Power converter

Abstract

A power converter includes a housing, a heat dissipation module, and a first circuit board. The housing forms an accommodation space. Among them, the housing includes a first housing port and a second housing port. The heat dissipation module is detachably connected to the housing and is adapted to be disposed in the accommodation space. Among them, the heat dissipation module includes an internal flow channel that communicates the first housing port and the second housing port. A working fluid enters the internal flow channel through the first housing port and leaves the internal flow channel through the second housing port. The first circuit board includes a first circuit board body and a first heat source. The first heat source is disposed on the first circuit board body, and the first heat source is thermally connected to the internal flow channel of the heat dissipation module.

Description

Technical Field

[0001] Embodiments of the present invention relate to a power converter, and more particularly to a power converter having a heat dissipation module. Background Art

[0002] Existing power converters generally dissipate heat solely through heat dissipation fins. However, for power converters used in electric vehicles, since the components generate more heat, a water-cooled method is required for heat dissipation.

[0003] In existing power converters, the heat dissipation channels are integrally formed with the converter housing. However, this will cause the volume of the converter housing to be too large, making it difficult for welding equipment and production lines to accommodate. In addition, the main structure of existing power converters is metal, and it is difficult to reach the working temperature during welding, resulting in a decline in welding quality. Moreover, due to the obstruction of the side wall of the main housing (Main housing), it is not easy to inspect the welding quality of the solder joints and the debugging of the hardware circuit. The existing coolant channel (Coolant channel) is integrally formed with the main housing (Main housing), so the coolant channel can only be designed in a planar manner, and the heat dissipation area is small. The structure in which the heat dissipation channel is integrally formed with the converter housing has a difficult-to-utilize heat dissipation space and is difficult to modularize, which is not conducive to the design of the assembly process during mass production.

[0004] In addition, in different prior arts, there are also cases where residual stress exists in the solder joints and is prone to cracking. Summary of the Invention

[0005] Embodiments of the present invention provide a power converter to solve the problems of the prior art. The power converter includes a housing, a heat dissipation module, and a first circuit board. The housing forms an accommodation space. The housing includes a first housing port and a second housing port. The heat dissipation module is detachably connected to the housing and is adapted to be disposed in the accommodation space. The heat dissipation module includes an internal flow channel that communicates the first housing port and the second housing port. A working fluid enters the internal flow channel through the first housing port and leaves the internal flow channel through the second housing port. The first circuit board includes a first circuit board body and a first heat source. The first heat source is disposed on the first circuit board body, and the first heat source is thermally connected to the internal flow channel of the heat dissipation module.

[0006] In an embodiment, the heat dissipation module includes a first internal flow channel port and a second internal flow channel port. The first internal flow channel port is correspondingly connected to the first housing port, and the second internal flow channel port is correspondingly connected to the second housing port. The heat dissipation module is placed in the housing along a first direction. The first internal flow channel port is connected to the first housing port along the first direction, and the second internal flow channel port is connected to the second housing port along the first direction.

[0007] In one embodiment, the power converter further includes a locking accessory. Wherein, the housing includes at least one housing locking portion, the heat dissipation module includes at least one module locking portion, and the locking accessory locks and fixes the module locking portion to the housing locking portion along the first direction.

[0008] In one embodiment, the power converter further includes a second circuit board, which includes a second circuit board body and a second heat source. The second heat source is disposed on the second circuit board body, and the second heat source is thermally connected to the internal flow channel of the heat dissipation module. Wherein, the first circuit board is connected to a first side of the heat dissipation module, the second circuit board is connected to a second side of the heat dissipation module, and the first side is opposite to the second side.

[0009] In one embodiment, the heat dissipation module includes a module accommodation groove, and the first heat source is placed in the module accommodation groove to be thermally connected to the heat dissipation module.

[0010] In one embodiment, the first heat source includes a transformer.

[0011] In one embodiment, the first circuit board further includes a capacitor, which is connected to the first circuit board body. The heat dissipation module includes an annular connection portion, and the capacitor is connected to the annular connection portion to be thermally connected to the heat dissipation module.

