Electromagnetic cooking appliance

Abstract

The utility model discloses an electromagnetic cooking utensil, including the body of a pot, is equipped with the electromagnetic wire disc and is equipped with the installation shell below the electromagnetic wire disc in the body of a pot, and installation shell is equipped with circuit board mounting cavity and fan mounting cavity, and is equipped with cooling air duct between circuit board mounting cavity and fan mounting cavity, and the top of fan mounting cavity is equipped with the air outlet towards electromagnetic wire disc, and the top wall of circuit board mounting cavity is closed to separate electromagnetic wire disc and circuit board mounting cavity, and circuit board mounting cavity is below fan mounting cavity and is located the downstream of cooling air duct, and cooling air duct is transversely set up relative to fan mounting cavity, and electromagnetic wire disc is transversely equipped in the downstream of air outlet, and the body of a pot is equipped with the air outlet, and the air outlet is equipped in the downstream of circuit board mounting cavity and electromagnetic wire disc. The airflow that cooling fan blows divides into two in fan mounting cavity, makes the airflow that cooling fan blows can cool down electromagnetic wire disc also can cool down circuit board, and one fan satisfies the heat dissipation demand of multiple components simultaneously.

Description

Technical Field

[0001] This utility model belongs to the field of kitchen appliance technology, specifically relating to an electromagnetic cooking appliance. Background Technology

[0002] Electromagnetic cooking appliances have an electromagnetic coil inside the pot. When this coil is energized, it generates a magnetic field that heats the contents of the pot. Simultaneously, a cooling fan is installed inside the pot to cool the circuit board and other components. The circuit board is typically placed vertically at the rear of the pot, and the cooling fan blows cool air onto it for air cooling.

[0003] However, placing the circuit board at the rear of the pot occupies a significant portion of the pot's radial space, increasing its radial dimensions. For example, a raised bulge structure is often required at the rear of the pot to accommodate the circuit board, which hinders the trend towards miniaturization. Furthermore, water can easily enter the area around the pivot and torsion spring holes at the rear of the pot, potentially causing water droplets to fall onto the circuit board and posing a risk of short circuits or even damage.

[0004] Furthermore, in existing technologies, the cooling fan is usually located at the rear of the pot body, below the circuit board, blowing cold air upwards. This means that the airflow can only flow upwards into the area where the circuit board is located, and cannot reach other components inside the pot body, especially the electromagnetic coil. During cooking, the electromagnetic coil generates a lot of heat, which can cause the electromagnetic coil temperature to rise too high, thus limiting the selection of coil material and heating power.

[0005] Chinese patent CN209331775U discloses a power board assembly and a cooking appliance having the same. The assembly has a cooling fan positioned below the electromagnetic coil. A portion of the cooling fan's exhaust surface is covered by the airflow opening of the airflow box. Part of the exhaust air from the cooling fan enters the airflow cavity and flows smoothly into the receiving cavity, thereby cooling the power board. The other portion of the exhaust air from the cooling fan passes through the airflow box from its outer periphery, thereby cooling the coil inside the outer casing.

[0006] However, the airflow blown out by the aforementioned cooling fan flows from bottom to top and contacts the power board and electromagnetic coil for heat dissipation. The overall airflow direction is from the bottom of the pot to the top of the pot. However, due to the difficulty in setting an air outlet structure at the top of the pot, the airflow inside the pot is difficult to flow out. The airflow is poor and the airflow is obstructed, resulting in unsatisfactory heat dissipation. When using high-power heating, the temperature rise of components such as the circuit board will still be too high. Utility Model Content

[0007] This utility model provides an electromagnetic cooking appliance to solve the problems of unreasonable circuit board layout leading to increased radial dimensions of the pot body, and the fan being unable to reach other components that require heat dissipation, resulting in limited functionality and poor heat dissipation.

[0008] The technical solution adopted in this utility model is as follows:

[0009] An electromagnetic cooking appliance includes a pot body, an electromagnetic coil inside the pot body, and a mounting shell located below the electromagnetic coil. The mounting shell has a circuit board mounting cavity and a fan mounting cavity. A cooling air duct connects the circuit board mounting cavity and the fan mounting cavity. The top of the fan mounting cavity has an air outlet facing the electromagnetic coil. The top wall of the circuit board mounting cavity is closed to separate the electromagnetic coil and the circuit board mounting cavity. The circuit board mounting cavity is lower than the fan mounting cavity and located downstream of the cooling air duct. The cooling air duct is arranged laterally relative to the fan mounting cavity. The electromagnetic coil is arranged laterally downstream of the air outlet. The pot body has an exhaust vent located downstream of the circuit board mounting cavity and the electromagnetic coil.

[0010] In this invention, the mounting shell is located below the electromagnetic coil. The mounting shell has a circuit board mounting cavity for mounting the circuit board and a fan mounting cavity for mounting the cooling fan. This allows both the circuit board and the cooling fan to be located below the electromagnetic coil, making reasonable use of the space inside the pot and greatly saving space on the side of the pot. This helps to reduce the radial dimension of the pot and achieve a miniaturized design.

