Die bonding module and die bonder having the same

Abstract

This application relates to a die bonding module and a die bonder having the same. The die bonding module includes: a die bonding head structure; a robotic arm structure, the robotic arm structure includes a first-level vertical transmission structure and a second-level vertical transmission structure, the second-level vertical transmission structure is installed on the first-level vertical transmission structure, and the die bonding head structure is installed on the second-level vertical transmission structure. The technical solution of this application effectively solves the problem of low transmission accuracy when the die bonding head structure moves up and down in the prior art.

Description

Technical Field

[0001] This application relates to the technical field of die bonders, and particularly to a die bonding module and a die bonder having the same. Background Art

[0002] With the rapid development of modern electronic information technology, higher and higher requirements are put forward for the miniaturization, portability, multi-functionality, high reliability, and low cost of electronic products. Currently, in order to meet the requirements of various electronic products, electronic packaging has gradually become relatively independent from its subordinate position as a post-process of microelectronics manufacturing. In response to the special requirements of various electronic products, a variety of packaging technologies have been developed, and a large number of new theories, new materials, new processes, new equipment, and new electronic products have emerged; electronic packaging testing technology, together with chip design and manufacturing, is jointly promoting the development of the information society.

[0003] In the prior art, the die bonding module uses a hydraulic structure to move the die bonding head structure up and down, and such a transmission structure has low precision. Summary of the Invention

[0004] This application provides a die bonding module and a die bonder having the same to solve the problem of low precision in the transmission when the die bonding head structure moves up and down in the prior art.

[0005] To achieve the above object, on the one hand, this application provides a die bonding module, including: a die bonding head structure; a robotic arm structure, the robotic arm structure includes a first-stage vertical transmission structure and a second-stage vertical transmission structure, the second-stage vertical transmission structure is installed on the first-stage vertical transmission structure, and the die bonding head structure is installed on the second-stage vertical transmission structure.

[0006] Further, the first-stage vertical transmission structure includes a die bonding mounting base, a die bonding driving motor, a die bonding driving pulley, a die bonding synchronous belt, a die bonding driven pulley, and a die bonding transmission lead screw. The die bonding driving motor is fixed on the die bonding mounting base, the die bonding driving pulley is connected to the die bonding driving motor, the die bonding driving pulley and the die bonding driven pulley are driven by the die bonding synchronous belt, the die bonding driven pulley is connected to the die bonding transmission lead screw, and the second-stage vertical transmission structure is connected to the die bonding transmission lead screw.

[0007] Further, the second-stage vertical transmission structure has a die bonding threaded hole adapted to the die bonding transmission lead screw, and the die bonding transmission lead screw is inserted into the die bonding threaded hole.

[0008] Further, the second-stage vertical transmission structure includes a voice coil motor, and the die bonding head structure is connected to the voice coil motor.

[0009] Further, the die bonding head structure includes a die bonding head and a die bonding head connecting seat. The die bonding head connecting seat is fixed on the robotic arm structure, and the die bonding head is magnetically installed on the die bonding head connecting seat.

[0010] Further, the die bonding head includes a die bonding head body and a die bonding head mounting seat. The die bonding head mounting seat has a mounting hole, and the die bonding head body is mounted in the mounting hole.

[0011] Further, the die bonding head mounting seat includes a ferromagnetic body, a first mounting section, a limiting section, and a second mounting section. The limiting section is located between the first mounting section and the second mounting section. The ferromagnetic body is located on the side of the first mounting section away from the limiting section. The outer diameter of the limiting section is greater than that of the first mounting section.

[0012] Further, the die bonding head connecting seat includes a seat body and a connecting pipe. The connecting pipe is disposed on the side wall of the seat body and can communicate with the die bonding head body.

[0013] Further, the mounting hole extends from the end of the second mounting section away from the limiting section to the first mounting section. The side wall of the first mounting section has a communication hole that communicates the mounting hole and the connecting pipe.

[0014] Further, the die bonding head connecting seat further includes a magnet. The seat body includes a receiving space, and the magnet is disposed in the receiving space.

[0015] Further, the ferromagnetic body and the first mounting section are located in the receiving space, and there are mutually cooperating limiting portions between the first mounting section and the wall surface of the receiving space.

[0016] Further, the die bonding module further includes a die bonding head picking structure and a die bonding head storage structure, and both the die bonding head picking structure and the die bonding head storage structure are disposed on the mounting frame module.

[0017] According to another aspect of the present application, there is also provided a die bonder including a die bonding module, and the die bonding module is the above-mentioned die bonding module.

[0018] Further, a mounting frame module, on which a robotic arm structure is mounted; a dispensing module, which is disposed on the mounting frame module; a feeding module, which is disposed on the mounting frame module; a discharging module, which is disposed on the mounting frame module; a conveying module, which is disposed on the mounting frame module and can drive the carrier plate to move among the dispensing module, the feeding module, the die bonding module, and the discharging module.

