Heat dissipation device of capillary core coupling manifold microchannel

Abstract

The invention belongs to the technical field of evaporation-boiling heat dissipation in a limited space, and relates to a heat dissipation device of a capillary core coupling manifold microchannel, and the heat dissipation device realizes vapor-liquid efficient separation and thermodynamic equilibrium regulation and control through the synergistic effect of thin film evaporation of a capillary core structure and boiling heat exchange of the manifold microchannel. The capillary core structure utilizes high porosity and strong capillary force to realize rapid liquid supplementing and uniform spreading of a working medium, so that local dryness is avoided; the radial manifold structure reduces the flow resistance and improves the temperature uniformity through the topological optimization of the flow channel; the directional exhaust design of the steam channel fundamentally inhibits steam bubble backflow. In a multi-heat-source scene, the device can dynamically adjust the branch flow through a thermal resistance-flow resistance coupling model, and the system stability is remarkably improved. The invention has the advantages of high heat flow bearing capacity, low energy consumption and strong environmental adaptability, and provides an innovative solution for reliable heat management of high-power electronic devices.

Description

Technical Field

[0001] The present invention belongs to the technical field of evaporation-boiling heat dissipation in a confined space, and particularly relates to a heat dissipation device with a capillary core coupled with a manifold microchannel. Background Art

[0002] With the breakthrough development of microelectronic manufacturing processes, the high-frequency, miniaturization, and integration levels of electronic components have been continuously improved, and their power density has exceeded the 1000 W / cm 2 magnitude, and the local hot spot temperature can reach above 150 °C. Research shows that for every 10 °C increase in the temperature of semiconductor devices, their working life is shortened by 50%, and more than 55% of electronic device failures are caused by overheating. In cutting-edge fields such as supercomputing, high-power lasers, and phased array radars, the rapid accumulation of chip heat will not only cause reliability problems such as performance degradation and signal delay, but may also lead to material fatigue or even permanent damage due to thermal stress concentration. Therefore, how to achieve effective heat dissipation of ultra-high heat flux density in a limited space has become the core challenge restricting the development of electronic technology.

[0003] Traditional air-cooling technology relies on forced air convection for heat dissipation, but the low thermal conductivity of air (about 0.026 W / m·K) limits its heat flux density carrying capacity to less than 50 W / cm2; although single-phase liquid-cooling technology can increase the heat dissipation capacity to 100 W / cm2 through high-thermal-conductivity working fluids (such as water and fluorinated liquids), its heat transfer efficiency is significantly restricted by the inlet working fluid temperature, and it cannot handle the temperature gradient problem in multi-heat-source scenarios. In addition, the sensible heat absorption capacity of single-phase fluids is limited, and the temperature rise of the working fluid causes the temperature difference between the heat source and the fluid to gradually decrease, further restricting the heat dissipation performance. For high-power chips with a heat flux density exceeding 500 W / cm 2 both the above technologies face problems such as insufficient heat dissipation capacity, uneven temperature distribution, and the risk of local overheating.

[0004] Microchannel phase change heat dissipation technology can greatly improve the heat dissipation efficiency through the latent heat of vaporization of the working fluid, and is considered an effective way to break through the traditional heat dissipation bottleneck. However, existing microchannel radiators still have significant defects: firstly, in a single heat source scenario, bubbles accumulate in the closed microchannel and cannot be discharged in time, resulting in increased flow instability, periodic thermal stress, and a decrease in the critical heat flux density; secondly, when multiple heat sources are connected in parallel, the fluid flow distribution is highly uneven, and dry-out phenomena occur in local areas due to insufficient flow, causing chip thermal failure; thirdly, the traditional microchannel structure has a single flow channel, and the fluid temperature continuously increases from the inlet to the outlet, resulting in a large increase in the temperature difference between the wall and the fluid, seriously affecting the chip working consistency. To address the above problems, the present invention proposes a heat dissipation device with a capillary core coupled with a manifold microchannel. Summary of the Invention

[0005] Aiming at the deficiencies of the above-mentioned existing technologies, the purpose of the present invention is to provide a heat dissipation device with a capillary core coupled manifold microchannel, which solves the problems of bubble aggregation that cannot be discharged in time, uneven fluid distribution, dryness in local areas due to insufficient flow rate, and the chip working consistency problem caused by the single flow channel of the microchannel structure.

