Semiconductor process anomaly detection method, device and system

Abstract

The present application provides a method, device and system for detecting semiconductor process anomalies. The method includes: in the presence of an abnormal wafer, obtaining the first process data and the second process data of the abnormal wafer and the normal wafer produced in the same process step; judging whether the process step of the abnormal wafer is abnormal based on the first process data and the second process data. In this method, when the finished wafer does not meet the performance requirements of the predetermined requirements, the first process data and the second process data of the abnormal wafer and the normal wafer are obtained when the same process step is produced. According to the first process data of the abnormal wafer and the second process data of the normal wafer, it can be determined whether the step is abnormal, thereby realizing the detection of whether the semiconductor manufacturing process step is abnormal, and then according to the detection result, the parameters of the relevant process steps can be adjusted to avoid greater losses in subsequent semiconductor production.

Description

Technical Field

[0001] The present application relates to the semiconductor field, and more specifically, to a method, device, computer-readable storage medium and system for detecting semiconductor process anomalies. Background Art

[0002] With the development of semiconductor technology, the number of electronic devices integrated on semiconductor chips is increasing. In the process of chip manufacturing, hundreds of process steps are often required. Therefore, when the performance of the finished semiconductor product does not meet the predetermined requirements, it is often difficult to find which process step has an abnormality.

[0003] Therefore, there is an urgent need for a method that can detect whether an abnormality occurs in a process step.

[0004] The above information disclosed in the background technology section is only used to enhance the understanding of the background technology of the technology described in this article. Therefore, the background technology may contain certain information that does not form the prior art known in this country for those skilled in the art. Summary of the invention

[0005] The main purpose of the present application is to provide a method, device, computer-readable storage medium and system for detecting semiconductor process anomalies, so as to solve the problem in the prior art of lacking the ability to detect whether an abnormality occurs in a process step.

[0006] According to one aspect of an embodiment of the present invention, a method for detecting semiconductor process anomalies is provided, comprising: in the presence of an abnormal wafer, obtaining process data of the abnormal wafer and the normal wafer manufactured in the same process steps, and obtaining first process data and second process data respectively, the abnormal wafer being a wafer whose performance does not meet predetermined requirements, and the normal wafer being a wafer whose performance meets predetermined requirements; judging whether an abnormality occurs in the process steps of the abnormal wafer based on the first process data and the second process data.

[0007] Optionally, in the presence of an abnormal wafer, process data of manufacturing the abnormal wafer and the normal wafer in the same process steps are obtained to obtain first process data and second process data respectively, including: numbering the process steps, the same process steps have the same number, and multiple process numbers are obtained; obtaining the first predetermined process data when manufacturing the normal wafer and the second predetermined process data when manufacturing the abnormal wafer corresponding to each process step, wherein, when manufacturing one wafer, multiple identical process steps with time intervals correspond to the same process number; adjusting the process number according to the first predetermined process data and the second predetermined process data to obtain the adjusted process number, and the adjustment includes at least one of the following: adjusting adjacent different process numbers to the same process number, adjusting the process numbers corresponding to two identical process steps to different process numbers; obtaining the process data of manufacturing the abnormal wafer and the normal wafer when the process steps corresponding to the same adjusted process number are obtained to obtain first process data and second process data respectively.

[0008] Optionally, the process number is adjusted according to the first predetermined process data and the second predetermined process data to obtain the adjusted process number, including: when the difference between the two first predetermined process data corresponding to two adjacent identical process numbers is greater than the first predetermined difference, and / or when the difference between the two second predetermined process data corresponding to two adjacent identical process numbers is greater than the first predetermined difference, the corresponding two identical process numbers are adjusted to two different process numbers to obtain the first predetermined number and the second predetermined number.

[0009] Optionally, the process number is adjusted according to the first predetermined process data and the second predetermined process data to obtain the adjusted process number, including: when the difference between the two first predetermined process data corresponding to two adjacent different process steps is less than the second predetermined difference, and / or when the difference between the two second predetermined process data corresponding to two adjacent different process steps is less than the second predetermined difference, the corresponding predetermined process numbers are adjusted to two identical process numbers to obtain a third process number.

[0010] Optionally, process data of manufacturing the abnormal wafer and the normal wafer in the same process step are obtained to obtain first process data and second process data respectively, including: manufacturing multiple process data of the abnormal wafer and the normal wafer in the same process step and within a predetermined time to obtain multiple first original data and multiple second original data; and calculating the average values ​​of the first original data and the second original data respectively to obtain the first process data and the second process data.

[0011] Optionally, based on the first process data and the second process data, it is determined whether the process step of the abnormal wafer is abnormal, including: when the first process data is not within a predetermined range, determining that the corresponding process step is abnormal, the predetermined range is a range determined based on the corresponding second process data, and the second process data is within the predetermined range.

[0012] Optionally, the process of determining the predetermined range includes: when there are multiple normal wafers, determining that the maximum value of the predetermined range is the sum of the maximum second process data corresponding to the same process step and a first predetermined value, and the minimum value of the predetermined range is the difference between the minimum second process data corresponding to the same process step and a second predetermined value, the first predetermined value is greater than or equal to 0, and the second predetermined value is greater than or equal to 0; when there is only one normal wafer, determining that the maximum value of the predetermined range is the sum of the second process data corresponding to the same process step and a third predetermined value, and the minimum value of the predetermined range is the difference between the second process data corresponding to the same process step and a fourth predetermined value, the third predetermined value is greater than or equal to 0, and the fourth predetermined value is greater than or equal to 0.

[0013] Optionally, the process steps are process steps for manufacturing a memory.

[0014] According to another aspect of an embodiment of the present invention, a semiconductor process anomaly detection device is also provided, including: an acquisition unit, used to, in the presence of an abnormal wafer, acquire process data of the abnormal wafer and a normal wafer manufactured in the same process steps, to obtain first process data and second process data respectively, wherein the abnormal wafer is a wafer whose performance does not meet predetermined requirements, and the normal wafer is a wafer whose performance meets predetermined requirements; and a judgment unit, used to judge whether an abnormality occurs in the process steps of the abnormal wafer based on the first process data and the second process data.