[0019] The above technical solutions provided by the embodiments of the present application have the following advantages compared with the prior art:

[0020] In the technical solution of the present application, the robotic arm structure includes a first-level vertical transmission structure and a second-level vertical transmission structure. The second-level vertical transmission structure is arranged on the first-level transmission structure, and the die bonding head structure is arranged on the second-level vertical transmission structure. Through the cooperation of the first-level transmission structure and the second-level transmission structure, the up and down movement of the die bonding head structure can meet both the efficiency and the precision requirements. Specifically, the first-level transmission structure has higher efficiency, and the second-level transmission structure has higher precision. During the initial adjustment, it is transmitted through the first-level transmission structure, and when the initial adjustment is completed, it can be adjusted through the second-level transmission structure. The technical solution of the present application effectively solves the problem of low transmission precision when the die bonding head structure moves up and down in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The drawings herein are incorporated into and form a part of this specification, showing embodiments consistent with the present invention and, together with the specification, are used to explain the principles of the present invention.

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or in the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0023] Figure 1 Shows a schematic three-dimensional structure diagram of the die bonder according to an embodiment of the present application;

[0024] Figure 2 Shows Figure 1 a schematic diagram of the runner structure of the die bonder;

[0025] Figure 3 Shows Figure 1 a schematic diagram of the first pressing plate structure of the die bonder;

[0026] Figure 4 Shows Figure 1 a schematic diagram of the runner driving structure of the die bonder;

[0027] Figure 5 Shows Figure 1 a partially enlarged schematic diagram of the die bonding module of the die bonder;

[0028] Figure 6 Shows Figure 1 a mating schematic diagram of the die bonding module of the die bonder;

[0029] Figure 7 Shows Figure 6 a schematic diagram of the die bonding head storage structure of the die bonding module;

[0030] Figure 8 ShowsFigure 1 Schematic diagram of die bonding structure of die bonder

[0031] Figure 9 shows Figure 8 Schematic diagram of die bonding head of die bonding structure

[0032] Figure 10 shows Figure 1 Schematic diagram of robotic arm structure of die bonder

[0033] Among them, the above-mentioned drawings include the following reference numerals:

[0034] 10. Mounting frame module; 11. Base assembly; 12. Guide rail assembly; 13. Runner assembly; 131. Limit support frame structure; 132. Runner drive structure; 20. Dispensing module; 30. Material waiting module; 40. Die bonding module; 41. Die bonding head structure; 411. Die bonding head; 412. Die bonding head connecting seat; 42. Robotic arm structure; 421. First-level vertical transmission structure; 422. Second-level vertical transmission structure; 43. Die bonding head storage structure; 50. Material discharging module; 60. Conveying module; 70. First pressing plate structure; 71. First pressing plate; 72. Second elastic member; 80. First top plate structure Detailed implementation manners

[0035] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Apparently, the described embodiments are some but not all of the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts shall fall within the scope of protection of the present application

[0036] As Figures 1 to 10 shown, a die bonding module in this embodiment includes a die bonding head structure 41 and a robotic arm structure 42. The robotic arm structure 42 includes a first-level vertical transmission structure 421 and a second-level vertical transmission structure 422. The second-level vertical transmission structure 422 is installed on the first-level vertical transmission structure 421, and the die bonding head structure 41 is installed on the second-level vertical transmission structure 422

[0037] In the technical solution of this embodiment, the robotic arm structure 42 includes a first-level vertical transmission structure 421 and a second-level vertical transmission structure 422. The second-level vertical transmission structure 422 is arranged on the first-level vertical transmission structure 421, and the die bonding head structure 41 is arranged on the second-level vertical transmission structure 422. Through the cooperation of the first-level vertical transmission structure 421 and the second-level vertical transmission structure 422, the up-and-down movement of the die bonding head structure 41 can meet both the efficiency and the accuracy requirements. Specifically, the first-level vertical transmission structure 421 has a higher efficiency, and the second-level vertical transmission structure 422 has a higher accuracy. During the initial adjustment, the first-level vertical transmission structure 421 is used for transmission, and when the initial adjustment is completed, the second-level vertical transmission structure 422 can be used for adjustment. The technical solution of this embodiment effectively solves the problem of low transmission accuracy when the die bonding head structure in the prior art moves up and down.

