Nanoparticle resuspension liquid cooling device and cooling method

Abstract

The present invention discloses a nanoparticle resuspension liquid cooling device and a cooling method. The liquid cooling device comprises a heat dissipation shell and an electrode arranged in the heat dissipation shell. The inner cavity of the heat dissipation shell is filled with a nano suspension. The liquid level of the nano suspension in the heat dissipation shell is higher or lower than the horizontal plane height of the electrode. After the lower surface of the heat dissipation shell obtains heat, the heat is transferred to the inner cavity of the heat dissipation shell to exchange heat with the nano suspension. The nano suspension stored in the heat dissipation shell gradually rises due to heat vaporization; a high voltage is loaded on the electrode to form an electric field between the electrode and the upper cooling clamping plate and the lower cooling clamping plate respectively, and a potential difference is generated between the electrode and the upper cooling clamping plate and the lower cooling clamping plate, so that the nanoparticles in the nano suspension are accelerated to suspend and rise again under the action of the electric field, and the heat of the nanoparticles in the nano suspension is transferred to the upper cooling clamping plate for heat exchange, thereby achieving the purpose of heat dissipation and cooling.

Description

Technical Field

[0001] The invention belongs to the field of electronic component cooling, in particular to the field of heat pipe cooling technology, and more particularly to a nanoparticle resuspension liquid cooling device and a cooling method. Background Art

[0002] In the era of rapid information development, as the integration of transistors becomes higher and higher, the requirements for processor power density and computing speed are getting higher and higher, making the processor power consumption larger and requiring higher cooling requirements. In response to the continuous increase in power density and the need for stable and reliable operation, many mainstream server manufacturers have begun to launch plate-type liquid cooling products. However, the existing cold plate design is designed for a specific processor layout, which leads to its limitations, and most of these cooling devices use air cooling mode, which has poor cooling effect. Liquid cooling is better than air cooling. The application of liquid cooling technology meets the higher and more stringent requirements of various IT equipment in data centers, and drives the continuous innovation and optimization design of various components. This is a continuous progress for the entire chain. Liquid cooling solutions have a long history of application in military industry, high-speed rail, automobiles and other fields. The application of liquid cooling in automobiles is the most common. It effectively dissipates heat into the air to prevent engine overheating. With the development of automobile electrification, the innovation of battery thermal management applications has attracted great attention to liquid cooling. Solving battery cooling to improve energy efficiency can effectively accelerate the process of automobile electrification. At the same time, doubling the output of power batteries of the same size can save a lot of costs. This requires a given cooling device design to improve system efficiency, which can bring lower losses, reduce thermal stress on devices, and help extend service life. Driven by 5G technology, mainstream processor manufacturers will successively launch high-power processors with next-generation architectures, which will gradually be replaced by high-density processors. The heat dissipation design of high heat flux density processors is particularly urgent and important. Therefore, heat pipe conduction heat dissipation elements are considered to be an effective solution to the current heat dissipation problem of electronic devices. With its advantages of high thermal conductivity, reliable operation, simple structure, and uniform temperature, they have been widely used in industry, aviation, national defense, and medical fields. However, during the heat dissipation process of the heat pipe, a large amount of heat is easily accumulated inside, causing the nanofluid working medium inside the heat pipe to dry out or be insufficiently supplied, which in turn causes a sharp increase in temperature, thereby affecting the working performance of the electronic device. Summary of the invention

[0003] The purpose of the present invention is to provide a nanoparticle resuspension liquid cooling device and cooling method. The present invention can use the electric field to make the nanoparticles in the nanofluid in the cooling device resuspended in the base liquid, so that the nanofluid maintains good suspension, and well solves the problem of nanofluid working fluid drying or insufficient supply, and avoids the nanofluid working fluid from easily agglomerating and depositing in the cooling cavity after working for a long time, thereby improving the cooling effect of the cooling device. In order to achieve the above purpose, the present invention adopts the following technical effects:

[0004] According to one aspect of the present invention, a nanoparticle resuspension liquid cooling device is provided, characterized in that: the liquid cooling device includes a heat dissipation shell and an electrode arranged through the heat dissipation shell, one end of the electrode is arranged in one end of the heat dissipation shell, and the other end of the electrode extends horizontally outward from the other end of the heat dissipation shell, the inner cavity of the heat dissipation shell is filled with a nano suspension, the liquid level of the nano suspension in the heat dissipation shell is higher or lower than the horizontal plane height of the electrode, annular openings are respectively opened on the upper surface and the lower surface of the heat dissipation shell, and sealing covers are arranged at the annular openings on the upper surface and the lower surface of the heat dissipation shell.

[0005] The above scheme is further preferred, the heat dissipation shell is a flat hollow tube, an upper cooling clamp is tightly arranged on the sealing cover, a lower cooling clamp is arranged on the upper surface of the heat cavity, and the electrode runs through the heat dissipation shell parallel to the upper cooling clamp and the lower cooling clamp.

[0006] The above scheme is further preferred, in which output connectors and input connectors respectively connected to the inner cavity of the heat dissipation shell are arranged on the upper surfaces of both ends of the upper cooling clamp plate, a liquid circulation unit is arranged outside the heat dissipation shell, the input end of the liquid circulation unit is connected to the output connector through an output pipe, and the output end of the liquid circulation unit is connected to the input connector through an input pipe, electrodes extending from both ends are arranged in the heat dissipation shell, and the heat dissipation shell is filled with nano suspension.

[0007] The above scheme is further preferred, wherein the liquid circulation unit comprises a radiator, a hydraulic pump and a liquid storage tank, wherein the nanosuspension is stored in the liquid storage tank, the input end of the radiator is connected to the output connector via an output pipe, the output end of the radiator is connected to the input end of the liquid storage tank via a hydraulic pump, and the output end of the liquid storage tank is connected to the input connector via an input pipe.

[0008] The above solution is further preferred in that a hydraulic regulating valve is provided on the output pipe 10 at a side close to the output connector.

[0009] The above scheme is further preferred, that the liquid cooling device also includes a vacuum regulating unit, the vacuum regulating unit includes a vacuum pump, and one or more vacuum connectors connected to the interior of the heat dissipation shell are arranged on the surface of the upper cooling clamping plate between the output connector and the input connector, and the vacuum connector is connected to the input end of the vacuum pump through an air pipe.

[0010] The above scheme is further preferred that a gas pipe connected to the one-way control valve is provided on the gas pipe between the vacuum joint and the input end of the vacuum pump.

[0011] According to another aspect of the present invention, a cooling method using a nanoparticle resuspension liquid cooling device of the present invention comprises the following steps: the lower surface of the heat dissipation shell acquires heat, and the heat is conducted to the inner cavity of the heat dissipation shell to exchange heat with the nano-suspension, and the nano-suspension stored in the heat dissipation shell gradually rises due to heat vaporization; a high voltage of 1kV-10kV is loaded on the electrode, so that an electric field is formed between the electrode and the upper cooling clamp plate and the lower cooling clamp plate respectively, and an electric potential difference is generated between the electrode and the upper cooling clamp plate and the lower cooling clamp plate, so that the nanoparticles in the nano-suspension deposited in the heat dissipation shell are accelerated to suspend and rise again under the action of the electric field, and the heat of the nanoparticles in the nano-suspension is conducted to the upper cooling clamp plate for heat exchange, thereby achieving the purpose of heat dissipation and cooling.

[0012] The above scheme is further preferred, and the cooling method also includes the following steps: when the nanosuspension stored in the heat dissipation shell gradually rises due to vaporization caused by heat, the liquid circulation unit arranged outside the heat dissipation shell is started, and the nanosuspension stored in the liquid storage tank is pressed into the heat dissipation shell along the input pipe through the hydraulic pump, so that the hot liquid in the nanosuspension is quickly mixed with the cold liquid to cool and dissipate heat; then the flow rate of the nanosuspension pressed into the heat dissipation shell is adjusted by the hydraulic regulating valve, and the pressed nanosuspension is drawn out along the output pipe after being heated in the heat dissipation shell, and the heated nanosuspension is sent to the radiator for cooling, and then refluxes to the liquid storage tank, and is sent to the heat dissipation shell again for the next cycle cooling.

