Photosensitive resin composition, filter and application

Abstract

The present invention provides a photosensitive resin composition, a filter, and applications. The photosensitive resin composition comprises: a photopolymerizable compound, an oxime ester photoinitiator, and an alkali-soluble resin grafted with silyl side chains, wherein the alkali-soluble resin grafted with silyl side chains has a weight-average molecular weight of 5,000 to 30,000, an acid value of 50 to 200 mgKOH / g, and a grafting rate of silyl side chains of 5 to 20%. The alkali-soluble resin having a specific silyl grafting rate, weight-average molecular weight, and acid value has good compatibility with other components and is also beneficial for improving the adhesion of the photosensitive resin composition to the substrate. The combination of the alkali-soluble resin and the oxime ester photoinitiator is beneficial for improving the sensitivity of the photosensitive resin composition, the compatibility and stability of the reaction system, and improving the development effect during the development process.

Description

Technical Field

[0001] The present invention relates to the field of photocuring, and in particular to a photosensitive resin composition, a filter and applications thereof. Background Art

[0002] Typically, a photosensitive resin composition includes an alkali-soluble resin, a multifunctional acrylic monomer having two or more ethylenically unsaturated bonds, a photopolymerization initiator, and a solvent. Auxiliary agents to improve coating performance and adhesion to the substrate can be added as needed. This type of photosensitive resin is applied to a substrate to form a coating, which is then exposed and developed, and the unexposed portion is removed to form the desired pattern. Therefore, in order to create fine patterns, it is necessary not only to use a highly sensitive initiator, but also to use various additives such as silane-based adhesion promoters to increase the adhesion between the film and the substrate. To achieve high color contrast, the initiator added to the color filter needs to have good light transmittance and no noticeable color after decomposition.

[0003] Compounds with an oxime ester structure have a wide range of uses as photoinitiators in the field of photocuring. Due to their high sensitivity, oxime ester photoinitiators are widely used in photopolymer compositions containing colorants for applications such as color filters and black matrices. Existing literature discloses different carbazole oxime ester and ketone oxime ester photoinitiators. These disclosed photoinitiators have good photosensitivity and storage stability, and can meet the general application requirements of current display panels, color filters, and other photocuring fields to varying degrees. However, in photosensitive resin compositions requiring high-quality color performance, the addition of more pigments makes curing more difficult, and the clarity and integrity of the image after curing are reduced. Therefore, there is a need for a photosensitive resin composition with higher photosensitivity, stronger adhesion, and finer patterning to achieve the above-mentioned purposes.

[0004] Alkali-soluble resin binders serve as a foundational support in photocurable resins, ensuring pigment dispersion and film formation. To achieve superior development fineness, additives such as silane-based adhesion promoters are added to the resin. However, increasing the amount of additives added can lead to decreased stability of the photosensitive resin composition system and defects during the development process. Therefore, to achieve fine patterns, the adhesion of the alkali-soluble resin must be significantly enhanced, and it must also exhibit good compatibility with the corresponding high-sensitivity initiator. Summary of the Invention

[0005] The main purpose of the present invention is to provide a photosensitive resin composition, a filter and an application thereof, so as to solve the problems of poor stability and poor development effect of photosensitive resin compositions with high requirements on color performance.

[0006] To achieve the above-mentioned object, the present invention provides a photosensitive resin composition on one hand, which comprises: a photopolymerizable compound, an oxime ester photoinitiator and an alkali-soluble resin grafted with silyl side chains, wherein the alkali-soluble resin grafted with silyl side chains has a weight-average molecular weight of 5,000 to 30,000, an acid value of 50 to 200 mgKOH / g, and a grafting rate of silyl side chains of 5 to 20%.

[0007] Furthermore, the alkali-soluble resin grafted with silane side chains has a structure shown in Formula I:

[0008]

[0009] Among them, each R 21 Each independently represents H, methyl, C2-C 20 A straight-chain alkyl group or a branched-chain alkyl group;

[0010] R 22 and R 23 C1~C 30 Alkyl, C3~C 30 Cycloalkyl, C3~C 20 Heterocyclic group, C6~C 30 aromatic groups;

[0011] R 24 、R 25 、R 26 Each independently represents H, deuterium, C1~C 20 Alkyl, C1~C 20 Cycloalkyl, C3~C 20 Heterocycloalkyl, C6~C 30 Aryl, C6~C 30 Heteroaryl, C3~C 20 Cycloalkyl, or -Si-(R 28 )3, each R 28 Independently represent C1~C 10 A straight or branched chain alkyl group;

[0012] R 27 Represents a single bond, or R 24 、R 25 or R 26 The resulting divalent group;

[0013] x, y, z, and m each independently represent an integer of 1 to 20.

[0014] Furthermore, the alkali-soluble resin grafted with silane side chains is obtained by copolymerizing a polymerizable monomer with a monomer containing a silane structure, wherein the polymerizable monomer is selected from one or more of the group consisting of alkenyl polymerizable compounds, unsaturated oxetane carboxylates, maleic anhydride compounds, maleimide compounds, (meth)acrylamide compounds, (meth)acrylic acid compounds and (meth)acrylate compounds; the monomer containing a silane group is selected from one or more of the group consisting of trimethylsilyl methacrylate, triethylsilyl methacrylate, tert-butyldimethylsilyl methacrylate, isopropyldimethylsilyl methacrylate, phenyldimethylsilyl methacrylate, di-tert-butylmethylsilyl methacrylate, triisopropylsilyl methacrylate, trimethylsilyl acrylate and triethylsilyl acrylate.

[0015] Furthermore, the weight average molecular weight of the alkali-soluble resin grafted with a silyl side chain is 8,000 to 20,000, preferably 8,000 to 15,000.

[0016] Furthermore, the acid value of the alkali-soluble resin grafted with a silyl side chain is 70 to 150 mgKOH / g, preferably 90 to 120 mgKOH / g.

[0017] Furthermore, the ratio of the weight average molecular weight to the number average molecular weight of the alkali-soluble resin grafted with silyl side chains is 1.5 to 4.0, preferably 1.8 to 3.5.

[0018] Furthermore, based on 100 parts by weight of the photosensitive resin composition, the photosensitive resin composition includes 1 to 10 parts of a photopolymerizable compound, 5 to 30 parts of an alkali-soluble resin grafted with a silyl side chain, and 0.1 to 5.0 parts of an oxime ester photoinitiator; preferably, based on 100 parts by weight of the photosensitive resin composition, the photosensitive resin composition includes 3 to 7 parts of a photopolymerizable compound, 10 to 20 parts of an alkali-soluble resin grafted with a silyl side chain, and 0.5 to 3.0 parts of an oxime ester photoinitiator.