[0006] To solve the above technical problems, the present invention adopts the following technical solutions:

[0007] The present invention provides a heat dissipation device with a capillary core coupled manifold microchannel, including an upper cover plate, a radial manifold structure, a capillary core microchannel structure, and a capillary core structure arranged from top to bottom. Among them: a working fluid inlet and a plurality of working fluid outlets are provided on the upper cover plate;

[0008] The radial manifold structure includes a first plate body. A flow channel is penetrated through the center of the first plate body, and the flow channel is coaxially connected to the working fluid inlet. A plurality of manifold channels are evenly arranged radially on the first plate body with the flow channel as the inlet. Channels are opened on the first plate body between adjacent two manifold channels, and each channel is connected to each working fluid outlet;

[0009] The capillary core microchannel structure includes a second plate body. A concave cavity is opened on the second plate body. The center of the concave cavity is opposite to the center of the flow channel. A plurality of rib plates with the same number as the manifold channels and the same length from the center of the concave cavity are evenly distributed at equal intervals in the concave cavity. A horizontal placement platform is provided on each rib plate. A capillary core microchannel assembly starting from each rib plate is arranged in the concave cavity. The capillary core microchannel assembly is opposite to and connected to the manifold channel. A vapor-liquid channel communicating with the capillary core microchannel assembly is formed between adjacent two capillary core microchannel assemblies. The vapor-liquid channel is opposite to and connected to the channel;

[0010] The capillary core structure is arranged on the support platform formed by a plurality of horizontal placement platforms.

[0011] Preferably, a metal columnar structure equidistant from a plurality of rib plates is provided at the center of the second plate body. The metal columnar structure is composed of a matrix arrangement of a plurality of columns, and the side length of the metal columnar structure is smaller than the width of the vapor-liquid channel. The metal columnar structure is at the same height as each horizontal placement platform.

[0012] Preferably, the first plate body is a square plate body, and there are four manifold channels. The four manifold channels are in an X shape, and the included angle between adjacent two manifold channels is 90°.

[0013] Preferably, the channel is a fan-shaped channel, and the channel can be respectively connected to each working fluid outlet and each vapor-liquid channel.

[0014] Preferably, the capillary core microchannel assembly is a fan-shaped structure. The capillary core microchannel assembly is vertically aligned with each channel, and the angular bisector of each manifold channel coincides with the capillary core microchannel assembly.

[0015] Preferably, the capillary core microchannel assembly is composed of a plurality of capillary core microchannels distributed at equal intervals, and both ends of the plurality of capillary core microchannels are communicated with the vapor-liquid channels on both sides.

[0016] Preferably, the outermost layer of the capillary core microchannel assembly with a fan-shaped structure is arranged in vertical alignment with the ends of each manifold channel.

[0017] Preferably, there are four working fluid outlets, and the four working fluid outlets are evenly distributed in a circular array around the working fluid inlet on the upper cover plate, and each working fluid outlet is arranged in vertical alignment with each channel and each vapor-liquid channel from top to bottom.

[0018] Preferably, the diameter of the capillary core structure is equal to the inner diameter of the flow channel.

[0019] Preferably, the capillary core structure, the first plate body, the flow channel, the plurality of manifold channels, the plurality of channels, the second plate body, the rib plate, the vapor-liquid channel and the upper cover plate are all made of copper, aluminum or stainless steel.

[0020] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0021] The present invention provides a heat dissipation device with a capillary core coupled manifold microchannel. Through the synergistic effect of thin film evaporation of the porous capillary core structure and boiling heat transfer of the radial manifold structure, the device realizes efficient vapor-liquid separation and thermodynamic equilibrium regulation. The porous capillary core structure utilizes its high porosity and strong capillary force to achieve rapid replenishment and uniform spreading of the working fluid, avoiding local dry-out; the radial manifold structure optimizes the flow channel topology to reduce the flow resistance and improve the temperature uniformity, solving the problem that the temperature difference between the wall surface and the fluid caused by the flow channel of a single microchannel structure increases greatly; the directional exhaust design of the steam channel composed of each vapor-liquid channel, each channel and each working fluid outlet fundamentally suppresses the bubble backflow, does not cause the aggravation of flow instability, nor does it cause periodic thermal stress and the decrease of critical heat flux. In the multi-heat source scenario, the heat dissipation device can dynamically adjust the branch flow through the thermal resistance-flow resistance coupling model, significantly improving the system stability. The present invention has both high heat flux carrying capacity, low energy consumption and strong environmental adaptability, providing an innovative solution for the reliable thermal management of high-power electronic devices.

[0022] The radial manifold structure in the heat dissipation device of the capillary core coupled manifold microchannel given by the present invention can achieve pre-distribution of the coolant flow rate, enhance the uniformity of the liquid flow rate in the capillary core microchannel assembly, shorten the effective flow length in the capillary core coupled manifold microchannel, and reduce the pressure drop and flow resistance. In addition, the coupled design of the radial manifold structure and the capillary core microchannel structure not only provides a large amount of space for the release of steam in the capillary core microchannel assembly, reduces flow instability, but also weakens the thickness of the boundary layer, further reducing the flow resistance and temperature non-uniformity. In addition, a good vapor-liquid separation effect is achieved, reducing flow instability and improving the problems of local chip overheating and heat transfer deterioration. At the same time, with the strong wettability and thin film evaporation characteristics of the capillary core structure, liquid replenishment and evaporation are carried out quickly, effectively alleviating the problem of liquid backflow and increasing the critical heat flux density.

