Adhesive tape and method for manufacturing the same
By setting up a concave and convex structure in the peeling layer and/or the base layer of the tape, the problem of vacuum adsorption and adhesion of sheets during the traditional tape die cutting process is solved, and higher die cutting efficiency and yield are achieved, reducing processing costs.
Patent Information
- Application Number
- CN202111532391.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2021-12-15
- Publication Date
- 2025-08-19
- Estimated Expiration
- 2041-12-15
AI Technical Summary
The smooth and smooth surface of traditional tape leads to vacuum adsorption and adhesion between sheets during die cutting, affecting die cutting efficiency and yield and increasing processing costs.
A concave and convex structure is provided on the side of the stripping layer and/or the substrate layer of the adhesive tape away from the adhesive layer, increasing the surface roughness to reduce the contact area and reducing the possibility of vacuum adsorption.
Effectively avoid sheet adhesion problems, improve die-cutting efficiency and yield, and reduce processing costs.
Smart Images

Figure CN114231206B_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of adhesive tapes, and in particular to an adhesive tape and a method for manufacturing the same. Background Art
[0002] Because the traditional tapes currently on the market have a relatively smooth and flat surface, when the traditional tapes are die-cut into sheets and stacked in the mold for storage during the die-cutting process, vacuum adsorption will occur between the sheets, causing the sheets to stick together, making it impossible for the robot to grab the sheets and thus making it impossible to perform subsequent operations, reducing die-cutting efficiency and yield, and increasing processing costs. Summary of the Invention
[0003] In view of this, the present application provides a tape and a method for manufacturing the same to solve the technical problem of sheet adhesion caused by vacuum adsorption in the prior art, thereby improving die-cutting efficiency and yield and reducing processing costs.
[0004] According to one aspect of the present application, the present application provides an adhesive tape, which includes: a base material layer; a peeling layer; and an adhesive layer located between the base material layer and the peeling layer; wherein the peeling layer and / or the side of the base material layer away from the adhesive layer is set to a concave-convex structure.
[0005] In a possible implementation, the concave-convex structure is configured in a grid shape, a stripe shape, and a texture shape.
[0006] In a possible implementation, the peeling layer and / or the substrate layer includes a release layer or an antistatic layer or an antistatic release layer that is in contact with the concave-convex surface of the concave-convex structure.
[0007] In a possible implementation, the peeling layer and / or the substrate layer includes a release layer adhered to the concave-convex surface of the concave-convex structure, and an antistatic layer adhered to the release layer.
[0008] In a possible implementation, the side of the peeling layer away from the adhesive layer is configured as the concave-convex structure; wherein the peeling layer includes a base layer and a coating layer that are bonded to each other, and the coating layer forms the concave-convex structure.
[0009] In a possible implementation, the release layer includes a release layer or an antistatic release layer; and two opposite surfaces of the release layer or the antistatic release layer are respectively attached to the base layer and the adhesive layer.
[0010] In one possible implementation, the peeling layer is provided in plurality, and the plurality of peeling layers include a first peeling layer and a second peeling layer; the adhesive layer is provided in plurality, and the plurality of adhesive layers include a first adhesive layer and a second adhesive layer; the first adhesive layer is located between the substrate layer and the first peeling layer, and the second adhesive layer is located between the substrate layer and the second peeling layer; wherein the side of the first peeling layer away from the first adhesive layer and the side of the second peeling layer away from the second adhesive layer are both provided with the concave-convex structure.
[0011] In a possible implementation, the substrate layer is a polyethylene terephthalate layer, and the thickness of the substrate layer is set to 50 μm; the thickness of the first peeling layer and the second peeling layer are both set to 50 μm; the thickness of the first adhesive layer and the second adhesive layer are both set to 10 μm.
[0012] In a possible implementation, the adhesive layer is configured as an antistatic adhesive layer or a UV viscosity-reducing adhesive layer or an antistatic UV viscosity-reducing adhesive layer.
[0013] According to another aspect of the present application, the present application provides a method for manufacturing an adhesive tape, the manufacturing method comprising: providing a substrate layer; providing a first adhesive; coating the first adhesive on the substrate layer and drying it to form an adhesive layer; providing a peeling layer; and bonding the substrate layer to the peeling layer through the adhesive layer; wherein the peeling layer and / or the side of the substrate layer away from the adhesive layer is configured as a concave-convex structure.
