Substrate position detection method, drawing method, substrate position detection device and drawing device
The method of dividing substrate elements into rectangles and using pattern matching with line segments addresses the challenge of irregular corners in semiconductor packaging, ensuring accurate substrate position detection.
CN114253095BActive Publication Date: 2024-12-20SCREEN HOLDINGS CO LTD
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Patent Information
- Application Number
- CN202111107330.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2020-09-23
- Filing Date
- 2021-09-22
- Publication Date
- 2024-12-20
- Estimated Expiration
- 2041-09-22
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Figure CN114253095B_ABST
Abstract
The present invention provides a substrate position detection method, comprising: a process of maintaining a substrate having a plurality of substrate elements (step S11), wherein the plurality of substrate elements are respectively divided into rectangles by predetermined grid-shaped dividing lines; a process of respectively photographing two or more selected substrate elements selected from the plurality of substrate elements and acquiring two or more photographed images (step S12); a process of performing pattern matching on each of the two or more photographed images using a standard image, thereby respectively finding the positions of the two or more selected substrate elements, and detecting the position of the substrate (step S13), wherein the plurality of substrate elements respectively have a pattern area having a prescribed pattern formed on the inner side of the outer edge of a roughly rectangular area. The standard image is a collection of line segments set by removing corners from each side of the outer edge of the area. Thus, the position detection of the substrate can be performed easily and with high accuracy.
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