Solder resist spray line and circuit board obtained by spraying thereof
By using a plunger pump ink supply system and airless nozzle technology, the problems of ink clogging and low adhesion were solved, achieving efficient and low-cost solder resist spraying and improving the quality of circuit boards.
Patent Information
- Application Number
- CN202210080515.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-01-24
- Publication Date
- 2025-11-21
- Estimated Expiration
- 2042-01-24
AI Technical Summary
Existing solder resist coating lines use compressed air to atomize ink, resulting in frequent ink clogging, high costs, low adhesion, and negatively impacting the solder resist performance of circuit boards.
A plunger pump is used to provide high-pressure ink supply, and the ink is atomized through an airless printhead, which simplifies the printhead structure, increases ink viscosity, reduces solvent use, and increases adhesion.
It reduces the risk of ink clogging, lowers coating costs, improves ink adhesion, and enhances the quality of circuit boards.
Smart Images

Figure CN114260115B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the technical field of circuit board manufacturing equipment, and in particular to a solder resist spraying line and the circuit boards obtained by spraying. Background Technology
[0002] The manufacturing of printed circuit boards (PCBs) requires numerous pieces of equipment, among which the solder resist coating line is particularly crucial. A solder resist coating line consists of two coating machines and a flipping machine. One coating machine coats the first side of the PCB and then sends the coated PCB to the flipping machine. The flipping machine flips the coated PCB and sends it to the other coating machine, which then coats the second side of the PCB. However, to prevent ink from clogging the printheads, a large amount of solvent is needed to dissolve the ink. This results in higher costs for solder resist coating and lower ink viscosity, leading to weaker ink adhesion and making the ink prone to peeling off after adhering to the PCB, thus affecting the solder resist effect. Summary of the Invention
[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide a solder resist spraying line and the circuit board obtained by spraying.
[0004] The objective of this invention is achieved through the following technical solution:
[0005] A solder resist coating line, comprising:
[0006] Ink supply system, including plunger pump;
[0007] A spraying machine includes a first conveying device and an airless spraying device. The first conveying device conveys a circuit board to the airless spraying device. The airless spraying device includes an airless nozzle with a plurality of airless nozzle holes facing the circuit board. The airless nozzle holes are connected to the output end of a plunger pump to spray the circuit board. The number of spraying machines is two.
[0008] A flipping machine is disposed between the two spraying machines, wherein a first conveying device of one of the spraying machines is further used to convey the circuit board from the corresponding airless spraying device to the flipping machine, so that the flipping machine is used to flip the circuit board, and the flipping machine is further used to convey the flipped circuit board to the airless spraying device of the other spraying machine.
[0009] In one embodiment, the airless spraying device of each of the spraying machines includes a spraying drive mechanism, the power output end of which is connected to the corresponding airless nozzle, so that the spraying drive mechanism of each of the spraying machines is used to drive the corresponding airless nozzle to move and spray.
[0010] In one embodiment, the spraying drive mechanism of the airless spraying device of each of the spraying machines includes a rotating drive member and a drive connector. The first end of the drive connector of the spraying drive mechanism of the airless spraying device of each of the spraying machines is connected to the power output end of the corresponding rotating drive member, and the airless nozzle of the airless spraying device of each of the spraying machines is connected to the second end of the corresponding drive connector.
[0011] In one embodiment, the spraying drive mechanism of the airless spraying device of each of the spraying machines further includes a rotary component, a linear motion component, and a guide component. The rotary component of the spraying drive mechanism of the airless spraying device of each of the spraying machines is slidably connected to the second end of the corresponding drive connector. The linear motion component of the spraying drive mechanism of the airless spraying device of each of the spraying machines is rotatably connected to the corresponding rotary component. The linear motion component of the spraying drive mechanism of the airless spraying device of each of the spraying machines is slidably connected to the corresponding guide component. The airless nozzle of the airless spraying device of each of the spraying machines is connected to the corresponding linear motion component.
[0012] In one embodiment, the spraying drive mechanism of the airless spraying device of each spraying machine further includes a first guide rail and a first sliding member. The first guide rail of the spraying drive mechanism of the airless spraying device of each spraying machine is mounted on the corresponding drive connector. The first sliding member of the spraying drive mechanism of the airless spraying device of each spraying machine is rotatably connected to the corresponding rotary member. The first sliding member of the spraying drive mechanism of the airless spraying device of each spraying machine is also slidably connected to the corresponding first guide rail.
[0013] In one embodiment, each of the spraying machines further includes two ink baffles, which are respectively connected to both sides of the corresponding first conveying device, and both ink baffles of each spraying machine protrude from the side of the corresponding first conveying device adjacent to the corresponding airless spraying device.
[0014] In one embodiment, each of the spraying machines further includes an ink recovery device, and the airless nozzle of the airless spraying device of each spraying machine and the corresponding ink recovery device are respectively disposed on the upper and lower sides of the corresponding first conveying device.
[0015] In one embodiment, each of the sprayers further includes a water spraying device, which is disposed adjacent to the corresponding airless spraying device, and the water spraying device is used to settle the exhaust gas.
[0016] In one embodiment, the water spraying device of each spraying machine includes a waste liquid recovery tank, a spraying assembly, and a negative pressure adsorption component. The waste liquid recovery tank of each spraying machine has a waste inlet and an exhaust outlet. The waste inlet of the waste liquid recovery tank of each spraying machine is arranged opposite to the corresponding first conveying device. The spraying assembly and the corresponding negative pressure adsorption component of each spraying machine are arranged in the corresponding waste liquid recovery tank, and the negative pressure adsorption component of each spraying machine is arranged adjacent to the corresponding exhaust outlet.
[0017] A circuit board is obtained by spraying with solder resist coating line as described in any of the above embodiments.
