Installation

Abstract

The mounting device includes: a bonding stage for holding a substrate on which a semiconductor chip is arranged; a base; a mounting head on which a pressing tool for pressing the semiconductor chip to the substrate is installed; and a film arrangement mechanism provided on the base for moving a coating along the bonding stage so as to arrange the coating between the semiconductor chip pressed to the substrate and the pressing tool, the film arrangement mechanism including: a film guide for guiding the coating and defining a height relative to the bonding stage; and a lifting mechanism connected to the film guide via a spring for lifting the film guide relative to the bonding stage. In the mounting device for pressing the semiconductor chip to the mounted body by interposing the coating between the pressing tool and the semiconductor chip, the parallelism between the bonding stage and the coating can be ensured.

Description

Technical Field

[0001] The present invention relates to a structure of a mounting device for mounting a semiconductor chip on a mounted body such as a substrate or another semiconductor chip via an adhesive material. Background Art

[0002] In the past, a flip chip bonder technology was widely known: a semiconductor chip is mounted on a mounted body such as a substrate or other semiconductor chip without using leads. In a flip chip bonder, an adhesive material containing a thermosetting resin is applied to the mounted body in advance, and the semiconductor chip is heated and pressed by a pressing tool to melt the solder on the electrode, and after the adhesive material on the mounted body is solidified, the pressing tool is cooled to solidify the solder, thereby bonding the semiconductor chip to the substrate. At this time, when the semiconductor chip is heated and pressurized by the pressing tool, the adhesive material squeezed out by the semiconductor chip sometimes climbs up and adheres to the mounting head.

[0003] In order to prevent such adhesive material from adhering to the pressing tool, a mounting device is disclosed that covers the bottom surface of the pressing tool with a thin film member (cover film). For example, Patent Document 1 proposes a device that, after placing a workpiece including a substrate and a semiconductor chip on a bonding stage, moves a resin film in a horizontal direction so that the resin film is interposed between the workpiece and the bonding tool, then presses the semiconductor chip from above the resin film with the bonding tool, heats and ultrasonically vibrates the bump and the electrode to bond, and fixes the semiconductor chip to the substrate with an adhesive material.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2004-165536 Summary of the invention

[0007] Problems to be solved by the invention

[0008] However, in the case where the semiconductor chip is pressed and heated by the bonding tool from above the resin film with the film interposed between the pressing tool and the semiconductor chip as in the device described in Patent Document 1, if the bonding stage for adsorbing and fixing the workpiece and the film are not arranged parallel, the adhesive material squeezed out by the semiconductor chip may spread unevenly when the semiconductor chip is pressed and heated by the bonding tool or static electricity may be generated during mounting. Therefore, parallelism between the bonding stage and the film is required in such a device.

[0009] On the other hand, since the bonding stage is heated by the heater, the parallelism between the bonding stage and the coating film may not be ensured due to thermal expansion of the bonding stage.

[0010] Therefore, an object of the present invention is to ensure parallelism between a bonding stage and a cover film in a mounting device that presses a semiconductor chip to a mounted object with the cover film interposed between a pressing tool and the semiconductor chip.

[0011] Technical means of solving problems

[0012] The mounting device of the present invention presses a semiconductor chip arranged on a mounted body, and the mounting device is characterized in that it includes: a bonding carrier, which holds the mounted body arranged with the semiconductor chip; a base, which supports the bonding carrier; a mounting head, which moves in a direction approaching / moving away from the mounted body and has a pressing tool for pressing the semiconductor chip to the mounted body installed at the front end; and a film configuration mechanism, which is provided on the base and moves the film along the bonding carrier, so that the film is configured between the semiconductor chip and the pressing tool, and the film configuration mechanism includes: a film guide, which guides the film and has a contact portion that contacts the bonding carrier and determines the height of the film relative to the bonding carrier; and a lifting mechanism, which is connected to the film guide via an elastic member and lifts the film guide relative to the bonding carrier.

[0013] In this way, the height of the film guide can be adjusted by the lifting mechanism to ensure the parallelism between the bonding stage and the cover film.

[0014] In the mounting device of the present invention, the film guide and the lifting mechanism may be provided on both sides of the bonding stage with the bonding stage interposed therebetween.

[0015] In this way, the height of the coating film relative to the bonding stage is adjusted on both sides of the bonding stage, so that the parallelism between the bonding stage and the coating film can be ensured.

[0016] In the mounting device of the present invention, the film placement mechanism may include a connecting member that connects between film guides that are provided on both sides of the bonding stage with the bonding stage interposed therebetween.

[0017] This can eliminate the deviation in height between the film guides on both sides, and ensure the parallelism between the bonding stage and the coating film.

[0018] In the installation device of the present invention, the lifting mechanism may also include: a guide rail, which is provided on the base and extends in the up-down direction; a slider, which is guided by the guide rail and moves in the up-down direction; and a connecting member, one end of which is installed to the slider via an elastic member so as to be relatively movable in the up-down direction by a prescribed up-down amplitude, and a film guide is installed at the other end, and when the contact portion of the film guide contacts the upper surface of the bonding platform, the slider presses the film guide to the upper surface of the bonding platform via the elastic member and the connecting member.