[0015] According to another aspect of the embodiments of the present invention, a computer-readable storage medium is provided, wherein the computer-readable storage medium includes a stored program, wherein the program executes any one of the methods described.

[0016] According to another aspect of an embodiment of the present invention, a semiconductor process anomaly detection system is provided, comprising: a process manufacturing machine, one or more processors, a memory and one or more programs, wherein the one or more programs are stored in the memory and are configured to be executed by the one or more processors, and the one or more programs include methods for executing any one of the methods described.

[0017] In an embodiment of the present invention, in the case of an abnormal wafer, the first process data and the second process data of the abnormal wafer and the normal wafer produced in the same process step are first obtained, and then the first process data and the second process data are used to determine whether the process step of the abnormal wafer is abnormal. In this method, when the finished wafer does not meet the performance requirements of the predetermined requirements, the first process data and the second process data of the abnormal wafer and the normal wafer are obtained when they are produced in the same process step. According to the first process data of the abnormal wafer and the second process data of the normal wafer, it can be determined whether the step is abnormal, thereby realizing the detection of whether the semiconductor manufacturing process step is abnormal, solving the problem of the lack of methods for detecting whether the semiconductor manufacturing process step is abnormal in the prior art, and then the parameters of the relevant process steps can be adjusted according to the detection results to avoid greater losses in subsequent semiconductor manufacturing. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings constituting part of the present application are used to provide a further understanding of the present application. The exemplary embodiments and descriptions of the present application are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0019] Figure 1 A schematic flow chart of a method for detecting semiconductor process anomalies according to an embodiment of the present application is shown;

[0020] Figure 2 A schematic structural diagram of a semiconductor process abnormality detection device according to an embodiment of the present application is shown;

[0021] Figure 3 A timing diagram of process data according to an embodiment of the present application is shown;

[0022] Figure 4 shows a scatter plot of process data according to an embodiment of the present application;

[0023] Figure 5 shows a box plot of process data according to an embodiment of the present application;

[0024] Figure 6 A timing diagram of process data according to an embodiment of the present application is shown;

[0025] Figure 7 shows a scatter plot of process data according to an embodiment of the present application;

[0026] Figure 8 shows a box plot of process data according to an embodiment of the present application;

[0027] Fig. 9 A schematic diagram of adjusting the process number according to an embodiment of the present application is shown. DETAILED DESCRIPTION

[0028] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0029] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present application.

[0030] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present application described here. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0031] As mentioned in the background technology, the prior art lacks a method for detecting whether an abnormality occurs in a process step. In order to solve the above problem, in a typical embodiment of the present application, a method, device, computer-readable storage medium and system for detecting anomalies in a semiconductor process are provided.

[0032] According to an embodiment of the present application, a method for detecting semiconductor process anomalies is provided.

[0033] Figure 1 FIG. 1 is a flow chart of a method for detecting semiconductor process anomalies according to an embodiment of the present application. Figure 1 As shown, the method comprises the following steps:

[0034] Step S101, in the case of an abnormal wafer, obtaining process data of the abnormal wafer and the normal wafer manufactured in the same process steps, and obtaining first process data and second process data respectively, wherein the abnormal wafer is a wafer whose performance does not meet the predetermined requirements, and the normal wafer is a wafer whose performance meets the predetermined requirements;

[0035] Step S102 , judging whether the process step of the abnormal wafer is abnormal according to the first process data and the second process data.

[0036] In the above method, in the case of an abnormal wafer, the first process data and the second process data of the abnormal wafer and the normal wafer produced in the same process step are first obtained, and then the first process data and the second process data are used to determine whether the process step of the abnormal wafer is abnormal. In this method, when the finished wafer does not meet the performance requirements of the predetermined requirements, the first process data and the second process data of the abnormal wafer and the normal wafer are obtained when they are produced in the same process step. According to the first process data of the abnormal wafer and the second process data of the normal wafer, it can be determined whether the step is abnormal, thereby realizing the detection of whether the semiconductor manufacturing process step is abnormal, solving the problem of the lack of methods for detecting whether the semiconductor manufacturing process step is abnormal in the prior art, and then the parameters of the relevant process steps can be adjusted according to the detection results to avoid greater losses in the subsequent semiconductor manufacturing.

[0037] Specifically, the first process data and the second process data are process data collected by machine sensors at the stage of each process step when manufacturing wafers. The first process data and the second process data may be temperature, humidity, pressure, etc. There may be multiple first process data and the second process data, for example, multiple abnormal wafers correspond to multiple first process data, and multiple normal wafers correspond to multiple second process data.

[0038] It should be noted that the steps shown in the flowcharts of the accompanying drawings can be executed in a computer system such as a set of computer executable instructions, and that, although a logical order is shown in the flowcharts, in some cases, the steps shown or described can be executed in an order different from that shown here.

