Temperature-adjustable adsorption device and wafer transfer equipment

Abstract

The application discloses a temperature-adjustable adsorption device and wafer transfer equipment, and relates to the technical field of Micro-LED wafer mass transfer, the temperature-adjustable adsorption device comprising: an adsorption plate and a temperature control device; the temperature control device comprising a heating tube, a heating body, a temperature sensor and a temperature controller; the upper side of the adsorption plate is provided with an adsorption platform, the lower side of the adsorption plate is provided in close contact with the heating body, the heating tube is embedded in the inside of the heating body, and the temperature controller is connected with the heating tube and the temperature sensor respectively; and the temperature sensor is arranged on the adsorption plate. The temperature of the adsorption plate is adjusted by the temperature controller controlling the heating tube to generate heat, so that the temperature of the adsorption platform on the upper side of the adsorption plate is ensured to be within a proper temperature range, and the adhesive material on the Micro-LED wafer can be kept within a proper temperature range when the Micro-LED wafer is transferred on the adsorption platform.

Description

Technical Field

[0001] This invention relates to the field of Micro-LED wafer mass transfer technology, and in particular to a temperature-adjustable adsorption device and wafer transfer equipment. Background Technology

[0002] Micro-LED technology is a next-generation display technology, and mass transfer technology is the most important part of Micro-LED manufacturing. Micro-LED mass transfer technology is the technique of transferring thousands of Micro-LEDs from a carrier workpiece to a target workpiece. With the further development of LED display technology, the size of LED chips is becoming smaller and smaller; the size of existing MicroLEDs has reached the μm level.

[0003] Currently, during the Micro-LED production process, there is an adhesive material on the Micro-LED wafer. This adhesive material needs to be kept at a certain temperature. In the existing technology, when transferring the Micro-LED wafer, the temperature conditions are not maintained during the transfer process, resulting in insufficient adhesion of the material on the Micro-LED wafer, which prevents the Micro-LED wafer from being firmly attached to the target workpiece. Summary of the Invention

[0004] This invention provides an adjustable temperature adsorption device and a wafer transfer device to solve the problem in the prior art where the material adhesion on the Micro-LED wafer is insufficient due to the lack of a certain temperature condition during the transfer process, thus preventing the Micro-LED wafer from firmly adhering to the target workpiece.

[0005] In a first aspect, the present invention provides an adjustable temperature adsorption device, comprising: an adsorption plate and a temperature control device; the temperature control device includes a heating tube, a heating element, a temperature sensor and a temperature controller; the upper side of the adsorption plate is provided with an adsorption platform, the lower side of the adsorption plate is fitted with the heating element, the heating tube is embedded inside the heating element, and the temperature controller is connected to the heating tube and the temperature sensor respectively; the temperature sensor is located on the adsorption plate.

[0006] Optionally, the temperature-adjustable adsorption device further includes a heat insulation plate; the heat insulation plate is fitted to the lower side of the heating element.

[0007] Optionally, the upper side of the adsorption plate is provided with a groove; the groove is located on one side of the adsorption platform.

[0008] Optionally, the temperature-adjustable adsorption device further includes two alignment holes; the two alignment holes are respectively disposed on both sides of the adsorption plate.

[0009] Optionally, the material of the heat-generating body is ceramic.

[0010] Optionally, the temperature-adjustable adsorption device further comprises a pressure sensor, a pressure switch and a micro connector; the pressure sensor is connected with the micro connector; the pressure switch is connected with the pressure sensor and the micro connector respectively.

[0011] Optionally, one side of the adsorption plate is provided with a filling hole; the temperature sensor is arranged in the filling hole.

[0012] Optionally, the distribution density of the heat-generating pipe is concentrated in the middle side of the inside of the heat-generating body.

[0013] In a second aspect, the application further provides a wafer transfer device comprising the temperature-adjustable adsorption device of the first aspect.

