A production line for preparing chip electronic components

Abstract

The present invention provides a production line for preparing chip-type electronic components, which mainly includes a metal tape unwinding and a traction mechanism, a paper tape and an adhesive tape unwinding and a traction mechanism, the adhesive tape is placed above the paper tape and the two are moved synchronously and bonded at a gluing head, a stamping die is provided on one side of the gluing head, the metal tape moves through the gluing head and the stamping die in sequence, the stamping die stamps the metal tape to form a metal sheet, a movable slider is provided at the bottom of the stamping die for conveying the metal sheet, and after the adhesive tape and the paper tape are bonded, the metal sheet is carried through a profiling station, a chip loading station, a solder heating station, and a pin cutting and tray loading station to form a finished product. The present invention uses a metal sheet as a single pin of an electronic component, which is moved by metal tape stamping and adhesive tape bonding. Through a series of automated processes such as profiling and chip welding, the finished product is obtained through integrated production, with low equipment cost and high efficiency.

Description

Technical field:

[0001] The present invention relates to the technical field of electronic component production equipment, in particular to a production line for preparing chip-type electronic components. Background technology:

[0002] Chip varistors, thermistors, ceramic capacitors, and other electronic components are rapidly replacing traditional epoxy-encapsulated components. These new chip structures not only save installation space but also provide greater ease and durability. Currently, single-pin chip components are typically formed by punching the pins, bending them, and then soldering them to the chip. These processes typically require multiple machines and manual labor, resulting in low efficiency and high production costs. Currently, no equipment is available on the market that can fully integrate the production of chip components. Summary of the invention:

[0003] The purpose of the present invention is to provide a production line for the preparation of chip electronic components in response to the existing technical status, which has full-process integrated automatic production and is more efficient and economical.

[0004] In order to achieve the above object, the present invention adopts the following technical solutions:

[0005] The present invention is a production line for preparing chip-type electronic components, which mainly includes a metal tape unwinding and a traction mechanism, a paper tape and an adhesive tape unwinding and a traction mechanism, the adhesive tape is above the paper tape and the two move synchronously and are bonded at a glue pressing head, a stamping die is provided on one side of the glue pressing head, the metal tape moves through the glue pressing head and the stamping die in sequence, the stamping die stamps the metal tape to form a metal sheet, a movable slider is provided at the lower part of the stamping die for conveying the metal sheet, and after the adhesive tape and the paper tape are bonded, the metal sheet is carried through a pressing station, a chip loading station, a solder heating station, and a lead cutting and tray loading station to form a finished product.

[0006] Furthermore, a magnetic attraction mechanism is provided on the movable slider, and the movable slider slides between the glue pressing head and the stamping die.

[0007] Furthermore, the metal belt and the paper belt or the adhesive belt move in a cross-shaped manner in an upper and lower position.

[0008] Furthermore, the pressing station presses the middle of the metal sheet into an L shape and punches holes in the metal sheet.

[0009] Preferably, the chip loading station adopts a vibration plate, and a push rod driven by a cylinder and a positioning rod located on the travel path of the metal sheet are arranged on one side of the chip loading station discharge port.

[0010] Furthermore, a tinning station is added to the front station of the chip loading station, and tin dots are added to the metal sheet through the tinning station. After the chip is loaded at the chip loading station, it enters the heating soldering station for curing, and the heating soldering station uses hot air soldering.

[0011] Furthermore, after the adhesive tape and the paper tape are bonded together, the metal sheet is carried through an insulating paint application station and a drying station. The insulating paint application station and the drying station are located after the soldering heating station.

[0012] Furthermore, the insulating paint station is provided with a paint tank, and a pressure wheel is provided above the paint tank. The metal sheet and the back of the chip welded thereto carried by the adhesive tape and paper tape are pressed down by the pressure wheel, and the metal sheet is painted in the paint tank and finally solidified in the drying station.

[0013] Preferably, after the adhesive tape and the paper tape are bonded together, the metal sheet is carried through an inspection station, and the inspection station is located in front of the cutting and loading station.