[0019] In this way, the film guide is pressed against the bonding stage by the urging force of the elastic member, so that the height of the film guide relative to the bonding stage surface can be constant, thereby ensuring the parallelism between the bonding stage and the coating.

[0020] In the installation device of the present invention, the film configuration mechanism may also include a film feeding mechanism, which includes a pair of rollers and feeds out new films in sequence. The pair of rollers are arranged on a base on both sides of the bonding platform with the bonding platform clamped and the coating is supported. The film feeding mechanism includes bases supporting the rollers, and the guide rails of the lifting mechanism are installed on the bases.

[0021] In this way, since the lifting mechanism is attached to the base of the film delivery mechanism, the lifting mechanism and the film guide can move in the horizontal direction relative to the bonding stage together with the film delivery mechanism.

[0022] In the installation device of the present invention, the film configuration mechanism may also include: one side film guide and one side lifting mechanism, which are arranged on one side of the bonding platform; and the other side film guide and the other side lifting mechanism, which are arranged on the other side of the bonding platform, wherein the one side lifting mechanism includes: one side guide rail, which is arranged on the base on one side and extends in the up-down direction; a slider, which is guided by the one side guide rail and moves in the up-down direction; and a connecting member, one end of which is mounted to the slider via an elastic member so as to be relatively movable in the up-down direction by a predetermined up-down range, and one side film guide is mounted on the other end, and the other side The lifting mechanism includes a guide rail on the other side, which is arranged on the base on the other side and extends in the up-down direction to guide the film guide on the other side in the up-down direction. The film configuration mechanism includes a connecting structure that connects the film guide on one side with the film guide on the other side. When the contact portion of the film guide on one side and the contact portion of the film guide on the other side contact the upper surface of the bonding platform, the contact portion of the film guide on one side is pressed to the upper surface of the bonding platform via the elastic member and the connecting member, and the contact portion of the film guide on the other side is pressed to the bonding platform via the connecting structure.

[0023] In this way, since the film guide on one side and the film guide on the other side are moved up and down by the slider disposed on one side, the parallelism between the bonding stage and the coating film can be ensured with a simple structure.

[0024] In the installation device of the present invention, the film configuration mechanism may also include a film feeding mechanism, which includes a pair of rollers and feeds out new films in sequence, the pair of rollers are arranged on bases on both sides of the bonding platform with the bonding platform clamped and the coating is supported, and the film feeding mechanism includes a base supporting each roller, wherein a one-side guide rail is installed on one of the bases, and the other-side guide rail is installed on the other-side base.

[0025] In this way, since the lifting mechanism is attached to the base of the film delivery mechanism, the lifting mechanism and the film guide can move in the horizontal direction relative to the bonding stage together with the film delivery mechanism.

[0026] In the installation device of the present invention, the connecting member may also be a groove-shaped section member, which includes an upper flange, a lower flange facing the upper flange, and a web connecting the upper flange and the lower flange, and a slider guide extending in the up-down direction between the upper flange and the lower flange, the slider is guided by the slider guide and can move relative to the connecting member in the up-down direction between the upper flange and the lower flange, and the elastic member is arranged between the lower end of the slider and the upper surface of the lower flange.

[0027] Thus, with a simple structure, when the slider rises, the film guide rises together with the slider, and when the slider descends and the film guide contacts the bonding stage, the film guide can be pressed against the bonding stage by the urging force of the elastic member.

[0028] In the mounting device of the present invention, the film placement mechanism may include a moving mechanism that moves the film delivery mechanism in a horizontal direction relative to the bonding stage.

[0029] Thereby, the film delivery mechanism, the lifting mechanism, and the film guide can be moved in a horizontal direction relative to the bonding stage in an integrated manner.

[0030] Effects of the Invention

[0031] In a mounting device that presses a semiconductor chip to a mounted object with a cover film interposed between a pressing tool and the semiconductor chip, it is possible to ensure parallelism between the bonding stage and the cover film. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a schematic elevation view showing the structure of the mounting device according to the embodiment.

[0033] Figure 2It is a schematic plan view showing the structure of the mounting device according to the embodiment.

[0034] Figure 3 is a side elevation view showing the structure of one side of the mounting device of the embodiment, and is Figure 2 AA arrow view shown.

[0035] Figure 4 It is a plan view showing the structure of one side of the mounting device according to the embodiment.

[0036] Figure 5 is a vertical view showing a state in which the film guide is lowered by the lifting mechanism and abuts against the upper surface of the bonding stage of the mounting device according to the embodiment, and is Figure 2 AA arrow view shown.

[0037] Figure 6 It means in Figure 5 The state shown in FIG. 1 is a vertical view of a state in which the mounting head is lowered to mount the semiconductor chip on the substrate, and is Figure 2 AA arrow view shown.

[0038] Figure 7 It is an elevation view showing the structure of a mounting device according to another embodiment.

