Dynamic microstrip device, measurement system, determination method, device and storage medium

Abstract

The present application relates to a dynamic microstrip device, a measurement system, a determination method, a device and a storage medium. The dynamic microstrip device includes: a conductor strip; a base, the base is also provided with support columns arranged at intervals, and the support columns arranged at intervals are respectively used to support the two ends of the conductor strip; an air core plate is arranged between the support columns and is located below the conductor strip, has a spacing with the conductor strip, and is suitable for moving up and down relative to the base to adjust the spacing with the conductor strip. By providing a gap between the conductor strip of the dynamic microstrip device and the base, the transmission mode of the dynamic microstrip device is made to be an ideal TEM mode; at the same time, the impedance of the dynamic microstrip device can be changed by adjusting the spacing between the air core seat and the conductor strip, so as to facilitate the dynamic impedance matching with the signal source, so that the probe can perform accurate electric field coupling characterization and obtain accurate calibration factors.

Description

Technical Field

[0001] The present application relates to the field of probe calibration technology, and in particular to a dynamic microstrip device, a measurement system, a determination method, a device, and a storage medium. Background Art

[0002] Currently, electromagnetic compatibility testing is primarily performed using probes. Whether measuring in the time or frequency domain, these probes require calibration factors within a certain frequency band. Traditionally, this has been done using the microstrip line method.

[0003] However, since the impedance of the microstrip line is fixed, the impedance of the microstrip line may not match the impedance of the signal source, causing the signal to be reflected at the impedance-mismatched port, that is, at the connection between the signal source and the microstrip line. This causes the signal detected by the probe to be different from the signal output by the signal source, making it difficult to obtain an accurate calibration factor. Summary of the Invention

[0004] Based on this, it is necessary to provide a dynamic microstrip device, measurement system, determination method, device and storage medium that can obtain accurate calibration factors in response to the above technical problems.

[0005] A dynamic microstrip device, comprising:

[0006] Conductor tape;

[0007] A base, wherein the base is further provided with support columns arranged at intervals, and the support columns arranged at intervals are respectively used to support the two ends of the conductor strip;

[0008] The air core plate is arranged between the support columns and below the conductor strip, has a distance from the conductor strip, and is suitable for moving up and down relative to the base to adjust the distance from the conductor strip.

[0009] By creating a gap between the conductor strip and the base of the dynamic microstrip device, the medium above and below the conductor strip is air, ensuring that the signal transmission speed around the conductor strip is the same, thereby making the dynamic microstrip device's transmission mode the ideal TEM mode. At the same time, the impedance of the dynamic microstrip device can be changed by adjusting the spacing between the air core and the conductor strip, facilitating dynamic impedance matching with the signal source. Therefore, by using the dynamic microstrip device instead of the microstrip line to obtain the calibration factor, the signal detected by the probe is identical to the signal output by the signal source, allowing the probe to accurately characterize the electric field coupling, thereby obtaining an accurate calibration factor.

[0010] In one embodiment, the air core panel includes: a movable seat, a floating plate and a machine component, the movable seat is arranged between the support columns, the upper surface of the movable seat is provided with a first concave hole corresponding to the shape of the floating plate, and a second concave hole corresponding to the shape of the machine component and passing through the movable seat is provided below the first concave hole, and the first concave hole is connected to the second concave hole; the floating plate is suitable for being arranged in the first concave hole and fixedly connected to the movable seat; the cross-section of the machine component is "T"-shaped, the bottom of the machine component is provided with an external thread, and the bottom surface of the machine component is provided with a flat hole. When the machine component is arranged in the first concave hole, the bottom of the machine component passes through the movable seat; the base is also provided with a threaded hole passing through the base, the position of the threaded hole corresponds to the position of the first concave hole, and the bottom of the machine component is suitable for being screwed into the threaded hole.

[0011] In one embodiment, both ends of the movable seat are provided with grooves running through the movable seat from top to bottom, and the support columns are located in the grooves at both ends of the movable seat to guide the movable seat to move up and down.

[0012] In one embodiment, the method further comprises: a plurality of connectors, wherein the plurality of connectors are respectively disposed at both ends of the conductor strip, and the conductor strip is connected to the support column through the connectors.

[0013] A measurement system includes a vector network analyzer, a near-field probe, an electronic load, and the dynamic microstrip device described above, wherein the output port of the vector network analyzer is electrically connected to one end of a conductor strip of the dynamic microstrip device, the vector network analyzer is used to output a radio frequency signal, and the other end of the conductor strip is electrically connected to the electronic load. The near-field probe is arranged opposite to the conductor strip of the dynamic microstrip device, the near-field probe is electrically connected to the input port of the vector network analyzer, and the near-field probe generates an induced electric field signal after the vector network analyzer outputs the radio frequency signal. The vector network analyzer is also used to measure the forward transmission coefficient.