[0014] Furthermore, an assembly belt that moves in the opposite direction of the tape or paper tape is provided on one side of the cutting and loading station, and a material receiving mechanism is also configured to transport the finished products between the cutting and loading station and the assembly belt; the material receiving mechanism is specifically a material receiving rod driven by a motor, and a cylinder that drives the material receiving rod and its motor to move horizontally.

[0015] The beneficial effects of the present invention are: using a metal sheet as a single pin of an electronic component, it is carried by metal strip stamping and tape adhesion, and a series of automated processes such as pressing and chip welding, and an insulating layer on the back are used. The finished product is produced in an integrated belt assembly line without the need for manual operation, which is more efficient and economical. Description of the drawings:

[0016] Figure 1 It is a schematic structural diagram of the present invention;

[0017] Figure 2 It is a structural schematic diagram of the metal sheet stamping and tape bonding stations in the present invention.

[0018] In the above drawings: glue head 1, stamping die 2, moving slider 3, pressing station 4, tinning station 5, chip loading station 6, solder heating station 7, insulating paint application station 8, drying station 9, foot cutting and loading station 10, assembly belt 11, material connecting rod 12, magnetic suction mechanism 31, pushing rod 61, positioning rod 62, paint tank 81, pressure wheel 82, inspection station 90. Specific implementation method:

[0019] The present invention will be described in further detail below with reference to the accompanying drawings.

[0020] A production line for chip-type electronic components primarily includes a metal tape unwinding and traction mechanism, as well as paper and adhesive tape unwinding and traction mechanisms. Specifically, the metal tape has corresponding unwinding and rewinding mechanisms, with intermediate guide wheels providing auxiliary traction. The paper and adhesive tapes each have their own unwinding mechanisms. After bonding, the two are rewound by a unified rewinding mechanism, with intermediate guide wheels providing auxiliary traction. The metal tape is tinned iron tape.

[0021] Specific reference Figure 1 As shown, the adhesive tape is above the paper tape and the two move synchronously and are bonded at the gluing head 1. A stamping die 2 is provided on one side of the gluing head 1. The metal tape moves through the gluing head 1 and the stamping die 2 in sequence, and the metal tape is stamped by the stamping die 2 to form a metal sheet. A movable slider 3 is provided at the lower part of the stamping die 2 for conveying the metal sheet to the bonding point of the adhesive tape and the paper tape, and is pressed and bonded by the gluing head 1. After the adhesive tape and the paper tape are bonded, the metal sheet is carried through the pressing station 4, the chip loading station 6, the solder heating station 7, and the foot cutting and mounting station 10 to form a finished product.

[0022] The glue pressing head 1 is driven by the cylinder to press from top to bottom. Figure 2 As shown, there is a supporting rubber track under the glue pressing head 1, and the paper tape and the adhesive tape travel on the supporting track. When the movable slider 3 sends the end of the stamped metal sheet to the bonding point of the adhesive tape and the paper tape, the glue pressing head 1 presses down to bond the adhesive tape and the paper tape, and at the same time clamps the end of the metal sheet to the paper tape.

[0023] A magnetic attraction mechanism 31 is provided on the movable slider 3. The magnetic attraction mechanism 31 can be an electromagnet. The stamping die 2 stamps the stepping metal strip, and the metal sheet formed by the stamping falls on the movable slider. The magnetic attraction mechanism 31 then absorbs the metal sheet, and the movable slider 3 is driven by the cylinder to slide between the glue pressing head 1 and the stamping die 2, thereby transporting the metal sheet to the bonding position of the tape and the paper tape. Then the magnetic attraction mechanism 31 loses power, and the movable slider 3 resets to take on the next metal sheet.

[0024] The metal belt and the paper belt or adhesive tape move in a cross-shaped manner, both of which move in a step-by-step manner. The movable slider 3 for horizontal transportation can make the metal sheets evenly spaced on the paper belt, which is beneficial to the progressive construction of subsequent workstations.