[0039] [Explanation of Symbols]

[0040] 10, 200: Installation device

[0041] 11: Ontology

[0042] 12: Insulation block

[0043] 13: Air flow path

[0044] 14: Heater

[0045] 15: Cooling tank

[0046] 16: Pressing tool

[0047] 16a: protrusion

[0048] 17: Install the head

[0049] 18: Suction hole

[0050] 19: Fan

[0051] 20: Joining the stage

[0052] 21: Abutment

[0053] 30, 230: Film configuration mechanism

[0054] 40: Film guide

[0055] 41, 341: Base part

[0056] 42, 342: Lower guide roller

[0057] 43, 343: Upper guide roller

[0058] 44, 344: Blocker

[0059] 46: Connecting parts

[0060] 50: Lifting mechanism

[0061] 51: Guide rail

[0062] 52: Ontology Department

[0063] 52a, 53a: Hole

[0064] 53: Arm

[0065] 54: Slider

[0066] 55: Connecting components

[0067] 55a: Upper flange

[0068] 55b: Lower flange

[0069] 55c: Belly

[0070] 56: Spring

[0071] 57: Slider guide

[0072] 58: Z-direction actuator

[0073] 60: Film delivery mechanism

[0074] 61: Base

[0075] 62: Framework

[0076] 63: Feed roller

[0077] 63a: Delivery roller

[0078] 63b: Winding roller

[0079] 64: Axis

[0080] 65: Support structure

[0081] 70: Mobile mechanism

[0082] 71: Track

[0083] 72: Y direction actuator

[0084] 80: Control Department

[0085] 100: Semiconductor chips

[0086] 102: Bump

[0087] 104: Substrate

[0088] 105: Electrode

[0089] 106: Installation area

[0090] 108: Adhesive material

[0091] 110: Lamination

[0092] 340: Film guide on the other side

[0093] 350: Lifting mechanism on the other side

[0094] 351: The other side rail DETAILED DESCRIPTION

[0095] Below, while referring to the attached Figure 1 The mounting device 10 according to the embodiment will be described. The mounting device 10 is a device for manufacturing a semiconductor device by mounting a plurality of semiconductor chips 100 on a substrate 104 as a mounted object.

[0096] like Figure 1 , Figure 2 As shown in FIG. 1 , the mounting device 10 includes a bonding stage 20, a base 21, a mounting head 17, a film placement mechanism 30, and a control unit 80 for controlling the movement of the above-mentioned parts. In the following description, the extending direction of the coating film 110 is set as the X direction, the direction perpendicular to the X direction on the horizontal plane is set as the Y direction, and the up and down direction is set as the Z direction. In addition, the side provided with the winding roller 63b described later is set as one side, and the side provided with the delivery roller 63a is set as the other side.

[0097] The bonding stage 20 is a stage that holds the substrate 104 on its upper surface. The bonding stage 20 is provided with, for example, a suction hole (not shown) for holding the substrate 104 by suction, or a heater (not shown) for heating the substrate 104. The bonding stage 20 is supported by a base 21.

[0098] The mounting head 17 is arranged facing the bonding stage 20 and includes a main body 11 , an insulating block 12 arranged on the lower side of the main body 11 , a heater 14 installed on the lower side of the insulating block 12 , and a pressing tool 16 installed on the lower side of the heater 14 .

[0099] The main body 11 can move in a direction of approaching or moving away from the substrate 104 adsorbed on the bonding stage 20 , that is, in a vertical direction, by a driving mechanism provided inside, and can also move in a horizontal direction relative to the substrate 104 .

[0100] The heat insulating block 12 is a ceramic plate-shaped member interposed between the body 11 and the heater 14 to prevent the heat of the heater 14 from being transferred to the body 11. The heater 14 is a heater in which a heating resistor made of platinum or tungsten is embedded in ceramic such as aluminum nitride.

[0101] On the upper surface of the heater 14, there is a Figure 1 Two cooling grooves 15 extending in a direction perpendicular to the paper surface are provided in the heat insulating block 12. In addition, an air flow path 13 is provided in the heat insulating block 12, and the air flow path 13 extends from the side in an L shape and connects the side with the cooling groove 15 provided in the heater 14. When the heater 14 receives power from the control unit 80, the heating resistor generates heat and the temperature rises, thereby heating the pressing tool 16 installed on the lower side of the heater 14. In addition, when air from the fan 19 is made to flow to the air flow path 13 of the heat insulating block 12, the heater 14 is cooled, thereby cooling the pressing tool 16.

[0102] The size of the upper surface of the pressing tool 16 is substantially the same as that of the heater 14, and a protrusion 16a for adsorbing and pressing the semiconductor chip 100 is provided on the lower side. The size of the protrusion 16a is substantially the same as that of the semiconductor chip 100. The pressing tool 16 is made of ceramic. A suction hole 18 for sucking and holding the semiconductor chip 100 is formed in the pressing tool 16. The suction hole 18 passes through the heater 14 and the insulation block 12 and is connected from the main body 11 to a suction pump (not shown). The semiconductor chip 100 is sucked and held on the lower surface of the protrusion 16a of the pressing tool 16 by the negative pressure generated by the suction pump.

