Lightweight array module based on DGS structure

Abstract

The present invention relates to the field of phased array radar transceiver components, and more specifically, to a lightweight array module based on a DGS structure. The module comprises a component housing, within which is disposed the DGS structure; a component module disposed on the DGS structure; and a cover plate disposed at an opening in the component housing. The present invention has the advantage of minimizing component weight while ensuring the electromechanical and thermal performance of the component, achieving a lightweight design with stable and reliable performance.

Description

Technical Field

[0001] The present invention relates to the field of phased array radar transceiver components, and in particular to a lightweight array module based on a DGS structure. Background Art

[0002] With the technological advancement of airborne phased array radars and ground-based high-mobility radars, phased array radar systems need to integrate multiple functions, including reconnaissance, jamming, detection, and communications. Their active arrays must integrate antennas, feed networks, transceiver components, liquid cooling, power supplies, and control circuits. Each functional module must achieve a low profile and low mass density. Traditionally, this approach has been to increase system integration and reduce weight through high-density integration of microwave and RF circuits, system-in-package (SIP), 3D stacking, and the use of multilayer printed circuit boards (PCBs) in component design to achieve high-density interconnection and 3D layout. However, due to the limitations of Moore's Law and current device process technology, the integration of transceiver components in phased array radars, especially those in the X-band and below, remains primarily a modular hybrid circuit approach. This limits the profile height and weight of the active antenna arrays. Further improving system integration, reducing radar system weight, and enhancing radar performance requires radar designers to brainstorm and explore new approaches.

[0003] Defective ground structures (DGS) are widely used in fields such as filters and electromagnetic wave communication modules. For example, Chinese invention patent application publication number CN101931114A discloses an asymmetric DGS cascade filter, a microwave component. The filter comprises a rectangular dielectric plate with a T-shaped defective ground structure etched asymmetrically with respect to the microstrip line. Two or three such asymmetric T-shaped DGS structures are then cascaded in parallel to form a filter. Another example is Chinese invention patent application publication number CN111316497A, which discloses a DGS phase shifter and a radio communication module incorporating the same. The phase shifter includes: a first substrate; a microstrip formed on the first substrate to extend in a first direction; a ground layer having a space provided on an upper surface of the microstrip and having a defect ground structure (DGS) in which a defect pattern is formed; a second substrate provided on the ground layer; and a liquid crystal layer provided in the space between the first substrate and the second substrate, wherein a DC voltage is applied between the ground layer and the microstrip. Summary of the Invention

[0004] The technical problems to be solved by the present invention are:

[0005] The existing technology has the technical problem of how to reduce the weight of components while ensuring the electromechanical and thermal performance of the components.

[0006] The present invention solves the above technical problems through the following technical means:

[0007] A lightweight array module based on a DGS structure includes a component housing in which a component housing DGS structure is provided;

[0008] The component module is arranged on the component housing DGS structure;

[0009] The cover plate is arranged at the opening of the component housing.

[0010] The lightweight array module based on the DGS structure in the present invention can reduce the weight of the component to the greatest extent while ensuring the electromechanical and thermal performance of the component due to the provision of the DGS structure, thereby achieving a lightweight design with stable and reliable performance.

[0011] Optimally, the component housing is an aluminum alloy thin-wall structure.

[0012] Optimally, the component housing DGS structure includes a plurality of recesses arranged in the component housing.

[0013] Optimally, the notch is circular.

[0014] Optimally, the notches are arranged in several groups, and several notches in each group are distributed in an array.

[0015] Optimized, the component modules include a power amplifier module, a circulator, a limiting low noise amplifier module, a power supply module, and a switch filter amplifier module;

[0016] The power amplifier module, circulator, limiting low noise amplifier module, power supply module, switch filter amplifier module are respectively arranged on the corresponding component shell DGS structure.

[0017] Optimally, the component module is provided with a module housing DGS structure on one side facing the component housing DGS structure;

[0018] The module housing DGS structure is in contact with the component housing DGS structure.

[0019] The DGS structure of the module housing cooperates with the DGS structure of the component housing to further achieve lightweighting while ensuring the electromechanical and thermal performance of the component.

[0020] Optimally, the module housing DGS structure includes a groove provided on the component module and a boss provided in the groove;

[0021] The height of the boss is equal to the depth of the groove.

[0022] Optimally, the boss is a cylindrical structure.

[0023] Optimally, the module housing DGS structure is located at a non-heat-generating and non-fixed position of the component module.

[0024] The module housing DGS structure is set at a non-heat source and non-fixed position of the component module to prevent it from affecting normal operation and causing interference.

