IT containment systems and tandem configurations

Abstract

According to various embodiments, described herein are systems and methods for designing and configuring a cooling system for a server rack in an IT cluster. In one embodiment, a cooling system may include: a connection module having a fluid circuit connection and a standard fluid port; and a plurality of cooling modules, such as a heat exchanger module, a pump module, and a first bypass module, and a second bypass module. The connection module may connect the cooling modules together using standard fluid connections and standard ports to form a complete multifunctional cooling unit. The cooling unit may be attached to an IT enclosure via fluid ports on the connection module, and a fluid circuit is connected between the IT enclosure and each individual cooling module. The connection module, including cooling ports, fluid circuit connections, may be customized to accommodate the assembly and corresponding functions of different standard cooling modules.

Description

Technical Field

[0001] Embodiments of the present disclosure generally relate to airflow management in a data center. More specifically, embodiments of the present disclosure relate to cooling systems for a data center and methods of designing and configuring cooling systems for a data center. Background Art

[0002] As AI applications flourish, high-performance computing, cloud computing and data-driven applications, data centers, and computing and storage infrastructure become increasingly critical for companies to maintain their competitive advantage. Maintaining data centers is expensive, and part of the expense is related to cooling the data center.

[0003] The size of data centers can keep growing, and it can become expensive to service and maintain cooling systems in data centers. In some data centers, all cooling hardware units are integrated into inseparable units. If a specific component fails, the entire cooling system may need to be replaced or redesigned, which greatly increases the service and maintenance costs of the data center. In addition, as more efficient cooling hardware becomes available, it is difficult to insert new hardware into an existing cooling system. Therefore, designing the cooling solution and IT enclosure in a combined manner can benefit modern IT clusters and hardware. Summary of the invention

[0004] According to one aspect of the present application, a cooling system in a data center is provided, and the cooling system in the data center may include:

[0005] A cooling unit comprising a connection module and a plurality of cooling modules, wherein the connection module connects the plurality of cooling modules using a plurality of fluid circuit connections and a plurality of fluid ports in the connection module, wherein the plurality of cooling modules include one or more bypass modules, and a fluid outlet port is disposed on one of the one or more bypass modules; and

[0006] an information technology (IT) enclosure attached to the cooling unit, the IT enclosure housing one or more servers, each server housing one or more processors,

[0007] wherein the IT enclosure includes a fluid inlet port, wherein cooling fluid enters the cooling system via the fluid inlet port on the IT enclosure and leaves the cooling system via the fluid outlet port on one of the one or more bypass modules, and wherein the cooling fluid is used to reduce the temperature of the processor of the server.

[0008] According to another aspect of the present application, a method for creating a cooling system for a data center is provided. The method for creating a cooling system for a data center may include:

[0009] providing a cooling unit, the cooling unit comprising a connection module and a plurality of cooling modules, wherein the connection module connects the plurality of cooling modules using a plurality of fluid circuit connections and a plurality of fluid ports in the connection module, wherein the plurality of cooling modules comprises at least one bypass module, and a fluid outlet port is provided on one of the one or more bypass modules;

[0010] providing an information technology (IT) enclosure attached to the cooling unit, wherein the IT enclosure includes a fluid inlet port, wherein the IT enclosure houses one or more servers, and each server includes one or more processors, and

[0011] A cooling fluid is received into the cooling system via the fluid inlet port on the IT enclosure, wherein the cooling fluid exits the cooling system via a fluid outlet port on one of the one or more bypass modules, and wherein the cooling fluid is used to reduce a temperature of the processor of the server. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Embodiments of the invention are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings in which like references indicate similar elements.

[0013] Figure 1 is a schematic diagram showing a cooling system according to one embodiment.

[0014] Figure 2 A plan view of a connection module according to one embodiment is shown.

[0015] Figure 3 Another view of a cooling system according to one embodiment is shown.

[0016] Figure 4 A system design for connecting a cooling unit to an IT enclosure is shown according to one embodiment.

[0017] FIG. 5A to FIG. 5B A system design for connecting an IT enclosure to a cooling unit is shown according to one embodiment.

