A reaction chamber tail gas pressure control device and semiconductor process equipment

Abstract

A reaction chamber tail gas pressure control device and semiconductor process equipment, comprising a first condensation component, a transverse connection block, a first exhaust pipe, an automatic pressure control valve, a second exhaust pipe, and a water box arranged below the transverse connection block and connected to the first exhaust pipe, which are sequentially connected to the exhaust port of the reaction chamber. The automatic pressure control valve and the transverse connection block are also provided with a pressure detection tube, and also include a temperature control component and a drain pipe, wherein: the temperature control component is used to maintain the first exhaust pipe and the second exhaust pipe within a preset temperature range so that the temperature of the tail gas entering and exiting the automatic pressure control valve is stable; the second exhaust pipe is connected to the water box through the drain pipe and is used to connect to the factory exhaust pipe. In the embodiment of the present invention, the temperature of the tail gas entering and exiting the automatic pressure control valve is stabilized by the temperature control component, thereby avoiding the temperature changes upstream and downstream of the automatic pressure control valve causing the volume of the tail gas inside the automatic pressure control valve to change, affecting the pressure control effect.

Description

Technical Field

[0001] The present invention belongs to the field of semiconductor technology, and more specifically, relates to a reaction chamber tail gas pressure control device and semiconductor process equipment. Background Art

[0002] The density and uniformity of the silicon dioxide film on the wafer in the oxidation furnace process chamber are important indicators to measure the capability of the oxidation process equipment. In vertical oxidation process equipment, the wet oxygen oxidation process has the advantage of fast film formation rate and has been widely used by integrated circuit manufacturers. In this type of equipment, stable pressure control plays a decisive role in the thickness and uniformity of the oxide film generated in the chamber.

[0003] Pure water vapor is an essential reactive gas in the wet oxygen oxidation process. With the development of the process, the requirements for stable pressure control in the process chamber are getting higher and higher, the duration of the wet oxygen process is getting longer and longer, and the hydrogen-oxygen ratio of the wet oxygen process is getting larger and larger. This means that more and more water vapor passes through the exhaust end of the process per unit time, and the duration is getting longer and longer. Figure 1 In the relative pressure control system shown, water vapor in the process chamber 100 is converted into liquid water under the action of the condenser 500 and the condenser 400, and the liquid water is collected in the water box 800 through the transverse connecting block 600. The water condensed inside the automatic pressure control valve 1100 located above the transverse connecting block 600 can also be discharged into the water box 800 through the automatic pressure control valve drain pipe 900, and the water in the water box 800 is discharged through the drain pipe. Under the condition of large hydrogen-oxygen ratio and long wet oxygen process, the condenser 400 and the condensing tube 500 cannot infinitely increase the ability to condense water vapor into water as the hydrogen-oxygen ratio increases and the wet oxygen process time increases. The amount of water to be condensed at the automatic pressure control valve 1100 will increase as the hydrogen-oxygen ratio of the wet oxygen process increases and the wet oxygen process time increases. The drainage capacity of the automatic pressure control valve drain pipe 900 is insufficient to discharge the increased condensed water in time. The increased condensed water is retained inside the automatic pressure control valve 1100, blocking the movement of the piston, slowing down the response of the automatic pressure control valve 1100 and making the pressure control unstable. In addition, as the types of process gases in the dry oxygen process change more, the volume of process exhaust is also increasing, and the temperature used in the process is also changing more and more. The temperature change will cause a large flow of gas to produce an obvious volume change, making pressure control more difficult, and further increasing the pressure control fluctuation, which does not meet the pressure control stability requirements.

[0004] Therefore, a reaction chamber tail gas pressure control device is needed to solve at least one of the above problems. Summary of the invention

[0005] The purpose of the present invention is to provide a reaction chamber exhaust gas pressure control device and semiconductor process equipment, which can achieve stable pressure control in the process chamber when the hydrogen-oxygen ratio of the wet oxygen process continues to increase and the process time continues to increase.