[0038] As Figure 10 shown, in the technical solution of this embodiment, the first-level vertical transmission structure 421 includes a die bonding mounting seat, a die bonding drive motor, a die bonding driving wheel, a die bonding synchronous belt, a die bonding driven wheel, and a die bonding transmission lead screw. The die bonding drive motor is fixed on the die bonding mounting seat. The die bonding driving wheel is connected to the die bonding drive motor. The die bonding driving wheel and the die bonding driven wheel are driven by the die bonding synchronous belt. The die bonding driven wheel is connected to the die bonding transmission lead screw. The second-level vertical transmission structure 422 is connected to the die bonding transmission lead screw. Through the transmission structure of the die bonding drive motor, the die bonding driving wheel, the die bonding synchronous belt, the die bonding driven wheel, and the die bonding transmission lead screw, the transmission efficiency is improved, making the installation more flexible.

[0039] As Figure 10As shown, in the technical solution of this embodiment, the second vertical transmission structure 422 has a die bonding threaded hole adapted to the die bonding transmission lead screw, and the die bonding transmission lead screw is disposed in the die bonding threaded hole. The above structure is compact and convenient to install. Specifically, a mutually cooperating slide rail and a slide groove are provided between the die bonding mounting base and the second vertical transmission structure 422, such a structure makes the cooperation between the first vertical transmission structure 421 and the second vertical transmission structure 422 more stable, and the first vertical transmission structure 421 and the second vertical transmission structure 422 are more stable when moving relatively. The robotic arm structure 42 further includes an induction sheet, a photoelectric sensor, an alignment camera, etc. A linear module (die bonding transmission lead screw) is installed on the left side of the servo motor (die bonding driving motor), the servo motor and the linear module are at the same parallel height, and a mounting plate and an adjusting plate are provided above, and the die bonding synchronous belt is used to connect the servo motor and the linear module. When the servo motor moves, it drives the synchronous belt and the synchronous belt pulley to move, and at the same time provides power to the linear module to make the linear module move up and down in the z direction. A protective cover is provided around the die bonding synchronous belt, the die bonding driving pulley and the die bonding driven pulley for protection, and a transparent acrylic plate is installed in front of the protective cover, and the tightness of the synchronous belt can be observed at any time. When it is found that the synchronous belt becomes loose, the adjusting plate and the adjusting block can be used for adjustment. The adjusting plate and the mounting plate are connected to each other by screws. When the synchronous belt becomes loose, the adjusting plate can be adjusted to the right side, and fixed by the adjusting block and the locking block (the left and right in this embodiment are the left and right when facing a person). Figure 10 when facing a person).

[0040] A slider is provided on the left side of the linear module. When the motor gives power to the power source, the slider drives the die bonding head structure 41 to move in the z direction. A module induction sheet is provided on the slider, and a photoelectric sensor is fixed on the linear module by a mounting base, which can limit the effective movement range of the second vertical transmission structure 422.

[0041] The die bonding head structure first moves in the z direction through the first vertical transmission structure 421, and then rotates through the precision rotating platform. The rotation range can be rotated 360 degrees according to requirements. A voice coil motor is fixed under the precision rotating platform by a connecting plate and a mounting block, and a suction nozzle is provided under the voice coil motor (a suction nozzle is provided on the die bonding head structure 41), and the crystal can be picked up and die bonded through the suction nozzle. A alignment camera is provided on the right side of the die bonding module 40. Before picking up and die bonding the crystal, calibration can be performed first through the alignment camera to improve the accuracy of picking up and die bonding the crystal. The suction nozzle provides vacuum through a micro joint, and a pressure gauge is provided above the mounting plate, and the adsorption pressure of the suction nozzle can be observed through the pressure gauge.

[0042] As Figure 9 and 10 shown, in the technical solution of this embodiment, the second vertical transmission structure 422 includes a voice coil motor, and the die bonding head structure 41 is connected to the voice coil motor. The voice coil motor has a large transmission thrust, a fast response time and high precision.

[0043] In the technical solution of this embodiment, the die bonding head 411 includes a die bonding head main body and a die bonding head mounting seat. The die bonding head mounting seat has a mounting hole, and the die bonding head main body is mounted in the mounting hole. The structures of the die bonding head main body and the die bonding head mounting seat are convenient for maintenance and for setting up mating structures. For example, a ferromagnetic body is provided on the die bonding head mounting seat.

[0044] As Figure 9 shown, in the technical solution of this embodiment, the die bonding head mounting seat includes a ferromagnetic body, a first mounting section, a limiting section, and a second mounting section. The limiting section is located between the first mounting section and the second mounting section. The ferromagnetic body is located on the side of the first mounting section away from the limiting section. The outer diameter of the limiting section is greater than the outer diameter of the first mounting section. The ferromagnetic body facilitates the mating connection between the die bonding head main body and the die bonding head mounting seat. The limiting section makes the bottom edge of the die bonding head mounting seat abut against the upper surface of the limiting section. The limiting section is a circular plate. The upper part of the first mounting section is frustum-shaped, and the lower part is cylindrical, as Figure 9 shown. The second mounting section is fixed to the die bonding head main body by a pin. The side wall of the second mounting end has a pin through hole, and the side wall of the die bonding head main body has a groove provided corresponding to the pin hole. The pin passes through the pin through hole and penetrates into the groove.

