Method and device for verifying component lead forming parameters

Abstract

The present invention provides a method and apparatus for verifying component lead forming parameters. The method comprises the following steps: S101: measuring the component to obtain first measurement data; S102: calculating a first parameter based on the first measurement data, and determining whether the first parameter meets a first preset requirement; S103: receiving process parameters of the component, calculating second and third parameters based on the first measurement data and the process parameters of the component, and determining whether the second and third parameters meet a second preset requirement; S104: calculating forming equipment adjustment parameters based on the current process parameters of the component; and S105: adjusting corresponding parameters of the forming equipment based on the forming equipment adjustment parameters. In this way, before component lead forming, the rationality of the component design is pre-verified using the measurement data and the input process parameter indicators, effectively reducing the occurrence of component failures after lead forming.

Description

Technical Field

[0001] The present invention belongs to the field of component processing, and in particular relates to a method and device for verifying component lead forming parameters. Background Art

[0002] IC pin forming involves converting straight-lead IC pins into pi-shaped pins that mate with PCB pads. This forming process is typically performed using specialized forming equipment. Currently, ensuring that the formed components will mate well with the pads and meet process requirements requires advance assessment. Standard requirements dictate that, after pin forming, the soldering surface of the chip pin should be centered on the PCB pad. This means that the pads at both the toe and tip of the chip pin should have sufficient soldering length.

[0003] However, the existing pin forming equipment only realizes the process of converting the straight pins of components into π-shaped pins, and does not have the function of rechecking and recalculating the correctness of the position relationship between the component pins and the pads. In this case, after the component pins are formed, the toe or finger end of the pins often fail to fully match the pads. The pin forming of components is often a one-time process, and this process is irreversible. Once such a defect occurs, the formed component can only be scrapped, and the loss caused is immeasurable. Summary of the Invention

[0004] In order to overcome the defects in the above-mentioned prior art, the present invention proposes a method and device for verifying the component pin forming parameters, which is used to solve the problem that before the component pin is formed, the position relationship between the pin and the pad cannot be predicted, resulting in an increased component failure rate after the pin is formed.

[0005] To achieve the above objectives, the present invention adopts the following specific technical solutions:

[0006] In a first aspect, the present invention provides a method for verifying component lead forming parameters, the method comprising:

[0007] S101: Measure the component to obtain first measurement data;

[0008] S102: Calculate a first parameter based on the first measurement data, and determine whether the first parameter meets a first preset requirement. If so, execute step S103;

[0009] S103: receiving the process parameters of the component, calculating the second parameter and the third parameter according to the first measurement data and the process parameters of the component, and determining whether the second parameter and the third parameter meet the second preset requirement, and if so, executing step S104;

[0010] S104: Calculating forming equipment adjustment parameters based on the current process parameters of the component;

[0011] S105: adjusting corresponding parameters of the forming equipment according to the forming equipment adjustment parameters.

[0012] As an optional embodiment, the component includes a component body and two or more pins; the two or more pins are respectively connected to two sides of the component body; each pin is provided on a pad;

[0013] The first measurement data includes pad span, pad length and component body length; the pad span is the longest distance between two pads;

[0014] The first parameter is the shortest distance between the end of the pad close to the component body and the component body;

[0015] Calculating the first parameter according to the first measurement data in step S102 includes:

[0016] The first parameter Z = (pad span - 2 * pad length - component body length) / 2

[0017] The step S102 of determining whether the first parameter meets the first preset requirement includes:

[0018] Determine whether the value of the first parameter Z is within the range of 0 to 1 mm.

[0019] As an optional embodiment, the method includes:

[0020] When it is determined that the first parameter does not meet the first preset requirement, a prompt message indicating that the pad design is unreasonable is issued.

[0021] As an optional embodiment, the pin includes a first pin segment, a second pin segment, and a third pin segment; one end of the first pin segment is connected to the component body, and the other end is connected to the third pin segment through the second pin segment, and the third pin segment is provided on the pad;

[0022] The process parameters of the component include a pin shoulder width, which is the length of the first pin segment;

[0023] The second parameter is the pad margin; the pad margin is calculated according to the following method: pad margin Δ2 = lead shoulder width - first parameter Z;

[0024] Determining whether the second parameter meets the second preset requirement includes: determining whether Δ2 is not less than 0.5 mm.