[0011] The fan mounting cavity has an air outlet at its top, and a connecting cooling duct exists between the fan mounting cavity and the circuit board mounting cavity. This allows the airflow from the cooling fan to split into two streams within the fan mounting cavity. One stream flows out from the outlet and flows within the duct formed between the mounting shell and the electromagnetic coil, contacting the electromagnetic coil for cooling. The other stream flows through the cooling duct into the circuit board mounting cavity, contacting and cooling the circuit board. This allows the airflow from the cooling fan to cool both the electromagnetic coil and the circuit board, enabling a single fan to meet the heat dissipation needs of multiple components simultaneously. This simplifies the internal structure of the pot and saves costs. The fan mounting cavity and the circuit board mounting cavity are arranged laterally side-by-side, with both the electromagnetic coil and the circuit board mounting cavity located on one side of the fan mounting cavity. The airflow from the cooling fan splits into two streams within the fan mounting cavity, both flowing laterally and converging on the other side of the mounting shell before being exhausted through the exhaust vent. This ensures that both air intake and exhaust occur at the bottom of the pot, improving airflow and cooling efficiency.

[0012] In addition, the mounting shell also serves to isolate water and electricity. Water droplets falling from the upper electromagnetic coil and the inner liner are isolated from the circuit board mounting cavity by the mounting shell, allowing the water to be collected or guided out above the mounting cavity, preventing it from reaching the inside of the circuit board mounting cavity and thus reducing the risk of water damage to the circuit board. At the same time, the circuit board mounting cavity is lower than the fan mounting cavity, and the air outlet is located at the top of the fan mounting cavity, making the air outlet higher than the top wall of the circuit board mounting cavity, further preventing water dripping above the circuit board mounting cavity from flowing into the fan mounting cavity and the circuit board mounting cavity through the air outlet.

[0013] The fan mounting cavity and the electromagnetic coil are staggered vertically. The top of the fan mounting cavity is provided with a bent and extended air guide wall, and the air outlet is opened on the side of the air guide wall and faces the electromagnetic coil horizontally.

[0014] In this design, the air outlet is horizontally oriented towards the electromagnetic coil, ensuring that its horizontal projection covers at least a portion of the coil. This allows the airflow to fully contact and cool the coil after exiting the outlet, improving both the contact effect and heat exchange efficiency. Furthermore, the horizontal airflow, with inlets and outlets at the bottom of the pot, ensures both intake and exhaust occur at the bottom, enhancing airflow mobility. This allows cool air from the outside to enter the pot promptly, while the cooled airflow exits quickly, further improving cooling efficiency. Additionally, the horizontal orientation of the outlet also pushes liquid above the circuit board mounting cavity, directing it away from the outlet and helping to drain any drips onto the mounting shell, preventing prolonged accumulation. This also prevents liquid from being drawn into the outlet, reducing the risk of water contact with the cooling fan and circuit board.

[0015] The mounting housing is equipped with upward-protruding water-blocking ribs, which work together with the air guide wall to form an air outlet.

[0016] In this design, the water-blocking ribs protrude upwards from the top wall of the circuit board mounting cavity, further blocking liquid above the cavity and preventing it from flowing into the air outlet. Furthermore, the water-blocking ribs are located below the air guide wall, together forming the air outlet, further raising its height and reducing the risk of liquid entering it.

[0017] The mounting housing includes a baffle, a fan mounting cavity and a circuit board mounting cavity located below the baffle, and an electromagnetic coil located above the baffle. The baffle separates the electromagnetic coil and the circuit board mounting cavity.

[0018] In this design, a baffle separates the electromagnetic coil and the circuit board mounting cavity. The electromagnetic coil is located above the baffle, while the fan mounting cavity and the circuit board mounting cavity are located below it. Part of the baffle forms the top wall of the circuit board mounting cavity, and another part forms the top wall of the fan mounting cavity. Simultaneously, condensate and other liquids dripping from above can be temporarily collected on the baffle or guided out through it, achieving separation of the circuit board and water.

[0019] The baffle is equipped with a drainage structure, which is located on opposite sides of the baffle. The upper surface of the baffle is provided with a guide slope, the height of which gradually decreases from the air outlet towards the drainage structure.

[0020] In this design, the air outlet and drainage structure are located at opposite ends of the baffle wall. The airflow from the outlet pushes the liquid on the baffle wall towards the drainage structure, accelerating its discharge and preventing prolonged accumulation. Simultaneously, the guide slope gradually decreases towards the drainage structure, further enhancing the guidance of the liquid on the baffle wall, allowing it to flow towards the drainage structure under its own gravity. Through the combined effect of airflow and the guide slope, the flow efficiency of the liquid on the baffle wall is significantly improved, ensuring timely discharge. Furthermore, the guide slope on the lower side of the baffle wall also has a sloped structure, guiding the airflow within the fan mounting cavity through the cooling duct into the circuit board mounting cavity for cooling the circuit board.

[0021] The upper side of the baffle wall is provided with a water-blocking rib, which together with the upper surface of the baffle wall forms a water collection groove. The lower side of the baffle wall is provided with a mating wall, which together with the bottom wall of the pot body forms a circuit board mounting cavity.