[0019] Furthermore, the oxime ester photoinitiator is selected from 1-(4-phenylthiophenyl)-n-octane-1,2-diketo-2-benzoic acid oxime ester, 1-[6-(2-methylbenzoyl)-9-ethylcarbazole-3-yl]-ethane-1-one-acetic acid oxime ester, 1-(6-thenoyl-9-ethylcarbazole-3-yl)-3-cyclopentyl-propane-1-one-acetic acid oxime ester, 1-[6-[2[(acetoxy)imino]-3 -cyclohexane-1-oxypropyl]-9-ethyl-9H-carbazol-3-yl]-1,2-octanedione-2-(O-acetoxime), 1-(9,9-dibutyl-7-nitrofluoren-2-yl)-3-cyclohexyl-propane-1-one-acetic acid oxime ester, 1-(7-nitro-9,9-diallylfluoren-2-yl)-1-(2-methylphenyl)methanone-acetic acid oxime ester, 1-(6-(2-methylbenzoyl)-9-ethylcarbazole -3-yl)-3-cyclopentyl-propane-1-one-acetic acid oxime ester, 1-(4-phenylthiophenyl)-(3-cyclopentyl)-propane-1,2-dione-2-benzoic acid oxime ester, 1-(4-phenylthiophenyl)-(3-cyclohexyl)-propane-1,2-dione-2-acetic acid oxime ester; preferably, the oxime ester photoinitiator is selected from 1-(6-(2-methylbenzoyl)-9-ethylcarbazole-3- -yl)-3-cyclopentyl-propane-1-one-acetic acid oxime ester, 1-(6-thenoyl-9-ethylcarbazol-3-yl)-3-cyclopentyl-propane-1-one-acetic acid oxime ester, 1-(4-phenylthiophenyl)-(3-cyclopentyl)-propane-1,2-dione-2-benzoic acid oxime ester, and one or more of the group consisting of 1-(4-phenylthiophenyl)-(3-cyclohexyl)-propane-1,2-dione-2-acetic acid oxime ester.

[0020] Another aspect of the present application provides a filter, which includes a color layer. The color layer is formed by curing the above-mentioned photosensitive resin composition.

[0021] Another aspect of the present application provides an application of the above-mentioned photosensitive resin composition in the field of photocuring.

[0022] By applying the technical solution of the present invention, the alkali-soluble resin plays a basic supporting role in the polymerization process of the photopolymerizable compound, and can be dissolved by an alkaline solution to achieve development. The above-mentioned alkali-soluble resin with a specific silane grafting rate, weight-average molecular weight and acid value has good compatibility with other components, and is also beneficial to improving the adhesion of the photosensitive resin composition on the substrate. The use of the above-mentioned alkali-soluble resin in combination with an oxime ester photoinitiator is beneficial to improving the sensitivity of the photosensitive resin composition and the compatibility and stability of the reaction system, and improving the development effect during the development process. On this basis, the photosensitive resin composition having the above composition has good system stability, adhesion and development effect. DETAILED DESCRIPTION

[0023] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present invention will be described in detail below with reference to the embodiments.

[0024] As described in the background art, existing photosensitive resin compositions with high color performance requirements suffer from poor stability and poor development performance. To address the aforementioned technical issues, the present application provides a photosensitive resin composition comprising: a photopolymerizable compound, an oxime ester photoinitiator, and an alkali-soluble resin grafted with silyl side chains. The alkali-soluble resin grafted with silyl side chains has a weight-average molecular weight of 5,000 to 30,000, an acid value of 50 to 200 mgKOH / g, and a grafting ratio of silyl side chains of 5 to 20%.

[0025] The alkali-soluble resin plays a basic supporting role in the polymerization process of the photopolymerizable compound and can be dissolved by an alkaline solution to achieve development. The above-mentioned alkali-soluble resin with a specific silane grafting rate, weight-average molecular weight and acid value has good compatibility with other components and is also beneficial to improving the adhesion of the photosensitive resin composition to the substrate. The use of the above-mentioned alkali-soluble resin in combination with an oxime ester photoinitiator is beneficial to improving the sensitivity of the photosensitive resin composition and the compatibility and stability of the reaction system, and improving the development effect during the development process. On this basis, the photosensitive resin composition having the above composition has good system stability, adhesion and development effect.

[0026] Alkali-soluble resins with specific silyl side chain grafting ratios, weight-average molecular weights, and acid values ​​exhibit good compatibility with other components and also help improve the adhesion of the photosensitive resin composition to the substrate, thereby enhancing the development effect. In a preferred embodiment, the alkali-soluble resin grafted with silyl side chains has the structure shown in Formula I:

[0027]

[0028] Among them, each R 21 Each independently represents H, methyl, C2-C 20 A straight-chain alkyl group or a branched-chain alkyl group;

[0029] R 22 and R 23 C1~C 30 Alkyl, C3~C 30 Cycloalkyl, C3~C 20 Heterocyclic group, C6~C 30 Aryl; R 24 、R 25 、R26 Each independently represents H, deuterium, C1~C 20 Alkyl, C1~C 20 Cycloalkyl, C3~C 20 Heterocycloalkyl, C6~C 30 Aryl, C6~C 30 Heteroaryl, C3~C 20 Cycloalkyl, or -Si-(R 28 )3, each R 28 Independently represent C1~C 10 A straight chain or branched alkyl group; R 27 Represents a single bond, or R 24 、R 25 or R 26 The obtained divalent group; x, y, z and m each independently represent an integer of 1 to 20.

[0030] The alkali-soluble resin having the above structure has good alkali solubility and good dispersibility and emulsification effect on the reaction system. Therefore, the use of the above alkali-soluble resin is beneficial to further improve the system stability and development performance of the photosensitive resin.

[0031] During the development process, the alkali-soluble resin grafted with silyl side chains is dissolved by an alkaline developer for development. In a preferred embodiment, the alkali-soluble resin grafted with silyl side chains is obtained by copolymerizing a polymerizable monomer with a monomer containing a silane structure, wherein the polymerizable monomer includes but is not limited to one or more of the group consisting of alkenyl polymerizable compounds, unsaturated oxetane carboxylates, maleic anhydride compounds, maleimide compounds, (meth)acrylamide compounds, (meth)acrylic acid compounds, and (meth)acrylate compounds; the monomer containing a silyl group includes but is not limited to one or more of the group consisting of trimethylsilyl methacrylate, triethylsilyl methacrylate, tert-butyldimethylsilyl methacrylate, isopropyldimethylsilyl methacrylate, phenyldimethylsilyl methacrylate, di-tert-butylmethylsilyl methacrylate, triisopropylsilyl methacrylate, trimethylsilyl acrylate, and triethylsilyl acrylate.