[0045] As Figure 8 shown, in the technical solution of this embodiment, the die bonding head connecting seat 412 includes a seat body and a connecting pipe. The connecting pipe is provided on the side wall of the seat body and can communicate with the die bonding head main body. The above structure is compact and the connection is convenient. The negative pressure adsorbed by the connecting pipe is between 0.1 Kpa and 0.8 Kpa.

[0046] As Figure 8 and Figure 9 shown, in the technical solution of this embodiment, the mounting hole extends from the end of the second mounting section away from the limiting section to the first mounting section. The side wall of the first mounting section has a communication hole, and the communication hole communicates the mounting hole and the connecting pipe. The above structure is compact and the installation is convenient. The die bonding head main body is a hollow pipe.

[0047] As Figure 8 and Figure 9 shown, in the technical solution of this embodiment, the die bonding head connecting seat 412 further includes a magnet. The seat body includes a receiving space, and the magnet is provided in the receiving space. The above structure is compact and the assembly and disassembly efficiency is relatively high. The magnet in this embodiment is a permanent magnet, and the ferromagnetic body is a permanent magnet. The connection between the die bonding head 411 and the die bonding head mounting seat is achieved by the attraction of the two magnets. When disassembling, the die bonding head 411 is removed from the die bonding head mounting seat by an external force. The magnet can also be an electromagnet. When it is necessary to disassemble, the power supply of the electromagnet is cut off, and the die bonding head 411 is removed under the action of gravity or an external force.

[0048] As Figure 8 and Figure 9As shown, in the technical solution of this embodiment, the ferromagnet and the first mounting section are located within the accommodation space, and there are mutually cooperating limiting portions between the first mounting section and the wall surface of the accommodation space. This enables a relatively high fitting accuracy between the die bonding head 411 and the die bonding head connecting seat 412. The first mounting section has a frustum of a cone that cooperates with the frustum of a cone section, so that the fitting accuracy between the seat body and the die bonding head 411 is even higher, and the processing cost of the above structure is relatively low. The accommodation space sequentially includes a first cylindrical section, a second cylindrical section, a frustum of a cone section, and a cylindrical section from the side far from the die bonding head 411 to the side close to the die bonding head 411, and the magnet is installed within the seat body. The side wall of the first mounting seat has an anti-fooling surface, the side wall of the seat body has a plane that cooperates with the anti-fooling surface, and there is a fixing hole at the side wall of the seat body corresponding to the anti-fooling surface. A pin shaft is used to fix the first mounting end to the seat body.

[0049] As Figure 8 and Figure 9 shown, in the technical solution of this embodiment, the die bonding module 40 further includes a die bonding head picking structure and a die bonding head storage structure 43, and both the die bonding head picking structure and the die bonding head storage structure 43 are arranged on the mounting frame module 10. The above structure further improves the automation degree of the die bonder. When it is necessary to replace the die bonding head 411, the die bonding head 411 is removed through the die bonding head picking structure, and then the die bonding head 411 of the die bonding head storage structure is automatically installed by magnetic force. The die bonding head picking structure can be a separately arranged structure or a system structure. For example, a positive-pressure gas is blown out through a connecting pipe, and the die bonding head 411 is removed by the acting force of the positive-pressure gas.

[0050] This application also provides a die bonder, including: a mounting frame module 10, a dispensing module 20, a waiting material module 30, a die bonding module 40, a blanking module 50, and a conveying module 60. The dispensing module 20 is arranged on the mounting frame module 10. The waiting material module 30 is arranged on the mounting frame module 10. The die bonding module 40 is arranged on the mounting frame module 10. The die bonding module 40 includes a die bonding head structure 41 and a robotic arm structure 42. The robotic arm is installed on the mounting frame module 10, the die bonding head structure 41 is installed on the robotic arm structure 42, and the robotic arm structure 42 can drive the die bonding head structure 41 to move. The blanking module 50 is arranged on the mounting frame module 10. The conveying module 60 is arranged on the mounting frame module 10 and can drive the carrier plate to move among the dispensing module 20, the waiting material module 30, the die bonding module 40, and the blanking module 50.