[0018] Figure 6 An exemplary design of a cooling system according to one embodiment is shown.

[0019] Figure 7 A process for creating a cooling system for a data center is shown. DETAILED DESCRIPTION

[0020] Various embodiments and aspects of the present invention will be described with reference to the details discussed below, and the accompanying drawings will illustrate various embodiments. The following description and accompanying drawings are illustrative of the present invention and do not constitute a limitation of the present invention. Many specific details are described to provide a thorough understanding of various embodiments of the present invention. However, in some cases, in order to provide a concise discussion of embodiments of the present invention, known or conventional details are not described.

[0021] Reference in the specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in conjunction with the embodiment may be included in at least one embodiment of the invention. The phrase "in one embodiment" appearing in various places in the specification does not necessarily refer to the same embodiment.

[0022] According to various embodiments, described herein are systems for server racks in an IT cluster or data center and methods for designing and configuring cooling systems for server racks in an IT cluster or data center. In one embodiment, the cooling system may include a connection module with standard fluid connections and standard fluid ports and a plurality of cooling modules, such as a heat exchanger module, a pump module, and a first bypass module, and a second bypass module. The connection module may use standard fluid connections and standard ports to connect the cooling modules together as a single cooling unit, which may also be understood as a complete cooling module. The cooling unit may be attached to an IT enclosure, which may be an IT rack with cooling hardware / system.

[0023] In one embodiment, a fluid connection may connect the IT enclosure to the connection module and connect multiple pairs of cooling modules. The fluid connection is assembled in the connection module. For example, a fluid connection may connect a first bypass module and a second bypass module, while another fluid connection may connect a heat exchanger and a pump module. In one embodiment, the two fluid connections are also connected by a bidirectional loop in the connection module.

[0024] In one embodiment, a pair of fluid ports may be attached to either side of the IT enclosure. Since the IT enclosure is bi-directional and allows cooling fluid to pass through the IT enclosure from either side, either of the pair of fluid ports may be used as an inlet fluid port or an outlet fluid port. The inlet fluid port and the outlet fluid port on the IT enclosure are connected through internal fluid connections or other fluid management solutions within the IT enclosure. To enable fluid to flow from the outlet fluid port on the IT enclosure to the second bypass module, a portion of the fluid connection may be in an extension fluid connection that connects the IT enclosure outlet fluid port to the second bypass module inlet fluid port and enables cooling fluid to flow.

[0025] In one embodiment, a fluid port may also be attached to the first bypass module and serve as an outlet fluid port for the cooling system.Cooling fluid may enter the cooling system via the inlet fluid port on the IT enclosure and may exit the cooling system via the outlet fluid port.

[0026] In one embodiment, the connection module and the cooling module can be assembled together to form a cooling unit. Although the IT enclosure is bidirectional, meaning that both fluid ports on the IT enclosure can be used as an inlet or an outlet, the cooling unit is unidirectional, meaning that the cooling fluid can only pass through the connection module and multiple cooling modules in the cooling unit from one direction. Therefore, the outlet fluid port on the first bypass module in the cooling unit can only be used as an outlet fluid port and cannot be used as an inlet fluid port because the fluid flow direction is controlled by the pump. In another embodiment, if the pump in the module is changed and its fluid pumping direction is changed, the fluid port on the second bypass loop is used as an outlet port, and the fluid port on the first bypass loop is used only as an inlet port.

[0027] In one embodiment, the connection module can be customized based on the design requirements of the cooling system and the characteristics of the cooling modules. The characteristics of the IT enclosure are also considered in the design of the cooling system. The cooling modules can be independently repaired and replaced during normal operation of the cooling system. If any one of the cooling modules fails or fails, the two bypass loops will be used to generate a complete loop for the cooling fluid without the failed cooling module participating, thereby ensuring that the failed cooling module can be replaced with minimal impact on the normal operation of the cooling system.

[0028] The modules are connected to the cooling module through standard ports, the connection modules can be customized for different cooling systems, and the fluid connections within the connection modules are used to connect the modules into a complete system.