[0006] In order to achieve the above-mentioned object, the present invention provides a reaction chamber tail gas pressure control device, comprising a first condensation component, a transverse connection block, a first exhaust pipe, an automatic pressure control valve, a second exhaust pipe, and a water box arranged below the transverse connection block and connected to the first exhaust pipe, which are sequentially connected to the exhaust port of the reaction chamber, a pressure detection tube is also arranged between the automatic pressure control valve and the transverse connection block, and also includes a temperature control component and a drain pipe, wherein:

[0007] The temperature control assembly is used to maintain the first exhaust pipe and the second exhaust pipe within a preset temperature range so as to stabilize the temperature of the exhaust gas entering and exiting the automatic pressure control valve;

[0008] The second exhaust pipe is connected to the water box through the drain pipe and is used to be connected to the factory exhaust pipe.

[0009] Preferably, the temperature control assembly comprises a controller, a first heating belt, a first temperature sensor, a second heating belt and a second temperature sensor;

[0010] The first heating belt and the second heating belt are respectively wrapped around the first exhaust pipe and the second exhaust pipe, the first temperature sensor and the second temperature sensor are respectively used to collect temperatures of the first exhaust pipe and the second exhaust pipe, and the controller controls the operation of the first heating belt and the second heating belt according to the temperatures collected by the first temperature sensor and the second temperature sensor, so as to maintain the first exhaust pipe and the second exhaust pipe within the preset temperature range.

[0011] Preferably, the preset temperature range is 100°C to 120°C.

[0012] Preferably, the second exhaust pipe is in an inverted U shape and is connected to the top end of the automatic pressure control valve.

[0013] Preferably, it further comprises a second condensation assembly, wherein the second condensation assembly comprises a second condenser and a second condensation pipe arranged in the second condenser;

[0014] The second condensing pipe is arranged between the second exhaust pipe and the drain pipe.

[0015] Preferably, the second condenser pipe, the drain pipe and the factory exhaust pipe are connected via a tee.

[0016] Preferably, it further comprises an exhaust transition pipe, both ends of which are sealedly connected to the exhaust port of the reaction chamber and the inlet of the first condensation component respectively.

[0017] Preferably, the first condensing assembly includes a first condenser and a first condensing tube arranged in the first condenser, and one end of the first condensing tube is connected to the exhaust transition duct through a first joint.

[0018] Preferably, a channel inclined relative to the horizontal direction is provided in the transverse connecting block;

[0019] The first condensation pipe is connected to a higher end of the channel, and the first exhaust pipe and the water box are connected to a lower end of the channel.

[0020] The present invention also provides a semiconductor process equipment, comprising a reaction chamber and the above-mentioned reaction chamber tail gas pressure control device, wherein the reaction chamber tail gas pressure control device is connected to the reaction chamber exhaust port.

[0021] The present invention relates to a reaction chamber exhaust gas pressure control device, which has the beneficial effects that the exhaust gas of the reaction chamber is condensed by a first condensation component and then enters a first exhaust pipe and an automatic pressure control valve in sequence, the exhaust gas in the first exhaust pipe is maintained within a preset temperature range by a temperature control component to avoid condensation and accumulation of water generated by a wet oxygen process inside the automatic pressure control valve, and the exhaust gas in the second exhaust pipe is temperature controlled by the temperature control component at the same time to stabilize the exhaust gas temperature entering and exiting the automatic pressure control valve, thereby avoiding temperature changes upstream and downstream of the automatic pressure control valve causing changes in the volume of the exhaust gas inside the automatic pressure control valve, thereby affecting the pressure control effect.

[0022] Other features and advantages of the present invention will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The above and other objects, features and advantages of the present invention will become more apparent through a more detailed description of exemplary embodiments of the present invention in conjunction with the accompanying drawings, wherein like reference numerals generally represent like components throughout the exemplary embodiments of the present invention.

[0024] Figure 1 A schematic structural diagram of a relative pressure control system in the prior art is shown;

[0025] Figure 2 A schematic structural diagram of a reaction chamber tail gas pressure control device according to an exemplary embodiment of the present invention is shown.

