A circuit board of a motor drive module

Abstract

The embodiment of the application discloses a circuit board of a motor driving module, comprising: a printed circuit board and a motor driving module; the printed circuit board comprises: a top layer and a bottom layer; the motor driving module comprises: a driving and protection circuit, a driving power supply, a switching power supply and a high-voltage capacitor; the driving and protection circuit, the driving power supply, the switching power supply and the high-voltage capacitor are located on the same printed circuit board; the driving and protection circuit, the driving power supply and the high-voltage capacitor can be arranged on the top layer; and the switching power supply can be arranged on the bottom layer. Through the embodiment scheme, the number of the circuit board and the connector used is reduced, and the failure problem of the connector is solved.

Description

TECHNICAL FIELD

[0001] The embodiment of the present application relates to PCB circuit board design technology, in particular to a circuit board of a motor drive module. BACKGROUND

[0002] With the increasing requirement of the power performance of electric vehicles, the torque density and power density of the power assembly, as one of the core components of the power output of the electric vehicles, also increase to realize the light weight and miniaturization. The motor controller, as the core component of the power assembly, is the key to the power output of the power assembly, and directly determines the power output of the power assembly and the power performance of the vehicle.

[0003] The 800V silicon carbide (SIC) module, as a high-voltage SIC module, is currently in an active development stage in the entire automotive industry, and is rarely applied to mass production vehicles. The DCM1000X high-voltage silicon carbide (SIC) module is also in the early verification stage of batch commercial use. The application, circuit design and PCB (printed circuit board) layout in the use process of the module are also at the forefront of the industry, and there is no reference circuit layout design.

[0004] In the circuit layout design of the previous single silicon carbide (SIC) module, due to the structure and PCB layout space design, the single silicon carbide (SIC) module is mostly assembled in combination with one module and one drive board; the main and passive discharge resistors are mostly independent PCB circuit boards or directly assembled into an aluminum shell; the PCB layout design of the high-voltage sampling, switching power supply and other circuits is on independent circuits; and the above-mentioned circuit boards are interconnected by using various connectors, resulting in a large number of types and quantities of connectors used in the entire motor controller. At least the following problems exist in this case:

[0005] 1. Increased cost: the use and verification of connectors and wiring harnesses increase the cost of the controller.

[0006] 2. Reliability decreases: each use of a connector increases the failure node of the hardware system by one; because the connector joints are susceptible to the influence of the use environment during long-term use, causing signal interruption, open circuit, short circuit, poor contact and other adverse factors. SUMMARY

[0007] The embodiment of the present application provides a circuit board of a motor drive module, which can reduce the number of circuit boards and connectors used and solve the problem of connector failure.

[0008] The embodiment of the present application provides a circuit board of a motor driving module, the circuit board comprises: a printed circuit board and the motor driving module; the printed circuit board comprises: a top layer and a bottom layer; the motor driving module can comprise: a driving and protection circuit, a driving power supply, a switching power supply and a high-voltage capacitor; the driving and protection circuit, the driving power supply, the switching power supply and the high-voltage capacitor are located on the same printed circuit board;

[0009] The driving and protection circuit, the driving power supply and the high-voltage capacitor can be arranged on the top layer.

[0010] The switching power supply can be arranged on the bottom layer.

[0011] In the exemplary embodiment of the present application, the top layer can comprise a first area and a second area;

[0012] The high-voltage capacitor is arranged in the first area;

[0013] The driving and protection circuit, the driving power supply and the switching power supply are arranged in the second area.

[0014] The second area can comprise: a first upper area, a first middle area and a first lower area.

[0015] The driving and protection circuit can be arranged in the first middle area and the first lower area.

[0016] The driving power supply can be arranged in the first middle area and the first upper area.

[0017] In the exemplary embodiment of the present application, the driving and protection circuit comprises a driving transformer.

[0018] The driving transformer can be uniformly distributed in the first middle area.

[0019] In the exemplary embodiment of the present application, the driving power supply can be symmetrically distributed according to the symmetric axis of the middle line of the driving transformer which is uniformly distributed in the transverse direction.

[0020] In the exemplary embodiment of the present application, the motor driving module can further comprise: an active discharge resistor.

[0021] The active discharge resistor and the driving and protection circuit are arranged on the same printed circuit board, the active discharge resistor is arranged in the first upper area of the top layer and located on the first side of the driving and protection circuit, or,

[0022] The active discharge resistor is directly mounted in the case; or,

[0023] The active discharge resistor is arranged on another printed circuit board.

