Substrate processing apparatus

Abstract

Disclosed is a substrate processing apparatus. The substrate processing apparatus includes an indexing unit including a load tank in which a container is installed and an indexing chamber connected to the load tank, and a processing execution unit having a load lock chamber connected to the indexing chamber and a processing chamber processing a substrate transferred to the load lock chamber, the indexing unit further including an alignment unit provided in the indexing chamber and aligning a substrate type sensor transferred to the processing chamber.

Description

BACKGROUND

[0001] Embodiments of the inventive concept described herein relate to a substrate processing apparatus.

[0002] Plasma refers to an ionized gaseous including ions, radicals, and electrons. Plasma is generated by a very high temperature, a strong electric field, or a radio frequency (RF) electromagnetic field. A semiconductor device manufacturing process can include an etching process for removing a thin film formed on a substrate such as a wafer by using plasma. The etching process is performed when ions and / or radicals included in the plasma collide with or react with the thin film on the substrate.

[0003] A substrate processing apparatus using plasma includes a processing chamber of a vacuum atmosphere, a support chuck supporting a substrate in the processing chamber, and a focus ring surrounding an outer periphery of the substrate seated on the support chuck. The focus ring is installed to distribute plasma with high uniformity and to etch with plasma together with the substrate. When the substrate is repeatedly etched, the focus ring is also etched so that a shape of the focus ring is gradually changed. A direction in which ions and / or radicals are input to the substrate is changed according to the change of the shape of the focus ring, and thus an etching characteristic of the substrate is changed. Therefore, when a certain number or more of substrates are etched or the shape of the focus ring is changed to deviate from an allowable range, the focus ring needs to be replaced.

[0004] To replace the focus ring, a transfer robot takes out a used focus ring from the processing chamber and brings the focus ring into a ring cassette, and then takes out a new focus ring from the ring cassette and brings the focus ring into the processing chamber. Then, it is important for the transfer robot to seat the new focus ring at a desired position in the processing chamber correctly. This is because when the position of the new focus ring is not appropriate, processing of the substrate using plasma cannot be performed correctly.

[0005] Therefore, in order to identify whether the focus ring is seated in the processing chamber correctly, a wafer-type sensor having a shape similar to a substrate processed in the processing chamber is used. The wafer-type sensor has the same or slightly larger diameter as the substrate to be processed as an object. Therefore, the wafer-type sensor can be transferred by a transfer robot that transfers the substrate to be processed as an object. Further, the wafer-type sensor is provided with an image acquisition module (e.g., a camera or the like) that can acquire an image in an inside of the processing chamber. Therefore, when the wafer-type sensor is brought into the processing chamber, the image acquisition module of the wafer-type sensor can acquire an image in the inside of the processing chamber. Further, a user can identify whether the focus ring positioned in the processing chamber is seated at a desired position through the image acquired by the wafer-type sensor. Further, the wafer-type sensor is used for automatic teaching of the transfer robot.

[0006] In this way, in order to accurately recognize the positioning position of the focus ring by using the wafer type sensor and precisely perform the automatic teaching of the transfer robot, it is important to accurately ensure the centering of the wafer type sensor. For example, it is important to properly align the position of the notch formed in the wafer type sensor and the position at which the wafer type sensor is positioned on the transfer hand. To achieve this, a wafer type sensor dedicated container (for example, a wafer type sensor dedicated front opening unified pod (FOUP)) having a structure that aligns the notch of the wafer type sensor or centers the wafer type sensor is generally used.

[0007] However, in this case, the wafer type sensor cannot be aligned after it is taken out of the wafer type sensor dedicated container. In addition, a dedicated container having a structure that can align the wafer type sensor needs to be separately manufactured. Furthermore, there is a limitation in the use of the dedicated container for substrate processing apparatuses having different process environments and facility structures. SUMMARY

[0008] Embodiments of the inventive concept provide a substrate processing apparatus capable of effectively aligning a substrate type sensor.

[0009] Embodiments of the inventive concept also provide a substrate processing apparatus capable of effectively acquiring an image of the inside of a process chamber.

[0010] Embodiments of the inventive concept also provide a substrate processing apparatus capable of effectively performing automatic teaching of a transfer robot.

[0011] Aspects of the inventive concept are not limited to this and other unmentioned aspects of the present inventive concept will be clearly understood by those skilled in the art from the following description.

[0012] The inventive concept provides a substrate processing apparatus. The substrate processing apparatus includes a indexing unit including a load tank in which a container is installed and an indexing chamber connected to the load tank, and a process execution unit having a load lock chamber connected to the indexing chamber and a process chamber that processes a substrate transferred to the load lock chamber, the indexing unit further including an alignment unit provided in the indexing chamber and aligning a substrate type sensor transferred to the process chamber.

[0013] According to one embodiment, the alignment unit can include a support member that supports the substrate type sensor, and a sensor member that senses whether a notch formed in the substrate type sensor is aligned.

[0014] According to one embodiment, the support member can include a positioning part that moves the substrate-type sensor supported by the support member in a first direction and / or a second direction perpendicular to the first direction when viewed from the top, a support plate having a support surface that supports the substrate-type sensor, and a rotation shaft that rotates the support plate.

[0015] According to one embodiment, the support plate can have a suction hole that performs vacuum suction on the substrate-type sensor supported by the support surface.

[0016] According to one embodiment, the alignment unit can further include a pressure reduction member that reduces pressure in the suction hole.

[0017] According to one embodiment, the sensor member can include an irradiation part that irradiates light and a light-receiving part that receives the light irradiated by the irradiation part.

[0018] According to one embodiment, the indexing unit can further include a first transfer robot that is disposed in the indexing chamber and takes out the substrate-type sensor from the container.

[0019] According to one embodiment, the substrate processing apparatus can further include a controller, and the controller can be configured to take out the substrate-type sensor from the container and place the substrate-type sensor on the support plate, and control the first transfer robot and the alignment unit to align the substrate-type sensor by changing a position of the support plate and / or rotating the support plate.

[0020] According to one embodiment, the controller can be configured to control the first transfer robot to transfer the substrate-type sensor to the load lock chamber when the alignment unit has completely aligned the substrate-type sensor.

[0021] According to one embodiment, the controller can be configured to control the first transfer robot to transfer the substrate-type sensor placed on the support plate to the container when it is determined that the alignment unit is impossible to align the substrate-type sensor.

[0022] According to one embodiment, the controller can be configured to determine that the alignment unit is impossible to align the substrate-type sensor when gas flows in a pressure reduction line connected to the suction hole for a preset period of time or more.

[0023] According to one embodiment, the controller can be configured to determine that the alignment unit is impossible to align the substrate-type sensor when the sensor member does not sense the notch even if the substrate-type sensor is rotated by a preset angle or more.

[0024] The present inventive concept provides a substrate processing apparatus. The substrate processing apparatus includes a processing chamber having a processing space for processing a substrate; an indexing chamber connected to a load lock in which a container is installed, a substrate type sensor that acquires an image of the processing space is received in the container, and the indexing chamber maintains an internal atmosphere under an atmospheric atmosphere; at least one transfer robot that transfers the substrate or the substrate type sensor between the indexing chamber and the processing chamber; and an alignment unit disposed in the indexing chamber and aligning the substrate type sensor.

