Three-color LED solid crystal structure and LED bracket

Abstract

The present invention discloses an LED bracket, including an optical cup and a three-color LED solid crystal structure arranged on the optical cup. Specifically, the three-color LED solid crystal structure includes a plurality of solder pads, and the plurality of solder pads are arranged at intervals to form a gap, and the gap is filled with an insulating member. A chip is provided on the insulating member, and at least one side of the chip is overlapped on the solder pad, and the chip is electrically connected to the solder pad through a wire. The solder pad is made of metal, the insulating member is made of plastic, and the chip is connected to the insulating member through a solid crystal glue. This solution avoids chip abnormality or falling off due to large differences in expansion coefficients when the lamp body is heated by connecting the chip to an insulating member with a similar expansion coefficient to the solid crystal glue, thereby improving the stability of the chip connection and increasing the service life of the lamp. At the same time, overlapping the chip on the solder pad is conducive to heat dissipation and reducing the distance between the two solder pads, so as to reduce the overall size of the LED bracket.

Description

Technical field

[0001] The present application relates to a three-color LED die-bonding structure and an LED bracket. [Background Technology]

[0002] like Figure 1 As shown, the existing planar LED bracket includes a light cup, a metal pad and an LED chip, wherein the LED chip is connected to the metal pad by a bonding adhesive. Due to the large difference in expansion coefficient between the bonding adhesive and the metal pad, when the lamp body is powered on and heated, it is easy to cause the chip to malfunction or even fall off. [Summary of the invention]

[0003] One of the purposes of this application is to provide a three-color LED die-bonding structure, which avoids the problem of chip malfunction or chip falling off due to large differences in expansion coefficients by connecting the chip to an insulating member with a similar expansion coefficient to that of the die-bonding glue.

[0004] This application is achieved through the following technical solutions:

[0005] A three-color LED die-bonding structure includes a plurality of pads, wherein the plurality of pads are spaced apart to form a gap, wherein the gap is filled with an insulating member, a chip is provided on the insulating member, and at least one side of the chip is overlapped on one of the pads, and the chip is electrically connected to the pad via a wire.

[0006] In the above-mentioned three-color LED die-bonding structure, the insulating member is made of plastic.

[0007] As described above, for the three-color LED die-bonding structure, when the temperature is T, the lateral expansion coefficient of the insulating part is TD, and the longitudinal expansion coefficient is MD; when the temperature T is between 20°C and 250°C, the lateral expansion coefficient TD is between 55 and 157 μm / (m·°C), and the longitudinal expansion coefficient MD is between 20 and 45 μm / (m·°C).

[0008] For the three-color LED die-bonding structure described above, when the temperature T is between 20°C and 50°C, the lateral expansion coefficient TD is between 55 and 63 μm / (m·°C), and the longitudinal expansion coefficient MD is between 20 and 28.5 μm / (m·°C).

[0009] When the temperature T is between 50°C and 100°C, the transverse expansion coefficient TD is between 68 and 75 μm / (m·°C), and the longitudinal expansion coefficient MD is between 23 and 29 μm / (m·°C).

[0010] When the temperature T is between 100°C and 150°C, the transverse expansion coefficient TD is between 89 and 108 μm / (m·°C), and the longitudinal expansion coefficient MD is between 31 and 34 μm / (m·°C).

[0011] When the temperature T is between 150°C and 200°C, the transverse expansion coefficient TD is 107 to 157 μm / (m·°C), and the longitudinal expansion coefficient MD is 38 to 43 μm / (m·°C).

[0012] When the temperature T is 200°C to 250°C, the transverse expansion coefficient TD is 130 to 140 μm / (m·°C), and the longitudinal expansion coefficient MD is 40 to 45 μm / (m·°C).

[0013] In the three-color LED die-bonding structure as described above, the plurality of solder pads are respectively located on the left and right sides and / or the upper and lower sides of the insulating member.

[0014] In the above-mentioned three-color LED die-bonding structure, the insulating member includes a first insulating member extending in the left-right direction and a second insulating member extending in the up-down direction.

[0015] As described above, the three-color LED die-bonding structure, the multiple solder pads include a first solder pad, a second solder pad, a third solder pad and a fourth solder pad, the first solder pad and the second solder pad are arranged opposite to each other on the left and right sides of the second insulating member, the third solder pad and the fourth solder pad are arranged opposite to each other on the left and right sides of the second insulating member, the first solder pad and the third solder pad are arranged opposite to each other on the upper and lower sides of the first insulating member, and the second solder pad and the fourth solder pad are arranged opposite to each other on the upper and lower sides of the first insulating member.