[0024] In the exemplary embodiments of the present application, the bottom layer can include a third region and a fourth region; the third region corresponds to the first region, and the fourth region corresponds to the second region.

[0025] The fourth region can include a second upper region, a second middle region and a second lower region; the second upper region corresponds to the first upper region, the second middle region corresponds to the first middle region, and the second lower region corresponds to the first lower region.

[0026] The switching power supply can be located on the second side of the driving and protection circuit and distributed in the second upper region, the second middle region and the second lower region.

[0027] In the exemplary embodiments of the present application, the motor driving module can further include a passive discharge resistor.

[0028] The passive discharge resistor is arranged on the same printed circuit board as the driving and protection circuit, and the passive discharge resistor is arranged in the second upper region; or,

[0029] The passive discharge resistor is directly mounted inside the case; or,

[0030] The passive discharge resistor is arranged on another printed circuit board.

[0031] In the exemplary embodiments of the present application, the positive and negative pins of the high-voltage capacitor are extended, and the high-voltage capacitor body is directly soldered on the printed circuit board in a lead-free soldering manner.

[0032] In the exemplary embodiments of the present application, the printed circuit board can further include a ground layer and a power supply layer.

[0033] The printed circuit board is stacked in the order of the top layer, the ground layer, the power supply layer and the bottom layer.

[0034] The top layer is a device placement layer and draws part of the signal transmission lines.

[0035] The ground layer is a reference return layer for signals.

[0036] The power supply layer is a power supply layer and a signal transmission line.

[0037] The bottom layer is a device placement layer and draws part of the signal transmission lines.

[0038] In the exemplary embodiments of the present application, the printed circuit board of the circuit board adopts FR4 material, or a combination of phenolic cloth tube PFC material and FR4 material.

[0039] Compared with the related art, the circuit board of the embodiments of the present application comprises: a printed circuit board and the motor drive module; the printed circuit board comprises: a top layer and a bottom layer; the motor drive module can comprise: a drive and protection circuit, a drive power supply, a switching power supply and a high-voltage capacitor; the drive and protection circuit, the drive power supply, the switching power supply and the high-voltage capacitor are located on the same printed circuit board; the drive and protection circuit, the drive power supply and the high-voltage capacitor can be arranged on the top layer; the switching power supply can be arranged on the bottom layer. Through the embodiment scheme, the number of circuit boards and connectors used is reduced, and the problem of connector failure is solved.

[0040] Other features and advantages of the present application will be set forth in the following description, and in part will become apparent from the description, or can be learned by practice of the present application. Other advantages of the present application can be realized and obtained by the schemes described in the specification and drawings. BRIEF DESCRIPTION OF DRAWINGS

[0041] The accompanying drawings are used to provide an understanding of the technical schemes of the present application, and constitute a part of the specification, and are used together with the embodiments of the present application to explain the technical schemes of the present application, and do not constitute a limitation on the technical schemes of the present application.

[0042] Figure 1 The circuit board of the motor drive module of the embodiments of the present application is a block diagram;

[0043] Figure 2 The top layer layout schematic diagram of the embodiments of the present application is shown in the figure;

[0044] Figure 3 The bottom layer layout schematic diagram of the embodiments of the present application is shown in the figure;

[0045] Figure 4 The top layer printed circuit board schematic diagram of the embodiments of the present application is shown in the figure;

[0046] Figure 5 The bottom layer printed circuit board schematic diagram of the embodiments of the present application is shown in the figure;

[0047] Figure 6 The power layer printed circuit board schematic diagram of the embodiments of the present application is shown in the figure;

[0048] Figure 7 The ground layer printed circuit board schematic diagram of the embodiments of the present application is shown in the figure. DETAILED DESCRIPTION

[0049] The present application describes a number of embodiments, but the description is exemplary rather than limiting and it will be apparent to those of ordinary skill in the art that numerous more embodiments and implementations are possible within the scope of the embodiments described in the present application. Although a number of possible combinations of features have been set forth in the attached drawings and discussed above, many other combinations are possible. Unless specifically intended otherwise, any feature or element of any embodiment can be utilized in any other embodiment, whether or not that particular combination is specifically set forth in the claims. Furthermore, many of the features and elements described herein can be combined with either other in any combination, as would be understood by one of ordinary skill in the art.