[0014] In one possible implementation, the side of the release layer away from the adhesive layer is set as the concave-convex structure; wherein, providing the release layer includes: coating a release agent on the concave-convex structure and drying it to obtain a release layer; and coating an antistatic agent on the release layer and drying it to obtain an antistatic layer.
[0015] In one possible implementation, providing the first adhesive includes: mixing, by weight, 100 parts of acrylic adhesive, 20-40 parts of solvent, 3-5 parts of tackifying resin, 5-10 parts of UV resin, 0.5-0.8 parts of antistatic agent, 0.5-0.8 parts of photoinitiator, 0.5-1 parts of cohesion promoter, 0.5-1 parts of cross-linking agent, and 0.05-0.2 parts of antioxidant to obtain a mixture; placing the mixture in a blender under a yellow light or in the absence of light, stirring the mixture, setting the stirring speed to 200-400 r / min, and the stirring time to 30-60 min; and obtaining the first adhesive after the stirring is completed.
[0016] According to another aspect of the present application, the present application provides another method for manufacturing an adhesive tape, the manufacturing method comprising: providing a substrate layer, wherein the substrate layer comprises a first adhesive surface and a second adhesive surface for coating a first adhesive; coating the first adhesive on the first adhesive surface and drying it to form a first adhesive layer; providing a first peeling layer; bonding the first adhesive surface to the first peeling layer through the first adhesive layer; coating the first adhesive on the second adhesive surface and drying it to form a second adhesive layer; providing a second peeling layer; and bonding the second adhesive surface to the second peeling layer through the second adhesive layer; wherein the side of the first peeling layer away from the first adhesive layer and the side of the second peeling layer away from the second adhesive layer are both set to have a concave-convex structure.
[0017] According to the adhesive tape and its manufacturing method of the present application, by setting the peeling layer and / or the side of the base material layer away from the adhesive layer to a concave-convex structure, the surface roughness of the adhesive tape is increased to reduce the contact area, thereby reducing the possibility of vacuum adsorption between the sheets cut by the tape die or between the tapes, which is conducive to avoiding the sheet adhesion problem caused by vacuum adsorption, thereby improving the die-cutting efficiency and yield and reducing processing costs. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 FIG2 is a schematic diagram of a cross-sectional structure of an adhesive tape provided by a possible implementation of the present application, wherein the adhesive tape is a single-sided adhesive tape;
[0019] Figure 2 FIG2 is a schematic diagram of a cross-sectional structure of an adhesive tape provided by another possible implementation of the present application, wherein the adhesive tape is a single-sided adhesive tape;
[0020] Figure 3 FIG2 is a schematic diagram of a cross-sectional structure of an adhesive tape provided by another possible implementation of the present application, wherein the adhesive tape is a single-sided adhesive tape;
[0021] Figure 4 for Figure 1 A schematic cross-sectional structure diagram of a possible implementation of the peeling layer;
[0022] Figure 5 for Figure 1 A schematic cross-sectional structure diagram of another possible implementation of the middle peeling layer;
[0023] Figure 6 for Figure 1 A schematic cross-sectional structure diagram of another possible implementation of the middle peeling layer;
[0024] Figure 7 FIG2 is a schematic diagram of a cross-sectional structure of an adhesive tape provided by another possible implementation of the present application, wherein the adhesive tape is a double-sided adhesive tape;
[0025] Figure 8 Shown is a schematic flow chart of a method for manufacturing an adhesive tape provided by a possible implementation of the present application;
[0026] Figure 9 for Figure 8 A flow chart of a possible implementation of step S4;
[0027] Figure 10 for Figure 8 A flow chart of a possible implementation of step S2;
[0028] Figure 11 Shown is a schematic flow chart of a method for manufacturing an adhesive tape provided by another possible implementation of the present application. DETAILED DESCRIPTION
[0029] In the description of the application, the meaning of "multiple" is at least two, for example two, three, etc., unless otherwise clearly and specifically limited. In the embodiments of the present application, all directional indications (such as up, down, left, right, front, back, top, bottom ...) are only used to explain the relative position relationship, motion situation, etc. between each component under a certain specific posture (as shown in the drawings). If this specific posture changes, this directional indication also changes accordingly. In addition, the terms "comprise" and "have" and any deformation thereof are intended to cover non-exclusive inclusion. For example, the process, method, system, product or equipment comprising a series of steps or units is not limited to the steps or units listed, but optionally also includes the steps or units not listed, or optionally also includes other steps or units inherent to these processes, methods, products or equipment.