[0022] In this design, water-retaining ribs surround the edge of the baffle wall, effectively blocking liquid from dripping down the wall and confining it within the area enclosed by the ribs. The liquid is forced to drain through the drainage structure, further reducing the risk of liquid dripping down the wall and into the circuit board mounting cavity. The circuit board is located within the space enclosed by the mating walls. The mating walls, the lower surface of the baffle wall, and the bottom wall of the pot together form the circuit board mounting cavity. Compared to blowing air into a larger, open space, the smaller and more enclosed size of the circuit board mounting cavity allows for faster airflow and stronger airflow, resulting in a more effective cooling effect on the circuit board. Furthermore, the mating walls on both sides of the circuit board mounting cavity also prevent liquid leakage from the upper edge of the baffle wall, allowing the liquid to flow downwards along the surface of the mating walls and preventing it from reaching the circuit board inside the mating walls.

[0023] The electromagnetic cooking appliance also includes a circuit board installed in the circuit board mounting cavity. The circuit board has a mounting side with a circuit structure, and the mounting side faces the top wall of the circuit board mounting cavity.

[0024] In this design, because the bottom wall of the pot has holes for airflow and liquid drainage, when liquid drips from the bottom wall onto the countertop, it may splash upwards and re-enter the pot through the holes, posing a risk of water contact to the circuit board fixed to the bottom of the pot. This design addresses this by arranging the circuit board with its mounting side facing upwards, creating a backplate without any circuitry on the bottom of the board. Therefore, even if liquid splashes onto this side, it will not come into contact with the circuitry on the circuit board, ensuring its safety.

[0025] The bottom wall of the pot is provided with a closed area and a drain outlet. The upward projection of the closed area covers the circuit board mounting cavity, and the drain outlet is located on the outside of the closed area.

[0026] In this design, liquid dripping onto the mounting shell can be drained through the drain port on the bottom wall of the pot. Since the area corresponding to the bottom wall of the pot and the circuit board mounting cavity is a closed area, even if liquid splashes upwards upon impact with the countertop, it will be blocked by this closed area and cannot enter the circuit board mounting cavity, ensuring its dryness. Furthermore, the staggered positioning of the drain port and the circuit board mounting cavity further reduces the risk of liquid entering the circuit board mounting cavity during drainage.

[0027] There are water-resistant ribs between the drain outlet and the enclosed area; or, the enclosed area is located at a higher elevation than the drain outlet.

[0028] In this design, the water-resistant ribs separate the area where the drain outlet is located from the enclosed area, blocking liquid from flowing into the enclosed area and thus reducing the probability of the circuit board getting wet. The enclosed area is higher than the drain outlet, making it difficult for liquid to flow from the drain outlet into the enclosed area. Furthermore, because the enclosed area is higher, if liquid accidentally reaches it, it will flow outwards under gravity and will not accumulate within the enclosed area for an extended period.

[0029] The bottom wall of the pot body has an air inlet and an air outlet. The fan mounting cavity is positioned vertically opposite to the air inlet, and the air outlet is positioned vertically offset from the circuit board mounting cavity. The air inlet and air outlet are located at opposite ends of the bottom wall of the pot body along the length of the bottom wall.

[0030] In this design, the air inlet corresponds vertically to the fan mounting cavity, and thus to the air inlet of the cooling fan. This allows the cooling fan to smoothly draw in air from the outside, ensuring smooth airflow. The exhaust vent is also located on the bottom wall of the pot, achieving a concealed design for both the air inlet and exhaust vent when the pot is placed on a table. Furthermore, since the airflow from the exhaust vent comes into contact with the electromagnetic coil and circuit board for heat exchange, the temperature will rise. Bottom exhaust prevents users from coming into contact with hot air, reducing the risk of burns. Additionally, the exhaust vent and air inlet are located at both ends of the bottom wall of the pot, allowing airflow to enter the pot from one end of the electromagnetic coil and circuit board and exit from the other end. This allows the airflow to travel a longer distance within the pot, ensuring sufficient contact with the electromagnetic coil and circuit board for heat exchange, improving airflow utilization and cooling effect. Attached Figure Description

[0031] The accompanying drawings, which are included to provide a further understanding of the present invention and constitute a part of this invention, illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the present invention and do not constitute an undue limitation thereof. In the drawings:

[0032] Figure 1 This is a cross-sectional view of the pot body according to one embodiment of the present invention;

[0033] Figure 2 This is a schematic diagram of the structure of the pot body in one embodiment of the present invention;

[0034] Figure 3 This is an exploded view of the mounting shell according to one embodiment of the present invention;

[0035] Figure 4 This is a schematic diagram of the mounting shell according to one embodiment of the present invention;

[0036] Figure 5 for Figure 4 A schematic diagram of the structure on the other side of the mounting shell;

[0037] Figure 6 for Figure 4 A cross-sectional view of the mounting shell;

[0038] Figure 7 This is an exploded view of the pot body according to one embodiment of the present invention;

[0039] Figure 8 This is a top view of the base according to one embodiment of the present invention.