[0026] Description of reference numerals:

[0027] 1. reaction chamber, 2. exhaust transition pipe, 3. first joint, 4. first condenser, 5. first condenser tube, 6. transverse connection block, 7. water box, 8. drain pipe, 9. tee, 10. first exhaust pipe, 11. first heating belt, 12. first temperature sensor, 13. pressure detection tube, 14. second temperature sensor, 15. second exhaust pipe, 16. second heating belt, 17. automatic pressure control valve, 18. second joint, 19. second condenser, 20. second condenser tube, 21. third exhaust pipe;

[0028] 100 process chamber, 200 exhaust transition pipe, 400 condenser, 500 condenser pipe, 600 transverse connection block, 700 water box plug, 800 water box, 900 automatic pressure control valve drain pipe, 1000 exhaust pipe, 1100 automatic pressure control valve. DETAILED DESCRIPTION

[0029] The preferred embodiments of the present invention will be described in more detail below. Although the preferred embodiments of the present invention are described below, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided to make the present invention more thorough and complete, and to fully convey the scope of the present invention to those skilled in the art.

[0030] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0031] Figure 1The relative pressure control system shown in the prior art is shown, wherein the process chamber 100 is sealedly connected to the exhaust transition duct 200, the exhaust transition duct 200, the condenser 500, the transverse connecting block 600, the exhaust pipe 1000, the automatic pressure control valve 1100 and the factory exhaust pipe 1300 are connected end to end in sequence, the condenser 500 is arranged in the condenser 400, the water box 800 is connected to the bottom of the transverse connecting block 600, the water box plug 700 is sealedly connected to the water box 800, the automatic pressure control valve drain pipe 900 is respectively connected to the automatic pressure control valve 1100 and the water box 800, and the pressure detection tube 1200 is respectively connected to the automatic pressure control valve 1100 and the transverse connecting block 600. Under the wet oxygen process, the pressure control system can condense most of the water vapor into liquid water under the joint action of the condenser 400 and the condenser tube 500. Under the action of gravity, the cooling water will flow to the transverse connecting block 600, and then flow into the water box 800, and finally be discharged to the factory through the drain pipe. A small amount of water vapor will condense out at the rear end of the transverse connecting block 600, and the condensed water inside the automatic control valve 1100 can be discharged into the water box 800 through the automatic pressure control valve drain pipe 900, and finally be discharged to the factory through the drain pipe.

[0032] At present, the absolute pressure control system and the relative pressure control system are similar in terms of condensing water vapor and draining water. The only difference in the performance of the pressure control valve leads to different requirements for the structure of the water box. It has two water boxes. Under the wet oxygen process, the absolute pressure control system structure also condenses most of the water vapor into liquid water under the joint action of the condenser and the condenser tube. Under the action of gravity, the cooling water and the condensed water inside the automatic control valve are discharged through the exhaust pipe, flow to the horizontal connecting block, and then flow into one of the two water boxes, and finally discharged to the factory along the drain pipe.

[0033] The above-mentioned relative pressure control system and absolute pressure control system can both meet the use requirements under smaller hydrogen-oxygen ratios and shorter time periods. However, under large hydrogen-oxygen ratios and long wet oxygen processes, the condenser 400 and the condenser tube 500 cannot infinitely increase their ability to condense water vapor into water as the hydrogen-oxygen ratio increases and the wet oxygen process time lengthens. The amount of water to be condensed at the automatic pressure control valve increases as the hydrogen-oxygen ratio of the wet oxygen process increases and the wet oxygen process time lengthens. The drainage capacity of the automatic pressure control valve drain pipe is insufficient to discharge the increased condensed water in time. The increased condensed water is retained inside the automatic pressure control valve, blocking the movement of the piston, slowing down the response of the automatic pressure control valve, making the pressure control unstable, and reducing the sensitivity of the automatic pressure control valve's response, directly affecting the accuracy of the pressure control valve's pressure control, causing the pressure in the process chamber to fluctuate greatly in the later stage of the wet oxygen process. In the dry oxygen process, the process temperature of each step is different during the process, which causes the process exhaust temperature inside the pressure control valve to change. When the temperature changes drastically, the pressure control environment of the pressure control valve changes drastically due to the thermal expansion and contraction of the gas, which increases the difficulty of pressure control and thus the pressure control fluctuation will also become larger.

