Battery thermal management with large-area planar heat pipes
By using a combination of large-area planar heat pipes and radiator arrays within the battery pack, the problems of large temperature gradients and uneven temperature distribution within the battery pack are solved, achieving more efficient battery cooling and improved performance.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- TOYOTA JIDOSHA KK
- Filing Date
- 2021-09-29
- Publication Date
- 2026-07-03
AI Technical Summary
Traditional thermal management systems struggle to effectively reduce temperature gradients within battery packs and achieve uniform temperature distribution, leading to decreased battery performance and shortened lifespan.
The system employs a combination of large-area planar heat pipe arrangement and radiator array. Heat is absorbed through thermal contact between the heat pipes and the battery pack, and dissipated through thermal contact between the radiator and the edge of the heat pipe. Multiple radiators provide localized cooling, thereby enhancing the cooling effect of the thermal management system.
It achieves a uniform temperature distribution within the battery pack, improving battery performance and extending lifespan, while also providing greater battery design flexibility and more efficient cooling capabilities.
Smart Images

Figure CN114300778B_ABST
Abstract
Description
Technical Field
[0001] The embodiments generally relate to a thermal management system for cooling one or more battery packs. Background Technology
[0002] A battery system comprising one or more battery packs generates heat during operation, each battery pack containing one or more cells. Because overall battery performance is adversely affected by overheating and uneven temperature distribution within the battery pack, a thermal management system is provided. Conventional thermal management systems may include, for example, air cooling, liquid cooling, phase change cooling, fan cooling, and finned cooling.
[0003] An example of a thermal management system is a heat pipe, which can be used to maintain appropriate temperatures within a battery system. A heat pipe is a heat transfer device that typically consists of a sealed housing lined with a core-like capillary material and a small amount of working fluid in a partially vacuum. A typical heat pipe structure has a tubular cross-section and includes evaporator and condenser sections. Heat is absorbed in the evaporator section through the evaporation of the working fluid and released in the condenser section through the condensation of the vapor. Summary of the Invention
[0004] The embodiments relate to a thermal management system for cooling a battery system comprising one or more battery packs. The thermal management system according to one or more embodiments is configured to produce a uniform temperature distribution within one or more battery packs by reducing the temperature gradient (ΔT) across each battery pack while maintaining the operation of the battery packs within a desired optimal temperature. In this way, the thermal management system helps to improve battery performance and extend battery life.
[0005] According to one or more embodiments, a battery system may include: one or more battery packs; a thermal management system for cooling the one or more battery packs, the thermal management system including: a heat pipe arrangement including a plurality of heat pipes having a planar configuration and in thermal contact with the one or more battery packs to absorb heat from the one or more battery packs; and a heat sink arrangement including a plurality of radiators in thermal contact with two or more edges of the heat pipe arrangement to dissipate heat from the heat pipe arrangement.
[0006] According to one or more embodiments, a thermal management system for cooling one or more battery packs of a battery system may include: a heat pipe arrangement including a plurality of heat pipes having a planar configuration, in thermal contact with the one or more battery packs to absorb heat from the one or more battery packs; and a heat sink arrangement including a plurality of radiators in thermal contact with two or more edges of the heat pipe arrangement to dissipate heat from the heat pipe arrangement.
[0007] According to one or more embodiments, a method for cooling one or more battery packs of a battery system may include: placing a heat pipe arrangement including a plurality of heat pipes having a planar configuration in thermal contact with the one or more battery packs to absorb heat from the one or more battery packs; and placing a radiator arrangement including a plurality of radiators in thermal contact with two or more edges of the heat pipe arrangement to dissipate heat from the heat pipe arrangement.
[0008] According to one or more embodiments, a motor vehicle may include: a motor for providing propulsion to the vehicle; a battery system for powering the motor, the battery system including one or more battery packs; and a thermal management system for cooling the one or more battery packs, the thermal management system including: a heat pipe arrangement having a planar configuration and having a plurality of heat pipes in thermal contact with the one or more battery packs to absorb heat from the one or more battery packs; and a radiator arrangement including a plurality of radiators having a plurality of radiators in thermal contact with two or more edges of the heat pipe arrangement to dissipate heat from the heat pipe arrangement.
[0009] According to one or more embodiments, the heat pipe arrangement includes: one or more first heat pipes that are in thermal contact with one or more battery packs at a first thermal contact area; and one or more second heat pipes that are in thermal contact with one or more battery packs at a second thermal contact area opposite to the first thermal contact area.