[0025] According to one embodiment, the substrate processing apparatus can further include a controller, and the controller can be configured to take out the substrate type sensor from the container and transfer the substrate type sensor to the alignment unit, and control the transfer robot and the alignment unit so that the alignment unit aligns a position of a notch formed in the substrate type sensor.

[0026] According to one embodiment, the controller can be configured to control the transfer robot to transfer the substrate type sensor to the processing chamber when the alignment unit has completely aligned the position of the notch.

[0027] According to one embodiment, the controller can be configured to control the transfer robot to transfer the substrate type sensor to the container when it is determined that the alignment unit is impossible to align the position of the notch.

[0028] According to one embodiment, the controller can be configured to determine that the alignment unit is impossible to align the position of the notch when a gas flows in a pressure reduction line connected to a suction hole included in the alignment unit and performing vacuum suction on the substrate type sensor for a preset period of time or more.

[0029] According to one embodiment, the controller can be configured to determine that the alignment unit is impossible to align the position of the notch when a sensor member included in the alignment unit and sensing the notch does not sense the notch even when the alignment unit rotates the substrate type sensor by a preset angle or more.

[0030] The present inventive concept provides a substrate processing apparatus. The substrate processing apparatus includes a indexing unit including a load tank in which a container in which a substrate and a substrate type sensor having an image acquisition module are received is installed, a process performing unit having a process chamber in which the substrate is processed, and a controller, and the indexing unit includes an indexing chamber connected to the load tank and maintained under an atmospheric atmosphere, an alignment unit disposed in the indexing chamber and aligning the substrate type sensor, and a first transfer robot transferring the substrate or the substrate type sensor between the indexing chamber and the process performing unit, the process performing unit includes a load lock chamber contacting the indexing chamber and an internal atmosphere of which is converted between a vacuum pressure atmosphere and the atmospheric atmosphere, a transfer chamber contacting the load tank and an internal atmosphere of which is maintained under the vacuum pressure atmosphere, and a second transfer robot disposed in the transfer chamber and transferring the substrate brought into the load tank or the substrate type sensor to the process chamber, and the alignment unit includes a support plate having a support surface supporting the substrate type sensor and having a suction hole for vacuum suction of the substrate type sensor supported on the support surface, a rotation shaft rotating the support plate, a positioning part moving the substrate type sensor supported by the support plate in a first direction and / or a second direction perpendicular to the first direction when viewed from the top, an irradiation part irradiating light, and a sensor member receiving the light irradiated by the irradiation part and sensing a notch formed in the substrate type sensor.

[0031] According to one embodiment, the controller can be configured to control the first transfer robot to take out the substrate type sensor from the container and install the substrate type sensor on the support plate, control the alignment unit to align the substrate type sensor by changing a position of the support plate and / or rotating the support plate, control the first transfer robot to transfer the substrate type sensor to the load lock chamber when the alignment unit has completely aligned the substrate type sensor, and control the first transfer robot to transfer the substrate type sensor installed on the support plate to the container when it is determined that the alignment unit is impossible to align the substrate type sensor, and the controller can be configured to determine that the alignment unit is impossible to align the substrate type sensor when a gas flows in a pressure reduction line connected to the suction hole for a preset period of time or more or when the sensor member does not sense the notch even if the substrate type sensor is rotated by a preset angle or more. BRIEF DESCRIPTION OF DRAWINGS

[0032] The above and other objects and features will become more apparent from the following description taken in conjunction with the accompanying drawings, wherein:

[0033] Figure 1 is a plan view schematically showing a substrate processing apparatus according to an embodiment of the present inventive concept;

[0034] Figure 2 is a view showing a first container of Figure 1 ;

[0035] Figure 3 is a view showing a door of Figure 2 ;

[0036] Figure 4 is a view showing an example of a support slot and an alignment block of Figure 2 ;

[0037] Figure 5 is a view showing a ring member seated on a support portion of Figure 2 ;

[0038] Figure 6 is a view showing a carrier seated in a container and a carrier support structure supporting the carrier;

[0039] Figure 7 is a view showing a second container of Figure 1 ;

[0040] Figure 8 is a view showing a substrate processing apparatus disposed in a processing chamber of Figure 1 .

[0041] Figure 9 is a view showing a state in which a substrate-type sensor enters a processing space of Figure 8 ;

[0042] Figure 10 is a view showing an example of an internal image of a processing space acquired by a substrate-type sensor of the present inventive concept;

[0043] Figure 11 is a view showing another example of an internal image of a processing space acquired by a substrate-type sensor of the present inventive concept;

[0044] Figure 12 is a view showing an alignment unit of Figure 1 ;

[0045] Figure 13 is a view of an alignment unit of Figure 12 when viewed from the top;

[0046] Figure 14 is a flowchart illustrating a transfer sequence of a substrate-type sensor according to an embodiment of the inventive concept; and

[0047] Figure 15 is a view schematically illustrating a state in which a substrate processing apparatus transfers a substrate-type sensor according to an embodiment of the inventive concept. DETAILED DESCRIPTION

[0048] Hereinafter, exemplary embodiments of the inventive concept will be described in detail with reference to the accompanying drawings so that one of ordinary skill in the art to which the inventive concept pertains can easily practice the inventive concept. The inventive concept may, however, be implemented in various different forms and is not limited to the embodiments set forth herein. In addition, in describing the embodiments of the inventive concept, detailed descriptions of related known functions or configurations will be omitted when it is determined that such descriptions can unnecessarily obscure the inventive concept. Furthermore, in the entire disclosure of the drawings, the same reference numerals are used for the parts that play substantially the same roles.

[0049] The expression "comprising" some elements means that other elements can be further included without excluding another element unless specifically contradicted. In detail, the terms "comprising" and "having" are used to indicate that the features, numbers, steps, operations, elements, parts, or combinations thereof described in the specification are present, and it can be understood that one or more other features, numbers, steps, operations, elements, parts, or combinations thereof can be added.

[0050] Unless otherwise indicated, the singular forms "a," "an," and "the" can include plural references. Also, in the drawings, the shapes and sizes of elements can be exaggerated for the sake of more clear description.

[0051] Terms such as first and second can be used to describe various elements, but the elements are not limited by the terms. The terms can be used only for the purpose of distinguishing one element from another element. For example, a first element can be referred to as a second element, and similarly, a second element can be referred to as a first element without departing from the scope of the inventive concept.

[0052] When it is mentioned that one element is "connected to" or "electrically connected to" another element, it should be understood that the first element can be directly connected or electrically connected to the second element, but a third element can be provided therebetween. On the other hand, when it is mentioned that one element is "directly connected to" or "directly electrically connected to" another element, it should be understood that there is no third element therebetween. It should be understood that other expressions describing the relationship between elements, such as "between," "directly between," "adjacent to," and "directly adjacent to," can have the same purpose.

[0053] Also, unless otherwise defined, all terms (including technical or scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the inventive concept belongs. Terms defined in a general dictionary should be interpreted to have meanings consistent with the context in the relevant technology, and should not be interpreted to have ideal or excessively formal meanings unless clearly defined in the specification of the present disclosure.

[0054] Hereinafter, reference will be made to Figures 1 to 15 Embodiments of the inventive concept are described.

