Ejector device and calibration method thereof

Abstract

The present invention provides a pin device and a calibration method thereof, wherein the pin device comprises at least three pin assemblies, a detection unit, a control unit, and a plurality of drive units. The plurality of drive units are used to drive the pin assemblies to rise and fall in a one-to-one correspondence; the detection unit is used to detect the height of the top of each pin assembly; the control unit is used to control the drive unit to drive the pin assembly to rise from an initial position to a sheet placement position during calibration; based on the actual height of the top of each pin assembly detected by the detection unit, the difference between the actual height of the top of each pin assembly and a preset height is calculated, and it is determined whether any of the differences corresponding to all the pin assemblies is non-zero; if so, based on the non-zero difference, the drive unit corresponding to the difference is controlled to drive the pin assembly to rise and fall, so that the difference between the height of the top of the pin assembly when it is in the sheet placement position and the preset height is zero, thereby enabling all the pin assemblies to reach the preset height.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing, and in particular to a thimble device and a calibration method thereof. Background Art

[0002] Before the semiconductor process chamber begins, the ejector pins in the susceptor are usually controlled to rise, and then the wafer is placed on top of the ejector pins using a wafer gripper. Finally, as the ejector pins descend to a position no higher than the susceptor's support surface, the wafer lands in the center of the susceptor's support surface. After the process is completed, the ejector pins rise to lift the wafer, and then the wafer gripper removes the wafer from the process chamber.

[0003] In actual production, semiconductor manufacturing processes usually use higher process temperatures, and a large amount of heat is generated during the process. When the ejector pins are used for a long time, they will wear, bend, deform, or even break to varying degrees, causing the ejector pins to not be able to maintain the same level. Figure 1 As shown, the existing ejector device includes a plurality of ejectors 01 arranged in a base 02 and a driving device 03 arranged below the base 02, wherein the driving device 03 is used to drive the plurality of ejectors to rise and fall synchronously. Figure 2 As shown, in an ideal state, the wafer 04 should fall on the center area of ​​the base 02, so as to facilitate the subsequent process. Figure 3 As shown in FIG, when a pin 01 in the ejector device is worn or bent, its length will be shortened, which will cause the plane formed by the ends of all the ejector pins 01 to tilt, thereby causing the wafer supported on the top of the ejector device to slip during the falling process of the ejector device. When the ejector device falls to a position not higher than the supporting surface of the base, the wafer will not fall on the central area of ​​the supporting surface of the base, but will fall on the following position: Figure 4 In the eccentric area shown, this leads to uneven process results and even damage to the wafer or susceptor. Summary of the Invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art and proposes a pin device and a calibration method for a semiconductor process equipment, which can drive the pin assemblies separately so that when one or several pin assemblies are worn or bent, all the pin assemblies can reach a preset height, thereby allowing the top ends of the pin assemblies to form a horizontal support surface.

[0005] To achieve the purpose of the present invention, a pin device in a semiconductor process equipment is provided, which includes at least three pin assemblies, a detection unit, a control unit and a plurality of drive units; wherein,

[0006] The number of the driving units is the same as the number of the ejector assemblies, and each driving unit is used to drive each ejector assembly to rise and fall in a one-to-one correspondence;

[0007] The detection unit is used to detect the height of the top end of each ejector assembly;

[0008] The control unit is used to control the driving unit to drive the ejector assembly to rise from an initial position to a sheet pick-up and placement position during the calibration process; calculate the difference between the actual height of the top end of each ejector assembly and a preset height based on the actual height of the top end of each ejector assembly detected by the detection unit, and determine whether any of the differences corresponding to all the ejector assemblies is non-zero; if so, control the driving unit corresponding to the difference to drive the ejector assembly to rise and fall based on the non-zero difference, so that the difference between the height of the top end of the ejector assembly when it is located at the sheet pick-up and placement position and the preset height is zero.

[0009] Optionally, the control unit is further configured to:

[0010] When a difference among the differences corresponding to all the ejector assemblies is not zero, controlling all the driving units to drive all the ejector assemblies to descend to their respective initial positions;

[0011] According to the difference that is not zero, controlling the driving unit corresponding to the difference to drive the ejector assembly to move up and down, so as to adjust the ejector assembly from the original initial position to a new initial position;

[0012] All the driving units are controlled to drive all the ejector assemblies to rise from their respective current initial positions to the wafer placement position at the same speed.

