Ceramic packaging shell and method for preparing the same

Abstract

The present invention provides a ceramic package shell and a method for preparing the ceramic package shell. The ceramic package shell comprises: a ceramic base and a ceramic cavity fired integrally with the ceramic base, wherein the ceramic cavity is surrounded by ceramic side walls to form a cavity structure with a cavity in the middle, and the cavity is used to assemble the chip to be packaged, and the outer contour of the ceramic side wall is an octagonal prism structure; the ceramic base is adapted to the outer contour of the ceramic side wall, and the side walls spaced apart from each other by the ceramic base are provided with a second metallization layer for external leads. The octagonal ceramic shell side wall metallization prepared by the present invention can be mass-produced in arrays, which can improve the production efficiency of the ceramic shell and the consistency of the product.

Description

Technical Field

[0001] The present invention relates to the technical field of ceramic packaging, and in particular to a ceramic packaging shell and a preparation method of the ceramic packaging shell. Background Art

[0002] As the performance requirements of electronic products continue to increase, ceramic packaging shells are widely used due to their advantages such as good airtightness and high reliability.

[0003] Some chips such as diodes, amplifiers, and limiters have single functions, few leads, and small chips, but the demand is very large. The conventional packaging shell of such chips is a circular ceramic packaging shell, and the diameter of the shell is mostly within 3mm. In order to make the internal and external electrical interconnections of the ceramic shell and enhance the lead welding strength, a dedicated person is required to use a brush to metallize the edges one by one under a microscope. The production efficiency is low and the consistency is poor, and mass production is impossible. Therefore, there is an urgent need for a small ceramic packaging shell processing method that is simple to process and easy to mass produce. Summary of the invention

[0004] The embodiments of the present invention provide a ceramic package shell and a method for preparing the ceramic package shell, so as to solve the problem that the current ceramic package shell manufacturing efficiency is too low and cannot be mass-produced.

[0005] In a first aspect, an embodiment of the present invention provides a ceramic packaging shell, a ceramic base and a ceramic cavity fired integrally with the ceramic base; wherein:

[0006] The ceramic cavity is surrounded by ceramic side walls to form a cavity structure with a cavity in the middle. The cavity is used to assemble the chip to be packaged. The outer contour of the ceramic side walls is an octagonal prism structure.

[0007] The ceramic base is adapted to the outer contour of the ceramic side wall, and the spaced-apart side walls of the ceramic base are all provided with a second metallization layer for external lead wires.

[0008] In a possible implementation, the outer side surfaces of the ceramic side walls are provided with first metallization layers, which are connected to the second metallization layers correspondingly, and the number of first metallization layers is no more than 3; the inner side walls of the ceramic side walls are rounded and form a cavity.

[0009] In a possible implementation, the outer contour of the ceramic base is similar to and corresponds to the upper projection figure of the outer contour of the ceramic side wall.

[0010] Optionally, the upper projection figures of the outer contour of the ceramic cavity and the outer contour of the ceramic base are equal and directly opposite, and the upper projection figures are both regular octagons.

[0011] In a possible implementation, the distance between two opposite sides of the ceramic base is 1.5 mm-5 mm.

[0012] The ceramic packaging shell provided in the embodiment of the present invention is octagonal, similar to the circular ceramic packaging shell. Compared with the circular packaging shell, its side metallization layer is easier to process, easier to electrically interconnect the inside and outside of the shell, and can enhance the welding strength of the leads, thereby realizing mass production.

[0013] In a second aspect, an embodiment of the present invention provides a method for preparing a ceramic package shell, comprising:

[0014] preparing a plurality of first green porcelain strips and a plurality of second green porcelain strips respectively;

[0015] Punching a plurality of first graphic combinations in an array on the first raw porcelain strip, the first graphic combination comprising a circular through hole and four first through grooves arranged around the circular through hole and spaced at a preset interval from the circular through hole, wherein the side surface of the first through groove close to the circular through hole is parallel to a tangent surface of the circular through hole;

[0016] Punching a plurality of second graphic combinations in an array on the second green porcelain strip, the second graphic combination comprising four second through grooves, wherein the positional relationship between the four second through grooves matches the positional relationship between the four first through grooves, and the cross-sections of the first through grooves and the second through grooves are both rectangular;