[0032] To further improve the developing effect of the photosensitive resin composition, the types of polymerizable monomers and monomers containing a silane structure can be optimized. In a preferred embodiment, the alkenyl polymerizable compound includes, but is not limited to, one or more of the group consisting of styrene compounds substituted at the α-position or on the aromatic ring, vinyl alcohol ether compounds, N-vinylcaprolactam, N-vinylpyrrolidone, alkenyl acid compounds, and hydroxyl-substituted acid compounds.

[0033] Preferably, styrene compounds substituted at the α-position or on the aromatic ring include but are not limited to one or more of the group consisting of styrene, vinyltoluene, α-methylstyrene, p-methylstyrene, p-ethylstyrene and p-chlorostyrene; ether derivatives of vinyl alcohol include but are not limited to acrylonitrile and / or vinyl n-butyl ether; alkenyl acid compounds include but are not limited to one or more of the group consisting of fumaric acid (fumaric acid), cinnamic acid (β-phenylacrylic acid), α-cyanocinnamic acid, itaconic acid (methylenesuccinic acid), crotonic acid (butenoic acid); hydroxyl-substituted acid compounds include but are not limited to one or more of the group consisting of 2-hydroxypropionic acid, 2-hydroxyacrylic acid and 2-hydroxybutyric acid.

[0034] In a preferred embodiment, the maleic anhydride compounds include but are not limited to one or more of the group consisting of maleic anhydride, monomethyl maleate, monoethyl maleate and monoisopropyl maleate; the (meth)acrylamide compounds include but are not limited to acrylamide and / or diacetone acrylamide. (Meth)acrylic acid compounds include, but are not limited to, one or more of the group consisting of (meth)acrylic acid derivatives such as (meth)acrylic acid, α-bromo(meth)acrylic acid, α-chloro(meth)acrylic acid, β-furyl(meth)acrylic acid and β-styryl(meth)acrylic acid; (meth)acrylate compounds include, but are not limited to, one or more of the group consisting of alkyl(meth)acrylates, benzyl(meth)acrylate, phenoxyethyl(meth)acrylate, tetrahydrofurfuryl(meth)acrylate, dimethylaminoethyl(meth)acrylate, diethylaminoethyl(meth)acrylate, glycidyl(meth)acrylate, 2,2,2-trifluoroethyl(meth)acrylate, 2,2,3,3-tetrafluoropropyl(meth)acrylate, 2-ethylhexyl(meth)acrylate, tetrahydrofurfuryl(meth)acrylate, dimethylaminoethyl(meth)acrylate, diethylaminoethyl(meth)acrylate and glycidyl(meth)acrylate.

[0035] In the present application, the weight average molecular weight of the alkali-soluble polymer is measured by gel permeation chromatography (GPC) and converted by a calibration curve using standard polystyrene.

[0036] In the photosensitive resin composition of the present invention, the weight-average molecular weight of the alkali-soluble resin grafted with silyl side chains is not particularly limited and should be adapted to the specific application environment. When the weight-average molecular weight is greater than 30,000, the product's adhesion will be somewhat improved, but the smoothness during exposure and development will be significantly reduced, and the development time will be long. When the weight-average molecular weight is less than 5,000, the development time will be shorter, and the pattern's adhesion to the substrate will be significantly reduced, resulting in poor development results. Considering both the developing performance and adhesion to the substrate of the photosensitive resin composition, the weight-average molecular weight of the alkali-soluble resin grafted with silyl side chains is preferably between 8,000 and 20,000. To further improve its developability and adhesion to the substrate, a weight-average molecular weight of 8,000 to 15,000 is more preferred.

[0037] If the acid value of the alkali-soluble resin is too low, development becomes difficult and takes a long time. On the other hand, if the acid value is too high, development is too fast and the operating window is narrow. To ensure the stability of the alkali-soluble resin while improving the developing effect and developing time of the photosensitive resin composition, the acid value of the alkali-soluble resin grafted with silane side chains is preferably 70-150 mgKOH / g, more preferably 90-120 mgKOH / g.

[0038] If the molecular weight distribution of the alkali-soluble resin is too wide, the clarity of the development is poor; if the molecular weight distribution is narrow, the adhesion of the developed pattern is poor. In a preferred embodiment, the ratio of the weight average molecular weight to the number average molecular weight of the alkali-soluble resin grafted with silyl side chains is 1.5 to 4.0. By limiting the ratio of the weight average molecular weight to the number average molecular weight (molecular weight distribution index) of the alkali-soluble resin grafted with silyl side chains to the above range, the development effect of the photosensitive resin composition and its adhesion to the substrate can be taken into account at the same time. In order to further improve its development clarity and adhesion to the substrate, more preferably, the ratio of the weight average molecular weight to the number average molecular weight of the alkali-soluble resin grafted with silyl side chains is 1.8 to 3.5.

[0039] In a preferred embodiment, the photosensitive resin composition comprises, per 100 parts by weight, 1 to 10 parts of a photopolymerizable compound, 5 to 30 parts of an alkali-soluble resin, and 0.1 to 5.0 parts of an oxime ester photoinitiator. Limiting the amounts of each component within the aforementioned ranges can further enhance the sensitivity, adhesion, and development performance of the photosensitive resin composition. More preferably, per 100 parts by weight, the photosensitive resin composition comprises 3 to 7 parts of a photopolymerizable compound, 10 to 20 parts of an alkali-soluble resin, and 0.5 to 3.0 parts of an oxime ester photoinitiator.