[0023] The four manifold channels in the radial manifold structure designed by the present invention are in an "X" shape, and can enable the coolant to enter each capillary core microchannel assembly of the capillary core microchannel structure from four directions through the liquid pre-distribution mechanism, significantly shortening the effective flow length of the capillary core microchannel assembly and reducing the overall pressure drop. The orthogonal design of the manifold channel and the flow direction of the capillary core microchannel assembly weakens the boundary layer thickness by changing the liquid movement direction, reduces the flow resistance and improves the heat transfer efficiency, effectively improving the temperature distribution uniformity under the multi-heat source condition.

[0024] The present invention adopts the coupled design of the radial manifold structure, the capillary core microchannel structure and the porous capillary core structure, and accelerates liquid replenishment through the capillary suction of the capillary core structure to avoid local overheating caused by the dryness of the capillary core microchannel assembly. At the same time, the meniscus formed by the porous structure inside the capillary core structure realizes efficient thin film evaporation, combined with the boiling heat transfer in the capillary core microchannel assembly to form an evaporation-boiling coupled heat transfer mode, significantly delaying the heat transfer deterioration and increasing the critical heat flux density.

[0025] (3) By arranging fan-shaped channels between adjacent manifold channels, the present invention provides sufficient space for steam release, forming an alternating distribution pattern of the flow channel - steam release area. This design shortens the steam detachment period, and through the physical separation of the steam rising manifold channel and the liquid flow path, effectively avoids the flow instability problem caused by the mutual interference of the vapor-liquid two-phase flow.

[0026] The present invention sets a symmetric rib plate structure in the middle of the capillary core microchannel assembly. While providing positioning support for the porous capillary core structure, the rib plate gap is used to form a vapor-liquid separation channel. The steam is quickly discharged through the lower side of the capillary core, realizing efficient separation of the liquid and the steam, suppressing the local temperature sudden rise phenomenon caused by flow instability, and improving the system reliability. Description of the Drawings

[0027] Figure 1-1Explosion schematic diagram 1 of the overall structure of the present invention.

[0028] Figure 1-2 Explosion schematic diagram 2 of the overall structure of the present invention.

[0029] Figure 2-1 3D view of the upper cover plate of the present invention.

[0030] Figure 2-2 Top view of the upper cover plate of the present invention.

[0031] Figure 2-3 Front sectional view of the upper cover plate of the present invention.

[0032] Figure 3-1 3D view of the radial manifold of the present invention.

[0033] Figure 3-2 Top view of the radial manifold of the present invention.

[0034] Figure 3-3 Front sectional view of the radial manifold of the present invention.

[0035] Figure 4-1 3D view of the capillary core microchannel structure of the present invention.

[0036] Figure 4-2 Top view of the capillary core microchannel structure of the present invention.

[0037] Figure 4-3 Front sectional view of the capillary core microchannel structure of the present invention.

[0038] Figure 5-1 3D view of the capillary core structure of the present invention.

[0039] Figure 5-2 Top view of the capillary core structure of the present invention.

[0040] Figure 5-3 Front sectional view of the capillary core structure of the present invention.

[0041] Reference numerals

[0042] 1. Upper cover plate; 1.1. Working medium inlet; 1.2. Working medium outlet; 2. Radial manifold structure; 2.1. Flow channel; 2.2. Manifold channel; 2.3. Channel; 3. Capillary core microchannel structure; 3.1. Horizontally placed platform; 3.2. Vapor-liquid channel; 3.3. Capillary core microchannel assembly; 3.4. Metal columnar structure, 4. Capillary core structure. Detailed implementation manners

[0043] The following is a detailed description of the specific embodiments of the present invention. However, it should be understood that the protection scope of the present invention is not limited by the specific embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts fall within the protection scope of the present invention. The experimental methods described in the embodiments of the present invention are all conventional methods unless otherwise specified.

[0044] The inventor found that carbon nanotubes have good electrical conductivity and can generate Joule heat when an external electric field is applied, providing an internal heat source for the curing of composite materials. Thus, heat is directly generated from the inside of the material, avoiding heat loss in the external environment, reducing energy consumption, and improving the utilization rate of heat. At the same time, carbon nanotubes also have good thermal conductivity and can transfer heat evenly and quickly to all regions of the composite material, effectively reducing the problem of uneven curing heat distribution existing in the existing technology of preparing composite materials by electric-assisted heating, ensuring that the resin fully infiltrates the fibers, improving the interfacial bonding strength, and thus enhancing the mechanical properties of the composite material.

[0045] In view of this, the present invention provides a device and method for curing an electric-assisted carbon fiber-reinforced thermosetting composite material, which can not only reduce energy consumption by utilizing the excellent thermal conductivity, electrical conductivity, and Joule heat effect of carbon nanotubes, but also realize the uniform and rapid curing and forming of the composite material by using electric-assisted heating.