[0030] In addition, references to "embodiments" herein mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of such phrases in various places in the specification does not necessarily refer to the same embodiment, nor does it necessarily refer to independent or alternative embodiments that are mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.
[0031] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of this application.
[0032] Because the traditional tapes currently on the market have a relatively smooth and flat surface, when the traditional tapes are die-cut into sheets and stacked in the mold for storage during the die-cutting process, vacuum adsorption will occur between the sheets, causing the sheets to stick together, making it impossible for the robot to grab the sheets and thus making it impossible to perform subsequent operations.
[0033] According to one aspect of the present application, the present application provides a tape 100 to address the above-mentioned problem of sheet adhesion caused by vacuum adsorption. By increasing the surface roughness of the tape 100 to reduce the contact area when the sheets are stacked, the possibility of vacuum formation between the sheets when the sheets are stacked is reduced, thereby improving the die-cutting efficiency and yield and reducing processing costs.
[0034] Figure 1 、 Figure 2 and Figure 3 Figure 1 shows a cross-sectional schematic diagram of an adhesive tape 100 provided in one possible implementation of the present application. The adhesive tape 100 includes a substrate layer 1, a release layer 3, and an adhesive layer 2 positioned between the substrate layer 1 and the release layer 3. The release layer 3 and / or the side of the substrate layer 1 facing away from the adhesive layer 2 are provided with a concave-convex structure A to reduce vacuum absorption between adjacent adhesive tapes 100 when multiple adhesive tapes 100 are stacked.
[0035] The side of the release layer 3 and / or the substrate layer 1 away from the adhesive layer 2 refers to the side in contact with the outside world.
[0036] Figure 1 It is shown that the side of the peeling layer 3 away from the adhesive layer 2 is provided with the concavo-convex structure A, while the side of the base material layer 1 away from the adhesive layer 2 is not provided with the concavo-convex structure A.
[0037] Figure 2 It is shown that the side of the substrate layer 1 away from the adhesive layer 2 is provided with the concavo-convex structure A, while the side of the release layer 3 away from the adhesive layer 2 is not provided with the concavo-convex structure A.
[0038] Figure 3 It shows that the sides of the substrate layer 1 and the peeling layer 3 away from the adhesive layer 2 are both provided with a concave-convex structure A.
[0039] In this implementation, the side of the substrate layer 1 and / or the peeling layer 3 in contact with the outside world is set to the above-mentioned concave-convex structure A to increase the surface roughness of the tape 100, thereby reducing the possibility of vacuum adsorption between the tapes 100 and the tapes 100 when multiple tapes 100 are stacked, thereby solving the above-mentioned sheet adhesion problem.
[0040] Optionally, the concave-convex structure A is configured as a grid and / or stripe and / or texture. This implementation does not limit the specific shape and size of the concave-convex structure A, so long as it can increase the surface roughness of the tape 100 and thereby reduce the possibility of vacuum adsorption.
[0041] In a possible implementation, the peeling layer 3 is a release film.
[0042] Alternatively, as Figure 4 As shown, the side of the peeling layer 3 away from the adhesive layer 2 is set as a concave-convex structure A, and the peeling layer 3 includes a covering layer that fits the concave-convex surface of the concave-convex structure A.
[0043] Specifically, the cover layer is a release layer 32. That is, the release layer 32 is formed by coating the concave-convex surface of the concave-convex structure A with a lubricating release agent, thereby imparting a slippery property to the concave-convex surface. This allows the sheets of tape 100 to slide relative to each other more easily when they are stacked, preventing them from sticking together.
[0044] Specifically, the release layer 32 is a polysiloxane layer. The release agent can be a solvent-based silicone oil or a solvent-free silicone oil.
[0045] Alternatively, as Figure 1 、 Figure 2 、 Figure 3 and Figure 4 As shown, the peeling layer 3 includes a base film 31 forming the above-mentioned concavo-convex structure A and a release layer 32 provided between the base film 31 and the adhesive layer 2 .
[0046] Specifically, the release layer 3 is formed by coating a release agent on the side of the base film 31 that is bonded to the adhesive layer 2 to form a release layer 32 to obtain a light and stable release force, thereby reducing the peeling strength between the release layer 3 and the adhesive layer 2 .