[0040] The photosensitive resin composition with the above composition has good system stability and is convenient for long-term storage; it also has good adhesion to the substrate, and has the advantages of clear and complete developed patterns. Oxime ester photoinitiators have good photoinitiating effects. In the above photosensitive resin composition, the oxime ester photoinitiators can be selected from the types commonly used in the art. In a preferred embodiment, the oxime ester photoinitiators include but are not limited to 1-(4-phenylthiophenyl)-n-octane-1,2-dionato-2-benzoic acid oxime ester, 1-[6-(2-methylbenzoyl)-9-ethylcarbazole-3-yl]-ethane-1-one-acetic acid oxime ester, 1-[6-(2-methylbenzoyl)-9-ethylcarbazole-3-yl]-butane-1-one-acetic acid oxime ester, 1-[6-(2-methylbenzoyl)-9-ethylcarbazole-3-yl]-propane-1-one-acetic acid oxime ester, 1-[6 -(2-methylbenzoyl)-9-ethylcarbazol-3-yl]-1-cyclohexyl-methane-1-one-acetic acid oxime ester, 1-[6-(2-methylbenzoyl)-9-ethylcarbazol-3-yl]-(3-cyclopentyl)-propane-1-one-acetic acid oxime ester, 1-(4-phenylthiophenyl)-(3-cyclopentyl)-propane-1,2-dione-2-benzoic acid oxime ester, 1-(4-phenylthiophenyl)-(3-cyclohexyl)-propane-1,2-dione-2-cyclohexylcarboxylic acid oxime ester, 1-[6-(2-methylbenzoyl)-9-ethylcarbazol-3-yl]-(3-cyclopentyl)-propane-1-one-acetic acid oxime ester )-9-ethylcarbazol-3-yl]-(3-cyclopentyl)-propane-1,2-dione-2-acetic acid oxime ester, 1-(6-o-methylbenzoyl-9-ethylcarbazol-3-yl)-(3-cyclopentyl)-propane-1,2-dione-2-benzoic acid oxime ester, 1-(4-benzoyldiphenyl sulfide)-(3-cyclopentylacetone)-1-oxime acetate, 1-(6-o-methylbenzoyl-9-ethylcarbazol-3-yl)-(3-cyclopentylacetone)-1-oxime cyclohexylcarboxylate, 1-(4-benzoyldiphenyl sulfide)- 3-(Cyclopentylacetone)-1-oxime cyclohexylcarboxylate, 1-(6-o-methylbenzoyl-9-ethylcarbazol-3-yl)-(3-cyclopentyl)-propane-1,2-dione-2-o-methylbenzoic acid oxime ester, 1-(4-phenylthiophenyl)-(3-cyclopentyl)-propane-1,2-dione-2-cyclohexylcarboxylic acid oxime ester, 1-(4-thenoyl-diphenyl sulfide-4'-yl)-3-cyclopentyl-propane-1-one-acetic acid oxime ester, 1-(4-benzoyldiphenyl sulfide)-(3-cyclopentyl)-propane-1,2-dione-2-cyclohexylcarboxylic acid oxime ester2-diketo-2-oxime acetate, 1-(6-nitro-9-ethylcarbazol-3-yl)-3-cyclohexyl-propane-1-one-acetic acid oxime ester, 1-(6-o-methylbenzoyl-9-ethylcarbazol-3-yl)-3-cyclohexyl-propane-1-one-acetic acid oxime ester, 1-(6-thenoyl-9-ethylcarbazol-3-yl)-(3-cyclohexylacetone)-1-oxime acetate, 1-(6-furofuryl-9-ethylcarbazol-3-yl)-(3-cyclopentylacetone)-1-oxime acetate, 1,4-diphenylpropane-1,3-diketo-2-acetic acid oxime ester, 1-(6-furfuryl-9-ethylcarbazol-3-yl)-(3-cyclohexyl)-propane-1,2-dione-2-acetic acid oxime ester , 1-(4-phenylthiophenyl)-(3-cyclohexyl)-propane-1,2-dione-2-acetic acid oxime ester, 1-(6-furofuryl-9-ethylcarbazol-3-yl)-(3-cyclohexylacetone)-1-oxime acetate, 1-(4-phenylthiophenyl)-(3-cyclohexyl)-propane-1,2-dione-3-benzoic acid oxime ester, 1-(6-thenoyl-9-ethylcarbazol-3-yl)-(3-cyclohexyl)-propane-1,2-dione-2-acetic acid oxime ester, 2-[(benzoyloxy)imino]-1-phenylpropane-1-one, 1-phenyl-1,2-propanedione-2-(oxoacetyl)oxime, 1-(4-phenylthiophenyl)-2-(2-methylphenyl)-ethane-1,2 -diketone-2-acetic acid oxime ester, 1-(9,9-dibutyl-7-nitrofluoren-2-yl)-3-cyclohexyl-propane-1-one-acetic acid oxime ester, 1-{4-[4-(thiophene-2-formyl)phenylthio]phenyl}-3-cyclopentylpropane-1,2-dione-2-acetic acid oxime ester, 1-[9,9-dibutyl-2-yl]-3-cyclohexylpropane 1-[6-(2-benzoyloxyimino)-3-cyclohexylpropyl-9-ethylcarbazol-3-yl]octane-1,2-dione-2-benzoic acid oxime ester, 1-(7-nitro-9,9-diallylfluoren-2-yl)-1-(2-methylphenyl)methanone-acetic acid oxime ester, 1-[6-(2-benzoyloxyimino)-3-cyclohexylpropyl-9-ethylcarbazol-3-yl]octane-1,2-dione-2-benzoic acid oxime ester, 1-[7-(2-methylbenzoyl)-9,9-dibutylfluoren-2-yl]-3-cyclohexylpropane-1,2-dione-2-acetic acid oxime or 1-[6-(furan-2-carbonyl)-9-ethylcarbazol-3-yl]-3-cyclopentyl-propane-1-one-benzoic acid oxime ester, 1-(4-phenylthiophenyl)-n-octane-1,2-dione-2-benzoic acid oxime ester, 1-(6-(2-methylbenzoyl)-9-ethylcarbazol-3-yl)-3-cyclopentyl-propane-1-one-acetic acid oxime ester, 1-(4-phenylthiophenyl)-(3-cyclopentyl)-propane-1,2-dione-2-benzoic acid oxime ester2-diketo-2-benzoic acid oxime ester, 1-(4-benzoyldiphenyl sulfide)-(3-cyclopentylacetone)-1-oxime cyclohexylcarboxylate, 1-(6-thenoyl-9-ethylcarbazol-3-yl)-3-cyclopentyl-propane-1-one-acetic acid oxime ester, 1-(4-thenoyl-diphenyl sulfide-4'-yl)-3-cyclopentyl-propane-1-one-acetic acid oxime ester, 1-[6-[2[(acetoxy)imino]-3-cyclohexane-1-oxypropyl]-9-ethyl-9H-carbazol-3-yl]-1,2-octanedione-2-(O-acetyloxime), 1-(6-(1-acetoxyimino)octyl) One or more of the group consisting of 1-(9,9-dibutyl-7-nitrofluoren-2-yl)-3-cyclohexyl-propane-1-one-acetic acid oxime ester, 1-(9,9-dibutyl-2-yl)-3-cyclohexylpropylpropane-1,2-dione-2-acetic acid oxime ester, 1-(7-nitro-9,9-diallylfluoren-2-yl)-1-(2-methylphenyl)methanone-acetic acid oxime ester and 1-(6-(furan-2-carbonyl)-9-ethylcarbazol-3-yl)-3-cyclohexylpropane-1,2-dione-2-ethoxycarbonyl oxime ester. The oxime ester photoinitiator with the above structure has good luminous efficiency and good compatibility with the above alkali-soluble resin. When the two are used together, it is beneficial to improve the sensitivity of the photosensitive resin composition and the stability of the system.

