Gas operated head and wafer chucking device

Abstract

The application relates to the technical field of semiconductor devices, and discloses a gas operating head and a wafer adsorption device. The gas operating head comprises an operating head main body, an operating head base, a sealing cover plate and a light emitting piece. The operating head main body is internally hollow; an operating working surface protruding from the outer wall of the operating head main body is arranged on the outer wall of the operating head main body; at least one gas port communicating with the main body cavity is arranged on the operating working surface; a base cavity is arranged in the operating head base; a cavity opening is arranged on one end surface of the operating head base; the cavity opening communicates with the base cavity; the base cavity communicates with the main body cavity; the sealing cover plate is detachably sealed and fixed on the cavity opening; and the light emitting piece is used for irradiating the gas port. According to the light emitted by the light emitting piece penetrating the gas port, whether the gas port is blocked or not is judged, the wafer adsorption condition of the gas operating head is known, and the wafer adsorption efficiency is improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor equipment technology, and more particularly to a gas manipulation head and a wafer adsorption device. Background Technology

[0002] The wafer transfer process consists of steps including peeling, adsorption, and transfer. After the adhesive on the wafer is peeled off from the bonding film, a vacuum adsorption device is used to pick up the wafer, and then the wafer is transferred.

[0003] Existing vacuum adsorption devices typically employ negative pressure adsorption. However, the gas operating head in these devices also draws in some adhesive residue from the bonding film while adsorbing wafers. After multiple wafers are adsorbed, the adsorption pores on the gas operating head easily become clogged with adhesive, resulting in poor wafer adsorption. Furthermore, because the diameter of the adsorption pores is small, the blockage is not visible to the naked eye. Additionally, when adsorbing multiple wafers at once, it is difficult to determine whether each pore has adsorbed a wafer, leading to low wafer transfer efficiency. Summary of the Invention

[0004] To address the technical problems of difficulty in detecting and judging the adsorption status of clogged adsorption pores, this invention provides a gas manipulation head and a wafer adsorption device.

[0005] In a first aspect, the present invention provides a gas operating head, comprising:

[0006] The operating head body is a hollow main cavity; the outer wall of the operating head body is provided with an operating working surface protruding from the outer wall of the operating head body, and at least one air port communicating with the main cavity is provided on the operating working surface;

[0007] An operating head base is provided with a base cavity inside the operating head base, and a cavity opening is provided on one end face of the operating head base; the cavity opening is connected to the base cavity, and the base cavity is connected to the main body cavity;

[0008] A sealing cover plate, wherein the sealing cover plate is detachably and sealingly fixed to the cavity opening;

[0009] A light-emitting element for illuminating the air inlet.

[0010] Optionally, the sealing cover includes a transparent sealing cover.

[0011] Optionally, the light transmittance of the sealing cover is between 80% and 100%.

[0012] Optionally, the light-emitting element is disposed on the side of the sealing cover away from the operating head base.

[0013] Optionally, the light-emitting element is disposed on the periphery of the operating head body, or the light-emitting element is disposed on the operating surface.

[0014] Optionally, the light-emitting element is disposed on the side of the sealing cover near the operating head base.

[0015] Optionally, the light-emitting element includes a red light-emitting element.

[0016] Optionally, the shape of the air inlet includes one or more of the following: circular, rectangular, or trapezoidal.

[0017] Secondly, the present invention provides a wafer adsorption device, comprising: a light detection element and the aforementioned gas operating head, wherein the light detection element is used to detect light transmitted through the gas port in the gas operating head.

[0018] Optionally, the light detection device includes a CCD camera.

[0019] The technical solutions provided in the embodiments of the present invention have the following advantages compared with the prior art:

[0020] This invention provides a gas manipulation head and a wafer inspection device. The gas manipulation head includes a main body, a base, a sealing cover, and a light-emitting element. The main body is a hollow cavity. An operating surface protruding from the outer wall of the main body is provided, and at least one gas port communicating with the cavity is provided on the operating surface. The base has a cavity inside, and an opening is provided on one end face of the base. The opening communicates with the base cavity, and the base cavity communicates with the main body cavity. The sealing cover is detachably and securely fixed to the opening. The light-emitting element is used to illuminate the gas port. Using the gas manipulation head provided by this invention, the blockage of the gas port can be determined by observing the penetration of light emitted from the light-emitting element through it, and the wafer adsorption status of the gas manipulation head can be assessed, thereby improving the wafer adsorption efficiency. Attached Figure Description

[0021] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0022] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, those skilled in the art can obtain other drawings based on these drawings without creative effort.