[0039] In one embodiment of the present application, in the presence of an abnormal wafer, process data of manufacturing the abnormal wafer and the normal wafer in the same process steps are obtained to obtain first process data and second process data respectively, including: numbering the process steps, the same process steps have the same number, and multiple process numbers are obtained; obtaining the first predetermined process data when manufacturing the normal wafer and the second predetermined process data when manufacturing the abnormal wafer corresponding to each of the above process steps, wherein, when manufacturing one of the above wafers, multiple identical process steps with time intervals correspond to the same process number, for example, the process step corresponding to the first process number is photolithography, and the process step corresponding to the second process number is photolithography. The process step is etching, and the process step corresponding to the third process number is deposition, and then the above-mentioned manufacturing process is repeated, and the repeated lithography still corresponds to the first process number; according to the above-mentioned first predetermined process data and the above-mentioned second predetermined process data, the above-mentioned process number is adjusted to obtain the adjusted process number, and the above-mentioned adjustment includes at least one of the following: adjusting the adjacent different process numbers to the same process number, and adjusting the process numbers corresponding to two identical process steps to different process numbers; when obtaining the process steps corresponding to the same adjusted process number, the process data of making the abnormal wafer and the normal wafer are obtained, respectively, and the first process data and the second process data are obtained. In this embodiment, the process steps are numbered, and the same process steps with interval time have the same number. When obtaining each process step, the first predetermined process data when making a normal wafer and the second predetermined process data when making an abnormal wafer are obtained, and the process number is adjusted according to the first predetermined process data and the second predetermined process data, and different process numbers are adjusted to the same or the same process number is adjusted to a different process number, so that the process step corresponding to the adjusted process number can more accurately represent the process step corresponding to the wafer manufacturing, so that it can be more accurately determined which process step has a problem.

[0040] In a specific embodiment of the present application, the above interval is 5-7 seconds, that is, the same process steps within 5-7 seconds correspond to the same process number. Of course, in actual applications, the above interval can also be other values, and those skilled in the art can choose according to actual conditions.

[0041] In another embodiment of the present application, the process number is adjusted according to the first predetermined process data and the second predetermined process data to obtain the adjusted process number, including: when the difference between the two first predetermined process data corresponding to two adjacent identical process numbers is greater than the first predetermined difference, and / or, when the difference between the two second predetermined process data corresponding to two adjacent identical process numbers is greater than the first predetermined difference, the corresponding two identical process numbers are adjusted to two different process numbers to obtain the first predetermined number and the second predetermined number. The two identical process numbers to be adjusted are the process numbers corresponding to the two first predetermined process data whose difference is greater than the predetermined difference, or the two identical process numbers to be adjusted are the process numbers corresponding to the two second predetermined process data. For example, the process step corresponding to the first process number is photolithography, the process step corresponding to the second process number is etching, and the process step corresponding to the third process number is deposition. Then the above-mentioned manufacturing process is repeated, and the repeated photolithography still corresponds to the first process number. If the first predetermined process data collected during the first photolithography is different from the first predetermined process data collected during the second photolithography, the first process numbers corresponding to the two photolithography are adjusted, and the process number of the first photolithography and the process number of the second photolithography are adjusted to different process numbers. In order to distinguish which step of the same process step has an abnormality, in this embodiment, when the adjacent first predetermined process data and / or second predetermined process data are greater than the first predetermined difference, it indicates that the adjacent same process steps correspond to different process data, so it is necessary to adjust the numbers corresponding to the process steps, and adjust the two same process numbers to different numbers. In this way, when the process step corresponding to the adjusted process number is obtained, the first process data and the second process data of the above-mentioned abnormal wafer and the above-mentioned normal wafer are produced. According to the first process data and the second process data, it is possible to accurately determine which same process step has an abnormality, thereby further improving the accuracy of detection.

[0042] Specifically, the first reservation number and the second reservation number may both be adjusted to new numbers, or the first reservation number may remain the original number and the second reservation number may be adjusted to a new number, or the first reservation number may be adjusted to a new number and the second reservation number may remain the original number.

[0043] In a specific embodiment of the present application, the first predetermined difference is 0, and when adjacent first predetermined process data and / or second predetermined process data are different, the process number is adjusted. In actual applications, the first predetermined difference is not limited to 0, and can also be other values.

[0044] In another embodiment of the present application, the process number is adjusted according to the first predetermined process data and the second predetermined process data to obtain the adjusted process number, including: when the difference between the two first predetermined process data corresponding to the two adjacent different process steps is less than the second predetermined difference, and / or, when the difference between the two second predetermined process data corresponding to the two adjacent different process steps is less than the second predetermined difference, the corresponding predetermined process number is adjusted to two identical process numbers to obtain a third process number. In this embodiment, when the two first predetermined process data and / or the second predetermined process data corresponding to the two adjacent different process steps are less than the second predetermined difference, it indicates that the predetermined process data corresponding to the two adjacent different process steps are similar, and then the corresponding predetermined process number is adjusted to two identical third process numbers, so that when obtaining the first process data and the second process data, only one process step needs to be obtained, so that the process number more accurately represents the process step corresponding to the wafer manufacturing, thereby further improving the accuracy of detection.

[0045] Specifically, the third number may be any one of the process numbers corresponding to two adjacent different process steps, or may be a new number that is different from both process numbers.

[0046] In a specific embodiment of the present application, the second predetermined difference needs to be determined according to the ratio of the first predetermined process data or the second predetermined process data, and the ratio is 1% of the first first predetermined process data or the second predetermined process data of the two first predetermined process data or the second predetermined process data corresponding to the two different process steps. Similarly, the second predetermined difference can also be other values, which can be selected by those skilled in the art according to actual conditions.

[0047] In another embodiment of the present application, the process data of manufacturing the abnormal wafer and the normal wafer in the same process step are obtained to obtain the first process data and the second process data respectively, including: obtaining multiple process data of manufacturing the abnormal wafer and the normal wafer in the same process step and within a predetermined time to obtain multiple first original data and multiple second original data; respectively calculating the average values ​​of the first original data and the second original data to obtain the first process data and the second process data. In this embodiment, since there are a lot of process data obtained by the machine, it is necessary to process the process data, and calculate the average value of multiple process data of manufacturing the abnormal wafer and the normal wafer in the same process step and within a predetermined time to obtain the first process data and the second process data. In this way, there is no need to process multiple first original data and multiple second original data one by one, which further saves the detection time.

[0048] In another specific embodiment of the present application, the above-mentioned predetermined time of the present application is 10 minutes. For example, the machine sensor collects process data once every 1 second, and calculates the average value of the process data corresponding to the same process steps within 10 minutes, which greatly reduces the amount of process data that needs to be obtained and shortens the detection time.