[0103] A film placement mechanism 30 is provided on the base 21 of the mounting device 10. When mounting the semiconductor chip 100, the film placement mechanism 30 allows the film 110 to be interposed between the semiconductor chip 100 and the pressing tool 16. As a raw material of the film 110, a raw material having excellent heat resistance and high peelability of the adhesive material 108 is suitable. Therefore, as a raw material of the film 110, for example, a fluororesin such as polytetrafluoroethylene (PTFE) and tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA) can be used.

[0104] The film disposing mechanism 30 includes a film guide 40 , a connecting member 46 , a lifting mechanism 50 , a film feeding mechanism 60 , and a moving mechanism 70 .

[0105] The film delivery mechanism 60 delivers the strip-shaped coating film 110 to the top of the substrate 104 in sequence. It has a delivery roller 63a provided on the other side of the bonding stage 20 and a winding roller 63b provided on one side (hereinafter, in the case of not distinguishing between the delivery roller 63a and the winding roller 63b, it is simply referred to as "delivery roller 63"). The coating film 110 is suspended between the pair of delivery rollers 63. The coating film 110 is delivered in a predetermined delivery direction ( Figure 1 The delivery roller 63a and the winding roller 63b rotate in the same direction as the delivery roller 63a, thereby the used coating film 110 is wound around the winding roller 63b and recovered. The delivery roller 63a and the winding roller 63b are driven by a driving motor not shown. In addition, the delivery roller 63a may be a driven roller that is not driven by a motor but is driven by the rotation of the winding roller 63b.

[0106] The support structure 65 of the delivery roller 63a and the winding roller 63b is the same, and the difference between the two is that they are symmetrical with respect to the bonding stage 20. In addition, the lifting mechanism 50, the film guide 40, and the moving mechanism 70 are respectively provided on one side and the other side of the bonding stage 20, and the difference between the two is that they are symmetrical with respect to the bonding stage 20. Therefore, the support structure 65, the lifting mechanism 50, the film guide 40, and the moving mechanism 70 of the winding roller 63b arranged on one side of the bonding stage 20 are described below.

[0107] like Figure 3 , Figure 4 As shown, the support structure 65 of the winding roller 63b includes a base 61 and a frame 62. The base 61 is mounted on a rail 71 movably in the Y direction, and the rail 71 is provided on the upper surface of the base 21 on one side of the joint stage 20 and extends in the Y direction. The frame 62 includes four columns mounted on the base 61 and four beams connecting the upper parts of the columns. The shaft 64 of the winding roller 63b is rotatably mounted on two beams facing each other extending in the X direction.

[0108] The lifting mechanism 50 is mounted on the base 61 supporting the winding roller 63b of the film feeding mechanism 60, and the film guide 40 is connected to the lifting mechanism 50. The film guide 40 defines the height of the coating film 110 relative to the bonding stage 20, and the lifting mechanism 50 lifts and lowers the film guide 40 relative to the bonding stage 20.

[0109] The lifting mechanism 50 includes a guide rail 51, a slider 54, a connecting member 55, a spring 56, and a Z-direction actuator 58. The spring 56 is an example of an elastic member, but is not limited thereto, and an elastic member such as a leaf spring, rubber, or sponge can be used.

[0110] The guide rail 51 is mounted on the upper surface of the base 61 of the film delivery mechanism 60 so as to extend in the vertical direction. The slider 54 includes a main body 52 and an arm 53. The main body 52 is movable in the vertical direction along the guide rail 51 by inserting a hole 52a provided at the center thereof into the guide rail 51. Furthermore, the front end of a Z-direction actuator 58 installed on the base 61 is connected to the lower end of the main body 52, and the main body 52 is driven in the vertical direction by the Z-direction actuator 58. One end of the arm 53 is connected to the main body 52, and a hole 53a provided at the other end is inserted into a slider guide 57 of a connection member 55 described later, so that the slider is connected to the slider guide 57 so as to be movable in the vertical direction.

[0111] The connecting member 55 is a groove-shaped cross-section member, which includes a plate-shaped upper flange 55a, a plate-shaped lower flange 55b facing the upper flange 55a, and a plate-shaped web 55c connecting the upper flange 55a and the lower flange 55b in the up-down direction. A slider guide 57 extending in the up-down direction is provided between the upper flange 55a and the lower flange 55b. The hole 53a of the arm portion 53 of the slider 54 is inserted into the slider guide 57, and the slider 54 is connected to the connecting member 55 so as to be relatively movable in the up-down direction between the upper flange 55a and the lower flange 55b under the guidance of the slider guide 57.