[0012] In one embodiment, the first circuit board further includes a transistor, which is connected to the first circuit board body. The heat dissipation module includes a spring piece and a retaining wall. The spring piece pushes the transistor so that the transistor abuts against the retaining wall, whereby the transistor is thermally connected to the heat dissipation module.

[0013] In one embodiment, the power converter further includes a third circuit board, which includes a third circuit board body and a third heat source. The third circuit board body includes a circuit board opening, and the heat dissipation module includes a module boss. The module boss passes through the circuit board opening and is connected to the third heat source, whereby the third heat source is thermally connected to the heat dissipation module.

[0014] In one embodiment, the third heat source includes an inductor.

[0015] In one embodiment, the heat dissipation module further includes a module bump, and the second heat source is connected to the module bump, whereby the second heat source is thermally connected to the heat dissipation module. The second heat source is located between the second circuit board body and the heat dissipation module.

[0016] In one embodiment, the heat dissipation module includes a first module structure, a second module structure, and a third module structure. The second module structure is stacked on the first module structure, and the third module structure is stacked on the first module structure. The internal flow channel passes through the first module structure, the second module structure, and the third module structure.

[0017] In one embodiment, the height of the third module structure relative to the first module structure is lower than the height of the second module structure relative to the first module structure.

[0018] In one embodiment, the working fluid first enters the first module structure, then passes through the first module structure and enters the second module structure, then passes through the second module structure and enters the third module structure, and finally leaves the third module structure.

[0019] In one embodiment, the heat dissipation module includes a first connecting pipe, a second connecting pipe, and a third connecting pipe. The first housing port is connected to the first module structure. The first connecting pipe connects the first module structure and the second module structure. The second connecting pipe connects the second module structure and the third module structure. The third connecting pipe connects the third module structure and the second housing port.

[0020] In one embodiment, the first module structure includes a structure notch, and the third connecting pipe passes through the structure notch.

[0021] In one embodiment, the power converter further includes a fourth circuit board and a fifth circuit board. The first circuit board is thermally connected to the first module structure. The fourth circuit board is thermally connected to the second module structure. The fifth circuit board is thermally connected to the third module structure.

[0022] In another embodiment, the present invention provides an electric vehicle, including a cooling system and a power converter. A working fluid circulates in the cooling system to transfer heat. The power converter includes a housing, a heat dissipation module, and a first circuit board. The housing forms an accommodation space. Wherein, the housing includes a first housing port and a second housing port. The heat dissipation module is detachably connected to the housing and is adapted to be disposed in the accommodation space. Wherein, the heat dissipation module includes an internal flow channel that communicates the first housing port and the second housing port. The working fluid enters the internal flow channel through the first housing port and leaves the internal flow channel through the second housing port. The first circuit board includes a first circuit board body and a first heat source. The first heat source is disposed on the first circuit board body, and the first heat source is thermally connected to the internal flow channel of the heat dissipation module.

[0023] Applying the power converter of the embodiment of the present invention, since the housing and the heat dissipation module are separately manufactured, the heat dissipation module can be first combined with the first circuit board and then assembled into the housing. Due to the more detailed assembly steps that can be operated, the heat dissipation space on the heat dissipation module can be fully utilized, and it can be checked whether the first circuit board is fully combined with the heat dissipation module after assembly. Therefore, the production efficiency can be improved and the product yield can be improved. In the embodiment of the present invention, only the circuit board and the heat dissipation module need to be welded together, which is not only small in size but also has a small proportion of metal structure. Therefore, compared with the prior art, the welding equipment and the production line can easily accommodate the circuit board and the heat dissipation module, and the space utilization rate and welding efficiency of the welding equipment can both be improved. In addition, the situation of solder joint rupture can also be effectively improved. It is also relatively convenient to inspect the welding quality of the solder joints and debug the hardware circuits.

[0024] In addition, in another embodiment, the heat dissipation module includes a plurality of module structures, and these module structures form a three-dimensional water channel design, so that the heat dissipation area can be significantly increased. In one embodiment, the housing can even be made of engineering plastics to save weight. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1A To show a partial structure of the power converter according to the first embodiment of the present invention.