[0046] As Figures 1-1 to 5-3 shown, the present invention provides a heat dissipation device with a capillary core-coupled manifold microchannel, including an upper cover plate 1, a radial manifold structure 2, a capillary core microchannel structure 3, and a capillary core structure 4 arranged from top to bottom. Among them: a working fluid inlet 1.1 and a plurality of working fluid outlets 1.2 are provided on the upper cover plate 1;

[0047] The radial manifold structure 2 includes a first plate body. A flow channel 2.1 is centrally penetrated through the first plate body. The flow channel 2.1 is coaxially connected to the working fluid inlet 1.1. A plurality of manifold channels 2.2 are radially and evenly opened on the first plate body with the flow channel 2.1 as the inlet. Channels 2.3 are opened on the first plate body between adjacent two manifold channels 2.2, and each channel 2.3 is connected to each working fluid outlet 1.2;

[0048] The capillary core microchannel structure 3 includes a second plate body, on which a concave cavity is formed. The center of the concave cavity is opposite to the center of the flow channel 2.1. A plurality of rib plates, which are equal in number to the manifold channels 2.2 and have the same length from the center of the concave cavity, are evenly distributed at equal intervals in the concave cavity. Each rib plate is provided with a horizontal placement platform 3.1. A capillary core microchannel assembly 3.3 starting from each rib plate is arranged in the concave cavity. The capillary core microchannel assembly 3.3 is opposite to and communicated with the manifold channel 2.2. A vapor-liquid channel 3.2 communicated with the capillary core microchannel assembly 3.3 is formed between two adjacent capillary core microchannel assemblies 3.3. The vapor-liquid channel 3.2 is opposite to and communicated with the channel 2.3. The capillary core structure 4 is arranged on the support surface formed by a plurality of horizontal placement platforms 3.1.

[0049] The capillary core microchannel structure 3 includes a second plate body, on which a circular concave cavity is formed. The center of the second plate body is vertically aligned with the flow channel 2.1. A plurality of rib plates 1, which are equal in number to the manifold channels 2.2 and have the same length from the center of the second plate body, are evenly distributed at equal intervals in the circular groove. Each rib plate is provided with a horizontal placement platform 3.1. A vapor-liquid channel 3.2 is arranged on the second plate body between every two rib plates. Capillary core microchannel assemblies 3.3 are arranged on the second plate body on both sides of each vapor-liquid channel 3.2. Each manifold channel 2.2 is located above and communicated with each capillary core microchannel assembly 3.3. The top surfaces of each capillary core microchannel assembly 3.3 are flush with the top surface of the second plate body. Each capillary core microchannel assembly 3.3 is communicated with the vapor-liquid channels 3.2 on both sides. Each vapor-liquid channel 3.2 is communicated with each channel 2.3. A capillary core structure 4 for liquid replenishment and evaporation is embedded on a plurality of horizontal placement platforms 3.1.

[0050] Among them, the number of the plurality of manifold channels 2.2 can be 4, 5, 6 or 8. When the number of the manifold channels 2.2 is 4, the radial manifold structure 2 includes a first plate body, a flow channel 2.1, four manifold channels 2.2 and four channels 2.3. The flow channel 2.1 is formed through the center of the first plate body and arranged on the first plate body, and the flow channel 2.1 can be communicated with the working fluid inlet 1.1. The four manifold channels 2.2 are all radially formed with the flow channel 2.1 as the inlet on the first plate body. The four channels 2.3 are formed through the first plate body and arranged on the first plate body. Each channel 2.3 is adjacent to two manifold channels 2.2. The plurality of channels 2.3 can all be communicated with a plurality of working fluid outlets 1.2.

[0051] The capillary wick microchannel structure 3 includes a second plate body. The center of the second plate body is vertically aligned with the flow channel 2.1. There are multiple quarter-circular rib plates evenly distributed at equal intervals on the second plate body, and the number of the rib plates is the same as that of the manifold channels 2.2 and the four rib plates are of equal length from the center of the second plate body. A horizontal placement platform 3.1 is provided on each rib plate. A vapor-liquid channel 3.2 is provided on the second plate body between every two quarter-circular rib plates. Capillary wick microchannel assemblies 3.3 are provided on the second plate body on both sides of each vapor-liquid channel 3.2. Each capillary wick microchannel assembly 3.3 communicates with each manifold channel 2.2, and each vapor-liquid channel 3.2 communicates with each channel 2.3. A liquid replenishing and evaporation wick structure 4 is embedded on the multiple horizontal placement platforms 3.1. The interior of the liquid replenishing and evaporation wick structure 4 is a porous structure, which can effectively absorb liquid and form a meniscus film to improve the heat transfer performance.

[0052] During use, after the liquid flows in from the working fluid inlet 1.1 of the upper cover plate 1, the fluid flows downward and into the flow channel 2.1 from the working fluid inlet 1.1. At this time, a part of the liquid enters each manifold channel 2.2 and flows in a preset direction in each manifold channel 2.2. When the liquid flows to the area of the capillary wick microchannel assembly 3.2 below each manifold channel 2.2, the liquid is guided to flow downward in the vertical direction into the capillary wick microchannel structure 3. The liquid flowing in the capillary wick microchannel assembly 3.2 undergoes boiling heat transfer due to the heat generated by the chip heat source, and the generated vapor flows with the liquid to the multiple working fluid outlets 1.2 of the upper cover plate 1 and is discharged. Four quarter-circular rib plates evenly distributed at equal intervals in the middle of the capillary wick microchannel structure 3 are suitable for placing the porous wick structure 4. Since the porous wick structure 4 has strong wettability, it can quickly replenish liquid and evaporate. Another part of the liquid flows in from the working fluid inlet 1.1, and the fluid flows downward and into the flow channel 2.1 from the working fluid inlet 1.1 and is sucked by the porous wick structure 4. The liquid is heated and evaporated, and the generated vapor is discharged through the lower voids of the wick structure 4. Due to the inertial force effect of the liquid, the vapor can only flow out along the bottom vapor channel, and there will be no phenomenon of vapor backflow, so a good vapor-liquid separation effect is achieved.