[0040] in:

[0041] 1. Pot body; 11. Side wall; 12. Base; 13. Enclosed area; 14. Air inlet; 15. Air outlet; 16. Water baffle; 17. Drain outlet; 18. Exhaust duct;

[0042] 2. Electromagnetic coil;

[0043] 3 Mounting housing; 31 Circuit board mounting cavity; 311 Fixing clip; 312 Fixing post; 32 Fan mounting cavity; 33 Cooling air duct; 34 Air outlet; 35 Air guide wall; 36 Water-blocking rib; 37 Baffle wall; 371 Water-blocking rib; 372 Guide slope; 373 Mating wall; 38 Windproof wall; 39 Drainage groove;

[0044] 4. Circuit board; 41. Mounting side;

[0045] 5 cooling fans;

[0046] 6. Inner liner. Detailed Implementation

[0047] To more clearly illustrate the overall concept of this utility model, a detailed description will be provided below with reference to the accompanying drawings.

[0048] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present invention is not limited to the specific embodiments disclosed below.

[0049] Furthermore, it should be understood in the description of this utility model that the terms "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0050] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0051] In this invention, unless otherwise expressly specified and limited, the first feature "on" or "below" the second feature may be in direct contact with the first and second features, or indirect contact through an intermediate medium. In the description of this specification, references to terms such as "implementation," "example," "aspect," or "specific example" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0052] like Figure 1 , Figure 7 As shown, an electromagnetic cooking appliance includes a pot body 1, an electromagnetic coil 2 inside the pot body 1, and a mounting shell 3 located below the electromagnetic coil 2. The mounting shell 3 has a circuit board mounting cavity 31 and a fan mounting cavity 32. A cooling air duct 33 is provided between the circuit board mounting cavity 31 and the fan mounting cavity 32, connecting the circuit board mounting cavity 31 and the fan mounting cavity 32. The top of the fan mounting cavity 32 has an air outlet 34 facing the electromagnetic coil 2. The top wall of the circuit board mounting cavity 31 is closed to separate the electromagnetic coil 2 and the circuit board mounting cavity 31. The circuit board mounting cavity 31 is lower than the fan mounting cavity 32 and is located downstream of the cooling air duct 33. The cooling air duct 33 is arranged laterally relative to the fan mounting cavity 32. The electromagnetic coil 2 is arranged laterally downstream of the air outlet 34. The pot body 1 has an exhaust vent 15, which is located downstream of the circuit board mounting cavity 31 and the electromagnetic coil 2.

[0053] Specifically, the electromagnetic cooking appliance also includes an inner pot 6 placed inside the pot body 1. The inner pot 6 is located above the electromagnetic coil 2, which is used to heat the food inside the inner pot 6.

[0054] In this invention, the mounting shell 3 is located below the electromagnetic coil 2. The mounting shell 3 has a circuit board mounting cavity 31 for mounting the circuit board 4 and a fan mounting cavity 32 for mounting the cooling fan 5. This makes reasonable use of the space inside the pot body 1, which can greatly save the space on the side of the pot body 1, thereby helping to reduce the radial dimension of the pot body 1 and achieve miniaturization design.

[0055] The top of the fan mounting cavity 32 is provided with an air outlet 34, and there is a connecting cooling air duct 33 between the fan mounting cavity 32 and the circuit board mounting cavity 31, specifically, as shown in... Figure 1 , Figure 2 , Figure 6As shown, the air outlet 34 is located at the top of the fan mounting cavity 32, and the circuit board mounting cavity 31 is located on the lateral side of the fan mounting cavity 32. This causes the airflow blown by the cooling fan 5 to split into two streams within the fan mounting cavity 32. One stream flows out from the air outlet 34 at the top of the fan mounting cavity 32 and flows within the air duct formed between the mounting shell 3 and the electromagnetic coil 2, contacting the electromagnetic coil 2 to provide air cooling. The other stream flows laterally through the cooling air duct 33 into the circuit board mounting cavity 31, contacting the circuit board 4 to cool it. In this way, the airflow blown by the cooling fan 5 can cool both the electromagnetic coil 2 and the circuit board 4, thus using one fan to meet the heat dissipation needs of multiple components simultaneously. This not only simplifies the internal structure of the pot body 1 but also saves costs.

[0056] The fan mounting cavity 32 and the circuit board mounting cavity 31 are arranged horizontally side by side, so that the electromagnetic coil 2 and the circuit board mounting cavity 31 are both located on the horizontal side of the fan mounting cavity 32. The airflow blown out by the cooling fan 5 is divided into two streams in the fan mounting cavity 32. Both streams flow horizontally and converge in the exhaust channel 18 on the other side of the mounting shell 3, and are discharged through the exhaust port 15. This allows both air intake and exhaust to be completed at the bottom of the pot body 1, thereby improving the airflow and cooling efficiency.