[0018] Compared with the prior art, the present invention has at least the following advantages:
[0019] The aforementioned solder resist spraying line utilizes the high ink supply pressure of the plunger pump, which atomizes the ink within the airless nozzle's orifice. This eliminates the need for compressed air to disperse the ink, simplifying the nozzle's structure and improving maintenance convenience. Furthermore, the high ink supply pressure of the plunger pump results in a high ink flow rate through the airless nozzle, reducing clogging and allowing for the continuous spraying of high-viscosity ink. The higher viscosity of the ink reduces the solvent required for dissolving the ink, lowering spraying costs. Simultaneously, it improves ink adhesion to the circuit board, preventing ink detachment and ultimately enhancing circuit board quality. Attached Figure Description
[0020] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0021] Figure 1 This is a schematic diagram of the structure of a solder resist spraying line according to one embodiment;
[0022] Figure 2 for Figure 1 A partial structural schematic diagram of the solder resist spraying line is shown.
[0023] Figure 3 for Figure 1 Another partial structural schematic diagram of the solder resist spraying line is shown.
[0024] Figure 4 for Figure 1Another partial structural schematic diagram of the solder resist spraying line is shown.
[0025] Figure 5 for Figure 1 Another partial structural schematic diagram of the solder resist spraying line is shown.
[0026] Figure 6 for Figure 1 This is another partial structural schematic diagram of the solder resist spraying line shown. Detailed Implementation
[0027] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of the invention are shown in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the invention.
[0028] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.
[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.
[0030] This application provides a solder resist coating line including an ink supply system, a coating machine, and a flipping machine. The ink supply system includes a plunger pump. The coating machine includes a first conveying device and an airless coating device. The first conveying device is used to convey a circuit board to the airless coating device. The airless coating device includes an airless nozzle with a plurality of airless nozzles facing the circuit board. The airless nozzles are connected to the output end of the plunger pump so that the airless nozzles spray the circuit board. There are two coating machines, and the flipping machine is located between the two coating machines. The first conveying device of one coating machine is also used to convey the circuit board from the corresponding airless coating device to the flipping machine, so that the flipping machine flips the circuit board. The flipping machine is also used to convey the flipped circuit board to the airless coating device of the other coating machine.
[0031] The aforementioned solder resist spraying line utilizes the high ink supply pressure of the plunger pump, which atomizes the ink within the airless nozzle's orifice. This eliminates the need for compressed air to disperse the ink, simplifying the nozzle's structure and improving maintenance convenience. Furthermore, the high ink supply pressure of the plunger pump results in a high ink flow rate through the airless nozzle, reducing clogging and allowing for the continuous spraying of high-viscosity ink. The higher viscosity of the ink reduces the solvent required for dissolving the ink, lowering spraying costs. Simultaneously, it improves ink adhesion to the circuit board, preventing ink detachment and ultimately enhancing circuit board quality.
[0032] To better understand the technical solution and beneficial effects of this application, the following detailed description is provided in conjunction with specific embodiments:
[0033] like Figure 1 and Figure 2 As shown, an embodiment of a solder resist coating line 10 includes an ink supply system 100, a coating machine 200, and a flipping machine 300, wherein the ink supply system 100 includes a plunger pump. The spraying machine 200 includes a first conveying device 210 and an airless spraying device 220. The first conveying device 210 is used to convey the circuit board 20 to the airless spraying device 220 so that the circuit board 20 to be sprayed is correspondingly arranged with the airless spraying device 220. The airless spraying device 220 includes an airless nozzle 221. The airless nozzle 221 has a plurality of airless spray holes facing the circuit board 20. The airless spray holes are connected to the output end of the plunger pump so that the plunger pump delivers ink to the airless spray holes, thereby making the airless spray holes spray the circuit board 20. The ink sprayed from the airless spray holes is fan-shaped so that the ink sprayed from the airless spray holes diffuses outward, thereby expanding the range of the ink sprayed from the airless spray holes, and thus making the ink sprayed from the airless spray holes cover a larger area of the circuit board 20. There are two spraying machines 200, and the flipping machine 300 is arranged between the two spraying machines 200. The two spraying machines 200 spray the opposite sides of the circuit board 20 respectively, and the flipping machine 300 is used to flip the circuit board 20.
[0034] Specifically, the airless nozzle 221 of the airless spraying device 220 of one of the spraying machines 200 is used to spray one side of the circuit board 20. The first conveying device 210 of the spraying machine 200 is also used to convey the circuit board 20 from the corresponding airless spraying device 220 to the flipping machine 300, so that the flipping machine 300 can flip the circuit board 20. The flipping machine 300 is also used to convey the flipped circuit board 20 to the airless spraying device 220 of another spraying machine 200, so that the airless nozzle 221 of the other airless spraying device 220 of the spraying machine 200 can spray the other side of the circuit board 20. In this embodiment, the plunger pump obtains power through hydraulic pressure. The plunger pump has a high output pressure. Since the plunger pump is prior art, it will not be described in detail here.
[0035] The aforementioned solder resist spraying line 10 utilizes a high ink supply pressure from the plunger pump, causing the ink to atomize within the airless nozzle 221. This eliminates the need for compressed air to disperse the ink, simplifying the nozzle's structure and improving maintenance convenience. Furthermore, the high ink supply pressure from the plunger pump results in a high ink flow rate through the airless nozzle 221, reducing the likelihood of ink clogging and allowing for the continuous spraying of high-viscosity ink. The higher viscosity of the ink sprayed from the airless nozzle 221 reduces the solvent required for ink dissolution, lowering spraying costs. Simultaneously, it improves ink adhesion to the circuit board 20, preventing ink detachment and ultimately enhancing the quality of the circuit board 20.