[0055] Figure 1 is a plan view schematically showing a substrate processing apparatus according to an embodiment of the inventive concept. Reference will be made to Figure 1 The substrate processing apparatus 1000 according to an embodiment of the inventive concept can include a indexing unit 100, a process performing unit 300, and a controller 700. The indexing unit 100 and the process performing unit 300 can be arranged along a first direction "X" when viewed from the top. Hereinafter, a direction perpendicular to the first direction "X" when viewed from the top is defined as a second direction "Y". Also, a direction perpendicular to the first direction "X" and the second direction "Y" is defined as a third direction "Z". Here, the third direction "Z" can refer to a direction perpendicular to the ground.

[0056] The indexing unit 100 can include a load lock 110, an indexing chamber 130, a first transfer robot 150, a side buffer 170, and an alignment unit 600.

[0057] The containers 200a, 200b, and 200c can be installed in the load lock 110. Various types of containers 200a, 200b, and 200c can be installed in the load lock 110. For example, various types of containers 200a, 200b, and 200c receiving different articles can be installed in the load lock 110. For example, a ring member "R", which will be described hereinafter, transferred to the process chamber 370, and / or a carrier "C" for transferring the ring member "R" can be received in the first container 200a among the containers 200a, 200b, and 200c. Also, a substrate type sensor WS, which will be described hereinafter, can be received in the second container 200b. Also, a substrate "W" (for example, a wafer), which is a to-be-processed object processed in the process chamber 370, can be received in the third container 200c.

[0058] However, the inventive concept is not limited thereto, but at least any one of the ring member "R", the carrier "C", the substrate type sensor WS, and the substrate "W" can be received in the first container 200a. Similarly, at least any one of the ring member "R", the carrier "C", the substrate type sensor WS, and the substrate "W" can also be received in the second container 200b and the third container 200c.

[0059] The containers 200a, 200b, and 200c can be transferred to the load pot 110 so as to be loaded in the load pot 110 or unloaded from the load pot 110 by a container transfer apparatus, and can be transferred. The container transfer apparatus can be an overhead transport apparatus (hereinafter, referred to as OHT), but the inventive concept is not limited thereto, and the containers 200a, 200b, and 200c can be transferred by various apparatuses that transfer the containers 200a, 200b, and 200c. In addition, an operator can directly load the containers 200a, 200b, and 200c into the load pot 110 or unload the containers 200a, 200b, and 200c installed in the load pot 110 from the load pot 110.

[0060] Figure 2 is a view illustrating Figure 1 a first container. Referring to Figure 2 , the first container 200a can include a housing 210a, a flange 220a, a gripping portion 230a, a door 240a, a support portion 250a, and a carrier support structure 270a.

[0061] The housing 210a can have an internal space. At least one of the ring member "R" and the carrier "C" can be received in the internal space of the housing 210a. The flange 220a can be installed on an upper surface of the housing 210a. The flange 220a can be gripped by a gripping portion of a container transfer apparatus, for example, an overhead transfer (OHT) apparatus.

[0062] In addition, the gripping portion 230a can be installed on a side surface of the housing 210a. The gripping portion 230a can be installed on opposite side surfaces of the housing 210a. The gripping portion 230a can be a handle that allows an operator to grip the first container 200a. Accordingly, the operator can grip the gripping portion 230a to directly install the first container 200a in the load pot 110 or separate the first container 200a from the load pot 110.

[0063] The door 240a can selectively open and close the internal space of the housing 210a. The door 240a can be combined with the housing 210a to form the internal space. The door 240a can be in contact with or detached from a front surface of the housing 210a. As Figure 3 illustred, one surface of the door 240a facing the internal space of the housing 210a can be provided with a retainer 242a that clamps the ring member "R" received in the internal space. The retainer 242a can have a structure extending in an upward / downward direction. The retainer 242a can clamp one side of the ring member "R" received in the internal space, and can restrict a change in the position of the ring member "R" received in the internal space.

[0064] Referring again to Figure 2 , a support portion 250a can be disposed in the inner space of the housing 210a. The support portion 250a can support the ring member "R" in the inner space of the housing 210a. The support portion 250a can include a support slot 252a, a separation plate 256a, and an alignment block 260a.

[0065] The support slot 252a can support the ring member "R". The support slot 252a can support a bottom surface of an edge region of the ring member "R". For example, the support slot 252a can support at least a portion of the bottom surface of the edge region of the ring member "R". Also, the support slot 252a can support one side and an opposite side of the bottom surface of the edge region of the ring member "R".

[0066] At least one support slot 252a can be provided. For example, a plurality of support slots 252a can be provided. Also, the support slots 252a can be arranged along a third direction Z" which is an upward / downward direction. Accordingly, the ring member "R" supported by the support slots 252a can be received in the inner space of the housing 210a along the upward / downward direction.

[0067] The separation plate 256a can partition the inner space of the housing 210a. For example, the separation plate 256a can separate the inner space of the housing 210a into a space in which the carrier "C" is received and a space in which the ring member "R" is received. The separation plate 256a can be coupled to a support slot 252a installed on the lowermost side among the support slots 252a. For example, the separation plate 256a can be coupled to a lower surface of the support slot 252a installed on the lowermost side among the support slots 252a. The separation plate 256a can separate the inner space of the housing 210a into a space in which the carrier "C" is received and a space in which the ring member "R" is received to minimize the risk that the carrier "C" and the hand of the first transfer robot 150 collide with each other when the hand of the first transfer robot 150 is transported into the inner space of the housing 210a. Also, the separation plate 256a can minimize the possibility that impurities attached to the ring member "R" are delivered to the carrier "C" when the used ring member "R" is transported into the inner space of the housing 210a.

[0068] Figure 4 is a view showing an example of a support slot and an alignment block of Figure 2 Referring to Figure 4 , the alignment block 260a can be installed in the support slot 252a so as to be detachable. The alignment block 260a can be inserted into the support slot 252a. The alignment block 260a inserted into the support slot 252a can be fixedly coupled to a coupling unit 266a.

[0069] At least one of the surfaces of the alignment block 260a that contacts the support slot 252a can be provided with a protrusion 262a that guides the insertion of the alignment block 260a. For example, the protrusions 262a can be formed on the left and right surfaces of the alignment block 260a with respect to the direction in which the alignment block 260a is inserted. Also, at least one of the surfaces of the support slot 252a that contacts the alignment block 260a can be provided with a guide groove 253a having a shape corresponding to the protrusion 262a. For example, the guide groove 253a can be formed at a position corresponding to the protrusion 262a of the alignment block 260a inserted into the support slot 252a.

[0070] Also, it has been described as an example that the protrusions 262a are formed in the alignment block 260a and the guide groove 253a is formed in the support slot 252a, but the inventive concept is not limited thereto, and unlike this, the guide groove can be formed in the alignment block 260a and the protrusion can be formed in the support slot 252a.