[0049] In another embodiment of the present application, based on the above-mentioned first process data and the above-mentioned second process data, it is determined whether the above-mentioned process step of the above-mentioned abnormal wafer is abnormal, including: when the above-mentioned first process data is not within a predetermined range, it is determined that the corresponding above-mentioned process step is abnormal, and the above-mentioned predetermined range is a range determined according to the corresponding above-mentioned second process data, and the above-mentioned second process data is within the above-mentioned predetermined range. In this embodiment, the above-mentioned predetermined range is determined based on the second process data corresponding to the normal wafer. If the first process data is not within the predetermined range, it proves that the process step has an abnormality, so that the accuracy of the detection is further improved. At the same time, since there is no need to compare the first process data and the second process data one by one, the detection time is greatly solved, thereby improving the efficiency of the detection.

[0050] In another specific embodiment of the present application, there are multiple first process data and multiple second process data, and the first process data need to be compared with a predetermined range one by one. For example, there are multiple abnormal wafers corresponding to multiple first process data, and the first process data corresponding to each abnormal wafer is compared with the predetermined range. If the first process data corresponding to the abnormal wafer is not within the predetermined range, an abnormality has occurred in the process step corresponding to the first process data of the abnormal wafer, and then the next abnormal wafer is compared.

[0051] In another embodiment of the present application, the process of determining the above-mentioned predetermined range includes: in the case where there are multiple normal wafers, determining that the maximum value of the above-mentioned predetermined range is the sum of the maximum second process data corresponding to the same process step and the first predetermined value, and the minimum value of the above-mentioned predetermined range is the difference between the minimum second process data corresponding to the same process step and the second predetermined value, the first predetermined value is greater than or equal to 0, and the second predetermined value is greater than or equal to 0; in the case where there is only one normal wafer, determining that the maximum value of the above-mentioned predetermined range is the sum of the second process data corresponding to the same process step and the third predetermined value, and the minimum value of the above-mentioned predetermined range is the difference between the second process data corresponding to the same process step and the fourth predetermined value, the third predetermined value is greater than or equal to 0, and the fourth predetermined value is greater than or equal to 0. In this embodiment, the above-mentioned predetermined range has different determination methods according to the number of normal wafers. When there is only one normal wafer, the maximum value of the predetermined range is the sum of the second process data of the normal wafer and the third predetermined value, and the minimum value of the predetermined range is the difference between the second process data of the normal wafer and the fourth predetermined value; when there are multiple normal wafers, the maximum value of the predetermined range is the sum of the largest second process data and the first predetermined value, and the minimum value of the predetermined range is the difference between the smallest second process data and the second predetermined value, which makes the determination process of the predetermined range more accurate, thereby further improving the accuracy of detection.

[0052] The first predetermined value, the second predetermined value, the third predetermined value and the fourth predetermined value may be the same value or different values, and those skilled in the art may select them according to actual conditions.

[0053] Of course, the above-mentioned "determining whether the above-mentioned process steps of the above-mentioned abnormal wafer are abnormal based on the above-mentioned first process data and the above-mentioned second process data" of the present application is not limited to the above-mentioned process, but can also be to respectively calculate the maximum value, minimum value, median and lower quartile of the first process data and the second process data, and then compare the above-mentioned values.

[0054] In another embodiment of the present application, the above process steps are process steps for manufacturing a memory. The method of the present application can be applied to all process steps during memory manufacturing, so that it is possible to more accurately determine which process step has a problem and adjust the parameters of the process step to avoid greater losses in subsequent memory manufacturing.

[0055] The embodiment of the present application also provides a semiconductor process anomaly detection device. It should be noted that the semiconductor process anomaly detection device of the embodiment of the present application can be used to execute the semiconductor process anomaly detection method provided by the embodiment of the present application. The semiconductor process anomaly detection device provided by the embodiment of the present application is introduced below.

[0056] Figure 2 Schematic diagram of a semiconductor process abnormality detection device according to an embodiment of the present application. Figure 2 As shown, the device comprises:

[0057] The acquisition unit 10 is used to acquire process data of the abnormal wafer and the normal wafer manufactured in the same process step in the case of an abnormal wafer, and obtain first process data and second process data respectively, wherein the abnormal wafer is a wafer whose performance does not meet the predetermined requirements, and the normal wafer is a wafer whose performance meets the predetermined requirements;

[0058] The judgment unit 20 is used to judge whether the process step of the abnormal wafer is abnormal according to the first process data and the second process data.

[0059] The above-mentioned device includes an acquisition unit and a judgment unit, wherein the acquisition unit is used to acquire the first process data and the second process data of the abnormal wafer and the normal wafer produced in the same process step in the presence of an abnormal wafer, and the judgment unit is used to judge whether the above process step of the abnormal wafer is abnormal based on the first process data and the second process data. In the device, when the finished wafer does not meet the performance requirements of the predetermined requirements, the first process data and the second process data of the abnormal wafer and the normal wafer are obtained when they are produced in the same process step. According to the first process data of the abnormal wafer and the second process data of the normal wafer, it can be determined whether the step is abnormal, which solves the problem of the lack of methods for detecting whether the semiconductor manufacturing process step is abnormal in the prior art, thereby realizing the detection of whether the semiconductor manufacturing process step is abnormal, and then the parameters of the relevant process steps can be adjusted according to the detection results to avoid greater losses in the subsequent semiconductor manufacturing.

[0060] Specifically, the first process data and the second process data are process data collected by machine sensors at the stage of each process step when manufacturing wafers. The first process data and the second process data may be temperature, humidity, pressure, etc. There may be multiple first process data and the second process data, for example, multiple abnormal wafers correspond to multiple first process data, and multiple normal wafers correspond to multiple second process data.