[0036] like Figure 2As shown, in one embodiment, each of the spraying machines 200 further includes two ink baffles 230. The two ink baffles 230 of each spraying machine 200 are respectively connected to both sides of the corresponding first conveying device 210, and both ink baffles 230 of each spraying machine 200 protrude from the side of the corresponding first conveying device 210 adjacent to the corresponding airless spraying device 220. When the airless nozzle 221 of the airless spraying device 220 of each spraying machine 200 performs spraying, the ink diffuses outward in a fan shape, thereby causing the ink to adhere to the circuit board 20. In order to prevent ink from being sprayed onto the outside of the spraying machine 200, that is, to suppress ink pollution of the working environment, in this embodiment, each spraying machine 200 also includes two ink baffles 230. The two ink baffles 230 of each spraying machine 200 are respectively connected to both sides of the corresponding first conveying device 210, and the two ink baffles 230 of each spraying machine 200 protrude from the corresponding first conveying device 210, so that the ink baffles 230 block the ink inside the spraying machine 200, thereby suppressing the problem of ink pollution of the working environment, and also suppressing the problem of ink leakage and waste.
[0037] like Figure 2 As shown, in one embodiment, each of the spraying machines 200 further includes an ink recovery device 240. The airless nozzle 221 of the airless spraying device 220 of each spraying machine 200 and the corresponding ink recovery device 240 are respectively disposed on the upper and lower sides of the corresponding first conveying device 210. It can be understood that the ink sprayed by the airless spraying device 220 of each spraying machine 200 cannot be completely adhered to the circuit board 20, which will cause some ink waste.
[0038] To reduce ink waste, in this embodiment, each spraying machine 200 also includes an ink recovery device 240. The ink recovery device 240 of each spraying machine 200 is located below the corresponding first conveying device 210, that is, the ink recovery device 240 and the corresponding airless nozzle 221 of each spraying machine 200 are located on opposite sides of the corresponding first conveying device 210. When the airless nozzle 221 of the airless spraying device 220 of the spraying machine 200 sprays ink onto the circuit board 20, the ink not adhering to the circuit board 20 will fall into the corresponding ink recovery device 240. The ink recovered by the corresponding ink recovery device 240 is used for subsequent recycling, thereby improving the ink utilization rate and reducing ink waste.
[0039] like Figure 2As shown, further, the ink recovery device 240 of each of the spraying machines 200 includes an oil receiving component 241 and an oil storage tank 242. The oil receiving component 241 of each spraying machine 200 and the corresponding airless nozzle 221 are respectively located on opposite sides of the corresponding first conveying device 210, that is, the oil receiving component 241 of each spraying machine 200 is located below the corresponding first conveying device 210, and the oil receiving component 241 of each spraying machine 200 has an oil leakage hole. The oil storage tank 242 of each spraying machine 200 has an oil inlet hole, and the oil inlet hole of the oil storage tank 242 of each spraying machine 200 communicates with the corresponding oil leakage hole. In this embodiment, the ink collection component 241 of the ink recovery device 240 of each spraying machine 200 collects the falling ink and guides the ink into the corresponding oil storage tank 242, thereby recycling the falling ink and suppressing the problem of ink waste.
[0040] like Figure 2 As shown, in one embodiment, each of the spraying machines 200 further includes a water spraying device 250, which is disposed adjacent to the corresponding airless spraying device 220. The water spraying device 250 of each spraying machine 200 is used to settle the exhaust gas. It is understood that after the airless nozzle 221 of the airless spraying device 220 of each spraying machine 200 sprays ink, some ink will remain suspended in the air, thereby generating exhaust gas that pollutes the environment and may even cause respiratory diseases in workers. To reduce ink pollution of the air, in this embodiment, each spraying machine 200 further includes a water spraying device 250, which is disposed adjacent to the corresponding airless spraying device 220. The water spraying device 250 of each spraying machine 200 is used to spray the exhaust gas, so that the ink in the exhaust gas dissolves in the water and settles, thereby suppressing the pollution of the air by the ink exhaust gas.
[0041] Furthermore, each of the spraying machines 200 includes a waste liquid recovery tank, a spraying assembly, and a negative pressure adsorption component. The waste liquid recovery tank of each spraying machine 200 has a waste inlet and an exhaust outlet. The waste inlet of the waste liquid recovery tank of each spraying machine 200 is arranged opposite to the corresponding first conveying device 210. The spraying assembly and the corresponding negative pressure adsorption component of each spraying machine 200 are all arranged in the corresponding waste liquid recovery tank, and the negative pressure adsorption component of each spraying machine 200 is arranged adjacent to the corresponding exhaust outlet. In this embodiment, the negative pressure adsorption component of the water spray device 250 of each spraying machine 200 is used to adsorb the exhaust gas, so that the exhaust gas enters the corresponding waste liquid recovery tank through the inlet of the waste liquid recovery tank of the water spray device 250 of each spraying machine 200, thereby enabling the spraying assembly to spray the exhaust gas. The gas after spraying is discharged through the exhaust port, so that the ink in the exhaust gas dissolves in the spray liquid and sinks to the bottom of the corresponding waste liquid recovery tank, thereby suppressing the problem of exhaust gas polluting the environment.
[0042] Furthermore, the spraying components of the water spraying devices 250 of each of the spraying machines 200 include a first spraying element and a second spraying element. The first spraying element and the corresponding second spraying element of the spraying components of the water spraying devices 250 of each of the spraying machines 200 are arranged at intervals along the flow direction of the exhaust gas, so that the first spraying element and the corresponding second spraying element of the spraying components of the water spraying devices 250 of each of the spraying machines 200 spray the exhaust gas in sequence, thereby improving the spraying effect of the water spraying devices 250 of each spraying machine 200 on the exhaust gas, reducing the amount of ink discharged from the exhaust port of the waste liquid recovery tank of the spraying device of each spraying machine 200, and thus suppressing the pollution of the air by the ink.