[0013] Optionally, the control unit is further configured to:

[0014] When a difference among the differences corresponding to all the ejector assemblies is not zero, it is determined whether the non-zero difference is greater than a preset threshold value. If not, the driving unit corresponding to the difference is controlled to drive the ejector assembly to move up and down; if so, an alarm is issued to prompt the replacement of the ejector assembly corresponding to the difference.

[0015] Optionally, the driving unit includes a lifting device and a signal conversion device; wherein,

[0016] The lifting device is connected to the ejector assembly and is used to drive the ejector assembly to rise and fall;

[0017] The signal conversion device is used to receive the control signal sent by the control unit, and output an electrical signal to the lifting device according to the control signal to control the moving speed and moving duration of the lifting device.

[0018] Optionally, the lifting device includes a telescopic assembly and a servo motor; the servo motor and the telescopic assembly are mechanically connected via a transmission belt, and the servo motor is used to drive the telescopic assembly to extend and retract;

[0019] The signal conversion device includes a servo driver, which is used to receive the control signal sent by the control unit and output the electrical signal to the servo motor according to the control signal to control the servo motor to drive the telescopic assembly to extend and retract.

[0020] Optionally, each ejector pin assembly includes an ejector pin, a guide structure and a sealing structure; wherein,

[0021] One end of the ejector pin is used to support the wafer, and the other end of the ejector pin is connected to the driving unit;

[0022] The guide structure is arranged around the ejector pin and is perpendicular to the wafer surface, and the guide structure is used to limit the movement direction of the ejector pin to a direction perpendicular to the wafer surface;

[0023] The sealing structure is arranged around the guide structure and the ejector pin, and is used to seal the guide structure and a portion of the ejector pin.

[0024] Optionally, the detection unit includes a plurality of distance measuring sensors, the number of the distance measuring sensors is the same as the number of the ejector assemblies, the plurality of distance measuring sensors are arranged in a one-to-one correspondence with the ejector assemblies, and are all located above the corresponding ejector assemblies; the distance measuring sensors are used to respectively detect the distance from themselves to the top of the corresponding ejector assembly.

[0025] Optionally, the control unit is also used to control all the driving units to drive all the ejector assemblies to rise from the initial position to the wafer pick-up and placement position at the same speed during the wafer transfer process, and to control all the driving units to drive all the ejector assemblies to descend from the wafer pick-up and placement position to the initial position at the same speed after the wafer is placed on the ejector assemblies or after the wafer is detached from the ejector.

[0026] As another technical solution, the present invention further provides a calibration method for an ejector device, which is applied to the ejector device described in any one of the above embodiments; the method is characterized by comprising:

[0027] Drive all ejector assemblies to rise to the position for picking up and placing the sheet, and detect the height of the top of each ejector assembly;

[0028] Calculate the difference between the actual height of the top end of each ejector assembly when it is located at the pick-up and place position and the preset height, and determine whether any of the differences corresponding to all the ejector assemblies is non-zero; if so, control the driving unit corresponding to the difference to drive the ejector assembly to move up and down based on the non-zero difference, so that the difference between the height of the top end of the ejector assembly when it is located at the pick-up and place position and the preset height is zero.

[0029] Optionally, the step of controlling the driving unit corresponding to the difference to drive the ejector assembly to move upward and downward according to the difference that is not zero in the calibration method includes:

[0030] Driving all the ejector assemblies to descend to their respective initial positions;

[0031] According to the difference value that is not zero, driving the ejector assembly corresponding to the difference value from the original initial position to a new initial position;

[0032] All the ejector assemblies are driven to rise from their respective current initial positions to the sheet picking and placing positions at the same speed.