[0014] A vector network analyzer (VNA) emits an RF signal to apply source excitation to the dynamic microstrip device. Since the dynamic microstrip device's transmission mode is the ideal TEM mode, and the impedance of the dynamic microstrip device is pre-adjusted to match the impedance of the VNA, the signal is not reflected at the connection between the VNA and the dynamic microstrip device. This allows the signal to be fully transmitted to the dynamic microstrip device, where it transmits the TEM wave. Furthermore, since the near-field probe is facing the conductor strip, the TEM wave has no electric or magnetic field components in the transmission direction. Therefore, the induced electric field signal generated by the near-field probe completely corresponds to the output signal of the VNA. After the induced electric field signal is input into the VNA, an accurate calibration factor can be derived based on the measured parameters.

[0015] In one embodiment, the method further comprises: a displacement device for adjusting the position of the near-field probe to adjust the height of the near-field probe relative to the conductor strip.

[0016] A calibration factor determination method, performed based on the measurement system described above, comprises:

[0017] After the vector network analyzer sends a radio frequency signal, obtaining a forward transmission coefficient measured by the vector network analyzer;

[0018] Obtaining the impedance of the dynamic microstrip device and the structure function of the dynamic microstrip device;

[0019] A calibration factor is determined based on the acquired data.

[0020] In one embodiment, obtaining the structure function of the dynamic microstrip device includes:

[0021] Obtaining a first distance between the conductor strip and the base, a second distance between the conductor strip and the near-field probe, and a thickness of the conductor strip;

[0022] A structure function of the dynamic microstrip device is obtained based on the first spacing, the second spacing, and the thickness of the conductor strip.

[0023] A calibration factor determination device, comprising:

[0024] A first acquisition module is used to obtain a forward transmission coefficient measured by the vector network analyzer after the vector network analyzer sends a radio frequency signal;

[0025] A second acquisition module is used to obtain the impedance of the dynamic microstrip device and the structure function of the dynamic microstrip device;

[0026] A determination module determines a magnetic field strength calibration factor based on the acquired data.

[0027] A computer device includes a memory and a processor, wherein the memory stores a computer program, and when the processor executes the computer program, the following steps are implemented:

[0028] After the vector network analyzer sends a radio frequency signal, obtaining a forward transmission coefficient measured by the vector network analyzer;

[0029] Obtaining the impedance of the dynamic microstrip device and the structure function of the dynamic microstrip device;

[0030] A calibration factor is determined based on the acquired data.

[0031] A computer-readable storage medium stores a computer program, which, when executed by a processor, implements the following steps:

[0032] After the vector network analyzer sends a radio frequency signal, obtaining a forward transmission coefficient measured by the vector network analyzer;

[0033] Obtaining the impedance of the dynamic microstrip device and the structure function of the dynamic microstrip device;

[0034] A calibration factor is determined based on the acquired data.

[0035] The advantages of the above-mentioned calibration factor determination method, apparatus, computer device and storage medium over the prior art are the same as the advantages of the above-mentioned measurement system over the prior art, and will not be repeated here.

[0036] A measurement system includes a signal source, a spectrum analyzer, a near-field probe, an electronic load, and the dynamic microstrip device described above, wherein the signal source is electrically connected to one end of a conductor strip of the dynamic microstrip device and is used to output a radio frequency signal. The other end of the conductor strip is electrically connected to the electronic load. The near-field probe is arranged opposite to the conductor strip of the dynamic microstrip device and generates an induced electric field signal after the signal source outputs the radio frequency signal. The near-field probe is electrically connected to the spectrum analyzer and the spectrum analyzer is used to measure the induced electric field signal.

[0037] A radio frequency signal is emitted from a signal source to apply source excitation to the dynamic microstrip device. Since the transmission mode of the dynamic microstrip device is an ideal TEM mode, and the impedance of the dynamic microstrip device is pre-adjusted to match the impedance of the signal source, the signal will not be reflected at the connection between the signal source and the dynamic microstrip device. Therefore, the signal is completely transmitted to the dynamic microstrip device and the TEM wave is transmitted in the dynamic microstrip device. Since the near-field probe is facing the conductor strip, the TEM wave has no electric field and magnetic field components in the transmission direction. Therefore, the induced electric field signal generated by the near-field probe completely corresponds to the output signal. After the induced electric field signal is input into the spectrum analyzer, an accurate calibration factor can be obtained based on the signal parameters output by the signal source and the measurement parameters.

[0038] In one embodiment, the method further comprises: a displacement device for adjusting the position of the near-field probe to adjust the height of the near-field probe relative to the conductor strip.

[0039] A calibration factor determination method, performed based on the measurement system described above, comprises:

[0040] After the signal source outputs a radio frequency signal, obtaining an induced electric field signal value of the near-field probe measured by the spectrum analyzer;

[0041] Obtaining the impedance of the dynamic microstrip device and the structure function of the dynamic microstrip device;

[0042] A calibration factor is determined based on the acquired data.

[0043] In one embodiment, obtaining the structure function of the dynamic microstrip device includes:

[0044] Obtaining a first distance between the conductor strip and the base, a second distance between the conductor strip and the near-field probe, and a thickness of the conductor strip;

[0045] A structure function of the dynamic microstrip device is obtained based on the first spacing, the second spacing, and the thickness of the conductor strip.