[0057] Preferably, the fan mounting cavity 32 is located at one end of the mounting shell 3, and the mounting shell 3 and its opposite end form an exhaust channel 18. This allows the airflow above the mounting shell 3 for cooling the electromagnetic coil 2 and the airflow in the cooling duct 33 below the mounting shell 3 to flow laterally, converge in the exhaust channel 18, and be discharged through the exhaust port 15. Preferably, the mounting shell 3 is arranged along the front-rear direction of the pot body 1, the fan mounting cavity 32 is located on the rear side of the pot body 1, and the exhaust channel 18 is located on the front side of the pot body 1. The airflow direction is from the rear side to the front side of the pot body 1. During the flow, the airflow contacts and cools the electromagnetic coil 2 and the circuit board 4 respectively, converges in the exhaust channel 18 on the front side of the pot body 1, and is discharged. The exhaust port 15 can be opened on the side wall or bottom wall of the front side of the pot body 1. Specifically, the end of the mounting shell 3 away from the fan mounting cavity 32 forms an exhaust channel 18 between itself and the inner wall of the pot body 1.

[0058] Specifically, the airflow from the cooling fan 5 splits into two streams within the fan mounting cavity 32. One stream flows through the air outlet 34 at the top of the fan mounting cavity 32 towards the electromagnetic coil 2, meaning that in the airflow direction, the electromagnetic coil 2 is downstream of the air outlet 34. The other stream flows laterally through the cooling duct 33 into the circuit board mounting cavity 31, contacting the circuit board 4 within the cavity, meaning that in the airflow direction, the circuit board mounting cavity 31 is downstream of the cooling duct 33. After contacting the electromagnetic coil 2 and the circuit board 4 respectively, these two streams converge in the exhaust channel 18 at one end of the mounting housing 3 and are discharged through the exhaust port 15, thus ensuring that in the airflow direction, the exhaust port 15 is downstream of the electromagnetic coil 2 and the circuit board mounting cavity 31.

[0059] Specifically, such as Figure 1 As shown, with the top wall of the circuit board mounting cavity 31 as a reference, the electromagnetic coil 2 is located above it, the circuit board mounting cavity 31 is located below it, and the fan mounting cavity 32 is located on its lateral side. During operation, the airflow flows laterally from the fan mounting cavity 32 to the other end of the mounting shell 3, thereby satisfying the positional arrangement of each component in the air duct.

[0060] Preferably, such as Figure 1 As shown, the axis of the cooling fan 5 is arranged vertically.

[0061] Furthermore, the mounting shell 3 also serves to separate water and electricity. Water droplets falling from the upper electromagnetic coil 2 and the inner liner 6 are isolated outside the circuit board mounting cavity 31 by the mounting shell 3, allowing the water to be collected or guided out above the mounting cavity and not to reach the inside of the circuit board mounting cavity 31, thereby reducing the risk of water damage to the circuit board 4. At the same time, the circuit board mounting cavity 31 is lower than the fan mounting cavity 32, and the air outlet 34 is located at the top of the fan mounting cavity 32, making the position of the air outlet 34 higher than the top wall of the circuit board mounting cavity 31, further preventing water dripping above the circuit board mounting cavity 31 from flowing into the fan mounting cavity 32 and the circuit board mounting cavity 31 through the air outlet 34.

[0062] Preferably, such as Figure 2 As shown, a windbreak wall 38 is provided on the side of the fan mounting cavity 32 away from the circuit board mounting cavity 31, so as to block the airflow blown out by the fan, so that the airflow can only flow to the air outlet 34 and the cooling air duct 33, and will not spread in all directions, thereby improving the airflow utilization rate and improving the cooling effect.

[0063] The fan mounting cavity 32 and the electromagnetic coil 2 are staggered vertically. The top of the fan mounting cavity 32 is provided with a bent and extended air guide wall 35, and the air outlet 34 is opened on the side of the air guide wall 35 and faces the electromagnetic coil 2 horizontally.

[0064] Specifically, such as Figure 1As shown, the horizontal projection of the air outlet 34 covers at least a portion of the electromagnetic coil 2. This horizontal airflow, after exiting the air outlet 34, fully contacts and cools the electromagnetic coil 2. This improves the contact effect between the airflow and the electromagnetic coil 2, increasing heat exchange efficiency. Furthermore, the horizontal airflow, through the air inlet 14 and exhaust 15 located at the bottom of the pot body 1, allows both intake and exhaust to occur at the bottom of the pot body 1, further enhancing airflow. External cold air can enter the pot body 1 promptly, while the cooled airflow can be expelled in time, improving cooling efficiency. In addition, since the air outlet 34 is horizontally oriented, the airflow also pushes the liquid above the circuit board mounting cavity 31, causing the liquid to flow away from the air outlet 34. This helps to promptly drain liquid dripping onto the top of the mounting shell 3, preventing prolonged accumulation on the mounting shell 3. It also prevents liquid on the mounting shell 3 from being sucked into the air outlet 34, reducing the risk of water contact with the cooling fan 5 and the circuit board 4.

[0065] Specifically, such as Figure 1 , Figure 5 , Figure 6 As shown, the air guide wall 35 is located above the fan mounting cavity 32 and is used to convert the vertically upward airflow into a horizontal airflow flowing towards the electromagnetic coil 2. However, this embodiment does not limit the bending shape of the air guide wall 35, such as... Figure 5 , Figure 6 As shown, in one embodiment, the air guide wall 35 is arc-shaped to guide the airflow more smoothly and gently, preventing the airflow from changing direction at a large angle when passing through the air guide wall 35, thereby improving flow efficiency and reducing noise. In another embodiment, the air guide wall 35 can also be other shapes, such as being inclined to form a sloped structure.