[0013] The above scheme is further preferred, and the cooling method also includes the following steps: after the pressed nano-suspension is heated in the heat dissipation shell and then drawn out along the output pipe, the vacuum adjustment unit is started according to the temperature of the surface of the heat dissipation shell, and the hot air generated when the nano-suspension in the heat dissipation shell is heated and vaporized is extracted by turning on the vacuum pump of the vacuum adjustment unit, and the vacuum state in the heat dissipation shell is adjusted, so that the nano-suspension in the heat dissipation shell is accelerated to vaporize, thereby instantly taking away a large amount of heat in the heat dissipation shell.

[0014] In summary, the present invention adopts the above technical solution, and the present invention has the following technical effects:

[0015] The present invention can effectively make the deposited nanoparticles resuspended in the base liquid under the action of the external electric field, so that the nanofluid maintains good suspension; the nanofluid inside the cooling device can perform natural convection to achieve the purpose of heat exchange, and the non-evaporable substances can be discharged by turning on the vacuum pump, so that the whole device is in a vacuum state, the boiling point of the liquid is reduced, and the nanofluid (cooling medium) is converted into a gas-liquid two-phase state to quickly take away a large amount of heat, and quickly reach the working temperature required by the heat source to be cooled. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic structural diagram of a first embodiment of a nanoparticle resuspension liquid cooling device of the present invention;

[0017] Figure 2 It is a schematic cross-sectional structure diagram of a first embodiment of a nanoparticle resuspension liquid cooling device of the present invention;

[0018] Figure 3 It is a schematic structural diagram of a second embodiment of a nanoparticle resuspension liquid cooling device of the present invention;

[0019] Figure 4 is a schematic diagram of an exploded structure of a second embodiment of a nanoparticle resuspension liquid cooling device of the present invention;

[0020] In the accompanying drawings, there are heat dissipation housing 1, upper cooling splint 2, lower cooling splint 3, electrode 4, output connector 5, input connector 6, radiator 7, hydraulic pump 8, liquid storage tank 9, output pipe 10, input pipe 11, hydraulic regulating valve 12, vacuum pump 13, vacuum connector 14, air pipe 15, one-way control valve 16, bolt 20, nano suspension 100, annular opening 101, and sealing cover 102. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and preferred embodiments. However, it should be noted that many details listed in the specification are only for the purpose of enabling the reader to have a thorough understanding of one or more aspects of the present invention, and these aspects of the present invention can be implemented even without these specific details.

