An extrusion mechanism and extrusion system for the edge accompanying of a semiconductor base material wafer

Abstract

The present invention discloses an extrusion mechanism and an extrusion system for the edge accompanying of a semiconductor base material wafer, including a bent plate, a support, a swing rod, a probe, a probe positioning component, a swing rod rotation component and a swing rod rotation angle adjustment component. The lower end surface of the bent plate is connected to the support. The probe positioning component is fixedly connected to the lower end surface of the horizontal section of the support. The swing rod rotation component is fixedly connected to one side of the vertical section of the support close to the probe positioning component. The swing rod rotation angle adjustment component is fixedly connected to the other side of the vertical section of the support far from the probe positioning component. The probe is installed in the probe positioning component. The swing rod is rotatably installed in the swing rod rotation component. Among them, one side of the probe is close to the swing rod, and the other side of the swing rod rotation angle adjustment component is close to the swing rod. The swing rod swings in the space between the probe and the swing rod rotation angle adjustment component. The number of the swing rod, the probe and the swing rod rotation angle adjustment component is the same.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor chip manufacturing, and particularly relates to an extrusion mechanism and an extrusion system for the wafer margin of a semiconductor base material. Background Art

[0002] With the rapid development of China's semiconductor industry, due to the polishing process characteristics of regular wafers, in order to protect the wafers and prevent chipping of the four sides during the polishing process, it is required to bond four margins around the regular wafers. The four margins are connected end to end to form a new rectangle around the regular wafer, and they must be bonded seamlessly. Otherwise, the wafer will chip and be damaged during the polishing process. Therefore, the bonding gap between the wafer and the margin is an important factor affecting the polishing process.

[0003] In the existing extrusion mechanism, although the method of simultaneously extruding from 4 directions of the wafer is also adopted, the extrusion mechanism uses a spring structure with a guide. Due to mechanical reasons during the compression of the spring, the force provided is not very stable, sometimes large and sometimes small, resulting in unstable thrust and difficult adjustment. Even if there is no gap after extrusion in place, once the extrusion mechanism returns, since the extrusion block and the margin adopt surface contact and the contact surface is too large, the margin will be randomly pulled out when the extrusion block returns, causing a gap between the wafer and the margin, resulting in the disadvantage of poor quality of the wafer polishing process. Summary of the Invention

[0004] The purpose of the present invention is to overcome the above-mentioned deficiencies of the prior art, and provides an extrusion mechanism and an extrusion system for the wafer margin of a semiconductor base material, which solve the problems of unstable thrust, difficult adjustment, and when the extrusion mechanism returns, due to the withdrawal of the extrusion block, the margin is also randomly pulled out, resulting in a gap between the margin and the wafer.

[0005] To solve the technical problems, the technical solution of the present invention is: an extrusion mechanism for the wafer margin of a semiconductor base material, including a bent plate, a support, a swing rod, a probe, a probe positioning component, a swing rod rotation component, and a swing rod rotation angle adjustment component. The lower end surface of the bent plate is connected to the support. The probe positioning component is fixedly connected to the lower end surface of the horizontal section of the support. The swing rod rotation component is fixedly connected to one side of the vertical section of the support close to the probe positioning component. The swing rod rotation angle adjustment component is fixedly connected to the other side of the vertical section of the support far from the probe positioning component. The probe is installed in the probe positioning component. The swing rod is rotatably installed in the swing rod rotation component. One side of the probe is close to the swing rod, and the other side of the swing rod rotation angle adjustment component is close to the swing rod. The swing rod swings in the space between the probe and the swing rod rotation angle adjustment component. The number of the swing rod, the probe, and the swing rod rotation angle adjustment component is the same.

[0006] Preferably, the bent plate is a "Z"-shaped structure, and the lower end surface of the lower side of the bent plate is fixedly connected to the upper end surface of the support by a first screw.

[0007] Preferably, the support is a "¬"-shaped structure, the upper end surface of the horizontal section of the support is fixedly connected to the lower end surface of the lower side of the bent plate by a first screw, and the lower end surface of the horizontal section of the support is fixedly connected to the probe positioning assembly by a second screw.