[0066] Preferably, such as Figure 1 , Figure 6 As shown, the mounting shell 3 is provided with an upwardly protruding water-blocking rib 36, which, together with the air guide wall 35, forms an air outlet 34.

[0067] The water-blocking rib 36 protrudes upward from the top wall of the circuit board mounting cavity 31, further blocking liquid above the circuit board mounting cavity 31 and preventing liquid from flowing into the air outlet 34. In addition, the water-blocking rib 36 is located below the air guide wall 35, and the two together form the air outlet 34, which further increases the height of the air outlet 34 and reduces the risk of liquid entering the air outlet 34.

[0068] In a preferred embodiment, such as Figure 1 , Figure 5 , Figure 6As shown, the mounting housing 3 includes a baffle 37, a fan mounting cavity 32 and a circuit board mounting cavity 31 located below the baffle 37, and an electromagnetic coil 2 located above the baffle 37. The baffle 37 separates the electromagnetic coil 2 and the circuit board mounting cavity 31.

[0069] The baffle 37 separates the electromagnetic coil 2 and the circuit board mounting cavity 31, with the electromagnetic coil 2 located above it and the fan mounting cavity 32 and the circuit board mounting cavity 31 located below it. Part of the baffle 37 forms the top wall of the circuit board mounting cavity 31, and part of the baffle 37 forms the top wall of the fan mounting cavity 32. Simultaneously, condensate and other liquids dripping from above can be temporarily collected on the baffle 37 or guided out through it, achieving separation of the circuit board 4 and water.

[0070] Specifically, such as Figure 3 , Figure 4 As shown, a mounting position is provided on the side of the baffle 37 opposite to the electromagnetic coil 2. A fixing clip 311 is provided on the outer periphery of the mounting position, and the circuit board 4 is fixed in the mounting position by the fixing clip 311. The cooling fan 5 is fixedly connected to the mounting housing 3 by screws or other fasteners, and the cooling fan 5 is located within the fan mounting cavity 32. Figure 4 , Figure 5 As shown, the baffle 37 is also provided with a fixing post 312, which is fastened to the bottom wall of the pot body 1 using screws or other fasteners to fix the mounting shell 3 to the pot body 1. Specifically, as shown... Figure 4 As shown, there are multiple fixing posts 312 arranged at intervals along the circumference of the baffle 37 to make the fastening force on the mounting shell 3 more uniform. Of course, the mounting shell 3 can also be fixed to the electromagnetic coil 2, which is not limited here.

[0071] Preferably, such as Figure 5 , Figure 6 As shown, the baffle 37 is provided with a drainage structure. The drainage structure and the air outlet 34 are located on opposite sides of the baffle 37. The upper surface of the baffle 37 is provided with a guide slope 372. The height of the guide slope 372 gradually decreases from the air outlet 34 toward the drainage structure.

[0072] The air outlet 34 and the drainage structure are located at opposite ends of the baffle wall 37. Under the influence of the airflow from the air outlet 34, the liquid on the baffle wall 37 is propelled towards the drainage structure, thus accelerating the discharge of the liquid and preventing prolonged accumulation on the baffle wall 37. Simultaneously, the guide slope 372 gradually decreases towards the drainage structure, further enhancing the guiding effect on the liquid on the baffle wall 37, allowing the liquid to flow towards the drainage structure under its own gravity. Through the combined effect of the airflow and the guide slope 372, the flow efficiency of the liquid on the baffle wall 37 is significantly improved, enabling timely discharge of the liquid.

[0073] Furthermore, the guide ramp 372 is also a ramp structure on the lower side of the baffle 37, thereby guiding the airflow in the fan mounting cavity 32 through the cooling air duct 33 into the circuit board mounting cavity 31 to cool the circuit board 4. Specifically, the ramp structure is located on the top wall of at least a portion of the fan mounting cavity 32, and the height gradually decreases from the fan mounting cavity 32 to the circuit board mounting cavity 31.

[0074] It should be noted that this embodiment does not limit the specific structure of the drainage structure. In one embodiment, such as... Figure 5 As shown, the drainage structure is a drainage groove 39 located on the edge of the baffle 37 away from the air outlet 34 and extending downward at an angle, so that liquid above the baffle 37 flows to this end and is then guided downward by the drainage groove 39 to be discharged. In another embodiment, the drainage structure is a drainage hole, so that liquid can be discharged to the outside of the pot body 1 through the drainage hole.

[0075] Preferably, such as Figure 5 , Figure 6 As shown, the upper side of the baffle wall 37 is provided with a water-blocking rib 371, which together with the upper surface of the baffle wall 37 forms a water collection groove. The lower side of the baffle wall 37 is provided with a mating wall 373, which together with the bottom wall of the pot body 1 forms a circuit board mounting cavity 31.