[0026] Figure 1B To show the internal flow channel of the power converter according to the first embodiment of the present invention.

[0027] Figure 1C To show the detailed structure of the housing of the present invention.

[0028] Figure 2A To show an exploded view of a partial structure of the power converter according to the first embodiment of the present invention.

[0029] Figure 2B To show an assembled view of a partial structure of the power converter according to the first embodiment of the present invention.

[0030] Figure 3A To show the detailed structure of the first circuit board and the heat dissipation module according to the embodiment of the present invention.

[0031] Figure 3B 、 Figure 3C To show the detailed structure of the third circuit board and the heat dissipation module according to the embodiment of the present invention.

[0032] Figure 4A 、 Figure 4B To show the detailed structure of the second circuit board and the heat dissipation module according to the embodiment of the present invention.

[0033] Figure 5A To show an exploded view of the power converter according to the second embodiment of the present invention.

[0034] Figure 5B To show the combined view of the heat dissipation module of the power converter according to the second embodiment of the present invention.

[0035] Figure 5C To show the exploded view of the heat dissipation module of the power converter according to the second embodiment of the present invention.

[0036] Among them, the reference numerals are:

[0037] C: Power converter

[0038] W: Working fluid

[0039] 1: First circuit board

[0040] 11: First heat source

[0041] 12: Capacitor

[0042] 13: Transistor

[0043] 19: First circuit board body

[0044] 2: Second circuit board

[0045] 21: Second heat source

[0046] 29: Second circuit board body

[0047] 3: Third circuit board

[0048] 31: Third heat source

[0049] 39: Third circuit board body

[0050] 391: Circuit board opening

[0051] 41: Fourth circuit board

[0052] 42: Fifth circuit board

[0053] 801, 802: Heat dissipation module

[0054] 8i: Inner flow channel

[0055] 81: First module structure

[0056] 811: Structure notch

[0057] 82: Second module structure

[0058] 83: Third module structure

[0059] 841: First connecting pipe

[0060] 842: Second connecting pipe

[0061] 843: Third connecting pipe

[0062] 871: Module accommodation groove

[0063] 872: Ring-shaped connecting part

[0064] 873: Elastic piece

[0065] 874: Retaining wall

[0066] 875: Module boss

[0067] 876: Module bump

[0068] 881: First side

[0069] 882: Second side

[0070] 891: First internal flow path port

[0071] 892: Second internal flow path port

[0072] 893: Module locking part

[0073] 9: Housing

[0074] 9S: Accommodation space

[0075] 911: First housing port

[0076] 912: Second housing port

[0077] 921: Locking accessory

[0078] 922: Housing locking part

[0079] Z: First direction Detailed implementation manner

[0080] Figure 1A To show a partial structure of the power converter according to the first embodiment of the present invention. Figure 1B To show the internal flow path of the power converter according to the first embodiment of the present invention. With reference to FIGS. 1A and 1B, the power converter C of the embodiment of the present invention includes a housing 9 and a heat dissipation module 801. The housing 9 forms an accommodation space 9S. Among them, the housing 9 includes a first housing port 911 and a second housing port 912. The heat dissipation module 801 is detachably connected to the housing 9 and is adapted to be disposed in the accommodation space 9S. Among them, the heat dissipation module 801 includes an internal flow path 8i, and the internal flow path 8i communicates with the first housing port 911 and the second housing port 912. A working fluid W enters the internal flow path 8i through the first housing port 911 and leaves the internal flow path 8i through the second housing port 912.

[0081] Referring to FIGS. 1A and 1B, in one embodiment, the heat dissipation module 801 includes a first internal flow channel port 891 and a second internal flow channel port 892. The first internal flow channel port 891 is correspondingly connected to the first housing port 911, and the second internal flow channel port 892 is correspondingly connected to the second housing port 912. The heat dissipation module 801 is placed in the housing 9 along a first direction Z. The first internal flow channel port 891 is connected to the first housing port 911 along the first direction Z, and the second internal flow channel port 892 is connected to the second housing port 912 along the first direction Z.