[0043] like Figure 2 As shown, in one embodiment, each of the airless spraying devices 220 of the spraying machine 200 includes a spraying drive mechanism 222. The power output end of the spraying drive mechanism 222 of each of the airless spraying devices 220 is connected to the corresponding airless nozzle 221, so that the spraying drive mechanism 222 of each of the airless spraying devices 220 drives the corresponding airless nozzle 221 to move and spray. In this embodiment, the power output end of the spraying drive mechanism 222 of each of the airless spraying devices 220 is connected to the corresponding airless nozzle 221, so that the spraying drive mechanism 222 of each of the airless spraying devices 220 drives the corresponding airless nozzle 221 to reciprocate and spray, thereby completely covering the circuit board 20 with ink.
[0044] like Figure 3As shown, further, the spraying drive mechanism 222 of the airless spraying device 220 of each of the spraying machines 200 includes a rotating drive member 2221 and a drive connector 2222. The first end of the drive connector 2222 of the spraying drive mechanism 222 of each of the spraying machines 200 is connected to the power output end of the corresponding rotating drive member 2221, and the airless nozzle 221 of the airless spraying device 220 of each of the spraying machines 200 is connected to the second end of the corresponding drive connector 2222. When the airless spraying device 220 of each spraying machine 200 is spraying the circuit board 20, the airless nozzle 221 reciprocates. When the airless nozzle 221 of each spraying machine 200 switches directions, the speed will first decrease and then increase. This will cause the airless nozzle 221 to stay at the edge of the circuit board 20 for a longer time, which will lead to ink accumulation at the edge of the circuit board 20, that is, the ink on the circuit board 20 will be uneven. To improve the uniformity of ink on the circuit board 20, in this embodiment, the drive connector 2222 of the spraying drive mechanism 222 of the airless spraying device 220 of each spraying machine 200 is a rod-shaped structure. The first end of the drive connector 2222 of the spraying drive mechanism 222 of each spraying machine 200 is connected to the corresponding rotating drive member 2221, and the airless nozzle 221 of each spraying machine 200 is connected to the second end of the corresponding drive connector 2222. This allows the rotating drive member 2221 of the spraying drive mechanism 222 of each spraying machine 200 to drive the second end of the corresponding drive connector 2222 to move at a higher speed with a lower linear velocity. This increases the acceleration of the airless nozzle 221 when switching directions, thereby reducing the time for the airless nozzle 221 to switch directions and reducing the problem of uneven spraying by the airless nozzle 221, thus improving the uniformity of ink on the circuit board 20.
[0045] like Figure 3Furthermore, the spraying drive mechanism 222 of the airless spraying device 220 of each of the spraying machines 200 further includes a rotating component 2223, a linear motion component 2225, and a guide component 2224. The rotating component 2223 of the spraying drive mechanism 222 of each of the airless spraying devices 220 of the spraying machine 200 is slidably connected to the second end of the corresponding drive connector 2222. The linear motion component 2225 of the spraying drive mechanism 222 of each of the airless spraying devices 220 of the spraying machine 200 is rotatably connected to the corresponding rotating component 2223. The linear motion component 2225 of the spraying drive mechanism 222 of each of the airless spraying devices 220 of the spraying machine 200 is slidably connected to the corresponding guide component 2224. The airless nozzle 221 of each of the airless spraying devices 220 of the spraying machine 200 is connected to the corresponding linear motion component 2225. In this embodiment, the guide member 2224 of the spraying drive mechanism 222 of the airless spraying device 220 of each spraying machine 200 is used to guide the linear motion of the corresponding linear motion component 2225. The linear motion component 2225 of the spraying drive mechanism 222 of the airless spraying device 220 of each spraying machine 200 is rotatably connected to the corresponding rotary member 2223 to prevent jamming when the linear motion component 2225 of the spraying drive mechanism 222 of the airless spraying device 220 of the spraying machine 200 moves linearly along the corresponding guide member 2224. This ensures that the linear motion component 2225 of the spraying drive mechanism 222 of the airless spraying device 220 of the spraying machine 200 slides along the guide member 2224, thereby allowing the corresponding airless nozzle 221 to spray in a predetermined direction. In one embodiment, the rotary member 2223 is a rotary bearing.
[0046] like Figure 3 As shown, in one embodiment, the spraying drive mechanism 222 of the airless spraying device 220 of each spraying machine 200 further includes a first guide rail 2226 and a first sliding member 2227. The first guide rail 2226 of the spraying drive mechanism 222 of the airless spraying device 220 of each spraying machine 200 is mounted on the corresponding drive connector 2222, and the first sliding member 2227 of the spraying drive mechanism 222 of the airless spraying device 220 of each spraying machine 200 is mounted on the corresponding rotary member 2223. The first sliding member 2227 of the spraying drive mechanism 222 of the airless spraying device 220 of each spraying machine 200 is also slidably connected to the corresponding first guide rail 2226.