[0051] In the technical solution of this embodiment, the carrier is successively dispensed by the dispensing module 20 under the conveyance of the conveying module 60, and then enters the material waiting module 30 for inspection, such as inspecting whether the dispensing is qualified. After passing through the material waiting module 30, it enters the die bonding module 40 under the drive of the conveying module 60. After the die bonding module completes the die bonding work, it passes through the blanking module 50. Through the operation of the production line of this solution, dispensing, inspection, and die bonding are completed, thus greatly improving the working efficiency of the die bonder. The technical solution of this embodiment effectively solves the problems of low integration and working efficiency of the die bonder in the prior art. The carrier board includes a carrier board body and an object on the carrier board body.

[0052] As Figure 1 and Figure 2 shown, in the technical solution of this embodiment, the mounting frame module 10 includes a base assembly 11, a guide rail assembly 12, and a runner assembly 13. The guide rail assembly 12 is fixed on the base assembly 11, and the runner assembly 13 is movably arranged on the guide rail assembly 12. The carrier board can be supported on the runner assembly 13. The runner assembly 13 moves on the guide rail assembly 12, which can adapt to carrier boards of different sizes and models, so that the die bonder has stronger versatility. It should be noted that the extending direction of the guide rail assembly 12 is perpendicular to the extending direction of the runner assembly 13. The die bonder of this embodiment further includes a guiding structure, which is fixed on the mounting frame module 10. The runner assembly 13 and the guiding structure cooperate with each other, so that when the runner assembly 13 adjusts the width of the runner, the movement is more stable. There are multiple guide rail assemblies, and each guide rail assembly is adapted to the limit support frame structure 131 and is located at the bottom of the limit support frame structure 131.

[0053] As Figure 2 shown, in the technical solution of this embodiment, the runner assembly 13 includes a limit support frame structure 131. The limit support frame structure 131 includes a first limit support plate and a second limit support plate. There is an adjustable predetermined distance between the first limit support plate and the second limit support plate to form a runner. Both the first limit support plate and the second limit support plate extend along the moving direction of the carrier board. The limit structure includes a first limit support plate and a second limit support plate. By adjusting the distance between the first limit support plate and the second limit support plate, it is possible to adapt to carrier boards of different sizes. Such a structure has a low manufacturing cost and is convenient to operate. It should be noted that the guiding structure: multiple guiding rods, both the first limit support plate and the second limit support plate pass through each guiding rod, and the extending direction of each guiding rod is parallel to the guide rail assembly 12.

[0054] As Figure 2As shown, in the technical solution of this embodiment, the first limit support plate includes a first limit plate and a first support plate, the first support plate is located on the side of the first limit plate close to the second limit support plate, the upper surface of the first support plate is lower than the upper surface of the first limit plate to form a first step surface, and the second limit support plate includes a second limit plate and a second support plate, the second support plate is located on the side of the second limit plate close to the first limit support plate, and the upper surface of the second support plate is lower than the upper surface of the second limit plate to form a second step surface. The cooperation of the first step surface and the second step surface can realize the support of the carrier plate, so that the upward support force can be realized on the carrier plate, reducing the force on the conveying module 60. The side of the first limit plate and the side of the second limit plate cooperate to prevent the carrier plate from being separated from the flow channel, so that the carrier plate can be better moved along the predetermined track. The structure of the first limit support plate and the second limit support plate of this embodiment is simple and easy to operate. It should be noted that the height of the first step surface and the second step surface is the same. The first limiting plate includes a first limiting plate segment, a second limiting plate segment, a third limiting plate segment and a fourth limiting plate segment, and the second limiting plate includes a fifth limiting plate segment, a sixth limiting plate segment, a seventh limiting plate segment and an eighth limiting plate segment. The first support plate includes a first support plate segment, a second support plate segment, a third support plate segment and a fourth support plate segment, and the second support plate includes a fifth support plate segment, a sixth support plate segment, a seventh support plate segment and an eighth support plate segment. The first limiting plate segment and the first support plate segment are connected together, the second limiting plate segment and the second support plate segment are connected together, the third limiting plate segment and the third support plate segment are connected together, and so on. The first limiting plate section, the first supporting plate section, the fifth limiting plate section and the fifth supporting plate section have the same length and are all arranged corresponding to the dispensing module 20; the second limiting plate section, the second supporting plate section, the sixth limiting plate section and the sixth supporting plate section have the same length and are arranged corresponding to the waiting module 30; the third limiting plate section, the third supporting plate section, the seventh limiting plate section and the seventh supporting plate section have the same length and are arranged corresponding to the crystal fixing module 40; the fourth limiting plate section, the fourth supporting plate section, the eighth limiting plate section and the eighth supporting plate section have the same length and are arranged corresponding to the unloading module 50.

[0055] like Figure 2 and Figure 4 As shown, in the technical solution of this embodiment, the flow channel assembly 13 also includes a flow channel driving structure 132, and the flow channel driving structure 132 is connected to the limit support frame structure 131 to drive the limit support frame structure 131 to change the predetermined distance of the flow channel. The above structure is easy to set and operate.

