Stage unit and processing system

Abstract

To provide a stage unit and a processing system which are advantageous for accurately positioning an electronic component at a desired position.SOLUTION: The stage unit 10 includes the base 11, the stage 12 on which the electronic component is placed, the stage moving mechanism 13 that moves the stage 12 with respect to the base 11, the movement measuring sensor 37 capable of directly or indirectly measuring the movement amount of the stage 12, and the control unit that controls the stage moving mechanism 13 based on the movement instruction command signal and moves the stage 12 so as to be arranged at the adjustment position indicated by the movement instruction command signal. The control unit controls the stage moving mechanism 13 based on the movement amount of the stage 12 indicated by the measurement result of the movement measuring sensor 37 and the adjustment position.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a stage unit on which electronic components are placed, and a processing system including such a stage unit. [Background technology]

[0002] In order to perform processes such as inspection of electronic components with high accuracy, the positions of the electronic components are adjusted.

[0003] Patent Document 1 discloses a device that corrects the position of transported electronic components, and in particular proposes a device that does not require advance registration of electronic component posture information. Patent Document 2 discloses a device that aims to place electronic components with high precision on contacts for electrical testing. Patent Document 3 discloses a device that aims to prevent the mounting position of electronic components from shifting in a direction different from the direction of movement during mounting. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-116529 [Patent Document 2] Japanese Patent Application Laid-Open No. 2012-117915 [Patent Document 3] Japanese Patent Publication No. 2020-088244 Summary of the Invention [Problem to be solved by the invention]

[0005] In recent years, the miniaturization of electronic components such as capacitors has progressed dramatically, and as a result, the contact points of electronic components for, for example, performance testing, tend to become smaller. As a result, strict requirements are placed on the placement accuracy (alignment accuracy) of electronic components when performing processes such as performance testing. For example, it is sometimes required to accurately move electronic components on the order of micrometers (μm) and place them in the desired position.

[0006] In order to place an electronic component at a desired position, the electronic component may be moved together with the stage while the electronic component is mounted on the stage. In this case, the stage must be moved by a very small distance (for example, a distance on the order of micrometers) using a stage movement mechanism. However, due to manufacturing errors and assembly errors of the various mechanical elements that make up the stage movement mechanism, it is not always easy to move the stage by the desired small distance with high precision using the stage movement mechanism.

[0007] The present disclosure provides an advantageous technique for accurately positioning an electronic component at a desired position. [Means for solving the problem]

[0008] One aspect of the present disclosure relates to a stage unit comprising a base, a stage on which an electronic component is placed, a stage movement mechanism that moves the stage relative to the base, a movement measurement sensor that can directly or indirectly measure the amount of movement of the stage, and a control unit that controls the stage movement mechanism based on a movement instruction command signal and moves the stage to an adjustment position indicated by the movement instruction command signal, wherein the control unit controls the stage movement mechanism based on the amount of movement of the stage indicated by the measurement result of the movement measurement sensor and the adjustment position.

[0009] The stage moving mechanism may have a stage moving body that moves integrally with the stage, and the movement measurement sensor may indirectly measure the movement amount of the stage by measuring the movement amount of the stage moving body.

[0010] The stage movement mechanism may be capable of moving the stage two-dimensionally along a plane, and the movement measurement sensor may have a first movement measurement sensor capable of measuring the amount of movement of the stage in a first direction along the plane, and a second movement measurement sensor capable of measuring the amount of movement of the stage in a second direction along the plane.

[0011] The stage moving mechanism may be capable of rotating the stage about a rotation axis extending in a direction perpendicular to the plane.

[0012] The stage moving mechanism may have a cam and a motor that rotates the cam, and may move the stage based on the rotation of the cam.

[0013] Another aspect of the present disclosure relates to a processing system including the above-mentioned stage unit, a mounting device that places electronic components on the stage, and an imaging device that acquires image data of the electronic components before they are placed on the stage, and a control unit that controls the stage movement mechanism to move the stage to an adjustment position based on a movement instruction command signal obtained as a result of analyzing the image data. [Effects of the Invention]

[0014] The present disclosure is advantageous in positioning electronic components at desired locations with high precision. [Brief explanation of the drawings]