[0112] That is, the arm portion 53 of the slider 54 is mounted to the connecting member 55 so that it can be relatively moved in the up-down direction by a predetermined vertical range between the lower surface of the upper flange 55a and the upper surface of the lower flange 55b of the connecting member 55. In other words, the connecting member 55 is mounted to the arm portion 53 of the slider 54 so that it can be relatively moved in the up-down direction by a predetermined vertical range between the lower surface of the upper flange 55a and the upper surface of the lower flange 55b.

[0113] A spring 56 is installed between the upper surface of the lower flange 55b of the connecting member 55 and the lower surface of the arm 53 of the slider 54. The spring 56 urges the arm 53 upward so that the upper surface of the arm 53 of the slider 54 contacts the lower surface of the upper flange 55a.

[0114] The film guide 40 is connected to the surface of the web 55c of the connection member 55 on the bonding stage 20 side. The film guide 40 includes a base portion 41, a lower guide roller 42, an upper guide roller 43, and a stopper 44.

[0115] The base portion 41 is a long member connected to the web 55c and extending toward the bonding stage 20 along the side end of the coating 110 on the upper surface of the bonding stage 20. The lower guide roller 42 is a cylindrical rotating body installed on the side of the front end of the base portion 41 on the bonding stage 20 side, extending from the base portion 41 toward the coating 110 in a direction perpendicular to the extension direction of the coating 110, and winding the coating 110 on the lower side. The upper guide roller 43 is arranged on one side of the lower guide roller 42. The upper guide roller 43 is a cylindrical rotating body installed on the side of the base portion 41, extending from the base portion 41 toward the coating 110 in a direction perpendicular to the extension direction of the coating 110, and winding the coating 110 on the upper side.

[0116] The stopper 44 is a plate-shaped member mounted on the lower end surface of the base portion 41 and extending from the base portion 41 toward the negative side in the Y direction. The lower end of the stopper 44 is arranged at a position abutting against the upper surface of one side of the bonding stage 20, forming a contact portion in contact with the upper surface of the bonding stage 20. With regard to the height of the stopper 44, when the lower end of the stopper 44 abuts against the upper surface of the bonding stage 20, the height of the lower surface of the coating 110 becomes a height in contact with the upper surface of the semiconductor chip 100 temporarily pressed onto the substrate 104.

[0117] The front end of the base 41 of the film guide 40 on one side is connected to the front end of the base 41 of the film guide 40 on the other side by a connecting member 46. The connecting member 46 is a long member extending in the X direction along the side end of the coating 110 on the upper surface of the bonding stage 20. The film guide 40 on the other side has the same structure as the film guide 40 on the one side except that it is symmetrical with the film guide 40 on the one side with respect to the bonding stage 20.

[0118] like Figure 1 , Figure 2 As shown, the coating film 110 wound around the upper guide roller 43 of the film guide 40 on one side extends toward the winding roller 63b arranged on one side and is wound around the winding roller 63b. In addition, the coating film 110 wound around the lower guide roller 42 of the film guide 40 on one side extends toward the other side, is wound around the lower side of the lower guide roller 42 of the film guide 40 arranged on the other side, and then is wound around the upper side of the upper guide roller 43 of the film guide 40 arranged on the other side and extends toward the delivery roller 63a.

[0119] In this way, the coating film 110 mounted between the delivery roller 63a on the other side and the winding roller 63b on one side is respectively wound around the lower guide roller 42 and the upper guide roller 43 of the two film guides 40 arranged on both sides of the bonding stage 20. The height of the coating film 110 from the bonding stage 20 is regulated by the lower guide rollers 42 on both sides.

[0120] return Figure 3 The moving mechanism 70 includes: a rail 71, which is provided on the upper surface of the base 21 on one side of the bonding stage 20; and a Y-direction actuator 72, which is provided on the base 21 and drives the base 61 of the film delivery mechanism 60 guided by the rail 71 along the Y direction. The Y-direction actuator 72 drives the winding roller 63b of the film delivery mechanism 60 and the base 61 connected to the lifting mechanism 50 along the Y direction ( Figure 2 The film guide 40 of the film feeding mechanism 60 moves in the direction of the arrow 92 in the figure, thereby causing the winding roller 63b of the film feeding mechanism 60, the lifting mechanism 50 and the film guide 40 connected to the lifting mechanism 50 to move in the Y direction as a whole.

[0121] In the above, the support structure 65, the lifting mechanism 50, the film guide 40, and the moving mechanism 70 of the winding roller 63b arranged on one side of the bonding stage 20 are described. The support structure 65, the lifting mechanism 50, the film guide 40, and the moving mechanism 70 of the delivery roller 63a arranged on the other side of the bonding stage 20 are symmetrical with respect to the bonding stage 20, and other than that, they are the same structure as one side, so the description is omitted.

[0122] The control unit 80 is connected to the main body 11 of the mounting head 17, the heater 14, the fan 19, the Z-direction actuator 58 of the lifting mechanism 50, the unillustrated drive motor of the film delivery mechanism 60, the Y-direction actuator 72 of the moving mechanism 70, and the bonding stage 20, and controls the movement of the mounting head 17, the Z-direction movement of the slider 54 of the lifting mechanism 50, the rotation of the feeding roller 63, and the Y-direction movement of the base 61, and controls the temperature of the pressing tool 16 through the heater 14 and the fan 19. The control unit 80 includes, for example, a central processing unit (CPU) for performing various calculations, and a memory for storing various data and programs. The control unit 80 is input with detection results from various sensors, and the control unit 80 performs drive control and temperature control of each part according to the detection results.