[0041] More preferably, the oxime ester photoinitiator includes but is not limited to 1-(4-phenylthiophenyl)-n-octane-1,2-dionato-2-benzoic acid oxime ester, 1-[6-(2-methylbenzoyl)-9-ethylcarbazol-3-yl]-ethane-1-one-acetic acid oxime ester, 1-(6-thenoyl-9-ethylcarbazol-3-yl)-3-cyclopentyl-propane-1-one-acetic acid oxime ester, 1-[6-[2[(acetyloxy)imino]-3-cyclohexane-1-oxypropyl]-9-ethyl-9H-carbazol-3-yl]-1,2-octanedionato-2-(O-acetyl oxime), 1-(9,9- One or more of the group consisting of dibutyl-7-nitrofluoren-2-yl)-3-cyclohexyl-propane-1-one-acetic acid oxime ester, 1-(7-nitro-9,9-diallylfluoren-2-yl)-1-(2-methylphenyl)methanone-acetic acid oxime ester, 1-(6-(2-methylbenzoyl)-9-ethylcarbazol-3-yl)-3-cyclopentyl-propane-1-one-acetic acid oxime ester, 1-(4-phenylthiophenyl)-(3-cyclopentyl)-propane-1,2-dione-2-benzoic acid oxime ester and 1-(4-phenylthiophenyl)-(3-cyclohexyl)-propane-1,2-dione-2-acetic acid oxime ester.

[0042] Further preferably, the oxime ester photoinitiator includes but is not limited to 1-(6-(2-methylbenzoyl)-9-ethylcarbazole-3-yl)-3-cyclopentyl-propane-1-one-acetic acid oxime ester, 1-(6-thiophene-9-ethylcarbazole-3-yl)-3-cyclopentyl-propane-1-one-acetic acid oxime ester, 1-(4-phenylthiophenyl)-(3-cyclopentyl)-propane-1,2-dione-2-benzoic acid oxime ester and 1-(4-phenylthiophenyl)-(3-cyclohexyl)-propane-1,2-dione-2-acetic acid oxime ester. One or more of the group consisting of.

[0043] As needed, the photopolymerizable compound used in the photosensitive resin composition is used to improve its photosensitivity, mechanical strength, crosslinking, chemical resistance, and other properties. As the polymerizable compound, any one or a combination of compounds having one or more unsaturated bonds within the molecule can be selected as needed. In a preferred embodiment, the photopolymerizable compound includes but is not limited to the following:

[0044] ① (Meth) acrylic acid adducts of epoxy compounds include but are not limited to one or more of the group consisting of propylene glycol diglycidyl ether, dipropylene glycol diglycidyl ether, tripropylene glycol diglycidyl ether, tetrapropylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, sorbitol triglycidyl ether, and glycerol triglycidyl ether;

[0045] ② Unsaturated organic acids and their anhydrides including but not limited to maleic acid and / or maleic acid amide;

[0046] ③ Acrylamide compounds include, but are not limited to, one or more of the group consisting of N-methylacrylamide, N-ethylacrylamide, N-isopropylacrylamide, N-hydroxymethylacrylamide, N-methylacrylamide, N-ethylmethacrylamide, N-isopropylmethacrylamide, N-hydroxymethylmethacrylamide, N,N-dimethylacrylamide, N,N-diethylacrylamide, N,N-dimethylacrylamide and N,N-diethylmethacrylamide;

[0047] ④ Polyethylene glycol di(meth)acrylate (ethylene number is 2 to 14);

[0048] ⑤ Polyhydroxy acrylate compounds include, but are not limited to, one or more of the group consisting of trimethylolpropane di(meth)acrylate, trimethylolpropane tri(meth)acrylate, trimethylolpropane ethoxy tri(meth)acrylate, trimethylolpropane propoxy tri(meth)acrylate, tetramethylolmethane tri(meth)acrylate, tetramethylolmethane tetra(meth)acrylate, polypropylene glycol di(meth)acrylate (with 2 to 14 trimethylene groups), dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, bisphenol A polyoxyethylene di(meth)acrylate, bisphenol A dioxyethylene di(meth)acrylate, bisphenol A trioxyethylene di(meth)acrylate, and bisphenol A oxyethylene di(meth)acrylate;

[0049] ⑥ Esterification products formed by polycarboxylic acids (such as phthalic anhydride, etc.) and compounds having hydroxyl groups and ethylenically unsaturated groups (such as β-hydroxyethyl (meth)acrylate, etc.);

[0050] ⑦ Alkyl (meth)acrylates include, but are not limited to, one or more of the group consisting of methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, and 2-ethylhexyl (meth)acrylate;

[0051] ⑧ Glyceryl ether compounds include but are not limited to one or more of the group consisting of ethylene glycol diglycidyl ether, diethylene glycol diglycidyl ether, triethylene glycol diglycidyl ether, tetraethylene glycol diglycidyl ether and polyethylene glycol diglycidyl ether;

[0052] ⑨ Styrene compounds including but not limited to styrene and / or hydroxystyrene;

[0053] ⑩ One or more of the group consisting of N-vinylpyrrolidone, N-vinylformamide, N-vinylacetamide, and N-vinylimidazole. The above-mentioned substances may be used alone or in combination.

[0054] In order to further improve the comprehensive performance of the photosensitive resin and meet the color requirements of different customers at the same time. Preferably, the photosensitive resin composition also includes a colorant. Any organic pigment and inorganic pigment commonly used in the art can be selectively used as the colorant of this application. For example, water-soluble pigments, insoluble azo pigments, phthalocyanine pigments, quinacridone pigments, isoindoline pigments, indoleanthrone pigments, indole pigments, indanthrone pigments, pyrrole dione pigments, etc. The above pigments can be used alone or in combination, depending on the specific requirements of the product.

[0055] Further preferred organic raw materials include but are not limited to the following pigments: specifically listed are compounds with color index (The Society of Dyers and Colorists (CI) numbers such as:

[0056] CI Pigment Yellow 1, 3, 11, 13, 14, 15, 16, 17, 20, 24, 3, 53, 55, 60, 65, 71, 73, 74, 81, 83, 86, 93, 95, 97, 98, 100, 101, 106, 109, 120, 125, 138, 139, 147, 148, 150, 151, 152, 153, 154, 155, 167, 175, 180, 183, 185.

[0057] CI Pigment Orange 1, 13, 31, 36, 42, 43, 55, 59, 61, 65, 71.

[0058] CI Pigment Violet 1, 14, 19, 23, 29, 30, 36, 37, 38, 39, 40.