[0023] In the attached image:

[0024] Figure 1 This is a schematic diagram of the structure of the gas operating head provided in an embodiment of the present invention;

[0025] Figure 2 This is an exploded view of the gas operating head provided in an embodiment of the present invention;

[0026] Figure 3 This is a schematic diagram of the structure of the operating head body and the operating head base provided in an embodiment of the present invention;

[0027] Figure 4 This is a schematic diagram of the structure of the gas operating head provided in an embodiment of the present invention;

[0028] Figure 5 yes Figure 4 A magnified view of a portion of point A in the middle. Attached image description:

[0030] 100. Gas operating head; 110. Operating head body; 120. Operating head base; 130. Sealing cover; 140. Light-emitting element;

[0031] 111. Operating surface; 112. Air inlet; 131. Cover plate through hole;

[0032] 121. Base cavity; 122. Cavity opening. Detailed Implementation

[0033] To provide a clearer understanding of the technical features, objectives, and effects of this invention, specific embodiments are now described in detail with reference to the accompanying drawings. In the following description, it should be understood that the orientations or positional relationships indicated by terms such as "front," "rear," "upper," "lower," "left," "right," "longitudinal," "horizontal," "vertical," "horizontal," "top," "bottom," "inner," "outer," "head," and "tail" are based on the orientations or positional relationships shown in the accompanying drawings, and are constructed and operated in a specific orientation. They are only for the convenience of describing this technical solution and do not indicate that the device or element referred to must have a specific orientation; therefore, they should not be construed as limitations on this invention.

[0034] It should also be noted that, unless otherwise explicitly specified and limited, terms such as "installation," "connection," "linking," "fixing," and "setting" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. When an component is referred to as being "on" or "below" another component, the component can be located "directly" or "indirectly" on the other component, or there may be one or more intermediary components. The terms "first," "second," "third," etc., are only for the convenience of describing this technical solution and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, features defined with "first," "second," "third," etc., may explicitly or implicitly include one or more of that feature. For those skilled in the art, the specific meaning of the above terms in this invention can be understood according to the specific circumstances.

[0035] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of the invention. However, those skilled in the art will understand that the invention can be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods are omitted so as not to obscure the description of the invention with unnecessary detail.

[0036] refer to Figures 1 to 5 The gas operating head 100 provided in this embodiment of the invention includes an operating head body 110, an operating head base 120, a sealing cover plate 130, and a light-emitting element 140.

[0037] The operating head body 110 is a hollow main cavity. An operating working surface 111 protruding from the outer wall of the operating head body 110 is provided, and at least one air port 112 communicating with the main cavity is provided on the operating working surface 111. A base cavity 121 is provided inside the operating head base 120, and a cavity opening 122 is provided on one end face of the operating head base 120. The cavity opening 122 communicates with the base cavity 121, and the base cavity 121 communicates with the main cavity. A sealing cover plate 130 is detachably and securely fixed to the cavity opening 122. A light-emitting element 140 is used to illuminate the air port 112. Using the gas operating head 100 provided in this embodiment of the invention, the presence or absence of blockage in the air port 112 can be determined based on the penetration of light emitted by the light-emitting element 140 into the gas port 112. Furthermore, the adsorption of wafers by the gas operating head 100 can be assessed, thereby improving the wafer adsorption efficiency.

[0038] There are multiple air ports 112. In this way, by using the light emitted by the light-emitting element 140 to pass through the air ports 112, it is possible to detect whether the air ports 112 are blocked, and also to understand the adsorption status of the air ports 112, thereby improving the adsorption efficiency of the gas operating head 100.

[0039] Specifically, to check if the gas port 112 is blocked, you can check whether light is emitted from the gas port 112 without the gas operating head 100 performing adsorption. When light is detected emanating from the gas port 112, it means that the gas port 112 is not blocked. When no light is detected emanating from the gas port 112, it means that the gas port 112 is blocked and needs to be addressed.