[0015] [Figure 1] FIG. 1 is a perspective view showing an example of a stage unit. [Figure 2] FIG. 2 is a functional block diagram showing an example of the relationship between the movement measuring sensor, the control unit, and the drive motors (X-axis drive motor and Y-axis drive motor). [Figure 3] FIG. 3 is a graph showing an example of an ideal state of the rotation angle (horizontal axis) and lift amount (vertical axis) of the cams (see the X-axis drive cam and Y-axis drive cam shown in FIG. 1). [Figure 4] FIG. 4 is a graph showing an example of actual measurements of a cam manufactured to correspond to FIG. 3, where the horizontal axis indicates the rotation angle of the cam and the vertical axis indicates the error in the lift amount of the cam. [Figure 5] FIG. 5 is a diagram illustrating a schematic configuration of an example of a processing system. [Figure 6] FIG. 6 shows an example of a processing flow performed by the processing system shown in FIG. [Figure 7]Figure 7 is a diagram showing an example of the relationship between the target movement amount of the stage (horizontal axis) and the movement error amount (vertical axis) representing the difference between the target movement amount of the stage and the actual movement amount when the processing flow shown in Figure 6 (however, steps S7 and S8 are skipped) is executed by a processing system (see Figure 3) equipped with the stage unit shown in Figure 1. [Figure 8] Figure 8 is a diagram showing an example of the relationship between the target movement amount of the stage (horizontal axis) and the movement error amount (vertical axis) representing the difference between the target movement amount of the stage and the actual movement amount when the processing flow shown in Figure 6 (including steps S7 and S8) is executed by a processing system (see Figure 3) equipped with the stage unit shown in Figure 1. DETAILED DESCRIPTION OF THE INVENTION

[0016] Hereinafter, an embodiment of the present disclosure will be described with reference to the drawings.

[0017] FIG. 1 is a perspective view showing an example of a stage unit 10. As shown in FIG.

[0018] The stage unit 10 includes a base 11 , a stage 12 on which an electronic component is placed, and a stage moving mechanism 13 that moves the stage 12 relative to the base 11 .

[0019] 1 has an upper base portion 11a located relatively higher and extending horizontally (X direction dX and Y direction dY), a lower base portion 11c located relatively lower and extending horizontally, a drive motor mounting plate 11d located between the upper base portion 11a and the lower base portion 11c and extending horizontally, and two side base portions 11b extending in the height direction (vertical direction) between the upper base portion 11a and the side base portion 11b. The horizontal direction and the height direction form a right angle with each other.

[0020] One side base portion 11b is connected and fixed to one end of the upper base portion 11a in the X-direction dX and one end of the lower base portion 11c in the X-direction dX. The other side base portion 11b is connected and fixed to the other end of the upper base portion 11a in the X-direction dX and the other end of the lower base portion 11c in the X-direction dX. The drive motor mounting plate 11d is connected and fixed to each side base portion 11b at both ends in the X-direction dX. Therefore, the base 11 has an upper inner space (first inner space) surrounded by the upper base portion 11a, the side base portion 11b, and the drive motor mounting plate 11d, and a lower inner space (second inner space) surrounded by the drive motor mounting plate 11d, the side base portion 11b, and the lower base portion 11c.

[0021] The stage 12 is provided so as to be movable in each of the X direction (first direction) dX and the Y direction (second direction) dY by a stage moving mechanism 13, and is also provided so as to be movable (i.e., rotatable) in a rotation direction dR. The rotation direction dR is based on a rotation axis A that extends in the height direction (a direction perpendicular to a horizontal plane) so as to penetrate the stage 12 (particularly a reference placement position (e.g., the center position of the stage 12)), and the stage 12 is provided so as to be rotatable about the rotation axis A. The X direction dX and the Y direction dY are directions that are perpendicular to the rotation axis A and are perpendicular to each other. Note that any direction along a plane (a horizontal plane in this example) extending along the X direction dX and the Y direction dY is referred to as the XY direction, and the XY direction does not necessarily have to coincide with the X direction dX or the Y direction dY.

[0022] In this embodiment, in order to position the electronic components placed on the stage 12 at the desired position suitable for inspection of the electronic components by the inspection device 61, the X-direction position, Y-direction position and rotational position of the stage 12 can be adjusted for each electronic component by the stage moving mechanism 13.

[0023] In this embodiment, one target electronic component is transported from upstream by a mounting device (see reference numeral "46" in FIG. 5) and placed on stage 12, and after being inspected by inspection device 61 on stage 12, is transported downstream from stage 12 by the mounting device. This series of processes is performed consecutively for multiple target electronic components. In other words, immediately after the preceding electronic component has been inspected and transported from stage 12, the next electronic component transported from upstream is placed on stage 12 and inspected.