[0014] Optionally, the wafer transfer device further comprises a rotary motor and a rotary motor upper mounting plate; the temperature-adjustable adsorption device is arranged on the rotary motor upper mounting plate; the rotary motor upper mounting plate is connected with the rotary motor.

[0015] Compared with the prior art, the above technical solution provided in the embodiments of the application has the following advantages:

[0016] In the embodiments of the application, the temperature-adjustable adsorption device is used to adhere the heat-generating body in the temperature control device to the lower side of the adsorption plate, so as to heat the adsorption plate by the heat-generating body; the temperature sensor is arranged on the adsorption plate, and the temperature sensor is connected with the temperature controller, so as to monitor the temperature of the adsorption plate in real time by the temperature controller, and then control the heat-generating pipe to generate heat by the temperature controller to adjust the temperature of the adsorption plate, so as to ensure that the temperature of the adsorption platform on the upper side of the adsorption plate is in a suitable temperature range, so that the adhesive material on the Micro-LED wafer can be kept in a suitable temperature range during the transfer process of the Micro-LED wafer on the adsorption platform, thereby enabling the Micro-LED wafer to be firmly adhered to the target workpiece after being transferred. BRIEF DESCRIPTION OF DRAWINGS

[0017] The drawings incorporated into the specification and forming a part thereof, illustrate embodiments consistent with the application and, together with the description, serve to explain the principles of the application.

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced as follows. Obviously, for those skilled in the art, other drawings can also be obtained from these drawings without any creative labor.

[0019] Figure 1 is a structural schematic diagram of an adjustable temperature adsorption device according to an embodiment of the present application;

[0020] Figure 2 is a structural schematic diagram of a wafer transfer device according to an embodiment of the present application;

[0021] Figure 3 is a structural schematic diagram of a wafer transfer device according to an embodiment of the present application;

[0022] Figure 4 is a structural schematic diagram of a wafer transfer device according to an embodiment of the present application.

[0023] Reference numerals

[0024] 1, adsorption plate; 2, heating tube; 3, heating body; 4, temperature sensor; 5, temperature controller; 6, adsorption platform; 7, heat insulation plate; 8, groove; 9, alignment hole; 10, pressure sensor; 11, pressure switch; 12, micro connector; 13, landfill hole; 14, rotary motor; 15, upper mounting plate of rotary motor. DETAILED DESCRIPTION

[0025] In order to make the objectives, technical solutions and advantages of the present application clearer, further detailed description will be made to the present application in combination with the accompanying drawings and specific embodiments.

[0026] The technical solutions in the embodiments will be described clearly and completely in combination with the accompanying drawings of the embodiments of the present application. Obviously, the embodiments to be described are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without any creative work fall within the protection scope of the present application.

[0027] It should be understood that the terms “comprising” and “including” as used in the specification and the appended claims indicate the presence of the described features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0028] It should also be understood that the terms used in the specification of the embodiments of the present application are only for the purpose of describing specific embodiments and are not intended to limit the embodiments of the present application. As used in the specification and the appended claims of the embodiments of the present application, the singular forms “a”, “an” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0029] As shown in Figure 1 the first aspect, the present application provides a temperature-adjustable adsorption device, comprising: an adsorption plate 1 and a temperature control device; the temperature control device comprises a heating tube 2, a heating body 3, a temperature sensor 4 and a temperature controller 5; the upper side of the adsorption plate 1 is provided with an adsorption platform 6, the lower side of the adsorption plate 1 is provided with the heating body 3, the heating tube 2 is embedded in the inside of the heating body 3, and the temperature controller 5 is connected with the heating tube 2 and the temperature sensor 4 respectively; the temperature sensor 4 is arranged on the adsorption plate 1.