[0046] A calibration factor determination device, comprising:

[0047] A first acquisition module is used to obtain the induced electric field signal value of the near-field probe measured by the spectrum analyzer after the signal source is used to output the radio frequency signal;

[0048] A second acquisition module is used to obtain the impedance of the dynamic microstrip device and the structure function of the dynamic microstrip device;

[0049] A determination module is used to determine a magnetic field strength calibration factor based on the acquired data.

[0050] A computer device includes a memory and a processor, wherein the memory stores a computer program, and when the processor executes the computer program, the following steps are implemented:

[0051] After the signal source outputs a radio frequency signal, obtaining an induced electric field signal value of the near-field probe measured by the spectrum analyzer;

[0052] Obtaining the impedance of the dynamic microstrip device and the structure function of the dynamic microstrip device;

[0053] A calibration factor is determined based on the acquired data.

[0054] A computer-readable storage medium stores a computer program, which, when executed by a processor, implements the following steps:

[0055] After the signal source outputs a radio frequency signal, obtaining an induced electric field signal value of the near-field probe measured by the spectrum analyzer;

[0056] Obtaining the impedance of the dynamic microstrip device and the structure function of the dynamic microstrip device;

[0057] A calibration factor is determined based on the acquired data.

[0058] The advantages of the above-mentioned calibration factor determination method, apparatus, computer device and storage medium over the prior art are the same as the advantages of the above-mentioned measurement system over the prior art, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0059] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the conventional technology, the following briefly introduces the drawings required for use in the embodiments or the conventional technology descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0060] Figure 1 is a schematic structural diagram of a dynamic microstrip device in one embodiment;

[0061] Figure 2 is an exploded view of a dynamic microstrip device in one embodiment;

[0062] Figure 3 is a structural block diagram of a measurement system in one embodiment;

[0063] Figure 4 is a structural block diagram of a measurement system in another embodiment;

[0064] Figure 5 Schematic diagram of a flow chart of a method for determining a calibration factor in one embodiment;

[0065] Figure 6 is a flow chart of a method for determining a calibration factor in another embodiment;

[0066] Figure 7 FIG. 1 is a structural block diagram of a calibration factor determination apparatus in one embodiment.

[0067] Description of reference numerals:

[0068] 1-conductor strip, 2-base, 21-support column, 22-threaded hole, 3-air core plate, 31-floating plate, 32-machine component, 33-movable seat, 35-first concave hole, 34-second concave hole. DETAILED DESCRIPTION

[0069] To facilitate understanding of the present application, the present application will be described more fully below with reference to the accompanying drawings. The accompanying drawings provide embodiments of the present application. However, the present application may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to make the disclosure of the present application more thorough and comprehensive.

[0070] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application.

[0071] It will be understood that the terms "first", "second", etc. used in this application may be used to describe various elements in this document, but these elements are not limited by these terms. These terms are only used to distinguish a first element from another element.

[0072] Spatially relative terms such as "under," "beneath," "beneath," "under," "above," "above," etc., may be used herein to describe the relationship of an element or feature shown in the figures to other elements or features. It should be understood that in addition to the orientations shown in the figures, spatially relative terms also include different orientations of the device in use and operation. For example, if the device in the drawings is turned over, the element or feature described as "under" or "beneath" or "beneath" the other elements will be oriented as "above" the other elements or features. Thus, the exemplary terms "under" and "under" can include both upper and lower orientations. In addition, the device can also include alternative orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptors used herein are interpreted accordingly.

[0073] It should be noted that when an element is considered to be "connected" to another element, it can be directly connected to the other element or connected to the other element through an intervening element. In addition, the "connection" in the following embodiments should be understood as "electrical connection", "communication connection", etc., if there is transmission of electrical signals or data between the connected objects.

[0074] When used herein, the singular forms "a", "an", and "the" may also include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "include / comprise" or "have" and the like specify the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

[0075] In one embodiment, Figure 1 As shown, a dynamic microstrip device 302 is provided, comprising:

[0076] Conductor strip 1;

[0077] The base 2 is further provided with spaced support columns 21, which are used to support the two ends of the conductor strip 1 respectively;

[0078] The air core board 3 is disposed between the support columns 21 and below the conductor strip 1 , with a distance therebetween. The air core board 3 is adapted to move up and down relative to the base 2 to adjust the distance therebetween.

[0079] The dynamic microstrip device 302 described above creates a gap between its conductor strip 1 and base 2, ensuring that the medium above and below the conductor strip 1 is air. This ensures that the signal transmission speed around the conductor strip 1 is uniform, thereby achieving an ideal TEM transmission mode. Furthermore, the impedance of the dynamic microstrip device 302 can be varied by adjusting the distance between the air core and the conductor strip 1, facilitating dynamic impedance matching with the signal source. Therefore, by using the dynamic microstrip device 302 in place of a microstrip line to obtain a calibration factor, the signal detected by the probe is identical to the signal output by the signal source, enabling accurate electric field coupling characterization and thus accurate calibration factors.