[0025] The advantages of the present invention are:

[0026] 1. The lightweight array module based on the DGS structure in the present invention can reduce the weight of the component to the greatest extent while ensuring the electromechanical and thermal performance of the component, thereby achieving a lightweight design and stable and reliable performance.

[0027] 2. The DGS structure of the module housing is coordinated with the DGS structure of the component housing to further achieve lightweighting while ensuring the electromechanical and thermal performance of the component.

[0028] 3. The module housing DGS structure is set at a non-heat source and non-fixed position of the component module to prevent it from affecting normal operation and causing interference. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 Schematic diagram of a lightweight array module based on a DGS structure according to an embodiment of the present invention;

[0030] Figure 2 Schematic diagram of the contact surface between the module housing DGS structure and the component housing DGS structure in an embodiment of the present invention;

[0031] Figure 3 、 4 It is a three-dimensional diagram of a component housing in the prior art;

[0032] Figure 5 、 6 They are respectively the front view and the rear view of the component housing in the prior art;

[0033] Figure 7 、 8 is a three-dimensional diagram of a component housing according to an embodiment of the present invention;

[0034] Figure 9 This is a front view of the component housing in an embodiment of the present invention;

[0035] Figure 10-13 Schematic diagram of the DGS structure array arrangement of the component housings corresponding to the power amplifier module, circulator, limiter low noise amplifier module, and power supply module in the embodiment of the present invention;

[0036] Figure 14The front view and rear view of the component housing in the embodiment of the present invention;

[0037] Figure 15 、 16 is a three-dimensional diagram of a power amplifier module according to an embodiment of the present invention;

[0038] Figure 17 、 18 is a three-dimensional diagram of a circulator in an embodiment of the present invention;

[0039] in,

[0040] Component housing-1; component housing DGS structure-11; notch-111;

[0041] Component module-2; power amplifier module-21; circulator-22; limiter low noise amplifier module-23; power supply module-24; switch filter amplifier module-25; module housing DGS structure-26; boss-27; groove-28;

[0042] Cover-3. DETAILED DESCRIPTION

[0043] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0044] like Figure 1 As shown, a lightweight array module based on a DGS structure, specifically an 8-channel UHF band digital array module, includes a component housing 1, a component module 2, and a cover plate 3.

[0045] like Figure 7 、 9 As shown, a component housing DGS structure 11 is provided in the component housing 1; when processing the continuous defect grounding structure of the component housing DGS structure, the spacing between adjacent units is preferably less than λ / 16 (λ is the wavelength of the highest operating frequency of the radar).

[0046] like Figure 1As shown, the component module 2 is mounted on the component housing DGS structure 11; the cover plate 3 is mounted at the opening of the component housing 1. The component housing serves as the structural mounting carrier for the various functional modules within it, including liquid cooling channels (liquid cooling components) or heat sinks (air cooling components). These channels (liquid cooling components) or heat sinks (air cooling components) can be configured according to existing technologies. The liquid cooling components can be arranged in a three-dimensional layout with cooling channels arranged in the middle. The air cooling components can also be arranged in a three-dimensional layout in addition to the heat sinks to reduce the volume and weight of the components.

[0047] The component housing and the cover form a closed cavity to adapt to the working environment requirements of the radar system. The cover is generally made of aluminum and is connected to the component housing by screws or welding. The design of the cover in a multi-channel component needs to consider the electromagnetic compatibility design within the channel and the isolation design between channels.

[0048] Specifically, such as Figure 7 As shown, the component housing 1 is a thin-walled aluminum alloy structure. The component housing DGS structure 11 includes a plurality of notches 111 disposed therein. These notches 111 are circular. The notches 111 are arranged in groups, with the notches 111 in each group arranged in an array. The spacing between adjacent units is required to be less than λ / 16, meaning the spacing between adjacent notches 111 is required to be less than λ / 16.

[0049] like Figure 1 As shown, the component module 2 includes a power amplifier module 21, a circulator 22, a limiting low-noise amplifier module 23, a power module 24, and a switch filter amplifier module 25. These modules are each disposed on the corresponding component housing DGS structure 11. These modules are the primary functional units of the phased array radar transceiver assembly. Other functional components may not include or not fully include these functional modules, but a DGS structure can still be implemented within their component functional modules to achieve a lightweight design.

[0050] Specifically, the power amplifier module 21, circulator 22, limiter low-noise amplifier module 23, and power module 24 are mounted on the front of the component housing 1. Signals from each module are connected and transmitted via an adapter board. The back of the housing houses the busbars, capacitors, switch filter amplifier module 25, and an integrated digital transceiver board, with a cooling water channel arranged in the middle. The adapter board, busbars, capacitors, integrated digital transceiver board, and cooling water channel can be configured according to existing techniques.