[0022] Combination Figure 1 and Figure 2As shown, according to a nanoparticle resuspension liquid cooling device of the present invention, the liquid cooling device comprises a heat dissipation shell 1 and an electrode 4 which is arranged through the heat dissipation shell 1, one end of the electrode 4 is arranged in one end of the heat dissipation shell 1, and the other end of the electrode 4 extends horizontally outward from the other end of the heat dissipation shell 1, and the inner cavity of the heat dissipation shell 1 is filled with a nano suspension 100, and the liquid level of the nano suspension 100 in the heat dissipation shell 1 is higher or lower than the horizontal plane height of the electrode 4, and the electrode 4 is in insulating contact with the heat dissipation shell 1, and the heat dissipation shell 1 is made of high temperature resistant material, and the electrode 4 is passed through the cavity of the heat dissipation shell 1 horizontally, and a high voltage is applied to the outside of the electrode, so that an electric field is generated between the electrode 4 and the inner wall of the heat dissipation shell 1, and the zero potential on the electrode 4 and the inner wall (the outer wall is grounded) of the heat dissipation shell 1 forms an electric Potential difference, the nanoparticles in the nanosuspension 100 are acted upon by the Coulomb force in the electric field environment, and the nanoparticles are suspended in the liquid, which increases the heat exchange efficiency. At the same time, due to the relationship of the external electric field, the temperature field, velocity field and electric field inside the heat dissipation shell 1 have a coupling effect on the internal liquid. The nanoparticles in the nanosuspension 100 have a complex force relationship. By changing the electric field, the nanoparticles in the nanosuspension 100 can move more violently, and the electric field nanoparticles can be resuspended and move in a predetermined direction under the action of the electric field, thereby achieving the effect of enhanced heat exchange; it is prevented that the nanosuspension working fluid is easily deposited in the heat dissipation shell 1 due to agglomeration after working for a long time, thereby improving the heat dissipation and cooling performance of the heat dissipation shell 1, and can well solve the problem of drying out or insufficient supply of the nanofluid working fluid, thereby ensuring the normal and efficient operation of the heat pipe. In the present invention, the nano suspension 100 is composed of a base liquid and nano powders, the particle size of the nano powders is 10nm-100nm, preferably 10nm-50nm, the base liquid includes but is not limited to refrigerants, transformer oil, liquid nitrogen, liquid carbon dioxide, etc., the nano powders are composed of nano metal powders, nano metal oxide powders and nano non-metallic nanoparticles, the nano metal oxide powders can be selected from nano aluminum powders, nano copper powders, etc., the nano metal oxide powders can be selected from nano aluminum oxide powders, nano magnesium oxide powders, nano ferroferric oxide powders and other nanoparticles, and the non-metal oxide powders can be selected from nano silicon dioxide silicon powders or nano silicon carbide powders and other nanoparticles. Due to the presence of an external electric field, the deposited nanoparticles can be effectively suspended in the base liquid again, and maintain good suspension during the operation of the device.

[0023] In the present invention, Figure 1 and Figure 2As shown, the heat dissipation housing 1 is a flat hollow tube, and an annular opening 101 is respectively opened on the upper surface and the lower surface of the heat dissipation housing 1, and a sealing cover 102 is arranged at the annular opening 101 on the upper surface and the lower surface of the heat dissipation housing 1, and an upper cooling clamping plate 2 is closely arranged on the sealing cover 102, and a lower cooling clamping plate 3 is arranged on the upper surface of the heat cavity 1, and the electrode 4 is parallel to the upper cooling clamping plate 2 and the lower cooling clamping plate 3 and passes through the heat dissipation housing 1. The inner wall of the sealing cover 102 is grid-shaped, which ensures internal sealing while increasing the contact area with the nano suspension 100, and is also convenient for installing the upper cooling clamping plate 2. The cooling plate 2 and the lower cooling plate 3 are provided; the upper surfaces of both ends of the upper cooling plate 2 are provided with output connectors 5 and input connectors 6 respectively connected to the inner cavity of the heat dissipation housing 1; a liquid circulation unit is provided outside the heat dissipation housing 1; the input end of the liquid circulation unit is connected to the output connector 5 through an output pipe 10; the output end of the liquid circulation unit is connected to the input connector 6 through an input pipe 11; electrodes 4 extending from both ends are provided in the heat dissipation housing 1; the heat dissipation housing 1 is filled with a nano suspension 100; the sealing cover 102 is made of a material with good thermal conductivity, and the sealing cover 102 is provided with a sealing cover 11; ... 02 The nano suspension 100 is sealed in the heat dissipation housing 1, and then the corresponding sealing cover plate 102 is fixed in the annular opening 101 of the heat dissipation housing 1 by the upper cooling clamp plate 2 and the lower cooling clamp plate 3 on the upper and lower surfaces of the heat dissipation housing 1. The electrode 4 is in the form of but not limited to a wire electrode, a needle electrode, etc., and different electrodes 4 can be loaded to form a uniform electric field or a non-uniform electric field to improve the heat exchange efficiency of the device. The upper cooling clamp plate 2 and the lower cooling clamp plate 3 are grounded respectively, and the upper cooling clamp plate 2 and the lower cooling clamp plate 3 are made of metal plates with good thermal conductivity, which can effectively reduce the accumulation of heat. The upper cooling clamp plate 2 and the lower cooling clamp plate 3 are fixed with bolts 20, so that the sealing of the whole device can be ensured; after applying a high voltage to the electrode 4 and grounding the upper and lower cooling clamp plates, a higher potential difference is formed between the line electrode and the two cooling clamp plates. This potential difference acts on the nanoparticles in the nanosuspension 100, which helps the nanoparticles deposited inside to be suspended again, which well ensures the reuse of the nanofluid inside the liquid. The nanosuspension 100 is used as a cooling medium inside the heat dissipation housing 1, so that the recycling of the cooling medium is increased and material loss is reduced.When the device to be cooled is cooled, the lower surface of the heat dissipation housing 1 is placed close to the cooling surface of the device to be cooled, and the heat (Heating) generated by the operation of the device to be cooled is transferred to the cooling surface (lower cooling clamp 3), and then the nano suspension 100 takes away the heat when heated and rises to the upper cooling clamp 2 for cooling (Cooling). The cooling medium of the nano suspension 100 contacts the heat source to be cooled through the heat conductive medium (upper cooling clamp 2), which can increase the thermal contact area between the surface of the cooling clamp 2 and the heat source to be cooled. The contact surface with the heat source to be cooled can be designed in different shapes or sizes to adapt to different shapes or The heat source to be cooled has a size. In the present invention, the heat transfer efficiency of the device can be improved by adjusting the voltage size, voltage form (including but not limited to square wave voltage, sine wave voltage, periodic alternating voltage) and nano suspension 100 (nanofluid) concentration loaded on the electrode 4. Since there is a difference between positive and negative voltages in the external electric field, the electrode 4 serves as the positive electrode, and the upper cooling clamp plate 2 and the lower cooling clamp plate 3 serve as the negative electrode. When the external voltage changes periodically, a periodically changing electric field is generated between the electrode 4 and the upper and lower clamp plates. The stress condition of the nanoparticles is constantly changing, which helps to suspend the nanoparticles while increasing liquid disturbance, thereby enhancing heat transfer.