[0056] like Figure 2 and Figure 4As shown, in the technical solution of this embodiment, the runner driving structure 132 includes a first motor, a lead screw, and two connecting parts. The output shaft of the first motor is connected to the lead screw, and both ends of the lead screw are threadedly connected to the two connecting parts respectively. The first limit support plate and the second limit support plate are fixedly connected to the two connecting parts respectively. The runner driving structure 132 with the above structure has a relatively low processing cost and applies a relatively balanced force. Specifically, both ends of the lead screw connected to the two connecting parts have the same thread, so that the force applied by the lead screw to the two connecting parts is relatively balanced, and the two connecting parts can be moved synchronously and simultaneously. The two connecting parts drive the first limit support plate and the second limit support plate to move synchronously and simultaneously respectively. When the size of the carrier plate changes and the width of the runner needs to be adjusted, the first limit plate and the second limit plate on both sides of the carrier plate lean towards the carrier plate simultaneously and synchronously. In this way, the working precision is improved both in terms of force and moving distance.

[0057] As Figure 1 and Figure 3 shown, in the technical solution of this embodiment, the die bonder further includes a first pressing plate structure 70 and a first top plate structure 80. The first pressing plate structure 70 is fixedly connected to the limit support frame. The first top plate structure 80 is arranged on the mounting frame module 10. The first pressing plate structure 70 and the first top plate structure 80 are arranged correspondingly, and the first pressing plate structure 70 cooperates with the dispensing module 20. By fixing the carrier plate through the first pressing plate structure 70 and the first top plate structure 80, multi-directional limiting and fixing of the carrier plate can be achieved, which further ensures the precision during the operation of the carrier plate. The second pressing plate structure and the second top plate structure are arranged at corresponding positions of the die bonding module 40.

[0058] As Figure 1 、 Figure 3 and Figure 4 shown, in the technical solution of this embodiment, the first top plate structure 80 includes a second motor, a first cam, a first transmission part, and a first top plate. The second motor is connected to the first cam to drive the first cam to rotate. The first cam cooperates with the bottom of the first transmission part, and the top of the first transmission part is fixedly connected to the first top plate. The first top plate and the first pressing plate structure 70 have a pressing position where they approach each other or a separating position where they move away from each other. The structure of the first cam ensures that when the first top plate presses the carrier plate, the applied force is relatively gentle. Similarly, when the first top plate moves from the pressing position to the separating position, it also leaves gently.

[0059] As Figure 4As shown, in the technical solution of this embodiment, the first transmission part includes a first mating block and a first connecting plate. The bottom surface of the first mating block has an arc surface that mates with the first cam. The bottom surface of the first mating block having an arc surface that mates with the first cam results in a relatively large contact surface between the first mating block and the first cam, so that the cooperation between the first mating block and the first cam is relatively stable. In addition, the structure of the first mating block being an arc surface can also ensure that the first transmission part moves at the desired speed.

[0060] In the technical solution of this embodiment, the first top plate structure 80 further includes a first elastic member. One end of the first elastic member is connected to the base assembly 11, and the second end of the first elastic member is connected to the first top plate structure 80 so that the first transmission part is in contact with the first cam. The setting of the first elastic member ensures that the first cam and the first mating block can have a pressing force against each other under the action of an external force, that is, the first transmission part always has a downward acting force under the action of the spring force. The first elastic member includes two springs, and the two springs are symmetrically located on both sides of the first cam to make the acting force between the first transmission part and the first cam balanced and uniform. Specifically, the two springs are in a stretched state.

[0061] As Figure 3 shown, in the technical solution of this embodiment, the first pressing plate structure 70 includes a first pressing plate 71 and a second elastic member 72. The second elastic member 72 is arranged on the first pressing plate 71. When the first top plate and the first pressing plate structure 70 are in the pressing position, the first top plate and the second elastic member 72 jointly press the carrier plate. The setting of the second elastic member 72 enables the carrier plate not to be rigidly pressed when jointly pressed by the first top plate structure 80 and the first pressing plate structure 70, and the carrier plate has a buffering acting force. Such a structure ensures that the carrier plate is not easily damaged.

[0062] As Figure 3 shown, in the technical solution of this embodiment, the second elastic member 72 includes a first elastic sheet, and the first elastic sheet is fixed on the first pressing plate 71. The above structure is compact and convenient to use.

[0063] As Figure 3 shown, in the technical solution of this embodiment, the first elastic sheet includes a first connecting plate and a first pressing foot. The first end of the first pressing foot is connected to the side of the first connecting plate. The first pressing plate 71 has a hollow hole, and the first connecting plate is connected to the surface of the first pressing plate 71 away from the first top plate structure 80, and the second end of the first pressing foot passes through the hollow hole. The above structure is compact and has a lower processing cost. Specifically, the first connecting plate and the first pressing foot are of an integrally formed structure.