[0047] It is easy to understand that in other possible implementations, the peeling layer 3 may also be a common film without the release layer 32 .
[0048] During the die-cutting process, static electricity may be generated, which may cause static adsorption between the sheets, thereby causing the sheets to stick together. Therefore, in order to further solve the problem of sheet adhesion caused by static adsorption, another possible implementation of the present application provides a tape 100. Figure 4 A schematic cross-sectional structure diagram of the release layer 3 of the adhesive tape 100 is shown.
[0049] Specifically, the side of the peeling layer 3 away from the adhesive layer 2 is provided with a concave-convex structure A, and the peeling layer 3 includes a covering layer that adheres to the concave-convex surface of the concave-convex structure A. The covering layer is an antistatic layer 33 .
[0050] The provision of the antistatic layer 33 makes it difficult for the adhesive tape 100 to generate static electricity during the die-cutting process.
[0051] Specifically, the antistatic layer 33 is formed by coating the concavo-convex surface of the concavo-convex structure A with an antistatic agent.
[0052] Optionally, the antistatic agent is a polythiophene conductive liquid, which is diluted with deionized water or isopropyl alcohol as a diluent and then coated on the concave and convex surface, and then dried in an oven to obtain the antistatic layer 33 .
[0053] Optionally, the covering layer is an antistatic release layer 34 so that the concave-convex surface of the concave-convex structure A has both a smooth property and an antistatic function, thereby more effectively solving the technical problem of sheet adhesion.
[0054] Specifically, the antistatic release layer 34 is formed by coating an antistatic release agent on the concavo-convex surface of the concavo-convex structure A.
[0055] Optionally, the antistatic release agent is an antistatic silicone release agent.
[0056] It is easy to understand, please refer to Figure 4 As shown, the peeling layer 3 can be coated with the above-mentioned antistatic release agent on the side of the base film 31 used for bonding with the adhesive layer 2 to form an antistatic release layer 34. In this way, a light and stable release force can be obtained, and static electricity is not easily generated in the tape 100 during the die-cutting process.
[0057] Figure 5 A schematic diagram of the cross-sectional structure of the peeling layer 3 provided in another possible implementation of the present application is shown, in which the side of the peeling layer 3 away from the adhesive layer 2 is set as a concave-convex structure A, and the peeling layer 3 includes a release layer 32 bonded to the concave-convex surface of the concave-convex structure A, and an antistatic layer 33 bonded to the release layer 32.
[0058] Optionally, the antistatic layer 33 is configured by coating a 0.2-0.8 μm polythiophene conductive liquid on the release layer 32 and drying the resulting liquid.
[0059] It is easy to understand that the reference Figure 4 The composite structure of the concavo-convex structure A of the peeling layer 3 and any one of the release layer 32, the antistatic layer 33 and the antistatic release layer 34 is laminated, and the reference Figure 5 It can be seen from the composite structure of the concavo-convex structure A of the peeling layer 3, the release layer 32 and the antistatic layer 33 stacked in sequence that in other possible implementations, Figure 2 and Figure 3 The concavo-convex structure A of the middle substrate layer 1 may also be superimposed with any one of the composite release layer 32 , the antistatic layer 33 , and the antistatic release layer 34 , or the composite release layer 32 and the antistatic layer 33 may be superimposed in sequence.
[0060] Figure 6A schematic cross-sectional structure diagram of a release layer 3 provided in another possible implementation of the present application is shown. The side of the release layer 3 facing away from the adhesive layer 2 is provided with a concave-convex structure A. The base film 31 of the release layer 3 includes a base layer 311 and a laminate layer 312 that are bonded together. The laminate layer 312 forms the concave-convex structure A. To improve the adhesion between the base layer 311 and the laminate layer 312, a glue layer 313 may be provided between the base layer 311 and the laminate layer 312.
[0061] Optionally, the base layer 311 may be a BOPP layer, a PP layer, a PE layer, or a PET (polyethylene terephthalate) layer.
[0062] Optionally, the coating layer 312 is a polyethylene layer, specifically a mixture of high-density polyethylene and low-density polyethylene. The coating layer 312 can also be a polypropylene layer.
[0063] Specifically, the peeling layer 3 further includes an antistatic release layer 34 , and two opposite surfaces of the antistatic release layer 34 are respectively adhered to the base layer 311 and the adhesive layer 2 .