[0047] The power output end of the rotating drive component 2221 of the airless spraying device 220 of each spraying machine 200 is rotating, causing the corresponding drive connector 2222 to also rotate, while the airless nozzle 221 needs to perform linear reciprocating motion and spray. Figure 3As shown, in order to enable the airless nozzle 221 to perform linear reciprocating motion, in this embodiment, the spraying drive mechanism 222 of the airless spraying device 220 of each spraying machine 200 further includes a first guide rail 2226 and a first sliding member 2227. The first guide rail 2226 of the spraying drive mechanism 222 of the airless spraying device 220 of each spraying machine 200 is mounted on the corresponding drive connector 2222. The first sliding member 2227 of the spraying drive mechanism 222 of the airless spraying device 220 of each spraying machine 200 is mounted on the corresponding rotating member 2223, and the first sliding member 2227 of the spraying drive mechanism 222 of the airless spraying device 220 of each spraying machine 200 is slidably connected to the corresponding first guide rail 2226 along the extending direction of the corresponding first guide rail 2226. It is understood that in other embodiments, the first guide rail 2226 of the spraying drive mechanism 222 of the airless spraying device 220 of each spraying machine 200 is mounted on the corresponding rotating part 2223, and the first sliding part 2227 of the spraying drive mechanism 222 of the airless spraying device 220 of each spraying machine 200 is mounted on the other end of the corresponding drive connector 2222.
[0048] like Figure 3 As shown, further, the first guide rail 2226 of the spraying drive mechanism 222 of the airless spraying device 220 of each of the spraying machines 200 is parallel to the corresponding drive connector 2222, so as to improve the driving efficiency of the spraying drive mechanism 222 on the airless nozzle 221, thereby improving the spraying efficiency of the airless nozzle 221.
[0049] It is understandable that, because the linear motion component 2225 of the spraying drive mechanism 222 of the airless spraying device 220 of each spraying machine 200 needs to reciprocate rapidly, and the linear motion component 2225 of the spraying drive mechanism 222 of each spraying machine 200 slides on the corresponding guide 2224, this causes friction between the linear motion component 2225 of the spraying drive mechanism 222 of each spraying machine 200 and the corresponding guide 2224, resulting in faster wear of the linear motion component 2225 of the spraying drive mechanism 222 of each spraying machine 200. For example... Figure 3As shown, in order to reduce the wear of the linear motion component 2225 of the spraying drive mechanism 222 of the airless spraying device 220 of each spraying machine 200, in one embodiment, the linear motion component 2225 of the spraying drive mechanism 222 of each spraying machine 200 includes a nozzle connector 2225a and a roller 2225b. The roller 2225b of the linear motion component 2225 of the spraying drive mechanism 222 of each spraying machine 200 is mounted on a corresponding... The nozzle connector 2225a, the roller 2225b of the linear motion component 2225 of the spraying drive mechanism 222 of the airless spraying device 220 of each spraying machine 200 is rotatably connected to the corresponding guide member 2224, the nozzle connector 2225a of the spraying drive mechanism 222 of the airless spraying device 220 of each spraying machine 200 is rotatably connected to the corresponding rotary member 2223, and the airless nozzle 221 of the airless spraying device 220 of each spraying machine 200 is connected to the corresponding nozzle connector 2225a.
[0050] In this embodiment, the rollers 2225b of the linear motion component 2225 of the spraying drive mechanism 222 of the airless spraying device 220 of each spraying machine 200 and the corresponding guide members 2224 experience rolling friction. This reduces the wear rate of the linear motion component 2225 and the corresponding guide members 2224 of the spraying drive mechanism 222 of the airless spraying device 220 of each spraying machine 200, thereby increasing the service life of the linear motion component 2225 and the guide members 2224. At the same time, it reduces the frictional resistance of the linear motion component 2225 and the airless nozzle 221, thereby increasing the movement speed of the linear motion component 2225 and the airless nozzle 221, resulting in better ink uniformity on the circuit board 20.
[0051] like Figure 4As shown, furthermore, since the linear motion component 2225 of the spraying drive mechanism 222 of each airless spraying device 220 of the spraying machine 200 moves at a relatively high speed, even though the linear motion component 2225 of the spraying drive mechanism 222 of each airless spraying device 220 of the spraying machine 200 rolls on the corresponding guide member 2224, the roller 2225b of the linear motion component 2225 of the spraying drive mechanism 222 of each airless spraying device 220 of the spraying machine 200 will be worn. Therefore, the roller 2225b of the linear motion component 2225 needs to be replaced periodically. To improve the ease of replacing rollers 2225b, in one embodiment, the linear motion component 2225 of the spraying drive mechanism 222 of the airless spraying device 220 of each spraying machine 200 further includes a mounting rod 2225c. The nozzle connector 2225a of the linear motion component 2225 of the airless spraying device 220 of each spraying machine 200 has a disassembly hole. One end of the mounting rod 2225c of the linear motion component 2225 of the airless spraying device 220 of each spraying machine 200 is connected to the corresponding conveying roller 2225b, and the other end of the mounting rod 2225c of the linear motion component 2225 of the airless spraying device 220 of each spraying machine 200 is located in the corresponding disassembly hole and is sleeved with the corresponding nozzle connector 2225a.
[0052] like Figure 4As shown, further, the nozzle connector 2225a of the linear motion component 2225 of the airless spraying device 222 of each spraying machine 200 is also provided with a threaded ejection hole. The threaded ejection hole of the nozzle connector 2225a of the linear motion component 2225 of the airless spraying device 222 of each spraying machine 200 is coaxial with and connected to the corresponding disassembly hole. The linear motion component 2225 of the airless spraying device 222 of each spraying machine 200 also includes a threaded ejection part 2225d. The threaded ejection part 2225d of the linear motion component 2225 of the airless spraying device 222 of each spraying machine 200 is threadedly connected to the corresponding threaded ejection hole and abuts against the corresponding mounting rod 2225c. In this embodiment, when disassembling roller 2225b, the threaded ejector 2225d of the linear motion component 2225 of the spraying drive mechanism 222 of the airless spraying device 220 of each spraying machine 200 is rotated, so that the threaded ejector 2225d of the linear motion component 2225 of the spraying drive mechanism 222 of each spraying machine 200 enters the corresponding disassembly hole, thereby causing the threaded ejector 2225d of the linear motion component 2225 of the spraying drive mechanism 222 of each spraying machine 200 to push the corresponding mounting rod 2225c out of the corresponding disassembly hole. In this way, roller 2225b can be disassembled simply by rotating the threaded ejector 2225d, improving the ease of disassembling roller 2225b, and thus improving the ease of maintenance and replacement of roller 2225b.