[0050] The present application includes and contemplates combinations of features and elements known to those of ordinary skill in the art. The embodiments, features and elements disclosed herein can also be combined with any conventional features or elements to form unique inventive solutions that are within the scope of the claims. Any feature or element of any embodiment can also be combined with features or elements from other inventive solutions to form another unique inventive solution that is within the scope of the claims. Thus, it will be understood that any of the features shown and / or discussed in the present application can be implemented alone or in any combination. Accordingly, the embodiments are not to be restricted, except as by the appended claims and their equivalents. Furthermore, various modifications and changes can be made within the scope of the claims.

[0051] Furthermore, in describing representative embodiments, the specification can have presented the method and / or process as a particular sequence of steps. However, to the extent that the method or process depends on more than one step, the method or process should not be limited to the particular sequence of steps described. Other sequences of steps can be possible, and are within the scope of the embodiments. Thus, man skilled in the art will appreciate that the specific order of the steps in the descriptions of the specification is not an inherent part of the embodiments. Furthermore, the claims should not be limited to the method and / or process steps, in the order described, unless such steps are necessarily dependent on the order, as would be understood by those skilled in the art.

[0052] The embodiments of the present application provide a circuit board 1 of a motor drive module, as shown in Figure 1 The circuit board includes: a printed circuit board and a motor drive module; the printed circuit board includes: a top layer and a bottom layer; the motor drive module can include: a drive and protection circuit 11, a drive power supply 12, a switching power supply 13, and a high-voltage capacitor 14; the drive and protection circuit 11, the drive power supply 12, the switching power supply 13, and the high-voltage capacitor 14 are located on the same printed circuit board;

[0053] The drive and protection circuit 11, the drive power supply 12, and the high-voltage capacitor 14 can be disposed on the top layer;

[0054] The switching power supply 13 can be set at the bottom layer.

[0055] In the exemplary embodiments of this application, the printed circuit board (PCB) layout of the silicon carbide (SiC) module driver circuit board (i.e., circuit board 1 of the motor drive module) integration scheme of this application embodiment abandons the traditional connection scheme between printed circuit boards via connectors, and instead integrates them directly into a single printed circuit board, reducing the number of connectors used in the entire machine, thereby greatly reducing the expenditure of equipment material costs. In mass production, previously, at least four circuit boards needed to be assembled during the overall machine assembly process, while the scheme of this application embodiment only requires one circuit board, greatly shortening the mass production time of the product. Compared with the previous connector interconnection method, it avoids connector failure caused by environmental corrosion, vibration, impact, etc. during equipment movement, thereby avoiding various states caused by signal loss.

[0056] In exemplary embodiments of this application, as Figure 2 , Figure 4 As shown, the top layer may include a first region A and a second region B;

[0057] High-voltage capacitor 14 can be located in the first region A;

[0058] The drive and protection circuit 11, the drive power supply 12, and the switching power supply 13 can be located in the second area B;

[0059] The second region B may include: a first upper region a1, a first middle region b1, and a first lower region c1;

[0060] The drive and protection circuit 11 can be disposed in the first intermediate region a1 and the first lower region c1;

[0061] The driving power supply 12 can be located in the first intermediate region b1 and the first upper region a1.

[0062] In an exemplary embodiment of this application, the high-voltage capacitor is located in the first region to be as close as possible to the switching power supply, which helps to reduce ripple effects; the drive and protection circuit 11, the drive power supply 12 and the switching power supply 13 are located in the second region B to effectively utilize the board space to electrically isolate the switching power supply from other circuits.

[0063] In an exemplary embodiment of this application, the drive and protection circuit 11 includes a drive transformer TDK;

[0064] The drive transformer TDK can be evenly distributed laterally in the first middle area, which can increase the aesthetics of the printed circuit board surface.

[0065] In an exemplary embodiment of this application, the drive power supply 12 can be symmetrically distributed according to the symmetry axis, with the center line of the horizontally uniformly distributed drive transformer TDK as the axis of symmetry.

[0066] In an exemplary embodiment of this application, the drive power supply 12 may be arranged in a symmetrical layout with the drive transformer as the Y-axis.

[0067] In the exemplary embodiments of this application, the proposed solution can prevent circuit signals from crossing and minimize signal loops, thus achieving the best EMC (electromagnetic compatibility) performance.

[0068] In an exemplary embodiment of this application, the motor drive module may further include: an active discharge resistor 15;

[0069] The active discharge resistor 15 and the drive and protection circuit 11 are disposed on the same printed circuit board. The active discharge resistor 15 is disposed in the first upper region a of the top layer and is located on the first side of the drive and protection circuit 11, or...

