A self-circulating cooling packaging substrate

Abstract

The present invention relates to a self-circulating cooling package substrate, comprising: a package substrate having a chip location for mounting a chip; and a phase-change cooling liquid channel disposed within the package substrate and passing through the chip location to exchange heat with the package substrate and the chip located therein. The phase-change cooling liquid channel is configured to accommodate a phase-change cooling liquid and is configured to allow the phase-change cooling liquid to exit the chip location after being heated and return to the chip location after cooling within the package substrate. By providing the phase-change cooling liquid channel within the package substrate for self-circulating cooling, rapid heat dissipation from the substrate is promoted, heat dissipation from high-power devices is optimized, and the service life and reliability of the high-power devices are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and in particular to a self-circulating cooling packaging substrate. Background Art

[0002] As electronic products gradually develop towards higher performance, higher frequency, higher speed, and thinner dimensions, and under the design concept of light, thin, short, small, and multifunctional, various electronic devices are being researched and developed in the direction of high speed, multifunctionality, high power, and small size. As a result, the heat generated per unit volume within the components continues to increase. If the excessive heat cannot be removed, it will affect the operation of the chip, thereby causing a variety of problems in the operation of the equipment.

[0003] If a package substrate fails to provide a rapid heat dissipation channel when mounting a high-power device, it can lead to device failure or even burnout. Commonly used package substrates on the market, when used for high-power device packaging, can cause localized high temperatures if they fail to dissipate heat quickly during operation. This can lead to problems such as desoldering, cracking, and wire breakage, significantly impacting device lifespan and reliability. Summary of the Invention

[0004] The task of the present invention is to provide a self-circulating cooling packaging substrate. By setting a phase change coolant channel in the packaging substrate, self-circulating cooling is achieved to achieve rapid heat dissipation of the substrate, optimize the heat dissipation of high-power devices, and improve the service life and reliability of high-power devices.

[0005] According to the present invention, the aforementioned task is solved by a self-circulating cooling package substrate, which comprises:

[0006] a package substrate having a chip position for mounting a chip; and

[0007] a phase-change cooling liquid channel arranged in the package substrate and passing through the chip position to perform heat exchange with the package substrate and the chip at the chip position, wherein the phase-change cooling liquid channel is used to accommodate a phase-change cooling liquid, and wherein the phase-change cooling liquid channel is configured to enable the phase-change cooling liquid to leave the chip position after being heated and to return to the chip position after being cooled in the package substrate.

[0008] In a preferred embodiment of the present invention, it is provided that the cross-sectional shape of the phase-change coolant channel is curved.

[0009] In another preferred embodiment of the present invention, it is provided that the height of the phase-change coolant channel at the chip position is lower than the height outside the chip position.

[0010] In another preferred embodiment of the present invention, the phase change coolant in the phase change coolant channel is heated and vaporized and leaves the chip position, and flows back to the chip position after cooling in the packaging substrate to reduce the temperature of the chip position of the packaging substrate.

[0011] In another preferred embodiment of the present invention, it is provided that the self-circulation cooling package substrate is used for lead packaging and / or flip-chip packaging.

[0012] In another preferred embodiment of the present invention, the packaging substrate includes a base material layer and PP layers located on the front and back sides of the base material layer.

[0013] In another preferred embodiment of the present invention, it is provided that the phase-change cooling liquid channel is located in the substrate layer and / or the PP layer.

[0014] The present invention has at least the following beneficial effects: the self-circulating cooling packaging substrate disclosed in the present invention, by arranging a phase change coolant channel in the packaging substrate for self-circulating cooling, thereby promoting rapid heat dissipation of the substrate, optimizing the heat dissipation of high-power devices, and improving the service life and reliability of high-power devices; the shape, position and size of the phase change coolant channel can be flexibly set according to the application scenario; the self-circulating cooling packaging substrate is suitable for a variety of packaging structures. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] To further illustrate the above and other advantages and features of various embodiments of the present invention, a more detailed description of various embodiments of the present invention will be presented with reference to the accompanying drawings. It will be understood that these drawings depict only typical embodiments of the present invention and are not to be considered as limiting the scope thereof. In the drawings, for clarity, identical or corresponding parts will be represented by the same or similar reference numerals.