[0024] The inspection device 61 can perform desired inspections of the electronic components on the stage 12 and can have any desired device configuration and process. While FIG. 1 shows the inspection device 61 installed above the stage 12, the installation location and installation form of the inspection device 61 are not limited, and it may be installed, for example, on the second stage support 42. The inspection device 61 may, for example, capture and acquire images of the electronic components on the stage 12 and analyze the images to inspect for abnormalities (e.g., cracks or chips) that can be discerned from the appearance of the electronic components. The inspection device 61 may also contact the electronic components on the stage 12 and inspect for abnormalities in the electrical performance of the electronic components by, for example, passing a current through the electronic components on the stage 12 and measuring the state quantity (e.g., voltage value) of the electronic components related to the current. The inspection device 61 may not be installed, and the electronic components placed on the stage 12 may simply be subjected to the state adjustments (including position adjustments and orientation adjustments) described below.

[0025] The stage movement mechanism 13 of this embodiment is a position correction mechanism that moves the stage 12 based on the rotation of the drive cams 22 and 32. The drive cams 22 and 32 convert the rotational motion of the drive motors 20 and 30 into linear motion, thereby moving the stage 12 in each of the X direction dX and the Y direction dY. That is, the stage movement mechanism 13 can move the stage 12 two-dimensionally along a plane (a horizontal plane in this example) and position the stage 12 at a desired horizontal position. The stage movement mechanism 13 of this embodiment can also move the stage 12 in a rotational direction dR (rotating about the rotation axis A in this example) and position the stage 12 in a desired orientation (direction) relative to the horizontal direction. In this way, the stage movement mechanism 13 can linearly move the stage 12 a desired distance along each of the X direction dX and the Y direction dY, and can rotate the stage 12 a desired amount (desired angle) in the rotational direction dR.

[0026] Therefore, the stage moving mechanism 13 shown in FIG. 1 includes an XY moving device that moves the stage 12 in the XY directions relative to the base 11, and a rotation moving device that rotates the stage 12 relative to the base 11 in a rotation direction dR.

[0027] The XY movement device includes X-direction drive units (first direction drive units) 20-25, Y-direction drive units (second direction drive units) 30-35, a stage X-axis guide unit (first direction guide unit) 15, and a stage Y-axis guide unit (second direction guide unit) 16.

[0028] The X-direction drive unit has an X-axis drive motor (first direction drive source) 20 and an X-axis movable table (first direction movable part) 21 that is moved in the X direction dX together with the stage 12 by the driving force output from the X-axis drive motor 20.

[0029] The Y-direction drive unit has a Y-axis drive motor (second-direction drive source) 30 and a Y-axis movable table (second-direction movable part) 31 that is moved in the Y direction dY together with the stage 12 by the driving force output from the Y-axis drive motor 30.

[0030] The X-axis drive motor 20 and the Y-axis drive motor 30 are fixedly supported by the base 11, and even if the stage 12 is moved in the horizontal directions dX, dY and the rotational direction dR by the stage movement mechanism 13, the X-axis drive motor 20 and the Y-axis drive motor 30 do not move in the horizontal directions dX, dY and the rotational direction dR.

[0031] In the example shown in FIG. 1, the X-axis drive motor body 20a of the X-axis drive motor 20 is disposed in the upper inner space of the base 11 and is fixedly supported by the upper base portion 11a. The X-axis drive motor shaft of the X-axis drive motor 20 protrudes upward from the X-axis drive motor body 20a and extends in the height direction so as to pass through a through-hole (first through-hole) in the upper base portion 11a. Similarly, the Y-axis drive motor body 30a of the Y-axis drive motor 30 is disposed in the upper inner space of the base 11 and is fixedly supported by the upper base portion 11a. The Y-axis drive motor shaft of the Y-axis drive motor 30 protrudes upward from the Y-axis drive motor body 30a and extends in the height direction so as to pass through a through-hole (second through-hole) in the upper base portion 11a.

[0032] The X-axis drive motor 20 and the Y-axis drive motor 30 are configured so that the motor shafts can be rotated by a desired amount under the control of a control unit (see FIG. 2, which will be described later). In this example, the X-axis drive motor 20 and the Y-axis drive motor 30 are configured by servo motors, but the specific configuration of such X-axis drive motor 20 and Y-axis drive motor 30 is not limited.