[0025] As an optional embodiment, the third parameter is the pad margin;

[0026] The pad margin is calculated as follows: pad margin Δ1 = (pad span - span after lead forming) / 2; the span after lead forming is the distance between the ends of the two third lead segments away from the component body;

[0027] Determining whether the third parameter meets the second preset requirement includes: determining whether Δ1 is not less than 0.25 mm.

[0028] As an optional embodiment, a connection between the second lead segment and the first lead segment has a bending angle; the process parameters of the component include a welding surface length, and the welding surface length is a contact distance between the third lead segment and the pad;

[0029] The post-lead forming span is calculated as follows:

[0030] The span after pin forming = component body length + 2*pin shoulder width + 2*welding surface length + 4x the radius corresponding to the bending angle + 2*pin thickness.

[0031] As an optional embodiment, the method includes:

[0032] When the second parameter or the third parameter does not meet the second preset requirement, the process parameters of the adjusted component are received again, and the second parameter and the third parameter are calculated again based on the re-received process parameters of the adjusted component until the second parameter or the third parameter meets the second preset requirement.

[0033] As an optional embodiment, the forming device includes a presser mold and a forming mold; the forming mold is arranged above the third lead segment and fits with the second lead segment; the presser mold is arranged on the upper and lower sides of the first lead segment to limit the first lead segment; the process parameters of the component include a welding surface length, which is the contact distance between the third lead segment and the pad;

[0034] The forming equipment adjustment parameters include shoulder width adjustment amount and welding surface length adjustment amount;

[0035] The step of calculating the adjustment parameters of the forming equipment according to the current process parameters of the components includes:

[0036] Calculate the shoulder width adjustment and weld face length adjustment according to the following formula:

[0037] Shoulder width adjustment = pin shoulder width - presser foot mold thickness;

[0038] Welding surface length adjustment amount = welding surface length - forming die thickness.

[0039] As an optional embodiment, the first measurement includes the body stand height, and the process parameters of the component include the body stand height; the body stand height is the distance from the first pin segment to the bottom surface of the body; the body stand height is the vertical distance from the bottom surface of the component body to the pad; the forming equipment adjustment parameters include the stand height adjustment parameters;

[0040] The step of calculating the adjustment parameters of the forming equipment according to the current process parameters of the components includes:

[0041] The station height adjustment parameter is calculated according to the following formula:

[0042] Standing height adjustment parameter = main body standing height + main body height from the board.

[0043] In a second aspect, the present invention provides an apparatus for verifying component lead forming parameters, wherein the apparatus is configured to execute the method as described in the first aspect of the present invention.

[0044] The present invention can achieve the following technical effects:

[0045] The method for verifying component lead forming parameters of the present invention includes the following steps: S101: measuring the component to obtain first measurement data; S102: calculating a first parameter based on the first measurement data, determining whether the first parameter meets a first preset requirement, and if so, executing step S103; S103: receiving process parameters of the component, calculating second and third parameters based on the first measurement data and the process parameters of the component, determining whether the second and third parameters meet a second preset requirement, and if so, executing step S104; S104: calculating forming equipment adjustment parameters based on the current process parameters of the component; and S105: adjusting corresponding parameters of the forming equipment based on the forming equipment adjustment parameters. In this way, before component lead forming, the rationality of the component design is pre-verified using the measurement data and the input process parameter indicators, effectively reducing the occurrence of component failures due to improper contact with the pad after lead forming. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Figure 1This is a structural diagram of a component before pin forming according to an embodiment of the present invention;

[0047] Figure 2 This is a structural diagram of a component after pin forming according to an embodiment of the present invention;

[0048] Figure 3 This is a schematic structural diagram of a qualified product after component pin forming according to an embodiment of the present invention;

[0049] Figure 4 It is a structural schematic diagram of a non-conforming product after component pin forming according to an embodiment of the present invention;

[0050] Figure 5 is a structural schematic diagram of an unqualified product after component pin forming according to another embodiment of the present invention;

[0051] Figure 6 It is a structural schematic diagram of a forming device involved in one embodiment of the present invention;

[0052] Figure 7 is a schematic diagram of various parameters involved in an embodiment of the present invention;

