally move in a direction parallel to the bracket, thereby driving the stage plate to horizontally move in a direction parallel to the bracket; the bottom plate is sleeved on a vertically arranged lead screw through a threaded hole opened on the bottom plate, so that the bottom plate can move up and down in the vertical direction, thereby driving the bracket and the stage plate to move up and down in the vertical direction.

6. The chip partial coating device according to claim 5, characterized in that, the bracket includes a plurality of support rods arranged in parallel; the first moving component includes a first gear and a first rack. The first gear is fixed at the bottom of the stage plate, and the first rack is fixed on the bracket and is perpendicular to each support rod; the second moving component includes a second gear and a second rack. The second gear is fixed at the bottom of the bracket, and the second rack is fixed on the upper surface of the bottom plate and is parallel to the support rod.

7. The chip partial coating device according to claim 1, characterized in that, The probe fixing base includes a three-axis moving component, the coating probe is fixed on a fixing plate, and the fixing plate is mounted on the three-axis moving component, so that the fixing plate can move in the X-axis, Y-axis, and Z-axis directions through the three-axis moving component.

8. The chip partial coating device according to claim 1, wherein, the inner diameter of the coating probe is 5-10 μm, and the outer diameter is 10-15 μm.

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