[0061] In one embodiment of the present application, the acquisition unit includes a first acquisition module, a first acquisition module, an adjustment module, and a second acquisition module, wherein the first acquisition module is used to number the process steps, the same process steps have the same number, and multiple process numbers are obtained; the first acquisition module is used to obtain the first predetermined process data when making the above-mentioned normal wafer and the second predetermined process data when making the above-mentioned abnormal wafer corresponding to each of the above-mentioned process steps, wherein, when making one of the above-mentioned wafers, multiple identical process steps with time intervals correspond to the same process number, for example, the process step corresponding to the first process number is photolithography, the process step corresponding to the second process number is etching, and the process step corresponding to the third process number is etching. The process step is deposition, and then the above-mentioned manufacturing process is repeated, and the repeated lithography still corresponds to the first process number; the adjustment module is used to adjust the above-mentioned process number according to the above-mentioned first predetermined process data and the above-mentioned second predetermined process data, and obtain the adjusted above-mentioned process number, and the above-mentioned adjustment includes at least one of the following: adjusting the adjacent different above-mentioned process numbers to the same above-mentioned process number, and adjusting the above-mentioned process numbers corresponding to two identical above-mentioned process steps to different above-mentioned process numbers; the second acquisition module is used to obtain the process data of the above-mentioned abnormal wafer and the above-mentioned normal wafer when the above-mentioned process step corresponding to the same adjusted above-mentioned process number is produced, and the first process data and the second process data are obtained respectively. In this embodiment, the process steps are numbered, and the same process steps with interval time have the same number. When obtaining each process step, the first predetermined process data when making a normal wafer and the second predetermined process data when making an abnormal wafer are adjusted, and the process number is adjusted according to the first predetermined process data and the second predetermined process data, and different process numbers are adjusted to the same or the same process number is adjusted to a different process number, so that the process step corresponding to the adjusted process number can more accurately represent the process step corresponding to the wafer production, so that it can be more accurately determined which process step has a problem.

[0062] In a specific embodiment of the present application, the above interval is 5-7 seconds, that is, the same process steps within 5-7 seconds correspond to the same process number. Of course, in actual applications, the above interval can also be other values, and those skilled in the art can choose according to actual conditions.

[0063] In another embodiment of the present application, the adjustment module includes a first adjustment submodule, wherein the first adjustment submodule is used to adjust the corresponding two identical process numbers to two different process numbers when the difference between the two first predetermined process data corresponding to the two adjacent identical process numbers is greater than the first predetermined difference, and / or when the difference between the two second predetermined process data corresponding to the two adjacent identical process numbers is greater than the first predetermined difference, to obtain the first predetermined number and the second predetermined number. The two identical process numbers adjusted are the process numbers corresponding to the two first predetermined process data whose difference is greater than the predetermined difference, or the two identical process numbers adjusted are the process numbers corresponding to the two second predetermined process data. For example, the process step corresponding to the first process number is photolithography, the process step corresponding to the second process number is etching, and the process step corresponding to the third process number is deposition, and then the above-mentioned manufacturing process is repeated, and the repeated photolithography still corresponds to the first process number. If the first predetermined process data collected during the first photolithography is different from the first predetermined process data collected during the second photolithography, the first process numbers corresponding to the two photolithography are adjusted, and the process number of the first photolithography and the process number of the second photolithography are adjusted to different process numbers. In order to distinguish which step of the same process step has an abnormality, in this embodiment, when the adjacent first predetermined process data and / or second predetermined process data are greater than the first predetermined difference, it indicates that the adjacent same process steps correspond to different process data, so it is necessary to adjust the numbers corresponding to the process steps, and adjust the two same process numbers to different numbers. In this way, when the process steps corresponding to the adjusted process numbers are obtained, the first process data and the second process data of the abnormal wafer and the normal wafer are produced. According to the first process data and the second process data, it can be accurately determined which same process step has the abnormality, thereby further improving the detection accuracy.

[0064] Specifically, the first reservation number and the second reservation number may both be adjusted to new numbers, or the first reservation number may remain the original number and the second reservation number may be adjusted to a new number, or the first reservation number may be adjusted to a new number and the second reservation number may remain the original number.

[0065] In a specific embodiment of the present application, the first predetermined difference is 0, and when adjacent first predetermined process data and / or second predetermined process data are different, the process number is adjusted. In actual applications, the first predetermined difference is not limited to 0, and can also be other values.

[0066] In another embodiment of the present application, the adjustment module includes a second adjustment submodule, wherein the second adjustment submodule is used to adjust the corresponding predetermined process number to two identical process numbers to obtain a third process number when the difference between the two first predetermined process data corresponding to the two adjacent different process steps is less than the second predetermined difference, and / or when the difference between the two second predetermined process data corresponding to the two adjacent different process steps is less than the second predetermined difference. In this embodiment, when the two first predetermined process data and / or the second predetermined process data corresponding to the two adjacent different process steps are less than the second predetermined difference, it indicates that the predetermined process data corresponding to the two adjacent different process steps are similar, and then the corresponding predetermined process number is adjusted to two identical third process numbers, so that when acquiring the first process data and the second process data, only one process step needs to be acquired, so that the process number more accurately represents the process step corresponding to the wafer manufacturing, thereby further improving the accuracy of detection.

[0067] Specifically, the third number may be any one of the process numbers corresponding to two adjacent different process steps, or may be a new number that is different from both process numbers.

[0068] In a specific embodiment of the present application, the second predetermined difference needs to be determined according to the ratio of the first predetermined process data or the second predetermined process data, and the ratio is 1% of the first first predetermined process data or the second predetermined process data of the two first predetermined process data or the second predetermined process data corresponding to the two different process steps. Similarly, the second predetermined difference can also be other values, which can be selected by those skilled in the art according to actual conditions.