[0071] Also, the support portion 250a can include at least one guide pin 254a that guides the position of the alignment block 260a inserted into the support slot 252a. For example, the guide pin 254a can be provided on at least one of the surfaces of the support slot 252a that contacts the alignment block 260a. The guide pin 254a can be inserted into a hole (not shown) formed in the alignment block 260a. For example, the hole into which the guide pin 254a is inserted can be formed on the front surface of the alignment block 260a with respect to the direction in which the alignment block 260a is inserted into the support slot 252a. Also, the guide pin 254a can be provided at a position corresponding to the hole formed in the alignment block 260a. The guide groove 253a, the guide pin 254a, the protrusion 262a, and the hole (not shown) can help the alignment block 260a to be properly inserted into the support slot 252a, and can prevent the position of the inserted alignment block 260a from being changed and the alignment block 260a from being loosened from the support slot 252a.

[0072] The alignment block 260a can be provided with an alignment pin 264a. The alignment pin 264a can be provided on the upper surface of the alignment block 260a. Thus, when the alignment block 260a is inserted into the support slot 252a, the support slot 252a can align the position of the supported ring member "R".

[0073] Figure 5 is a view showing a ring member fitted on the support portion of Figure 2 . Referring to Figure 5, the ring member "R" can have a ring shape. The ring member "R" can be a process kit disposed in the process chamber 370. The ring member "R" can be a ring member disposed in the process chamber 370. For example, the ring member "R" can be an ISO ring or a focus ring. The alignment slots "G" can be formed on a lower surface of the ring member "R". A plurality of the alignment slots "G" can be formed on the lower surface of the ring member "R". The alignment pins 264a disposed in the alignment block 260a can be inserted into the alignment slots "G" to align the position of the ring member "R".

[0074] That is, the alignment pins 264a according to the embodiment of the inventive concept can be inserted into the alignment slots "G" formed in the ring member "R" received in the first container 200a to align the ring member "R". Accordingly, even when the skill of the operator is relatively low, when the ring member "R" is seated in the first container 200a, even by just aligning the positions of the alignment slots "G" of the ring member "R" and the alignment pins 264a so as to coincide with each other, the ring member "R" can be aligned at the proper position. Accordingly, the problem in which the ring member "R" is not aligned in the first container 200a and thus the ring member "R" transferred to the process chamber 370 can not be properly seated at the proper position in the process chamber 370 can be solved. Furthermore, the alignment pins 264a can be inserted into the alignment slots "G" formed in the ring member "R" to restrict the change in the position of the ring member "R" when the first container 200a is transferred. Accordingly, during the process of transferring the first container 200a, the problem in which the position of the ring member "R" changes and thus the ring member "R" can not be properly seated at the proper position in the process chamber 370 can be solved.

[0075] Figure 6 is a view showing a carrier seated in a container and a carrier support structure supporting the carrier. Referring to Figure 6 , the carrier "C" can be used to transfer the ring member "R". When viewed from the top, the carrier "C" can have a substantially ladder shape, and any one surface of the carrier "C" can be circular. The carrier "C" can be stored in the inner space of the first container 200a by the carrier support structure 270a. Furthermore, the carrier "C" can be retrieved by the first transfer robot 150 having a hand.

[0076] The carrier support structure 270a can support the carrier "C". The carrier support structure 270a can support the carrier "C" in the inner space of the housing 210a. The carrier support structure 270a can be disposed below the support portion 250a. The carrier support structure 270a can be installed in the inner space corresponding to a lower space among the inner spaces partitioned by the separation plate 256a. The carrier support structure 270a can include a first support structure 272a and a second support structure 274a. A pair of second support structures 274a can be provided. The first support structure 272a and the pair of second support structures 274a can support a lower surface of the carrier "C" at three points.

[0077] The substrate processing apparatus 1000 according to the embodiment of the present inventive concept can transfer the unused ring member "R" received in the first container 200a to the processing chamber 370 by using the first transfer robot 150 and the second transfer robot 350, which will be described later. In addition, the substrate processing apparatus 1000 according to the embodiment of the present inventive concept can transfer the ring member "R" used in the processing chamber 370 to the first container 200a by using the first transfer robot 150 and the second transfer robot 350, which will be described later. That is, the substrate processing apparatus 1000 can automatically replace the ring member "R".

[0078] Figure 7 is a view illustrating Figure 1 a second container. Referring to Figure 7 , a substrate type sensor WS can be received in the second container 200b according to the embodiment of the present inventive concept. The substrate type sensor WS can be a wafer type sensor. The substrate type sensor WS can have an image acquisition module that is transferred to the processing chamber 510 (which will be described later) to acquire an image of a processing space included in the processing chamber 510. In addition, the substrate type sensor WS can have a notch "N" used when centering of the substrate type sensor WS is secured.

[0079] The substrate processing apparatus 1000 according to the embodiment of the present inventive concept can transfer the substrate type sensor WS received in the second container 200b to the processing chamber 370 by using the first transfer robot 150 and the second transfer robot 350, which will be described later. In addition, the substrate processing apparatus 1000 according to the embodiment of the present inventive concept can transfer the substrate type sensor WS that has performed measurement in the processing chamber 370 to the second container 200b by using the first transfer robot 150 and the second transfer robot 350, which will be described later.

[0080] A transfer chamber 130 can be provided between the load lock 110 and the process performing unit 300. That is, the load lock 110 can be connected to the transfer chamber 130. The transfer chamber 130 can be maintained in an atmospheric atmosphere. A side buffer 170, which is a holding site, can be installed on one side of the transfer chamber 130. Further, an alignment unit 600 (to be described below) which aligns a substrate type sensor WS transferred to the process chamber 510 can be provided into the transfer chamber 130. The alignment unit 600 will be described in detail below.

[0081] Further, a first transfer robot 150 can be provided in the transfer chamber 130. The first transfer robot 150 can transfer a substrate "W", a substrate type sensor WS, and a ring member "R" between the containers 200a, 200b, and 200c installed in the load lock 110, the alignment unit 600, a load lock chamber 310 (to be described below), and the side buffer 170. That is, the first transfer robot 150 can take out the substrate type sensor WS from the second container 200b.

[0082] The process performing unit 300 can include the load lock chamber 310, a transfer chamber 330, a second transfer robot 350, and a process chamber 370.

[0083] The load lock chamber 310 can be provided between the transfer chamber 330 and the transfer chamber 130. That is, the load lock chamber 310 can be connected to the transfer chamber 130 and the transfer chamber 330. The load lock chamber 310 provides a space in which a substrate "W" and / or a ring member "R" is temporarily stored. A vacuum pump (not shown) and a valve can be installed in the load lock chamber 310 so that the internal atmosphere of the load lock chamber 310 can be converted between an atmospheric atmosphere and a vacuum atmosphere. Since the internal atmosphere of the transfer chamber 330 to be described below is maintained in a vacuum atmosphere, the atmosphere of the load lock chamber 310 can be converted between an atmospheric atmosphere and a vacuum atmosphere to transfer a substrate and a ring member "R" between the transfer chamber 330 and the transfer chamber 130.

[0084] The transfer chamber 330 can be provided between the load lock chamber 310 and the process chamber 370. As described above, the internal atmosphere of the transfer chamber 330 can be maintained in a vacuum atmosphere. Further, a second transfer robot 350 can be provided in the transfer chamber 330. The second transfer robot 350 can transfer a substrate "W" and a ring member "R" between the load lock chamber 310 and the process chamber 370. The second transfer robot 350 can transfer a substrate "W" or a ring member "R" between a process space of the process chamber 370 and the transfer chamber 330. The second transfer robot 350 includes a hand 352. The second transfer robot 350 can be configured to move in a first direction "X", a second direction "Y", and a third direction "Z". Further, the second transfer robot 350 can be configured so that the hand 352 surrounds the third direction "Z".