[0016] Figure 1 FIG. 1 shows a top view of a self-circulating cooling package substrate 100 having three phase-change cooling liquid channels according to an embodiment of the present invention;

[0017] Figure 2 FIG2 is a cross-sectional schematic diagram of a self-circulating cooling package substrate 100 having three phase-change cooling liquid channels according to an embodiment of the present invention;

[0018] Figure 3 1 shows a top view of a self-circulating cooling package substrate 200 having one phase-change cooling liquid channel according to one embodiment of the present invention;

[0019] Figure 4 1 shows a cross-sectional schematic diagram of a self-circulating cooling package substrate 200 having one phase-change cooling liquid channel according to one embodiment of the present invention;

[0020] Figure 5A schematic cross-sectional view of a wire-bonded package structure 300 with a self-circulating cooling package substrate according to an embodiment of the present invention is shown; and

[0021] Figure 6 FIG. 4 is a cross-sectional view of a flip-chip package structure 400 with a self-circulating cooling package substrate according to an embodiment of the present invention. DETAILED DESCRIPTION

[0022] It should be noted that components in the drawings may be shown exaggerated for illustrative purposes and are not necessarily true to scale.

[0023] In the present invention, each embodiment is only intended to illustrate the aspects of the present invention and should not be construed as limiting.

[0024] In the present invention, unless otherwise specified, the quantifiers "a" and "an" do not exclude the presence of multiple elements.

[0025] It should also be pointed out that in the embodiments of the present invention, for the sake of clarity and simplicity, only a portion of the parts or components may be shown, but a person skilled in the art will understand that under the teachings of the present invention, the required parts or components may be added according to the needs of the specific scenario.

[0026] It should also be pointed out that within the scope of the present invention, the terms "same", "equal", "equal to" and the like do not mean that the two values ​​are absolutely equal, but allow a certain reasonable error, that is, the terms also cover "substantially the same", "substantially equal", and "substantially equal to".

[0027] It should also be noted that in the description of the present invention, the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer" and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate description and simplify the present invention. They do not explicitly or implicitly state that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0028] In addition, the embodiments of the present invention describe the process steps in a specific order, but this is only for the convenience of distinguishing the steps, and does not limit the order of the steps. In different embodiments of the present invention, the order of the steps can be adjusted according to the adjustment of the process.

[0029] Figure 1FIG. 1 shows a top view of a self-circulating cooling package substrate 100 having three phase-change cooling liquid channels according to an embodiment of the present invention; Figure 2 FIG. 1 is a cross-sectional schematic diagram of a self-circulating cooling package substrate 100 having three phase-change cooling liquid channels according to an embodiment of the present invention.

[0030] like Figure 1 As shown, a self-circulating cooling package substrate 100 includes a package substrate 101 and a phase-change coolant channel 102. Package substrate 101 has a chip location for mounting a chip, and chip 01 is mounted on the chip location of package substrate 101. Phase-change coolant channel 102 is located in package substrate 101 and passes through the chip location, enabling heat exchange with the package substrate and the chip at the chip location. Phase-change coolant channel 102 includes three phase-change coolant channels, the middle of which is interconnected. Phase-change coolant channels 102 are fabricated during the package substrate processing process, and phase-change coolant is added to the phase-change coolant channels 102. The phase-change coolant in the central region of package substrate 100 (the chip location) is vaporized by heat and diffuses around the package substrate along flow directions 001, 002, 003, 004, 005, and 006. After condensing into liquid, it flows along flow directions 007, 008, 009, 010, 011, and 012 to the central region of the package substrate.

[0031] like Figure 2 As shown, the phase-change coolant channel 102 can be located in the PP layer 1011, the substrate layer 1012, or both layers 1011 and 1012 of the package substrate 100. A single phase-change coolant channel 102 can be located entirely within the PP layer 1011 and the substrate layer 1012, or can exist in both layers simultaneously. The phase-change coolant channel 102 has a curved cross-section, and its height in the central region of the package substrate (where the chip is located) is lower than its height around the perimeter of the package substrate. This structure allows the phase-change coolant in the phase-change coolant channel to vaporize upon heating and diffuse around the package substrate, thereby lowering the temperature around the chip on the package substrate. The vaporized phase-change coolant gas condenses within the channel around the package substrate and flows back to the chip on the package substrate, repeating this cycle to achieve rapid heat dissipation from the package substrate.