[0008] Preferably, a notch is opened on the lower side of the vertical section of the support, and the number of the notches is the same as the number of the rocker arms. A rocker arm rotating assembly is fixed to the side of the vertical section of the support close to the probe positioning assembly. The upper side of the rocker arm can be rotatably mounted on the rocker arm rotating assembly, and the lower side of the rocker arm extends out from the notch.

[0009] Preferably, the probe positioning assembly includes a connecting block and a fourth screw, the upper end surface of the connecting block is fixedly connected to the lower end surface of the horizontal section of the support by the second screw, and a probe hole is opened on the connecting block. The probe is inserted into the probe hole, one end of the probe extends from the probe hole to support the rocker arm, and the other end of the probe is fixed by the fourth screw.

[0010] Preferably, the rocker arm rotation assembly includes a connecting shaft, a fixing seat, a spacer sleeve and a third screw. There are two fixing seats and two third screws respectively. The upper sides of the two fixing seats are respectively fixed to the side of the vertical section of the support close to the probe positioning assembly by two third screws, and a through hole is provided on the lower side of the fixing seat. The connecting shaft passes through the through holes of the two fixing seats respectively, and the end of the connecting shaft is fixed by a nut. The upper side of the rocker arm is connected to the connecting shaft, and the lower side of the rocker arm extends out from the notch. There are several rocker arms, and a spacer sleeve is provided between two adjacent rocker arms.

[0011] Preferably, the pendulum rod is an "L"-shaped structure, a circular ring is arranged on the top of the vertical section of the pendulum rod, the circular ring is connected to the connecting shaft, the horizontal section of the pendulum rod is a truncated cone, and the size of the horizontal section of the pendulum rod gradually decreases as it moves away from the vertical section of the pendulum rod.

[0012] Preferably, the rocker arm rotation angle adjustment assembly includes a nut and a fifth screw, a screw hole is opened at the support on the upper side of the notch, the fifth screw passes through the screw hole and is fixed by the nut, and the fifth screw passes through the screw hole to limit the swing angle of the rocker arm, the position of the screw hole corresponds to the rocker arm, and the number of the screw holes is the same as the number of the rocker arm.

[0013] Preferably, a semiconductor base material wafer edge extrusion system comprises four semiconductor base material wafer edge extrusion mechanisms as described in any of the above items and two groups of ball screws, the two groups of ball screws are cross-arranged, the four extrusion mechanisms are divided into two groups, the bent plates of the two extrusion mechanisms in each group are respectively connected to the two ends of the ball screw through connecting parts, and the two extrusion mechanisms in each group are arranged in a centrally symmetrical manner.

[0014] Preferably, the ball screw is a left-handed screw, and two groups of ball screws respectively drive two groups of extrusion mechanisms to move, thereby completing simultaneous extrusion of the wafer in four directions.

[0015] Compared with the prior art, the advantages of the present invention are:

[0016] (1) The present invention discloses an extrusion mechanism for a semiconductor base material wafer edge, comprising a bending plate, a support, a swing rod, a probe, a probe positioning assembly, a swing rod rotation assembly and a swing rod rotation angle adjustment assembly, wherein the probe is mounted on the probe positioning assembly, the swing rod is rotatably mounted on the swing rod rotation assembly, the probe and the swing rod rotation angle adjustment assembly limit the swing angle of the swing rod from both sides of the swing rod, so that the thrust and swing angle of the swing rod can be adjusted by adjusting the probe or the swing rod rotation angle adjustment assembly, the number of the swing rods is 3 to 4, the swing rod and the edge are in point contact, so that there are only a few contact points between the extrusion mechanism and the edge, reducing the contact area, so that the edge will not rebound or be carried out during the return process of the extrusion mechanism, avoiding the occurrence of gaps, and improving the quality of the wafer polishing process;

[0017] (2) The present invention adopts the structure of a probe and a probe positioning assembly, and the probe is fixedly installed in the probe positioning assembly. One end of the probe extends from the probe positioning assembly to support the swing rod. The mechanical guidance of the probe is relatively stable. The thrust size can be manually adjusted through the probe positioning assembly, or probes of different specifications can be selected according to different thrust sizes;

[0018] (3) The present invention adopts a connection structure of a swing rod and a swing rod rotating assembly, wherein a plurality of swing rods are rotatably fixed on the swing rod rotating assembly. The number of swing rods can be selected according to the length of the side edge. A spacer is provided between two adjacent swing rods, so that the two adjacent swing rods do not affect each other. The upper side of the swing rod is connected to the swing rod rotating assembly, and the lower side of the swing rod extends from the notch of the support to push the side edge.