[0040] Specifically, to detect whether the gas port 112 has attracted a wafer, one can check whether light is emitted from the gas port 112 while the gas operating head 100 is attracting the wafer. When light is detected emanating from the gas port 112, it means that the gas port 112 has not attracted a wafer; when no light is detected emanating from the gas port 112, it means that the gas port 112 has attracted a wafer.

[0041] The operating surface 111 serves as the working surface that contacts the wafer. Considering that the wafer is located on the same plane during the placement, the operating surface 111 can be set as a plane in this embodiment of the invention.

[0042] The operating head base 120 is fixed relative to the operating head body 110, and the position of the operating head base 120 is opposite to the position of the operating working surface 111. Here, "opposite position" means that the two sides on the operating head body 110 are located opposite each other, with the operating working surface 111 located above the operating head body 110 and the operating head base 120 located below the operating head body 110.

[0043] The operation head base 120 and the operation working surface 111 are positioned on two opposite sides of the operation head body 110. The purpose of this is to make the operation working surface 111 protrude to avoid interference caused by accidental contact between the operation head base 120 and the wafer when the operation working surface 111 contacts the wafer.

[0044] The sealing cover 130 includes a transparent sealing cover 130. When light emitted from the light-emitting element 140 illuminates the sealing cover 130, the light emitted from the light-emitting element 140 can penetrate the sealing cover 130 and pass through the air port 112. Therefore, the blockage or adsorption status of the air port 112 can be determined by observing the light passing through it.

[0045] The light transmittance of the sealing cover 130 is between 80% and 100%. The sealing cover 130 can be made of materials such as transparent glass or transparent plastic. The higher the light transmittance of the sealing cover 130, the higher the light intensity emitted by the light-emitting element 140 through the air port 112, which facilitates the detection of the light transmitted from the air port 112.

[0046] When the light transmittance of the sealing cover 130 is less than 80%, the light-emitting element 140 is located on the side of the sealing cover 130 away from the operating head base 120. In this case, the light emitted by the light-emitting element 140 is difficult to penetrate the sealing cover 130 and be emitted from the air port 112. It is difficult to detect whether the air port 112 is blocked or whether the air port 112 has attracted a chip by light.

[0047] In one specific embodiment, the light transmittance of the sealing cover 130 is between 90% and 100%, so that the light emitted by the light-emitting element 140 can more easily penetrate the sealing cover 130 and then be emitted from the air port 112.

[0048] In one specific embodiment, the light transmittance of the sealing cover 130 is between 95% and 100%. When the light transmittance of the sealing cover 130 is greater than 95%, the light emitted by the light-emitting element 140 shines on the sealing cover 130 more easily and shines on the air vent 112. The higher the light transmittance of the sealing cover 130, the easier it is for light to pass through the sealing cover 130.

[0049] The light-emitting element 140 is located on the side of the sealing cover 130 away from the operating head base 120. Since the sealing cover 130 includes a transparent sealing cover 130, the light emitted by the light-emitting element 140 can penetrate the sealing cover 130 and then be emitted from the air port 112. Positioning the light-emitting element 140 on the side of the sealing cover 130 away from the operating head base 120 facilitates replacement of the light-emitting element 140.

[0050] The light-emitting element 140 is disposed on the side of the sealing cover plate 130 near the operating head base 120. The sealing cover plate 130 is provided with a groove on the side near the operating head base 120, and the light-emitting element 140 can be accommodated in the groove, which is connected to the base cavity 121.

[0051] In one specific embodiment, the sealing cover 130 is a transparent sealing cover, and there are two light-emitting elements 140. One of the light-emitting elements 140 is located on the side of the sealing cover 130 close to the operating head base 120, and the other light-emitting element 140 is located on the side of the sealing cover 130 away from the operating head base 120.

[0052] The light-emitting element 140 is disposed on the periphery of the operating head body 110. The light emitted by the light-emitting element 140 illuminates the air port 112, and the adsorption status of the air port 112 can be detected by whether light is transmitted through the air port 112. Furthermore, the light-emitting element 140 is disposed on the operating head body 110, which facilitates the replacement of the light-emitting element 140.