[0053] Figure 8 This is an interface diagram of a method for recalculating various parameters according to an embodiment of the present invention;

[0054] Figure 9 is a flow chart of a method for verifying component lead forming parameters according to an embodiment of the present invention;

[0055] Figure 10 This is an interface diagram of a method for calculating a first parameter according to an embodiment of the present invention;

[0056] Figure 11 This is an interface diagram for calculating pad margin based on process parameters according to an embodiment of the present invention;

[0057] Figure 12 This is an interface diagram for adjusting process parameters to achieve a desired pad margin according to an embodiment of the present invention;

[0058] Figure 13 This is an interface diagram for setting adjustment parameters of a forming device according to an embodiment of the present invention;

[0059] Figure 14 It is a flow chart of a method for verifying component lead forming parameters according to another embodiment of the present invention.

[0060] Reference numerals:

[0061] 1. The first mold;

[0062] 11. First forming die; 12. First foot cutting die; 13. First foot pressing die; 14. First anvil;

[0063] 2. Second mold;

[0064] 21. Second forming die; 22. Second foot cutting die; 23. Second foot pressing die; 24. Second anvil;

[0065] 3. Components;

[0066] 31. Component body;

[0067] 32. Pin; 321. First pin segment; 322. Second pin segment; 323. Third pin segment; 4. Pad. DETAILED DESCRIPTION

[0068] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and do not constitute a limitation of the present invention.

[0069] like Figure 1 FIG. 1 shows the structure of a component before pin forming according to an embodiment of the present invention.

[0070] In this application, component 3 refers to an electronic component with pins 32, such as a chip. Before use, the pins of a chip typically need to be soldered to pads to enable signal interaction with other components. Component 3 typically has a pin 32 on at least two sides. During soldering, the component body 31 and the corresponding pins can be soldered to the circuit board, or the component body 31 can be soldered to the pads at a certain height, with the pins connected to the component soldered to the pads to enable interaction between the component and other electronic components.

[0071] Pins, also known as pins, are the connections between the internal circuitry of an integrated circuit (chip) and the peripheral circuitry. These pins constitute the chip's interface. These are the ends of the leads that, through soldering, form solder joints with pads on the printed circuit board. Pins can be divided into the bottom, toe, and side sections.

[0072] like Figure 2 FIG. 1 is a structural diagram of a component after pin forming according to an embodiment of the present invention. Figure 2 It is not difficult to see that after the pins 32 of the component 3 are formed, they are distributed in a π shape with the component body 31. One end of the pin 2 is connected to the component body 31, and the other end is first completely downward and then set horizontally. The horizontally set section is set on the pad.

[0073] Since the contact between the pin and the pad will directly affect the performance of the component, after the component pin is formed, it is generally required that the contact section between the pin and the pad is located exactly in the center of the PCB pad, that is, there should be enough welding length between the toe and the fingertip of the pin and the edge of the pad (that is, Δ1 and Δ2 are greater than the predetermined values). Figure 3 shown.

[0074] like Figure 4 As shown, the pin includes a first pin segment 321, a second pin segment 322, and a third pin segment 323; one end of the first pin segment 321 is connected to the component body 31, and the other end is connected to the third pin segment 323 through the second pin segment 322. The third pin segment 323 is set on the pad 4. If the inner side of the third pin segment 323 (i.e., the pin toe part) does not fully contact the pad 4, the formed component will be judged as unqualified. Figure 5 As shown, if the outer side of the third lead segment 323 (ie, the lead finger end portion) is not in sufficient contact with the pad 4, this may also cause the formed component to be judged as unqualified.

[0075] Since the pin forming of components is one-time and the process is irreversible, once the welding between the component pin and the pad after forming does not meet the requirements, the component can only be scrapped, causing immeasurable losses.

[0076] In order to ensure that the pins of components match the pads after forming, it is necessary to comprehensively consider many factors from a process perspective (for example: mold size, pad length, pad span, forming shoulder width, welding surface length, etc.) and perform a large number of manual dimensional calculations before forming, and then determine the forming process parameters. This calculation method is not only cumbersome and inefficient, but also has a wide variety of components and different external dimensions. How to ensure that the components designed based on the input process parameters can meet the requirements of matching the pins and pads after forming has always been a problem that needs to be solved in the current electronic product assembly field.