[0064] Optionally, the antistatic release layer 34 is configured by coating an antistatic organic silicone release agent with a thickness of 0.5-0.8 μm on the second surface of the base layer 311 and performing a drying process thereafter.
[0065] Optionally, the antistatic silicone release agent includes alkenyl polysiloxane, hydrogen polysiloxane, a conductive polymer resin, a binder compound, a platinum catalyst, and an ionic surfactant.
[0066] Figure 7 A schematic cross-sectional structure diagram of an adhesive tape 100 provided in another possible implementation of the present application is shown, where the adhesive tape 100 is a double-sided adhesive tape.
[0067] Specifically, the peeling layer 3 is provided in plurality, and the plurality of peeling layers 3 include a first peeling layer 3a and a second peeling layer 3b; the adhesive layer 2 is provided in plurality, and the plurality of adhesive layers 2 include a first adhesive layer 2a and a second adhesive layer 2b; the first adhesive layer 2a is located between the substrate layer 1 and the first peeling layer 3a, and the second adhesive layer 2b is located between the substrate layer 1 and the second peeling layer 3b; wherein the side of the first peeling layer 3a away from the first adhesive layer 2a and the side of the second peeling layer 3b away from the second adhesive layer 2b are both provided with a concave-convex structure A.
[0068] In a possible implementation, the substrate layer 1 is set to a PET layer, and the thickness of the substrate layer 1 is set to 50 μm; the thickness of the first peeling layer 3a and the second peeling layer 3b are both set to 50 μm; the thickness of the first adhesive layer 2a and the second adhesive layer 2b are both set to 10 μm.
[0069] In a possible implementation, the adhesive layer 2 is configured as an antistatic adhesive layer or a UV viscosity-reducing adhesive layer or an antistatic UV viscosity-reducing adhesive layer.
[0070] Specifically, the adhesive layer 2 is an antistatic UV adhesive layer.
[0071] Specifically, the adhesive layer 2 is configured to be made of the following raw materials in parts by weight: 100 parts of acrylic adhesive, 5-10 parts of UV resin, 3-5 parts of tackifying resin, 1-2 parts of photoinitiator, 0.5-0.8 parts of antistatic agent, 0.5-1 parts of cohesion promoter, 0.5-1 parts of crosslinking agent, 0.05-0.2 parts of antioxidant, and 20-40 parts of solvent.
[0072] Among them, the use of cohesion promoter is to improve the cohesion of adhesive layer 2, reduce the fluidity of adhesive layer 2, and make adhesive layer 2 "hard". In this way, adhesive can be avoided as much as possible from overflowing from adhesive layer 2 at the edge after die-cutting, thereby helping to reduce the sheet adhesion problem caused by die-cutting overflow. At the same time, it is also beneficial to protect the die-cutting tool from adhesive contamination and extend the service life of the tool.
[0073] Among them, the use of antistatic agent is to make the adhesive layer 2 have antistatic function, which is beneficial to reduce the peeling voltage when peeling the peeling layer 3 from the adhesive layer 2 when using the tape 100, and is also beneficial to avoid static electricity during die-cutting, thereby reducing the problem of sheet adhesion caused by electrostatic adsorption.
[0074] The use of the photoinitiator is to enable the adhesive layer 2 to have a UV viscosity-reducing function.
[0075] In order to more clearly describe the structure and beneficial effects of the adhesive tape 100 provided in the present application, the manufacturing method of the adhesive tape 100 is further described below.
[0076] According to another aspect of the present application, the present application provides a method for manufacturing an adhesive tape 100 .
[0077] Figure 8 A schematic flow chart of a method for manufacturing the adhesive tape 100 provided in a possible implementation of the present application is shown.
[0078] Combine Figure 1 、 Figure 2 and Figure 3 As shown, the manufacturing method includes the following steps:
[0079] Step S1: providing a base material layer 1.
[0080] In a specific implementation, the substrate layer 1 is a 50 μm transparent PET substrate.
[0081] Step S2: providing a first adhesive.
[0082] Step S3: coating a first adhesive on the substrate layer 1 and drying the adhesive layer 2;
[0083] In practice, one side of the substrate layer 1 is passed through a corona discharge machine (corona power of 1.2-1.6 kW) to form a corona surface. A coater is then used to apply a 15 μm thick, evenly mixed first adhesive to the corona surface. The adhesive is then dried in a multi-section oven. The oven temperatures for each section are set to 50°C / 70°C / 90°C / 100°C / 110°C / 130°C / 130°C / 110°C / 80°C, with a coater speed of 15-25 m / min.