[0123] Next, refer to Figures 3 to 6 The operation of the mounting device 10 of the embodiment is described below. The mounting device 10 mounts the semiconductor chip 100 on the substrate 104 using the flip chip bonding technology. Specifically, Figure 1 As shown, the mounting device 10 bonds projections made of a conductive material, called bumps 102 formed on the bottom surface of a semiconductor chip 100 , to electrodes 105 formed on the surface of a substrate 104 , thereby electrically connecting the semiconductor chip 100 to the substrate 104 .

[0124] like Figure 2 and Figure 3As shown, a plurality of electrodes 105 electrically connected to the bumps 102 of the semiconductor chip 100 are formed on the substrate 104, thereby defining a mounting region 106 for mounting the semiconductor chip 100. In each mounting region 106, an adhesive material 108 as an insulating thermosetting resin is applied in advance.

[0125] The control unit 80 of the mounting device 10 causes the semiconductor chip 100 to be held by the pressing tool 16 at the front end of the mounting head 17 by suction, and causes the mounting head 17 to be lowered and pressed against the adhesive material 108 in the mounting area 106, thereby temporarily pressing the semiconductor chip 100 onto the adhesive material 108. During the temporary pressing, the cover film 110 is retracted to a position separated from the mounting area 106 in the horizontal direction by the moving mechanism 70.

[0126] After temporary crimping, the control unit 80 drives the moving mechanism 70 to move the coating 110 in the horizontal direction, so that Figure 3 As shown in FIG. 1 , the cover film 110 is moved to a position just above the temporarily pressed semiconductor chip 100 and between the semiconductor chip 100 and the pressing tool 16. At this time, the height of the cover film 110 is determined by the lower guide roller 42 of the film guide 40. The height of the cover film 110 is located between the upper surface of the semiconductor chip 100 and the pressing tool 16.

[0127] At this time, if Figure 3 As shown, a gap of height △h1 is provided between the lower end of the stopper 44 of the film guide 40 and the upper surface of the bonding stage 20. Furthermore, the arm 53 of the slider 54 of the lifting mechanism 50 is urged by the spring 56 to contact the lower surface of the upper flange 55a of the connecting member 55, and a gap of height △h0 is provided between the lower surface of the arm 53 and the lower flange 55b of the connecting member 55. Furthermore, the length of the spring 56 is △h0.

[0128] like Figure 5 As shown in FIG. 1 , the control unit 80 operates the Z-direction actuator 58 of the lifting mechanism 50 to lower the main body 52 of the slider 54 as shown by the arrow 93. Then, along with this, the arm 53 and the film guide 40 also move as shown in FIG. Figure 5 And, when the slider 54 moves from Figure 3 When the state shown in the figure drops by a height of △h1, Figure 5 As shown, the lower end of the stopper 44 of the film guide 40 abuts against the bonding stage 20. At this time, the lower surface of the cover film 110 is at a height in contact with the upper surface of the temporarily pressure-bonded semiconductor chip 100.

[0129] Then, the control unit 80 further lowers the slider 54 by the Z-direction actuator 58 by the height △h2. As a result, the spring 56 is compressed by the height △h2, and a gap of the height △h2 is formed between the upper surface of the arm portion 53 of the slider 54 and the lower surface of the upper flange 55a of the connecting member 55. And, by the reaction force caused by the compression of the spring 56, the stopper 44 of the film guide 40 is pressed onto the bonding stage 20. By the pressing force, the height of the film guide 40 relative to the bonding stage 20 is kept constant.

[0130] The control unit 80 operates the Z-direction actuator 58 of the lifting mechanism 50 disposed on the other side in the same manner as the Z-direction actuator 58 of the lifting mechanism 50 disposed on one side, and presses the stopper 44 of the film guide 40 on the other side to the upper surface of the bonding stage 20. As a result, the height of the film guide 40 on the other side relative to the bonding stage 20 becomes the same as the height of the film guide 40 on one side relative to the bonding stage 20. As a result, the parallelism between the coating 110 and the bonding stage 20 can be ensured. Therefore, as Figure 2 As shown, even when the cover film 110 covers the upper surfaces of the plurality of semiconductor chips 100 in the longitudinal direction, the cover film 110 can be in close contact with the upper surfaces of the semiconductor chips 100 .