[0082] Figure 1C To show the detailed structure of the housing of the present invention, referring to FIGS. 1A and 1C, in one embodiment, the power converter C further includes at least one locking accessory 921. Wherein, the housing 9 includes at least one housing locking portion 922, and the heat dissipation module 801 includes at least one module locking portion 893. The locking accessory 921 locks and fixes the module locking portion 893 to the housing locking portion 922 along the first direction Z.

[0083] Figure 2A To show an exploded view of a partial structure of the power converter according to the first embodiment of the present invention. Figure 2B To show an assembled view of a partial structure of the power converter according to the first embodiment of the present invention. Referring to FIGS. 2A and 2B, in one embodiment, the power converter C includes a first circuit board 1. The first circuit board 1 includes a first circuit board body 19 and a first heat source 11. The first heat source 11 is provided on the first circuit board body 19, and the first heat source 11 is thermally connected to the internal flow channel 8i of the heat dissipation module 801.

[0084] Referring to FIGS. 2A and 2B, in one embodiment, the power converter C further includes a second circuit board 2. The second circuit board 2 includes a second circuit board body 29 and a second heat source 21. The second heat source 21 is provided on the second circuit board body 29, and the second heat source 21 is connected to the internal flow channel of the heat dissipation module 801. Wherein, the first circuit board 1 is connected to a first side 881 of the heat dissipation module 801, and the second circuit board 2 is connected to a second side 882 of the heat dissipation module 801. The first side 881 is opposite to the second side 882.

[0085] Figure 3A To show the detailed structure of the first circuit board and the heat dissipation module according to the embodiment of the present invention. Referring to Figure 3A , in one embodiment, the heat dissipation module 801 includes a module accommodation groove 871. The first heat source 11 is placed in the module accommodation groove 871 to be thermally connected to the heat dissipation module 801. In one embodiment, the first heat source 11 includes a transformer.

[0086] Referring to Figure 3A, in one embodiment, the first circuit board 1 further includes a capacitor 12. The capacitor 12 is connected to the first circuit board body 19. The heat dissipation module 801 includes an annular connection portion 872. The capacitor 12 is connected to the annular connection portion 872 to thermally connect to the heat dissipation module.

[0087] Referring to Figure 3A , in one embodiment, the first circuit board 1 further includes a transistor 13. The transistor 13 is connected to the first circuit board body 19. The heat dissipation module 801 includes a spring piece 873 and a retaining wall 874. The spring piece 873 pushes against the transistor 13, causing the transistor 13 to abut against the retaining wall 874, whereby the transistor 13 is thermally connected to the heat dissipation module 801.

[0088] Figure 3B 、 Figure 3C To show the detailed structure of the third circuit board and the heat dissipation module of the embodiments of the present invention. With reference to Figure 3B 、 Figure 3C , in one embodiment, the power converter further includes a third circuit board 3. The third circuit board 3 includes a third circuit board body 39 and a third heat source 31. The third circuit board body 39 includes a circuit board opening 391. The heat dissipation module 801 includes a module boss 875. The module boss 875 passes through the circuit board opening 391 to connect to the third heat source 31, whereby the third heat source 31 is thermally connected to the heat dissipation module 801. In one embodiment, the third heat source 31 includes an inductor.

[0089] Figure 4A 、 Figure 4B To show the detailed structure of the second circuit board and the heat dissipation module of the embodiments of the present invention. In one embodiment, the heat dissipation module 801 further includes a module bump 876. The second heat source 21 is connected to the module bump 876, whereby the second heat source 21 is thermally connected to the heat dissipation module 801. The second heat source 21 is located between the second circuit board body 29 and the heat dissipation module 801.

[0090] Refer again to Figure 1B , in one embodiment, the working fluid W enters the internal flow channel 8i through the first housing port 911 and the first internal flow channel port 891. During the flow process in the internal flow channel 8i, the working fluid W removes the heat generated by the aforementioned heat source from the heat dissipation module 801. The working fluid W then leaves the internal flow channel 8i through the second internal flow channel port 892 and leaves the power converter through the second housing port 912.