[0024] In the present invention, combined with Figure 1 , Figure 3 and Figure 4 The liquid circulation unit comprises a radiator 7, a hydraulic pump 8 and a liquid storage tank 9, wherein a nano suspension 100 is stored in the liquid storage tank 9, wherein the input end of the radiator 7 is connected to the output connector 5 via an output pipe 10, wherein the output end of the radiator 7 is connected to the input end of the liquid storage tank 9 via a hydraulic pump 8, wherein the output end of the liquid storage tank 9 is connected to the input connector 6 via an input pipe 11, wherein a hydraulic regulating valve 12 is arranged on the output pipe 10 close to the output connector 5, wherein the hydraulic pump 8 does not operate when the power is off, and the electrode 4 does not load high voltage electricity; before starting the liquid circulation unit, the nano suspension 100 is firstly filled into the interior of the device, and when the device is running, the hydraulic pump 8 is turned on so that the nano fluid (nano suspension 100) ) fills the entire device pipeline, and then a high voltage is applied to the linear electrode 4, and the upper and lower cooling clamps are grounded. When the heat dissipation shell 1 absorbs the heat of the cooled device, a part of the heat of the nano suspension 100 inside the heat dissipation shell 1 is heated and vaporized and rises to the upper cooling clamp 2 for cooling, and a part of the heat of the nano fluid (nano suspension 100) flows into the radiator 7 along the output pipe 10 for cooling. The radiator 7 has a coil structure inside, and the radiator can dissipate heat through a constant temperature water bath, natural air cooling or an air cooler. The nano fluid (nano suspension 100) cooled in the radiator 7 flows back to the liquid storage tank 9 again, and then enters the next heat dissipation cooling cycle, so that the cooled device works within a suitable temperature range.