[0033] The present invention has the following beneficial effects:

[0034] The ejector device provided by the present invention includes multiple ejector assemblies and driving units corresponding to the multiple ejector assemblies one by one, so that the multiple ejector assemblies can be driven separately; the ejector device also includes a detection unit and a control unit, wherein, during a calibration process, the control unit is used to calculate the difference between the actual height of the worn or bent ejector assembly and a preset height, and perform height compensation for the lifting and lowering of the ejector assembly according to the height difference, so that all the ejector assemblies can reach the preset height, so that the top ends of all the ejector assemblies can form a horizontal supporting surface, thereby preventing the wafer supported by the top ends of the ejector assemblies from slipping, ensuring that the wafer can fall into the central area of ​​the supporting surface of the base, thereby ensuring the process effect.

[0035] The present invention provides a method for calibrating an ejector device, which is applied to the aforementioned ejector device. The method detects and calculates the difference between the actual height of all ejector assemblies at the sheet transfer position and the preset height, and compensates the lifting path of the ejector assemblies based on the difference, thereby ensuring that the top ends of all ejector assemblies can reach the preset height. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 It is a simplified structural diagram of the existing base and ejector device;

[0037] Figure 2 This is a top view of a susceptor with a wafer placed in an ideal state;

[0038] Figure 3 This is a side view of the ejector device when the ejector pin is worn;

[0039] Figure 4 A top view of the susceptor when the wafer slips;

[0040] Figure 5 A simplified structural diagram of the ejector device and the base using the ejector device provided in Example 1;

[0041] Figure 6 A schematic structural diagram of the ejector pin assembly provided in Example 1;

[0042] Figure 7 This is a flow chart of the calibration method for the ejector device provided in Example 2. DETAILED DESCRIPTION

[0043] In order to enable those skilled in the art to better understand the technical solution of the present invention, the ejector device and the calibration method thereof provided by the present invention are described in detail below with reference to the accompanying drawings.

[0044] Example 1

[0045] In order to solve the above technical problems, this embodiment provides a pin device, which is used in semiconductor process equipment and is used to cooperate with a wafer gripping device to pick up and place wafers. Figure 5 As shown, the ejector device includes at least three liftable ejector assemblies 1. Specifically, when all the ejector assemblies 1 rise to the wafer placement position, the wafer gripping device places the wafer on the top of all the ejector assemblies 1, or the wafer gripping device takes away the wafer placed on the top of all the ejector assemblies 1; when all the ejector assemblies 1 descend to the initial position, the top of all the ejector assemblies 1 will be lower than the supporting surface of the base 4, so that the wafer can fall on the supporting surface of the base 4.

[0046] like Figure 5 As shown, the ejector device in this embodiment further includes a detection unit 2, a control unit (not shown), and multiple drive units 3. The number of drive units 3 is the same as the number of ejector assemblies 1, and each drive unit 3 is used to drive each ejector assembly 1 up and down in a one-to-one correspondence. The detection unit 2 is used to detect the height of the top of each ejector assembly 1 and send the actual height value to the control unit.

[0047] During the calibration process, the control unit is used to first control the driving unit 3 to drive the ejector assembly 1 to rise from the initial position to the pick-up and placement position; then, based on the actual height of the top of each ejector assembly 1 detected by the detection unit 2, calculate the difference between the actual height of the top of each ejector assembly 1 and the preset height, and determine whether any of the differences corresponding to all the ejector assemblies 1 is non-zero, so as to determine whether one or several ejector assemblies 1 have become shorter due to wear or bending and are unable to reach the preset height.

[0048] If the judgment result of the control unit is yes, then according to the non-zero difference, the driving unit 3 corresponding to the difference is controlled to drive the corresponding ejector assembly 1 to rise and fall, so that the difference between the height of the top end of the ejector assembly 1 when it is located at the wafer picking and placing position and the preset height is zero, so that the top end of each ejector assembly 1 can reach the preset height when it is located at the wafer picking and placing position, so that the top ends of all ejector assemblies 1 can form a horizontal plane, avoiding the wafer supported by the top end of the ejector assembly 1 from slipping, and ensuring that the wafer can fall in the central area of ​​the supporting surface of the base, so as to ensure the process effect.

[0049] If the control unit determines that the top end of each ejector pin assembly 1 can reach the preset height when located at the sheet placement position, the calibration process can be terminated.