[0053] It is understandable that, due to the high speed of the linear motion component 2225, when the linear motion component 2225 switches its direction of movement, the first guide rail 2226 and the corresponding first sliding member 2227 of the spraying drive mechanism 222 of each airless spraying device 220 of the spraying machine 200 are prone to violent collisions. This causes significant wear or even damage to the first guide rail 2226 and the corresponding first sliding member 2227 of the spraying drive mechanism 222 of each airless spraying device 220 of the spraying machine 200, thereby reducing the driving effect of the drive connector 2222 of the spraying drive mechanism 222 of each airless spraying device 220 on the corresponding linear motion component 2225. Please refer to [further details]. Figure 3 and Figure 5In order to reduce the impact on the first guide rail 2226 and the first sliding member 2227, in one embodiment, the spraying drive mechanism 222 of the airless spraying device 220 of each spraying machine 200 further includes a buffer member 2228. The buffer member 2228 of the spraying drive mechanism 222 of the airless spraying device 220 of each spraying machine 200 is embedded in the first slide groove 2227a of the corresponding first sliding member 2227, and the buffer member 2228 of the spraying drive mechanism 222 of the airless spraying device 220 of each spraying machine 200 slides on the corresponding first guide rail 2226.
[0054] In this embodiment, when the linear motion component 2225 of the spraying drive mechanism 222 of the airless spraying device 220 of each spraying machine 200 switches its motion direction, the buffer 2228 of the spraying drive mechanism 222 of the airless spraying device 220 of each spraying machine 200 uses elastic deformation to alleviate the force of the collision between the corresponding first guide rail 2226 and the corresponding first sliding member 2227, thereby avoiding severe wear or even damage to the corresponding first guide rail 2226 and the corresponding first sliding member 2227. It can be understood that in this embodiment, the buffer 2228 is an elastic structure.
[0055] like Figure 3 As shown, it can be understood that because the drive connector 2222 is a rod-shaped structure, and its two ends are respectively equipped with a rotation drive 2221 and a linear motion component 2225, when the linear motion component 2225 switches directions, the forces on both ends of the drive connector 2222 are opposite, causing the drive connector 2222 to be subjected to bending forces. This makes the drive connector 2222 more prone to cracking and breakage, thereby reducing the stability of the airless nozzle 221 and reducing the service life of the drive connector 2222. To suppress the cracking and breakage of the drive connector 2222, in one of... In the embodiment, the drive connector 2222 of the spraying drive mechanism 222 of the airless spraying device 220 of each spraying machine 200 is integrally formed with the corresponding first guide rail 2226, so that the first guide rail 2226 of the spraying drive mechanism 222 of the airless spraying device 220 of each spraying machine 200 serves as a reinforcing rib of the corresponding drive connector 2222, thereby improving the strength of the drive connector 2222, thus suppressing the problem of breakage of the drive connector 2222, improving the service life of the drive connector 2222, and improving the movement stability of the airless nozzle 221, thereby improving the spraying stability of the airless nozzle 221.
[0056] like Figure 5As shown, it can be understood that the drive connector 2222 of the spraying drive mechanism 222 of each airless spraying device 220 of each spraying machine 200 and the corresponding first guide rail 2226 move in a rotating manner. This causes the force exerted by the first guide rail 2226 of the spraying drive mechanism 222 of each airless spraying device 220 on the corresponding buffer 2228 to have an angle with the corresponding buffer 2228. Consequently, the corresponding buffer 2228 is prone to denting, which in turn causes the corresponding first sliding member 2227, the corresponding linear motion component 2225 and the corresponding airless nozzle 221 to be prone to jamming, which in turn reduces the uniformity of the ink on the circuit board 20.
[0057] To avoid the ink uniformity of circuit board 20 being adversely affected by buffer 2228, such as Figure 5 As shown, in one embodiment, the buffer 2228 of the spraying drive mechanism 222 of the airless spraying device 220 of each spraying machine 200 includes an elastic buffer portion 2228a and a hard contact portion 2228b. The elastic buffer portion 2228a of the buffer 2228 of the airless spraying device 220 of each spraying machine 200 is connected to the first slide groove 2227a of the corresponding first sliding member 2227. The hard contact portion 2228b of the buffer 2228 of the airless spraying device 220 of each spraying machine 200 is connected to the corresponding elastic buffer portion 2228a. The hard contact portion 2228b of the buffer 2228 of the airless spraying device 220 of each spraying machine 200 is slidably connected to the corresponding first guide rail 2226.
[0058] In this embodiment, the rigid contact portion 2228b is a rigid structure. Since the rigid contact portion 2228b of the buffer member 2228 of the spraying drive mechanism 222 of each airless spraying device 220 of the spraying machine 200 contacts the corresponding first guide rail 2226, the corresponding buffer member 2228 will not experience a dent. That is, the contact surface between the corresponding buffer member 2228 and the corresponding first guide rail 2226 will not experience a dent, and consequently, the rigid contact portion 2228b will not experience a dent. This improves the smoothness of the movement of the airless printhead 221 and suppresses the problem of uneven ink spraying from the airless printhead 221. In one embodiment, the rigid contact portion 2228b is a plate-like structure. It can be understood that the elastic buffer portion 2228a can be a silicone body, a rubber body, a spring, or other existing elastic structures.