[0010] According to one or more embodiments, the heat sink arrangement includes one or more first liquid cold plates that are in thermal contact with one or more first heat pipes at a third thermal contact area.
[0011] According to one or more embodiments, the heat sink arrangement includes one or more second liquid cold plates that are in thermal contact with one or more first heat pipes at a fourth thermal contact area.
[0012] According to one or more embodiments, the heat sink arrangement includes one or more third liquid cold plates that are in thermal contact with one or more first heat pipes at a fifth thermal contact area opposite to the third thermal contact area.
[0013] According to one or more embodiments, the heat sink arrangement includes one or more fourth liquid cold plates that are in thermal contact with one or more first heat pipes at a sixth thermal contact area opposite to the fourth thermal contact area.
[0014] According to one or more embodiments, one or more third liquid cold plates have higher cooling performance than one or more first cold plates.
[0015] According to one or more embodiments, one or more fourth liquid cold plates have higher cooling performance than one or more second cold plates.
[0016] According to one or more embodiments, the heat sink arrangement includes one or more fifth liquid cold plates that are in thermal contact with one or more second heat pipes at a seventh thermal contact area.
[0017] According to one or more embodiments, the heat sink arrangement includes one or more sixth liquid cold plates that are in thermal contact with one or more second heat pipes at an eighth thermal contact area.
[0018] According to one or more embodiments, the heat sink arrangement includes one or more seventh liquid cold plates that are in thermal contact with one or more second heat pipes at a ninth thermal contact region opposite to the seventh thermal contact region.
[0019] According to one or more embodiments, the heat sink arrangement includes one or more eighth liquid cold plates that are in thermal contact with one or more second heat pipes at a tenth thermal contact region opposite to the eighth thermal contact region.
[0020] According to one or more embodiments, one or more fifth liquid cold plates have higher cooling performance than one or more first and seventh cold plates.
[0021] According to one or more embodiments, one or more sixth liquid cold plates have higher cooling performance than one or more eighth cold plates. Attached Figure Description
[0022] Various advantages of embodiments of the present invention will become apparent to those skilled in the art upon reading the following specification and appended claims and referring to the following drawings, wherein:
[0023] Figure 1 This is a diagram of an electric vehicle according to one or more embodiments.
[0024] Figure 2 It is for use according to one or more embodiments Figure 1 A diagram of the battery system of an electric vehicle.
[0025] Figure 3 It is used for Figure 2 A diagram of the thermal management system for the battery system.
[0026] Figure 4 The illustration shows a side cross-sectional view of a battery system according to one or more embodiments.
[0027] Figure 5 The illustration shows a side cross-sectional view of a battery system according to one or more embodiments.
[0028] Figure 6 The illustration shows a schematic diagram of a battery system according to one or more embodiments.
[0029] Figure 7The illustration shows a top view of an example of a battery system according to one or more embodiments.
[0030] Figure 8 The illustration shows a top view of an example of a battery system according to one or more embodiments.
[0031] Figure 9 This is a flowchart of a method for cooling a battery system according to one or more embodiments. Detailed Implementation
[0032] Figure 1 An example of an electric vehicle 10 is illustrated, which includes a motor 20 for propelling the vehicle 10 and a battery system 30 that serves as a power source for the motor 20.
[0033] like Figure 2 As shown, the battery system 30 may include one or more battery packs 40 that are thermally contacted / thermally coupled to the thermal management system 50 in order to produce a uniform temperature distribution within the battery packs 40 in a manner that reduces the temperature gradient (ΔT) across each battery pack 40 while maintaining the operation of the battery packs 40 within the desired optimal temperature range.
[0034] According to one or more embodiments, the battery system 30 can be applied to the vehicle 10, such as, for example, an electric vehicle (EV), including air-powered electric vehicles, marine electric vehicles, electric vehicle-powered spacecraft, and ground vehicles (e.g., hybrid electric vehicles (HEVs), plug-in hybrid electric vehicles (PHEVs), battery electric vehicles (BEVs), fuel cell electric vehicles (FCEVs), and rail electric vehicles (REVs)). While the battery system 30 and thermal management system 50 according to embodiments can be implemented for mobile applications such as vehicles, the embodiments are not limited thereto and can therefore be implemented in non-mobile or stationary applications.
[0035] like Figure 3 As shown, an example of the thermal management system 50 may include a heat pipe arrangement comprising one or more heat pipes 51 that are in thermal contact with one or more battery packs 40 to passively cool the battery packs 40 by absorbing heat from them during operation, and a heat sink arrangement comprising one or more radiators 52D that are in thermal contact with the heat pipes 51 to passively dissipate heat from the heat pipes 51.