[0076] Water-retaining ribs 371 surround the edge of the baffle wall 37, blocking liquid on the baffle wall 37 and confining it within the area enclosed by the ribs 371. The liquid cannot drip from the edge of the baffle wall 37 downwards and can only be discharged through the drainage structure, further reducing the risk of liquid dripping from the baffle wall 37 into the circuit board mounting cavity 31. The circuit board 4 is located within the space enclosed by the mating wall 373. The mating wall 373, the lower surface of the baffle wall 37, and the bottom wall of the pot body 1 together form the circuit board mounting cavity 31. Compared to blowing air into a larger, open space, the circuit board mounting cavity 31 is smaller and more enclosed, resulting in faster airflow and stronger wind force, thus providing a more significant air-cooling effect on the circuit board 4. Furthermore, the mating walls 373 on both sides of the circuit board mounting cavity 31 also block liquid leaking from the upper edge of the baffle wall 37, causing the liquid to flow downwards along the surface of the mating wall 373 and preventing it from flowing to the circuit board 4 inside the mating wall 373.

[0077] Preferably, such as Figure 7 As shown, the electromagnetic cooking appliance also includes a circuit board 4 installed in the circuit board mounting cavity 31. The circuit board 4 has a mounting side 41, which is provided with a circuit structure and faces the top wall of the circuit board mounting cavity 31.

[0078] Because the bottom wall of the pot body 1 has holes for airflow and liquid drainage, when liquid drips from the bottom wall of the pot body 1 onto the countertop, it may splash upwards and re-enter the pot body 1 through the holes, posing a risk of water contact to the circuit board 4 fixed to the bottom of the pot body 1. This solution addresses this by arranging the mounting side 41 of the circuit board 4 upwards, making the lower side of the circuit board 4 a backplate without any circuit structure. Therefore, even if liquid splashes onto this side, it will not come into contact with the circuit structure on the circuit board 4, ensuring the safety of the circuit structure on the circuit board 4.

[0079] As a preferred embodiment of this utility model, such as Figure 7 , Figure 8 As shown, the bottom wall of the pot body 1 is provided with a closed area 13 and a drain outlet 17. The upward projection of the closed area 13 covers the circuit board mounting cavity 31, and the drain outlet 17 is located on the outside of the closed area 13.

[0080] Liquid dripping onto the mounting shell 3 can be drained through the drain port 17 on the bottom wall of the pot body 1. Since the area corresponding vertically to the bottom wall of the pot body 1 and the circuit board mounting cavity 31 is a closed area 13, even if liquid splashes upwards upon impact with the tabletop, it will be blocked by the closed area 13 and cannot enter the circuit board mounting cavity 31, ensuring the dryness of the circuit board mounting cavity 31. At the same time, the drain port 17 is vertically offset from the circuit board mounting cavity 31, making the drainage position misaligned with the area where the circuit board 4 is located, further reducing the risk of liquid entering the circuit board mounting cavity 31 during drainage.

[0081] like Figure 8 As shown, there are multiple drain outlets 17, which are spaced apart circumferentially along the closed area 13.

[0082] This invention does not limit the structure of the pot body 1, which can be an integral structure. Preferably, the pot body 1 includes a side wall 11 and a base 12, which are separate structures, and the bottom wall of the base 12 constitutes the bottom wall of the pot body 1.

[0083] In one embodiment of this implementation, such as Figure 8 As shown, a water-proof rib 16 is provided between the drain outlet 17 and the enclosed area 13. The water-proof rib 16 can separate the area where the drain outlet 17 is located from the enclosed area 13, and block the liquid in the area where the drain outlet 17 is located, preventing the liquid from flowing into the enclosed area 13, thereby reducing the probability of the circuit board 4 coming into contact with water.

[0084] In another embodiment of this implementation, the height of the enclosed area 13 is higher than the height of the drain outlet 17. The enclosed area 13 is higher than the drain outlet 17, making it difficult for liquid at the drain outlet 17 to flow into the enclosed area 13. Also, because the enclosed area 13 is higher, if liquid accidentally reaches the enclosed area 13, it can flow outward under the action of gravity and will not accumulate in the enclosed area 13 for a long time.

[0085] Preferably, such as Figure 7 , Figure 8 As shown, the bottom wall of the pot body 1 is provided with an air inlet 14 and an air outlet 15. The fan mounting cavity 32 is vertically aligned with the air inlet 14, and the air outlet 34 is vertically offset from the circuit board mounting cavity 31. The air inlet 14 and the air outlet 15 are located at opposite ends of the bottom wall of the pot body 1 along the length of the bottom wall.

[0086] The air inlet 14 corresponds vertically to the fan mounting cavity 32, and is thus aligned with the air inlet of the cooling fan 5. This allows the cooling fan 5 to smoothly draw in air from the outside, ensuring smooth airflow. The exhaust vent 15 is also located on the bottom wall of the pot body 1. When the pot body 1 is placed on a table, the air inlet 14 and exhaust vent 15 are concealed. Furthermore, since the airflow from the exhaust vent 15 contacts the electromagnetic coil 2 and circuit board 4 for heat exchange, the temperature will rise. Bottom exhaust prevents users from contacting hot air, reducing the risk of burns. Additionally, the exhaust vent 15 and air inlet 14 are located at both ends of the bottom wall of the pot body 1, allowing airflow to enter the pot body 1 from one end of the electromagnetic coil 2 and circuit board 4 and exit from the other end. This allows the airflow to travel a longer distance within the pot body 1, ensuring sufficient contact with the electromagnetic coil 2 and circuit board 4 for heat exchange, improving airflow utilization and cooling effect.