[0069] In another embodiment of the present application, the acquisition unit includes a second acquisition module and a third acquisition module, wherein the second acquisition module is used to produce multiple process data of the above-mentioned abnormal wafer and the above-mentioned normal wafer in the same process step and within a predetermined time, respectively, to obtain multiple first original data and multiple second original data; the third acquisition module is used to calculate the average value of the above-mentioned first original data and the above-mentioned second original data, respectively, to obtain the above-mentioned first process data and the above-mentioned second process data. In this embodiment, since there are a lot of process data acquired by the machine, it is necessary to process the process data, and calculate the average value of the multiple process data of the above-mentioned abnormal wafer and the above-mentioned normal wafer produced in the same process step and within a predetermined time to obtain the first process data and the second process data. In this way, there is no need to process the multiple first original data and the multiple second original data one by one, which further saves the detection time.

[0070] In another specific embodiment of the present application, the above-mentioned predetermined time of the present application is 10 minutes. For example, the machine sensor collects process data once every 1 second, and calculates the average value of the process data corresponding to the same process steps within 10 minutes, which greatly reduces the amount of process data that needs to be obtained and shortens the detection time.

[0071] In another embodiment of the present application, the judgment unit includes a determination module, wherein the determination module is used to determine that the corresponding process step is abnormal when the first process data is not within a predetermined range, and the predetermined range is a range determined according to the corresponding second process data, and the second process data is within the predetermined range. In this embodiment, the predetermined range is determined based on the second process data corresponding to the normal wafer. If the first process data is not within the predetermined range, it proves that the process step is abnormal, so that the accuracy of the detection is further improved. At the same time, since there is no need to compare the first process data and the second process data one by one, the detection time is greatly solved, thereby improving the efficiency of the detection.

[0072] In another specific embodiment of the present application, there are multiple first process data and multiple second process data, and the first process data need to be compared with a predetermined range one by one. For example, there are multiple abnormal wafers corresponding to multiple first process data, and the first process data corresponding to each abnormal wafer is compared with the predetermined range. If the first process data corresponding to the abnormal wafer is not within the predetermined range, an abnormality has occurred in the process step corresponding to the first process data of the abnormal wafer, and then the next abnormal wafer is compared.

[0073] In another embodiment of the present application, the process of determining the above-mentioned predetermined range includes: in the case where there are multiple normal wafers, determining that the maximum value of the above-mentioned predetermined range is the sum of the maximum second process data corresponding to the same process step and the first predetermined value, and the minimum value of the above-mentioned predetermined range is the difference between the minimum second process data corresponding to the same process step and the second predetermined value, the first predetermined value is greater than or equal to 0, and the second predetermined value is greater than or equal to 0; in the case where there is only one normal wafer, determining that the maximum value of the above-mentioned predetermined range is the sum of the second process data corresponding to the same process step and the third predetermined value, and the minimum value of the above-mentioned predetermined range is the difference between the second process data corresponding to the same process step and the fourth predetermined value, the third predetermined value is greater than or equal to 0, and the fourth predetermined value is greater than or equal to 0. In this embodiment, the above-mentioned predetermined range has different determination methods according to the number of normal wafers. When there is only one normal wafer, the maximum value of the predetermined range is the sum of the second process data of the normal wafer and the third predetermined value, and the minimum value of the predetermined range is the difference between the second process data of the normal wafer and the fourth predetermined value; when there are multiple normal wafers, the maximum value of the predetermined range is the sum of the largest second process data and the first predetermined value, and the minimum value of the predetermined range is the difference between the smallest second process data and the second predetermined value, which makes the determination process of the predetermined range more accurate, thereby further improving the accuracy of detection.

[0074] The first predetermined value, the second predetermined value, the third predetermined value and the fourth predetermined value may be the same value or different values, and those skilled in the art may select them according to actual conditions.

[0075] Of course, the above-mentioned "determining whether the above-mentioned process steps of the above-mentioned abnormal wafer are abnormal based on the above-mentioned first process data and the above-mentioned second process data" of the present application is not limited to the above-mentioned process, but can also be to respectively calculate the maximum value, minimum value, median and lower quartile of the first process data and the second process data, and then compare the above-mentioned values.

[0076] In another embodiment of the present application, the above process steps are process steps for manufacturing a memory. The method of the present application can be applied to all process steps during memory manufacturing, so that it is possible to more accurately determine which process step has a problem and adjust the parameters of the process step to avoid greater losses in subsequent memory manufacturing.

[0077] The above-mentioned semiconductor process anomaly detection device includes a processor and a memory. The above-mentioned acquisition unit and judgment unit, etc. are all stored in the memory as program units, and the processor executes the above-mentioned program units stored in the memory to realize corresponding functions.

[0078] The processor includes a kernel, which calls the corresponding program unit from the memory. One or more kernels can be set, and the kernel parameters can be adjusted to detect whether the process steps are abnormal.

[0079] The memory may include non-permanent memory in a computer-readable medium, random access memory (RAM) and / or non-volatile memory, such as read-only memory (ROM) or flash RAM, and the memory includes at least one memory chip.

[0080] An embodiment of the present invention provides a storage medium on which a program is stored. When the program is executed by a processor, the above-mentioned semiconductor process abnormality detection method is implemented.

[0081] An embodiment of the present invention also provides a semiconductor process anomaly detection system of the present application, comprising a process manufacturing machine, one or more processors, a memory and one or more programs, wherein the one or more programs are stored in the memory and configured to be executed by the one or more processors, and the one or more programs include methods for executing any one of the above methods.

[0082] The above-mentioned detection system includes a process production machine, one or more processors, a memory and one or more programs, and the one or more programs include a method for executing any of the above-mentioned methods. In this method, when the finished wafer does not meet the predetermined performance requirements, the first process data and the second process data of the abnormal wafer and the normal wafer when they are produced in the same process steps are obtained. According to the first process data of the abnormal wafer and the second process data of the normal wafer, it can be determined whether the step is abnormal, thereby realizing the detection of whether the semiconductor manufacturing process step has an abnormality, solving the problem of the lack of methods in the prior art that can detect whether the semiconductor manufacturing process step has an abnormality, and then the parameters of the relevant process steps can be adjusted according to the detection results to avoid causing greater losses in subsequent semiconductor production.