[0036] Figure 4The diagram illustrates an example embodiment of a battery system 30, wherein a thermal management system 50 is applied to a planar surface of a battery pack 40 to provide cooling thereon. Specifically, the illustrated example includes one or more heat pipes 51 in thermal contact with the battery pack 40 at its planar surface. One or more heat sinks 52a-52d are in thermal contact with the one or more heat pipes 51.
[0037] Figure 5 The diagram illustrates another example of an embodiment of the battery system 30, wherein a thermal management system 50 is applied to opposing planar surfaces of the battery pack 40 to provide cooling on both sides. Specifically, the illustrated example includes one or more heat pipes 51a, 51b in thermal contact with the battery pack 40 at their respective planar surfaces. One or more heat sinks 52a-52h are in thermal contact with one or more heat pipes 51a, 51b. The dimensions of the battery, such as its height or thickness, generally depend on the performance of the cooling solution. Figure 5 The thermal management system 50 shown not only affects the battery performance of providing uniform cooling on both sides of the battery pack 40, but also does not limit the physical size of the battery pack 40. In particular, this contrasts with the use of unilateral battery cooling that limits the physical size of the battery. Figure 5 The thermal management system 50 shown can allow the use of batteries with larger size and / or capacity.
[0038] Although Figure 4 and 5 The examples shown each include a battery pack 40, but the embodiments are not limited thereto, therefore, as Figure 6 As shown, it can cover two or more battery packs 140 arranged in a stacked configuration. n 140 n+1 Battery system 130. Battery pack 140, according to one or more embodiments. n 140 n+1 They can be arranged or oriented in a vertically stacked or alternatively horizontally stacked manner. They can be connected via a method having... Figure 4 and 5 The thermal management system 50 has the same technical features and structure as the thermal management system 150 for cooling the stack. The thermal management system 50 according to the embodiment allows the battery pack 40 to be stacked in a manner that reduces the heat transfer distance by at least half.
[0039] like Figure 7As shown, an example battery system 30 according to one or more embodiments may include one or more battery packs 40 thermally contacting / coupling to a thermal management system comprising one or more heat pipes 51 and one or more heat sinks 52 arranged physically and thermally in contact with the exposed edge regions (i.e., planar surfaces and periphery / peripheral sides) of the heat pipes 51 to provide localized cooling thereto. In the illustrated example, each of the heat pipes 51 may comprise a single large-area heat pipe HP1 having a planar geometry. The single large-area heat pipe HP1 may have a predetermined total surface area greater than the total surface area of the corresponding battery pack 40. This means that the single large-area heat pipe HP1 extends beyond the dimensions of the battery 140. In this way, the heat sink 52 is strategically positioned in the region of heat transfer (i.e., the edge of the heat pipes 51) where heat transfer occurs. According to one or more embodiments, the predetermined total surface area of the single large-area heat pipe HP1 may range from approximately 20 cm x 10 cm to 200 cm x 100 cm.
[0040] like Figure 8 As shown, alternatively, the example battery system 130 according to one or more embodiments may include a battery pack 140 that is thermally contacted / thermally coupled to a thermal management system comprising one or more heat pipes 151 and one or more heat sinks 152 arranged in a physical and thermal contact manner at exposed edge regions (i.e., planar surfaces and periphery / peripheral sides) of heat pipe(s) 151 to provide localized cooling thereto. In the illustrated example, the heat pipes 151 may each comprise an array of heat pipes consisting of a plurality of large-area heat pipes HP1-HP10 having planar geometry. The large-area heat pipes HP1-HP10 may have a predetermined combined total surface area greater than the total surface area of the battery pack 140. This means that the array of large-area heat pipes HP1-HP10 extends beyond the dimensions of the battery 140. In this way, the heat sinks 152 are strategically positioned in the regions of heat transfer occurring (i.e., the edges of the heat pipe(s) 151) 151. According to one or more embodiments, the total surface area of a predetermined combination of heat pipes HP1-HP10 can be in the range of approximately 20cm x 10cm to 200cm x 100cm.
[0041] While the illustrated example battery system 130 depicts ten large-area heat pipes HP1-HP10, the embodiments are not limited and may therefore include any number of heat pipes falling within the spirit and scope of the principles set forth herein. Ultimately, the selection of the total number of heat pipes for each battery pack can take into account one or more design variables, including but not limited to cost, performance requirements, manufacturing requirements, etc.