[0034] In order to solve the problems existing in the prior art, the present invention provides a reaction chamber tail gas pressure control device, such as Figure 2 As shown, it includes a first condensing component connected to the exhaust port of the reaction chamber 1 in sequence, a transverse connecting block 6, a first exhaust pipe 10, an automatic pressure control valve 17, a second exhaust pipe 15, and a water box 7 arranged below the transverse connecting block 6 and connected to the first exhaust pipe 10, a pressure detection tube 13 is also arranged between the automatic pressure control valve 17 and the transverse connecting block 6, and also includes a temperature control component and a drain pipe 8, wherein:

[0035] The temperature control assembly is used to maintain the first exhaust pipe 10 and the second exhaust pipe 15 within a preset temperature range so that the exhaust gas temperature entering and exiting the automatic pressure control valve 17 is stable;

[0036] The second exhaust pipe 15 is connected to the water box 7 through the drain pipe 8 and is used to be connected to the factory exhaust pipe 21 .

[0037] The present invention relates to a reaction chamber exhaust gas pressure control device, in which the exhaust gas of the reaction chamber is condensed by a first condensing component and then enters a first exhaust pipe 10 and an automatic pressure control valve 17 in sequence, and the exhaust gas in the first exhaust pipe 10 is maintained within a preset temperature range by a temperature control component to prevent water generated by a wet oxygen process from condensing and accumulating inside the automatic pressure control valve 17, and the temperature of the exhaust gas in a second exhaust pipe 15 located downstream of the automatic pressure control valve 17 is simultaneously controlled by the temperature control component to stabilize the temperature of the exhaust gas entering and exiting the automatic pressure control valve 17, thereby preventing the temperature changes upstream and downstream of the automatic pressure control valve 17 from causing changes in the volume of the exhaust gas inside the automatic pressure control valve 17 and affecting the pressure control effect.

[0038] As a preferred solution of the present application, the temperature control assembly includes a controller, a first heating belt 11, a first temperature sensor 12, a second heating belt 16 and a second temperature sensor 14;

[0039] The first heating belt 11 and the second heating belt 16 are respectively wrapped around the first exhaust pipe 10 and the second exhaust pipe 15. The first temperature sensor 12 and the second temperature sensor 14 are respectively used to collect the temperatures of the first exhaust pipe 10 and the second exhaust pipe 15. The controller controls the operation of the first heating belt 11 and the second heating belt 16 according to the temperatures collected by the first temperature sensor 12 and the second temperature sensor 14 to maintain the first exhaust pipe 10 and the second exhaust pipe 15 within a preset temperature range.

[0040] The first exhaust pipe 10 and the second exhaust pipe 15 are respectively maintained in a preset temperature range by the temperature control component. On the one hand, the temperature of the tail gas after condensation from the first condensation component can be increased to prevent the water generated by the wet oxygen process from condensing and accumulating inside the automatic pressure control valve 17, so that no condensed water is generated in the automatic pressure control valve 17. On the other hand, the temperature of the tail gas entering and leaving the automatic pressure control valve 17 is maintained within the working temperature required by the pressure control valve, providing a stable pressure control environment for the automatic pressure control valve 17, avoiding the volume change of the tail gas caused by temperature change, affecting the pressure control effect of the automatic pressure control valve 17, and preventing the automatic pressure control valve 17 from being affected by the hydrogen-oxygen ratio and time of the wet oxygen process;

[0041] Among them, the exhaust gas entering and exiting the automatic pressure control valve 17 is heated by the first heating belt 11 and the second heating belt 16 respectively, so that the water generated by the wet oxygen process can be prevented from condensing and accumulating inside the pressure control valve, and the controller can control the heating belt according to the monitoring signal feedback of the temperature sensor to maintain the heating temperature of the heating belt at a stable value, so as to prevent the volume of the exhaust gas inside the automatic pressure control valve 17 from changing due to temperature changes.