[0059] CI Pigment Red 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 14, 15, 16, 18, 19, 21, 23, 30, 31, 37, 38, 40, 42, 48, 53:1, 57, 57:2, 60:1, 83, 97, 105, 122, 144, 166, 176, 180, 192, 202, 206, 207, 208, 215, 224, 242, 254, 255, 264, 265.

[0060] CI Pigment Blue 1, 2, 15, 15:3, 15:6, 16, 21, 22, 60, 64, 66. CI Pigment Green 7, 10, 15, 25, 36, 47, 48. CI Pigment Brown 23, 25, 26, 28. CI Pigment Black 1 and 7, etc.

[0061] When the photosensitive resin composition of the present invention is applied to display materials such as optical filters, a dispersion solvent is required. In a preferred embodiment, the solvent includes, but is not limited to, one or more of the group consisting of (poly)alkylene glycol monoalkyl ether compounds, aromatic hydrocarbon compounds, amide compounds, carboxylic acid ester compounds, ketone compounds, cyclic ether compounds, and cyclic ester compounds.

[0062] Preferably, the (poly)alkylene glycol monoalkyl ether compounds include, but are not limited to, one or more of the group consisting of ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol n-propyl ether, ethylene glycol mono-n-butyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monopropyl ether, diethylene glycol mono-n-butyl ether, triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol mono-n-propyl ether, propylene glycol mono-n-butyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol mono-n-butyl ether, tripropylene glycol monomethyl ether and tripropylene glycol monoethyl ether.

[0063] Preferably, the aromatic hydrocarbon organic compound includes, but is not limited to, one or more of the group consisting of toluene, xylene and trimethylbenzene.

[0064] Preferably, the amide compound includes but is not limited to one or more of the group consisting of N-methylpyrrolidone, N,N-dimethylformamide and N,N-dimethylacetamide;

[0065] Preferably, the carboxylate compounds include but are not limited to ethyl 2-oxobutyrate, methyl acetoacetate, ethyl acetoacetate, ethyl acetate, n-propyl acetate, isopropyl acetate, butyl acetate, isobutyl acetate, n-pentyl formate, isopentyl acetate, butyl propionate, ethyl butyrate, n-propyl butyrate, isopropyl butyrate, butyl butyrate, methyl pyruvate, ethyl pyruvate, n-propyl acetone, methyl 2-hydroxypropionate, ethyl 2-hydroxypropionate, ethyl 2-hydroxy-2-methylpropionate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethyl Preferably, the ketone compounds include but are not limited to one or more of the group consisting of methyl ethyl ketone, cyclohexanone, heptanone and 3-heptanone; preferably, the cyclic ether compounds include but are not limited to tetrahydrofuran and / or tetrahydropyran; preferably, the cyclic ester compounds include but are not limited to γ-butyrolactone.

[0066] To further improve the compatibility of the components in the photosensitive resin composition, preferably, the above-mentioned solvent includes, but is not limited to, one or more of the group consisting of propylene glycol monomethyl ether, ethylene glycol monomethyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, diethylene glycol monomethyl ether, and diethylene glycol methyl ethyl ether. These solvents have more excellent solvent types, and therefore, the use of these solvents is beneficial to further improve the compatibility of the components, thereby improving the overall performance of the photosensitive resin composition. More preferably, the above-mentioned solvent is propylene glycol monomethyl ether acetate and / or diethylene glycol methyl ethyl ether.

[0067] In order to further improve the comprehensive performance of the above-mentioned photosensitive resin composition, preferably, the above-mentioned photosensitive resin composition further includes additives, which include but are not limited to one or more of the group consisting of fillers, curing agents, leveling agents, adhesion promoters, antioxidants and ultraviolet absorbers.

[0068] In the above-mentioned photosensitive resin composition, the curing agent is used to improve the deep curing performance and mechanical strength. Preferably, the curing agent includes but is not limited to one or more of the group consisting of epoxy compounds, multifunctional isocyanate compounds, melamine compounds and oxetane compounds.

[0069] The leveling agent may use commercially available surfactants, including but not limited to one or more selected from the group consisting of ionic surfactants, nonionic surfactants and amphoteric surfactants.

[0070] Adhesion promoters can use silane compounds, including but not limited to one or more of the group consisting of vinyltrimethoxysilane, vinyltriethoxysilane, vinyltri(2-methoxyethoxy)silane, N-(2-aminoethyl)-30aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-chloropropylmethyldimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-isocyanatepropyltrimethoxysilane, and 3-isocyanatepropyltriethoxysilane.

[0071] The antioxidant includes, but is not limited to, one or more of the group consisting of 4,4′-butylenebis(6-tert-butyl-3-methylphenol), 2,6-di-tert-butyl-4-methylphenol, 2,3′-thiobis(4-methyl-6-tert-butylphenol) and p-methoxyphenol.

[0072] UV absorbers include, but are not limited to, 2-(3-tert-butyl-2-hydroxy-5-methylphenyl)-5-chlorobenzotriazole and / or alkoxybenzophenone.

[0073] Another aspect of the present application further provides a filter, which includes a color layer. The color layer is formed by curing the photosensitive resin composition provided in the present application.

[0074] The alkali-soluble resin plays a basic supporting role in the polymerization process of the photopolymerizable compound and can be dissolved by an alkaline solution to achieve development. The above-mentioned alkali-soluble resin with a specific silane grafting rate, weight-average molecular weight and acid value has good compatibility with other components and is also beneficial to improving the adhesion of the photosensitive resin composition to the substrate. The use of the above-mentioned alkali-soluble resin in combination with an oxime ester photoinitiator is beneficial to improving the sensitivity of the photosensitive resin composition and the compatibility and stability of the reaction system, and improving the development effect during the development process. On this basis, the photosensitive resin composition having the above composition has good system stability, adhesion and development effect.

[0075] Another aspect of the present application further provides an application of the photosensitive resin composition provided in the present application in the field of photocuring.

[0076] The alkali-soluble resin plays a basic supporting role in the polymerization process of the photopolymerizable compound and can be dissolved by an alkaline solution to achieve development. The above-mentioned alkali-soluble resin with a specific silane grafting rate, weight-average molecular weight and acid value has good compatibility with other components and is also beneficial to improving the adhesion of the photosensitive resin composition to the substrate. The use of the above-mentioned alkali-soluble resin in combination with an oxime ester photoinitiator is beneficial to improving the sensitivity of the photosensitive resin composition and the compatibility and stability of the reaction system, and improving the development effect during the development process. On this basis, the photosensitive resin composition having the above composition has good system stability, adhesion and development effect.

[0077] The present application is further described in detail below with reference to specific embodiments. These embodiments should not be construed as limiting the scope of protection claimed in this application.