[0091] Figure 5A Exploded view showing the power converter of the second embodiment of the present invention. Figure 5B Combined view showing the heat dissipation module of the power converter of the second embodiment of the present invention.Figure 5C To show an exploded view of the heat dissipation module of the power converter according to the second embodiment of the present invention. With reference to FIGS. 5A, 5B, and 5C, in the second embodiment of the present invention, the heat dissipation module 802 includes a first module structure 81, a second module structure 82, and a third module structure 83. The second module structure 82 is stacked on the first module structure 81, the third module structure 83 is stacked on the first module structure 81, and the internal flow channel passes through the first module structure 81, the second module structure 82, and the third module structure 83.

[0092] With reference to FIGS. 5A, 5B, and 5C, in an embodiment, the height of the third module structure 83 relative to the first module structure 81 is lower than the height of the second module structure 82 relative to the first module structure 81.

[0093] With reference to FIGS. 5A, 5B, and 5C, in an embodiment, the heat dissipation module 802 includes a first connecting pipe 841, a second connecting pipe 842, and a third connecting pipe 843. The first housing port 911 is connected to the first module structure 81. The first connecting pipe 841 connects the first module structure 81 and the second module structure 82. The second connecting pipe 842 connects the second module structure 82 and the third module structure 83. The third connecting pipe 843 connects the third module structure 83 and the second housing port 912.

[0094] With reference to FIGS. 5A, 5B, and 5C, in an embodiment, the first module structure 81 includes a structure notch 811, and the third connecting pipe 843 passes through the structure notch 811.

[0095] With reference to Figure 5A 、 Figure 5B and Figure 5C , in an embodiment, the power converter further includes a fourth circuit board 41 and a fifth circuit board 42. The first circuit board 1 is thermally connected to the first module structure 81. The fourth circuit board 41 is thermally connected to the second module structure 82. The fifth circuit board 42 is thermally connected to the third module structure 83.

[0096] With reference to Figure 5A 、 Figure 5B and Figure 5C , in an embodiment, the working fluid (not shown) flows from the first module structure 81, through the first connecting pipe 841, into the second module structure 82, then through the second connecting pipe 842, into the third module structure 83, and finally leaves the heat dissipation module 802 via the third connecting pipe 843. During the flow of the working fluid, the working fluid removes the heat generated by the aforementioned heat source from the heat dissipation module 802.

[0097] When applying the power converter according to the embodiment of the present invention, since the housing and the heat dissipation module are separately manufactured, the heat dissipation module can be first combined with the first circuit board and then assembled into the housing. Since more detailed assembly steps can be operated, the heat dissipation space on the heat dissipation module can be fully utilized, and it can be checked whether the first circuit board is fully combined with the heat dissipation module after assembly. Therefore, the production efficiency can be improved and the product yield can be improved.

[0098] When applying the power converter according to the embodiment of the present invention, since the housing and the heat dissipation module are separately manufactured, the heat dissipation module can be first combined with the first circuit board and then assembled into the housing. Since more detailed assembly steps can be operated, the heat dissipation space on the heat dissipation module can be fully utilized, and it can be checked whether the first circuit board is fully combined with the heat dissipation module after assembly. Therefore, the production efficiency can be improved and the product yield can be improved. In the embodiment of the present invention, only the circuit board and the heat dissipation module need to be welded together. Not only is the volume small but the proportion of the metal structure is small. Therefore, compared with the prior art, the welding equipment and the production line can easily accommodate the circuit board and the heat dissipation module, and the space utilization rate and the welding efficiency of the welding equipment can both be improved. In addition, the situation of solder joint rupture can also be effectively improved. It is also relatively convenient to inspect the welding quality of the solder joints and the detection and debugging of the hardware circuit.

[0099] In addition, in another embodiment, the heat dissipation module includes a plurality of module structures, and these module structures form a three-dimensional water channel design, and the heat dissipation area thereof can thus be greatly increased. In one embodiment, the housing can even be made of engineering plastic to save weight.

[0100] Although the present invention has been disclosed above with specific preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can still make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to that defined by the appended patent application scope.