[0087] like Figure 7 , Figure 8 As shown, the fan mounting cavity 32 is located at one end of the mounting housing 3 along its length. The air inlet 14 is vertically aligned with the fan mounting cavity 32, and the exhaust outlet 15 is located at the other end along the length of the mounting housing 3. One stream of air from the cooling fan 5 flows from above the mounting housing 3 to cool the electromagnetic coil 2, while the other stream flows from the circuit board mounting cavity 31 below the mounting housing 3 to cool the circuit board 4. Both air streams flow along the length of the mounting housing 3 and eventually converge at the opposite end of the mounting housing 3 and the cooling fan 5, before being discharged from the exhaust outlet 15.

[0088] Specifically, this embodiment does not limit the shape of the air inlet 14 and the air outlet 15. In one embodiment, such as Figure 8As shown, there are multiple air inlets 14 arranged in a circular pattern to match the blade arrangement of the cooling fan 5, allowing the cooling fan 5 to better draw in cool air from the outside through the air inlets 14. There are multiple air outlets 15 arranged in a straight line, with their arrangement direction perpendicular to the length direction of the mounting housing 3. Of course, the air inlets 14 and air outlets 15 can also be arranged in other ways and shapes, which are not limited here.

[0089] For any parts not mentioned in this utility model, existing technologies can be used or referenced.

[0090] The various embodiments in this specification are described in a progressive manner. The same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on describing the differences from other embodiments.

[0091] The above description is merely an embodiment of this utility model and is not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principle of this utility model should be included within the scope of the claims of this utility model.

Claims

1. An electromagnetic cooking appliance, comprising a pot body, wherein an electromagnetic coil is disposed within the pot body and a mounting shell disposed below the electromagnetic coil, characterized in that, The mounting shell has a circuit board mounting cavity and a fan mounting cavity. A cooling air duct is provided between the circuit board mounting cavity and the fan mounting cavity, connecting the circuit board mounting cavity and the fan mounting cavity. The top of the fan mounting cavity has an air outlet facing the electromagnetic coil. The top wall of the circuit board mounting cavity is closed to separate the electromagnetic coil and the circuit board mounting cavity. The circuit board mounting cavity is lower than the fan mounting cavity and located downstream of the cooling air duct. The cooling air duct is arranged laterally relative to the fan mounting cavity. The electromagnetic coil is arranged laterally downstream of the air outlet. The pot body has an exhaust port, which is located downstream of the circuit board mounting cavity and the electromagnetic coil.

2. The electromagnetic cooking appliance according to claim 1, characterized in that, The fan mounting cavity is offset vertically from the electromagnetic coil. The top of the fan mounting cavity is provided with a bent and extended air guide wall, and the air outlet is opened on the side of the air guide wall so as to face the electromagnetic coil horizontally.

3. The electromagnetic cooking appliance according to claim 2, characterized in that, The mounting shell is provided with upward-protruding water-blocking ribs, which cooperate with the air guide wall to form the air outlet.

4. The electromagnetic cooking appliance according to claim 1, characterized in that, The mounting housing includes a baffle wall, with the fan mounting cavity and the circuit board mounting cavity located below the baffle wall, and the electromagnetic coil located above the baffle wall, the baffle wall separating the electromagnetic coil and the circuit board mounting cavity.

5. The electromagnetic cooking appliance according to claim 4, characterized in that, The baffle is provided with a drainage structure, and the drainage structure and the air outlet are located on opposite sides of the baffle. The upper surface of the baffle is provided with a guide slope, and the height of the guide slope gradually decreases from the air outlet towards the drainage structure.

6. The electromagnetic cooking appliance according to claim 4, characterized in that, The upper side of the baffle wall is provided with a water-blocking rib, which together with the upper surface of the baffle wall forms a water collection groove. The lower side of the baffle wall is provided with a mating wall, which cooperates with the bottom wall of the pot body to form the circuit board mounting cavity.

7. The electromagnetic cooking appliance according to claim 1, characterized in that, The electromagnetic cooking appliance also includes a circuit board installed in the circuit board mounting cavity. The circuit board has a mounting side with a circuit structure, and the mounting side faces the top wall of the circuit board mounting cavity.

8. The electromagnetic cooking appliance according to claim 1, characterized in that, The bottom wall of the pot body is provided with a closed area and a drain outlet. The upward projection of the closed area covers the circuit board mounting cavity, and the drain outlet is located on the outside of the closed area.

9. The electromagnetic cooking appliance according to claim 8, characterized in that, A water-resistant rib is provided between the drain outlet and the enclosed area; or... The height of the enclosed area is higher than the height of the drain outlet.

10. The electromagnetic cooking utensil according to claim 1, characterized in that, the bottom wall of the pot body is provided with an air inlet and the air outlet, the fan mounting cavity is arranged in correspondence with the air inlet in the up-down direction, the air outlet is arranged in dislocation with the circuit board mounting cavity in the up-down direction, and the air inlet and the air outlet are located at two ends of the bottom wall of the pot body in the length direction of the bottom wall of the pot body.

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