[0083] An embodiment of the present invention provides a device, the device comprising a processor, a memory, and a program stored in the memory and executable on the processor, and when the processor executes the program, at least the following steps are implemented:

[0084] Step S101, in the case of an abnormal wafer, obtaining process data of the abnormal wafer and the normal wafer manufactured in the same process steps, and obtaining first process data and second process data respectively, wherein the abnormal wafer is a wafer whose performance does not meet the predetermined requirements, and the normal wafer is a wafer whose performance meets the predetermined requirements;

[0085] Step S102 , judging whether the process step of the abnormal wafer is abnormal according to the first process data and the second process data.

[0086] The devices in this article can be servers, PCs, PADs, mobile phones, etc.

[0087] The present application also provides a computer program product, which, when executed on a data processing device, is suitable for executing a program for initializing at least the following method steps:

[0088] Step S101, in the case of an abnormal wafer, obtaining process data of the abnormal wafer and the normal wafer manufactured in the same process steps, and obtaining first process data and second process data respectively, wherein the abnormal wafer is a wafer whose performance does not meet the predetermined requirements, and the normal wafer is a wafer whose performance meets the predetermined requirements;

[0089] Step S102 , judging whether the process step of the abnormal wafer is abnormal according to the first process data and the second process data.

[0090] In order to enable those skilled in the art to more clearly understand the technical solution of the present application, the following will be described in conjunction with specific embodiments:

[0091] Example

[0092] Figure 3 and Figure 4 The first process data of the abnormal wafer and the second process data of the normal wafer in the first process step are shown. Figure 5 The box plots of the abnormal wafer and the normal wafer are obtained by calculating the maximum value, minimum value, median and lower quartile of the first process data and the second process data respectively. It can be seen from the figure that the first process data and the second process data are different, so an abnormality occurred in the first step.

[0093] Figure 6 and Figure 7 The first process data of the abnormal wafer and the second process data of the normal wafer in the second process step are shown. Figure 8 The box plots of abnormal wafers and normal wafers are obtained by calculating the maximum value, minimum value, median and lower quartile of the first process data and the second process data respectively. It can be seen from the figure that the first process data and the second process data are different, so an abnormality occurred in the second step.

[0094] The principle of adjusting the process number in this embodiment is as follows: Fig. 9 As shown, from Fig. 9It can be seen that when the process number is 2-7, the first process data is obviously different, so in order to distinguish which process number corresponds to the process step that has an abnormality, the two identical process numbers need to be adjusted to different process numbers; when the process number is 13-20, the first process data is approximately the same, so these process numbers can be merged together, so when analyzing whether the process data is abnormal, only one process step needs to be analyzed.

[0095] In the embodiments provided in the present application, it should be understood that the disclosed technical content can be implemented in other ways. Among them, the device embodiments described above are only schematic. For example, the division of the above-mentioned units can be a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of units or modules, which can be electrical or other forms.

[0096] The units described above as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple units. Some or all of the units may be selected according to actual needs to achieve the purpose of the present embodiment.

[0097] In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0098] If the above-mentioned integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions for a computer device (which can be a personal computer, a server or a network device, etc.) to perform all or part of the steps of the above-mentioned methods of each embodiment of the present invention. The aforementioned storage medium includes: U disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), mobile hard disk, magnetic disk or optical disk and other media that can store program codes.

[0099] From the above description, it can be seen that the above embodiments of the present application achieve the following technical effects:

[0100] 1) The semiconductor process anomaly detection method of the present application, in the case of an abnormal wafer, first obtains the first process data and the second process data of the abnormal wafer and the normal wafer produced in the same process step, and then determines whether the above process step of the abnormal wafer is abnormal based on the first process data and the second process data. In this method, when the finished wafer does not meet the performance requirements of the predetermined requirements, the first process data and the second process data of the abnormal wafer and the normal wafer are obtained when they are produced in the same process step. According to the first process data of the abnormal wafer and the second process data of the normal wafer, it can be determined whether the step is abnormal, thereby realizing the detection of whether the semiconductor manufacturing process step is abnormal, solving the problem of the lack of methods for detecting whether the semiconductor manufacturing process step is abnormal in the prior art, and then the parameters of the relevant process steps can be adjusted according to the detection results to avoid greater losses in subsequent semiconductor manufacturing.

[0101] 2) The semiconductor process anomaly detection device of the present application includes an acquisition unit and a judgment unit, wherein the acquisition unit is used to acquire the first process data and the second process data of the abnormal wafer and the normal wafer produced in the same process step in the presence of an abnormal wafer, and the judgment unit is used to judge whether the above process step of the abnormal wafer is abnormal based on the above first process data and the above second process data. In the device, when the finished wafer does not meet the performance requirements of the predetermined requirements, the first process data and the second process data of the abnormal wafer and the normal wafer when they are produced in the same process step are acquired. Based on the first process data of the abnormal wafer and the second process data of the normal wafer, it can be determined whether the step is abnormal, thereby realizing the detection of whether the semiconductor manufacturing process step is abnormal, solving the problem of the lack of methods for detecting whether the semiconductor manufacturing process step is abnormal in the prior art, and then the parameters of the relevant process steps can be adjusted based on the detection results to avoid greater losses in the subsequent semiconductor manufacturing.

[0102] 3) The semiconductor process anomaly detection system of the present application includes a process manufacturing machine, one or more processors, a memory and one or more programs, and the one or more programs include a method for executing any one of the above-mentioned methods. In the method, when the finished wafer does not meet the predetermined performance requirements, the first process data and the second process data of the abnormal wafer and the normal wafer when they are manufactured in the same process steps are obtained. According to the first process data of the abnormal wafer and the second process data of the normal wafer, it can be determined whether the step is abnormal, thereby realizing the detection of whether the semiconductor manufacturing process step has an abnormality, solving the problem of lack of methods for detecting whether the semiconductor manufacturing process step has an abnormality, and then the parameters of the relevant process steps can be adjusted according to the detection results to avoid greater losses in subsequent semiconductor manufacturing.