[0080] In addition, the distance between the air core plate 3 and the conductor strip 1 is adjusted by adjusting the air core plate 3 so that it moves up and down relative to the base 2, instead of adjusting the conductor strip 1. This ensures that the conductor strip 1 always remains stable during the adjustment process, thereby ensuring the stability of the signal transmission process during the impedance adjustment process.

[0081] In application, the upper surface of the air core plate 3 is parallel to the lower surface of the conductor strip 1 so that the thickness of the air dielectric layer between the air core plate 3 and the conductor strip 1 is uniform.

[0082] In one embodiment, Figure 2 As shown, the air core plate 3 includes: a movable seat 33, a floating plate 31 and a machine component 32. The movable seat 33 is arranged between the support columns 21. The upper surface of the movable seat 33 is provided with a first concave hole 35 corresponding to the shape of the floating plate 31, and a second concave hole 34 corresponding to the shape of the machine component 32 and passing through the movable seat 33 is provided below the first concave hole 35, and the first concave hole 35 is communicated with the second concave hole 34; the floating plate 31 is suitable for being arranged in the first concave hole 35 and fixedly connected to the movable seat 33; the cross-section of the machine component 32 is "T"-shaped, the bottom of the machine component 32 is provided with an external thread, and the bottom surface of the machine component 32 is provided with a flat hole. When the machine component 32 is arranged in the first concave hole 35, the bottom of the machine component 32 passes through the movable seat 33; the base 2 is also provided with a threaded hole 22 passing through the base 2, and the position of the threaded hole 22 corresponds to the position of the second concave hole 34, and the bottom of the machine component 32 is suitable for being screwed into the threaded hole 22.

[0083] The rice component 32 is adapted to rotate within the second recessed hole 34. A flat hole is a hole that is not circular and can be an elliptical hole, a polygonal hole, or an irregular hole. The floating plate 31 is connected to the movable base 33 via bolts, allowing the rice component 32 and the floating plate 31 to be detached from the movable base 33.

[0084] Specifically, by providing a flat hole on the bottom surface of the machine component 32, the machine component 32 can be driven to rotate by an "L"-shaped wrench whose end is loosely fitted in the flat hole. For example, the flat hole provided on the bottom surface of the machine component 32 is a regular hexagonal hole. Then, by inserting one end of an inner hexagonal wrench into the flat hole and turning the inner hexagonal wrench, the machine component 32 can be driven to rotate in the second concave hole 34. Since the bottom of the machine rice component 32 is screwed into the threaded hole 22, the rotation of the machine rice component 32 will cause the machine rice component 32 to move up and down. When the machine rice component 32 moves up, the top of the machine rice component 32 will apply an upward thrust to the float plate 31. Since the float plate 31 is fixedly connected to the movable seat 33, the float plate 31 and the movable seat 33 will move upward as a whole, thereby realizing the upward movement of the air core plate 3. When the machine rice component 32 moves down, since the cross-section of the machine rice component 32 is "T"-shaped, the corresponding cross-sectional shape of the second concave hole 34 is also "T"-shaped, when the machine rice component 32 moves down, its top will apply a thrust to the movable seat 33, causing the movable seat 33 to move downward, thereby realizing the downward movement of the air core plate 3. At the same time, the bottom of the machine component 32 is threadedly connected to the threaded hole 22, which effectively ensures that when the machine component 32 is not rotating, the machine component 32 is in a stable state, thereby keeping the movable seat 33 and the floating plate 31 supported by the machine component 32 stable. After the adjustment is completed, the distance between the air core plate 3 and the conductor strip 1 is fixed, thereby fixing the impedance of the dynamic microstrip device 302.

[0085] In one embodiment, grooves are respectively provided at both ends of the movable seat 33 and pass through the grooves up and down. The support columns 21 are respectively located in the grooves at both ends of the movable seat 33 to guide the movable seat 33 to move up and down.

[0086] Specifically, the cross-sectional shape of the groove corresponds to the cross-sectional shape of the support column 21. When the support column 21 is respectively located in the grooves at both ends of the movable seat 33, under the restriction of the support column 21, the movable seat 33 cannot move horizontally but can only move up and down, ensuring that the movable seat 33 will not tilt during the adjustment process.

[0087] In one embodiment, the present invention further comprises: a plurality of connectors, which are respectively disposed at both ends of the conductor strip 1 , and the conductor strip 1 is connected to the support column 21 through the connectors.

[0088] Specifically, threaded holes 22 are provided on both the connector and the support column 21. The connector is bolted to the support column 21, and the connector is fixedly connected to the conductor strip 1, which can be connected by welding. Providing connectors at both ends of the conductor strip 1 facilitates electrical connection between the dynamic microstrip device 302 and external devices.