[0029] The various embodiments described above enable different types of cooling hardware to be integrated into a cooling system, and also enable easy repair and maintenance of existing cooling hardware in the system. Any cooling hardware (e.g., cooling module) can be replaced by inserting a replacement cooling module into the cooling system via a standard fluid port. Using the above features, various cooling systems can be designed, configured, and manufactured, including liquid cooling systems, immersion cooling systems, and hybrid cooling systems.

[0030] Additional advantages of this system include a more efficient rack structure for deploying cooling systems with different types of cooling configurations; a modular design to provide flexibility for repair and maintenance; eliminating the complexity of system or facility loops; and decoupling cooling system design from equipment loop design.

[0031] Another advantage of this cooling system is that different standard cooling modules can be plugged into the connection module to form different cooling systems with different functions, which increases the modularity of the system.

[0032] Other advantages of this cooling system include compatibility with different IT or server configurations, as thermal management and heat transfer capabilities are individually configured; rapid adaptation to changes in deployment requirements; and high reliability.

[0033] Figure 1 1 is a schematic diagram showing a cooling system 100 according to one embodiment. The cooling system 100 includes a plurality of cooling modules, such as cooling module A 101, cooling module B 103, cooling module C 105, and cooling module D 107. Cooling module A 101 and cooling module B 103 are bypass modules, cooling module C 105 is a pumping module, and cooling module D 107 is a heat transfer module. The plurality of cooling modules 101-107 may be assembled together as a cooling unit, and in one embodiment, the cooling unit may include a bypass loop.

[0034] In one embodiment, cooling module A 101 includes bypass loop A 125 and port B 111, which is a standard fluid outlet port. Port B 111 is attached to cooling module A 101, and fluid flows out of cooling system 100 from port 111. In addition, within cooling module A 101, a two-way valve 124 is used to control the fluid so that the fluid can move in either way. In one embodiment, cooling module A 101 can be combined with cooling module B 103.

[0035] In one embodiment, cooling module B 103 includes bypass loop B 131, which is a more complex bypass loop than bypass loop A 125. Bypass loop B 131 includes a four-way valve 119 and a buffer unit 121 for the heat exchanger 127 in cooling module portion D 107. The buffer unit 121 is controlled by the four-way valve 119 and the two-way valve 123 in the bypass loop 131. Port A 109 attached to cooling module B 103 is a fluid inlet port for the cooling unit and can receive cooling fluid from an inlet fluid port for the cooling system 100 via an extended fluid connection. In one embodiment, the extended fluid connection can include multiple fluid connections and multiple fluid ports and enable cooling fluid to enter cooling module B 103, from which the cooling fluid can pass through multiple cooling modules 101-107 in series and exit the cooling system 100 at port B 111.

[0036] In one embodiment, the buffer 121 may be a buffer unit for buffering the cooling system 101 to prevent changes in fluid flow rate and pressure so that the cooling fluid flowing out of the cooling system 100 at the port B 111 may have a desired condition.

[0037] In one embodiment, the four-way valve 119 may include multiple operating positions. For example, in position #1, the four-way valve 119 may be connected to the cooling module D 107; in position #2, the four-way valve 119 may direct the bypass loop B 131; and in position #3, the four-way valve 119 may be connected to the buffer unit 121. In one embodiment, the four-way valve 119 may be partially open to multiple positions, for example, only positions #1 and #3 are open, while position #2 is closed.

[0038] In one embodiment, cooling module C 105 includes a pump 113 for moving fluid within cooling system 100. Cooling module D 107 includes a heat exchanger 107 connected to an external cooling source via port C 117 and port D 115 to complete the fluid circuit. Figure 1 As shown, port D 115 is used for cooling fluid from another cooling source to enter the heat exchanger 127, and port C 117 is used for cooling fluid to exit the heat exchanger.

[0039] In one embodiment, bypass loop A 125 is parallel to cooling module C 105, while bypass loop B 131 is parallel to portion D 107. Additionally, a bidirectional loop 137 may be provided between cooling module A 101 and cooling module C 105 to allow cooling fluid to flow between the two cooling modules 101 and 105.