[0042] The preset temperature range is 100℃~120℃.

[0043] As a preferred solution of the present application, the preset temperature is 110°C. When the wet oxygen process is carried out at this temperature, no condensed water will be generated in the automatic pressure control valve 17. The temperature control component makes the temperature of the tail gas entering the automatic pressure control valve 17 always within the working temperature required by the pressure control valve. Similarly, the temperature in the second exhaust pipe 15 downstream of the automatic pressure control valve 17 is also maintained in this range. In this way, the temperature before and after the automatic pressure control valve 17 will not change, or the change is very small, so that the automatic pressure control valve 17 is in a stable pressure control environment, which is not affected by the hydrogen-oxygen ratio and time of the wet oxygen process. For the dry oxygen process, even if the temperature in the reaction chamber 1 is different in different dry oxygen processes, the temperature of the tail gas in the reaction chamber 1 reaching the automatic pressure control valve 17 is always a stable value, that is, within the preset temperature range, at this stable value, the volume of the tail gas in the automatic pressure control valve 17 will not expand and contract due to temperature changes, and the pressure control effect of the automatic pressure control valve 17 is better.

[0044] As a preferred solution, the second exhaust pipe 15 is inverted U-shaped and connected to the top of the automatic pressure control valve 17. The second heating belt 16 adapted to the second exhaust pipe 15 is also inverted U-shaped to wrap most of the second exhaust pipe 15.

[0045] In one embodiment of the present application, the first exhaust pipe 10 is a straight pipe, and the first heating belt 11 is a matching straight cylinder.

[0046] The reaction chamber tail gas pressure control device further includes a second condensation assembly, which includes a second condenser 19 and a second condensation pipe 20 disposed in the second condenser 19;

[0047] The second condensing pipe 20 is disposed between the second exhaust pipe 15 and the drain pipe 8 .

[0048] The second condenser pipe 20 , the drain pipe 8 and the factory exhaust pipe 21 are connected via a tee 9 .

[0049] The second condensation component is sealedly connected to the second exhaust pipe 15 via a second joint 18, which is used to further cool and condense the exhaust gas from the reaction chamber 1 in the second exhaust pipe 15. Part of the water vapor is condensed into liquid water in the second condenser 20, and the cooled water vapor is discharged to the plant through the plant exhaust pipe 21, and the liquid water is collected in the water box 7 through the drain pipe 8.

[0050] The reaction chamber tail gas pressure control device further comprises an exhaust transition pipe 2, both ends of which are sealedly connected to the exhaust port of the reaction chamber 1 and the inlet of the first condensation component respectively.

[0051] The exhaust transition pipe 2 is used to pass the exhaust gas of the reaction chamber 1 into the first condensation component. One end of the exhaust transition pipe 2 is connected to the exhaust port of the reaction chamber 1 through a joint, and the other end is sealed and connected to the first condensation component.

[0052] The first condensation assembly includes a first condenser 4 and a first condensation pipe 5 arranged in the first condenser 4 . One end of the first condensation pipe 5 is connected to the exhaust transition pipe 2 through a first joint 3 .

[0053] At present, the automatic pressure control valve 17 includes a relative pressure control valve used in a relative pressure control system and an absolute pressure control valve used in an absolute pressure control system, wherein the relative pressure control valve allows a maximum exhaust temperature of 150°C, and the absolute pressure control valve allows a maximum exhaust temperature of 120°C. Therefore, during the wet oxygen process, the high-temperature process exhaust gas discharged from the exhaust port of the reaction chamber 1, that is, the temperature of the tail gas of the reaction chamber 1 is as high as 800°C to 1000°C. The tail gas of the reaction chamber 1 is reduced to below 100°C through the first condenser 4 and the first condenser tube 5, so as to protect the rear-end pipeline and the automatic pressure control valve 17; when the wet oxygen process is carried out, part of the water vapor will be condensed into liquid water in the first condenser tube 5, and the liquid water will flow into the water box 7 along the transverse connecting block 6, and finally discharged to the factory service; the tail gas cooled to below 100°C by the first condenser 4 and the first condenser tube 5 passes through the transverse connecting block 6 and the first exhaust pipe 10 to enter the automatic pressure control valve 17, and then discharged to the factory service exhaust pipe 21 through the second exhaust pipe 15. A pressure detection tube 13 is provided between the automatic pressure control valve 17 and the transverse connecting block 6 for detecting the pressure of the exhaust gas before entering the automatic pressure control valve 17, thereby automatically adjusting the pressure. This process belongs to the prior art and will not be described in detail.