[0017] Metallization screen printing is performed on the surfaces of the first raw porcelain strip and the second raw porcelain strip respectively, and metallization slurry is printed on the sidewalls of the first through groove and the second through groove respectively to form a first metallization layer and a second metallization layer; wherein, the number of first through grooves provided with the first metallization layer is no more than three;

[0018] Stacking and laminating a plurality of first raw porcelain tape materials and a plurality of second raw porcelain tape materials in a manner that the first through grooves and the second through grooves correspond to each other, to obtain a plurality of whole pieces of raw porcelain tape materials;

[0019] Cutting the plurality of pattern combinations arranged in an array on the whole piece of raw porcelain tape along the preset cutting lines to obtain a plurality of raw porcelain pieces; wherein each group of pattern combinations is provided with two groups of cutting lines, and each cutting line passes through the side surface of a corresponding group of first through grooves close to the circular through hole, so that the raw porcelain piece obtained by cutting includes an octagonal prism ceramic base formed by a plurality of second raw porcelain tapes and an octagonal prism ceramic cavity formed by a plurality of first raw porcelain tapes;

[0020] A plurality of green ceramic parts are sintered, nickel plated, lead wires brazed, and gold plated to form a plurality of ceramic packaging shells.

[0021] In a possible implementation, the cross-sectional shapes of the first through-slot and the second through-slot are equal.

[0022] Optionally, each cutting line forms an angle of 45° with the side surface of the corresponding first through groove close to the circular through hole.

[0023] In a possible implementation, metallization screen printing is performed on the surfaces of the first green porcelain tape and the second green porcelain tape respectively, specifically:

[0024] Performing metallization screen printing on the upper surface of the first raw porcelain strip according to a first preset pattern;

[0025] Performing metallization screen printing on the upper surface of the second raw porcelain strip according to a second preset pattern;

[0026] The lower surface of the second green porcelain strip is metallized by screen printing according to a third preset pattern.

[0027] In a possible implementation, the thickness of the green porcelain piece is in the range of 0.6 mm to 2 mm, and the distance between two opposite sides of the cross section of the green porcelain piece is in the range of 1.5 mm to 5 mm.

[0028] The embodiment of the present invention provides a method for preparing a ceramic package shell, by punching different graphic combinations on a first raw porcelain tape and a second raw porcelain tape, and printing metallization slurry on the through grooves in the graphic combination, and after cutting, the spaced-apart side walls of the obtained ceramic package shell are already provided with metal, and there is no need to outline each surface one by one with a brush under a microscope like a circular ceramic package shell. Leads can be connected below the four spaced-apart metal side walls of the ceramic substrate to enhance the welding strength of the leads. The ceramic package shell prepared by the method provided by the present invention not only saves production time, but also improves the consistency of the product, and can be mass-produced. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0030] Figure 1 It is a schematic diagram of a conventional ceramic package housing and chip assembly structure provided by an embodiment of the present invention;

[0031] Figure 2a yes Figure 1 Schematic diagram of the top view of the conventional packaging shell, Figure 2b yes Figure 2a Right view of;

[0032] Figure 3a is a schematic diagram of a top view of the packaging shell provided by the present invention, Figure 3b yes Figure 3a Right view of;

[0033] Figure 4 is a schematic structural diagram of a first graphic combination provided by an embodiment of the present invention;

[0034] Figure 5 is a schematic structural diagram of a second graphic combination provided by an embodiment of the present invention;

[0035] Figure 6 It is a schematic structural diagram of the first raw porcelain strip material provided in an embodiment of the present invention after metallization screen printing is performed on the upper surface;

[0036] Figure 7 It is a schematic structural diagram of the upper surface of the second green porcelain strip material provided by an embodiment of the present invention after metallization screen printing is performed;

[0037] Figure 8 It is a schematic structural diagram of the lower surface of the second green porcelain strip material provided by an embodiment of the present invention after metallization screen printing is performed;

[0038] Fig. 9 is a schematic diagram of the structure of four first through slots provided in an embodiment of the present invention for printing metallization paste;

[0039] Fig.10 is a schematic diagram of the structure of four second through slots provided in an embodiment of the present invention for printing metallization paste;

[0040] Fig.11 Schematic diagram of a cutting line provided by an embodiment of the present invention.