[0089] In one embodiment, Figure 3As shown, a measurement system 300 is provided, including a vector network analyzer 301, a near-field probe 303, an electronic load 304, and the dynamic microstrip device 302 as described above. The output port of the vector network analyzer 301 is electrically connected to one end of the conductor strip 1 of the dynamic microstrip device 302. The vector network analyzer 301 is used to output a radio frequency signal. The other end of the conductor strip 1 is electrically connected to the electronic load 304. The near-field probe 303 is arranged opposite to the conductor strip 1 of the dynamic microstrip device 302. The near-field probe 303 is electrically connected to the input port of the vector network analyzer 301. The near-field probe 303 generates an induced electric field signal after the vector network analyzer 301 outputs the radio frequency signal. The vector network analyzer 301 is also used to measure the forward transmission coefficient.

[0090] The measurement system 300 uses a vector network analyzer 301 to emit an RF signal, applying source excitation to a dynamic microstrip device 302. Because the transmission mode of the dynamic microstrip device 302 is an ideal TEM mode, and the impedance of the dynamic microstrip device 302 is pre-adjusted to match the impedance of the vector network analyzer 301, the signal is not reflected at the connection between the vector network analyzer 301 and the dynamic microstrip device 302. This allows the signal to be fully transmitted to the dynamic microstrip device 302, where the TEM wave is transmitted. Furthermore, because the near-field probe 303 is facing the conductor strip 1, the TEM wave has no electric field or magnetic field components in the transmission direction. Therefore, the induced electric field signal generated by the near-field probe 303 completely corresponds to the output signal of the vector network analyzer 301. After the induced electric field signal is input into the vector network analyzer 301, an accurate calibration factor can be obtained based on the measurement parameters.

[0091] In one embodiment, the measurement system 300 further includes a displacement device, which is used to adjust the position of the near-field probe 303 to adjust the height of the near-field probe 303 relative to the conductor strip 1 .

[0092] The displacement device may be a three-dimensional displacement stage.

[0093] Specifically, the distance between the near-field probe 303 and the conductor strip 1 will affect the detection effect of the near-field probe 303. The position of the near-field probe 303 is adjusted by the displacement device to adjust the distance between the near-field probe 303 and the conductor strip 1, so that the distance between the near-field probe 303 and the conductor strip 1 is a reasonable distance, thereby enabling the near-field probe 303 to have a better detection effect.

[0094] In one embodiment, Figure 5 As shown, a calibration factor determination method is provided, which is performed based on the above measurement system 300, including:

[0095] S501 : After the vector network analyzer 301 sends a radio frequency signal, a forward transmission coefficient measured by the vector network analyzer 301 is obtained.

[0096] Specifically, vector network analysis measures the complex transmission characteristics of a two-port microwave network system consisting of a near-field probe 303 and a dynamic microstrip device 302, thereby obtaining calibration factors. The process involves the signal source of vector network analyzer 301 generating a sinusoidal test signal. Port 1 of vector network analyzer 301 outputs this signal to dynamic microstrip device 302, generating a TEM wave on conductor strip 1 of dynamic microstrip device 302. Near-field probe 303 senses the TEM wave, generating an induced electric field signal that is transmitted to port 2 of vector network analyzer 301. Port 2 receives the induced electric field signal from near-field probe 303, and the forward transmission coefficient from port 1 to port 2 is calculated.

[0097] S502 : Obtain the impedance of the dynamic microstrip device 302 and the structure function of the dynamic microstrip device 302 .

[0098] Specifically, the impedance of the dynamic microstrip device 302 can be obtained by pre-measurement, where Y1 and Y2 are structural functions of the microstrip structure, Y1 = h + t, where h is the height of the probe from the microstrip strip during measurement, and t is the thickness of the microstrip line. Y2 = Y1 + 2D, where D is the height of the microstrip line from the ground plane.

[0099] S503: Determine a calibration factor based on the acquired data.

[0100] Specifically, the process of determining the calibration factor is as follows:

[0101] According to Faraday's law: the probe voltage V probe =SBω,

[0102] Where S is the probe loop area, B is the magnetic induction intensity, and ω is the angular frequency.

[0103] ω=2πf;

[0104] B=μR(h)I in ;

[0105] Y1=h+t,Y2=Y1+2D;

[0106]

[0107] Among them, V a is the input voltage and Z is the impedance.

[0108]

[0109] Wherein, S21 represents the forward transmission coefficient from port 1 to port 2 when port 2 is matched.

[0110] Taking magnetic field strength as an example,

[0111] So the magnetic field strength calibration factor

[0112] In one embodiment, obtaining the structure function of the dynamic microstrip device 302 includes:

[0113] S5021 : Obtain a first distance between the conductor strip 1 and the base 2 , a second distance between the conductor strip 1 and the near-field probe 303 , and a thickness of the conductor strip 1 .

[0114] S5022 : Obtaining a structure function of the dynamic microstrip device 302 based on the first spacing, the second spacing, and the thickness of the conductor strip 1 .

[0115] The parameters included in Y1 and Y2 are calculated by SI9000 to guide the design of the dynamic microstrip device 302 so that the impedance of the dynamic microstrip device 302 is a predetermined value, such as 50Ω.