[0025] The metal sheet punched by the stamping die 2 is long and has a disc at one end. The long strip serves as the pin of the electronic component. The disc can be soldered to the chip in the subsequent process. The front and back of the chip are two poles. The single-pin chip electronic component formed in this way can be used as a varistor, thermistor, ceramic capacitor, etc. One pole is connected to the PCB board through the pin, and the other pole is connected to the PCB board through the front of the chip.

[0026] The profiling station 4 is primarily driven by a pneumatic cylinder to press the metal sheet. A support rail is also located below the profiling station 4. The rail's stepped position allows the profiling station 4 to press the center of the metal sheet downward into an L-shape, ensuring that the bonded end of the metal sheet, serving as a lead, is flush with the front of the chip after soldering. Simultaneously, the profiling station 4 also punches holes in the metal sheet. These holes are then cut in the subsequent pin cutting and mounting station 10, leaving the end of the metal sheet, serving as a lead, with a semicircular groove, facilitating soldering or wire clamping to the PCB.

[0027] The chip loading station 6 utilizes a vibrating plate. A cylinder-driven push rod 61 and a positioning rod 62 located in the path of the metal sheet are located on one side of the chip loading station 6's discharge port. Specifically, the chip is supplied by the chip loading station 6 and positioned. The push rod 61 pushes the chip onto the disc at the end of the metal sheet that has reached the corresponding position. To ensure that the chip's placement matches the disc, a positioning rod 62 is installed above this position to define the chip's position. That is, when the push rod 61 pushes the chip against the positioning rod 62, the chip's position matches the disc.

[0028] The chip on the wafer can be directly sent to the heated soldering station 7 for welding. The welding method can be performed at the edge where the chip contacts the wafer. To make the welding more secure, it is preferred to add a tinning station 5 to the front station of the chip loading station 6. Tin dots are added to the wafer at the end of the metal sheet through the tinning station 5. Specifically, the tinning can be performed by automatic tinning equipment. After the chip is loaded at the chip loading station 6, it enters the heated soldering station 7 for curing. The heated soldering station 7 can use hot air soldering, that is, hot air is used to melt and solidify the tin dots between the wafer and the chip to connect the two.

[0029] After the adhesive tape and paper tape are bonded, the metal sheet is carried through an insulating varnishing station 8 and a drying station 9. These stations are located after the soldering station 7 and provide an insulating layer on the upper surface of the semi-finished product after the metal sheet and chip are soldered. Specifically, the insulating varnishing station 8 has a paint tank 81, above which is a pressure wheel 82. The adhesive tape and paper tape carry the metal sheet and the back of the chip being soldered, which is pressed down by the pressure wheel 82, and the paint is applied in the paint tank 81. Finally, the metal sheet is cured in a high-temperature oven in the drying station 9.

[0030] To ensure the quality of the finished product, after the adhesive tape and paper tape are bonded, the metal sheet passes through inspection station 90. Inspection station 90 is located before the cutting and loading station 10. That is, before cutting and loading, the product passes through inspection station 90 to check whether it is qualified. Unqualified products can be rejected manually or by an automatic rejection mechanism. Inspection station 90 can use an automatic tester to perform contact inspection along the product's path. The automatic tester measures the product's properties, such as using a varistor to detect current flow. Automatic testers are widely used in the prior art and will not be discussed here.

[0031] In the pin cutting and loading station 10, a cutter driven by a cylinder is mainly used to cut the pins and cut the punched positions on the metal sheet. One side of the pin cutting and loading station 10 is provided with an assembly belt 11 that moves in the opposite direction of the tape or paper tape. The assembly belt 11 has evenly distributed slots. The assembly belt 11 is pulled by its corresponding unwinding and rewinding mechanism. A material receiving mechanism is also configured to transport the finished product between the pin cutting and loading station 10 and the assembly belt 11. The material receiving mechanism is specifically a material receiving rod 12 driven by a motor and a cylinder that drives the material receiving rod 12 and its motor to move horizontally. The end of the material receiving rod 12 is mainly driven by the cylinder to enter under the chip of the finished product at the corresponding position. After the metal sheet is cut at the pin cutting and loading station 10, the finished product falls on the material receiving rod 12. The cylinder resets and drives the material receiving rod 12 to retreat. Then the motor drives the material receiving rod 12 to flip downward, and the finished product is placed in the slot in the assembly belt 11. The assembly belt 11 gradually sends it out and seals the entire film.