Claims

1. A power converter, characterized in that, Comprising: A housing, which forms an accommodation space. Among them, the housing includes a first housing port and a second housing port; A heat dissipation module, which is detachably connected to the housing and disposed in the accommodation space. Among them, the heat dissipation module includes an internal flow channel, the internal flow channel communicates with the first housing port and the second housing port, a working fluid enters the internal flow channel through the first housing port and leaves the internal flow channel through the second housing port; A first circuit board, which includes a first circuit board body and a first heat source, the first heat source is disposed on the first circuit board body, and the first heat source is thermally connected to the internal flow channel of the heat dissipation module; A second circuit board, the second circuit board includes a second circuit board body and a second heat source, the second heat source is disposed on the second circuit board body, the second heat source is thermally connected to the internal flow channel of the heat dissipation module. Among them, the first circuit board is connected to a first side of the heat dissipation module, the second circuit board is connected to a second side of the heat dissipation module, the first side is opposite to the second side, and A third circuit board, the third circuit board includes a third circuit board body and a third heat source, the third circuit board body includes a circuit board opening, the heat dissipation module includes a module boss, and the module boss passes through the circuit board opening to connect the third heat source.

2. The power converter according to claim 1, wherein The heat dissipation module includes a first internal flow channel port and a second internal flow channel port, the first internal flow channel port is correspondingly connected to the first housing port, the second internal flow channel port is correspondingly connected to the second housing port, the heat dissipation module is placed into the housing along a first direction, the first internal flow channel port is connected to the first housing port along the first direction, and the second internal flow channel port is connected to the second housing port along the first direction.

3. The power converter as claimed in claim 2, further comprising a locking accessory, wherein, The housing includes at least one housing locking portion, the heat dissipation module includes at least one module locking portion, and the locking member locks and fixes the module locking portion to the housing locking portion along the first direction.

4. The power converter according to claim 1, wherein, The heat dissipation module includes a module accommodation groove, and the first heat source is placed into the module accommodation groove to be thermally connected to the heat dissipation module.

5. The power converter according to claim 1, wherein, The first heat source includes a transformer.

6. The power converter according to claim 1, wherein, The first circuit board further includes a capacitor, the capacitor is connected to the first circuit board body, the heat dissipation module includes an annular connection portion, and the capacitor is connected to the annular connection portion to be thermally connected to the heat dissipation module.

7. The power converter according to claim 1, wherein, The first circuit board further includes a transistor, the transistor is connected to the first circuit board body, the heat dissipation module includes a spring piece and a retaining wall, the spring piece pushes against the transistor to make the transistor abut against the retaining wall, whereby the transistor is thermally connected to the heat dissipation module.

8. The power converter according to claim 1, wherein, The third heat source includes an inductor.

9. The power converter according to claim 1, wherein, The heat dissipation module further includes a module bump, the second heat source is connected to the module bump, whereby the second heat source is thermally connected to the heat dissipation module, and the second heat source is located between the second circuit board body and the heat dissipation module.

10. An electric vehicle, characterized in that, Comprising: A cooling system, wherein a working fluid circulates in the cooling system to transfer and receive heat; and A power converter, comprising: A housing, which forms an accommodation space. Among them, the housing includes a first housing port and a second housing port; A heat dissipation module is detachably connected to the housing and disposed in the accommodating space. Wherein, the heat dissipation module includes an internal flow channel that communicates with the first housing port and the second housing port, and the working fluid enters the internal flow channel through the first housing port and leaves the internal flow channel through the second housing port; A first circuit board includes a first circuit board body and a first heat source. The first heat source is disposed on the first circuit board body, and the first heat source is thermally connected to the internal flow channel of the heat dissipation module. A second circuit board includes a second circuit board body and a second heat source. The second heat source is disposed on the second circuit board body, and the second heat source is thermally connected to the internal flow channel of the heat dissipation module. Wherein, the first circuit board is connected to a first side of the heat dissipation module, the second circuit board is connected to a second side of the heat dissipation module, and the first side is opposite to the second side, and A third circuit board includes a third circuit board body and a third heat source. The third circuit board body includes a circuit board opening, and the heat dissipation module includes a module convex seat that passes through the circuit board opening and is connected to the third heat source.

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