[0131] Next, if Figure 6 As shown by arrow 97, the control unit 80 lowers the mounting head 17 and uses the protrusion 16a of the pressing tool 16 at the front end to press the semiconductor chip 100 from the upper side of the film 110. By pressing, the adhesive material 108 runs out of the periphery of the semiconductor chip 100, and a part of the adhesive material 108 climbs to the side of the semiconductor chip 100 and reaches the lower surface of the film 110. Moreover, by pressing, the bump 102 formed on the semiconductor chip 100 contacts the electrode 105 of the substrate 104. As described above, since the parallelism between the film 110 and the upper surface of the bonding stage 20 is ensured, the film 110 is in close contact with the upper surface of the semiconductor chip 100, so that the adhesive material 108 squeezed out by the semiconductor chip 100 can be suppressed from unevenly climbing or generating static electricity during mounting.

[0132] Then, the control unit 80 starts supplying power to the heater 14 to increase the temperature of the pressing tool 16 through the heater 14. When the temperature of the pressing tool 16 increases, the semiconductor chip 100 is heated by the heat, and the adhesive material 108 softens. When the temperature is further increased to a melting temperature or higher than the bump 102, the bump 102 of the semiconductor chip 100 melts. And when the temperature rises to a curing temperature of the adhesive material 108, the adhesive material 108 starts to be thermally cured.

[0133] Then, the control unit 80 starts Figure 1The fan 19 shown in the figure makes cooling air flow to the air flow path 13 of the heat insulating block 12 to cool the pressing tool 16. As a result, the melted bump 102 is solidified, and the bonding with the electrode 105 of the substrate 104 is completed. In addition, the temperature of the heat-cured adhesive material 108 also decreases, becoming Figure 6 Once the installation is completed, the control unit 80 raises the mounting head 17.

[0134] Once the control unit 80 raises the mounting head 17, the slider 54 is raised by the Z-direction actuator 58 of the lifting mechanism 50 on one side and the other side. Figure 6 At the height Δh2 shown in FIG. 1 , the upper surface of the arm portion 53 of the slider 54 contacts the lower surface of the upper flange 55a of the connecting member 55. When the slider 54 is further raised, the connecting member 55 and the film guide 40 rise with the rise of the slider 54, and the coating 110 also rises, and the coating 110 returns to the original position. Figure 3 Once the control unit 80 raises the coating 110 to Figure 3 As shown in the height, the cover film 110 is retracted by the moving mechanism 70 to a position spaced apart in the horizontal direction from the next mounting area 106 to which the semiconductor chip 100 is to be temporarily crimped.

[0135] As described above, the mounting device 10 of the embodiment can adjust the height of the film guides 40 on both sides by using the lifting mechanisms 50 respectively arranged on both sides of the bonding stage 20 to ensure the parallelism between the bonding stage 20 and the cover film 110, so that the cover film 110 can be closely contacted with the upper surface of the semiconductor chip 100. Therefore, when mounting the semiconductor chip 100, it is possible to suppress the adhesive material 108 squeezed out by the semiconductor chip 100 from unevenly climbing or generating static electricity during mounting.

[0136] Moreover, in the mounting device 10 of the embodiment, the film guides 40 on both sides are connected by the connecting member 46, so that the deviation of the height of the film guides 40 on both sides can be eliminated, and the parallelism between the bonding stage 20 and the coating 110 can be ensured. Furthermore, the mounting device 10 of the embodiment uses the force of the spring 56 to press the film guide 40 onto the bonding stage 20, so that the height of the film guide 40 relative to the surface of the bonding stage 20 can be set to be fixed, thereby ensuring the parallelism between the bonding stage 20 and the coating 110.

[0137] Next, refer to Figure 7, while explaining another embodiment of the mounting device 200. The film placement mechanism 230 of the mounting device 200 includes: a film guide 40 provided on one side, a lifting mechanism 50, a moving mechanism 70, a film delivery mechanism 60 including a delivery roller 63a on the other side and a winding roller 63b on one side, an other side lifting mechanism 350 provided on the other side, and a film guide 340 on the other side. The structure of the film delivery mechanism 60, the film guide 40 provided on one side, the lifting mechanism 50 and the moving mechanism 70 is the same as that of the film delivery mechanism 60, the film guide 40 provided on one side, the lifting mechanism 50 and the moving mechanism 70 previously described. Figures 1 to 6 The described mounting device 10 is the same, so the description is omitted.

[0138] The other side lifting mechanism 350 provided on the other side does not include the Z-direction actuator 58, the slider 54, and the connecting member 55, but includes only the other side guide rail 351. The other side guide rail 351 is mounted on the other side base 61 and extends in the up-down direction to guide the other side film guide 340 in the up-down direction. The other side film guide 340 is connected to the one side film guide 40 by the connecting member 46, and moves in the up-down direction driven by the one side film guide 40. Moreover, the other side film guide 340 includes a base 341, a lower guide roller 342, an upper guide roller 343, and a stopper 344, similarly to the one side film guide 40. The base portion 341 has the same structure as the film guide 40 on one side, except that a hole is provided at the end portion on the other side for embedding into the guide rail 351 on the other side and the length in the X direction is long. The lower guide roller 342, the upper guide roller 343 and the blocker 344 have the same structure as the lower guide roller 42, the upper guide roller 43 and the blocker 44 on one side, respectively.