[0040] In one embodiment, each of the cooling modules 105 and 107 can be replaced without affecting the fluid recirculation of the cooling system 100. The cooling system 100 can still function without the cooling modules 105 and 107 because the cooling fluid can bypass the cooling modules 105 and 107 via the bypass loop B 131 and the bypass loop A 125, as well as being pumped by the other 105 in the loop. However, since the fluid inlet port A 109 is attached to the cooling module B 103 via an extended fluid connection, and the fluid outlet port B 111 is attached to the cooling module A 101, replacing the cooling module B 103 or the cooling module A 101 may affect the system operation.

[0041] In one embodiment, the cooling modules 101-107 can be connected using a connection module including a plurality of fluid connections 130, 133, 134 and 135, each of which connects a pair of fluid ports (in Figure 1 Only one for each fluid connection is shown). Figure 1 The two pairs of fluid connections shown are connected to each other. The connection module will be discussed in detail below.

[0042] Figure 2 1 shows a plan view of a connection module 200 according to one embodiment. This figure is used to highlight the key components and functions of the connection module 200. The connection module 200 may include a plurality of fluid connections 217-223 and a bidirectional loop 137. Each of the fluid connections 217-223 may be connected to a pair of fluid ports 201-215. The fluid connections may be designed taking into account the corresponding cooling modules 101-107 to be attached to the connection module 200. Figure 2 As shown, fluid connection 217 is connected to fluid ports 201 and 209, fluid connection 219 is connected to fluid ports 203 and 205, fluid connection 221 is connected to fluid ports 207 and 215, and fluid connection 223 is connected to fluid ports 211 and 213. Each of the fluid connections 217-223 is a one-way loop. The one-way feature of each fluid connection is defined by the cooling module attached thereto. Each fluid connection is physically capable of allowing cooling fluid to pass in a two-way manner. All fluid connections 217-233 are one-way fluid connections through which cooling fluid can flow. As further shown, the one-way loops 217 and 221 are connected by a two-way loop 137.

[0043] In one embodiment, the fluid ports connected to the fluid connections 217-233 are all standard fluid ports and are located and assembled in the connection module 200. The cooling modules 101-107 can be inserted into the connection module 200 via the standard fluid ports.

[0044] In one embodiment, each of the cooling modules 101-107 can be a standard module. By customizing the fluid connections 217-223 and the bidirectional loop 137 in the connection module 200, various cooling systems can be generated. Such cooling systems are highly reliable, easy to customize, and easy to assemble.

[0045] Figure 3Another view of the cooling system 100 assembled by the connection module 301 according to one embodiment is shown. In this embodiment, the cooling modules 101-107 are arranged in parallel with the connection module 301. The connection module 301 may include fluid connections 303-311 arranged in series. The arrangement of the cooling modules 101-107 is an example of how the cooling modules 101-107 can be arranged. In other embodiments, various other arrangements can be used, and the cooling modules 101-107 can be arranged in many other different orders. For example, cooling module D 107 and cooling module B 103 can switch positions. In another embodiment, each cooling module can be customized and can be connected using different connection modules.

[0046] In one embodiment, standard connection layer 315 may be used to provide standard fluid ports for fluid connections 303-311. A variety of connection hardware may be used in standard connection layer 315. Examples of connection hardware used in standard connection layer 315 may include, for example, manual mating connection hardware and blind mating connection hardware.

[0047] In one embodiment, each of the fluid connections 304-311 is a fluid circuit (also referred to as a fluid circuit connection) and can connect two cooling modules via the pair of standard fluid ports associated with the connection. For example, fluid connection 304 can connect cooling module B 103 and cooling module D 107, fluid connection 307 can connect cooling module C 105 and cooling module D 107, fluid connection 309 can connect cooling module A 101 and cooling module B 103, and fluid connection 311 can connect cooling module A 101 and cooling module C 105. In addition, similar to Figure 1 and Figure 2 The bidirectional circuit 317 of the bidirectional circuit 137 in can be used to connect to the fluid connections 307 and 309. Figure 3 The gaps between the ports and the cooling modules 101-107 shown in FIG. 1 are for a clearer representation of the design. In actual implementation, there may not be such gaps in actual implementation.