[0016] In the three-color LED die-bonding structure as described above, the two sides of the chip are respectively connected to the two solder pads.

[0017] In the three-color LED die-bonding structure as described above, the chips include a green chip and a blue chip, and the green chip and the blue chip are spaced apart from each other on the insulating member.

[0018] In the three-color LED die-bonding structure as described above, a red chip electrically connected to another pad is provided on one of the pads.

[0019] The second object of the present application is to provide an LED bracket, comprising an optical cup and the above-mentioned three-color LED die-bonding structure arranged on the optical cup, wherein a light-transmitting hole is formed on the optical cup to expose the solder pad and the chip.

[0020] Compared with the prior art, the present invention has the following advantages:

[0021] 1. The present invention avoids the problem of abnormal operation or chip falling off caused by large differences in expansion coefficients by connecting the chip to an insulating member with a similar expansion coefficient to that of the die-bonding adhesive.

[0022] 2. Preferably, the multiple solder pads are located on the left and right sides and / or the top and bottom sides of the insulating member, so that the multiple solder pads form only one gap in the left-right direction or the top and bottom directions, or form interconnected sub-gaps in the left-right direction and the top and bottom directions, respectively. This reduces the number of gaps in the left-right direction or the top and bottom directions, thereby reducing the overall size of the LED bracket.

Brief Description of the Drawings

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for describing the embodiments.

[0024] Figure 1 It is a structural diagram of an existing LED bracket;

[0025] Figure 2 A schematic diagram of the structure of an LED bracket using a three-color LED die-bonding structure;

[0026] Figure 3 This is a schematic diagram of the structure of an LED bracket using a three-color LED die-bonding structure. [Specific implementation method]

[0027] In order to make the technical problems, technical solutions and beneficial effects solved by this application more clearly understood, this application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0028] like Figure 2-3 The LED bracket shown includes an optical cup 6 and a three-color LED solid crystal structure arranged on the optical cup 6. Specifically, the three-color LED solid crystal structure includes a plurality of solder pads 1, and the plurality of solder pads 1 are arranged at intervals to form a gap (not marked in the figure). The gap is filled with an insulating member 3, and a chip 4 electrically connected to the solder pad 1 is provided on the insulating member 3. A light-transmitting hole (not marked in the figure) is formed on the optical cup 6 to expose the solder pad 1 and the chip 4.

[0029] Specifically, the pad 1 is made of metal, and the insulating member 3 is made of plastic. Preferably, the insulating member 3 is PPA plastic. Specifically, the chip 4 is connected to the insulating member 3 via a die-bonding adhesive and is electrically connected to the pad 1 via a wire.

[0030] In the above scheme, by connecting the chip 4 to the insulating part 3 having an expansion coefficient close to that of the die-bonding glue, the chip is prevented from becoming abnormal or falling off due to a large difference in expansion coefficient when the lamp body is heated, thereby improving the stability of the connection between the chip and the insulating part and increasing the service life of the lamp.

[0031] Furthermore, as a preferred embodiment of the present invention but not a limitation, at least one side of the chip 4 is overlapped on one of the pads 1, and preferably, both sides of the chip 4 are connected to the two pads 1 respectively. Specifically, the left and right sides of the chip 4 are respectively connected to the two oppositely arranged pads 1. More specifically, the left and right sides of the green chip 41 are connected to the third pad 13 and the fourth pad 14 through a solid crystal adhesive, and the left and right sides of the blue chip 42 are connected to the third pad 13 and the fourth pad 14 through a solid crystal adhesive. This arrangement can reduce the distance between the two pads 1 and further reduce the overall size of the LED bracket, while ensuring the contact area between the chip 4 and the insulating member 3 to ensure the stability of the connection. At the same time, the chip 4 is overlapped on the pad 1, which is beneficial to the heat dissipation of the chip 4.

[0032] Among them, when the temperature is T, the lateral expansion coefficient of the insulating member 3 is TD, and the longitudinal expansion coefficient is MD; when the temperature T is: 20℃~250℃, the lateral expansion coefficient TD is: 55~157μm / (m·℃), and the longitudinal expansion coefficient MD is: 20~45μm / (m·℃).

[0033] Specifically, when the temperature T is 20°C to 50°C, the transverse expansion coefficient TD is 55 to 63 μm / (m·°C), and the longitudinal expansion coefficient MD is 20 to 28.5 μm / (m·°C). Preferably, the transverse expansion coefficient TD is 62.63 μm / (m·°C) or 56.8 μm / (m·°C), and the longitudinal expansion coefficient MD is 28.13 μm / (m·°C) or 21.73 μm / (m·°C).