[0064] As Figure 3As shown, in the technical solution of this embodiment, the angle between the plane of the first connecting plate and the plane of the first pressing foot is greater than 90° and less than 180°. The second end of the first pressing foot has an outward flanging, and the flanging is connected to the first pressing foot through an arc connecting portion. The angle between the plane of the first connecting plate and the plane of the first pressing foot is greater than 90° and less than 180°, which ensures the convenience of using the first elastic piece. For example, when the first elastic piece moves downward, the force and elastic force on the carrier plate can be realized by increasing the angle between the plane of the first connecting plate and the plane of the first pressing foot. The second elastic piece includes a second connecting plate and two second pressing feet. The two second pressing feet are oppositely arranged on both sides of the second connecting plate. The structures of the first connecting plate and the second connecting plate are the same, and the structures of the first pressing foot and the second pressing foot are the same. When there are multiple hollow holes, adjacent hollow holes have connecting bridges, and the second connecting plate is connected to the connecting bridge. Both ends of the second connecting plate have second pressing feet, so that both sides of the second connecting plate can elastically press the carrier plate. The first elastic piece is used for the positions of the hollow holes at both ends, and the second elastic piece is used for the position of the connecting bridge in the middle of two adjacent hollow holes.

[0065] In the technical solution of this embodiment, the blanking module 50 includes an anti-static push rod, which pushes the carrier plate away from the flow channel assembly, and the anti-static push rod can also prevent static electricity from damaging the carrier plate.

[0066] As Figure 1 shown, in the technical solution of this embodiment, the conveying module 60 includes a third motor, a conveyor belt, a driven wheel and a carrier plate clamping structure. The third motor and the driven wheel are respectively arranged at both ends of the installation module. The conveyor belt is matched with the third motor and the driven wheel, and the carrier plate clamping structure is arranged on the conveyor belt. The conveyor belt can ensure that the span of the conveying module 60 is relatively large. In the technical solution of this embodiment, there can be multiple carrier plate clamping structures, and multiple carrier plate clamping structures improve the efficiency. For example, the dispensing module 20 and the die bonding module 40 can work simultaneously and move different carrier plates at the same time. The second top plate structure includes a fourth motor, a second cam, a second transmission part and a second top plate.

[0067] In the technical solution of this embodiment, the carrier plate clamping structure includes a clamping mounting seat, a fixed clamping part, a movable clamping part and a clamping driving part. The clamping mounting seat is mounted on the conveyor belt, the fixed clamping part is fixedly arranged on the clamping mounting seat, the clamping driving part is arranged on the clamping mounting seat, and the clamping driving part is connected to the movable clamping part to drive the movable clamping part to approach the fixed clamping part to be in the clamping position, or to drive the movable clamping part to move away from the fixed clamping part to be in the loosening position. The position where the carrier plate clamping structure cooperates with the carrier plate is made of PEEK (polyether ether ketone) material, and the carrier plate clamping structure with the above structure is convenient to operate. The movable clamping part can be connected to a cylinder, a hydraulic cylinder or an electric push rod.

[0068] As Figures 5 to 9As shown, in the technical solution of this embodiment, the die bonding head structure 41 includes a die bonding head 411 and a die bonding head connecting base 412. The die bonding head connecting base 412 is fixed on the robotic arm structure 42, and the die bonding head 411 is magnetically mounted on the die bonding head connecting base 412. The robotic arm structure 42 can drive the die bonding head 411 to work, making the die bonding work more accurate and with a higher degree of automation. The die bonding head 411 and the die bonding head connecting base 412 are magnetically connected, and such a connection method greatly improves the assembly and disassembly efficiency. The die bonding head 411 and the die bonding head connecting base 412 are attracted and fixed by magnetic force, reducing processes such as installing and removing screws.

[0069] It should be noted that the die bonder of this embodiment has multiple cameras. For example, a camera (which can also be a video camera according to needs) is arranged at the position of the material waiting module 30 to detect the result of dispensing. Cameras are arranged in both the dispensing module 20 and the die bonding module to detect dispensing and die bonding. This embodiment also has a movable camera that can be moved to the position to be detected according to needs.

[0070] It should be noted that in this article, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including a..." does not exclude the existence of additional identical elements in the process, method, article or device including the said element.

[0071] The above are only specific embodiments of the present invention, enabling those skilled in the art to understand or implement the present invention. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to these embodiments shown herein, but rather to the broadest scope consistent with the principles and novel features claimed herein.