[0053] The size of the upper cover plate 1 is l1×l1×h1, where the length and width are both l1 = 40 mm, and the overall height is h1 = 5 mm. Five circular through-holes are machined on the upper cover plate 1. The central through-hole is the working fluid inlet 1.1, and the other four through-holes are the working fluid outlets 1.2. The diameter of the circular through-holes is all d1 = 8 mm.

[0054] The dimensions of the radial manifold structure 2 are l1×l1×h2. The radial manifold structure 2 is placed in a space with a length and width both equal to l1 = 40 mm, and the overall height of the radial manifold structure 2 is h2 = 2 mm. The inner wall dimensions of the flow channel 2.1 are d2×h2, the diameter of the flow channel 2.1 is d2 = 8 mm, the outer wall dimensions of the flow channel 2.1 are d3×h2, the diameter of the outer wall of the flow channel 2.1 is d3 = 12 mm, and the height of both the inner and outer walls of the flow channel 2.1 is h2 = 2 mm. The inner wall dimensions of the circular ends of each manifold channel 2.2 are d4×h2, the diameter of the end of each manifold channel 2.2 is d4 = 34 mm, and the height of the end of each manifold channel 2.2 is h2 = 2 mm. The dimensions of the 4 channels connecting the central ring and the circular inner wall at the ends are [1 / 2×(d4 - d3)]×l2, the length is approximately [1 / 2×(d4 - d3)] = 11 mm, the width is l2 = 2 mm, and the wall thickness is l3 = 1 - 2 mm.

[0055] The dimensions of the capillary wick microchannel structure 3 are l1×l1×h3. The length and width of the capillary wick microchannel structure 3 are both l1 = 40 mm, and the overall height of the capillary wick microchannel structure 3 is h3 = 4 mm.

[0056] Four quarter - circular rib plates are provided on the plate. The inner wall dimensions of the four quarter - circular rib plates are d5×h4, the diameter of the four quarter - circular rib plates 3.1 is d5 = 10 mm, the height of the four sector - shaped rib plates is h4 = 1 mm, the outer wall dimensions of the four quarter - circular rib plates are d3×h5, the diameter of the outer wall of the four quarter - circular rib plates is d3 = 12 mm, and the outer wall height of the four quarter - circular rib plates 3.1 is h5 = 2 mm.

[0057] The width of the vapor - liquid channel 3.2, l4, is 4 mm. The two ends of the vapor - liquid channel 3.2 are directly opposite to 2 working fluid outlets 1.2. Seven rib plates are externally equidistantly distributed with capillary wick microchannel assemblies 3.3. The capillary wick microchannel assemblies 3 are accurately aligned with the ends of the manifold channels 2.2, forming an alternating distribution pattern of the flow channel - steam release area.

[0058] 11 capillary wick microchannel assemblies 3.3 are machined on the surface of the second plate body and outside the four rib plates, and are equidistantly distributed. The cross - sectional dimensions of the capillary wick microchannel assemblies 3.3 are h5×l5, the length of the capillary wick microchannel assemblies 3.3 is h5 = 1 mm, the width of the capillary wick microchannel assemblies 3.3 is l5 = 0.5 mm, and the outer diameter of the outermost capillary wick microchannel assemblies 3.3 is d6 = 34 mm.

[0059] The size of the wick structure 4 is d5×h5, with a diameter of d5 = 10 mm and a height of h4 = 1 mm. The vapor formed by evaporation heat transfer in the wick structure 4 is discharged from below it to achieve the effect of vapor-liquid separation. The interior of the wick is a porous structure, which can effectively absorb liquid and form a meniscus film to improve the heat transfer performance.

[0060] Horizontal placement platforms 3.1 are provided on all four rib plates. The wick structure 4 is embedded on the horizontal placement platforms 3.1, and the top surface of the wick structure 4 is flush with the wick microchannel assembly 3.3, which is used to form a vapor-liquid separation channel between the wick structure 4 and the horizontal placement platforms 3.1, promoting the effective separation of liquid and vapor and suppressing the local overheating phenomenon caused by unstable flow. The height of the symmetric horizontal placement platforms 3.1 is (h5 - h4) = 1 mm, and four vapor channels are machined in the center of it, each with a width of l4 = 4 mm. The liquid enters the wick structure 4, and through the coupled design of the manifold channel and the porous wick, boiling heat transfer in the wick structure 4 and film evaporation on the meniscus of the wick are realized. At the same time, a vapor-liquid separation channel is formed by means of the structure of the horizontal placement platforms 3.1, effectively suppressing the local overheating phenomenon, increasing the critical heat flux density, and fundamentally solving the problem of flow instability caused by the coexistence of vapor and liquid in traditional microchannel flow boiling heat transfer. The porous characteristics of the wick structure 4 accelerate the liquid replenishment through capillary force, avoiding the dry-out phenomenon in the wick microchannel assembly 3.3 and resulting in overheating of the local chip temperature. In addition, after the liquid enters the wick structure 4, a meniscus is formed based on the porous structure inside the wick structure 4, thereby realizing efficient film evaporation, delaying the deterioration of heat transfer, and increasing the critical heat flux density. Combined with the boiling heat transfer in the wick microchannel assembly 3.3, an evaporation-boiling coupled heat transfer is formed, which has good heat transfer enhancement performance.