[0077] like Figure 14 As shown, the present application provides a method for verifying the pin forming parameters of a component, the method comprising:

[0078] S101: Measure components to obtain first measurement data;

[0079] S102: Calculate a first parameter based on the first measurement data, and determine whether the first parameter meets a first preset requirement. If so, execute step S103;

[0080] S103: Receive process parameters of the component, calculate second and third parameters based on the first measurement data and the process parameters of the component, and determine whether the second and third parameters meet second preset requirements. If so, execute step S104;

[0081] S104: Calculating forming equipment adjustment parameters based on current component process parameters;

[0082] S105: Adjust corresponding parameters of the forming equipment according to the forming equipment adjustment parameters.

[0083] In the present application, the first measurement data is data obtained by measuring the component before the current forming, and the first parameter calculated based on the first measurement data can be used to judge the feasibility of the current component forming. After the first parameter meets the requirements, the process parameters of the component can be received, and the second parameter and the third parameter can be calculated based on the first measurement data and the process parameters of the component. If the second parameter and the third parameter also meet the requirements, it means that the currently input process parameter design is feasible, and thus the forming equipment adjustment parameters can be calculated based on the process parameters of the current component, and the corresponding parameters of the forming equipment can be adjusted. The forming equipment refers to the equipment used for forming the pins of the component. Because the feasibility of the component forming is fully analyzed based on the first measurement data or process parameters before the component is formed, it can be ensured that the pins and pads match after the component is formed, effectively improving the yield of the matched product and meeting the needs of component processing with different process parameter models.

[0084] As an optional embodiment, a component includes a component body and two or more pins; the two or more pins are respectively connected to two sides of the component body; and each pin is disposed on a pad. The first measurement data includes a pad span, a pad length, and a component body length; the pad span is the longest distance between two pads; and the first parameter is the shortest distance between the end of the pad closest to the component body and the component body.

[0085] Calculating the first parameter according to the first measurement data in step S102 includes:

[0086] The first parameter Z = (pad span - 2 * pad length - component body length) / 2

[0087] In step S102, determining whether the first parameter meets the first preset requirement includes:

[0088] Determine whether the value of the first parameter Z is within the range of 0 to 1 mm.

[0089] If the value of the first parameter Z is too large, for example, greater than 1mm, it means that the edge of the component pad is far away from the vertical projection of the edge of the component body during the forming process. In this way, it is not easy for the third pin segment of the component to fall at the center of the pad during forming, indicating that there is a problem with the pad design and it needs to be redesigned.

[0090] Preferably, the method includes: when determining whether the first parameter does not meet the first preset requirement, issuing a prompt message indicating that the pad design is unreasonable. The prompt message may be an audio prompt message, a vibration prompt message, a video prompt message, an image prompt message, a light prompt message, etc. When the pad design is determined to be unreasonable, issuing a prompt message in a timely manner helps to remind the designer to redesign the pad. Since this operation occurs before the component is formed, it can effectively reduce the occurrence of component pins failing after forming due to unreasonable pad design, thereby improving the product yield of the formed component.

[0091] In some embodiments, a lead includes a first lead segment, a second lead segment, and a third lead segment. One end of the first lead segment is connected to the component body, and the other end is connected to the third lead segment via the second lead segment. The third lead segment is disposed on a pad. Component process parameters include a lead shoulder width, which is the length of the first lead segment; and a second parameter, the margin within the pad.

[0092] The pad margin is calculated according to the following method: pad margin Δ2 = pin shoulder width - first parameter Z; judging whether the second parameter meets the second preset requirement includes: judging whether Δ2 is not less than 0.5 mm.

[0093] In other embodiments, the third parameter is a pad margin. The pad margin is calculated as follows: pad margin Δ1 = (pad span - span after lead forming) / 2; the span after lead forming is the distance between two ends of the third lead segments away from the component body; and determining whether the third parameter meets the second preset requirement includes determining whether Δ1 is not less than 0.25 mm.

[0094] like Figure 3 or Figure 7 As shown, if the matching degree between the pins of the formed component and the pads needs to meet the requirements, the pins of the formed component need to be located exactly in the middle of the pads, which is manifested as when the third pin segment is set on the pad, there is a certain distance between it and the two side edges of the pads. The distances from the two side edges of the pads are represented by Δ1 and Δ2 respectively. Generally, the following conditions need to be met to determine that the processability of the component meets the requirements: Δ1 ≥ 0.25 mm and Δ2 ≥ 0.5 mm.