[0050] In some embodiments, the control unit is further used to control all the drive units 3 to drive all the ejector assemblies 1 to rise from the initial position to the wafer pick-up and placement position at the same speed during the wafer transfer process, and to control all the drive units 3 to drive all the ejector assemblies 1 to descend from the wafer pick-up and placement position to the initial position at the same speed after the wafer is placed on the ejector assembly 1 or after the wafer is detached from the ejector. After the ejector assembly 1 is raised and lowered multiple times, the probability of wear and bending of the ejector assembly 1 increases. Therefore, the above-mentioned calibration process can be performed once after the wafer transfer process has been performed a preset number of times, so that the actual height of the ejector assembly 1 when it is at the wafer pick-up and placement position can be compensated in time. Specifically, the above-mentioned preset number of times can be, for example, 1000 times.

[0051] When a difference among the differences corresponding to all ejector assemblies 1 is non-zero, it indicates that the ejector assembly 1 corresponding to the non-zero difference has been worn or bent, or that an error has occurred in the corresponding drive unit 3. In this regard, in some embodiments, the control unit is further configured to: when a difference among the differences corresponding to all ejector assemblies 1 is non-zero, first control all drive units 3 to drive all ejector assemblies 1 to descend to their respective initial positions; then, based on the non-zero difference, control the drive unit 3 corresponding to the difference to drive the ejector assembly 1 up and down, so as to adjust the ejector assembly 1 from the original initial position to the new initial position, that is, to raise or lower the starting point of the lifting path of the ejector assembly 1, and the height change of the starting point is equal to the above-mentioned difference; and finally, control all drive units 3 to drive all ejector assemblies 1 to rise from their respective current initial positions to the wafer placement position at the same speed. In this way, although the actual lifting distances of the top ends of different ejector assemblies 1 are different, since the control unit adjusts the height of the initial position according to the corresponding difference, the top end of each ejector assembly 1 can reach the preset height when it is located at the pick-up and placement position in the subsequent lifting, and the lifting distance of the worn ejector assembly 1 can be shortened each time, thereby reducing the energy consumption and time consumption during the lifting process.

[0052] Moreover, all the driving units 3 drive all the ejector assemblies to rise or fall synchronously at the same speed, so as to prevent the plane formed by the top of all the ejector assemblies 1 from being unable to remain horizontal during the movement of the supporting wafer descending or rising, thereby ensuring that the wafer placed on the top of the ejector assembly 1 will not slide due to the tilt of the plane formed by the top of the ejector assembly 1, thereby ensuring that the wafer can fall into the center area of ​​the base 4 and can rise to a position where it can be aligned with the wafer gripping device.

[0053] As described above, after ejector assembly 1 descends to its initial position, it will be lower than the surface of base 4, and a wafer placed on top of ejector assembly 1 will fall onto the surface of base 4. Therefore, drive unit 3 should be positioned below base 4. Furthermore, due to the limitations of the chamber structure and the position of base 4, drive unit 3 cannot rise too high. However, if ejector assembly 1 is significantly reduced in length due to wear or severe bending, the aforementioned difference may be too large, potentially exceeding the rising range of drive unit 3, causing ejector assembly 1 to fail to reach the preset height. To avoid this, in some embodiments, the control unit is configured to, when a non-zero difference among all the corresponding differences of ejector assemblies 1 is greater than a preset threshold, control the drive unit 3 corresponding to the difference to drive the ejector assembly 1 upward or downward. If so, an alarm is issued prompting the operator to replace the ejector assembly corresponding to the difference, prompting the operator to promptly replace the severely worn ejector assembly.

[0054] In some embodiments, the driving unit 3 includes a lifting device and a signal conversion device; wherein the lifting device is connected to the ejector assembly 1 and is used to drive the ejector assembly 1 to rise and fall. The signal conversion device is used to receive a control signal sent by the control unit and output a corresponding electrical signal to the lifting device according to the control signal, so as to control the position of the lifting device by controlling the moving speed and moving time of the lifting device. Preferably, as Figure 5 As shown, in some embodiments, the lifting device includes a telescopic assembly 31 and a servo motor 32. The servo motor 32 and the telescopic assembly 31 are mechanically connected via a transmission belt. The servo motor 32 is used to drive the telescopic assembly 31 to extend and retract. Specifically, the telescopic assembly 31 can be, for example, an electric cylinder. Accordingly, the signal conversion device also includes a servo driver 33. The servo driver 33 is used to receive a control signal sent by the control unit and output an electrical signal to the servo motor 32 based on the control signal, thereby controlling the servo motor 32 to drive the telescopic assembly 31 to extend and retract.