[0053] Specifically, the light-emitting element 140 is disposed on the operating working surface 111 of the operating head body 110, so that the light emitted by the light-emitting element 140 can more easily illuminate the air port 112.

[0054] refer to Figure 2 The sealing cover plate 130 is detachably and sealed to the cavity opening 122. At least one cover plate through hole 131 is provided on the sealing cover plate 130, which penetrates the sealing cover plate 130 and communicates with the base cavity 121.

[0055] The function of the cover plate through hole 131 is to allow air to be blown or sucked into the base cavity 121 after the sealing cover plate 130 seals the cavity opening 122, so that the operating surface 111 can be adsorbed or blown off by the airflow.

[0056] The gas manipulation head 100 provided in this embodiment of the invention connects the base cavity 121 and the main body cavity through the cover plate through hole 131, and further connects to the air port 112 of the manipulation head body 110. When using the gas manipulation head 100 provided in this embodiment of the invention, the gas pressure inside the base cavity 121 and the main body cavity can be controlled through the cover plate through hole 131, and operations such as wafer adsorption or blowing can be performed through at least one air port 112 on the operation working surface 111.

[0057] When the air inlet 112 is aligned with the wafer, if a negative pressure is applied to the cover plate through hole 131, the wafer can be adsorbed through the air inlet 112. If a positive pressure is applied to the cover plate through hole 131, the wafer can be blown open through the air inlet 112, causing the wafer to leave the air inlet 112 and then leave the operating head body 110, thus providing a basis for batch wafer operation.

[0058] In one specific embodiment, the light-emitting element 140 can be distributed in a strip shape, which means that the light-emitting element 140 is distributed in a long strip shape and continuously on the sealing cover plate 130. When the light-emitting element 140 is distributed in a strip shape, the outer contour of the light-emitting element 140 can be straight or S-shaped.

[0059] refer to Figure 1In one specific embodiment, the light-emitting elements 140 can also be distributed in a dotted pattern, meaning that the light-emitting elements 140 are spaced apart on the sealing cover plate 130. The light-emitting elements 140 can be arranged in a straight line and spaced apart. Of course, there can be multiple light-emitting elements 140, with one light-emitting element 140 distributed in a strip and another light-emitting element 140 distributed in a dotted pattern.

[0060] The light-emitting element 140 includes an LED light. LED lights have low energy consumption and a long lifespan. Of course, the light-emitting element 140 can also use other light fixtures, such as incandescent bulbs.

[0061] The light-emitting element 140 includes a red light-emitting element. The red light-emitting element emits red light with a wavelength between 625 nm and 740 nm. The longer the wavelength of the red light emitted by the red light-emitting element, the less diffraction occurs, thus improving the accuracy of detecting the light emitted from the gas port 112. Specifically, since the distance between adjacent gas ports 112 is relatively small, reaching the micrometer level, and light exhibits wave-particle duality, both diffraction and interference can occur. The longer the wavelength, the less likely diffraction will occur. Therefore, using a red light-emitting element in the light-emitting element 140 makes it less prone to diffraction when the light emitted by the light-emitting element 140 exits from the gas port 112, allowing the light emitted by the light-emitting element 140 to form clear light spots after penetrating the gas port 122, facilitating the detection of these light spots.

[0062] refer to Figure 4 and Figure 5 The shape of the air inlet 112 includes one or more of the following: circular, rectangular, or trapezoidal. Various shapes of the air inlet 112 can be configured to match different wafers. The size of the air inlet 112 can also be adjusted according to the size of the wafer, making it easier for the air inlet 112 to attract and hold the wafer.

[0063] The width of the operating surface 111 is between 0.05 μm and 0.9 μm. The air inlet 112 is circular in shape, and its diameter is between 0.03 μm and 0.04 μm. In one specific embodiment, the diameter of the air inlet 112 is 0.04 μm.

[0064] The operating head body 110 and the operating head base 120 can be integrally formed, which can extend the service life of the operating head body 110. Furthermore, during the wafer adsorption process using the operating head body 110, the operating head body 110 can stably adsorb the wafer, improving the wafer adsorption efficiency. When the operating head body 110 and the operating head base 120 are integrally formed, the body cavity and the base cavity 121 do not need to be distinguished and can be considered as a single cavity.