[0084] Step S4: providing a release layer 3.
[0085] Step S5 : The base material layer 1 and the release layer 3 are bonded together via the adhesive layer 2 .
[0086] In a specific implementation, the adhesive layer 2 dried in an oven is attached to the peeling layer 3 and rolled up to obtain a single-sided adhesive tape.
[0087] Among them, the side of the peeling layer 3 and / or the substrate layer 1 away from the adhesive layer 2 is set as a concave-convex structure A to weaken the vacuum adsorption effect generated between adjacent tapes 100 or between sheets when multiple tapes 100 are stacked or the tapes 100 are die-cut into sheets and stacked.
[0088] In one possible implementation, combining Figure 9 and Figure 5 As shown, the side of the peeling layer 3 away from the adhesive layer 2 is provided with the above-mentioned concave-convex structure A; step S4 (providing the peeling layer 3) includes the following steps:
[0089] Step S41 : coating a release agent on the concavo-convex structure A and performing a drying process to obtain a release layer 32 .
[0090] In a specific implementation, the release agent is polysiloxane, and the thickness of the release layer 32 is 0.001-0.003 mm.
[0091] Step S42 : coating an antistatic agent on the release layer 32 and performing a drying process to obtain an antistatic layer 33 .
[0092] In a specific implementation, the antistatic agent is polythiophene conductive liquid, which is diluted with deionized water or isopropyl alcohol and then coated on the release layer 32 . The thickness of the antistatic layer 33 is 0.2-0.8 μm.
[0093] In one possible implementation, Figure 10 As shown, step S2 (providing the first adhesive) includes the following steps:
[0094] Step S21: 100 parts of acrylic adhesive, 20-40 parts of solvent, 3-5 parts of tackifying resin, 5-10 parts of UV resin, 0.5-0.8 parts of antistatic agent, 0.5-0.8 parts of photoinitiator, 0.5-1 parts of cohesion promoter, 0.5-1 parts of cross-linking agent, and 0.05-0.2 parts of antioxidant are mixed in sequence by weight to obtain a mixture.
[0095] The use of antistatic agent and photoinitiator in process S21 makes the first adhesive have antistatic function and UV viscosity reducing function. At the same time, since the cohesion promoter makes the adhesive layer 2 become "hard", the fluidity of the adhesive layer 2 is reduced, which is beneficial to avoid problems such as sheet adhesion caused by die-cutting overflow and shortened tool life caused by adhesive contamination of die-cutting tools.
[0096] In a specific implementation, the main component of the acrylic adhesive is an acrylic ester copolymer, and the solvent is one or more of ethyl acetate, n-butyl acetate, toluene, vinyl dichloride, and methyl isobutyl ketone. The UV resin is one or more of epoxy-modified acrylic resin, polyurethane-modified acrylic resin, polyester acrylic resin, and elastic modified acrylic resin. The tackifying resin is one of terpene phenolic resin, maleated rosin, and hydrogenated rosin. The photoinitiator is one of BASF IRGACURE 651 and IRGACURE 184. The antistatic agent is one of lithium bis(trifluoromethanesulfonyl)imide, carbon nanotubes, and polyether ester amide. The cohesion promoter is one of butyl cellulose acetate and carboxymethyl cellulose acetate butyrate. The crosslinking agent is one of polyisocyanate, epoxy resin, polyepoxide, and alkoxy metal compound. The oxidizing agent is one of pentaerythritol tetrakis(β-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate), dilauryl thiodipropionate, and distearyl thiodipropionate.
[0097] Step S22: placing the mixture in a blender and stirring it under a yellow light or in the absence of light.
[0098] During specific implementation, the stirring speed is set to 200-400 r / min and the stirring time is set to 30-60 min.
[0099] Step S23: After stirring, a first adhesive is obtained.
[0100] Figure 11 The figure shows a flow chart of a method for manufacturing the adhesive tape 100 provided by a possible implementation of the present application, Figure 7 As shown, the manufacturing method includes the following steps:
[0101] Step B1: providing a substrate layer 1, wherein the substrate layer 1 comprises a first adhesive surface and a second adhesive surface for coating a first adhesive.