[0019] (4) The present invention discloses an extrusion system for the edge of a semiconductor base material wafer. The extrusion system includes four extrusion mechanisms and two sets of ball screws, which extrude the wafer from four directions simultaneously. The system is symmetrically arranged, symmetrical left-right, and front-back; the extrusion distance is achieved by driving the ball screws with a stepper motor. The ball screws are left-right rotating screws, which respectively drive the left and right extrusion mechanisms to move left and right, and the front and rear extrusion mechanisms to move forward and backward, thereby completing the simultaneous extrusion of the wafer in four directions to ensure the bonding quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 , a schematic diagram of a front cross-sectional structure of an extrusion mechanism for a semiconductor base material wafer edge of the present invention;

[0021] Figure 2 , a top view of an extrusion mechanism for a semiconductor base material wafer edge of the present invention;

[0022] Figure 3 3. Right view of the extrusion mechanism for the wafer margin of a semiconductor base material according to the present invention;

[0023] Figure 4 7. Schematic structural diagram of an extrusion system for the wafer margin of a semiconductor base material according to the present invention.

[0024] Explanation of reference numerals:

[0025] 1. Bent plate, 2. Connecting block, 3. Support, 4. Connecting shaft, 5. Fixed seat, 6. Swing rod, 7. Sleeve, 8. First screw, 9. Second screw, 10. Probe, 11. Third screw, 12. Fourth screw, 13. Nut, 14. Fifth screw, 15. Margin, 16. Wafer;

[0026] 2-1. Probe hole;

[0027] 3-1. Notch, 3-2. Screw hole. Detailed implementation manners

[0028] The following describes the detailed implementation manners of the present invention in conjunction with embodiments:

[0029] It should be noted that the structures, ratios, sizes, etc. shown in this specification are only used to cooperate with the content disclosed in the specification for those skilled in this technology to understand and read, and are not used to limit the implementation conditions of the present invention. Any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the effects that the present invention can produce and the purposes that can be achieved, should still fall within the scope covered by the technical content disclosed in the present invention.

[0030] At the same time, the terms such as "upper", "lower", "left", "right", "middle" and "one" cited in this specification are only for the convenience of clear narration, and are not used to limit the implementation scope of the present invention. The change or adjustment of their relative relationships, without substantial change of the technical content, should also be regarded as the scope that the present invention can implement.

[0031] The wafer is a semiconductor base material, such as: silicon wafer, cadmium telluride zinc, indium antimonide, etc.; the margin is a silicon wafer that protects the wafer, which is distributed around the wafer and plays a protective role during the wafer polishing to prevent the four sides of the wafer from chipping; extrusion is to form a new rectangle around the four margins around the regular wafer in a head-to-tail connection manner, so that there is no gap between the wafer and the four margins. The bonding is carried out by heating the wax for bonding (the wax melts into a liquid state at about 65°C) and curing at room temperature.

[0032] Embodiment 1

[0033] As Figures 1 to 3As shown, the present invention discloses an extrusion mechanism for the edge of a semiconductor basic material wafer, comprising a bending plate 1, a support 3, a pendulum 6, a probe 10, a probe positioning assembly, a pendulum rotation assembly and a pendulum rotation angle adjustment assembly, wherein the lower end face of the bending plate 1 is connected to the support 3, the probe positioning assembly is fixedly connected to the lower end face of the horizontal section of the support 3, the pendulum rotation assembly is fixedly connected to a side of the vertical section of the support 3 close to the probe positioning assembly, the pendulum rotation angle adjustment assembly is fixedly connected to a side of the vertical section of the support 3 away from the probe positioning assembly, the probe 10 is installed in the probe positioning assembly, the pendulum 6 is rotatably installed in the pendulum rotation assembly, wherein the probe 10 is close to one side of the pendulum 6, and the pendulum rotation angle adjustment assembly is close to the other side of the pendulum 6, the pendulum 6 swings in the space between the probe 10 and the pendulum rotation angle adjustment assembly, and the number of the pendulum 6, the probe 10 and the pendulum rotation angle adjustment assembly is the same.