[0033] An X-axis drive cam 22 is attached to the tip of the X-axis drive motor shaft (particularly, a portion located above the upper base portion 11a). The X-axis drive cam 22 rotates integrally with the X-axis drive motor shaft, which is driven to rotate by the X-axis drive motor body 20a, and the rotation axis of the X-axis drive cam 22 coincides with the rotation axis of the X-axis drive motor shaft. Meanwhile, an X-axis drive cam follower 23 is fixedly attached to the X-axis movable table 21, extending so as to protrude downward (vertically) from the underside of the X-axis movable table 21. The X-axis drive cam follower 23 comes into contact with the X-axis drive cam 22, and receives a force acting in the X direction dX from the X-axis drive cam 22 as the X-axis drive cam 22 rotates, so that the X-axis drive cam follower 23 is provided so as to be able to move back and forth in the X direction dX integrally with the X-axis movable table 21.

[0034] Further, an X-axis drive spring (X-axis drive elastic portion) 24 and a table X-axis guide unit 25 are attached to the X-axis movable table 21.

[0035] The X-axis drive spring 24 in this example is a tension spring whose one end is supported by the X-axis movable table 21 and whose other end is supported by the upper base portion 11a via a connecting member. The X-axis drive spring 24 applies an elastic force (restoring force) to the X-axis movable table 21 in the direction opposite (X direction dX) to the direction of the force in the X direction dX that the X-axis movable table 21 receives from the X-axis drive cam 22 via the X-axis drive cam follower 23. In this manner, the X-axis drive spring 24 acts to ensure contact (close contact) between the X-axis drive cam 22 and the X-axis drive cam follower 23. Note that instead of the X-axis drive spring 24, an elastic body other than a spring may be used, or an arbitrary mechanism (e.g., a mechanism using a magnet) that applies an arbitrary force other than an elastic force (e.g., a magnetic force) to the X-axis movable table 21 in the direction opposite (X direction dX) to the direction of the force in the X direction dX that the X-axis movable table 21 receives from the X-axis drive cam 22 may be used.

[0036] In the above example, the X-axis movable table 21 moved by the X-axis drive cam 22 is returned to its original position by using an arbitrary mechanism such as a spring (elastic body) or a magnet, but such an arbitrary mechanism such as a spring (elastic body) or a magnet does not have to be provided. For example, if the X-axis drive cam 22 has a structure that can move the X-axis movable table 21 back and forth in the X direction dX, there is no need to install a mechanism for returning the X-axis movable table 21 to its original position.

[0037] Table X-axis guide unit 25 in this example is configured with an LM guide (Linear Motion Guide), and has an LM rail fixedly provided on the top surface of upper base portion 11a, and an LM block that slides on the LM rail fixedly attached to the underside of X-axis movable table 21. The LM rail of table X-axis guide unit 25 supports the LM block so as to allow the LM block to freely slide back and forth in the X direction dX, while restricting its movement in the Y direction dY.

[0038] Similarly, a Y-axis drive cam 32 is attached to the tip of the Y-axis drive motor shaft (particularly, a portion located above the upper base portion 11a). The Y-axis drive cam 32 rotates integrally with the Y-axis drive motor shaft, which is rotated by the Y-axis drive motor body 30a, and the rotation axis of the Y-axis drive cam 32 coincides with the rotation axis of the Y-axis drive motor shaft. Meanwhile, a Y-axis drive cam follower 33 is fixedly attached to the Y-axis movable table 31, extending so as to protrude downward (vertically) from the underside of the Y-axis movable table 31. The Y-axis drive cam follower 33 comes into contact with the Y-axis drive cam 32, and receives a force acting in the Y direction dY from the Y-axis drive cam 32 as the Y-axis drive cam 32 rotates, so that the Y-axis drive cam follower 33 is provided so as to be able to move back and forth along the Y direction dY integrally with the Y-axis movable table 31.