[0042] Compared to using multiple large-area planar heat pipes HP1-HP10, using a single large-area planar heat pipe (HP1) results in a more uniform temperature distribution on the battery surface. This is because the heat resistance between heat pipes HP1-HP10 prevents lateral heat diffusion between them.
[0043] Regarding scale, the total surface area of the heat pipes (H1 or HP1-HP10) far exceeds that of conventional heat pipes, thus providing enhanced overall cooling for the corresponding battery packs 40, 140. Specifically, the use of large-area planar heat pipes 51, 151 with this total surface area creates a larger contact interface with the heat source (i.e., (one or more) battery packs) 40, 140 compared to using tubular heat pipes. Furthermore, due to the two-stage heat transfer properties, battery cooling via one or more large-area planar heat pipes reduces the temperature gradient (ΔT) across the battery pack 40 while maintaining the operation of the battery pack 40 within the desired optimal temperature range, resulting in enhanced temperature regulation of the battery pack 40 by generating a more uniform temperature distribution within the battery pack 40, compared to using tubular heat pipes. Moreover, the thermal management system sandwiched between the two planar sides of (one or more) battery packs 40, 140 provides greater battery design flexibility without limiting the size of (one or more) battery packs.
[0044] like Figure 4 As further shown, one or more heat pipes 51 are configured to make thermal contact with the outer planar surface of the battery pack 40 at a thermal contact area or interface 54 to absorb heat generated by the battery pack 40 during operation. A thermal interface material (TIM) 55 may be applied to fill the microspaces or gaps between the battery pack 40 and (one or more) heat pipes 51 at the thermal contact area 54, thereby enhancing heat transfer between the battery pack 40 and (one or more) heat pipes 51. According to one or more embodiments, the TIM 55 may comprise a ceramic, graphite, or boron nitride (BN) filled polymer matrix (e.g., alumina, graphite-filled silicone) and may be in the form of a spacer pad or filler. However, the embodiments are not limited thereto, and therefore the TIM 55 may be composed of other materials falling within the spirit and scope of the principles set forth herein.
[0045] According to one or more embodiments, the heat sink arrangement 52 may include one or more heat sinks 52a-52d that are in physical and thermal contact with two or more exposed edge regions (i.e., planar surfaces and peripheral / peripheral sides) of the heat pipe(s) 51 to provide localized cooling by transferring heat from the heat pipe(s) 51 to the liquid coolant (where heat is dissipated from the heat sinks 52a-52d). As used herein, the edge region of a heat pipe refers to the region exposed by not being in physical contact with the battery pack. As used herein, the “side” at the edge region of the heat pipe(s) 51 extends along a plane substantially perpendicular to the upper and lower planar surfaces of the heat pipe(s) 51. In the illustrated embodiment, the side edge regions extend substantially along a horizontal plane, while the upper and lower edge regions extend substantially along a vertical plane, respectively. Providing coverage at all four edge regions (e.g., upper, lower, and side) of the heat pipe(s) 51 can produce greater localized cooling. TIM (not shown) can be applied to fill the microspaces or gaps between one or more heat pipes 51 and one or more heat sinks 52a-52d in the corresponding thermal contact areas, thereby enhancing the heat transfer between them.
[0046] exist Figure 4 In the illustrated embodiment, a pair of heat sinks 52a and 52b are spaced apart and substantially coplanar on the outer plane surfaces of one or more heat pipes 51, while another pair of heat sinks 52c and 52d are spaced apart and substantially coplanar on opposite outer plane surfaces of one or more heat pipes 51. Heat sinks 52a-52d may each include a liquid cold plate comprising a cold plate body having one or more internal flow channels 53a. n -53d n 53a n+1 -53d n+1 The flow of liquid coolant extends through it to facilitate the dissipation of heat from the cold plate body. Each internal flow channel 53a n -53d n 53a n+1 -53d n+1 This may include an inlet channel through which liquid coolant enters the cold plate body and an outlet channel through which liquid coolant exits the cold plate body. Each internal flow channel 53a n -53d n 53a n+1 -53d n+1The dimensions can be set to have a diameter that falls within the spirit and scope of the principles set forth in this disclosure. While the embodiments illustrate an internal flow channel having a generally circular configuration, one or more embodiments disclosed herein are not limited thereto and may therefore include internal flow channels having any geometry that falls within the spirit and scope of the principles set forth in this disclosure.