[0116] Therefore, the values ​​of the various parameters included in Y1 and Y2 are known and can be directly obtained, and the impedance of the dynamic microstrip device 302 is also determined. Taking the calculation of the magnetic field strength calibration factor as an example, S21 is measured by the vector network analyzer 301. The values ​​of various parameters included in Y1 and Y2 are known. It can be calculated that, if the impedance of the dynamic microstrip device 302 is known, the magnetic field strength calibration factor can be calculated.

[0117] In another embodiment, Figure 4 As shown, a measurement system 400 is provided, including a signal source 401, a spectrum analyzer 402, a near-field probe 303, an electronic load 304, and the dynamic microstrip device 302 as described above. The signal source 401 is electrically connected to one end of the conductor strip 1 of the dynamic microstrip device 302, and the signal source 401 is used to output a radio frequency signal. The other end of the conductor strip 1 is electrically connected to the electronic load 304. The near-field probe 303 is arranged opposite to the conductor strip 1 of the dynamic microstrip device 302. After the signal source 401 outputs the radio frequency signal, the near-field probe 303 generates an induced electric field signal. The near-field probe 303 is electrically connected to the spectrum analyzer 402, and the spectrum analyzer 402 is used to measure the induced electric field signal.

[0118] A radio frequency signal is emitted by signal source 401 to apply source excitation to the dynamic microstrip device 302. Since the transmission mode of the dynamic microstrip device 302 is an ideal TEM mode, and the impedance of the dynamic microstrip device 302 is pre-adjusted, the impedance of the dynamic microstrip device 302 and the signal source 401 are matched. Therefore, the signal will not be reflected at the connection between the signal source 401 and the dynamic microstrip device 302, so that the signal is completely transmitted to the dynamic microstrip device 302 and the TEM wave is transmitted in the dynamic microstrip device 302. Since the near-field probe 303 is facing the conductor strip 1, the TEM wave has no electric field and magnetic field components in the transmission direction. Therefore, the induced electric field signal generated by the near-field probe 303 completely corresponds to the output signal. After the induced electric field signal is input into the spectrum analyzer 402, an accurate calibration factor can be obtained based on the signal parameters output by the signal source 401 and the measurement parameters.

[0119] In one embodiment, the measurement system 400 further includes a displacement device, which is used to adjust the position of the near-field probe 303 to adjust the height of the near-field probe 303 relative to the conductor strip 1 .

[0120] In one embodiment, Figure 6 As shown, a calibration factor determination method is provided, which is performed based on the above measurement system 400, including:

[0121] S601: After the signal source 401 outputs the radio frequency signal, the induced electric field signal value of the near-field probe 303 measured by the spectrum analyzer 402 is obtained;

[0122] S602: Obtain the impedance of the dynamic microstrip device 302 and the structure function of the dynamic microstrip device 302;

[0123] S603: Determine a calibration factor based on the acquired data.

[0124] Specifically, according to the above description, the magnetic field strength calibration factor When the values ​​of the parameters included in the structure functions Y1 and Y2 are known, It can be calculated that V a is the input voltage, is the voltage of the signal output by the signal source 401, Z is the impedance of the dynamic microstrip device 302, V probe CF is calculated by measuring with spectrum analyzer 502. m The relevant data can be determined, therefore, CF m It can be calculated.

[0125] In one embodiment, obtaining the structure function of the dynamic microstrip device 302 includes:

[0126] S6021: Obtain a first distance between the conductor strip 1 and the base 2 , a second distance between the conductor strip 1 and the near-field probe 303 , and a thickness of the conductor strip 1 .

[0127] S6022 : Obtaining a structure function of the dynamic microstrip device 302 based on the first spacing, the second spacing, and the thickness of the conductor strip 1 .

[0128] It should be understood that although Figure 5 and Figure 6 The steps in the flowchart are shown in sequence as indicated by the arrows, but these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified in this document, there is no strict order restriction for the execution of these steps, and these steps can be executed in other orders. In addition, Figure 5 and Figure 6 At least part of the steps may include multiple steps or multiple stages. These steps or stages are not necessarily performed at the same time, but can be performed at different times. The order of execution of these steps or stages is not necessarily one by one, but can be performed in turn or alternately with other steps or at least part of the steps or stages in other steps.

[0129] In one embodiment, Figure 7 As shown, a calibration factor determination device 700 is provided, comprising: a first acquisition module 701, a second acquisition module 702 and a determination module 703, wherein:

[0130] A first acquisition module 701 is configured to acquire a forward transmission coefficient measured by the vector network analyzer 301 after the vector network analyzer 301 sends a radio frequency signal;

[0131] A second acquisition module 702 is configured to acquire the impedance of the dynamic microstrip device 302 and the structure function of the dynamic microstrip device 302;

[0132] The determination module 703 determines a magnetic field strength calibration factor based on the acquired data.

[0133] In one embodiment, the second acquisition module 702 includes: an acquisition unit and a calculation unit, the acquisition unit is used to obtain a first spacing between the conductor strip 1 and the base 2, a second spacing between the conductor strip 1 and the near-field probe, and the thickness of the conductor strip 1; the calculation unit is used to obtain the structure function of the dynamic microstrip device 302 based on the first spacing, the second spacing, and the thickness of the conductor strip 1.