Claims

1. A die bonder, characterized in that, including a die bonding module (40) and a mounting bracket module (10); a dispensing module (20), which is arranged on the mounting bracket module (10); a material waiting module (30), which is arranged on the mounting bracket module (10); a blanking module (50), which is arranged on the mounting bracket module (10); a conveying module (60), which is arranged on the mounting bracket module (10) and can drive a carrier board to move among the dispensing module (20), the material waiting module (30), the die bonding module (40) and the blanking module (50). The mounting bracket module (10) includes a base assembly (11), a guide rail assembly (12) and a runner assembly (13). The guide rail assembly (12) is fixed on the base assembly (11). The runner assembly (13) is movably arranged on the guide rail assembly (12). The carrier board can be supported on the runner assembly (13). The runner assembly (13) includes a limit support frame structure (131) and a runner driving structure (132) connected to the limit support frame structure (131). The limit support frame structure (131) includes a first limit support plate and a second limit support plate. A adjustable predetermined distance is provided between the first limit support plate and the second limit support plate to form a runner. Both the first limit support plate and the second limit support plate extend along the moving direction of the carrier board. The runner driving structure (132) includes a first motor, a lead screw and two connecting parts. The output shaft of the first motor is connected to the lead screw. The two ends of the lead screw are respectively connected to the two connecting parts through threads. The first limit support plate and the second limit support plate are respectively fixedly connected to the two connecting parts; a first pressing plate structure (70) and a first top plate structure (80). The first pressing plate structure (70) is fixedly connected to the limit support frame structure (131). The first top plate structure (80) is arranged on the mounting bracket module (10). The first pressing plate structure (70) is arranged corresponding to the first top plate structure (80). The first pressing plate structure (70) cooperates with the dispensing module (20).

2. The die bonder according to claim 1, wherein The die bonding module (40) includes: a die bonding head structure (41); a robotic arm structure (42), which includes a first-level vertical transmission structure (421) and a second-level vertical transmission structure (422). The second-level vertical transmission structure (422) is installed on the first-level vertical transmission structure (421). The die bonding head structure (41) is installed on the second-level vertical transmission structure (422).

3. The die bonder according to claim 2, characterized in that, The first-level vertical transmission structure (421) includes a die bonding mounting seat, a die bonding driving motor, a die bonding driving pulley, a die bonding synchronous belt, a die bonding driven pulley and a die bonding transmission lead screw. The die bonding driving motor is fixed on the die bonding mounting seat. The die bonding driving pulley is connected to the die bonding driving motor. The die bonding driving pulley and the die bonding driven pulley are driven by the die bonding synchronous belt. The die bonding driven pulley is connected to the die bonding transmission lead screw. The second-level vertical transmission structure (422) is connected to the die bonding transmission lead screw.

4. The die bonder according to claim 3, characterized in that, The secondary vertical transmission structure (422) has a die bonding threaded hole adapted to the die bonding transmission lead screw, and the die bonding transmission lead screw is disposed in the die bonding threaded hole.

5. The die bonder according to claim 2, characterized in that, The secondary vertical transmission structure (422) includes a voice coil motor, and the die bonding head structure (41) is connected to the voice coil motor.

6. The die bonder according to any one of claims 2 to 5, characterized in that, The die bonding head structure (41) includes a die bonding head (411) and a die bonding head connecting seat (412). The die bonding head connecting seat (412) is fixed on the robotic arm structure (42), and the die bonding head (411) is magnetically mounted on the die bonding head connecting seat (412).

7. The die bonder according to claim 6, wherein, The die bonding head (411) includes a die bonding head body and a die bonding head mounting seat. The die bonding head mounting seat has a mounting hole, and the die bonding head body is mounted in the mounting hole.

8. The die bonder according to claim 7, wherein, The die bonding head mounting seat includes a ferromagnetic body, a first mounting section, a limiting section, and a second mounting section. The limiting section is located between the first mounting section and the second mounting section. The ferromagnetic body is located on a side of the first mounting section away from the limiting section, and an outer diameter of the limiting section is greater than an outer diameter of the first mounting section.

9. The die bonder according to claim 8, wherein The die bonding head connecting seat (412) includes a seat body and a connecting pipe. The connecting pipe is disposed on a side wall of the seat body and can communicate with the die bonding head body.

10. The die bonder according to claim 9, wherein, The mounting hole extends from an end of the second mounting section away from the limiting section to the first mounting section. A side wall of the first mounting section has a communication hole that communicates the mounting hole and the connecting pipe.

11. The die bonder according to claim 10, wherein The die bonding head connecting seat (412) further includes a magnet. The seat body includes a receiving space, and the magnet is disposed in the receiving space.

12. The die bonder according to claim 11, wherein, The ferromagnetic body and the first mounting section are located in the receiving space, and there are cooperating limiting portions between the first mounting section and a wall surface of the receiving space.

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