[0095] Preferably, the method of the present invention also includes: when the second parameter or the third parameter does not meet the second preset requirement, re-receiving the adjusted process parameters of the component, and recalculating the second parameter and the third parameter based on the re-received adjusted process parameters of the component until the second parameter or the third parameter meets the second preset requirement.

[0096] By judging the second and third parameters, if the input process parameters are not designed properly, a prompt message can be issued to remind the designer that the current process parameters are not designed properly and need to be improved until the second and third parameters meet the second preset requirements. Because this operation occurs before the component is formed, it can effectively reduce the occurrence of component lead failures after forming due to unreasonable pad design, thereby improving the product yield of component forming.

[0097] In some embodiments, a connection between the second lead segment and the first lead segment has a bending angle; the process parameters of the component include a welding surface length, and the welding surface length is the contact distance between the third lead segment and the pad.

[0098] The post-leadforming span is calculated as follows:

[0099] The span after pin forming = component body length + 2*pin shoulder width + 2*welding surface length + 4x radius corresponding to the bending angle + 2*pin thickness.

[0100] When calculating the span after lead forming, repeatedly considering the influence of the bending angle can effectively improve the accuracy of the span calculation after lead forming, thereby improving the accuracy of the feasibility judgment of the process parameters of the components.

[0101] In some embodiments, the forming device includes a presser die and a forming die; the forming die is disposed above the third lead segment and is in contact with the second lead segment; the presser die is disposed above and below the first lead segment to limit the first lead segment; the process parameters of the component include a soldering surface length, which is the contact distance between the third lead segment and the solder pad;

[0102] The adjustment parameters of the forming equipment include the shoulder width adjustment amount and the welding surface length adjustment amount;

[0103] Calculating the forming equipment adjustment parameters based on the current component process parameters includes:

[0104] Calculate the shoulder width adjustment and weld face length adjustment according to the following formula:

[0105] Shoulder width adjustment = pin shoulder width - presser foot mold thickness;

[0106] Welding surface length adjustment amount = welding surface length - forming die thickness.

[0107] In some other embodiments, the first measurement includes the body stand height, and the process parameters of the component include the body stand height from the board; the body stand height is the distance from the first pin segment to the bottom surface of the body; the body stand height is the vertical distance from the bottom surface of the component body to the pad; the forming equipment adjustment parameters include the stand height adjustment parameters;

[0108] Calculating the forming equipment adjustment parameters based on the current component process parameters includes:

[0109] Calculate the station height adjustment parameters according to the following formula:

[0110] Standing height adjustment parameter = main body standing height + main body height from the board.

[0111] like Figure 6 As shown, the forming apparatus includes a first mold 1 and a second mold 2. The first mold 1 includes a first forming mold, a first leg cutting mold 12, a first leg pressing mold 13, and a first anvil 14. The second mold 2 includes a second forming mold 21, a second leg cutting mold 22, a second leg pressing mold 23, and a second anvil 24. The component includes a component body 31 and two or more pins 32. The first mold 1 is used to form one of the pins 32, and the second mold 2 is used to form the other pin 32.

[0112] Taking the first mold 1 as an example, the first forming mold 11 is positioned above the third lead segment and aligned with the second lead segment. A first anvil plate 14 is positioned directly below the first forming mold 11. A first presser mold 13 is positioned above and below the first lead segment to limit its position. A first leg cutting mold 12 is positioned outside the first forming mold 11 to remove portions of the lead 32 other than the first, second, and third lead segments during the forming process. The operating principle of the second mold 2 is similar to that of the first mold 1 and will not be elaborated on here.

[0113] In this application, the parameter adjustment of the forming equipment can be completed by micrometers, which include standing height micrometers, shoulder width micrometers and welding surface length micrometers. The standing height micrometer is used to adjust the standing height adjustment parameters, the shoulder width micrometer is used to adjust the shoulder width adjustment parameters, and the welding surface length micrometer is used to adjust the welding surface length.