[0034] Example 2

[0035] like Figure 1 As shown, preferably, the bent plate 1 is a "Z"-shaped structure, and the lower end surface of the lower side of the bent plate 1 is fixedly connected to the upper end surface of the support 3 by a first screw 8.

[0036] like Figure 1 As shown, preferably, the support 3 is a "¬" type structure, the upper end surface of the horizontal section of the support 3 is fixedly connected to the lower end surface of the lower side of the bent plate 1 by a first screw 8, and the lower end surface of the horizontal section of the support 3 is fixedly connected to the probe positioning assembly by a second screw 9.

[0037] like Figure 3 As shown, preferably, a notch 3-1 is opened on the lower side of the vertical section of the support 3, and the number of the notches 3-1 is the same as the number of the rocker arms 6. A rocker arm rotating assembly is fixed to one side of the vertical section of the support 3 close to the probe positioning assembly. The upper side of the rocker arm 6 can be rotatably mounted on the rocker arm rotating assembly, and the lower side of the rocker arm 6 extends out from the notch 3-1.

[0038] Example 3

[0039] like Figure 1 As shown, preferably, the probe positioning assembly includes a connecting block 2 and a fourth screw 12, the upper end surface of the connecting block 2 is fixedly connected to the lower end surface of the horizontal section of the support 3 by the second screw 9, a probe hole 2-1 is opened on the connecting block 2, the probe 10 is inserted into the probe hole 2-1, one end of the probe 10 extends from the probe hole 2-1 to support the rocker arm 6, and the other end of the probe 10 is fixed by the fourth screw 12.

[0040] The needle 10 is inserted into the probe hole 2-1 on the connection block 2. One end of the probe 10 extends out of the probe hole 2-1 of the connection block 2 and abuts against the swing rod 6, providing a certain thrust to the swing rod 6. The other end of the probe 10 is fixed by the fourth screw 12, and the extending length of the probe 10 is adjusted by the fourth screw 12.

[0041] The extrusion mechanism of the present invention has 3 to 4 sets of probes 10, and the lengths of the probes 10 extending out of the probe holes 2-1 are the same.

[0042] Embodiment 4

[0043] As Figure 1 、 2 As shown, preferably, the swing rod rotating assembly includes a connecting shaft 4, a fixed seat 5, a spacer sleeve 7 and a third screw 11. There are two fixed seats 5 and two third screws 11 respectively. The upper sides of the two fixed seats 5 are respectively fixed to one side of the vertical section of the support 3 close to the probe positioning assembly by the two third screws 11, and through holes are provided on the lower sides of the fixed seats 5. The connecting shaft 4 passes through the through holes of the two fixed seats 5 respectively, and the end of the connecting shaft 4 is fixed by a nut. The upper side of the swing rod 6 is inserted into the connecting shaft 4, and the lower side of the swing rod 6 extends out from the notch 3-1. There are several swing rods 6, and a spacer sleeve 7 is arranged between adjacent two swing rods 6.

[0044] There are 3 to 4 notches 3-1 on the support 3 for the swing rod 6 to extend out. One notch 3-1 is located corresponding to the connecting shaft 4 to install one swing rod 6. There are 3 to 4 swing rods 6 in the extrusion mechanism. Each swing rod 6 is isolated from each other by a spacer sleeve 7. The fixed seat 5, the spacer sleeve 7 and the swing rod 6 are sequentially inserted into the connecting shaft 4. After installation, one end of the connecting shaft 4 is fixed by a nut; the installed connecting shaft 4 connects the two fixed seats 5 to the support 3 with two third screws 11, thus completing the installation of the swing rod rotating assembly.