[0070] The active discharge resistor 15 is directly installed inside the chassis; or,

[0071] The active discharge resistor 15 is located on another PCB board.

[0072] In an exemplary embodiment of this application, the active discharge resistor 15 is disposed on a printed circuit board to facilitate final assembly and manufacturing, thereby reducing production costs.

[0073] In exemplary embodiments of this application, as Figure 3 , Figure 5 As shown, the bottom layer may include a third region C and a fourth region D; the third region C corresponds to the first region A, and the fourth region D corresponds to the second region B;

[0074] The fourth region D may include: a second upper region a2, a second middle region b2, and a second lower region c2; the second upper region a2 corresponds to the first upper region a1, the second middle region b2 corresponds to the first middle region b1, and the second lower region c2 corresponds to the first lower region c1.

[0075] The switching power supply 13 can be located on the second side of the drive and protection circuit 11, distributed in the second upper region a2, the second middle region b2, and the second lower region c2.

[0076] In the exemplary embodiments of this application, the proposed solution ensures the requirements of electrical and electromagnetic isolation, making the isolation strip clearly visible and reducing crosstalk and line coupling.

[0077] In an exemplary embodiment of this application, the motor drive module may further include: a passive discharge resistor 16;

[0078] The passive discharge resistor 16 is arranged on the same PCB board as the driving and protection circuit 11, and is arranged in the second upper region; or,

[0079] The passive discharge resistor 16 is directly mounted in the chassis; or,

[0080] The passive discharge resistor 16 is arranged on another printed circuit board.

[0081] In the example embodiment of the present application, the active discharge resistor 16 is arranged on the printed circuit board to facilitate the assembly manufacturing, and the production cost can be reduced.

[0082] In the example embodiment of the present application, when the active discharge resistor 15 and the passive discharge resistor 16 are arranged on another printed circuit board, the other printed circuit board can be connected through a connector.

[0083] In the example embodiment of the present application, the positive and negative pins of the high-voltage capacitor 14 are extended, and the body of the high-voltage capacitor 14 is directly welded on the printed circuit board in a lead-free welding manner.

[0084] In the example embodiment of the present application, this welding method is simple, reliable, and has the lowest cost, and avoids the loosening problem of screw mounting and wire harness mounting.

[0085] In the example embodiment of the present application, the lead-free welding process can be performed manually or by a welding machine during the whole machine assembly process.

[0086] In the example embodiment of the present application, the high-voltage capacitor and the circuit board can be installed through automatic lead-free welding.

[0087] In the example embodiment of the present application, the printed circuit board can further include a ground layer and a power supply layer;

[0088] The printed circuit board is stacked in the order of a top layer, a ground layer, a power supply layer, and a bottom layer;

[0089] The top layer is a device placement layer and draws part of the signal transmission line;

[0090] The ground layer is a reference return layer for signals;

[0091] The power supply layer is a power supply layer and a signal transmission line;

[0092] The bottom layer is a device placement layer and draws part of the signal transmission line.

[0093] In the example embodiment of the present application, the printed circuit board of the embodiment scheme of the present application can adopt a 4-layer structure, that is, a top layer (TOP layer), a ground layer (GND layer, such asFigure 7 a ground layer (GND layer, as shown), a power layer (POWER layer, as shown), and a bottom layer (BOTTOM layer), in the order of the top layer, the ground layer, the power layer, and the bottom layer. Figure 6

[0094] In the exemplary embodiments of the present application, such a stacking method can obtain better signal integrity, avoid voltage drop of the wiring, and greatly reduce the EMC over-standard problem caused by signal radiation conduction.

[0095] In the exemplary embodiments of the present application, the printed circuit board adopts FR4 material, or adopts PFC (phenolic cloth tube) material and FR4 material in combination.

[0096] In the exemplary embodiments of the present application, the PFC material and the FR4 material are low in cost, mature in manufacturing process, high in bending strength, good in shock resistance, and can achieve heat resistance of above 170℃.

[0097] In the exemplary embodiments of the present application, the printed circuit board integrated board scheme of the FR4 material can be used, or the soft and hard combination board scheme of the PFC+FR4 material can be used.