[0114] Since there are many related dimensional parameters involved in the process of reviewing and recalculating the forming process of components, it is possible to establish a component forming dimensional model and define various parameters for subsequent calculations. The component forming dimensional model is as follows: Figure 7 As shown, Figure 7 The parameters in are defined as follows:

[0115] L1: Width of the component body;

[0116] N: pin thickness;

[0117] X: pad length;

[0118] Y: pad span;

[0119] R: Bending angle radius (mold R angle), which is an inherent property of the mold and is determined according to the selected mold; value

[0120] Z: Horizontal gap between the inside of the pad and the component body;

[0121] ΔA: Shoulder width adjustment (adjust the shoulder width by micrometer);

[0122] A: Component forming shoulder width;

[0123] M2: Component height from the board;

[0124] M1: Component body height;

[0125] M: Overall height of components, the value is M1+M2;

[0126] B: welding surface length;

[0127] L: total span after forming;

[0128] Δ1: margin outside the pad;

[0129] Δ2: margin inside the pad;

[0130] M(A): presser foot mold thickness;

[0131] M(B): Thickness of forming die.

[0132] When determining the manufacturability of component lead forming, the following requirements should be met: After the component lead is formed, the component pin and the PCB pad should meet the following requirements:

[0133] (1) The pad margin (Δ1) has a minimum soldering surface length of 0.25 mm;

[0134] (2) The margin (Δ2) in the pad should be at least 0.5mm of the welding surface length.

[0135] The pad margin Δ1 can be calculated as follows:

[0136] Δ1=(YL) / 2

[0137] Among them: L=L1+2A+2B+4R+2N.

[0138] The pad margin Δ2 can be calculated as follows:

[0139] Δ2=(AZ)

[0140] Where: Z = (Y-2X-L1) / 2.

[0141] The parameters used in the component forming process are shown in Table 1 below:

[0142]

[0143] Table 1-Component forming parameters

[0144] The parameters in Table 1 are described as follows:

[0145] a) Row numbers 1 to 6 are measured data, i.e. the first measurement data;

[0146] b) Item 7 is to determine the gap between the inside of the pad and the body. 0mm-1mm is the best, which is the first parameter.

[0147] c) Items 8 to 10, process input data, i.e. process parameters, can be input by the designer in real time. When the internal and external margins of the pad do not meet the process requirements, the process data needs to be adjusted dynamically;

[0148] d) Items 11 to 13 are the calculated micrometer adjustments, i.e. the forming equipment adjustment parameters;

[0149] e) The calculated values ​​of the key process dimensions in items 15 and 16, i.e. the second and third parameters, are used to determine the conformity of the process.

[0150] like Figure 8 The following is a diagram of the software interface for recalculating various parameters based on the design in Table 1. The interface specifically includes the chip description column, pad description column, forming process selection column, data calculation and confirmation column, and micrometer setting column. The descriptions of each part are as follows:

[0151] Chip description column: including chip type selection, pin outlet method, chip model, number of pins, pin thickness, pin width, body height, body size, etc. Among them, pin thickness, pin width, body height, and body size need to be measured and filled in with data;

[0152] Pad description column: including pad length, pad span, pad inner side and body gap, etc. The pad length and pad span need to be measured and filled in with data. The pad inner side and body gap can be automatically calculated by the software to give the result. If the calculated result is not within the range of 0-1mm, there is a problem with the pad design and the design needs to be changed.

[0153] Forming process selection column: including shoulder width, stand height, welding surface length, etc., which can be input through the software interface;

[0154] Data calculation and confirmation column: including span after forming, toe and heel, finger end, etc. The data of toe and heel and finger end are used to judge the rationality of the forming process. If the toe and heel (i.e. Δ2) ≥ 0.5mm and the finger end (i.e. Δ1) ≥ 0.25mm, it is qualified. Otherwise, process parameter adjustment and design change will be made.

[0155] Micrometer setting column: including shoulder width, stand height, welding length, etc. The adjustment amount of shoulder width, stand height and welding surface length is automatically calculated by computer program. According to the adjustment amount value, the equipment micrometer is adjusted to perform forming operation.