[0055] In some embodiments, as Figure 6As shown, each ejector pin assembly 1 includes an ejector pin 11, a guide structure 12, and a sealing structure (not shown). One end of ejector pin 11 is used to support the wafer, and the other end of ejector pin 11 is connected to drive unit 3. Guide structure 12 is arranged around ejector pin 11 and perpendicular to the wafer surface, and is used to limit the movement direction of ejector pin 11 to a direction perpendicular to the wafer surface. The sealing structure is arranged around guide structure 12 and ejector pin 11 and is used to seal the guide structure 12 and ejector pin 11 to partially isolate the guide structure 12 and ejector pin 11 from the process environment, thereby preventing corrosion of both.

[0056] In some embodiments, the sealing structure includes a bellows and a sealing ring. The sealing ring is positioned around the outer periphery of the guide structure 12 or the outer periphery of the ejector pin 11, located at both ends of the bellows. The bellows has a telescopic function. Specifically, when the drive unit drives the ejector pin 11 upward, the bellows is compressed; when the drive unit drives the ejector pin 11 downward, the bellows is stretched or returns to its original state. This dynamically seals the ejector pin 11 and the guide structure 12 during the ascending and descending process, isolating portions of the guide structure 12 and ejector pin 11 from the process environment.

[0057] In some embodiments, the detection unit 2 includes a plurality of distance measuring sensors 21. The number of distance measuring sensors 21 is the same as the number of ejector assemblies 1. The plurality of distance measuring sensors 21 are provided in a one-to-one correspondence with the ejector assemblies 1 and are all located above the corresponding ejector assemblies 1. The distance measuring sensors 21 are used to respectively detect the distance from themselves to the top of the corresponding ejector assembly 1. It is easy to understand that the actual height of the top of the ejector assembly detected by the detection unit 2 is equal to: the difference between the distance from the distance measuring sensor 21 to the base 4 and the distance from the distance measuring sensor 21 to the top of the ejector assembly 1.

[0058] Based on the above-mentioned arrangement of the distance sensor 21, this embodiment further provides a method for converting the height of the top of the ejector assembly. The preset height of the top of the ejector assembly is H1, the distance from the distance sensor 21 to the base support surface is H2, the distance from the distance sensor 21 to the top of the ejector assembly is H3, and the distance from the top of the ejector assembly to the base support surface when the ejector assembly is in the sheet transfer position, i.e., the actual height of the top of the ejector assembly, is H4. From this, H4 = H2 - H3 can be calculated. The distance from the top of the ejector assembly to the base support surface when the ejector assembly is in the initial position is H5. The preset stroke of the ejector assembly is S. From this, S = H1 - H5 can be inferred. During the calibration process, the control unit is configured to calculate the difference ΔH = H1 - H4 between the actual height of the top of the ejector assembly when it is in the sheet transfer position and the preset height. If ΔH is not zero, the height H5 of the ejector assembly at the initial position is adjusted to H5 + ΔH, so that all ejector assemblies rise again by the preset stroke S and reach the preset height H1 when they reach the sheet transfer position. Specifically, the data of the preset height H1, preset stroke S and initial position height H5 can be pre-stored in the control unit, and the actual height H4 of the top of the ejector assembly can be converted by either the detection unit or the control unit.

[0059] The ejector device provided in this embodiment includes multiple ejector assemblies and driving units corresponding to the multiple ejector assemblies one-to-one, so that the multiple ejector assemblies can be driven separately; the ejector device also includes a detection unit and a control unit, wherein, during a calibration process, the control unit is used to calculate the difference between the actual height of the worn or bent ejector assembly and a preset height, and perform height compensation for the lifting and lowering of the ejector assembly according to the height difference, so that all the ejector assemblies can reach the preset height, so that the top ends of all the ejector assemblies can form a horizontal supporting surface, thereby preventing the wafer supported by the top ends of the ejector assemblies from slipping, ensuring that the wafer can fall in the central area of ​​the supporting surface of the base, thereby ensuring the process effect.