[0032] The receiving rod 12 should also be connected to a negative pressure air pipe so that negative pressure can be generated at the end of the receiving rod 12, so that the finished product can be sucked during receiving and transferring, so that the transfer position is accurate and smooth.

[0033] The above content further describes the present invention in detail in conjunction with specific preferred embodiments. The technical scope of this invention is not limited to the contents of the specification. For ordinary technicians in this field, they can make improvements or changes based on the above description. All these improvements and changes should fall within the scope of protection of the claims attached to the present invention.

Claims

1. A production line for preparing chip electronic components, characterized by: The invention mainly comprises a metal strip unwinding and a traction mechanism, a paper strip and an adhesive tape unwinding and a traction mechanism, the adhesive tape is above the paper tape and the two are moved synchronously and bonded at a glue pressing head (1), a stamping die (2) is provided on one side of the glue pressing head (1), the metal strip moves through the glue pressing head (1) and the stamping die (2) in sequence, the stamping die (2) stamps the metal strip to form a metal sheet, a movable slider (3) is provided at the lower part of the stamping die (2) for conveying the metal sheet, and after the adhesive tape and the paper tape are bonded, the metal sheet is carried through a pressing station (4), a chip loading station (6), a solder heating station (7), and a foot cutting and loading station (10) to form a finished product; A magnetic attraction mechanism (31) is provided on the movable slider (3), and the movable slider (3) slides between the glue pressing head (1) and the stamping die (2); the metal tape and the paper tape or the adhesive tape move in a cross-shaped manner in the upper and lower positions; the chip loading station (6) adopts a vibration plate, and a push rod (61) driven by a cylinder and a positioning rod (62) located on the moving path of the metal sheet are arranged on one side of the discharge port of the chip loading station (6); after the adhesive tape and the paper tape are bonded, the metal sheet is also carried through the insulating paint application station (8) and the drying station (9), and the insulating paint application station (8) and the drying station (9) are located at the rear station of the heating solder station (7).

2. The production line for preparing chip electronic components according to claim 1, characterized in that: The pressing station (4) presses the middle of the metal sheet downward into an L shape and punches holes in the metal sheet.

3. The production line for preparing chip electronic components according to claim 1, characterized in that: A tinning station (5) is added to the front station of the chip loading station (6), and tin dots are added to the metal sheet through the tinning station (5). After the chip is loaded at the chip loading station (6), the metal sheet enters the heating soldering station (7) for curing. The heating soldering station (7) uses hot air soldering.

4. The production line for preparing chip electronic components according to claim 1, characterized in that: The upper insulating paint station (8) has a paint tank (81), and a pressure wheel (82) is provided above the paint tank (81). The metal sheet and the back of the chip welded thereto carried by the adhesive tape and the paper tape are pressed down by the pressure wheel (82), and the metal sheet is painted in the paint tank (81), and finally cured in the drying station (9).

5. A production line for preparing chip electronic components according to claim 1 or 4, characterized in that: After the adhesive tape is bonded to the paper tape, the metal sheet is carried through an inspection station (90), which is located in front of the cutting and loading station (10).

6. The production line for preparing chip electronic components according to claim 1, characterized in that: An assembly belt (11) running in the opposite direction to the adhesive tape or paper tape is provided on one side of the cutting and loading station (10), and a material receiving mechanism is also provided to transport the finished product between the cutting and loading station (10) and the assembly belt (11); the material receiving mechanism is specifically a material receiving rod (12) driven by a motor, and a cylinder that drives the material receiving rod (12) and its motor to move horizontally.

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