[0034] When the temperature T is 50℃~100℃, the lateral expansion coefficient TD is 68~75μm / (m·℃), and the longitudinal expansion coefficient MD is 23~29μm / (m·℃). Preferably, the lateral expansion coefficient TD is 69.55μm / (m·℃) or 74.28μm / (m·℃), and the longitudinal expansion coefficient MD is 28.64μm / (m·℃) or 25.97μm / (m·℃).

[0035] When the temperature T is between 100°C and 150°C, the transverse expansion coefficient TD is between 89 and 108 μm / (m·°C), and the longitudinal expansion coefficient MD is between 31 and 34 μm / (m·°C); preferably, the transverse expansion coefficient TD is 106.7 μm / (m·°C) or 90.51 μm / (m·°C), and the longitudinal expansion coefficient MD is 33.1 μm / (m·°C) or 32.69 μm / (m·°C);

[0036] When the temperature T is between 150°C and 200°C, the transverse expansion coefficient TD is 107 to 157 μm / (m·°C), and the longitudinal expansion coefficient MD is 38 to 43 μm / (m·°C); preferably, the transverse expansion coefficient TD is 156.6 μm / (m·°C) or 108.2 μm / (m·°C), and the longitudinal expansion coefficient MD is 42.6 μm / (m·°C) or 39.51 μm / (m·°C);

[0037] When the temperature T is 200℃~250℃, the lateral expansion coefficient TD is 130~140μm / (m·℃), and the longitudinal expansion coefficient MD is 40~45μm / (m·℃); preferably, the lateral expansion coefficient TD is 132μm / (m·℃) or 135.3μm / (m·℃), and the longitudinal expansion coefficient MD is 44.62μm / (m·℃) or 42.54μm / (m·℃).

[0038] The above expansion coefficient is reasonable and close to the expansion coefficient of the die-bonding adhesive, which can effectively avoid the problem of abnormal operation or chip falling off caused by large differences in expansion coefficients.

[0039] Figure 1 This LED holder utilizes a conventional three-color LED die-bonding structure. As shown in the figure, the LED chip 100 is attached to a metal pad 200 and electrically connected to two alternate metal pads 200. This die-bonding structure creates at least two spaced-apart water channel gaps between the multiple alternate metal pads 200. Due to these multiple water channel gaps, the minimum dimensions of conventional LED holders are 1.0 mm by 1.0 mm.

[0040] After adopting the three-color LED solid crystal structure in this solution, preferably, the multiple soldering pads 1 are respectively located on the left and right sides and / or the upper and lower sides of the insulating member 3. That is, the multiple soldering pads 1 form only one gap in the left and right direction or the upper and lower directions, or form interconnected sub-gaps in the left and right direction and the upper and lower directions. This structure reduces the number of gaps in the left and right direction or the upper and lower directions, thereby reducing the overall size of the LED bracket. Specifically, after adopting the three-color LED solid crystal structure in the solution, the size of the LED bracket can be reduced to 0.8mm*0.8mm. The reduction in the size of the LED bracket is conducive to improving the display accuracy and display quality of the LED display screen.

[0041] As can be seen from the figure, the gap includes a first gap extending left and right (not marked in the figure) and a second gap extending up and down (not marked in the figure), and the insulating member 3 includes a first insulating member 31 filling the first gap and a second insulating member 32 filling the second gap. Specifically, the plurality of pads 1 include a first pad 11, a second pad 12, a third pad 13 and a fourth pad 14. The first pad 11 and the second pad 12 are arranged on the left and right sides of the second insulating member 32, and the third pad 13 and the fourth pad 14 are arranged on the left and right sides of the second insulating member 32. The first pad 11 and the third pad 13 are arranged on the upper and lower sides of the first insulating member 31, and the second pad 12 and the fourth pad 14 are arranged on the upper and lower sides of the first insulating member 31. The above arrangement of the plurality of pads 1 is conducive to reducing the overall size of the LED bracket, and at the same time, it is also conducive to heat dissipation of the chip and the pads.

[0042] Specifically, the chips 4 include a green chip 41 and a blue chip 42, which are spaced apart on the insulating member 3. As shown in the figure, the green and blue chips 41 and 42 are connected to the second insulating member 32 via die-bonding adhesive. The green chip 41 is electrically connected to the second pad 12 and the third pad 13 via wires, while the blue chip 42 is electrically connected to the third pad 13 and the fourth pad 14 via wires. This arrangement, by connecting the green and blue chips 41 and 42 to the insulating member 3, which has a similar expansion coefficient to the die-bonding adhesive, prevents chip malfunction and chip detachment due to the large difference in expansion coefficients when the lamp body heats up.