[0059] like Figure 5As shown, furthermore, the hard contact portion 2228b of the buffer member 2228 of the airless spraying device 222 of each spraying machine 200 has a countersunk hole 2228c, the elastic buffer portion 2228a of the buffer member 2228 of the airless spraying device 222 of each spraying machine 200 has a through hole 2228d, the first sliding member 2227 of the airless spraying device 222 of each spraying machine 200 has a screw hole 2227b, and the airless spraying device 222 of each spraying machine 200 also includes a fastener 2229. The fasteners 2229 of the spraying drive mechanism 222 of the spraying machine 20 are inserted through the corresponding through holes 2228d, and one end of the fasteners 2229 of the spraying drive mechanism 222 of the airless spraying device 220 of each spraying machine 200 is screwed to the corresponding screw hole 2227b. The other end of the fasteners 2229 of the spraying drive mechanism 222 of the airless spraying device 220 of each spraying machine 200 is located in the corresponding countersunk hole 2228c and abuts against the bottom surface of the countersunk hole 2228c. There is a gap between the end face of the fasteners 2229 of the airless spraying device 222 of each spraying machine 200 that is away from the corresponding screw hole 2227b and the corresponding hard contact part 2228b.
[0060] In this embodiment, the corresponding hard contact portion 2228b and the corresponding elastic buffer portion 2228a are mounted on the corresponding first sliding member 2227 by the fasteners 2229 of the spraying drive mechanism 222 of the airless spraying device 220 of each spraying machine 200. Since there is a gap between the end face of the fastener 2229 of the spraying drive mechanism 222 of the airless spraying device 220 of each spraying machine 200 away from the corresponding screw hole 2227b and the corresponding hard contact portion 2228b, the problem of the fastener 2229 of the spraying drive mechanism 222 of the airless spraying device 220 of each spraying machine 200 protruding from the corresponding countersunk hole 2228c is avoided. This avoids the problem of the fastener 2229 of the spraying drive mechanism 222 of the airless spraying device 220 of each spraying machine 200 interfering with the sliding of the corresponding first sliding member 2227, thereby improving the smoothness of ink ejection from the airless printhead 221.
[0061] like Figure 5As shown, further, the surface of the hard contact portion 2228b of the buffer member 2228 of the spraying drive mechanism 222 of the airless spraying device 220 of each spraying machine 200 is coated with a wear-resistant layer to increase the hardness of the hard contact portion 2228b, thereby reducing the wear of the hard contact portion 2228b, while avoiding the problem of further inhibiting the deformation or even dent of the hard contact portion 2228b, and further improving the smoothness of the movement of the airless nozzle 221. Furthermore, the wear-resistant layer of the hard contact portion 2228b of the buffer member 2228 of the spraying drive mechanism 222 of the airless spraying device 220 of each spraying machine 200 is coated with a lubricating layer to reduce the frictional force on the wear-resistant layer, thereby reducing the wear of the wear-resistant layer and resulting in a longer service life of the wear-resistant layer.
[0062] like Figure 6 As shown, in one embodiment, the flipping machine 300 includes a flipping table 310, a second conveying device 320, a flipping drive 330, and a clamping mechanism 340. The flipping drive 330 is mounted on the flipping table 310, and the clamping mechanism 340 is mounted on the power output end of the flipping drive 330. The second conveying device 320 is used to convey the circuit board 20 to the position corresponding to the clamping mechanism 340, so that the clamping mechanism 340 clamps the circuit board 20. The flipping drive 330 is used to drive the clamping mechanism 340 and the circuit board 20 to flip. The second conveying device 320 is also used to convey the flipped circuit board 20 to the first conveying device 210 of another spraying machine 200. In this embodiment, the flipping drive 330 drives the clamping mechanism 340 and the circuit board 20 to flip 180° so that the uncoated side of the circuit board 20 faces upward, so that the other spraying machine 200 can spray that side. In this way, manual intervention in flipping the circuit board 20 is avoided, which in turn avoids the situation where the ink on the circuit board 20 is not fully solidified, thereby improving the coating quality of the circuit board 20. At the same time, the flipping efficiency of the circuit board 20 is improved, which in turn improves the coating efficiency of the circuit board 20.
[0063] like Figure 6 As shown, the clamping mechanism 340 further includes a flipping connector 341 and a clamping assembly 342, wherein there are multiple clamping assemblies 342. One end of the flipping connector 341 is connected to the power output end of the flipping drive 330, and multiple clamping assemblies 342 are installed on the other end of the flipping connector 341. All multiple clamping assemblies 342 are used to clamp the circuit board 20, which improves the clamping strength of the clamping assembly 342 and avoids the circuit board 20 from falling off during flipping, thereby ensuring the normal flipping of the circuit board 20.
[0064] This application also provides a circuit board 20, which is obtained by spraying with solder resist spraying machine 200 as described in any of the above embodiments.
[0065] Compared with the prior art, the present invention has at least the following advantages:
[0066] The aforementioned solder resist spraying line 10 utilizes a high ink supply pressure from the plunger pump, causing the ink to atomize within the airless nozzle 221. This eliminates the need for compressed air to disperse the ink, simplifying the nozzle's structure and improving maintenance convenience. Furthermore, the high ink supply pressure from the plunger pump results in a high ink flow rate through the airless nozzle 221, reducing the likelihood of ink clogging and allowing for the continuous spraying of high-viscosity ink. The higher viscosity of the ink sprayed from the airless nozzle 221 reduces the solvent required for ink dissolution, lowering spraying costs. Simultaneously, it improves ink adhesion to the circuit board 20, preventing ink detachment and ultimately enhancing the quality of the circuit board 20.
[0067] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.