[0025] In the present invention, combined Figure 1 , Figure 3 The liquid cooling device also includes a vacuum regulating unit, which includes a vacuum pump 13. The vacuum pump 13, the radiator 7 and the hydraulic pump 8 should all adopt silent devices to avoid noise as much as possible. One or more vacuum joints 14 connected to the inside of the heat dissipation shell 1 are arranged on the surface of the upper cooling clamping plate 2 between the output joint 5 and the input joint 6. The vacuum joint 13 is connected to the input end of the vacuum pump 13 through an air pipe 15. The air pipe 15 between the vacuum joint 13 and the input end of the vacuum pump 13 is provided with a one-way control valve 16 connected to the one-way control valve 16; in some situations where rapid cooling is required, the vacuum pump 13 can be turned on to make the inside of the heat dissipation shell 1 and the pipeline in a vacuum state. The one-way control valve 16 can effectively prevent the liquid inside the device from flowing back into the vacuum pump 13. The use of the vacuum pump 13 has certain requirements on the true pressure resistance of the pipeline and the heat dissipation shell 1. When the vacuum pump 13 is running to maintain the vacuum state inside the heat dissipation housing 1, the hydraulic pump 8 is turned on to circulate the liquid. The boiling point of the liquid in the vacuum state is reduced, which makes it easier for the liquid to boil. The liquid evaporates and takes away a lot of heat, causing the temperature of the cooling surface to drop rapidly. The generated gas and liquid are cooled by the radiator 7 and flow back to the liquid storage tank 9, which is a heat dissipation cycle. For some situations with lower heat dissipation requirements, the hydraulic pump 8 can be turned off so that the device can perform natural convection heat exchange when the hydraulic pump 8 is turned off to reduce energy loss.

[0026] According to another aspect of the present invention, Figure 1 , Figure 3 and Figure 4, a cooling method of a nanoparticle resuspension liquid cooling device according to the present invention: comprising the following steps: the lower surface of the heat dissipation housing 1 obtains heat, and the heat is transferred to the inner cavity of the heat dissipation housing 1 to exchange heat with the nano suspension 100, and the nano suspension 100 stored in the heat dissipation housing 1 gradually rises due to heat vaporization; a 1kV-10kV high voltage is loaded on the electrode 4, so that an electric field is formed between the electrode 4 and the upper cooling clamp plate 2 and the lower cooling clamp plate 3 respectively, and an electric potential difference is generated between the electrode 4 and the upper cooling clamp plate 2 and the lower cooling clamp plate 3, so that the nanoparticles in the nano suspension 100 deposited in the heat dissipation housing 1 are accelerated to suspend and rise again under the action of the electric field, and the heat of the nanoparticles in the nano suspension 100 is transferred to the upper cooling clamp plate 2 for heat exchange, thereby achieving the purpose of heat dissipation and cooling. Due to the existence of the external electric field, the deposited nanoparticles can be effectively suspended in the base liquid again, and maintain good suspension during the operation of the device. This prevents the nanofluid from agglomerating and settling in the heat dissipation housing 1 after working for a long time, thereby improving the heat dissipation performance of the heat dissipation housing 1, and can effectively solve the problem of the nanofluid drying up or insufficient supply, thereby ensuring the normal and efficient operation of the heat pipe.