[0032] Figure 3 1 shows a top view of a self-circulating cooling package substrate 200 having one phase-change cooling liquid channel according to one embodiment of the present invention; Figure 4 FIG. 1 is a cross-sectional schematic diagram of a self-circulating cooling package substrate 200 having one phase-change cooling liquid channel according to an embodiment of the present invention.

[0033] like Figure 3As shown, a self-circulating cooling package substrate 200 with one phase change coolant channel includes a package substrate 201 and a phase change coolant channel 202. The package substrate 201 has a chip position for mounting a chip, and the chip 002 is mounted at the chip position of the package substrate 201. The phase change coolant channel 202 is located in the package substrate 201 and passes through the chip position, and can exchange heat with the package substrate and the chip at the chip position. The phase change coolant channel 202 is manufactured during the processing of the package substrate, and a phase change cooling liquid is added to the phase change coolant channel 202. The phase change coolant located in the middle area (chip position) of the package substrate 200 is vaporized by heat and diffuses to the surrounding areas of the package substrate along the flow direction 004. After condensing into liquid, it flows to the middle area of ​​the package substrate along the flow direction 005.

[0034] like Figure 4 As shown, the phase-change coolant channel 202 located in the package substrate 200 has a curved cross-section. The height of the phase-change coolant channel 202 in the center region of the package substrate (where the chip is located) is lower than the height of the surrounding region, forming a spiraling shape. The phase-change coolant channel 202 can be located in the PP layer 2011, the base material layer 2012, or both layers. A single phase-change coolant channel 202 can be located entirely within the PP layer 2011 and the base material layer 2012, or even within both layers. This structure allows the phase-change coolant within the phase-change coolant channel to vaporize upon heating and diffuse around the package substrate, thereby reducing the temperature at the chip location on the package substrate. The vaporized phase-change coolant gas condenses within the channel surrounding the package substrate and flows back to the chip location on the package substrate, repeating this cycle to achieve rapid heat dissipation from the package substrate.

[0035] Figure 5 FIG. 3 is a cross-sectional view of a wire-bonded package structure 300 with a self-circulating cooling package substrate according to an embodiment of the present invention.

[0036] like Figure 5 As shown, the wire bonding structure 300 with self-circulating cooling package substrate includes: a package substrate 301 , wherein the package substrate 301 has a phase change cooling liquid channel 306 .

[0037] The chip 302 is located on the package substrate 301 , and a pad 3021 is provided on the front surface of the chip 302 .

[0038] The metal interconnection line 303 is located on the front surface of the package substrate 301 and extends to the back surface of the package substrate 301 .

[0039] The bonding wires 304 connect the pads 3021 on the front surface of the chip 302 and the metal interconnection lines 303 on the front surface of the package substrate 301 .

[0040] The bumps 305 are electrically connected to the backside metal interconnection lines 303 extending to the package substrate 301 .

[0041] The package substrate 301 includes a phase-change coolant channel 306. This channel 306 is generally curved, with the height of the channel 306 in the center region of the package substrate (where the chip is located) lower than the height of the channels surrounding the package substrate. When the chip 302 operates, heat is generated, raising the temperature of the center region. The phase-change coolant in the channel 306 vaporizes in response to the heat and diffuses along the 004 direction around the package substrate. The gas condenses within the channels surrounding the package substrate and flows back to the center region of the package substrate 302. This cycle repeats, achieving rapid heat dissipation from the package substrate.

[0042] Figure 6 FIG. 4 is a cross-sectional view of a flip-chip package structure 400 with a self-circulating cooling package substrate according to an embodiment of the present invention.