[0085] At least one processing chamber 370 can be connected to the transfer chamber 330. The processing chamber 370 can receive the substrate "W" from the second transfer robot 350 disposed in the transfer chamber 330 and can perform a process. The processing chamber 370 can be a chamber that performs a process on the substrate "W". The processing chamber 370 can be a liquid processing chamber that processes the substrate "W" by supplying a processing liquid to the substrate "W". Also, the processing chamber 370 can be a plasma chamber that processes the substrate "W" by using plasma. Also, some of the processing chambers 370 can be a liquid processing chamber that processes the substrate "W" by supplying a processing liquid to the substrate, and some of the processing chambers 370 can be a plasma chamber that processes the substrate "W" by using plasma. However, the inventive concept is not limited thereto, and the substrate processing process performed in the processing chamber 370 can be variously modified to a known substrate processing process. Also, when the processing chamber 370 is a plasma chamber that processes the substrate "W" by using plasma, the plasma chamber can be a chamber that performs an etching or ashing process that removes a thin film on the substrate "W" by using plasma. However, the inventive concept is not limited thereto, and the plasma processing process performed in the processing chamber 370 can be variously modified to a known plasma processing process. A detailed structure of the processing chamber 370 will be described below.

[0086] Also, Figure 1 An example in which the transfer chamber 330 has a substantially hexagonal shape when viewed from the top is illustrated, and four processing chambers 370 connected to the transfer chamber 330 are provided, but the inventive concept is not limited thereto. For example, the shape of the transfer chamber 330 and the number of processing chambers 370 can be variously modified according to the user's needs and the number of substrates to be processed.

[0087] The controller 700 can control the substrate processing apparatus 1000. The controller 700 can control the indexing unit 100 and the process performing unit 300. The controller 700 can control the first transfer robot 150, the second transfer robot 350, and the alignment unit 600. The controller 700 can control the substrate processing apparatus disposed in the processing chamber 370 so that the substrate "W" can be processed in the processing chamber 370 by using plasma.

[0088] Further, the controller 700 can include a process controller including a microprocessor (computer) that performs control of the substrate processing apparatus 1000, a keyboard for inputting a command to allow an operator to manage the substrate processing apparatus 1000, a user interface including a display that visualizes and displays an operation situation of the substrate processing apparatus 1000, and a memory unit for storing a control program for a process performed by the substrate processing apparatus 1000 under control of the process controller or a program for performing a process (i.e., a process recipe in elements according to various data and process conditions). Further, the user interface and the storage unit can be connected to the process controller. The process recipe can be stored in a memory medium of the memory unit, and the memory medium can be a hard disk, and can be a removable disk such as a CD-ROM, a DVD, and the like, a semiconductor memory such as a flash memory.

[0089] Figure 8 is a view showing a substrate processing apparatus disposed in a processing chamber of Figure 1 Reference will be made to Figure 8 The substrate processing apparatus 500 disposed in the processing chamber 370 will be described in detail. The substrate processing apparatus 500 can process a substrate "W" by delivering plasma to the substrate "W".

[0090] The substrate processing apparatus 500 can include a processing chamber 510, a gate valve 520, an exhaust line 530, a power supply unit 540, a support unit 550, a ring lift module 560, a substrate lift module 570, a baffle 580, and a gas supply unit 590.

[0091] The processing chamber 510 can have a processing space. The processing chamber 510 can be grounded. The processing chamber 510 can provide a processing space in which a substrate W is processed. The processing space of the processing chamber 510 can be substantially maintained in a vacuum atmosphere when processing a substrate "W". An inlet 512 through which a substrate "W" or a ring member "R" is brought in and out can be formed on one side of the processing chamber 510. The gate valve 520 can selectively open and close the inlet 512.

[0092] An exhaust hole 514 can be formed on a bottom surface of the process chamber 510. An exhaust line 530 can be connected to the exhaust hole 514. The exhaust line 530 can exhaust a process gas, a process by-product, etc. supplied to a process space of the process chamber 510 to the outside of the process chamber 510 through the exhaust hole 514. In addition, an exhaust plate 532 such that the process space can be exhausted more uniformly can be provided at an upper portion of the exhaust hole 514. The exhaust plate 532 can have a substantially annular shape when viewed from the top. In addition, at least one exhaust hole can be formed in the exhaust plate 532. An operator can select the exhaust plate 532 that can uniformly exhaust the process space from among a plurality of exhaust plates 532 having various shapes and sizes and install the exhaust plate 532 at the upper portion of the exhaust hole 514.

[0093] In addition, the process chamber 510 can further include a support member 516. The support member 516 can support at least a portion of a susceptor included in a support unit 550, which will be described below. For example, the support member 516 can be configured to support a lower portion of an isolation plate 554 included in the support unit 550.

[0094] The power supply unit 540 can generate RF power that excites a process gas supplied by a gas supply unit 590 into a plasma state, which will be described below. The power supply unit 540 can include a power source 542 and a matcher 544. The power source 542 and the matcher 544 can be installed on a power transmission line. In addition, the power transmission line can be connected to the chuck 552.

[0095] The support unit 550 supports the substrate "W" in a process space of the process chamber 510. The support unit 550 can include the chuck 552, the isolation plate 554, a quartz ring 556, and a sealing member 558.

[0096] The chuck 552 can have a support surface that supports the substrate "W". The chuck 552 can support the substrate "W" and can chuck the supported substrate "W". For example, an electrostatic plate (not shown) can be provided in the chuck 552, and the chuck 552 can be an electrostatic chuck that chucks the substrate "W" by using an electrostatic force. For example, the chuck 552 can be an electrode electrostatic chuck (ESC). However, the inventive concept is not limited thereto, and the chuck 552 can chuck the substrate "W" in a vacuum suction scheme.

[0097] The isolation plate 554 can have a circular shape when viewed from the top. The above-described chuck 552 and the quartz ring 556 to be described below can be positioned on the isolation plate 554. The isolation plate 554 can be a dielectric body. For example, the isolation plate 554 can be formed of a material including ceramic.

[0098] The quartz ring 556 can be formed of a material including quartz. The quartz ring 556 can have a substantially ring shape when viewed from the top. The quartz ring 556 can have a shape substantially surrounding the chuck 552 when viewed from the top. The quartz ring 556 can have a shape surrounding the substrate "W" supported by the chuck 552 when viewed from the top.

[0099] Further, the quartz ring 556 can have a stepped shape such that a height of an upper surface of an inner side thereof and a height of an upper surface of an outer side thereof can be different. For example, the height of the upper surface of the inner side of the quartz ring 556 can be lower than the height of the upper surface of the outer side thereof. Further, a ring member "R" (for example, a focus ring) can be positioned on the upper surface of the inner side of the quartz ring 556.

[0100] The sealing member 558 can be disposed between the isolation plate 554 and the chuck 552 to prevent an arc from being generated in a gap between pin holes formed in the isolation plate 554 and the chuck 552, which will be described below.