[0027] In the present invention, combined with Figure 1 , Figure 3 and Figure 4The cooling method further comprises the following steps: when the nano suspension 100 stored in the heat dissipation housing 1 gradually rises due to vaporization caused by heat, the liquid circulation unit arranged outside the heat dissipation housing 1 is started, and the nano suspension 100 stored in the liquid storage tank 9 is pressed into the heat dissipation housing 1 along the input pipe 11 by the hydraulic pump 8, so that the hot liquid in the nano suspension 100 is quickly mixed with the cold liquid to cool and dissipate heat; and then the flow rate of the nano suspension 100 pressed into the heat dissipation housing 1 is adjusted by the hydraulic regulating valve 12, and the pressed nano suspension 100 is drawn out along the output pipe 10 after being heated in the heat dissipation housing 1, and the heated nano suspension 100 is sent to the radiator 7 for cooling, and then flows back to the liquid storage tank 9, and is sent to the heat dissipation housing 1 again for the next cycle cooling. Before starting the liquid circulation unit, the nano suspension 100 is first injected into the heat dissipation housing 1. When the cooling device needs to be operated, the hydraulic pump 8 is turned on to make the nano fluid (nano suspension 100) fill the entire pipeline of the liquid circulation unit. The hydraulic pump 8 delivers the nano suspension 100 in the low temperature state after condensation in the liquid storage tank 9 into the heat dissipation housing 1, and mixes with the nano fluid in the high temperature state inside the heat dissipation housing 1, thereby reducing the temperature of the nano suspension 100 in the heat dissipation housing 1, thereby cooling and dissipating the heat dissipation housing 1. After the heat dissipation housing 1 absorbs the heat of the cooled equipment, the temperature of the nano suspension 100 in the heat dissipation housing 1 increases as the nano suspension 100 in the heat dissipation housing 1 absorbs heat. Under the pressure of the hydraulic pump 8, part of the heat of the nano suspension 100 vaporized by heat in the heat dissipation housing 1 rises to the upper cooling clamp plate 2 for cooling, and part of the heat of the nano fluid (nano suspension 100) flows into the radiator 7 along the output pipe 10. At this time, the nano suspension 100 (nano fluid) transfers the heat it carries to the radiator for cooling in the cold zone. The cooled nano fluid flows back to the liquid storage tank 9 through the pipeline again, and then enters the next heat dissipation cooling cycle, so that the nano suspension 100 circulates inside and outside the heat dissipation housing 1, and the cooled equipment works within a suitable temperature range, further enhancing the heat dissipation performance of the electronic device.

[0028] In the present invention, combined with Figure 1 , Figure 3 and Figure 4The cooling method further comprises the following steps: after the pressed nano suspension 100 is heated in the heat dissipation housing 1 and then drawn out along the output pipe 10, the vacuum regulating unit is started according to the surface temperature of the heat dissipation housing 1, and the hot gas generated when the nano suspension 100 in the heat dissipation housing 1 is heated and vaporized is extracted by turning on the vacuum pump 13 of the vacuum regulating unit, and the vacuum state in the heat dissipation housing 1 is adjusted, so that the nano suspension 100 in the heat dissipation housing 1 is accelerated to vaporize, thereby instantly taking away a large amount of heat in the heat dissipation housing 1, and the non-evaporable substances are discharged by external vacuuming, so that the whole device is in a vacuum state, the boiling point of the liquid is reduced, and the internal nano suspension 100 (cooling medium) is vaporized, and the cooling medium is converted into a gas-liquid two-phase state to instantly take away a large amount of heat, and quickly reach the working temperature required by the heat source to be cooled, so as to achieve a better cooling effect, and the nano suspension 100 (cooling medium) between the upper and lower clamping plates can effectively reduce the accumulation of heat.

[0029] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A nanoparticle resuspension liquid cooling device, characterized in that: The liquid cooling device comprises a heat dissipation shell and an electrode penetrating the heat dissipation shell, one end of the electrode is arranged in one end of the heat dissipation shell, and the other end of the electrode horizontally extends outward from the other end of the heat dissipation shell, the inner cavity of the heat dissipation shell is filled with a nano suspension, the liquid level of the nano suspension in the heat dissipation shell is higher or lower than the horizontal plane height of the electrode, annular openings are respectively opened on the upper surface and the lower surface of the heat dissipation shell, and sealing covers are arranged at the annular openings on the upper surface and the lower surface of the heat dissipation shell; The heat dissipation shell is in the shape of a flat hollow tube, an upper cooling clamp is tightly arranged on the sealing cover, a lower cooling clamp is arranged on the upper surface of the heat cavity, and the electrode is parallel to the upper cooling clamp and the lower cooling clamp and passes through the heat dissipation shell; output connectors and input connectors respectively connected to the inner cavity of the heat dissipation shell are arranged on the upper surfaces of both ends of the upper cooling clamp, a liquid circulation unit is arranged outside the heat dissipation shell, the input end of the liquid circulation unit is connected to the output connector through an output pipe, and the output end of the liquid circulation unit is connected to the input connector through an input pipe, electrodes extending from both ends are arranged in the heat dissipation shell, and the heat dissipation shell is filled with nano suspension.