[0134] In another embodiment, Figure 7 As shown, a calibration factor determination apparatus 700 is provided, comprising:

[0135] A first acquisition module 701 is configured to acquire an induced electric field signal value of the near-field probe 303 measured by the spectrum analyzer 402 after the signal source 401 is configured to output a radio frequency signal;

[0136] A second acquisition module 702 is configured to acquire the impedance of the dynamic microstrip device 302 and the structure function of the dynamic microstrip device 302;

[0137] The determination module 703 is configured to determine a magnetic field strength calibration factor based on the acquired data.

[0138] In one embodiment, the second acquisition module 702 includes: an acquisition unit and a calculation unit, the acquisition unit is used to obtain a first spacing between the conductor strip 1 and the base 2, a second spacing between the conductor strip 1 and the near-field probe, and the thickness of the conductor strip 1; the calculation unit is used to obtain the structure function of the dynamic microstrip device 302 based on the first spacing, the second spacing, and the thickness of the conductor strip 1.

[0139] For the specific limitations of the calibration factor determination device 700, please refer to the limitations of the calibration factor determination method in the corresponding embodiment above, which will not be repeated here. The various modules in the above-mentioned calibration factor determination device 700 can be implemented in whole or in part by software, hardware and a combination thereof. The above-mentioned modules can be embedded in or independent of the processor in the computer device in the form of hardware, or can be stored in the memory in the computer device in the form of software, so that the processor can call and execute the operations corresponding to the above modules. It should be noted that the division of modules in the embodiment of the present application is schematic and is only a logical function division. There may be other division methods in actual implementation.

[0140] In one embodiment, a computer device is provided, including a memory and a processor, wherein a computer program is stored in the memory, and when the processor executes the computer program, the following steps are implemented:

[0141] After the vector network analyzer 301 sends a radio frequency signal, obtaining a forward transmission coefficient measured by the vector network analyzer 301;

[0142] Obtaining the impedance of the dynamic microstrip device 302 and the structure function of the dynamic microstrip device 302;

[0143] A calibration factor is determined based on the acquired data.

[0144] In one embodiment, when the processor executes the computer program, the processor further implements the following steps:

[0145] A first spacing between the conductor strip 1 and the base 2 , a second spacing between the conductor strip 1 and the near-field probe 303 , and the thickness of the conductor strip 1 are obtained; and a structure function of the dynamic microstrip device 302 is obtained based on the first spacing, the second spacing, and the thickness of the conductor strip 1 .

[0146] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the following steps are implemented:

[0147] After the vector network analyzer 301 sends a radio frequency signal, obtaining a forward transmission coefficient measured by the vector network analyzer 301;

[0148] Obtaining the impedance of the dynamic microstrip device 302 and the structure function of the dynamic microstrip device 302;

[0149] A calibration factor is determined based on the acquired data.

[0150] In one embodiment, when the computer program is executed by a processor, the following steps are further implemented:

[0151] A first spacing between the conductor strip 1 and the base 2 , a second spacing between the conductor strip 1 and the near-field probe 303 , and the thickness of the conductor strip 1 are obtained; and a structure function of the dynamic microstrip device 302 is obtained based on the first spacing, the second spacing, and the thickness of the conductor strip 1 .

[0152] In another embodiment, a computer device is provided, including a memory and a processor, wherein a computer program is stored in the memory, and when the processor executes the computer program, the following steps are implemented:

[0153] After the signal source 401 outputs the radio frequency signal, the induced electric field signal value of the near-field probe 303 measured by the spectrum analyzer 402 is obtained;

[0154] Obtaining the impedance of the dynamic microstrip device 302 and the structure function of the dynamic microstrip device 302;

[0155] A calibration factor is determined based on the acquired data.

[0156] In one embodiment, when the processor executes the computer program, the processor further implements the following steps:

[0157] A first spacing between the conductor strip 1 and the base 2 , a second spacing between the conductor strip 1 and the near-field probe 303 , and the thickness of the conductor strip 1 are obtained; and a structure function of the dynamic microstrip device 302 is obtained based on the first spacing, the second spacing, and the thickness of the conductor strip 1 .

[0158] In another embodiment, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the following steps are implemented:

[0159] After the signal source 401 outputs the radio frequency signal, the induced electric field signal value of the near-field probe 303 measured by the spectrum analyzer 402 is obtained;

[0160] Obtaining the impedance of the dynamic microstrip device 302 and the structure function of the dynamic microstrip device 302;

[0161] A calibration factor is determined based on the acquired data.

[0162] In one embodiment, when the computer program is executed by a processor, the following steps are further implemented:

[0163] A first spacing between the conductor strip 1 and the base 2 , a second spacing between the conductor strip 1 and the near-field probe 303 , and the thickness of the conductor strip 1 are obtained; and a structure function of the dynamic microstrip device 302 is obtained based on the first spacing, the second spacing, and the thickness of the conductor strip 1 .