[0060] Example 2

[0061] Based on the ejector device proposed in Example 1, this embodiment also provides a method for calibrating the ejector height, such as Figure 7 As shown, the specific steps include:

[0062] Step S1: driving all ejector assemblies to rise to the pick-up and placement position, and detecting the height of the top of each ejector assembly;

[0063] Step S2: Calculate the difference between the actual height of the top of each ejector assembly when it is located at the sheet placement position and the preset height, and determine whether any of the differences corresponding to all ejector assemblies is non-zero;

[0064] If yes, then according to the non-zero difference, the driving unit corresponding to the difference is controlled to drive the ejector assembly to move up and down, so that the height difference between the top of the ejector assembly at the position of taking and placing the sheet and the preset height is zero.

[0065] In some embodiments, when one of the differences corresponding to all ejector assemblies is not zero, in step S2, the step of controlling the driving unit corresponding to the difference to drive the ejector assembly to move upward and downward specifically includes:

[0066] Step S21: driving all ejector assemblies to descend to their respective initial positions;

[0067] Step S22: according to the difference that is not zero, driving the ejector assembly corresponding to the difference from the original initial position to a new initial position;

[0068] Step S23: driving all ejector pin assemblies to rise from their respective current initial positions to the wafer placement position at the same speed.

[0069] The calibration method of the ejector device provided in this embodiment, which is applied to Example 1, detects and calculates the difference between the actual height and the preset height of all ejector assemblies when the sheet is transferred and retrieved, and compensates the lifting path of the ejector assemblies based on the difference, so that the top ends of all ejector assemblies can reach the preset height.

[0070] Example 3

[0071] Based on the ejector device provided in Example 1 and the calibration method provided in Example 2, this embodiment provides an actual control process of the ejector device:

[0072] Step S01: controlling the ejector pin assembly to rise to a wafer placement position so that the wafer gripping device places the wafer on the top of the ejector pin; controlling the ejector pin assembly to descend to an initial position so that the wafer falls on the surface of the base;

[0073] Step S02: Control the ejector assembly to rise to a wafer placement position to lift the wafer for the wafer gripping device to remove the wafer; control the ejector assembly to descend to the initial position;

[0074] Loop through steps S01 and S02;

[0075] Step S03: Determine whether the number of cycles of steps S01 and S02 has reached 1000; if not, proceed to step S01; if so, proceed to step S04;

[0076] Step S04: controlling all ejector pin assemblies to rise to a sheet placement position, and detecting the actual height of the top end of each ejector pin assembly;

[0077] Step S05: Calculate the difference ΔH between the actual height of the top end of each ejector assembly when it is located at the sheet placement position and the preset height, and determine whether ΔH is greater than 0; if so, proceed to step S06; if not, terminate the control process;

[0078] Step S06: Determine whether ΔH is less than 2 mm. If so, proceed to step S07; if not, issue an alarm and control all ejector pin assemblies to return to their initial positions.

[0079] Step S07: Control the original initial position of the ejector assembly to rise by ΔH to obtain a new initial position, and return to step S01.

[0080] It will be understood that the above embodiments are merely exemplary embodiments for illustrating the principles of the present invention, and the present invention is not limited thereto. Those skilled in the art will appreciate that various modifications and improvements can be made without departing from the spirit and substance of the present invention, and such modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A ejector pin device in a semiconductor process equipment, characterized in that: It includes at least three ejector pin assemblies, a detection unit, a control unit and a plurality of drive units; wherein, The number of the driving units is the same as the number of the ejector assemblies, and each driving unit is used to drive each ejector assembly to rise and fall in a one-to-one correspondence; The detection unit is used to detect the height of the top end of each ejector assembly; The control unit is configured to control the driving unit to drive the ejector assembly to rise from an initial position to a sheet placement position during a calibration process; calculate, based on the actual height of the top end of each ejector assembly detected by the detection unit, a difference between the actual height of the top end of each ejector assembly and a preset height, and determine whether any of the differences corresponding to all the ejector assemblies is non-zero; if so, control, based on the non-zero difference, the driving unit corresponding to the difference to drive the ejector assembly to rise and fall, so that the difference between the height of the top end of the ejector assembly when located at the sheet placement position and the preset height is zero; The control unit is further configured to: when a difference among the differences corresponding to all the ejector assemblies is not zero, control all the driving units to drive all the ejector assemblies to descend to their respective initial positions; According to the difference that is not zero, controlling the driving unit corresponding to the difference to drive the ejector assembly to move up and down, so as to adjust the ejector assembly from the original initial position to a new initial position; All the driving units are controlled to drive all the ejector assemblies to rise from their respective current initial positions to the wafer placement position at the same speed.