2. A nanoparticle resuspension liquid cooling device according to claim 1, characterized in that: The liquid circulation unit includes a radiator, a hydraulic pump and a liquid storage tank. The nano suspension is stored in the liquid storage tank. The input end of the radiator is connected to the output joint through an output pipe, the output end of the radiator is connected to the input end of the liquid storage tank through the hydraulic pump, and the output end of the liquid storage tank is connected to the input joint through an input pipe.

3. A nanoparticle resuspension liquid cooling device according to claim 2, characterized in that: A hydraulic regulating valve is arranged on the output pipe at one side close to the output joint.

4. A nanoparticle resuspension liquid cooling device according to any one of claims 1 to 3, characterized in that: The liquid cooling device also includes a vacuum regulating unit, which includes a vacuum pump. One or more vacuum connectors connected to the interior of the heat dissipation shell are arranged on the surface of the upper cooling clamping plate between the output connector and the input connector. The vacuum connector is connected to the input end of the vacuum pump through an air pipe.

5. The nanoparticle resuspension liquid cooling device according to claim 4, characterized in that: A gas delivery pipe between the vacuum joint and the input end of the vacuum pump is provided with a valve connected to the one-way control valve.

6. A cooling method using a nanoparticle resuspension liquid cooling device according to any one of claims 1 to 5, characterized in that: The method comprises the following steps: the lower surface of the heat dissipation shell acquires heat, and the heat is conducted to the inner cavity of the heat dissipation shell to exchange heat with the nano suspension, and the nano suspension stored in the heat dissipation shell gradually rises due to heat vaporization; a high voltage of 1kV-10kV is loaded on the electrode, so that an electric field is formed between the electrode and the upper cooling clamp plate and the lower cooling clamp plate respectively, and an electric potential difference is generated between the electrode and the upper cooling clamp plate and the lower cooling clamp plate, so that the nano particles in the nano suspension deposited in the heat dissipation shell are accelerated to suspend and rise again under the action of the electric field, and the heat of the nano particles in the nano suspension is conducted to the upper cooling clamp plate for heat exchange, thereby achieving the purpose of heat dissipation and cooling.

7. The cooling method of a nanoparticle resuspension liquid cooling device according to claim 6, characterized in that: The cooling method further comprises the following steps: when the nano suspension stored in the heat dissipation shell gradually rises due to vaporization caused by heat, a liquid circulation unit arranged outside the heat dissipation shell is started, and the nano suspension stored in the liquid storage tank is pressed into the heat dissipation shell along the input pipe by a hydraulic pump, so that the hot liquid in the nano suspension is quickly mixed with the cold liquid to perform cooling and heat dissipation; and then the flow rate of the nano suspension pressed into the heat dissipation shell is adjusted by a hydraulic regulating valve, and the pressed nano suspension is drawn out along the output pipe after being heated in the heat dissipation shell, and the heated nano suspension is sent to the radiator for cooling, and then flows back to the liquid storage tank, and is sent to the heat dissipation shell again for the next cycle cooling.

8. The cooling method of a nanoparticle resuspension liquid cooling device according to claim 7, characterized in that: The cooling method further comprises the following steps: after the pressed nano suspension is heated in the heat dissipation shell and then drawn out along the output pipe, a vacuum adjustment unit is started according to the surface temperature of the heat dissipation shell, and the hot air generated when the nano suspension in the heat dissipation shell is heated and vaporized is extracted by turning on the vacuum pump of the vacuum adjustment unit, and the vacuum state in the heat dissipation shell is adjusted, so that the nano suspension in the heat dissipation shell is vaporized faster, thereby instantly taking away a large amount of heat in the heat dissipation shell.

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