[0061] Specifically, a metal columnar structure 3.4 equidistant from multiple rib plates is provided at the center of the second plate body. The metal columnar structure 3.4 is composed of a matrix arrangement of multiple columns, and the side length of the metal columnar structure 3.4 is less than the width of the vapor-liquid channel 3.2. The metal columnar structure 3.4 is at the same height as each horizontal placement platform 3.1.

[0062] Among them, the size of the columnar micro-structure 3.4 is l6×l6×h4. Both the length and width l6 of the columnar micro-structure 3.4 are 0.4 mm, and the height of the columnar micro-structure 3.4 is the same as the height of the four quarter-circular grooves 3.1, both being h4 = 1 mm. There are two purposes for setting the metal columnar structure 3.4. One is to make the liquid flow turbulently, and the other is to increase the contact area between the second plate body and the wick structure 4, quickly transferring the heat on the second plate body to the wick structure 4.

[0063] Specifically, the first plate body is a square plate body, and there are four manifold channels 2.2. The four manifold channels 2.2 are in an X shape, and the included angle between two adjacent manifold channels 2.2 is 90°. The four manifold channels 2.2 achieve pre-distribution of the flow rate. The "X" shape of the four manifold channels 2.2 enables the inflow into the capillary microchannel structure 3 to not only achieve pre-distribution of the flow rate, but also make the flow rate distribution more uniform, further effectively shortening the effective flow length of the microchannel and achieving uniform distribution of the flow rate and temperature under multi-heat-source conditions. In addition, the X shape of the four manifold channels 2.2 improves the uniformity of the temperature and flow rate in the microchannel.

[0064] Specifically, the channel 2.3 is a fan-shaped channel. The channel 2.3 can be respectively communicated with each working fluid outlet 1.2 and each vapor-liquid channel 3.2. The fan-shaped channel provides a large amount of space for the release of steam in the capillary microchannel assembly 3.3, significantly improving the flow stability, delaying the deterioration of heat transfer, and increasing the critical heat flux density. The fan-shaped channels formed between adjacent manifold channels 2.2 provide sufficient space for steam release, forming an alternating distribution pattern of flow channels - steam release areas. This spatial decoupling design shortens the steam detachment period. At the same time, through the separation of the steam rising channel and the liquid flow path, the mutual interference of the gas-liquid two-phase flow is fundamentally avoided, and the problem of unstable flow in the microchannel is solved.

[0065] Specifically, the capillary microchannel assembly 3.3 is in a fan-shaped structure. The capillary microchannel assembly 3.3 is vertically aligned with each manifold channel 2.2, and each manifold channel 2.2 coincides with the angular bisector of the capillary microchannel assembly 3.3. The liquid in each manifold channel 2.2 changes its motion direction to perform tangential motion after entering the capillary microchannel assembly 3.3. Such a structural design weakens the thickness of the boundary layer in the capillary microchannel assembly 3.3, reduces the flow resistance, increases the heat transfer efficiency, reduces the temperature non-uniformity, and is applicable to the temperature equilibrium control under multi-heat-source working conditions.

[0066] Specifically, the capillary microchannel assembly 3.3 is composed of multiple capillary microchannels distributed at equal intervals. Both ends of the multiple capillary microchannels are communicated with the vapor-liquid channels 3.2 on both sides. The purpose of setting the capillary microchannels at equal intervals is to make the flow velocity in each capillary microchannel the same under the premise of non-equal interval setting, further reducing the flow resistance and increasing the heat transfer efficiency.

[0067] Specifically, the outermost layer of the fan-shaped capillary microchannel assembly 3.3 is vertically aligned with the ends of each manifold channel 2.2. The purpose of this setting is to make the fluid enter the microchannel along the manifold, ensuring that each microchannel from the inside to the outside has fluid entering. In fact, this point can also be emphasized.

[0068] Specifically, when there are four channels, there are four working fluid outlets 1.2, and the four working fluid outlets 1.2 are evenly distributed in a circumferential array around the working fluid inlet 1.1 on the upper cover plate 1, and each working fluid outlet 1.2 is arranged in alignment with each channel 2.3 and each vapor-liquid channel 3.2 from top to bottom. The purpose is to dissipate heat quickly.