[0030] Specifically, the temperature-adjustable adsorption device combines the heating body 3 in the temperature control device with the lower side of the adsorption plate 1, so as to heat the adsorption plate 1 through the heating body 3; by arranging the temperature sensor 4 on the adsorption plate 1 and connecting the temperature sensor 4 with the temperature controller 5, the temperature of the adsorption plate 1 is monitored in real time through the temperature controller 5, and the temperature of the adsorption plate 1 is adjusted by controlling the heating tube 2 to heat through the temperature controller 5, so as to ensure that the temperature of the adsorption platform 6 on the upper side of the adsorption plate 1 is within a suitable temperature range, so that the adhesive material on the Micro-LED wafer can be kept within a suitable temperature range during the transfer process of the Micro-LED wafer on the adsorption platform 6, thereby enabling the Micro-LED wafer to be firmly adhered to the target workpiece after transfer.

[0031] Further, as shown in Figures 1-4 the temperature-adjustable adsorption device further comprises a heat insulation plate 7; the heat insulation plate 7 is provided with the lower side of the heating body 3.

[0032] Specifically, the heat insulation plate 7 is used to isolate the heating body 3 from the object below the heating body 3, so as to ensure that the heat of the heating body 3 will not be transferred to the object below the heating body 3, but only to the adsorption plate 1.

[0033] Further, as shown in Figures 1-4 the upper side of the adsorption plate 1 is provided with a groove 8; the groove 8 is located on one side of the adsorption platform 6.

[0034] Specifically, the groove 8 is used to take or place the Micro-LED wafer, for example, when the Micro-LED wafer is placed on the adsorption platform 6, it is difficult to find a gripping point to grip due to the contact between the Micro-LED wafer and the adsorption platform 6, but when the Micro-LED wafer is placed on the adsorption platform 6 and covers one side of the groove 8, the Micro-LED wafer can be easily gripped through the groove 8.

[0035] Further, asFigures 1-4 As shown, the temperature-adjustable adsorption device further comprises two pairs of alignment holes 9; two of the alignment holes 9 are respectively arranged on the two sides of the adsorption plate 1.

[0036] Specifically, the two alignment holes 9 are used for the alignment system below the adsorption platform 6 to take pictures.

[0037] Further, as shown in the figure, Figures 1-4 The material of the heating body 3 is ceramic.

[0038] Specifically, the material of the heating body 3 is ceramic, which has good thermal conductivity and small thermal expansion, and is conducive to keeping the adhesive material on the Micro-LED wafer within a suitable temperature range during the transfer process, so that the adhesive material is in the best state and the Micro-LED wafer can be firmly adhered to the target workpiece after transfer.

[0039] Further, as shown in the figure, Figures 1-4 The temperature-adjustable adsorption device further comprises a pressure sensor 10, a pressure switch 11 and a micro connector 12; the pressure sensor 10 is connected with the micro connector 12; the pressure switch 11 is respectively connected with the pressure sensor 10 and the micro connector 12.

[0040] Specifically, the micro connector 12 is connected with an air pipe, which is connected with the adsorption holes on the adsorption platform 6, so as to transmit vacuum to the entire adsorption platform 6 through the adsorption holes, which is conducive to adsorbing the product and preventing the product from falling off. The pressure sensor 10 is used to monitor the vacuum air pressure in the micro connector 12 and transmit the vacuum air pressure value to the pressure switch 11; the pressure switch 11 is used to adjust the size value of the vacuum air pressure in the micro connector 12, so that the adsorption pressure on the adsorption platform 6 is a suitable pressure value.

[0041] Further, as shown in the figure, Figures 1-4 One side of the adsorption plate 1 is provided with a filling hole 13; the temperature sensor 4 is arranged in the filling hole 13.

[0042] Specifically, the filling hole 13 is used to place the temperature sensor 4 so that the temperature sensor 4 monitors the temperature value of the adsorption plate 1.

[0043] Further, as shown in the figure, Figures 1-4 The distribution density of the heating pipe 2 is concentrated in the middle side of the inside of the heating body 3.

[0044] Specifically, during the transfer process of the Micro-LED wafer, the Micro-LED wafer is adsorbed onto the adsorption holes on the adsorption platform 6. At this time, the Micro-LED wafer is located directly below the middle side of the heating element 3. Therefore, by concentrating the distribution density of the heating tubes 2 on the inner middle side of the heating element 3, heat can be quickly transferred to the Micro-LED wafer above it.