[0047] The operating temperature profile of the heat pipe arrangement indicates that the corresponding regions of heat pipe(s) 51 located inside the battery system 30 experience greater heat exposure than the external regions. Therefore, those heat sinks located in the regions experiencing greater heat exposure can have a structural design that achieves higher cooling performance. As an example, to achieve this higher cooling performance, the overall size or total surface area of such heat sinks can be larger than the corresponding overall size and total surface area of heat sinks not located in the regions experiencing greater heat exposure. Additionally or alternatively, to achieve this higher cooling performance by allowing a larger volumetric capacity of liquid coolant, such heat sinks can accommodate a larger total number of internal flow channels compared to those heat sinks not located in the regions experiencing greater heat exposure. Additionally or alternatively, to achieve this higher cooling performance by allowing a larger volumetric capacity of liquid coolant, such heat sinks can have internal flow channels with a larger diameter than those heat sinks not located in the regions experiencing greater heat exposure.
[0048] like Figure 5 As further shown, one or more heat pipes 51a are configured to make thermal contact with the outer planar surface of the battery pack 40 at a first thermal contact region or interface 54a to absorb heat generated by the battery pack 40 during operation. A first thermal interface material (TIM) 55a may be applied to fill the microspaces or gaps between the battery pack 40 and the heat pipe(s) 51a at the first thermal contact region 54a, thereby enhancing heat transfer 40 between the battery pack and the heat pipe(s) 51a. According to one or more embodiments, the first TIM 55a may comprise a ceramic, graphite, or boron nitride (BN) filled polymer matrix (e.g., alumina, graphite filled silicone) and may be in the form of a spacer pad or filler. However, the embodiments are not limited thereto, and therefore the first TIM 55a may be composed of other materials falling within the spirit and scope of the principles set forth herein.
[0049] Furthermore, one or more heat pipes 51b are configured to make thermal contact with the opposing outer planar surface of the battery pack 40 at the second thermal contact region or interface 54b to absorb heat generated by the battery pack 40 during operation. A second TIM 55b can be applied to fill the microspaces or gaps between the battery pack 40 and (one or more) heat pipes 51b at the second thermal contact region 54b, thereby enhancing heat transfer between the battery pack 40 and (one or more) heat pipes 51b. According to one or more embodiments, the second TIM 55b may comprise a ceramic, graphite, or boron nitride (BN) filled polymer matrix (e.g., alumina, graphite-filled silicone) and may be in the form of a spacer pad or filler. However, the embodiments are not limited thereto, and therefore the second TIM 55b may be composed of other materials falling within the spirit and scope of the principles set forth herein.
[0050] According to one or more embodiments, the heat sink arrangement 52 may include a first heat sink group comprising one or more heat sinks 52a-52d that are in physical and thermal contact with two or more exposed edge regions (i.e., planar surfaces and peripheral / peripheral sides) of the heat pipe(s) 51a to provide localized cooling to the heat pipe(s) 51a by transferring heat from the heat pipe(s) 51a to the liquid coolant (where heat is dissipated from the heat sinks 52a-52d). As used herein, the edge region of a heat pipe refers to the region exposed by not being in physical contact with the battery pack. As used herein, the “side” at the edge region of the heat pipe(s) 51a extends along a plane substantially perpendicular to the upper and lower planar surfaces of the heat pipe(s) 51a. In the illustrated embodiment, the side edge regions extend substantially along a horizontal plane, while the upper and lower edge regions extend substantially along a vertical plane, respectively. Providing coverage at all four edge regions (e.g., upper, lower, and side) of the heat pipe(s) 51a can produce greater localized cooling. Thermal interface material (TIM) (not shown) can be applied to fill the microspaces or gaps between one or more heat pipes 51 and one or more heat sinks 52a-52d in the corresponding thermal contact areas, thereby enhancing the heat transfer between them.
[0051] exist Figure 5 In the illustrated embodiment, a pair of heat sinks 52a and 52b are spaced apart and coplanar on the outer plane surfaces of one or more heat pipes 51a, while another pair of heat sinks 52c and 52d are spaced apart and coplanar on the opposite outer plane surfaces of one or more heat pipes 51a. Heat sinks 52a-52d may each include a liquid cold plate, which includes a cold plate body having one or more internal flow channels 53a. n -53d n 53an+1 -53d n+1 The flow of liquid coolant extends through it to facilitate the dissipation of heat from the cold plate body. Each internal flow channel 53a n -53d n 53a n+1 -53d n+1 This may include an inlet channel through which liquid coolant enters the cold plate body and an outlet channel through which liquid coolant exits the cold plate body. Each internal flow channel 53a n -53d n 53a n+1 -53d n+1 The size can be set to a diameter that falls within the spirit and scope of the principles set forth in this disclosure.