[0043] like Figure 6 As shown, the flip-chip package structure 400 with a self-circulating cooling package substrate includes: a package substrate 401, wherein the package substrate 401 includes a base material layer 4011 located in the middle, a first PP layer 4012 located on the front side of the base material layer 4011, a second PP layer 4013 and a third PP layer 4014 and a fourth PP layer 4015 located on the back side of the base material layer 4011 and a first metal layer 4016 located between the third PP layer 4014 and the fourth PP layer 4015.

[0044] The first metal interconnection line 402 is located between the first PP layer 4012 and the second PP layer 4013 , passes through the second PP layer 4013 , the substrate layer 4011 , the third PP layer 4014 , the first metal layer 4016 and the fourth PP layer 4015 , and extends to the back side of the fourth PP layer 4015 .

[0045] The second metal interconnection line 403 is located on the packaging substrate 401 , passes through the packaging substrate 401 , and extends to the back side of the fourth PP layer 4015 .

[0046] The third metal interconnection line 404 is located on the package substrate 401 and passes through the first PP layer 4012 to be electrically connected to the first metal interconnection line 402 .

[0047] The chip 405 is located on the package substrate 401 and is electrically connected to the second metal interconnection line 403 and the third metal interconnection line 404 .

[0048] The bump 406 is located on the back side of the package substrate 401 and is electrically connected to the first metal interconnection line 402 and the second metal interconnection line 403 .

[0049] The base layer 4011 of the package substrate 401 includes a phase-change coolant channel 406. The phase-change coolant channel 406 is generally curved, and the height of the phase-change coolant channel 406 in the central region of the base layer 4011 is lower than the height of the phase-change coolant channels surrounding the base layer 4011. When the chip 302 operates, the heat generated causes the temperature of the central region (where the chip is located) of the underlying package substrate 4011 to rise. The phase-change coolant in the phase-change coolant channel 406 is vaporized by the heat and diffuses along the 004 direction to the periphery of the package substrate. The gas condenses in the phase-change coolant channels surrounding the base layer 4011 and flows back to the central region of the base layer 4011. This cycle repeats, thereby achieving rapid heat dissipation from the package substrate.

[0050] The present invention has at least the following beneficial effects: the self-circulating cooling packaging substrate disclosed in the present invention, by arranging a phase change coolant channel in the packaging substrate for self-circulating cooling, thereby promoting rapid heat dissipation of the substrate, optimizing the heat dissipation of high-power devices, and improving the service life and reliability of high-power devices; the shape, position and size of the phase change coolant channel can be flexibly set according to the application scenario; the self-circulating cooling packaging substrate is suitable for a variety of packaging structures.

[0051] Although certain embodiments of the present invention have been described in this application, those skilled in the art will appreciate that these embodiments are provided by way of example only. Numerous variations, alternatives, and modifications will be contemplated by those skilled in the art in light of the teachings of this disclosure without departing from the scope of the present invention. The appended claims are intended to define the scope of the present invention and are intended to encompass methods and structures within the scope of these claims and their equivalents.

Claims

1. A self-circulating cooling package substrate, comprising: a package substrate having a chip position for mounting a chip; as well as a phase-change cooling liquid channel arranged in the package substrate and passing through the chip position to perform heat exchange with the package substrate and the chip at the chip position, wherein the phase-change cooling liquid channel is used to accommodate a phase-change cooling liquid, and wherein the phase-change cooling liquid channel is configured to allow the phase-change cooling liquid to leave the chip position after being heated and to return to the chip position after being cooled in the package substrate; the height of the phase-change cooling liquid channel at the chip position is lower than the height outside the chip position; The packaging substrate includes a base material layer and PP layers located on the front and back sides of the base material layer; the phase-change cooling liquid channel is located in the base material layer and / or the PP layer.

2. The self-circulating cooling package substrate according to claim 1, characterized in that: The cross-sectional shape of the phase-change coolant channel is curved.

3. The self-circulating cooling package substrate according to claim 1, wherein: The phase-change coolant in the phase-change coolant channel evaporates due to heat and leaves the chip position, and flows back to the chip position after cooling in the packaging substrate to reduce the temperature of the chip position of the packaging substrate.

4. The self-circulating cooling package substrate according to claim 1, wherein: The self-circulation cooling package substrate is used for lead packaging and / or flip-chip packaging.

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