Claims
1. A solder resist spraying line, characterized in that, include: Ink supply system, including plunger pump; A spraying machine includes a first conveying device and an airless spraying device. The first conveying device conveys a circuit board to the airless spraying device. The airless spraying device includes an airless nozzle with a plurality of airless nozzle holes facing the circuit board. The airless nozzle holes are connected to the output end of a plunger pump to spray the circuit board. The number of spraying machines is two. A flipping machine is disposed between two of the spraying machines, wherein a first conveying device of one of the spraying machines is further used to convey the circuit board from the corresponding airless spraying device to the flipping machine, so that the flipping machine is used to flip the circuit board, and the flipping machine is further used to convey the flipped circuit board to the airless spraying device of the other spraying machine. Each of the airless spraying devices of the spraying machine includes a spraying drive mechanism. The power output end of the spraying drive mechanism of each of the airless spraying devices of the spraying machine is connected to the corresponding airless nozzle, so that the spraying drive mechanism of each of the airless spraying devices of the spraying machine is used to drive the corresponding airless nozzle to move and spray. The airless spraying device of each of the spraying machines includes a rotating drive component and a drive connector. The first end of the drive connector of the airless spraying device of each of the spraying machines is connected to the power output end of the corresponding rotating drive component, and the airless nozzle of the airless spraying device of each of the spraying machines is connected to the second end of the corresponding drive connector. The airless spraying device of each of the aforementioned spraying machines further includes a rotating component, a linear motion component, and a guide component. The rotating component of the airless spraying device of each of the aforementioned spraying machines is slidably connected to the second end of the corresponding drive connector. The linear motion component of the airless spraying device of each of the aforementioned spraying machines is rotatably connected to the corresponding rotating component. The linear motion component of the airless spraying device of each of the aforementioned spraying machines is slidably connected to the corresponding guide component. The airless nozzle of the airless spraying device of each of the aforementioned spraying machines is connected to the corresponding linear motion component. The linear motion component of the spraying drive mechanism of each of the airless spraying devices of the spraying machine includes a nozzle connector and rollers. The rollers of the linear motion component of the spraying drive mechanism of each of the airless spraying devices of the spraying machine are mounted on the corresponding nozzle connectors. The rollers of the linear motion component of the spraying drive mechanism of each of the airless spraying devices of the spraying machine are rotatably connected to the corresponding guide members. The nozzle connectors of the spraying drive mechanism of each of the airless spraying devices of the spraying machine are rotatably connected to the corresponding rotary members. The airless nozzles of each of the airless spraying devices of the spraying machine are connected to the corresponding nozzle connectors. The linear motion component of the spraying drive mechanism of the airless spraying device of each of the aforementioned spraying machines further includes a mounting rod. The nozzle connector of the linear motion component of the spraying drive mechanism of the airless spraying device of each of the aforementioned spraying machines has a disassembly hole. One end of the mounting rod of the linear motion component of the spraying drive mechanism of the airless spraying device of each of the aforementioned spraying machines is connected to the corresponding conveying roller of the linear motion component of the spraying drive mechanism of the airless spraying device of each of the aforementioned spraying machines. The other end of the mounting rod of the linear motion component of the spraying drive mechanism of the airless spraying device of each of the aforementioned spraying machines is located in the corresponding disassembly hole and is sleeved with the corresponding nozzle connector. The nozzle connector of the linear motion component of the spraying drive mechanism of each airless spraying device of the spraying machine is further provided with a threaded ejection hole. The threaded ejection hole of the nozzle connector of the linear motion component of the spraying drive mechanism of each airless spraying device of the spraying machine is coaxial with and connected to the corresponding disassembly hole. The linear motion component of the spraying drive mechanism of each airless spraying device of the spraying machine also includes a threaded ejector. The threaded ejector of the linear motion component of the spraying drive mechanism of each airless spraying device of the spraying machine is threadedly connected to the corresponding threaded ejection hole and abuts against the corresponding mounting rod.
2. The solder resist spraying line according to claim 1, characterized in that, The airless spraying device of each of the aforementioned spraying machines further includes a first guide rail and a first sliding member. The first guide rail of the airless spraying device of each of the aforementioned spraying machines is mounted on the corresponding drive connector. The first sliding member of the airless spraying device of each of the aforementioned spraying machines is rotatably connected to the corresponding rotary member, and the first sliding member of the airless spraying device of each of the aforementioned spraying machines is also slidably connected to the corresponding first guide rail.
3. The solder resist spraying line according to claim 1, characterized in that, Each of the spraying machines further includes two ink baffles, which are respectively connected to both sides of the corresponding first conveying device, and both ink baffles of each spraying machine protrude from the side of the corresponding first conveying device adjacent to the corresponding airless spraying device.
4. The solder resist spraying line according to claim 1, characterized in that, Each of the spraying machines further includes an ink recovery device, and the airless nozzle of the airless spraying device of each of the spraying machines and the corresponding ink recovery device are respectively arranged on the upper and lower sides of the corresponding first conveying device.
5. The solder resist spraying line according to any one of claims 1 to 4, characterized in that, Each of the spraying machines also includes a water spraying device, which is located adjacent to the corresponding airless spraying device. The water spraying device of each spraying machine is used to settle the exhaust gas.
6. The solder resist spraying line according to claim 5, characterized in that, Each of the spraying machines has a water spraying device including a waste liquid recovery tank, a spraying assembly, and a negative pressure adsorption component. The waste liquid recovery tank of each spraying machine has a waste inlet and an exhaust outlet. The waste inlet of the waste liquid recovery tank of each spraying machine is arranged opposite to the corresponding first conveying device. The spraying assembly and the corresponding negative pressure adsorption component of each spraying machine are arranged in the corresponding waste liquid recovery tank, and the negative pressure adsorption component of each spraying machine is arranged adjacent to the corresponding exhaust outlet.
7. A circuit board, characterized in that, It is obtained by spraying with the solder resist spraying line according to any one of claims 1 to 6.
Citation Information
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