[0045] As Figure 1 As shown, preferably, the swing rod 6 has an "L" shape. A circular ring is provided at the top of the vertical section of the swing rod 6, and the circular ring is inserted into the connecting shaft 4. The horizontal section of the swing rod 6 is frustum-shaped, and the size of the horizontal section of the swing rod 6 gradually decreases as it is farther away from the vertical section of the swing rod 6.

[0046] There are 3 to 4 swing rods 6. The dimensions of the swing rods along the moving direction (length) of the accompanying edge 15 are the same. The dimensions of the swing rods along the direction perpendicular to the moving direction of the accompanying edge 15 (width) are the same or different, and the width dimension of the swing rod 6 close to the edge of the support 3 is larger.

[0047] When the extrusion mechanism returns, the swing rod 6 does not move directly in the opposite direction. Instead, it first returns from the compressed state to the normal state. At this time, a continuous pressure is provided to the accompanying edge 15 to prevent the accompanying edge 15 from rebounding. When the swing rod 6 swings to the position restricted by the swing rod rotation angle adjustment component, the swing rod 6 separates from the accompanying edge 15 to prevent the accompanying edge 15 from being taken out.

[0048] Embodiment 5

[0049] As Figure 1 、 3 shown, preferably, the swing rod rotation angle adjustment component includes a nut 13 and a fifth screw 14. A screw hole 3-2 is provided at the support 3 on the upper side of the notch 3-1. The fifth screw 14 passes through the screw hole 3-2 and is fixed by the nut 13. The fifth screw 14 passes through the screw hole 3-2 to limit the swing angle of the swing rod 6. The position of the screw hole 3-2 corresponds to the swing rod 6, and the number of screw holes 3-2 is the same as the number of swing rods 6.

[0050] The fifth screw 14 is installed on the support 3. The number of the fifth screws 14 is the same as the number of the swing rods 6. There is a swing rod 6 corresponding to each position of the fifth screw 14. The extrusion mechanism is provided with 3 to 4 fifth screws 14, corresponding to the positions of 3 to 4 swing rods 6 on the connecting shaft 4. By adjusting the protruding position of the fifth screw 14, the purpose of adjusting the swing angle of the swing rod 6 can be achieved. After adjustment, lock the fifth screw 14 with the nut 13.

[0051] Embodiment 6

[0052] As Figure 4 shown, preferably, an extrusion system for the accompanying edge of a semiconductor base material wafer includes four extrusion mechanisms for the accompanying edge of a semiconductor base material wafer as described in any one of the above, and two groups of ball screws. The two groups of ball screws are arranged in a cross shape. The four extrusion mechanisms are divided into two groups. The bent plates 1 of the two extrusion mechanisms in each group are respectively connected to both ends of the ball screw through connecting pieces, and the two extrusion mechanisms in each group are arranged in central symmetry.

[0053] Preferably, the ball screws are left - and - right - hand screws. The two groups of ball screws drive the two groups of extrusion mechanisms to move respectively to complete the simultaneous extrusion of the wafer in four directions.

[0054] The four extrusion mechanisms can be installed according to the existing installation method. Install the four extrusion mechanisms in four directions to complete the simultaneous extrusion of the wafer in four directions.

[0055] The working principle of the present invention is as follows:

[0056] As Figures 1 to 3As shown in the figure, the present invention provides an extrusion mechanism for the bevel of a semiconductor base material wafer, which includes a bent plate 1, a support 3, a swing rod 6, a probe 10, a probe positioning component, a swing rod rotation component, and a swing rod rotation angle adjustment component. The probe 10 is installed in the probe positioning component, the swing rod 6 is rotatably fixed in the swing rod rotation component, and the probe 10 and the swing rod rotation angle adjustment component limit the swing angle of the swing rod 6 from both sides of the swing rod 6. In this way, the thrust and swing angle of the swing rod 6 can be adjusted by adjusting the probe or the swing rod rotation angle adjustment component. The number of swing rods 6 is 3 to 4, and the swing rod 6 is in point contact with the bevel 15, so that there are only a few contact points between the extrusion mechanism and the bevel 15, reducing the contact area, preventing the bevel 15 from rebounding or being taken out during the return process of the extrusion mechanism, avoiding the appearance of gaps, and improving the quality of the wafer polishing process; the extrusion of the bevel in the extrusion mechanism is achieved by the swing rod 6. When the swing rod 6 is in extrusion contact with the bevel, due to the resistance of the bevel to the swing rod 6, the swing rod 6 will rotate backward by a certain angle, and the probe 10 is compressed, so that the bevel is pushed in the direction of the wafer 16 to achieve the purpose of extrusion. When the extrusion mechanism returns, the swing rod 6 does not move directly in the opposite direction, but first returns from the compressed state to the normal state. At this time, a continuous pressure will be provided to the bevel 15 to prevent the bevel 15 from rebounding. When the swing rod 6 swings to the position limited by the swing rod rotation angle adjustment component, the swing rod 6 is separated from the bevel 15 to prevent the bevel 15 from being taken out. The magnitude of the bevel thrust is adjusted manually through the probe positioning component or by replacing the probe specifications, and the swing angle of the swing rod 6 is adjusted manually through the swing rod rotation angle adjustment component.

[0057] The assembly process of the present invention is as follows:

[0058] The first step is to complete the assembly of the probe positioning component: insert the probe 10 into the probe hole 2-1 on the connecting block 2, with one end of the probe head 10 protruding and the other end fixed by the fourth screw 12. The protruding length of the probe 10 is adjusted by the fourth screw 12, and there are 3 to 4 sets of probes in total;

[0059] The second step is to complete the assembly of the swing rod rotation component: first install 2 fixing seats 5 on the support 3, then install the connecting shaft 4, the swing rod 6, and the spacer sleeve 7 on the fixing seats 5 in sequence, and finally fix them with nuts;

[0060] The third step is to complete the assembly of the swing rod rotation angle adjustment component: the nut 13 and the fifth screw 14 are fixed on the support 3. Adjusting the fifth screw 14 can adjust the rotation angle of the swing rod 6, and after adjustment, it is fixed with the nut 13;

[0061] The fourth step is to connect the probe positioning component and the support 3 with the second screw 9;

[0062] The fifth step is to connect the support 3 to the bent plate 1 with the first screw 8.

[0063] When the extrusion mechanism moves forward, the swing rod 6 first contacts the accompanying edge 15. As the extrusion mechanism moves forward a greater distance, the swing rod 6 will swing backward due to the resistance of the accompanying edge 15. At this time, the probe 10 installed on the connecting block 2 generates a certain thrust on the swing rod 6 swinging backward, so that the swing rod 6 pushes the accompanying edge 15 to move toward the wafer 16, thereby achieving the purpose of extruding the accompanying edge. The extrusion distance of the extrusion mechanism is achieved through the control system and can be manually set according to actual conditions. The control system adopts a conventional PLC control system.

[0064] The invention discloses an extrusion mechanism for a semiconductor basic material wafer edge, comprising a bending plate, a support, a swing rod, a probe, a probe positioning assembly, a swing rod rotating assembly and a swing rod rotation angle adjustment assembly. The probe is installed on the probe positioning assembly, and the swing rod is rotatably installed on the swing rod rotating assembly. The probe and the swing rod rotation angle adjustment assembly limit the swing angle of the swing rod from both sides of the swing rod, so that the thrust and the swing angle of the swing rod can be adjusted by adjusting the probe or the swing rod rotation angle adjustment assembly. The number of the swing rods is 3 to 4, and the swing rod and the edge are in point contact, so that there are only a few contact points between the extrusion mechanism and the edge, which reduces the contact area, so that the edge will not rebound or be carried out during the return process of the extrusion mechanism, avoid the occurrence of gaps, and improve the quality of the wafer polishing process.

[0065] The present invention adopts the structure of a probe and a probe positioning assembly, and the probe is fixedly installed in the probe positioning assembly. One end of the probe extends from the probe positioning assembly to support the rocker arm. The mechanical guidance of the probe is relatively stable. The thrust size can be manually adjusted through the probe positioning assembly, or probes of different specifications can be selected according to different thrust sizes.