[0051] This embodiment includes eight circulators 22, eight power amplifier modules 21, eight limiting low-noise amplifier modules 23, four DC / DC power modules (i.e., power modules 24), eight switch filter modules (i.e., switch filter amplifier modules 25), one integrated digital transceiver board, a component housing 1, a cover 3, an RF connector, a low-frequency connector, and an optical connector. The RF connector, low-frequency connector, and optical connector can be configured according to existing technologies.

[0052] The cover plate, power amplifier module, circulator, limiting low noise amplifier module, power supply module, switch filter amplifier module, etc. are installed together with the housing of the DGS structural component by screw fixation, microstrip welding, transmission control transition, power supply welding, control wiring, etc., to form a component with phased array radar transceiver function or special function.

[0053] The module module 2 is provided with a module housing DGS structure 26 on one side facing the module housing DGS structure 11; the module housing DGS structure 26 contacts the module housing DGS structure 11, and a continuous grounding mode is formed between the two through the contact surface, that is, Figure 2 The state shown does not affect the electrical performance of the module. The DGS structure of the component shell is milled to the maximum extent to achieve the purpose of maximum weight reduction while ensuring the mechanical strength of the entire component and the performance of each functional module.

[0054] The module housing DGS structure 26 includes a recess 28 provided on the component module 2 and a boss 27 provided within the recess 28. The height of the boss 27 is equal to the depth of the recess 28. The boss 27 is cylindrical. The module housing DGS structure 26 is located at a non-heat-generating and non-fixed position within the component module 2.

[0055] Specifically, the shell material of the circulator 22 is Y15 steel, the bottom plate thickness is 1.2 mm, and it is milled out by mechanical processing; the module shell DGS structure 26 of the circulator 22 is milled out by mechanical processing, such as Figure 17 、 18 As shown, four rows of bosses 27 are provided in the groove 28 of the circulator 22, and the specifications of the bosses 27 are The height of the bosses 27 is 0.8 mm, and the bosses 27 are staggered between adjacent rows. That is, one boss 27 in one row and two bosses 27 in the adjacent row are arranged in a triangle, preferably an equilateral triangle, and the spacing between two adjacent circular bosses is 7 mm. In this embodiment, the circulator shell adopts a DGS structure, which reduces the weight by approximately 3.71 grams.

[0056] The housing material of the power amplifier module 21 is 5A06 aluminum, the bottom plate thickness is 4mm, and it is milled out by mechanical processing; the module housing DGS structure 26 of the power amplifier module 21 is milled out by mechanical processing, such as Figure 15 、 16 As shown, the middle position is the power tube heat dissipation area. In order to achieve ideal heat dissipation of the power amplifier module, the DGS structure is not adopted in this position; that is, the grooves 28 of the power amplifier module 21 are arranged on both sides of the power tube heat dissipation area, and three rows of bosses 27 are arranged in each groove 28. The adjacent two rows are staggered, that is, a boss 27 in one row and two bosses 27 in the other row are arranged in a triangle, preferably an equilateral triangle. The specifications of the boss 27 are 2.8 mm is the height of the boss 27 of the power amplifier module 21 , and the distance between two adjacent circular bosses is 7 mm. The weight of the power amplifier module housing adopting the DGS structure is reduced by about 6.23 grams.

[0057] In this embodiment, the component housing 1 is made of 5A06 aluminum alloy and machined into a thin-walled structure. Figure 7-14 As shown, the front of the component housing 1 is provided with a total of 28 groups of component housing DGS structures 11, corresponding to 8 circulators 22, 8 power amplifier modules 21, 8 limiting low noise amplifier modules 23, and 4 DC / DC power supply modules. The notches in each group are distributed in a horizontal and vertical array. The circular notches are 3.5mm apart, and the maximum depth of the notches is 5mm. The DGS structures corresponding to the circulator and the power amplifier module form the DGS structure of the circulator shell and the DGS structure of the power amplifier module shell. Figure 2 The defective structure shown.

[0058] like Figure 2 As shown, the boss 27 of the module housing DGS structure 26 and the recess 111 of the component housing DGS structure 11 form a one-to-four structure, that is, the boss 27 is located in the middle of the four recesses 111 and covers a portion of the recess 111. Figure 2 The situation shown in the figure is that the size of the boss 27 of the module shell DGS structure 26 is larger than the recess 111 of the component shell DGS structure 11. In actual applications, the size of the boss 27 can also be set to be smaller than or equal to the recess 111 of the component shell DGS structure 11.