[0052] According to one or more embodiments, the radiator arrangement 52 may further include one or more radiators 52e-52h that are in physical and thermal contact with two or more edge regions (i.e., planar surfaces and peripheral / peripheral sides) of the heat pipe(s) 51a to provide localized cooling by transferring heat from the heat pipe(s) 51a to the liquid coolant (where heat is dissipated from the radiators 52e-52e). A thermal interface material (TIM) (not shown) may be applied to fill the microspaces or gaps between the one or more intermediate heat pipes 51b and the one or more second radiators 52e-52h at the thermal contact area, thereby enhancing heat transfer between them.
[0053] In the illustrated embodiment, a pair of heat sinks 52e, 52f are spaced apart and coplanar on the outer plane surfaces of one or more heat pipes 51b, while another pair of second heat sinks 52g, 52h are spaced apart and coplanar on the opposing outer plane surfaces of one or more heat pipes 51b. Heat sinks 52e-52h may each include a liquid cold plate, which includes a cold plate body having a plurality of internal flow channels 53e. n -53h n 53e n+1 -53h n+1 The flow of liquid coolant extends through it to facilitate the dissipation of heat from the cold plate body. Each internal flow channel 53e n -53h n 53e n+1 -53h n+1 This may include an inlet channel through which liquid coolant enters the cold plate body and an outlet channel through which liquid coolant exits the cold plate body. Each internal flow channel 53e n -53h n 53e n+1 -53hn+1 The size can be set to a diameter that falls within the spirit and scope of the principles set forth in this disclosure.
[0054] The operating temperature profile of the heat pipe arrangement indicates that the corresponding areas of heat pipe(s) 51a and(s) 51b located inside the battery system 30 experience greater heat exposure than the external areas. Therefore, radiators 52c-52f can have a structural design that achieves higher cooling performance than radiators 52a, 52b, 52g, and 52h. As an example, to achieve this higher cooling performance, the total size or total surface area of radiators 52c-52f can be greater than the corresponding total size and total surface area of radiators 52a, 52b, 52g, and 52h. Additionally or alternatively, to achieve this higher cooling performance, radiators 52c-52f can accommodate a larger total number of internal flow channels than radiators 52a, 52b, 52g, and 52h, in order to allow for a larger volumetric capacity for liquid coolant. Additionally or alternatively, in order to achieve this higher cooling performance, radiators 52c-52f may have internal flow channels with a larger diameter than those of radiators 52a, 52b, 52g, and 52h, so as to allow for a larger volumetric capacity for liquid coolant.
[0055] According to one or more embodiments, each cold plate body may be made of a metal or metal composite exhibiting high thermal conductivity. For example, such a metal or metal composite may include aluminum, copper, or stainless steel. The liquid coolant may include a highly thermally conductive fluid that is thermally stable and compatible with the material composition of the corresponding heat sink through which it flows.
[0056] like Figure 9 As shown, a method 200 for cooling one or more battery packs in a battery system is provided. Method 200 may be implemented, for example, as logic instructions (e.g., software), configurable logic, fixed-function hardware logic, or any combination thereof.
[0057] Block 202 includes arranging heat pipes in thermal contact with the outer planar surface of one or more battery packs of a battery system to absorb heat therefrom. The heat pipe arrangement may include, for example, one or more heat pipes having a planar configuration.
[0058] According to one or more embodiments of method 100, the heat pipe arrangement includes one or more first heat pipes that are in thermal contact with one or more battery packs at a first thermal contact region, and one or more second heat pipes that are in thermal contact with one or more battery packs at a second thermal contact region opposite to the first thermal contact region.
[0059] Block 204 includes positioning a heat sink arrangement in thermal contact with two or more edges of a heat pipe arrangement to dissipate heat from the heat pipe arrangement, which may include, for example, one or more heat sinks. Execution of block 204 may be performed simultaneously, in series, or in parallel with execution of block 202.
[0060] According to one or more embodiments of method 200, the heat sink arrangement includes one or more first liquid cold plates that are in thermal contact with one or more first heat pipes at a third thermal contact region, and one or more second liquid cold plates that are in thermal contact with one or more first heat pipes at a fourth thermal contact region.
[0061] According to one or more embodiments of method 200, the heat sink arrangement includes one or more third liquid cold plates that are in thermal contact with one or more first heat pipes at a fifth thermal contact area opposite to the third thermal contact area, and one or more fourth liquid cold plates that are in thermal contact with one or more first heat pipes at a sixth thermal contact area opposite to the fourth thermal contact area.