[0041] In the figure, 10-ceramic base, 11-sidewall metallization layer, 20-ceramic cavity, 21-cavity, 30-lead, 40-chip to be packaged, 201-circular through hole, 202-first through groove, 203-first preset pattern, 204-first metallization layer, 101-second through groove, 102-second preset pattern, 103-third preset pattern, 104-second metallization layer, 500-cutting line. DETAILED DESCRIPTION

[0042] In order to enable people in the technical field to better understand the present solution, the technical solution in the embodiment of the present solution will be clearly described below in conjunction with the drawings in the embodiment of the present solution. Obviously, the described embodiment is an embodiment of a part of the present solution, not all of the embodiments. Based on the embodiments in the present solution, all other embodiments obtained by ordinary technicians in the field without creative work should fall within the scope of protection of the present solution.

[0043] The term "including" and any other variations in the specification and claims of this solution and the above drawings mean "including but not limited to", and is intended to cover non-exclusive inclusions and is not limited to the examples listed in the text. In addition, the terms "first" and "second" are used to distinguish different objects, not to describe a specific order.

[0044] The following is a detailed description of the implementation of the present invention in conjunction with the specific drawings:

[0045] As described in the background art, currently the conventional packaging shell of small chips is a circular ceramic packaging shell, such as Figure 1 , Figure 2a and Figure 2b The schematic diagram of the structure of a conventional circular ceramic package shell is shown, the circular ceramic package shell includes a ceramic base 10 and a ceramic cavity 20, a cavity 21 is provided in the ceramic cavity 20, the cavity 21 is used to assemble the chip 40 to be packaged, and leads 30 are connected to the four side walls 11 of the ceramic base 10. However, since the circular package shell cannot be mass-produced when the side wall 11 is metallized, the production efficiency is too low to meet the production needs. Therefore, a processing method for a small ceramic package shell that is simple to process and convenient for mass production is urgently needed.

[0046] In order to solve the problems in the prior art, an embodiment of the present invention provides a ceramic package shell and a method for preparing the ceramic package shell. The ceramic package shell provided by the embodiment of the present invention is first introduced below.

[0047] The ceramic package shell includes a ceramic base and a ceramic cavity fired integrally with the ceramic base. The ceramic cavity is surrounded by ceramic side walls to form a cavity structure with a cavity in the middle, and the chip to be packaged is mounted in the cavity. The outer contour of the ceramic side wall is an octagonal prism structure. The ceramic base is adapted to the outer contour of the ceramic side wall, and the side walls spaced apart from each other by the ceramic base are provided with a second metallization layer for external leads.

[0048] In some embodiments, in order to enhance the welding strength of the lead wire and the internal and external electrical interconnection, a first metallization layer 204 may be provided on the outer side surface spaced apart by the ceramic side wall, and the number of the first metallization layer 204 may not exceed 3. The first metallization layer 204 and the second metallization layer 104 are connected correspondingly. The inner side wall of the ceramic side wall is a smooth wall and encloses a cavity 21. Of course, the inner side wall of the cavity may also be set to a square shape according to the needs, and the shape of the cavity may be set according to the user's usage scenario.

[0049] In order to facilitate production and improve the production efficiency of the product, the outer contour of the ceramic base 10 and the upper projection figure of the outer contour of the ceramic side wall can be similar and corresponding.

[0050] Of course, the outer contour of the ceramic base 10 is equal to and directly opposite to the upper projection figure of the outer contour of the ceramic side wall, so that the outer contour of the cross section of the ceramic base 10 and the outer contour of the cross section of the ceramic cavity are both regular octagons. The lower surface of the side wall of the ceramic base 10 provided with the second metallization layer 104 is used to connect the leads, that is, 4 leads can be connected.

[0051] Among them, the distance between the two opposite sides of the cross section of the ceramic base 10 can be 1.5mm-5mm. This octagonal ceramic packaging shell can be similar to the existing 1.8mm, 2.0mm and 3.0mm circular ceramic packaging shells. However, compared with the circular packaging shell, its side metallization layer is easier to process, easier to electrically interconnect the inside and outside of the shell, and can enhance the welding strength of the lead wire, which can realize mass production. Of course, the present invention is also applicable to large-sized ceramic packaging shells, and no specific limitation is made here.