[0065] In one specific embodiment, the operating head body 110 and the operating head base 120 can also be connected by a fixed connection method such as welding or riveting.

[0066] The material of the operating head body 110 can be metal, such as steel or alloy, or non-metallic material, including organic and inorganic materials. Inorganic materials can include glass or ceramics.

[0067] Secondly, the present invention provides a wafer adsorption device, comprising: a light detection element and a gas operating head 100, wherein the light detection element is used to detect light transmitted through the gas port 112 in the gas operating head 100. When the gas operating head 100 is performing adsorption operations or detecting blockages, the light detection element can assist in detecting the adsorption and blockage status of the gas operating head 100.

[0068] In one specific embodiment, a light-emitting detection element is disposed near the air port 112 to detect light emitted from the air port 112. This allows for more accurate detection of light emitted from the air port 112, improving the efficiency of wafer transfer.

[0069] The light-emitting detection device includes a CCD camera. The CCD camera captures the light emitted from the air vent 112 to detect whether light is being emitted from the air vent 112, thereby determining whether the air vent 112 is blocked and whether the chip is being attracted. CCD stands for Charge-Coupled Device, a semiconductor device that can convert optical images into digital signals with high accuracy.

[0070] The light-emitting detection element can be located on the side of the sealing cover 130 in the gas operating head 100 away from the gas port 112. The sealing cover 130 is a transparent sealing cover, so that the light emitted by the light-emitting element 140 can pass through the gas port 112, and the light-emitting detection element can detect the light transmitted through the transparent sealing cover.

[0071] In one specific embodiment, the light-emitting detection element can also be located on the side of the gas port 112 in the gas operating head 100 away from the sealing cover plate 130. In this way, the light emitted by the light-emitting element 140 can pass through the gas port 112 and be detected by the light-emitting detection element.

[0072] It is understood that the above embodiments only illustrate preferred embodiments of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can freely combine the above technical features without departing from the concept of the present invention, and can also make several modifications and improvements, all of which fall within the protection scope of the present invention. Therefore, all equivalent transformations and modifications made with respect to the scope of the claims of the present invention should fall within the scope of the claims of the present invention.

Claims

1. A gas operating head, characterized in that, include: The operating head body is a hollow main cavity; the outer wall of the operating head body is provided with an operating working surface protruding from the outer wall of the operating head body, and at least one air port communicating with the main cavity is provided on the operating working surface; An operating head base is provided, wherein a base cavity is provided inside the operating head base, and a cavity opening is provided on one end face of the operating head base; the cavity opening is connected to the base cavity, and the base cavity is connected to the main body cavity; the operating head base is relatively fixed to the operating head body, and the position of the operating head base is opposite to the position of the operating working surface; A sealing cover plate, wherein the sealing cover plate is detachably and sealingly fixed to the cavity opening; the sealing cover plate is provided with at least one cover plate through hole that penetrates the sealing cover plate and communicates with the base cavity; A light-emitting element for illuminating the air inlet; the light-emitting element is disposed on the periphery of the operating head body, or the light-emitting element is disposed on the operating surface; the light-emitting element includes a red light-emitting element; The sealing cover plate has a groove on the side near the operating head base, the light-emitting element is housed in the groove, and the groove communicates with the base cavity.

2. The gas operating head according to claim 1, characterized in that, The sealing cover includes a transparent sealing cover.

3. The gas operating head according to claim 2, characterized in that, The light transmittance of the sealing cover is between 80% and 100%.

4. The gas operating head according to claim 2, characterized in that, The light-emitting element is located on the side of the sealing cover away from the operating head base.

5. The gas operating head according to claim 1, characterized in that, The light-emitting element is disposed on the side of the sealing cover plate near the operating head base.

6. The gas operating head according to claim 1, characterized in that, The shape of the air inlet includes one or more of the following: circular, rectangular, or trapezoidal.

7. A wafer adsorption device, characterized in that, It includes a light detection element and a gas operating head as described in any one of claims 1 to 6, wherein the light detection element is used to detect light emitted from a gas port in the gas operating head.

8. The wafer adsorption device according to claim 7, characterized in that, The light detection device includes a CCD camera.

Images