[0066] The present invention adopts a connection structure of a rocker arm and a rocker arm rotating assembly, and a plurality of rocker arms are rotatably fixed on the rocker arm rotating assembly. The number of rocker arms can be selected according to the length of the accompanying edge. A spacer is provided between two adjacent rocker arms, so that the two adjacent rocker arms do not affect each other. The upper side of the rocker arm is connected to the rocker arm rotating assembly, and the lower side of the rocker arm extends out from the notch of the support to push the accompanying edge.

[0067] The invention discloses an extrusion system for a semiconductor basic material wafer edge. The extrusion system comprises four extrusion mechanisms and two sets of ball screws. The wafer is extruded simultaneously from four directions, with a symmetrical layout, left-right symmetry, and front-back symmetry. The extrusion distance is achieved by driving the ball screws with a stepping motor. The ball screws are left-right rotating screws, which respectively drive the left and right extrusion mechanisms to move left and right, and the front and rear extrusion mechanisms to move back and forth, so as to complete the simultaneous extrusion of the wafer in four directions. Each extrusion mechanism and the edge are in contact with each other using a probe point, so that the edge will not rebound during the return process of the extrusion mechanism, so as to ensure the bonding quality.

[0068] The above has described the preferred embodiments of the present invention in detail. However, the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the scope of knowledge possessed by those of ordinary skill in the art.

[0069] Many other changes and modifications can be made without departing from the concept and scope of the present invention. It should be understood that the present invention is not limited to the specific embodiments, and the scope of the present invention is defined by the appended claims.

Claims

1. An extrusion mechanism for the edge of a semiconductor base material wafer, characterized in that: It includes a bent plate (1), a support (3), a swing rod (6), a probe (10), a probe positioning assembly, a swing rod rotation assembly, and a swing rod rotation angle adjustment assembly. The lower end face of the bent plate (1) is connected to the support (3). The probe positioning assembly is fixedly connected to the lower end face of the horizontal section of the support (3). The swing rod rotation assembly is fixedly connected to the side of the vertical section of the support (3) close to the probe positioning assembly. The swing rod rotation angle adjustment assembly is fixedly connected to the side of the vertical section of the support (3) away from the probe positioning assembly. The probe (10) is installed in the probe positioning assembly, and the swing rod (6) is rotatably installed in the swing rod rotation assembly. Among them, on one side of the probe (10) close to the swing rod (6), and on the other side of the swing rod rotation angle adjustment assembly close to the swing rod (6), the swing rod (6) swings within the space between the probe (10) and the swing rod rotation angle adjustment assembly. The number of the swing rod (6), the probe (10), and the swing rod rotation angle adjustment assembly is the same. One end of the probe (10) abuts against the swing rod (6). When the swing rod (6) is in extrusion contact with the accompanying edge (15), due to the resistance of the accompanying edge (15) to the swing rod (6), the swing rod (6) will rotate backward by a certain angle, and the probe (10) is compressed, so that the accompanying edge (15) is pushed toward the wafer (16) to achieve the purpose of extrusion. When the extrusion mechanism returns, the swing rod (6) does not move directly in the opposite direction, but first returns from the compressed state to the normal state, so as to provide continuous pressure on the accompanying edge (15) to prevent the accompanying edge (15) from rebounding. When the swing rod (6) swings to the position limited by the swing rod rotation angle adjustment assembly, the swing rod (6) separates from the accompanying edge (15) to prevent the accompanying edge (15) from being taken out. The magnitude of the thrust of the accompanying edge (15) is adjusted by the probe positioning assembly or by replacing the probe specifications, and the swing angle of the swing rod (6) is adjusted by the swing rod rotation angle adjustment assembly.

2. The extrusion mechanism for semiconductor base material wafer edge accompanying according to claim 1, characterized in that: The bent plate (1) has a "Z" - shaped structure, and the lower end face of the lower side of the bent plate (1) is fixedly connected to the upper end face of the support (3) through a first screw (8).