[0052] Specifically, a ceramic package shell, please refer to Figure 1 , Figure 3a and Figure 3b , including a ceramic base 10 and a ceramic cavity 20 fired integrally with the ceramic base 10. Among them, the ceramic cavity 20 is a cavity structure surrounded by ceramic side walls with a cavity in the middle, and the chip to be packaged can be assembled in the cavity 21, and the outer contour of the ceramic side wall is an octagonal prism structure. Specifically, the outer contour of the ceramic side wall is a regular octagonal prism structure. A first metallization layer is provided on at most three of the four ceramic side walls of the ceramic cavity that are spaced apart. The outer contour of the ceramic base 10 is equal to and directly opposite to the upper projection figure of the outer contour of the ceramic cavity 20, and both are regular octagons. And a second metallization layer electrically connected to the first metallization layer is provided on the four spaced side walls of the ceramic base 10. The first metallization layer and the second metallization layer can not only enhance the welding strength of the lead, but also realize the internal and external electrical interconnection of the ceramic packaging shell. Mass production of ceramic packaging shells for small chips can be realized.

[0053] The embodiment of the present invention further provides a method for preparing a ceramic package shell, comprising:

[0054] S110. Prepare a plurality of first green porcelain tapes and a plurality of second green porcelain tapes respectively.

[0055] The first green porcelain tape material and the second green porcelain tape material are materials for preparing a ceramic packaging shell, wherein the total thickness range of the first green porcelain tape material and the second green porcelain tape material after stacking is 0.6mm-2mm, and the specific thickness and size of each green porcelain tape material are not limited here, and green porcelain tape materials of different sizes and thicknesses can be selected according to actual usage scenarios.

[0056] S120. Punching a plurality of first graphic combinations in an array on the first green porcelain tape, and punching a plurality of second graphic combinations in an array on the second green porcelain tape.

[0057] like Figure 4 and Figure 5 As shown, the first graphic combination includes a circular through hole 201 and four first through slots 202 arranged around the circular through hole and at a preset interval from the circular through hole, and the cross section of the first through slot 202 is a rectangle. The side of the first through slot 202 close to the circular through hole is parallel to a tangent surface of the circular through hole 201, that is, the long side of the first through slot 202 is at a 45-degree angle with the horizontal line.

[0058] The second graphic combination includes four second through slots 101, and the cross section of the second through slots 101 is also rectangular. The positional relationship between the four second through slots 101 matches the positional relationship of the four first through slots 101. That is, when the four second through slots 101 and the four first through slots 202 are stacked, the long sides of the first through slots 202 and the second through slots 101 close to the circular through hole 201 overlap. Of course, in order to facilitate design and production, the size of the cross section of the first through slot 202 and the second through slot 101 can be set to the same size, so that the four second through slots 101 and the four first through slots 202 can completely overlap when stacked.

[0059] S130. Perform metallization screen printing on the surfaces of the first green porcelain tape and the second green porcelain tape respectively, and perform metallization slurry printing on the sidewalls of the first through groove and the second through groove respectively to form a first metallization layer and a second metallization layer.

[0060] Specifically, metallization screen printing can be performed on the upper surface of the first green ceramic strip according to a first preset pattern, wherein the first preset pattern is as follows: Figure 6 Metallization screen printing is performed on the upper surface of the second raw porcelain strip according to a second preset pattern, and the second preset pattern is as shown in FIG. Figure 7 The lower surface of the second green porcelain strip is metallized by screen printing according to a third preset pattern. The third preset pattern is as shown in FIG. Figure 8 shown.

[0061] Figure 6-8 The pattern after screen printing is the welding position corresponding to the four leads and the welding position corresponding to the chip. All the metallization patterns are used to interconnect the chip to be packaged with the leads and the ceramic package shell.

[0062] The number of first through slots 202 provided with the first metallization layer 204 is no more than three, that is, the number of first through slots 202 provided with the first metallization layer 204 can be 0, 1, 2 or 3. The number of first through slots 202 provided with the first metallization layer 204 can be set according to actual needs and is not limited here.

[0063] Fig. 9The diagram shown is a schematic diagram showing that the number of the first through-grooves 202 containing the first metallization layer 204 is two, and the two first through-grooves 202 are arranged at intervals. Fig.10 The diagram shown is a schematic diagram of printing metallization paste on the sidewall of the second through-groove 101 , to form the second through-groove 101 containing four second metallization layers 104 .