[0062] According to one or more embodiments of method 200, one or more third liquid cold plates may have higher cooling performance than one or more first cold plates, and one or more fourth liquid cold plates may have higher cooling performance than one or more second cold plates.
[0063] According to one or more embodiments of method 200, the heat sink arrangement includes one or more fifth liquid cold plates that are in thermal contact with one or more second heat pipes at a seventh thermal contact region, and one or more sixth liquid cold plates that are in thermal contact with one or more second heat pipes at an eighth thermal contact region.
[0064] According to one or more embodiments of method 200, the heat sink arrangement includes one or more seventh liquid cold plates that are in thermal contact with one or more second heat pipes at a ninth thermal contact region opposite to the seventh thermal contact region, and one or more eighth liquid cold plates that are in thermal contact with one or more second heat pipes at a tenth thermal contact region opposite to the eighth thermal contact region.
[0065] According to one or more embodiments of method 200, one or more fifth liquid cold plates may have higher cooling performance than one or more first seventh liquid cold plates, and one or more sixth liquid cold plates may have higher cooling performance than one or more eighth cold plates.
[0066] The terms “coupled,” “attached,” or “connected” are used herein to refer to any type of direct or indirect relationship between the components under discussion and can be applied to electrical, mechanical, fluid, optical, electromagnetic, electromechanical, or other connections. Furthermore, the terms “first,” “second,” etc., are used herein merely for ease of discussion and, unless otherwise stated, do not have a specific temporal or chronological meaning.
[0067] Those skilled in the art will recognize from the foregoing description that a wide range of techniques can be implemented in various forms in accordance with embodiments of the invention. Therefore, although embodiments of the invention have been described in conjunction with specific examples, the true scope of the embodiments of the invention should not be so limited, as other modifications will become apparent to those skilled in the art upon studying the drawings, specification, and the following claims.
Claims
1. A battery system, comprising: One or more battery packs; A thermal management system for cooling the one or more battery packs, the thermal management system comprising: A heat pipe arrangement comprising multiple heat pipes, having a planar configuration, is in thermal contact with the one or more battery packs to extract heat from the one or more battery packs; and A heat sink arrangement comprising multiple heat sinks, in thermal contact with two or more edges of a heat pipe arrangement to dissipate heat from the heat pipe arrangement; The heat pipe arrangement includes: One or more first heat pipes are in thermal contact with the one or more battery packs at a first thermal contact area; and One or more second heat pipes are in thermal contact with the one or more battery packs at a second thermal contact area opposite to the first thermal contact area; The radiator arrangement includes: One or more first liquid cold plates are in thermal contact with the one or more first heat pipes at a third thermal contact area; and One or more second liquid cold plates are in thermal contact with the one or more first heat pipes at a fourth thermal contact area; One or more third liquid cold plates are in thermal contact with the one or more first heat pipes at a fifth thermal contact area opposite to the third thermal contact area; and One or more fourth liquid cold plates are in thermal contact with the one or more first heat pipes at a sixth thermal contact area opposite to the fourth thermal contact area; in: The one or more third liquid cooling plates have higher cooling performance than the one or more first liquid cooling plates, wherein the third liquid cooling plate is closer to the heat-exposed area of the battery system than the first liquid cooling plate; and The one or more fourth liquid cooling plates have higher cooling performance than the one or more second liquid cooling plates, wherein the fourth liquid cooling plate is closer to the heat-exposed area of the battery system than the second liquid cooling plate.
2. The battery system of claim 1, wherein the heat sink arrangement comprises: One or more fifth liquid cold plates are in thermal contact with the one or more second heat pipes at the seventh thermal contact area; as well as One or more sixth liquid cold plates are in thermal contact with the one or more second heat pipes at the eighth thermal contact area.
3. The battery system of claim 2, wherein the heat sink arrangement comprises: One or more seventh liquid cold plates are in thermal contact with the one or more second heat pipes at a ninth thermal contact area opposite to the seventh thermal contact area; as well as One or more eighth liquid cold plates are in thermal contact with the one or more second heat pipes at a tenth thermal contact area opposite to the eighth thermal contact area.
4. The battery system of claim 3, wherein: The one or more fifth liquid cooling plates have higher cooling performance than the one or more seventh liquid cooling plates, wherein the fifth liquid cooling plate is closer to the heat-exposed area of the battery system than the seventh liquid cooling plate. as well as The one or more sixth liquid cooling plates have higher cooling performance than the one or more eighth liquid cooling plates, wherein the sixth liquid cooling plate is closer to the heat-exposed area of the battery system than the eighth liquid cooling plate.