[0069] Specifically, the diameter of the capillary core structure 4 is equal to the inner diameter of the flow channel 2.1. Here, it is for the flow channel 2.1 to cooperate with the capillary core structure 4 for heat dissipation, and the bottom of the capillary core structure 4 is supported by a horizontally placed platform 3.1 and a metal columnar structure.

[0070] Specifically, the capillary core structure 4, the first plate body, the flow channel 2.1, the plurality of manifold channels 2.2, the plurality of channels 2.3, the second plate body, the rib plate 3.1, the vapor-liquid channel 3.2, and the upper cover plate 1 are all made of copper, aluminum, or stainless steel. This is because copper has good thermal conductivity, aluminum is light in weight, and stainless steel is stable. When in use, the heat dissipation device with a capillary core-coupled manifold microchannel is placed on the surface of the chip that needs to be cooled.

[0071] Working principle of the heat dissipation device with a capillary core-coupled manifold microchannel:

[0072] The present invention discloses a heat dissipation device with a capillary core-coupled manifold microchannel, mainly including an upper cover plate 1, a radial manifold structure 2, a capillary core microchannel structure 3, and a capillary core structure 4. Among them, the cover plate 1, the radial manifold structure 2, the annular microchannel structure 3, and the capillary core structure 4 are made by machining / 3D printing technology.

[0073] The capillary core microchannel assembly 3.3 and the capillary core structure 4 serve as the main heat dissipation areas. The working fluid enters the flow channel 2.1 from the working fluid inlet 1.1 of the upper cover plate 1 and is divided into two parts for flow. They flow into the X-shaped manifold channel and the capillary core structure 4 respectively. The liquid flowing into the X-shaped manifold channel flows in four directions, realizing the pre-distribution of the flow rate, improving the uniformity of the temperature and flow rate in the microchannel. Then the liquid enters the capillary core microchannel assembly 3.3 structure of the annular microchannel 3, and the flow direction becomes horizontal. Such a setting weakens the thickness of the flow boundary layer and the thermal boundary layer, further improves the heat flux density, and reduces the flow resistance; the liquid vertically enters the capillary core microchannel assembly 3.3 of the capillary core microchannel structure 3 to carry out boiling heat transfer. The steam flows out from the fan-shaped channel and the working fluid outlet 1.2 of the upper cover plate 1 under the action of buoyancy and the liquid, achieving a good gas-liquid separation effect and avoiding the occurrence of heat transfer deterioration; another part of the working fluid flows into the capillary core structure 4 to carry out evaporation heat transfer. The steam flows out to the working fluid outlet 1.2 through the gas-liquid channel 3.2 under the action of the liquid. Due to the strong wettability of the capillary core, rapid liquid replenishment and evaporation are realized, the liquid and the steam are effectively separated, and the flow instability is reduced. It pre-distributes the liquid through multiple X-shaped manifold channels, combines the orthogonal flow direction design to shorten the flow path and disturb the boundary layer, not only reduces the flow pressure drop in the capillary core microchannel assembly 3.3, but also improves the temperature uniformity; the concentric circle equidistant capillary core microchannel assembly 3.3 is accurately aligned with each manifold channel 2.2 to construct an alternating distribution of the flow channel - steam area, realizing the spatial decoupling of the flow path and steam release to accelerate the bubble detachment period, and coupling the porous capillary core liquid replenishment mechanism. On the one hand, it basically solves the problem of heat transfer deterioration caused by bubble accumulation in the downstream of the microchannel, and significantly improves the critical heat flux density; on the other hand, the integrated effect of boiling heat transfer in the microchannel and evaporation heat transfer in the capillary core structure makes the heat dissipation performance of the whole device be significantly improved.

[0074] The manifold channels located in the radial manifold structure pre-allocate the liquid flow path, shorten the flow path within the capillary wick microchannel structure, and effectively reduce the overall flow pressure drop. At the same time, the orthogonal design of the capillary wick microchannel assembly and the manifold channels can also weaken the boundary layer to enhance flow and heat transfer. The liquid boils within the capillary wick microchannel assembly. The alternating distribution pattern of the steam flow channels and the steam release areas formed by the arrangement of the fan-shaped channels reduces the flow unevenness caused by the vapor-liquid mixture. Coupled with the porous capillary wick structure for capillary liquid replenishment, it can better solve the problem that in the traditional structure, the vapor bubbles downstream coalesce and attach to the bottom surface of the capillary wick microchannel assembly, making it impossible for the vapor bubbles to be discharged in time. Attaching to the bottom of the microchannel will form a gas film, and the liquid cannot wet the wall surface, seriously affecting the heat transfer efficiency and causing the phenomenon of heat transfer deterioration. The inside of the capillary wick structure can continuously maintain the liquid film evaporation interface, forming a synergistic enhanced heat transfer with the boiling phase change process of the capillary wick microchannel assembly, and significantly improving the critical heat flux density. Finally, the ribbed gas-liquid separation structure guides the steam generated by the liquid phase change in the capillary wick structure to be discharged laterally, completely isolating the steam movement path from the liquid supply channel. While eliminating the pulsation interference of the two-phase flow, it realizes the temperature equalization control under the multi-heat source working conditions. The present invention has the advantages of small volume, low power consumption, strong heat dissipation capacity, and good temperature uniformity, and can be used to meet the heat dissipation requirements of high-power multi-heat source chips.