[0156] like Figure 8 As shown, the present invention discloses a component forming processability review and recalculation and offline interpretation method, which can effectively and quickly predict the rationality of PCB pad design and process parameter design. At the same time, through software calculation methods, it can determine the adjustment amount of micrometers such as shoulder width, standing height, and welding surface length, reducing calculation errors caused by manual calculation. The implementation process is as follows:

[0157] S1: size measurement;

[0158] S2: Fill in measurement data;

[0159] S3: Determine whether Z is between 0-1mm. If so, proceed to S4; otherwise, proceed to S9.

[0160] S4: Input process parameters;

[0161] S5: Determine whether the following conditions are met: Δ1 ≥ 0.25 mm, Δ2 ≥ 0.5 mm. If so, proceed to S6; otherwise, proceed to S7.

[0162] S6: Determine the micrometer adjustment amount;

[0163] S7: Adjust process parameters;

[0164] After S7, the process can proceed to S8: again determine whether the following conditions are met: Δ1 ≥ 0.25 mm, Δ2 ≥ 0.5 mm. If so, proceed to S6; otherwise, proceed to S9.

[0165] S9: Design changes.

[0166] like Figure 10-13 As shown, the method for verifying and recalculating the component forming processability of the present invention is further described, using the forming process of a specific component model as an example. Assume that the forming equipment parameters are: presser mold thickness M(A) = 1.4mm; forming mold thickness M(B) = 0.86mm; and mold forming radius (R) = 0.39mm. The component model to be formed is the A54SX72A-CQ208, with a 208-pin CQFP package.

[0167] (1) First measure the dimensions. The measured parameters are as follows:

[0168] Component body height M1 = 2.37mm;

[0169] Component body size L1 = 29.19mm;

[0170] Pin thickness N = 0.16 mm;

[0171] Pin width = 0.25mm;

[0172] Pad design length X = 4.0 mm;

[0173] The pad design span Y = 37.47 mm;

[0174] (2) Fill in the measurement data

[0175] After filling in the measured data, the first parameter Z is calculated. The gap between the inner side of the pad and the body Z = 0.14mm, indicating that the position relationship between the pad and the device body is reasonable, such as Figure 10 shown.

[0176] (3) Fill in process parameters

[0177] The input process parameters include: shoulder width 2mm, stand height 0.5mm, welding surface length 1.5mm, and then calculate. The calculation results in the data verification and confirmation column are: fingertip (toe) Δ1 = 0.09mm, heel (toe heel) Δ2 = 1.86mm. Since Δ1 ≥ 0.25mm is not satisfied, the calculation result is unqualified and the process parameters need to be adjusted. Figure 11 shown.

[0178] Adjust the shoulder width in the process parameters from 2mm to 1.5mm, and the calculation results are as follows Figure 12 As shown in the figure, the fingertip (toe) Δ1 = 0.59 mm, the heel (toe heel) Δ2 = 1.36 mm, and the calculated results are qualified.

[0179] (4) Confirm the micrometer adjustment amount

[0180] After adjusting the process parameters, the forming process is reasonable, and then according to the micrometer adjustment amount, adjust the three micrometers of the forming equipment (shoulder width adjustment micrometer, standing height adjustment micrometer, welding surface length adjustment micrometer) to the specified data, see Figure 13 , parameter adjustment thickness rating forming equipment can be used to carry out subsequent component batch forming.

[0181] In a second aspect, the present invention provides an apparatus for verifying component lead forming parameters, the apparatus being configured to execute any one of the methods of the first aspect of the present invention.

[0182] The device may be a storage medium or an electronic device (such as a mobile terminal, a host computer, etc.) including a storage medium. A computer program is stored in the storage medium, and when the computer program is executed by the processor, the method steps of any one of the first aspects of the present invention are implemented. In the description of this specification, the description of the reference terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms is not necessarily for the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples without contradicting each other.

[0183] Although the embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and are not to be construed as limitations on the present invention. A person skilled in the art may change, modify, replace and modify the above embodiments within the scope of the present invention.

[0184] The above specific embodiments of the present invention do not constitute a limitation on the scope of protection of the present invention. Any other corresponding changes and modifications made based on the technical concept of the present invention should be included in the scope of protection of the claims of the present invention.