[0043] Specifically, a red chip 5 is provided on one pad 1 and electrically connected to another pad 1. As shown in the figure, the red chip 5 is connected to the first pad 11 via silver glue and is electrically connected to the third pad 13 via a wire. This arrangement achieves the connection of the red chip 5 with a simple structure and easy implementation.

[0044] It should be understood that the terms "first", "second", etc. are used in this application to describe various information, but this information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this application, "first" information may also be referred to as "second" information, and similarly, "second" information may also be referred to as "first" information. In addition, the terms "center of a circle", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0045] The above descriptions are one or more implementation methods provided in conjunction with specific content, and the specific implementation of this application is not limited to these descriptions. Any similarity or similarity with the methods, structures, etc. of this application, or any technical deduction or replacement based on the concept of this application shall be considered within the scope of protection of this application.

Claims

1. Three-color LED die-bonding structure, characterized in that: The device comprises a plurality of pads (1), wherein the plurality of pads (1) are spaced apart to form a gap, wherein the gap is filled with an insulating member (3), a chip (4) is provided on the insulating member (3), and at least one side of the chip (4) is overlapped on the pad (1), and the chip (4) is electrically connected to the pad (1) via a wire; The insulating member (3) is made of plastic material; When the temperature is T, the transverse expansion coefficient of the insulating member (3) is TD, and the longitudinal expansion coefficient is MD; When the temperature T is between 20°C and 50°C, the transverse expansion coefficient TD is between 55 and 63 μm / (m·°C), and the longitudinal expansion coefficient MD is between 20 and 28.5 μm / (m·°C). When the temperature T is between 50°C and 100°C, the transverse expansion coefficient TD is between 68 and 75 μm / (m·°C), and the longitudinal expansion coefficient MD is between 23 and 29 μm / (m·°C). When the temperature T is between 100°C and 150°C, the transverse expansion coefficient TD is between 89 and 108 μm / (m·°C), and the longitudinal expansion coefficient MD is between 31 and 34 μm / (m·°C). When the temperature T is between 150°C and 200°C, the transverse expansion coefficient TD is 107 to 157 μm / (m·°C), and the longitudinal expansion coefficient MD is 38 to 43 μm / (m·°C). When the temperature T is between 200°C and 250°C, the transverse expansion coefficient TD is 130 to 140 μm / (m·°C), and the longitudinal expansion coefficient MD is 40 to 45 μm / (m·°C). The chip (4) is connected to the insulating member (3) via a die-bonding adhesive, and is electrically connected to the pad (1) via a wire.

2. The three-color LED die-bonding structure according to claim 1, characterized in that: The plurality of solder pads (1) are respectively located on the left and right sides and / or the upper and lower sides of the insulating member (3).

3. The three-color LED die-bonding structure according to claim 1, characterized in that: The insulating member (3) comprises a first insulating member (31) extending in a left-right direction and a second insulating member (32) extending in an up-down direction.

4. The three-color LED die-bonding structure according to claim 3, characterized in that: The plurality of pads (1) include a first pad (11), a second pad (12), a third pad (13) and a fourth pad (14); the first pad (11) and the second pad (12) are arranged oppositely on the left and right sides of the second insulating member (32); the third pad (13) and the fourth pad (14) are arranged oppositely on the left and right sides of the second insulating member (32); the first pad (11) and the third pad (13) are arranged oppositely on the upper and lower sides of the first insulating member (31); and the second pad (12) and the fourth pad (14) are arranged oppositely on the upper and lower sides of the first insulating member (31).

5. The three-color LED die-bonding structure according to claim 1, characterized in that: Both sides of the chip (4) are respectively overlapped on the two pads (1).

6. The three-color LED die-bonding structure according to claim 1, characterized in that: The chip (4) comprises a green chip (41) and a blue chip (42), wherein the green chip (41) and the blue chip (42) are arranged at intervals on the insulating member (3), and a red chip (5) electrically connected to the other soldering pad (1) is provided on one soldering pad (1). 7.LED bracket, characterized in that, The invention comprises an optical cup (6) and a three-color LED die-bonding structure according to any one of claims 1 to 6, which is arranged on the optical cup (6); a light-transmitting hole is formed on the optical cup (6) to expose the solder pad (1) and the chip (4).

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