[0078] Preparation of alkali-soluble resin

[0079] Example 1: Preparation of alkali-soluble resin B-1

[0080] Accurately weigh a certain amount of acrylic monomer and trimethylsilyl methacrylate, mix them evenly and set aside; in addition, accurately weigh a certain amount of initiator (azobisisobutyronitrile) and dissolve it in 3 times the amount of propylene glycol methyl ether acetate (PGMEA) solution, fully dissolve and set aside.

[0081] In a 500mL four-necked flask equipped with a stirring device, a condenser, a constant pressure dropping funnel, a thermometer and a nitrogen inlet, 100g of propylene glycol methyl ether acetate (PGMEA) was added, nitrogen was introduced, and the mixture was heated to 70°C under stirring. The monomer mixture (formula see Table 1) and the initiator solution were added dropwise respectively. The addition time was controlled within 2h. After completion, the mixture was kept at this temperature for 4h. The system Mw was measured (8000≤Mw≤15000). After meeting the requirements, the temperature was lowered and filtered to obtain polyacrylate resin B-1. The output Mw = 19678, PDI = 1.93.

[0082] Alkali-soluble resins B-2 to B-8 and comparative resin B were prepared according to different monomers and ratios, as shown in Table 1.

[0083] Table 1

[0084]

[0085] Performance evaluation

[0086] (1) Preparation of photocurable composition

[0087] The application performance of the photosensitive resin compositions composed of the photopolymerization initiator and alkali-soluble resin described in the examples of the present invention was evaluated by preparing exemplary photocurable compositions. These properties included sensitivity, developability, pattern integrity, and substrate adhesion. Referring to the formulations shown in Table 2 for Examples 1-17 and Comparative Examples 1-4, the raw materials were mixed uniformly in the following proportions to form photocurable compositions:

[0088]

[0089] According to the above formula, different photocuring combinations were prepared using the initiator and modified alkali-soluble resin provided by the existing patent. In the specific embodiment, the commercially available 1173 and 184 were used as initiators in the comparative example, see Table 2.

[0090] Table 2

[0091]

[0092] Note: In the above table, the initiators corresponding to each code are described as follows:

[0093] A-1: 1-(6-(2-methylbenzoyl)-9-ethylcarbazol-3-yl)-3-cyclopentyl-propane-1-one-acetic acid oxime ester;

[0094] A-2: 1-(6-thenoyl-9-ethylcarbazol-3-yl)-3-cyclopentyl-propane-1-one-acetic acid oxime ester;

[0095] A-3: 1-(4-phenylthiophenyl)-(3-cyclopentyl)-propane-1,2-dione-2-benzoic acid oxime ester;

[0096] A-4: 1-(4-phenylthiophenyl)-(3-cyclohexyl)-propane-1,2-dione-2-acetic acid oxime ester;

[0097] A-5: 1-[6-(2-Methylbenzoyl)-9-ethylcarbazol-3-yl]-butan-1-one-acetic acid oxime ester.

[0098] Silane coupling agent: methyltriethoxysilane

[0099] (2) Exposure and development

[0100] The photosensitive resin composition described above was stirred under a yellow light lamp, spin-coated onto a glass substrate, and vacuum-dried at 90°C for 2 minutes to obtain a 2μm-thick coating. The coated substrate was cooled to room temperature, attached with a mask, and illuminated with a high-pressure mercury lamp using a long-wavelength (FWHM) filter. The coating was exposed to ultraviolet light at a wavelength of 350-420nm through a 20μm linewidth mask. The film was then developed by immersing in a 2.5% sodium carbonate solution at 25°C for 20 seconds, then rinsed with ultrapure water, air-dried, and hard-baked at 230°C for 30 minutes to fix the pattern.

[0101] (3) Performance evaluation

[0102] ① Sensitivity: The minimum exposure required for a 90% or higher residual film rate in the exposed area after development is considered the exposure requirement. A smaller exposure requirement indicates a higher sensitivity.

[0103] ② Development: Observe the substrate pattern using a scanning electron microscope (SEM) to evaluate development and pattern integrity. Calculate the residual film rate using the following formula: Residual film rate = film thickness after post-bake treatment / film thickness before post-bake treatment × 100. The higher the residual film rate, the better the development effect and pattern integrity.

[0104] The developability was evaluated according to the following criteria:

[0105] ○: Residual film rate ≥95%;

[0106] △: 95%>Residual film rate ≥90;

[0107] ╳: Residual film rate <90%.

[0108] Pattern integrity was evaluated according to the following criteria:

[0109] ○: No pattern defect was observed;

[0110] △: Some defects are observed in a small part of the pattern;

[0111] ╳: Many pattern defects were clearly observed.

[0112] ③Adhesion test

[0113] The fully exposed coating film was overdeveloped by 1.5 times and dried. Ten cuts of 1 mm each were made on the substrate vertically and horizontally with a knife. A peel test was performed using standard 3M 600 tape. A scanning electron microscope (SEM) was used to observe the amount of pattern remaining on the substrate. The greater the amount of pattern remaining, the higher the adhesion.

[0114] Adhesion between pattern and substrate:

[0115] ○: No peeling from the substrate, the pattern is complete;

[0116] △: 1-5 squares peeled off from the substrate;

[0117] ╳: More than 5 squares peeled off from the substrate.

[0118] The evaluation results are shown in Table 3.

[0119] Table 3

[0120]

[0121] It can be seen from the above evaluation table 3 that the photosensitive resin composition containing the oxime ester photoinitiator provided by the present invention has a high photosensitivity, and the exposure requirement is less than 60mJ / cm 2 In particular, the embodiments using 1-(6-(2-methylbenzoyl)-9-ethylcarbazol-3-yl)-3-cyclopentyl-propane-1-one-acetic acid oxime ester or 1-(6-thenoyl-9-ethylcarbazol-3-yl)-3-cyclopentyl-propane-1-one-acetic acid oxime ester as initiator require a lower exposure intensity, close to 50 mJ. Under the same conditions, when 1173 or 184 is used as the initiator, the exposure dose is greater than 70 mJ / cm 2 ; By using the oxime ester photoinitiator provided by the present invention in combination with the alkali-soluble resins B-1 to B-8 obtained by copolymerization with the silicone grease monomer provided by the present invention, better development effect, finer development line width and higher resolution can be obtained. As shown in the table above, Examples 1-17 all show good developability and pattern integrity, and have lower line width and higher development fineness.

[0122] Adhesion tests also showed that, under identical conditions, the photocurable composition comprising the soluble resin provided by the present invention and an oxime ester photoinitiator exhibited superior adhesion to the substrate. Comparative examples prepared using polymer B without silicone grease side chains exhibited poor development and adhesion. While polymer B without silane grafting and the direct addition of a silane coupling agent, combined with an oxime ester initiator, exhibited higher sensitivity, its development and adhesion were inferior to those of the polymer containing grafted silanes.