2. The ejector device according to claim 1, characterized in that: The control unit is further configured to: When a difference among the differences corresponding to all the ejector assemblies is not zero, it is determined whether the non-zero difference is greater than a preset threshold value. If not, the driving unit corresponding to the difference is controlled to drive the ejector assembly to move up and down; if so, an alarm is issued to prompt the replacement of the ejector assembly corresponding to the difference.

3. The ejector device according to claim 1, characterized in that: The driving unit includes a lifting device and a signal conversion device; wherein, The lifting device is connected to the ejector assembly and is used to drive the ejector assembly to rise and fall; The signal conversion device is used to receive the control signal sent by the control unit, and output an electrical signal to the lifting device according to the control signal to control the moving speed and moving duration of the lifting device.

4. The ejector device according to claim 3, characterized in that: The lifting device includes a telescopic assembly and a servo motor; the servo motor and the telescopic assembly are mechanically connected via a transmission belt, and the servo motor is used to drive the telescopic assembly to extend and retract; The signal conversion device includes a servo driver, which is used to receive the control signal sent by the control unit and output the electrical signal to the servo motor according to the control signal to control the servo motor to drive the telescopic assembly to extend and retract.

5. The ejector device according to claim 1, characterized in that: Each ejector pin assembly comprises an ejector pin, a guide structure and a sealing structure; wherein, One end of the ejector pin is used to support the wafer, and the other end of the ejector pin is connected to the driving unit; The guide structure is arranged around the ejector pin and is perpendicular to the wafer surface, and the guide structure is used to limit the movement direction of the ejector pin to a direction perpendicular to the wafer surface; The sealing structure is arranged around the guide structure and the ejector pin, and is used to seal the guide structure and a portion of the ejector pin.

6. The ejector device according to claim 1, characterized in that: The detection unit includes a plurality of distance measuring sensors, the number of the distance measuring sensors is the same as the number of the ejector assemblies, the plurality of distance measuring sensors are arranged in a one-to-one correspondence with the ejector assemblies, and are all located above the corresponding ejector assemblies; the distance measuring sensors are used to respectively detect the distance from themselves to the top of the corresponding ejector assembly.

7. The ejector device according to claim 1, characterized in that: The control unit is also used to control all the driving units to drive all the ejector assemblies to rise from the initial position to the wafer pick-up and placement position at the same speed during the wafer transfer process, and to control all the driving units to drive all the ejector assemblies to descend from the wafer pick-up and placement position to the initial position at the same speed after the wafer is placed on the ejector assemblies or after the wafer is detached from the ejector.

8. A method for calibrating an ejector pin device, applied to the ejector pin device according to any one of claims 1 to 7; characterized in that: include: Drive all ejector assemblies to rise to the position for picking up and placing the sheet, and detect the height of the top of each ejector assembly; Calculating the difference between the actual height of the top end of each ejector assembly when located at the pick-up and placement position and the preset height, and determining whether any of the differences corresponding to all the ejector assemblies is non-zero; If yes, then according to the difference that is not zero, controlling the driving unit corresponding to the difference to drive the ejector assembly to move up and down, so that the difference between the height of the top of the ejector assembly when it is located at the pick-up and place position and the preset height is zero; wherein, according to the difference that is not zero, controlling the driving unit corresponding to the difference to drive the ejector assembly to move up and down specifically includes: Driving all the ejector assemblies to descend to their respective initial positions; According to the difference value that is not zero, driving the ejector assembly corresponding to the difference value from the original initial position to a new initial position; All the ejector assemblies are driven to rise from their respective current initial positions to the sheet picking and placing positions at the same speed.

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