Claims

1. A method for verifying component lead forming parameters, characterized in that: The method comprises: S101: Measure the component to obtain first measurement data; S102: Calculate a first parameter based on the first measurement data, and determine whether the first parameter meets a first preset requirement. If so, execute step S103; S103: receiving the process parameters of the component, calculating the second parameter and the third parameter according to the first measurement data and the process parameters of the component, and determining whether the second parameter and the third parameter meet the second preset requirement, and if so, executing step S104; S104: Calculating forming equipment adjustment parameters based on the current process parameters of the component; S105: adjusting corresponding parameters of the forming equipment according to the forming equipment adjustment parameters; The component includes a component body and two or more pins; the two or more pins are respectively connected to two sides of the component body; each pin is provided on a pad; The first measurement data includes pad span, pad length and component body length; the pad span is the longest distance between two pads; The first parameter is the shortest distance between the end of the pad close to the component body and the component body; Calculating the first parameter according to the first measurement data in step S102 includes: The first parameter Z = (pad span - 2 * pad length - component body length) / 2 The step S102 of determining whether the first parameter meets the first preset requirement includes: Determine whether the value of the first parameter Z is within the range of 0~1mm; When it is determined that the first parameter does not meet the first preset requirement, a prompt message indicating that the pad design is unreasonable is issued.

2. The method for verifying component lead forming parameters according to claim 1, wherein: The pin includes a first pin segment, a second pin segment and a third pin segment; one end of the first pin segment is connected to the component body, and the other end is connected to the third pin segment through the second pin segment, and the third pin segment is provided on the pad; The process parameters of the component include a pin shoulder width, which is the length of the first pin segment; The second parameter is the pad margin; the pad margin is calculated according to the following method: pad margin Δ2 = pin shoulder width - first parameter Z; Determining whether the second parameter meets the second preset requirement includes: determining whether Δ2 is not less than 0.5 mm.

3. The method for verifying component lead forming parameters according to claim 2, wherein: The third parameter is the margin outside the pad; The pad margin is calculated as follows: pad outer margin Δ1 = (pad span after lead forming) / 2; the span after lead forming is the distance between the ends of the two third lead segments away from the component body; Determining whether the third parameter meets the second preset requirement includes: determining whether Δ1 is not less than 0.25 mm.

4. The method for verifying component lead forming parameters according to claim 3, wherein: The connection between the second lead segment and the first lead segment has a bending angle; the process parameters of the component include a welding surface length, and the welding surface length is the contact distance between the third lead segment and the pad; The post-lead forming span is calculated as follows: The span after pin forming = component body length + 2*pin shoulder width + 2*welding surface length + 4x the radius corresponding to the bending angle + 2*pin thickness.

5. The method for verifying component lead forming parameters according to claim 1, 2 or 3, wherein: The method comprises: When the second parameter or the third parameter does not meet the second preset requirement, the process parameters of the adjusted component are received again, and the second parameter and the third parameter are calculated again based on the re-received process parameters of the adjusted component until the second parameter or the third parameter meets the second preset requirement.

6. The method for verifying component lead forming parameters according to claim 2, wherein: The forming device includes a presser die and a forming die; the forming die is arranged above the third lead segment and fits with the second lead segment; the presser die is arranged on the upper and lower sides of the first lead segment to limit the first lead segment; the process parameters of the component include the welding surface length, which is the contact distance between the third lead segment and the pad; The forming equipment adjustment parameters include shoulder width adjustment amount and welding surface length adjustment amount; The step of calculating the adjustment parameters of the forming equipment according to the current process parameters of the components includes: Calculate the shoulder width adjustment and weld face length adjustment according to the following formula: Shoulder width adjustment = pin shoulder width - presser foot mold thickness; Welding surface length adjustment amount = welding surface length - forming die thickness.

7. The method for verifying component lead forming parameters according to claim 2 or 6, wherein: The first measurement data includes the body stand height, and the process parameters of the component include the body stand height from the board; the body stand height is the distance from the first pin segment to the bottom surface of the body; the body stand height is the vertical distance from the bottom surface of the component body to the pad; the forming equipment adjustment parameters include the stand height adjustment parameters; The step of calculating the adjustment parameters of the forming equipment according to the current process parameters of the components includes: The station height adjustment parameter is calculated according to the following formula: Standing height adjustment parameter = main body standing height + main body height from the board.

8. A device for verifying component lead forming parameters, characterized in that: The device is used to perform the method according to any one of claims 1 to 7.

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