[0064] The cross-sectional shapes of the first through groove and the second through groove are equal.

[0065] S140. Stack and laminate a plurality of first raw porcelain tapes and a plurality of second raw porcelain tapes in a manner that the first through grooves 202 and the second through grooves 101 correspond to each other, to obtain a plurality of whole pieces of raw porcelain tapes.

[0066] The long sides of the first through groove and the second through groove close to the circular through hole can be overlapped. If the cross-sections of the first through groove and the second through groove are of the same size, the four second through grooves and the four first through grooves are completely overlapped when stacked, and then stacked and laminated to obtain multiple pieces of green porcelain tape.

[0067] S150. Cutting the plurality of pattern combinations arranged in an array on the whole piece of raw porcelain tape as separate modules to obtain a plurality of raw porcelain pieces.

[0068] Each group of graphic combinations is provided with two groups of cutting lines, and each group of cutting lines is provided with two parallel cutting lines. Each cutting line passes through the side surface of a corresponding group of first through grooves close to the circular through hole, so that the green porcelain piece obtained by cutting includes an octagonal prism ceramic base formed by a plurality of second green porcelain strips and an octagonal prism ceramic cavity formed by a plurality of first green porcelain strips.

[0069] A variety of green porcelain pieces with different structures can be obtained by using different cutting lines for the whole green porcelain strip. In order to facilitate mass production, the outer contour of the green porcelain piece cut by the cutting line of the present invention is a regular octagon. Of course, different cutting lines can also be designed according to demand to obtain green porcelain pieces of different shapes.

[0070] In order to obtain the outer contour of a regular octagon, each cutting line forms an angle of 45° with the side surface of the corresponding first through groove close to the circular through hole.

[0071] The obtained whole piece of raw porcelain strip is prepared as follows Fig.11 After cutting along the cutting line 500, a plurality of green porcelain pieces with regular octagonal outer contours can be obtained. The cutting line 500 is composed of four lines, two parallel horizontal lines and two parallel vertical lines, and the horizontal lines and the vertical lines are perpendicular.

[0072] The raw ceramic part includes a ceramic base with an octagonal outer contour and a ceramic cavity with an octagonal outer contour, and a cylindrical cavity is provided in the middle of the ceramic cavity, and the cylindrical cavity is used to assemble the packaged chip; wherein, the second metallization layer is printed on the side walls spaced apart from each other, and the first metallization layer is printed on at most three of the four side walls spaced apart from each other of the ceramic cavity, and the first metallization layer is connected to the second metallization layer.

[0073] Optionally, for ease of production, the cross-sectional profile of the ceramic cavity and the cross-sectional profile of the ceramic base can be designed to be the same, both being octagons. The cross-sectional profile of the ceramic cavity and the cross-sectional profile of the ceramic base can also be made to be the same in size, both being regular octagons.

[0074] Specifically, the thickness of the green porcelain piece is in the range of 0.6 mm to 2 mm, and the distance between two opposite sides of the cross section of the green porcelain piece is in the range of 1.5 mm to 5 mm.

[0075] S160. Sintering, nickel-plating, soldering leads, and gold-plating multiple raw ceramic parts to form multiple ceramic packaging shells.

[0076] By subjecting the obtained multiple green ceramic pieces to sintering, nickel plating, soldering leads, and gold plating, multiple prepared octagonal ceramic packaging shells with metalized sides can be obtained.

[0077] The distance between two opposite sides of the cross section of the ceramic base of the prepared ceramic package shell is 1.5 mm to 5 mm, which is similar to the size of a conventional circular ceramic package shell.

[0078] The preparation method provided by the embodiment of the present invention punches different graphic combinations on the first raw porcelain tape and the second raw porcelain tape, and prints the metallization slurry on the through grooves in the graphic combination, and after cutting, the spaced-apart side walls of the obtained ceramic package shell are already provided with metal, and there is no need to outline each surface with a brush under a microscope like a circular ceramic package shell. Leads can be connected below the four spaced-apart metal side walls of the ceramic substrate to enhance the welding strength of the leads. The ceramic package shell prepared by the method provided by the present invention not only saves production time, but also improves the consistency of the product, and can be mass-produced.