[0164] Those skilled in the art will appreciate that all or part of the processes in the above-mentioned embodiment methods can be implemented by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application may include at least one of non-volatile and volatile memory. Non-volatile memory may include read-only memory (ROM), magnetic tape, floppy disk, flash memory or optical memory, etc. Volatile memory may include random access memory (RAM) or external cache memory. As an illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM).

[0165] Throughout this specification, references to terms such as "some embodiments," "other embodiments," and "desired embodiments" indicate that a particular feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. Although these terms are used interchangeably throughout this specification, they do not necessarily refer to the same embodiment or example.

[0166] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0167] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art could make various modifications and improvements without departing from the spirit of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A dynamic microstrip device, characterized in that: include: Conductor tape; A base, wherein the base is further provided with support columns arranged at intervals, and the support columns arranged at intervals are respectively used to support the two ends of the conductor strip; An air core plate is disposed between the support columns and below the conductor strip, has a spacing with the conductor strip, and is suitable for moving up and down relative to the base to adjust the spacing with the conductor strip; The air core plate includes: a movable seat, a floating plate and a machine component. The movable seat is arranged between the support columns. The upper surface of the movable seat is provided with a first concave hole corresponding to the shape of the floating plate, and a second concave hole corresponding to the shape of the machine component and penetrating the movable seat is provided below the first concave hole, and the first concave hole is connected to the second concave hole; the floating plate is suitable for being arranged in the first concave hole and fixedly connected to the movable seat; the cross-section of the machine component is "T" shaped, the bottom of the machine component is provided with an external thread, and the bottom surface of the machine component is provided with a flat hole. When the machine component is arranged in the first concave hole, the bottom of the machine component penetrates the movable seat; the base is also provided with a threaded hole penetrating the base, the position of the threaded hole corresponds to the position of the second concave hole, and the bottom of the machine component is suitable for being screwed into the threaded hole.

2. The dynamic microstrip device according to claim 1, characterized in that: The two ends of the movable seat are respectively provided with grooves penetrating up and down, and the support columns are respectively located in the grooves at the two ends of the movable seat to guide the movable seat to move up and down.

3. A measurement system, characterized in that: The invention comprises a vector network analyzer, a near-field probe, an electronic load and the dynamic microstrip device as claimed in any one of claims 1 to 2, wherein the output port of the vector network analyzer is electrically connected to one end of the conductor strip of the dynamic microstrip device, the vector network analyzer is used to output a radio frequency signal, the other end of the conductor strip is electrically connected to the electronic load, the near-field probe is arranged facing the conductor strip of the dynamic microstrip device, the near-field probe is electrically connected to the input port of the vector network analyzer, the near-field probe generates an induced electric field signal after the vector network analyzer outputs the radio frequency signal, and the vector network analyzer is also used to measure the forward transmission coefficient.

4. A measurement system, characterized in that: The invention comprises a signal source, a spectrum analyzer, a near-field probe, an electronic load and the dynamic microstrip device according to any one of claims 1 to 2, wherein the signal source is electrically connected to one end of a conductor strip of the dynamic microstrip device, the signal source is used to output a radio frequency signal, the other end of the conductor strip is electrically connected to the electronic load, the near-field probe is arranged facing the conductor strip of the dynamic microstrip device, the near-field probe generates an induced electric field signal after the signal source outputs the radio frequency signal, the near-field probe is electrically connected to the spectrum analyzer, and the spectrum analyzer is used to measure the induced electric field signal.

5. A method for determining a calibration factor, characterized in that: Based on the measurement system according to claim 3, the method comprises: After the vector network analyzer sends a radio frequency signal, obtaining a forward transmission coefficient measured by the vector network analyzer; Obtaining the impedance of the dynamic microstrip device and the structure function of the dynamic microstrip device; A calibration factor is determined based on the acquired data.

6. A method for determining a calibration factor, characterized in that: Executed based on the measurement system according to claim 4, comprising: After the signal source outputs a radio frequency signal, obtaining an induced electric field signal value of the near-field probe measured by the spectrum analyzer; Obtaining the impedance of the dynamic microstrip device and the structure function of the dynamic microstrip device; A calibration factor is determined based on the acquired data.

7. A calibration factor determination device, characterized in that: The method for determining the calibration factor according to claim 5 comprises: A first acquisition module, used for acquiring a forward transmission coefficient measured by the vector network analyzer after the vector network analyzer sends a radio frequency signal; A second acquisition module, used to acquire the impedance of the dynamic microstrip device and the structure function of the dynamic microstrip device; A determination module determines a magnetic field strength calibration factor based on the acquired data.

8. A calibration factor determination device, characterized in that: The method for determining the calibration factor according to claim 6 comprises: A first acquisition module, used for acquiring the induced electric field signal value of the near-field probe measured by the spectrum analyzer after the signal source is used to output the radio frequency signal; A second acquisition module, used to acquire the impedance of the dynamic microstrip device and the structure function of the dynamic microstrip device; A determination module is used to determine a magnetic field strength calibration factor based on the acquired data.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method described in claim 5 are implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method described in claim 6 are implemented.

Images