[0054] A channel is provided in the transverse connecting block 6 and is arranged obliquely relative to the horizontal direction;

[0055] The first condenser pipe 5 is connected to the higher end of the channel, and the first exhaust pipe 10 and the water box 7 are connected to the lower end of the channel to prevent the condensed liquid water in the first condenser pipe 5 from flowing back. The first exhaust pipe 10 is located above the transverse connecting block 6, and the water box 7 is located below the transverse connecting block 6.

[0056] In this embodiment, the drain pipe 8 is connected to the top of the water box 7 and communicates with the inside of the water box 7. The lower end of the channel in the transverse connecting block 6 is connected to the water box 7 through a connecting pipe. The top of the connecting pipe water box 7 is inserted into the inside of the water box 7 near the bottom. The water collected in the water box 7 is discharged through the water pipe. The water pipe is inserted from the bottom of the water box 7 upward into the inside of the water box 7 near the top.

[0057] The reaction chamber tail gas pressure control device of the present invention controls the temperature of the tail gas entering and exiting the automatic pressure control valve through a temperature control component, thereby preventing water generated by a wet oxygen process from condensing and accumulating inside the automatic pressure control valve, and preventing the volume of the tail gas inside the automatic pressure control valve from changing due to temperature changes. The specific process is as follows: the tail gas discharged from the reaction chamber 1 is cooled by a first condensing component, and then the first exhaust pipe 10 is heated by a temperature control component, so that the temperature of the tail gas entering the automatic pressure control valve 17 is maintained within a preset temperature range, thereby preventing the generation of liquid water inside the automatic pressure control valve 17. The water generated after condensation of the first condensing component is collected into the water box 7 through the horizontal connecting block 6, and the exhaust gas in the automatic pressure control valve 17 is discharged to the second exhaust pipe 15. The second exhaust pipe 15 is heated by the temperature control component to stabilize the temperature of the exhaust gas entering and leaving the automatic pressure control valve 17, thereby avoiding changes in the exhaust gas volume due to temperature changes, ensuring the stability of the pressure control of the automatic pressure control valve 17, and avoiding affecting the pressure control effect of the automatic pressure control valve 17. The exhaust gas in the second exhaust pipe 15 is cooled by the second condensing component, so that the exhaust gas discharged to the factory exhaust pipe 21 meets the requirements.

[0058] The reaction chamber tail gas pressure control device involved in the present invention can provide an absolutely stable pressure control environment for the automatic pressure control valve 17 to control the pressure in any temperature, any hydrogen-oxygen ratio and long-time wet oxygen process, and prevents the accumulation of condensed water in the automatic pressure control valve 17, avoids the problem that the accumulated condensed water blocks the piston of the pressure control valve, resulting in a slow response speed of the automatic pressure control valve 17, and ensures the stability of the pressure control of the automatic pressure control valve 17; at the same time, in a dry oxygen process at any temperature, it can provide an absolutely stable pressure control temperature environment for the automatic pressure control valve 17 to control the pressure, and prevents the problem of thermal expansion and contraction of the tail gas in the reaction chamber 1 with temperature changes, stabilizes the airflow environment inside the automatic pressure control valve 17, and ensures the stability of the pressure control of the automatic pressure control valve 17, and can simultaneously solve the problems of large hydrogen-oxygen ratio and large pressure fluctuation for a long time in the wet oxygen process of the relative pressure control system and the absolute pressure control system.