[0101] The ring lift module 560 can raise the ring member "R" positioned on the upper surface of the inner side of the quartz ring 556. The ring lift module 560 can include a ring lift pin 562 and a ring lift pin elevation portion 564. The ring lift pin 562 can move up and down along the pin holes formed in the isolation plate 554 and / or the quartz ring 556. Further, the ring lift pin 562 can move up and down by the ring lift pin elevation portion 564 elevating the ring lift pin 562. The ring lift pin elevation portion 564 can be a cylinder using air pressure or hydraulic pressure, or a motor.

[0102] The substrate lift module 570 can raise the substrate "W" positioned on the chuck 552. The substrate lift module 570 can include a substrate lift pin 572, a substrate lift pin elevation portion 574, an elevation plate 576, and a bellows 578. The substrate lift pin 572 can move up and down along the pin holes formed in the isolation plate 554 and / or the chuck 552. The substrate lift pin 572 can be coupled to the elevation plate 576 that has received power from the substrate lift pin elevation portion 574, and can move up and down by the elevation of the elevation plate 576. Further, the bellows 578 that can maintain air tightness can be installed at a connection portion of the elevation plate 576 and the substrate lift pin 572.

[0103] The baffle 580 can be disposed at an upper portion of the support unit 550. The baffle 580 can be formed of an electrode material. At least one baffle hole 582 can be formed in the baffle 580. For example, a plurality of baffle holes 582 can be formed, and can be uniformly formed in the entire area of the baffle 580 when viewed from the top. The baffle 580 makes it possible to uniformly deliver a process gas supplied by the gas supply unit 590 to the substrate "W", which will be described below.

[0104] The gas supply unit 590 can supply a process gas into a process space of the process chamber 510. The process gas can be a gas that is excited into a plasma state by the power supply unit 540 described above, which is described below. The gas supply unit 590 can include a gas supply source 592 and a gas supply line 594. One end of the gas supply line 594 can be connected to the gas supply source 592, and the opposite end of the gas supply line 594 can be connected to an upper portion of the process chamber 510. Thus, the process gas delivered by the gas supply source 592 can be supplied to an upper region of the baffle 580 through the gas supply line 594. The process gas supplied to the upper region of the baffle 580 can be introduced into the process space of the process chamber 510 through the baffle holes 582.

[0105] Figure 9 is a view illustrating a state in which the substrate type sensor enters Figure 8 the process space. Referring to Figure 9 , the hand 352 included in the second transfer robot 350 according to an embodiment of the inventive concept can enter the process space of the process chamber 510 while supporting the substrate type sensor WS. As described above, since the substrate type sensor WS has an image acquisition module, an image of the process space can be acquired. For example, the image of the process space acquired by the substrate type sensor WS can include the substrate "W" and the ring member "R", so that it is possible to identify the interval between the ring member "R" and the substrate "W". Thus, the operator can identify whether the ring member "R" is properly seated so that the interval between the ring member "R" and the substrate "W" is maintained as a preset interval "G" as shown in Figure 10 , or whether the ring member "R" is improperly seated so that the interval between the ring member "R" and the substrate "W" is maintained as a first interval G1 or a second interval G2 different from the preset interval. In addition, the image acquired by the substrate type sensor WS can be delivered to the controller 700. In addition, the controller 700 can derive a data value of the interval between the ring member "R" and the substrate "W" by analyzing the image. In addition, the controller 700 can store the data value. In addition, the controller 700 can perform an automatic teaching operation on the first transfer robot 150 and the second transfer robot 350 through the data value.

[0106] In this way, in order to improve the accuracy of the image acquired by the substrate type sensor WS or to improve the accuracy of the automatic teaching operation of the first transfer robot 150 and the second transfer robot 350, it is important to accurately ensure the centering of the substrate type sensor WS. Thus, the substrate processing apparatus 1000 according to an embodiment of the inventive concept includes the alignment unit 600 disposed in the indexing chamber 130.

[0107] Figure 12is a view showing an alignment unit of Figure 1 is a view showing an alignment unit of Figure 13 is a view showing an alignment unit of Figure 12 is a view showing an alignment unit of Figure 12 and Figure 13 The alignment unit 600 according to embodiments of the inventive concept can align the substrate-type sensor WS. However, the inventive concept is not limited thereto, and the alignment unit 600 can also align the substrate "W". The alignment unit 600 can include a support member 610, a pressure reduction member 620, and a sensor member 630.

[0108] The support member 610 can support the substrate-type sensor WS in the indexing chamber 130. The support member 610 can rotate the substrate-type sensor WS. When viewed from the top, the support member 610 can change the position of the substrate-type sensor WS along the first direction "X" and / or the second direction "Y". In addition, the support member 610 can change the height of the substrate-type sensor WS supported by the support member 610.

[0109] The support member 610 can include a support plate 612, a rotation shaft 614, a driver 616, and a positioning part 617. The support plate 612 can have a support surface that supports the substrate-type sensor WS. In addition, the support plate 612 can have a suction hole 613 that suctions the substrate-type sensor WS. In addition, a pressure reduction line 619 can be connected to the suction hole 613. In addition, the pressure reduction line 619 can be connected to the pressure reduction member 620. That is, the suction hole 613 can be connected to the pressure reduction member 620 that reduces the pressure in the suction hole 613 through the medium of the pressure reduction line 619. In addition, the pressure reduction member 620 can be a pump. However, the inventive concept is not limited thereto, and the pressure reduction member 620 can be modified by using a known device that can reduce the pressure in the suction hole.

[0110] The rotation shaft 614 that rotates the support plate 612 can be provided at a lower portion of the support plate 612. The rotation shaft 614 can be a hollow shaft. In addition, the rotation shaft 614 can be rotated by the driver 616, which can be a hollow motor. That is, the driver 616 can generate driving power that rotates the support plate 612.

[0111] The positioning part 617 can change the position of the support plate 612. For example, the positioning part 617 can change the position of the support plate 612 to the first direction "X" and / or the second direction "Y". Accordingly, the positioning part 617 moves the substrate-type sensor WS supported by the support plate 612 to the first direction "X" and / or the second direction "Y". The positioning part 617 can be disposed between the support plate 612 and the rotation shaft 614. The positioning part 617 can include an LM guide. The substrate-type sensor WS can have a slightly larger diameter than the substrate "W".

[0112] The sensor member 630 can sense whether the notch "N" formed in the substrate-type sensor WS is aligned. The sensor member 630 can sense the notch "N" formed in the substrate-type sensor WS. The sensor member 630 can include an irradiation part 632 that irradiates light and a light-receiving part 634 that receives light irradiated by the irradiation part 632. The light irradiated by the irradiation part 632 can have linearity. For example, the light irradiated by the irradiation part 632 can be a laser beam. The sensor member 630 can determine whether the light-receiving part 634 receives light, and determine whether the notch "N" of the substrate-type sensor WS is properly disposed according to the amount of light received.

[0113] The controller 700 can align the substrate-type sensor WS by controlling the alignment unit 600. For example, the controller 700 can control the alignment unit 600 such that the notch "N" of the substrate-type sensor WS supported by the support plate 612 is positioned between the irradiation part 632 and the light-receiving part 634 by rotating the support plate 612 or moving the position of the support plate 612 in the first direction "X" and / or the second direction "Y".