[0048] In one embodiment, unlike fluid connections 304-311, fluid connection 303 is an extended fluid connection that connects the fluid inlet to cooling module B 103 at one end and then, in one embodiment, connects to the IT outlet port at the other end. System cooling fluid can enter cooling modules 101-107 through fluid connection 303.

[0049] Figure 4A system design 400 for connecting a cooling unit to an IT enclosure is shown according to one embodiment. In one embodiment, a cooling unit 403 may be connected to an IT enclosure unit 401. The IT enclosure 401 may be an IT rack with cooling hardware / system.

[0050] In one embodiment, the cooling unit 403 may include using Figure 3 The connection module 301 is described as assembling cooling modules 101-107 together. The IT enclosure unit 401 and the cooling unit 403 can be transported separately to a location where the IT enclosure unit 401 and the cooling unit 403 can be assembled together using standard fluid ports. Alternatively, the IT enclosure unit 401 and the cooling unit 403 can be pre-assembled into a single unit and then transported to the installation site.

[0051] In one embodiment 6, each of the connectors 405-411 may be a standard fluid port, and each connector may have the same specifications, so that the IT packaging unit 401 and the cooling unit 403 can be assembled using only such connectors without using additional components. Connector C 409 is assembled on a connection module such as Figure 3 The connection module 301 described in , and the connector D 411 are assembled on one of the cooling modules.

[0052] In one embodiment, the IT enclosure unit 401 may be bidirectional, and the cooling unit 403 may be unidirectional. Thus, connector A 405 may be used as a fluid inlet port, and connector B 407 may be used as a fluid outlet port. Alternatively, connector B 407 is used for the fluid inlet port, and connector A 405 is used as a fluid outlet port. Cooling fluid may enter and exit the IT enclosure unit 403 from either side, while cooling fluid may enter the cooling unit 403 from only one side and exit the cooling unit 403 from the other side.

[0053] FIG. 5A to FIG. 5B A system design for connecting IT enclosure 501A and IT enclosure B 512 to cooling unit 504 is shown according to various embodiments. The design enables different fluid arrangements within the IT enclosure.

[0054] Figure 5A and Figure 5B The bidirectional features of IT enclosures 501 and 512 are shown. Figure 5A, cooling fluid enters the IT enclosure 501 at connector A 503 (e.g., a standard fluid port), exits the IT enclosure 501 at connector B 505, and passes through the cooling unit 504 via connector C 507 and connector D 509. Subsequently, the cooling fluid from connector D 509 may enter the IT enclosure 512 at connector E 510 and exit the IT enclosure 512 at connector F 511.

[0055] exist Figure 5B , the cooling fluid may enter the IT enclosure 501 from a different direction at connector B 505 and enter the IT enclosure 512 at connector F 511 after passing through the cooling unit 504 .

[0056] In one embodiment, multiple IT enclosures and multiple cooling units may be positioned alternately with each other to form a complete fluid circuit.

[0057] Figure 6 An exemplary design of a cooling system 600 according to one embodiment is shown. More specifically, the embodiment shows a cooling unit 602 attached to an IT enclosure 601. The cooling unit 602 may include cooling modules 101-107 assembled together using a connection module 301. Fluid ports may be located on the connection edge of the connection module 602 and each of the cooling modules 101-107. The connection edge of the connection module 602 and the connection edge of each of the cooling modules 101-107 form a standard connection layer 604, which includes a plurality of standard fluid ports for connecting the connection module 602 and each of the cooling modules 101-107.

[0058] In one embodiment, each of the cooling modules 101-107 can be connected to the connection module 301 via a pair of standard fluid ports. In addition, the cooling section D 107 can include two additional ports 115 and 117 for connecting to external devices. All standard fluid ports for assembling modular cooling modules 101-107 can be located in the connection module 301.

[0059] like Figure 6 As shown, cooling fluid 605 enters system 600 through standard fluid port 603, enters cooling module B 103 through extended fluid connections in connection module 301, and exits system 600 through standard port 111. Within cooling unit 602, cooling fluid 605 passes through connection module 301 and cooling modules 101-107, and enters cooling module B 103 through fluid connections 303, which connect IT enclosure 601 to cooling unit 602. From cooling module B 103, cooling fluid 605 may be directed to other cooling modules via fluid connections 304-311 in connection portion 301. Figure 6It is shown how various fluid circuits are formed between the IT enclosure 601 and the various cooling modules 101 - 107 .