[0059] The present invention further provides a semiconductor process equipment, comprising a reaction chamber 1 and the above-mentioned reaction chamber tail gas pressure control device, wherein the reaction chamber tail gas pressure control device is connected to the exhaust port of the reaction chamber 1 .

[0060] The embodiments of the present invention have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments.

Claims

1. A reaction chamber tail gas pressure control device, comprising a first condensation assembly, a transverse connection block (6), a first exhaust pipe (10), an automatic pressure control valve (17), a second exhaust pipe (15) which are sequentially connected to an exhaust port of a reaction chamber (1), and a water box (7) which is arranged below the transverse connection block (6) and is in communication with the transverse connection block (6), a pressure detection tube (13) is further arranged between the automatic pressure control valve (17) and the transverse connection block (6), and is characterized in that: It also includes a temperature control assembly and a drain pipe (8), wherein: The temperature control component comprises a first heating belt (11) and a second heating belt (16), wherein the first heating belt (11) and the second heating belt (16) are respectively wrapped around the first exhaust pipe (10) and the second exhaust pipe (15); The temperature control component is used to maintain the first exhaust pipe (10) and the second exhaust pipe (15) within a preset temperature range to prevent water from condensing inside the automatic pressure control valve (17), so as to stabilize the temperature of the exhaust gas entering and exiting the automatic pressure control valve (17); The second exhaust pipe (15) is connected to the water box (7) via the drain pipe (8) and is used to be connected to the factory exhaust pipe (21).

2. The reaction chamber tail gas pressure control device according to claim 1, characterized in that: The temperature control component comprises a controller, a first temperature sensor (12) and a second temperature sensor (14); The first temperature sensor (12) and the second temperature sensor (14) are used to collect temperatures of the first exhaust pipe (10) and the second exhaust pipe (15), respectively. The controller controls the operation of the first heating belt (11) and the second heating belt (16) according to the temperatures collected by the first temperature sensor (12) and the second temperature sensor (14), so as to maintain the first exhaust pipe (10) and the second exhaust pipe (15) within the preset temperature range.

3. The reaction chamber tail gas pressure control device according to claim 1, characterized in that: The preset temperature range is 100°C to 120°C.

4. The reaction chamber tail gas pressure control device according to claim 1, characterized in that: The second exhaust pipe (15) is in an inverted U shape and is connected to the top end of the automatic pressure control valve (17).

5. The reaction chamber tail gas pressure control device according to claim 1, characterized in that: It also includes a second condensation component, wherein the second condensation component includes a second condenser (19) and a second condensation pipe (20) arranged in the second condenser (19); The second condensation pipe (20) is arranged between the second exhaust pipe (15) and the drain pipe (8).

6. The reaction chamber tail gas pressure control device according to claim 5, characterized in that: The second condenser pipe (20), the drain pipe (8) and the factory exhaust pipe (21) are connected via a tee (9).

7. The reaction chamber tail gas pressure control device according to claim 1, characterized in that: It also comprises an exhaust transition pipe (2), the two ends of which are respectively sealedly connected to the exhaust port of the reaction chamber (1) and the inlet of the first condensation component.

8. The reaction chamber tail gas pressure control device according to claim 7, characterized in that: The first condensation assembly comprises a first condenser (4) and a first condensation pipe (5) arranged in the first condenser (4), and one end of the first condensation pipe (5) is connected to the exhaust transition pipe (2) via a first joint (3).

9. The reaction chamber tail gas pressure control device according to claim 8, characterized in that: The transverse connecting block (6) is provided with a channel which is arranged obliquely relative to the horizontal direction; The first condensation pipe (5) is connected to a higher end of the channel, and the first exhaust pipe (10) and the water box (7) are connected to a lower end of the channel.

10. A semiconductor process equipment, characterized in that: It comprises a reaction chamber (1) and a reaction chamber tail gas pressure control device according to any one of claims 1 to 9, wherein the reaction chamber tail gas pressure control device is connected to the exhaust port of the reaction chamber (1).

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