[0098] ​Those of ordinary skill in the art will realize and understand that all or some of the steps in the methods disclosed above and the functional modules / units in the systems and devices can be implemented as software, firmware, hardware, and appropriate combinations thereof. In hardware implementation, the division between the functional modules / units mentioned in the above description does not necessarily correspond to the division of physical components; for example, one physical component can have multiple functions, or one function or step can be performed by several physical components in cooperation. Some or all of the components can be implemented as software executed by a processor, such as a digital signal processor or a microprocessor, or as hardware, or as an integrated circuit, such as an application-specific integrated circuit. Such software can be distributed on computer-readable media, which can include computer storage media (or non-transitory media) and communication media (or transitory media). As is well known to those of ordinary skill in the art, the term computer storage media includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storage of information such as computer readable instructions, data structures, program modules or other data. Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disks (DVD) or other optical disk storage, magnetic cassettes, magnetic tapes, magnetic disk storage or other magnetic storage devices, or any other medium which can be used to store the desired information and which can be accessed by a computer. Furthermore, it is common and well understood by those of ordinary skill in the art that communication media typically embodies computer readable instructions, data structures, program modules or other data in a modulated data signal such as a carrier wave or other transport mechanism and can include any information delivery media.

Claims

1. A circuit board of a motor drive module, characterized by, The circuit board comprises: a printed circuit board and the motor drive module; The printed circuit board comprises: a top layer and a bottom layer; the motor drive module comprises: a drive and protection circuit, a drive power supply, a switching power supply and a high-voltage capacitor; the drive and protection circuit, the drive power supply, the switching power supply and the high-voltage capacitor are located on the same printed circuit board; The drive and protection circuit, the drive power supply and the high-voltage capacitor are all arranged on the top layer; The switching power supply is arranged on the bottom layer; The top layer comprises a first area and a second area; the drive and protection circuit and the drive power supply are arranged in the second area, and the second area comprises: a first intermediate area; The drive and protection circuit comprises a drive transformer; The drive transformer is uniformly distributed in the first intermediate area in the transverse direction; The drive power supply is symmetrically distributed according to the symmetric axis of the center line of the drive transformer uniformly distributed in the transverse direction.

2. The circuit board of the motor drive module according to claim 1, characterized in that, The high-voltage capacitor is arranged in the first area; The switching power supply is also arranged in the second area; The second area further comprises: a first upper area and a first lower area; The drive and protection circuit is arranged in the first intermediate area and the first lower area; The drive power supply is arranged in the first intermediate area and the first upper area.

3. The circuit board of the motor drive module of claim 2, wherein, The motor drive module further comprises: an active discharge resistor; The active discharge resistor and the drive and protection circuit are arranged on the same printed circuit board, the active discharge resistor is arranged in the first upper area of the top layer and located on the first side of the drive and protection circuit, or The active discharge resistor is directly installed in the case; or The active discharge resistor is arranged on another printed circuit board.

4. The circuit board of the motor drive module of claim 2, wherein, The bottom layer comprises a third area and a fourth area; the third area corresponds to the first area, and the fourth area corresponds to the second area; The fourth area comprises: a second upper area, a second intermediate area and a second lower area; the second upper area corresponds to the first upper area, the second intermediate area corresponds to the first intermediate area, and the second lower area corresponds to the first lower area; The switching power supply is located on the second side of the drive and protection circuit and is distributed in the second upper area, the second intermediate area and the second lower area.

5. The circuit board of the motor drive module of claim 4, wherein, The motor drive module further comprises: a passive discharge resistor; The passive discharge resistor and the drive and protection circuit are arranged on the same printed circuit board, and the passive discharge resistor is arranged in the second upper area; or The passive discharge resistor is directly installed in the case; or The passive discharge resistor is arranged on another printed circuit board.

6. The circuit board of the motor drive module according to any one of claims 1 to 5, wherein The positive and negative pins of the high-voltage capacitor are extended, and the high-voltage capacitor body is directly soldered on the printed circuit board in a lead-free soldering manner.

7. The circuit board of the motor drive module according to any one of claims 1 to 5, characterized in that, The printed circuit board further comprises: a ground layer and a power supply layer; The printed circuit board is stacked in the order of the top layer, the ground layer, the power supply layer and the bottom layer; The top layer is a device placement layer and part of the signal transmission line is drawn; The ground layer is a reference return layer of signals; The power supply layer is a power supply layer and a signal transmission line; The bottom layer is a device placement layer and draws part of the signal transmission line.

8. The circuit board of the motor drive module according to any one of claims 1 to 5, characterized in that, The printed circuit board of the circuit board adopts FR4 material, or a combination of phenolic cloth tube PFC material and FR4 material.

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