[0114] Figure 14 FIG. 1 is a flowchart illustrating a conveying sequence of a substrate-type sensor according to an embodiment of the present inventive concept. Figure 15 FIG. 2 is a view schematically illustrating a state in which a substrate processing apparatus according to an embodiment of the present inventive concept conveys a substrate-type sensor. Referring to FIG. 2, Figure 14 and Figure 15 A conveying sequence of the substrate-type sensor WS will be described in detail. To perform the conveying sequence of the substrate-type sensor WS to be described below, the controller 700 can control the substrate processing apparatus 1000.

[0115] First, the second container 200b in which the substrate-type sensor WS is received can be seated in the load cup 110 of the indexing unit 100 (S10). Then, the second container 200b can be conveyed by an article conveying apparatus (e.g., an OHT).

[0116] Thereafter, the first conveying robot 150 can take out the substrate-type sensor WS from the second container 200b, and can seat the substrate-type sensor WS on the support plate 612 included in the alignment unit 600 (S20).

[0117] Thereafter, the alignment unit 600 can align the substrate-type sensor WS. Then, the support plate 612 of the alignment unit 600 can be rotated. Also, the position of the support plate 612 of the alignment unit 600 can be changed in the first direction "X", the second direction "Y", and / or the third direction "Z". Accordingly, the notch "N" formed in the substrate-type sensor WS can be aligned to be positioned between the irradiation part 632 and the light-receiving part 634 of the sensor member 630.

[0118] Then, there can be a case in which the alignment unit 600 has completely aligned the substrate-type sensor WS and a case in which the alignment unit 600 cannot align the substrate-type sensor WS.

[0119] First, when the alignment unit 600 has completely aligned the substrate-type sensor WS, the first transfer robot 150 lifts the substrate-type sensor WS from the support plate 612 of the alignment unit 600 and places the substrate-type sensor WS in the load lock chamber 310 (S40).

[0120] Thereafter, the internal atmosphere of the load lock chamber 310 is changed from an atmospheric atmosphere to a vacuum atmosphere, and when the internal atmosphere of the load lock chamber 310 is changed to the vacuum atmosphere, the second transfer robot 350 can take out the substrate-type sensor WS from the load lock chamber 310 to the transfer chamber 330 (S50).

[0121] Thereafter, the second transfer robot 350 can transfer the substrate-type sensor WS to the processing space of the processing chamber 510 included in the processing chamber 370, and the substrate-type sensor WS can perform a measurement, for example, to obtain an image from the processing space of the processing chamber 510 (S60).

[0122] Thereafter, the second transfer robot 350 can take out the substrate-type sensor WS from the processing space of the processing chamber 510 included in the processing chamber 370 (S70).

[0123] Thereafter, the second transfer robot 350 can place the substrate-type sensor WS in the load lock chamber 310 (S80).

[0124] Thereafter, the internal atmosphere of the load lock chamber 310 is changed from a vacuum atmosphere to an atmospheric atmosphere, and when the internal atmosphere of the load lock chamber 310 is changed to the vacuum atmosphere, the first transfer robot 150 can take out the substrate-type sensor WS from the load lock chamber 310 and bring the substrate-type sensor WS into the second container 200b placed in the load cassette 110 (S90).

[0125] When it is impossible for the alignment unit 600 to align the substrate-type sensor WS, the first transfer robot 150 can transfer the substrate-type sensor WS seated on the support plate 612 of the alignment unit 600 to the second container 200b again (S31). As an example in which it is impossible to align the substrate-type sensor WS, the shape of the substrate-type sensor WS itself can be defective or the substrate-type sensor WS can be deflected. When gas flows in the reduced-pressure line 619 connected to the suction hole 613 for a preset period of time, the controller 700 can determine that it is impossible for the alignment unit 600 to align the substrate-type sensor WS, and can control the first transfer robot 150 to transfer the substrate-type sensor WS from the alignment unit 600 to the second container 200b. When gas flows in the reduced-pressure line 619 for a preset period of time or more, it can be inferred that the substrate-type sensor WS is not fixedly suctioned to the support plate 612 and the substrate-type sensor WS is deflected. Furthermore, when the sensor member 630 does not sense the notch "N" formed in the substrate-type sensor WS even if the substrate-type sensor WS is rotated by a preset angle or more (for example, 360 degrees or more), the controller 700 can determine that it is impossible for the alignment unit 600 to align the substrate-type sensor WS, and can control the first transfer robot 150 to transfer the substrate-type sensor WS from the alignment unit 600 to the second container 200b. This is because, when the sensor member 630 does not sense the notch "N" formed in the substrate-type sensor WS even if the substrate-type sensor WS is rotated by a preset angle or more (for example, 360 degrees or more), it can be inferred that the substrate-type sensor WS is deflected.

[0126] Thereafter, the controller 700 can generate an alarm so that an operator can recognize that it is impossible for the alignment unit 600 to align the substrate-type sensor WS (S32). The alarm can be implemented by various schemes (for example, a sound, etc.) that allow the operator to recognize that it is impossible for the alignment unit 600 to align the substrate-type sensor WS.

[0127] According to the embodiment of the present inventive concept, even though the containers 200a, 200b, and 200c do not provide a structure for aligning the substrate-type sensor WS, the substrate processing apparatus 1000 of the present inventive concept can align the substrate-type sensor WS and transfer the substrate-type sensor WS to the process space of the process chamber 510 due to the presence of the alignment unit 600. In addition, according to the embodiment of the present inventive concept, the alignment unit 600 is disposed in the indexing chamber 130 included in the indexing unit 100. Accordingly, the substrate-type sensor WS is delivered to the process-performing unit 300 while being aligned. Thus, it is possible to solve a problem (e.g., a problem in which the substrate-type sensor WS falls or collides with the configuration of the substrate processing apparatus 1000) that can occur when the substrate-type sensor WS is transferred to the process-performing unit 300 while being unaligned. In addition, according to the embodiment of the present inventive concept, when it is determined that the alignment unit 600 is impossible to align the substrate-type sensor WS, the substrate-type sensor WS is transferred to the second container 200b. When the alignment unit 600 only performs a predetermined operation programmed, the substrate-type sensor WS can be transferred to the process-performing unit 300 while being unaligned, and according to the present inventive concept, when it is determined that the alignment unit 600 is impossible to align the substrate-type sensor WS, by transferring the substrate-type sensor WS to the second container 200b, it is possible to prevent the substrate-type sensor WS from entering the process-performing unit 300 while being unaligned. In addition, because the alignment unit 600 is disposed in the indexing chamber 130, it is possible to further simplify the transfer sequence.

[0128] The embodiment of the present inventive concept provides a substrate processing apparatus capable of effectively aligning a substrate-type sensor.

[0129] In addition, according to the embodiment of the present inventive concept, it is possible to effectively acquire an image of the inside of a process chamber.

[0130] In addition, according to the embodiment of the present inventive concept, it is possible to effectively perform automatic teaching of a transfer robot.

[0131] Effects of the present inventive concept are not limited to the above-mentioned effects and a person skilled in the art to which the present inventive concept pertains can clearly understand unmentioned effects from the specification and the attached drawings.