[0075] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalent technologies, the present invention is also intended to include these changes and modifications.

Claims

1. A heat dissipation device of a capillary wick coupled manifold microchannel, characterized in that: It comprises an upper cover plate (1), a radial manifold structure (2), a capillary wick microchannel structure (3) and a capillary wick structure (4) arranged from top to bottom, wherein: the upper cover plate (1) is provided with a working fluid inlet (1.1) and a plurality of working fluid outlets (1.2); The radial manifold structure (2) comprises a first plate body, a flow channel (2.1) is provided through the center of the first plate body, the flow channel (2.1) is coaxially connected to a working fluid inlet (1.1), a plurality of manifold channels (2.2) are evenly provided radially on the first plate body with the flow channel (2.1) as the inlet, a channel (2.3) is provided on the first plate body between two adjacent manifold channels (2.2), and each channel (2.3) is connected to each working fluid outlet (1.2); The capillary wick microchannel structure (3) comprises a second plate body, a concave cavity is formed on the second plate body, the center of the concave cavity is opposite to the center of the flow channel (2.1), a plurality of ribs are evenly distributed in the concave cavity, the number of which is the same as that of the manifold channel (2.2) and the length of which is equal to that of the center of the concave cavity, each rib is provided with a horizontal placement platform (3.1), a capillary wick microchannel component (3.3) with each rib as a starting end is provided in the concave cavity, the capillary wick microchannel component (3.3) is opposite to and connected to the manifold channel (2.2), a vapor-liquid channel (3.2) connected to the capillary wick microchannel component (3.3) is formed between two adjacent capillary wick microchannel components (3.3), and the vapor-liquid channel (3.2) is opposite to and connected to the channel (2.3); The capillary core structure (4) is arranged on a supporting table formed by a plurality of horizontal placement tables (3.1).

2. A heat dissipation device of a capillary wick coupled manifold microchannel as claimed in claim 1, characterized in that: A metal columnar structure (3.4) is provided at the center of the second plate body at equal distances from the plurality of ribs. The metal columnar structure (3.4) is composed of a plurality of columns arranged in a matrix. The side length of the metal columnar structure (3.4) is smaller than the width of the vapor-liquid channel (3.2). The metal columnar structure (3.4) is at the same height as each horizontal placement platform (3.1).

3. A heat dissipation device of a capillary wick coupled manifold microchannel as claimed in claim 1, characterized in that: The first plate body is a square plate body, and the number of manifold channels (2.2) is set to four, the four manifold channels (2.2) are in an X shape, and an angle of 90° is formed between two adjacent manifold channels (2.2).

4. A heat dissipation device of a capillary wick coupled manifold microchannel as claimed in claim 3, characterized in that: The channel (2.3) is a fan-shaped channel, and the channel (2.3) can be respectively connected to each of the working medium outlets (1.2) and each of the vapor-liquid channels (3.2).

5. A heat dissipation device of a capillary wick coupled manifold microchannel as claimed in claim 4, characterized in that: The capillary core microchannel component (3.3) is a fan-shaped structure, the capillary core microchannel component (3.3) is vertically aligned with each of the manifold channels (2.2), and the angle bisectors of each of the manifold channels (2.2) and the capillary core microchannel component (3.3) coincide.

6. A heat dissipation device of a capillary wick coupled manifold microchannel as claimed in claim 4, characterized in that: The capillary wick microchannel component (3.3) is composed of a plurality of capillary wick microchannels distributed at equal intervals, and both ends of the plurality of capillary wick microchannels are connected to the vapor-liquid channels (3.2) on both sides.

7. A heat dissipation device of a capillary wick coupled manifold microchannel as claimed in claim 6, characterized in that: There are four working fluid outlets (1.2), and the four working fluid outlets (1.2) are distributed in a circular array on the upper cover plate (1) around the working fluid inlet (1.1), and each working fluid outlet (1.2) is arranged in alignment with each channel (2.3) and each vapor-liquid channel (3.2) from top to bottom.

8. A heat dissipation device of a capillary wick coupled manifold microchannel as claimed in claim 5, characterized in that: The outermost layer of the capillary core microchannel component (3.3) with a fan-shaped structure is arranged in vertical alignment with the end of each manifold channel (2.2).

9. A heat dissipation device of a capillary wick coupled manifold microchannel as claimed in claim 1, characterized in that: The diameter of the capillary core structure (4) is equal to the inner diameter of the flow channel (2.1).

10. A capillary wick coupled manifold microchannel heat dissipation device as claimed in claim 1, characterized in that: The capillary wick structure (4), the first plate body, the flow channel (2.1), the plurality of manifold channels (2.2), the plurality of channels (2.3), the second plate body, the rib plate, the vapor-liquid channel (3.2) and the upper cover plate (1) are all made of copper, aluminum or stainless steel.

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