[0079] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for preparing a ceramic packaging shell, It is characterized in that include: preparing a plurality of first green porcelain strips and a plurality of second green porcelain strips respectively; Punching a plurality of first graphic combinations in an array on the first green porcelain strip, wherein the first graphic combination includes a circular through hole and four first through grooves arranged around the circular through hole and spaced at a preset interval from the circular through hole, wherein the side surface of the first through groove close to the circular through hole is parallel to a tangent surface of the circular through hole; Punching a plurality of second graphic combinations in an array on the second green porcelain strip, wherein the second graphic combination includes four second through grooves, wherein the positional relationship between the four second through grooves matches the positional relationship between the four first through grooves, and the cross-sections of the first through grooves and the second through grooves are both rectangular; Metallization screen printing is performed on the surfaces of the first raw porcelain strip and the second raw porcelain strip respectively, and metallization slurry is printed on the sidewalls of the first through groove and the second through groove respectively to form a first metallization layer and a second metallization layer; wherein, the number of first through grooves provided with the first metallization layer is no more than three; Stacking and laminating a plurality of the first raw porcelain tape materials and a plurality of the second raw porcelain tape materials in a manner that the first through grooves correspond to the second through grooves to obtain a plurality of whole pieces of raw porcelain tape materials; Cutting the plurality of pattern combinations arranged in an array on the whole piece of raw porcelain tape along preset cutting lines to obtain a plurality of raw porcelain pieces; wherein each group of pattern combinations is provided with two groups of cutting lines, and each cutting line passes through the side surface of a corresponding group of first through grooves close to the circular through hole, so that the raw porcelain piece obtained by cutting includes an octagonal prism ceramic base formed by a plurality of second raw porcelain tapes and an octagonal prism ceramic cavity formed by a plurality of first raw porcelain tapes; the thickness of the raw porcelain piece ranges from 0.6 mm to 2 mm, and the distance between two opposite sides of the cross section of the raw porcelain piece is from 1.5 mm to 5 mm; The plurality of green ceramic parts are sintered, nickel plated, lead wires brazed, and gold plated to form a plurality of ceramic packaging shells.

2. The method for preparing the ceramic package shell according to claim 1, It is characterized in that The cross-sectional shapes of the first through groove and the second through groove are equal.

3. The method for preparing the ceramic package shell according to claim 2, It is characterized in that Each cutting line forms an angle of 45° with the side surface of the corresponding first through groove close to the circular through hole.

4. The method for preparing the ceramic package shell according to claim 1, It is characterized in that The metallization screen printing is performed on the surfaces of the first green porcelain strip and the second green porcelain strip respectively, specifically: Performing metallization screen printing on the upper surface of the first green porcelain strip according to a first preset pattern; Performing metallization screen printing on the upper surface of the second green porcelain strip material according to a second preset pattern; The lower surface of the second green porcelain strip is metallized by screen printing according to a third preset pattern.

5. A ceramic packaging shell, It is characterized in that include: A ceramic base and a ceramic cavity fired integrally with the ceramic base; the ceramic packaging shell is prepared based on the method described in any one of claims 1 to 4; wherein, The ceramic cavity is surrounded by ceramic side walls to form a cavity structure with a hollow center, and the cavity is used to assemble the chip to be packaged, and the outer contour of the ceramic side walls is an octagonal prism structure; The ceramic base is adapted to the outer contour of the ceramic side wall, and the spaced-apart side walls of the ceramic base are each provided with a second metallization layer for external lead wires.

6. The ceramic package as claimed in claim 5, It is characterized in that The outer side surfaces of the ceramic side walls are spaced apart from each other and are provided with first metallization layers, which are correspondingly connected to the second metallization layers, and the number of the first metallization layers is no more than 3; the inner side walls of the ceramic side walls are rounded walls, and surround the cavity.

7. The ceramic package as claimed in claim 5, It is characterized in that The outer contour of the ceramic base is similar to and corresponds to the upper projection figure of the outer contour of the ceramic side wall.

8. The ceramic package as claimed in claim 7, It is characterized in that The upper projection figures of the outer contour of the ceramic cavity and the outer contour of the ceramic base are equal and opposite to each other, and the upper projection figures are both regular octagons.

9. The ceramic package as claimed in claim 5, It is characterized in that The distance between two opposite sides of the cross section of the ceramic base is 1.5 mm-5 mm.

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