[0102] In a specific implementation, the substrate layer 1 is a 50 μm transparent PET substrate.
[0103] Step B2: coating the first adhesive on the first adhesive surface and drying it to form a first adhesive layer 2a.
[0104] In practice, the first adhesive surface of the substrate layer 1 is passed through a corona discharge machine (corona power of 1.2-1.6 kW) to form a corona surface. A coater is then used to apply a 15 μm thick, evenly stirred first adhesive to the corona surface. The adhesive is then dried in a multi-section oven. The oven temperatures for each section are set to 50°C / 70°C / 90°C / 100°C / 110°C / 130°C / 130°C / 110°C / 80°C, with a coater speed of 15-25 m / min.
[0105] Step B3: Providing the first peeling layer 3a.
[0106] Step B4: Laminating the first adhesive surface to the first release layer 3a through the first adhesive layer 2a.
[0107] In a specific implementation, the first adhesive layer 2a dried in an oven is attached to the first peeling layer 3a.
[0108] Step B5: coating the first adhesive on the second adhesive surface and drying it to form a second adhesive layer 2b.
[0109] In practice, the second adhesive surface of the substrate layer 1 is passed through a corona discharge machine (corona power of 1.2-1.6 kW) to form a corona surface. A coater is then used to apply a 15 μm thick, evenly stirred first adhesive to the corona surface. The adhesive is then dried in a multi-section oven. The oven temperatures for each section are set to 50°C / 70°C / 90°C / 100°C / 110°C / 130°C / 130°C / 110°C / 80°C, with a coater speed of 15-25 m / min.
[0110] Step B6: providing the second release layer 3b.
[0111] Step B7: Laminating the second adhesive surface to the second release layer 3b through the second adhesive layer 2b.
[0112] In a specific implementation, the second adhesive layer 2 b that has been dried in an oven is bonded to the second peeling layer 3 b to obtain a semi-finished adhesive tape 100 .
[0113] Step B8: Place the semi-finished adhesive tape 100 in a greenhouse for curing.
[0114] In a specific implementation, the semi-finished adhesive tape 100 is placed in a greenhouse and aged for 48-72 hours to obtain the finished adhesive tape 100. The greenhouse aging conditions are 50° C. and 40-50% humidity.
[0115] Among them, the side of the first peeling layer 3a away from the first adhesive layer 2a and the side of the second peeling layer 3b away from the second adhesive layer 2b are both set as a concave-convex structure A to weaken the vacuum adsorption effect generated between adjacent tapes 100 or between sheets when multiple tapes 100 are stacked or when the tapes 100 are die-cut into sheets and stacked.
[0116] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.
Claims
1. An adhesive tape, characterized in that: include: A 50 μm PET substrate layer, a 50 μm peeling layer, and a 10 μm adhesive layer, wherein the adhesive layer is located between the substrate layer and the peeling layer; the peeling layer and the side of the substrate layer away from the adhesive layer are both configured with a concave-convex structure; the peeling layer comprises a base film having a concave-convex structure and release layers disposed on both sides of the base film; the release layer is formed by coating with a release agent; The adhesive layer is an antistatic UV viscosity-reducing adhesive layer, which is composed of the following raw materials in parts by weight: 100 parts of acrylate copolymer, 5-10 parts of UV resin, 3-5 parts of tackifying resin, 1-2 parts of photoinitiator, 0.5-0.8 parts of antistatic agent, 0.5-1 parts of cohesion promoter, 0.5-1 parts of crosslinking agent, 0.05-0.2 parts of antioxidant, and 20-40 parts of solvent; Wherein, the UV resin is one or more of epoxy modified acrylate resin, polyurethane modified acrylate resin, and polyester acrylate resin; The cohesion promoter is one of cellulose butyl acetate and cellulose carboxymethyl acetate butyrate.
2. The adhesive tape according to claim 1, wherein: The tackifying resin is one of terpene phenolic resin, maleated rosin, and hydrogenated rosin; The antistatic agent is one of lithium bis(trifluoromethanesulfonyl)imide, carbon nanotubes, and polyether ester amide; The cross-linking agent is one of polyisocyanate and polyepoxide; The antioxidant is one of pentaerythritol tetrakis(β-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate), dilauryl thiodipropionate, and distearyl thiodipropionate.
Citation Information
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