[0132] The above detailed description illustrates the inventive concept. In addition, the above-mentioned content describes exemplary embodiments of the inventive concept, and the inventive concept can be used in various other combinations, changes, and environments. That is, the inventive concept can be modified and corrected without departing from the scope of the inventive concept disclosed in the specification, the equivalent scope of the written disclosure, and / or the scope of the technology or knowledge of those skilled in the art. The written embodiment description serves to embody the technical spirit of the inventive concept in the best state, and various changes required for the detailed application and purpose of the inventive concept can be made. Therefore, the detailed description of the inventive concept is not intended to limit the inventive concept in the disclosed embodiment state. In addition, it should be understood that the appended claims include other embodiments.

Claims

1. A substrate processing apparatus, comprising: A sorting unit, comprising a load tank and a sorting chamber, wherein a container is placed in the load tank and the sorting chamber is connected to the load tank; as well as A processing execution unit having a load locking chamber connected to the indexing chamber and a processing chamber configured to process a substrate transferred to the load locking chamber, and Controller, wherein the rotation unit further includes: An alignment unit is disposed in the indexing chamber and configured to align the substrate-type sensor conveyed to the processing chamber. The alignment unit includes: A support member, comprising a support plate and configured to support the substrate-type sensor; and A sensor component configured to sense whether a notch formed in the substrate-type sensor is aligned. The indexing unit further includes: A first transfer robot is disposed in the transposition chamber and configured to remove the substrate-type sensor from the container; The controller is configured as follows: Control the first transfer robot to remove the substrate-type sensor from the container and place the substrate-type sensor on the support plate; and The first transfer robot and the alignment unit are controlled to align the substrate-type sensor by changing the position of the support plate and / or rotating the support plate. When it is determined that the alignment unit cannot align the substrate-type sensor, the first transfer robot is controlled to transfer the substrate-type sensor, which is placed on the support plate, to the container.

2. The substrate processing apparatus of claim 1, wherein the support member comprises: The positioning portion is configured to move the substrate-type sensor supported by the support member in a first direction and / or a second direction perpendicular to the first direction when viewed from above; The support plate has a support surface that supports the substrate-type sensor; as well as A rotating shaft configured to rotate the support plate.

3. The substrate processing apparatus of claim 2, wherein the support plate has a suction hole for vacuum suction of the substrate-type sensor supported by the support surface.

4. The substrate processing apparatus of claim 3, wherein the alignment unit further comprises: A pressure-reducing component configured to reduce the pressure in the suction port.

5. The substrate processing apparatus of claim 1, wherein the sensor component comprises: An irradiation portion, wherein the irradiation portion is configured to emit irradiation light; as well as A light receiving section, the light receiving section being configured to receive the light irradiated by the irradiation section.

6. The substrate processing apparatus of claim 1, wherein the controller is configured to: When the alignment unit has fully aligned the substrate-type sensor, it controls the first transfer robot to transfer the substrate-type sensor to the load locking chamber.

7. The substrate processing apparatus of claim 3, wherein the controller is configured to: When gas flows in the pressure-reducing line connected to the suction port for a preset time period or longer, it is determined that the alignment unit cannot align the substrate-type sensor.

8. The substrate processing apparatus of claim 1, wherein the controller is configured to: If the sensor component does not sense the notch even when the substrate-type sensor is rotated by a preset angle or a larger angle, it is determined that the alignment unit cannot align the substrate-type sensor.

9. A substrate processing apparatus, comprising: A processing chamber having a processing space for processing substrates; A transposition chamber is connected to a load tank, the container is placed in the load tank, a substrate-type sensor for acquiring images of the processing space is received in the container, and the transposition chamber is configured to maintain the internal atmosphere at atmospheric level. At least one transfer robot, the at least one transfer robot being configured to transfer the substrate or the substrate-type sensor between the transposition chamber and the processing chamber; An alignment unit is disposed in the rotation chamber and configured to align the substrate-type sensor. as well as Controller The alignment unit includes: A support member, comprising a support plate and configured to support the substrate-type sensor; and A sensor component configured to sense whether a notch formed in the substrate-type sensor is aligned. The controller is configured as follows: The transfer robot is controlled to remove the substrate-type sensor from the container and transfer the substrate-type sensor to the alignment unit; The transfer robot and the alignment unit are controlled so that the alignment unit aligns with the notch formed in the substrate sensor; when the alignment unit has fully aligned the notch, the transfer robot is controlled to transfer the substrate sensor to the processing chamber; and When it is determined that the alignment unit cannot align the notch at the specified position, the transfer robot is controlled to transfer the substrate-type sensor to the container.

10. The substrate processing apparatus of claim 9, wherein the controller is configured to: When gas flows in a pressure-reducing line connected to a suction port included in the alignment unit and configured to vacuum the substrate-type sensor for a predetermined time period or longer, it is determined that the alignment unit cannot align the position of the notch.

11. The substrate processing apparatus of claim 9, wherein the controller is configured to: When the alignment unit rotates the substrate-type sensor by a preset angle or a larger angle, and the sensor component included in the alignment unit and configured to sense the notch does not sense the notch, it is determined that the alignment unit cannot align the position of the notch.

12. A substrate processing apparatus, comprising: The transposition unit includes a load container, a container is placed in the load container, and a substrate and a substrate-type sensor with an image acquisition module are received in the container. A processing execution unit having a processing chamber for processing the substrate; as well as Controller The transposition unit includes: A transposition chamber, which is connected to the load tank and maintained in an atmospheric environment; Alignment unit, the alignment unit being disposed in the rotation chamber and configured to align the substrate-type sensor; and A first transfer robot is configured to transfer the substrate or the substrate-type sensor between the rotation chamber and the processing execution unit. The processing execution unit includes: A load-locking chamber configured to contact the indexing chamber and whose internal atmosphere is switched between a vacuum pressure atmosphere and the atmospheric atmosphere; A transfer chamber, configured to contact the load tank and whose internal atmosphere is maintained under the vacuum pressure atmosphere; and A second transfer robot, disposed in the transfer chamber, is configured to transfer the substrate brought into the load tank or the substrate-type sensor to the processing chamber. The alignment unit includes: A support plate having a support surface for supporting the substrate-type sensor and a suction hole for vacuum suction of the substrate-type sensor supported on the support surface. A rotating shaft configured to rotate the support plate; The positioning portion is configured to move the substrate-type sensor supported by the support plate in a first direction and / or a second direction perpendicular to the first direction when viewed from above. An irradiation portion, wherein the irradiation portion is configured as an irradiation light; and A sensor component configured to receive light irradiated by the irradiation portion and sense a notch formed in the substrate-type sensor; The controller is configured as follows: The first transfer robot is controlled to remove the substrate-type sensor from the container and place the substrate-type sensor on the support plate; The alignment unit is controlled to align the substrate-type sensor by changing the position of the support plate and / or rotating the support plate; When the alignment unit has fully aligned the substrate sensor, the first transfer robot is controlled to transfer the substrate sensor to the load locking chamber; and When it is determined that the alignment unit cannot align the substrate-type sensor, the first transfer robot is controlled to transfer the substrate-type sensor, which is placed on the support plate, to the container. The controller is configured as follows: When gas flows in the pressure-reducing line connected to the suction port for a preset time period or longer, or when the sensor component does not sense the notch even if the substrate-type sensor is rotated by a preset angle or greater, it is determined that the alignment unit cannot align the substrate-type sensor.

Images