[0060] exist Figure 6 In the embodiment of the present invention, the modular cooling modules 101-107 can be standard cooling hardware. The cooling fluid 605 flows between the cooling modules 101-107 only through the fluid connections 304-311, which are all located in the connection module 301. Thus, this design separates the cooling modules 101-107 from the fluid connections, which enables each cooling module to be replaced with minimal or small impact on the overall design of the cooling system 600. More importantly, it can be quickly replaced or repaired.

[0061] Figure 7 The process of creating a cooling system for a data center is shown.

[0062] In block 701, a cooling unit is provided. The cooling unit comprises a connection module and a plurality of cooling modules. The connection module connects the plurality of cooling modules using a plurality of fluid circuit connections and a plurality of fluid ports in the connection module. The plurality of cooling modules comprises at least one bypass module and a fluid outlet port on one of the one or more bypass modules. The connection module is customized and designed, which is essential for forming and designing a detailed cooling circuit. The connection module is a hardware module comprising a plurality of standard fluid connections and standard fluid ports. The cooling module can be more standardized and can be integrated with different fluid components that provide different functions.

[0063] An information technology (IT) enclosure is attached to a cooling unit in block 703. An IT enclosure is an IT rack with cooling hardware / systems and includes a fluid inlet port.

[0064] In block 705 , cooling fluid is received into a cooling system via a fluid inlet on an IT enclosure, and the cooling fluid exits the cooling system via a fluid outlet port on one of the one or more bypass modules.

[0065] In the foregoing description, embodiments of the present disclosure have been described with reference to specific exemplary embodiments of the present disclosure. Obviously, various modifications may be made thereto without departing from the broader spirit and scope of the present disclosure as set forth in the appended claims. Therefore, the description and drawings are considered to be illustrative rather than restrictive.

[0066] As previously described, embodiments of the present disclosure may be (or include) a non-transitory machine-readable medium (such as a microelectronic memory) having instructions stored thereon that program one or more data processing components (collectively referred to herein as "processors") to perform airflow management operations, such as controlling the fan speed of one or more fans of a battery module (and / or BBU rack). In other embodiments, some of these operations may be performed by specific hardware components that include hardwired logic. Alternatively, these operations may be performed by any combination of programmed data processing components and fixed hardwired circuit components of any battery module described herein.

[0067] Although certain aspects have been described and shown in the drawings, it should be understood that these aspects are merely illustrative and not limiting of the broad disclosure, and that the disclosure is not limited to the specific constructions and arrangements shown and described, since various other modifications may occur to one of ordinary skill in the art. Thus, the description is to be regarded as illustrative rather than restrictive.

[0068] In some aspects, the disclosure may include language such as “at least one of [element A] and [element B]”. Such language may refer to one or more of the elements. For example, “at least one of A and B” may refer to “A”, “B”, or “A and B”. Specifically, “at least one of A and B” may refer to “at least one of A and at least one of B” or “at least one of A or B”. In some aspects, the disclosure may include language such as “[element A], [element B], and / or [element C]”. Such language may refer to the elements or any combination thereof. For example, “A, B, and / or C” may refer to “A”, “B”, “C”, “A and B”, “A and C”, “B and C”, or “A, B, and C”.

Claims

1. A cooling system in a data center, comprising: A cooling unit comprising a connection module and a plurality of cooling modules, wherein the connection module connects the plurality of cooling modules using a plurality of fluid circuit connections and a plurality of fluid ports in the connection module, wherein the plurality of cooling modules include one or more bypass modules, and a fluid outlet port is disposed on one of the one or more bypass modules; and an IT enclosure attached to the cooling unit, the IT enclosure housing one or more servers, each server housing one or more processors, wherein the IT enclosure includes a fluid inlet port, wherein cooling fluid enters the cooling system via the fluid inlet port on the IT enclosure and exits the cooling system via the fluid outlet port on one of the one or more bypass modules, and wherein the cooling fluid is used to reduce a temperature of the processor of the server; Wherein, the plurality of cooling modules include a heat exchanger module, a pumping module, a first bypass module and a second bypass module; The plurality of fluid circuit connections include a first fluid circuit connection connecting the first bypass module and the second bypass module, and a second fluid circuit connection connecting the heat exchanger module and the pumping module; The connection module further includes a bidirectional circuit connecting the first fluid circuit connection and the second fluid circuit connection.