[0045] In a second aspect, the present invention also provides a wafer transfer apparatus, including the temperature-adjustable adsorption device described in the first aspect above.

[0046] Specifically, the wafer transfer equipment includes power sources such as linear motors in the X and Y directions, linear motor actuators, precision lifting platforms, and servo motors, and also includes the temperature-adjustable adsorption device described in the first aspect above.

[0047] Furthermore, such as Figures 1-4 As shown, the wafer transfer equipment also includes a rotary motor 14 and a rotary motor upper mounting plate 15; the temperature-adjustable adsorption device is disposed on the rotary motor upper mounting plate 15; the rotary motor upper mounting plate 15 is connected to the rotary motor 14.

[0048] Specifically, the rotary motor 14 is used to enable the temperature-adjustable adsorption device to rotate; the upper mounting plate 15 of the rotary motor is used to support the temperature-adjustable adsorption device. When the rotary motor 14 rotates, it drives the upper mounting plate 15 of the rotary motor, thereby driving the temperature-adjustable adsorption device to move.

[0049] It should be noted that, in the description of this invention, the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "direction away from the rail side," and "direction towards the rail side," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0050] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0051] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0052] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0053] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. The illustrative expressions of the above terms in this specification should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0054] The above description is merely a specific embodiment of the present invention, enabling those skilled in the art to understand or implement the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features of the invention herein.

Claims

1. A temperature-regulatable adsorption device, characterized by The adjustable temperature adsorption device comprises an adsorption plate and a temperature control device; the temperature control device comprises a heating tube, a heating body, a temperature sensor and a temperature controller; an adsorption platform is arranged on the upper side of the adsorption plate; the lower side of the adsorption plate is arranged in close contact with the heating body; the heating tube is embedded in the inside of the heating body; the distribution density of the heating tube is concentrated in the middle side of the inside of the heating body; the temperature controller is connected with the heating tube and the temperature sensor respectively; the temperature sensor is arranged on the adsorption plate; the adjustable temperature adsorption device is used to keep the adhesive material on the Micro-LED wafer in a suitable temperature range during the transfer process of the Micro-LED wafer on the adsorption platform, so that the Micro-LED wafer can be firmly adhered to the target workpiece after being transferred. The adjustable temperature adsorption device further comprises a heat insulation plate; the heat insulation plate is arranged in close contact with the lower side of the heating body.

2. The temperature-adjustable adsorption apparatus according to claim 1, wherein The upper side of the adsorption plate is provided with a groove; the groove is located on one side of the adsorption platform.

3. The temperature swing adsorption apparatus of claim 1, wherein, The adjustable temperature adsorption device further comprises two alignment holes; the two alignment holes are arranged on the two sides of the adsorption plate respectively.

4. The temperature swing adsorption apparatus of claim 1, wherein, The material of the heating body is ceramic.

5. The temperature swing adsorption apparatus of claim 1, wherein, The adjustable temperature adsorption device further comprises a pressure sensor, a pressure switch and a micro connector; the pressure sensor is connected with the micro connector; the pressure switch is connected with the pressure sensor and the micro connector respectively.

6. The temperature swing adsorption apparatus of claim 1, wherein, One side of the adsorption plate is provided with a landfill hole; the temperature sensor is arranged in the landfill hole.

7. The temperature swing adsorption apparatus of claim 1, wherein, The adjustable temperature adsorption device comprises the adjustable temperature adsorption device of any one of claims 1-7.

8. A wafer transfer apparatus, characterized by, The wafer transfer equipment further comprises a rotary motor and a rotary motor upper mounting plate; the adjustable temperature adsorption device is arranged on the rotary motor upper mounting plate; the rotary motor upper mounting plate is connected with the rotary motor.

9. The wafer transfer apparatus of claim 8, wherein, ​

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