[0123] In summary, the photocurable resin composition composed of the oxime ester photoinitiator having the above-mentioned specific structural formula and the alkali-soluble resins B-1 to B-8 having silane pendant groups has high sensitivity, good developability, good adhesion to the substrate, and high resolution, and has good application prospects.

[0124] It should be noted that the terms "first," "second," and the like in the specification and claims of this application are used to distinguish similar objects, and are not necessarily used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of the application described herein can, for example, be implemented in an order other than that described herein.

[0125] The foregoing description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that various modifications and variations of the present invention are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A photosensitive resin composition, characterized in that The photosensitive resin composition comprises: a photopolymerizable compound, an oxime ester photoinitiator, and an alkali-soluble resin grafted with silyl side chains, wherein the alkali-soluble resin grafted with silyl side chains has a weight average molecular weight of 5,000 to 30,000, an acid value of 50 to 200 mgKOH / g, and a grafting rate of the silyl side chains of 5 to 20%; The alkali-soluble resin grafted with silane side chains has a structure shown in Formula I: Formula I Among them, each of the R 21 Each independently represents H, methyl, C2-C 20 A straight-chain alkyl group or a branched-chain alkyl group; The R 22 and the R 23 C1 to C 30 Alkyl, C3~C 30 Cycloalkyl, C6~C 30 aromatic groups; The R 24 、The R 25 、The R 26 Each independently represents H, deuterium, C1~C 20 Alkyl, C6~C 30 aromatic groups; The R 27 represents a single bond; The x, y, z, and m each independently represent an integer of 1 to 20.

2. The photosensitive resin composition according to claim 1, wherein The alkali-soluble resin grafted with silyl side chains is obtained by copolymerizing a polymerizable monomer with a monomer containing a silyl group, wherein The polymerizable monomer is selected from one or more of the group consisting of alkenyl polymerizable compounds, unsaturated oxetane carboxylates, maleic anhydride compounds, maleimide compounds, (meth)acrylamide compounds, (meth)acrylic acid compounds and (meth)acrylate compounds; The monomer containing a silyl group is selected from one or more of the group consisting of trimethylsilyl methacrylate, triethylsilyl methacrylate, tert-butyldimethylsilyl methacrylate, isopropyldimethylsilyl methacrylate, phenyldimethylsilyl methacrylate, di-tert-butylmethylsilyl methacrylate, triisopropylsilyl methacrylate, trimethylsilyl acrylate, and triethylsilyl acrylate.

3. The photosensitive resin composition according to claim 1, wherein The weight average molecular weight of the alkali-soluble resin grafted with silane side chains is 8,000 to 20,000.

4. The photosensitive resin composition according to claim 3, wherein The weight average molecular weight of the alkali-soluble resin grafted with silane side chains is 8,000 to 15,000.

5. The photosensitive resin composition according to claim 1, wherein The acid value of the alkali-soluble resin grafted with a silane side chain is 70 to 150 mgKOH / g.

6. The photosensitive resin composition according to claim 5, characterized in that The acid value of the alkali-soluble resin grafted with silyl side chains is 90 to 120 mgKOH / g.

7. The photosensitive resin composition according to claim 1, wherein The ratio of the weight average molecular weight to the number average molecular weight of the alkali-soluble resin grafted with silane side chains is 1.5 to 4.

0.

8. The photosensitive resin composition according to claim 7, wherein The ratio of the weight average molecular weight to the number average molecular weight of the alkali-soluble resin grafted with silane side chains is 1.8 to 3.

5.

9. The photosensitive resin composition according to any one of claims 1 to 8, characterized in that The photosensitive resin composition comprises, based on 100 parts by weight, 1 to 10 parts of the photopolymerizable compound, 5 to 30 parts of the alkali-soluble resin grafted with a silane side chain, and 0.1 to 5.0 parts of the oxime ester photoinitiator.

10. The photosensitive resin composition according to claim 9, characterized in that The photosensitive resin composition comprises 3 to 7 parts of the photopolymerizable compound, 10 to 20 parts of the alkali-soluble resin grafted with a silane side chain, and 0.5 to 3.0 parts of the oxime ester photoinitiator based on 100 parts by weight.

11. The photosensitive resin composition according to claim 9, wherein The oxime ester photoinitiator is selected from 1-(4-phenylthiophenyl)-octane-1,2-dionato-2-benzoic acid oxime ester, 1-[6-(2-methylbenzoyl)-9-ethylcarbazole-3-yl]-ethane-1-one-acetic acid oxime ester, 1-(6-thenoyl-9-ethylcarbazole-3-yl)-3-cyclopentyl-propane-1-one-acetic acid oxime ester, 1-[6-[2[(acetoxy)imino]-3-cyclohexane-1-oxypropyl]-9-ethyl-9H-carbazole-3-yl]-1,2-octanedionato-2-(O-acetyl oxime), 1-(9,9-dibutyl- One or more of the group consisting of 1-(7-nitrofluoren-2-yl)-3-cyclohexyl-propane-1-one-acetic acid oxime ester, 1-(7-nitro-9,9-diallylfluoren-2-yl)-1-(2-methylphenyl)methanone-acetic acid oxime ester, 1-(6-(2-methylbenzoyl)-9-ethylcarbazol-3-yl)-3-cyclopentyl-propane-1-one-acetic acid oxime ester, 1-(4-phenylthiophenyl)-(3-cyclopentyl)-propane-1,2-dione-2-benzoic acid oxime ester, and 1-(4-phenylthiophenyl)-(3-cyclohexyl)-propane-1,2-dione-2-acetic acid oxime ester.

12. The photosensitive resin composition according to claim 11, wherein The oxime ester photoinitiator is selected from the group consisting of 1-(6-(2-methylbenzoyl)-9-ethylcarbazole-3-yl)-3-cyclopentyl-propane-1-one-acetic acid oxime ester, 1-(6-thenoyl-9-ethylcarbazole-3-yl)-3-cyclopentyl-propane-1-one-acetic acid oxime ester, 1-(4-phenylthiophenyl)-(3-cyclopentyl)-propane-1,2-dione-2-benzoic acid oxime ester, and 1-(4-phenylthiophenyl)-(3-cyclohexyl)-propane-1,2-dione-2-acetic acid oxime ester.

13. A filter, characterized in that: The optical filter comprises a color layer, and the color layer is formed by curing the photosensitive resin composition according to any one of claims 1 to 12.

14. Use of the photosensitive resin composition according to any one of claims 1 to 12 in the field of photocuring.

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