[0139] Figure 7 The mounting device 200 shown in the figure drives both the film guide 40 on one side and the film guide 340 on the other side up and down by the Z-direction actuator 58 installed in the lifting mechanism 50 on one side, so that the structure can be simplified.

[0140] The mounting device 200 can adjust the height of the film guides 40 disposed on both sides of the bonding stage 20 to ensure the parallelism between the bonding stage 20 and the coating film 110 .

[0141] In the above description, the mounting apparatus 10, 200 mounts the semiconductor chip 100 on the substrate 104, but the present invention is not limited thereto and the semiconductor chip 100 may be mounted on another semiconductor chip 100. In this case, the other semiconductor chip 100 constitutes a mounted body similar to the substrate 104.

Claims

1. A mounting device for pressing a semiconductor chip disposed on a mounted body, the mounting device comprising: A bonding stage for holding the mounted body on which the semiconductor chip is arranged; A base, supporting the bonding stage; A mounting head moves in a direction approaching or moving away from the mounted object, and a pressing tool for pressing the semiconductor chip to the mounted object is installed at a front end thereof; as well as A film placement mechanism is provided on the base, and moves the film along the bonding stage, thereby placing the film between the semiconductor chip and the pressing tool. The film configuration mechanism comprises: a film guide that guides the coating film and has a contact portion that contacts the bonding stage to define a height of the coating film relative to the bonding stage; as well as The lifting mechanism is connected to the film guide via an elastic member, and lifts and lowers the film guide relative to the bonding stage.

2. The mounting device according to claim 1, characterized in that: The film guide and the lifting mechanism are respectively arranged on both sides of the bonding stage with the bonding stage sandwiched therebetween.

3. The mounting device according to claim 2, characterized in that: The film placement mechanism includes a connecting member that connects the film guides that are provided on both sides of the bonding stage with the bonding stage interposed therebetween.

4. The mounting device according to any one of claims 1 to 3, characterized in that: The lifting mechanism comprises: A guide rail, disposed on the base and extending in the up-down direction; A slider, guided by the guide rail to move in an up-down direction; and A connecting member is mounted to the slider at one end via the elastic member so as to be relatively movable in the vertical direction by a predetermined vertical range, and the film guide is mounted at the other end. When the contact portion of the film guide contacts the upper surface of the bonding stage, the slider presses the film guide to the upper surface of the bonding stage via the elastic member and the connecting member.

5. The mounting device according to claim 4, characterized in that: The film disposing mechanism includes a film feeding mechanism, the film feeding mechanism includes a pair of rollers and sequentially feeds out the new coating film, the pair of rollers sandwiching the bonding stage and arranged on the base on both sides of the bonding stage and mounting the coating film, The film delivery mechanism includes bases for supporting the rollers. The guide rails of the lifting mechanism are mounted on the bases.

6. The mounting device according to claim 2, characterized in that: The film configuration mechanism comprises: One side of the film guide and one side of the lifting mechanism are arranged on one side of the bonding platform; and The other side film guide and the other side lifting mechanism are arranged on the other side of the bonding stage, The lifting mechanism on one side comprises: One side guide rail is provided on the base at one side and extends in the up-down direction; A slider is guided by one of the side guide rails to move in the up and down direction; and A connecting member, one end of which is mounted to the slider via the elastic member so as to be relatively movable in the vertical direction by a predetermined vertical range, and the one-side film guide is mounted on the other end. The other side lifting mechanism includes a other side guide rail, which is provided on the other side base and extends in the up-down direction to guide the other side film guide in the up-down direction. The film disposing mechanism includes a connecting member connecting the one side film guide and the other side film guide. When the contact portion of the film guide on one side and the contact portion of the film guide on the other side contact the upper surface of the bonding platform, the slider presses the contact portion of the film guide on one side to the upper surface of the bonding platform via the elastic member and the connecting member, and presses the contact portion of the film guide on the other side to the upper surface of the bonding platform via the connecting member.

7. The mounting device according to claim 6, characterized in that: The film disposing mechanism includes a film feeding mechanism, the film feeding mechanism includes a pair of rollers and sequentially feeds out the new coating film, the pair of rollers sandwiching the bonding stage and arranged on the base on both sides of the bonding stage and mounting the coating film, The film delivery mechanism comprises a base supporting each of the rollers. The guide rail on one side is installed on the base on one side, and the guide rail on the other side is installed on the base on the other side.

8. The mounting device according to claim 4, characterized in that: The connecting member is a channel-shaped section member, comprising an upper flange, a lower flange facing the upper flange, and a web connecting the upper flange and the lower flange. A slider guide extending in the up-down direction is included between the upper flange and the lower flange, The slider is guided by the slider guide so as to be movable relative to the connecting member in the up-down direction between the upper flange and the lower flange. The elastic member is provided between a lower end of the slider and an upper surface of the lower flange.

9. The mounting device according to claim 5, characterized in that: The film placement mechanism includes a moving mechanism that moves the film delivery mechanism in a horizontal direction relative to the bonding stage.

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