[0103] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A method for detecting semiconductor process anomalies, characterized in that: include: In the case of an abnormal wafer, process data of manufacturing the abnormal wafer and a normal wafer in the same process step are obtained to obtain first process data and second process data respectively, wherein the abnormal wafer is a wafer whose performance does not meet the predetermined requirements, and the normal wafer is a wafer whose performance meets the predetermined requirements; determining whether the process step of the abnormal wafer is abnormal according to the first process data and the second process data, In the case of an abnormal wafer, process data of manufacturing the abnormal wafer and the normal wafer in the same process step are obtained to obtain first process data and second process data respectively, including: The process steps are numbered, and the same process steps are numbered the same, thereby obtaining multiple process numbers; Acquire the first predetermined process data when manufacturing the normal wafer and the second predetermined process data when manufacturing the abnormal wafer corresponding to each of the process steps, wherein, when manufacturing one wafer, a plurality of identical process steps spaced apart in time correspond to the same process number; According to the first predetermined process data and the second predetermined process data, the process number is adjusted to obtain the adjusted process number, wherein the adjustment includes at least one of the following: adjusting adjacent different process numbers to the same process number, and adjusting the process numbers corresponding to two identical process steps to different process numbers; When the process steps corresponding to the same adjusted process number are obtained, process data of the abnormal wafer and the normal wafer are produced to obtain the first process data and the second process data, respectively.

2. The method according to claim 1, characterized in that Adjusting the process number according to the first predetermined process data and the second predetermined process data to obtain the adjusted process number includes: When the difference between the two first predetermined process data corresponding to two adjacent identical process numbers is greater than the first predetermined difference, and / or when the difference between the two second predetermined process data corresponding to two adjacent identical process numbers is greater than the first predetermined difference, the corresponding two identical process numbers are adjusted to two different process numbers to obtain the first predetermined number and the second predetermined number.

3. The method according to claim 1, characterized in that: Adjusting the process number according to the first predetermined process data and the second predetermined process data to obtain the adjusted process number includes: When the difference between the two first predetermined process data corresponding to two adjacent different process steps is less than the second predetermined difference, and / or when the difference between the two second predetermined process data corresponding to two adjacent different process steps is less than the second predetermined difference, the corresponding predetermined process numbers are adjusted to two identical process numbers to obtain a third process number.

4. The method according to any one of claims 1 to 3, characterized in that Acquiring process data of manufacturing the abnormal wafer and the normal wafer in the same process step to obtain first process data and second process data respectively, including: In the same process step and within a predetermined time, a plurality of process data of the abnormal wafer and the normal wafer are produced to obtain a plurality of first original data and a plurality of second original data; The average values ​​of the first original data and the second original data are calculated respectively to obtain the first process data and the second process data.

5. The method according to any one of claims 1 to 3, characterized in that Judging whether the process step of the abnormal wafer is abnormal according to the first process data and the second process data includes: When the first process data is not within a predetermined range, it is determined that an abnormality occurs in the corresponding process step, the predetermined range being a range determined according to the corresponding second process data, and the second process data is within the predetermined range.

6. The method according to claim 5, characterized in that The process of determining the predetermined range includes: In the case where there are multiple normal wafers, the maximum value of the predetermined range is determined to be the sum of the largest second process data corresponding to the same process step and a first predetermined value, the minimum value of the predetermined range is the difference between the smallest second process data corresponding to the same process step and a second predetermined value, the first predetermined value is greater than or equal to 0, and the second predetermined value is greater than or equal to 0; In the case that there is one normal wafer, the maximum value of the predetermined range is determined to be the sum of the second process data corresponding to the same process step and a third predetermined value, the minimum value of the predetermined range is determined to be the difference between the second process data corresponding to the same process step and a fourth predetermined value, the third predetermined value is greater than or equal to 0, and the fourth predetermined value is greater than or equal to 0.

7. The method according to claim 1, characterized in that The process steps are process steps for manufacturing a memory.

8. A semiconductor process abnormality detection device, characterized in that: include: an acquisition unit, configured to acquire process data of the abnormal wafer and the normal wafer manufactured in the same process step in the case of an abnormal wafer, and obtain first process data and second process data respectively, wherein the abnormal wafer is a wafer whose performance does not meet the predetermined requirements, and the normal wafer is a wafer whose performance meets the predetermined requirements; a judging unit, configured to judge whether an abnormality occurs in the process step of the abnormal wafer according to the first process data and the second process data, The acquisition unit includes a first acquisition module, a first acquisition module, an adjustment module and a second acquisition module, wherein the first acquisition module is used to number the process steps, the same process steps have the same number, and multiple process numbers are obtained; the first acquisition module is used to obtain the first predetermined process data when making the normal wafer and the second predetermined process data when making the abnormal wafer corresponding to each process step, wherein when making one wafer, multiple identical process steps with time intervals correspond to the same process number; the adjustment module is used to adjust the process number according to the first predetermined process data and the second predetermined process data to obtain the adjusted process number, wherein the adjustment includes at least one of the following: adjusting adjacent different process numbers to the same process number, adjusting the process numbers corresponding to two identical process steps to different process numbers; the second acquisition module is used to obtain the process data of the abnormal wafer and the normal wafer when the process step corresponding to the same adjusted process number is made, and the first process data and the second process data are obtained respectively.

9. A computer-readable storage medium, characterized in that: The computer-readable storage medium includes a stored program, wherein the program executes the method of any one of claims 1 to 7.

10. A semiconductor process anomaly detection system, characterized in that: include: A process manufacturing machine, one or more processors, a memory and one or more programs, wherein the one or more programs are stored in the memory and are configured to be executed by the one or more processors, and the one or more programs include methods for executing any one of claims 1 to 7.

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