3. The extrusion mechanism for the semiconductor base material wafer edge accompanying according to claim 2, characterized in that: The support (3) has a "¬" - shaped structure. The upper end face of the horizontal section of the support (3) is fixedly connected to the lower end face of the lower side of the bent plate (1) through a first screw (8), and the lower end face of the horizontal section of the support (3) is fixedly connected to the probe positioning assembly through a second screw (9).

4. The extrusion mechanism for semiconductor base material wafer edge accompanying according to claim 3, characterized in that: A notch (3 - 1) is formed on the lower side of the vertical section of the support (3), and the number of the notches (3 - 1) is the same as the number of the swing rods (6). A swing rod rotation assembly is fixed on the side of the vertical section of the support (3) close to the probe positioning assembly. The upper side of the swing rod (6) is rotatably installed in the swing rod rotation assembly, and the lower side of the swing rod (6) extends out from the notch (3 - 1).

5. The extrusion mechanism for the bevel of a semiconductor base material wafer according to claim 4, characterized in that: The probe positioning assembly includes a connecting block (2) and a fourth screw (12). The upper end face of the connecting block (2) is fixedly connected to the lower end face of the horizontal section of the support (3) through a second screw (9). A probe hole (2 - 1) is formed on the connecting block (2). The probe (10) is inserted into the probe hole (2 - 1), one end of the probe (10) extends out of the probe hole (2 - 1) to abut against the swing rod (6), and the other end of the probe (10) is fixed through a fourth screw (12).

6. The extrusion mechanism for semiconductor base material wafer edge accompanying according to claim 4, characterized in that: The swing rod rotating assembly includes a connecting shaft (4), a fixed seat (5), a spacer sleeve (7) and a third screw (11). There are two fixed seats (5) and two third screws (11) respectively. The upper sides of the two fixed seats (5) are respectively fixed to one side of the vertical section of the support (3) close to the probe positioning assembly by the two third screws (11). And a through hole is provided on the lower side of the fixed seat (5). The connecting shaft (4) passes through the through holes of the two fixed seats (5) respectively, and the end of the connecting shaft (4) is fixed by a nut. The upper side of the swing rod (6) is inserted on the connecting shaft (4), and the lower side of the swing rod (6) extends out from the notch (3-1). There are several swing rods (6), and a spacer sleeve (7) is arranged between adjacent two swing rods (6).

7. The extrusion mechanism for the semiconductor base material wafer edge accompanying according to claim 6, characterized in that: The swing rod (6) is of an "L" - shaped structure. A circular ring is provided at the top of the vertical section of the swing rod (6), and the circular ring is inserted on the connecting shaft (4). The horizontal section of the swing rod (6) is frustum - shaped, and the size of the horizontal section of the swing rod (6) gradually decreases as it is farther away from the vertical section of the swing rod (6).

8. The extrusion mechanism for the edge accompanying of a semiconductor base material wafer according to claim 4, wherein: The swing rod rotation angle adjustment assembly includes a nut (13) and a fifth screw (14). A screw hole (3-2) is provided at the support (3) above the notch (3-1). The fifth screw (14) passes through the screw hole (3-2) and is fixed by the nut (13). The fifth screw (14) protruding out of the screw hole (3-2) is used to limit the swing angle of the swing rod (6). The position of the screw hole (3-2) corresponds to the swing rod (6), and the number of the screw holes (3-2) is the same as the number of the swing rods (6). The number of the swing rods (6) is 3 to 4.

9. An extrusion system for the edge accompanying of a semiconductor base material wafer, characterized in that: It includes the extrusion mechanism of the semiconductor base material wafer trimming edge according to any one of claims 1 to 8 and two sets of ball screws. The two sets of ball screws are arranged in a cross - shape. The four extrusion mechanisms are divided into two groups. The bent plates (1) of the two extrusion mechanisms in each group are respectively connected to both ends of the ball screw through connectors, and the two extrusion mechanisms in each group are arranged in central symmetry.

10. The extrusion system for the semiconductor base material wafer edge accompanying according to claim 9, characterized in that: The ball screw is a left - hand and right - hand screw. The two sets of ball screws respectively drive the two sets of extrusion mechanisms to move to complete the simultaneous extrusion of the wafer in four directions.

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