2. The cooling system according to claim 1, wherein: The fluid outlet port is attached to the first bypass module.

3. The cooling system according to claim 2, wherein: An extended fluid circuit connection connects the fluid port on the IT enclosure to a fluid port on the second bypass module.

4. The cooling system according to claim 1, wherein: The cooling fluid passes through the IT enclosure in a bidirectional manner and passes through the cooling unit in a unidirectional manner.

5. The cooling system according to claim 1, wherein: The cooling unit includes a standard connection layer formed by a connection edge of the connection module and a connection edge of each of the plurality of cooling modules, wherein the standard connection layer includes a plurality of standard connection ports.

6. The cooling system according to claim 1, wherein: The connection module can be customized to include different fluid ports and different fluid circuits for assembling different groups of cooling modules.

7. The cooling system according to claim 1, wherein: The multiple fluid circuit connections integrated into the connection module serve to simplify the cooling unit / submodule design and enable the use of a standard cooling module configuration.

8. The cooling system according to claim 1, wherein: The cooling unit is one of a plurality of cooling units, and the IT enclosure is one of a plurality of IT enclosures, wherein the plurality of cooling units and the plurality of IT enclosures are positioned alternately with each other to form a complete fluid circuit.

9. A method of creating a cooling system for a data center, comprising: providing a cooling unit, the cooling unit comprising a connection module and a plurality of cooling modules, wherein the connection module connects the plurality of cooling modules using a plurality of fluid circuit connections and a plurality of fluid ports in the connection module, wherein the plurality of cooling modules comprises at least one bypass module, and a fluid outlet port is provided on one of the one or more bypass modules, wherein the plurality of cooling modules comprises a heat exchanger module, a pumping module, a first bypass module and a second bypass module, the plurality of fluid circuit connections comprises a first fluid circuit connection connecting the first bypass module and the second bypass module, and a second fluid circuit connection connecting the heat exchanger module and the pumping module, and the connection module further comprises a bidirectional circuit connecting the first fluid circuit connection and the second fluid circuit connection; providing an IT enclosure attached to the cooling unit, wherein the IT enclosure includes a fluid inlet port, wherein the IT enclosure houses one or more servers, and each server includes one or more processors, and A cooling fluid is received into the cooling system via the fluid inlet port on the IT enclosure, wherein the cooling fluid exits the cooling system via a fluid outlet port on one of the one or more bypass modules, and wherein the cooling fluid is used to reduce a temperature of the processor of the server.

10. The method according to claim 9, wherein: The fluid outlet port is attached to the first bypass module.

11. The method according to claim 10, wherein: An extended fluid circuit connection connects the fluid port on the IT enclosure to a fluid port on the second bypass module.

12. The method according to claim 9, wherein: The cooling fluid passes through the IT enclosure in a bidirectional manner and passes through the cooling unit in a unidirectional manner.

13. The method according to claim 9, wherein: The cooling unit includes a standard connection layer formed by a connection edge of the connection module and a connection edge of each of the plurality of cooling modules, wherein the standard connection layer includes a plurality of standard connection ports.

14. The method according to claim 9, wherein: The connection module can be customized to include different fluid ports and different fluid circuits for assembling different groups of cooling modules.

15. The method according to claim 9, wherein: The plurality of fluid circuit connections integrated into the connection module serves to simplify the cooling unit design and enables the use of a standard cooling module configuration.

16. The method according to claim 9, wherein: The cooling unit is one of a plurality of cooling units, and the IT enclosure is one of a plurality of IT enclosures, wherein the plurality of cooling units and the plurality of IT enclosures are positioned alternately with each other to form a complete fluid circuit.

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