5. A thermal management system for cooling one or more battery packs in a battery system, the thermal management system comprising: A heat pipe arrangement comprising multiple heat pipes, having a planar configuration, is in thermal contact with the one or more battery packs to absorb heat from the one or more battery packs; as well as A heat sink arrangement comprising multiple radiators, in thermal contact with two or more edges of a heat pipe arrangement to dissipate heat from the heat pipe arrangement; The heat pipe arrangement includes: One or more first heat pipes are in thermal contact with the one or more battery packs at a first thermal contact area; and One or more second heat pipes are in thermal contact with the one or more battery packs at a second thermal contact area opposite to the first thermal contact area; The radiator arrangement includes: One or more first liquid cold plates are in thermal contact with the one or more first heat pipes at a third thermal contact area; and One or more second liquid cold plates are in thermal contact with the one or more first heat pipes at a fourth thermal contact area; One or more third liquid cold plates are in thermal contact with the one or more first heat pipes at a fifth thermal contact area opposite to the third thermal contact area; and One or more fourth liquid cold plates are in thermal contact with the one or more first heat pipes at a sixth thermal contact area opposite to the fourth thermal contact area; in: The one or more third liquid cooling plates have higher cooling performance than the one or more first liquid cooling plates, wherein the third liquid cooling plate is closer to the heat-exposed area of the battery system than the first liquid cooling plate; and The one or more fourth liquid cooling plates have higher cooling performance than the one or more second liquid cooling plates, wherein the fourth liquid cooling plate is closer to the heat-exposed area of the battery system than the second liquid cooling plate.
6. The thermal management system of claim 5, wherein the radiator arrangement comprises: One or more fifth liquid cold plates are in thermal contact with the one or more second heat pipes at the seventh thermal contact area; as well as One or more sixth liquid cold plates are in thermal contact with the one or more second heat pipes at the eighth thermal contact area.
7. The thermal management system of claim 6, wherein the radiator arrangement comprises: One or more seventh liquid cold plates are in thermal contact with the one or more second heat pipes at a ninth thermal contact area opposite to the seventh thermal contact area; as well as One or more eighth liquid cold plates are in thermal contact with the one or more second heat pipes at a tenth thermal contact area opposite to the eighth thermal contact area.
8. The thermal management system as described in claim 7, wherein: The one or more fifth liquid cooling plates have higher cooling performance than the one or more seventh liquid cooling plates, wherein the fifth liquid cooling plate is closer to the heat-exposed area of the battery system than the seventh liquid cooling plate. as well as The one or more sixth liquid cooling plates have higher cooling performance than the one or more eighth liquid cooling plates, wherein the sixth liquid cooling plate is closer to the heat-exposed area of the battery system than the eighth liquid cooling plate.
9. A method for cooling one or more battery packs of a battery system, the method comprising: A heat pipe arrangement is provided, the heat pipe arrangement comprising a plurality of heat pipes having a planar configuration, which are in thermal contact with the one or more battery packs to absorb heat from the one or more battery packs; as well as A radiator arrangement is provided, the radiator arrangement comprising a plurality of radiators in thermal contact with two or more edges of a heat pipe arrangement to dissipate heat from the heat pipe arrangement. The heat pipe arrangement includes: One or more first heat pipes are in thermal contact with the one or more battery packs at a first thermal contact area; and One or more second heat pipes are in thermal contact with the one or more battery packs at a second thermal contact area opposite to the first thermal contact area; The radiator arrangement includes: One or more first liquid cold plates are in thermal contact with the one or more first heat pipes at a third thermal contact area; and One or more second liquid cold plates are in thermal contact with the one or more first heat pipes at a fourth thermal contact area; One or more third liquid cold plates are in thermal contact with the one or more first heat pipes at a fifth thermal contact area opposite to the third thermal contact area; and One or more fourth liquid cold plates are in thermal contact with the one or more first heat pipes at a sixth thermal contact area opposite to the fourth thermal contact area; in: The one or more third liquid cooling plates have higher cooling performance than the one or more first liquid cooling plates, wherein the third liquid cooling plate is closer to the heat-exposed area of the battery system than the first liquid cooling plate; and The one or more fourth liquid cooling plates have higher cooling performance than the one or more second liquid cooling plates, wherein the fourth liquid cooling plate is closer to the heat-exposed area of the battery system than the second liquid cooling plate.