[0059] In actual applications, the continuity of grounding needs to be ensured, and each recess 111 needs to be partially covered by the boss 27. According to actual design requirements, the boss 27 and the recess 111 can be arranged in a one-to-one arrangement, or in a one-to-many arrangement. The one-to-many arrangement is to arrange the boss 27 and the recess 111 in a one-to-two, one-to-three, etc. The specific arrangement is optimized according to the structure and electrical performance to determine the number and correspondence of the two.

[0060] Because the housings of the limiting low-noise amplifier module and the power module are relatively thin, in this embodiment, only the corresponding locations of the component structure housing adopt a defective ground structure. All defective ground structures are required to avoid the heat dissipation water channels and the fixing screws of each functional module, and consider ideal heat dissipation in heat-concentrated areas. The 8-channel UHF-band digital array module structure housing adopts a DGS structure to reduce the weight by approximately 349.29 grams.

[0061] The 8-channel UHF band digital array module is reduced in weight by 423.93 grams after the module DGS structure and the structural shell DGS structure, which is about 5.44% of the weight. The components and their connection methods not described in detail in this embodiment are all prior art.

[0062] The circulator, power amplifier module, limiter low-noise amplifier module, power supply module, switch filter module, and integrated digital transceiver board are screwed onto the component housing to form an 8-channel UHF digital array module. During reception, the echo signal from the antenna array is fed via a feeder line into the 8-channel UHF digital array module, where it undergoes low-noise amplification and narrowband filtering through the circulator, limiter low-noise amplifier module, and switch filter module. The filtered echo signal is then sent to the integrated digital transceiver board for analog-to-digital conversion to generate a digital baseband signal. This signal is then transmitted to the signal processing subsystem as an optical signal via the electro-optical conversion module for receive DBF. During transmission, control commands are sent by the system task management subsystem, which is then transmitted to the 8-channel UHF digital array module via optical fiber via the signal processing subsystem. The DDS chip in the RF waveform generation module of the integrated digital transceiver board generates the RF transmission excitation signal. After filtering and amplification by the switch filter module, it is sent to the transmit module for power amplification and radiated into space through the antenna array. The radar transmits using DDS waveform generation technology to achieve high-precision phase control and transmit DBF.

[0063] The embodiment of the present invention reduces the weight of the component through the defective grounding structure design without affecting the electromechanical and thermal performance of the component. It has now been engineered for mass production and has stable and reliable performance.

[0064] The lightweight array module based on the DGS structure in the present invention has a DGS structure, which is superior to the existing technology (such as Figure 3-6 The module housing DGS structure 26, in conjunction with the component housing DGS structure 11, further reduces the weight of the component while ensuring electromechanical and thermal performance. The module housing DGS structure 26 is positioned in a non-heat-generating and non-fixed location within the component module 2 to prevent interference with normal operation and prevent any disruption to normal operation.

[0065] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A lightweight array module based on a DGS structure, characterized by: The invention comprises a component housing (1), wherein a component housing DGS structure (11) is provided in the component housing (1); The component module (2) is arranged on the component housing DGS structure (11); a module housing DGS structure (26) is arranged on a side of the component module (2) facing the component housing DGS structure (11); the module housing DGS structure (26) contacts the component housing DGS structure (11), and a continuous grounding mode is formed between the two through the contact surface; the component housing DGS structure (11) includes a plurality of notches (111) arranged in the component housing (1), and the spacing between adjacent notches (111) is less than λ / 16, where λ is the wavelength of the highest operating frequency of the radar; the module housing DGS structure (26) includes a groove (28) arranged on the component module (2) and a boss (27) arranged in the groove (28), and the height of the boss (27) is equal to the depth of the groove (28); A cover plate (3) is arranged at the opening of the component housing (1).

2. The lightweight array module based on the DGS structure according to claim 1, characterized in that: The component housing (1) is an aluminum alloy thin-wall structure.

3. The lightweight array module based on the DGS structure according to claim 1, characterized in that: The notch (111) is circular.

4. The lightweight array module based on the DGS structure according to claim 1, characterized in that: The notches (111) are arranged in a plurality of groups, and the plurality of notches (111) in each group are distributed in an array.

5. The lightweight array module based on the DGS structure according to claim 1, characterized in that: The component module (2) includes a power amplifier module (21), a circulator (22), a limiting low noise amplifier module (23), a power supply module (24), and a switch filter amplifier module (25); The power amplifier module (21), the circulator (22), the limiting low noise amplifier module (23), the power supply module (24), and the switch filter amplifier module (25) are respectively arranged on the corresponding component housing DGS structure (11).

6. The lightweight array module based on the DGS structure according to claim 1, characterized in that: The boss (27) is a cylindrical structure.

7. The lightweight array module based on the DGS structure according to claim 1, characterized in that: The module housing DGS structure (26) is located at a non-heat-generating and non-fixed position of the component module (2).

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