[0039] A Y-axis drive spring (Y-axis drive elastic portion) 34 and a table Y-axis guide unit 35 are also attached to the Y-axis movable table 31. In this example, the Y-axis drive spring 34 is a tension spring with one end supported by the Y-axis movable table 31 and the other end supported by the upper base portion 11a via a connecting member. The Y-axis drive spring 34 applies an elastic force (restoring force) to the Y-axis movable table 31 in the direction opposite to the direction of the force in the Y direction dY that the Y-axis movable table 31 receives from the Y-axis drive cam 32 via the Y-axis drive cam follower 33. In this way, the Y-axis drive spring 34 acts to ensure contact (close contact) between the Y-axis drive cam 32 and the Y-axis drive cam follower 33. Instead of the Y-axis drive spring 34, an elastic body other than a spring may be used, or any mechanism (for example, a mechanism using a magnet) may be used that applies any force other than elastic force (for example, magnetic force) to the Y-axis movable table 31 in the opposite direction (Y direction dY) to the direction of the force in the Y direction dY that the Y-axis movable table 31 receives from the Y-axis drive cam 32.

[0040] In the above example, the Y-axis movable table 31 moved by the Y-axis drive cam 32 is returned to its original position by using an arbitrary mechanism such as a spring (elastic body) or a magnet, but such an arbitrary mechanism such as a spring (elastic body) or a magnet does not have to be provided. For example, if the Y-axis drive cam 32 has a structure that allows the Y-axis movable table 31 to move back and forth in the Y direction dY, there is no need to install a mechanism for returning the Y-axis movable table 31 to its original position.

[0041] Table Y-axis guide unit 35 in this example is constituted by an LM guide, and has an LM rail fixedly provided on the top surface of upper base portion 11a, and an LM block that slides on the LM rail fixedly attached to the underside of Y-axis movable table 31. The LM rail of table Y-axis guide unit 35 supports the LM block so as to restrict movement of the LM block in the X-direction dX while allowing free reciprocating sliding movement of the LM block in the Y direction dY.

[0042] The stage X-axis guide unit 15 is attached to the upper base portion 11a and the stage 12, and allows movement of the stage 12 in the X direction dX relative to the upper base portion 11a while restricting movement in the Y direction dY. The stage X-axis guide unit 15 can be placed between one of the upper base portion 11a or the stage 12 and the Y-axis movable table 31. In the example shown in FIG. 1 , the stage X-axis guide unit 15 is placed between the stage 12 and the Y-axis movable table 31, and the Y-axis movable table 31 is attached to the stage 12 via the stage X-axis guide unit 15.

[0043] 1 is composed of LM guides, and has an LM rail fixedly provided on the upper surface of Y-axis movable table 31, and an LM block that slides on the LM rail and is fixedly attached to stage 12 via first stage support part 41, turntable 71, and second stage support part 42. The LM rail of stage X-axis guide unit 15 supports the LM block so as to allow the LM block to freely slide back and forth in the X direction dX, while restricting its movement in the Y direction dY.

[0044] The stage Y-axis guide unit 16 is attached to the upper base portion 11a and the stage 12, and restricts movement of the stage 12 in the X-axis direction dX while allowing movement of the stage 12 relative to the upper base portion 11a in the Y-direction dY. The stage Y-axis guide unit 16 can be arranged between one of the upper base portion 11a and the stage 12 and the X-axis movable table 21. In the example shown in FIG. 1 , the stage Y-axis guide unit 16 is arranged between the stage 12 and the X-axis movable table 21, and the X-axis movable table 21 is attached to the stage 12 via the stage Y-axis guide unit 16.

[0045] 1 is composed of an LM guide, and has an LM rail fixedly provided on the upper surface of X-axis movable table 21, and an LM block that slides on the LM rail and is fixedly attached to stage 12 via first stage support part 41, turntable 71, and second stage support part 42. The LM rail of stage Y-axis guide unit 16 supports the LM block so as to restrict movement of the LM block in the X-direction dX while allowing free reciprocating sliding movement of the LM block in the Y direction dY.

[0046] The rotational movement device includes a θ-axis drive motor (rotational direction drive source) 70 , a turntable (rotation support unit) 71 , and a rotation relay unit 72 .

[0047] The θ-axis drive motor 70 is fixedly supported by the base 11, and even if the stage 12 is moved in the horizontal directions dX, dY and the rotational direction dR by the stage movement mechanism 13, the θ-axis drive motor 70 does not move in the horizontal directions dX, dY and the rotational direction dR.

[0048] 1, a θ-axis drive motor body 70a of a θ-axis drive motor 70 is disposed in the lower inner space of the base 11 and is fixedly supported by a drive motor mounting plate 11d. A θ-axis drive motor shaft of the θ-axis drive motor 70 protrudes upward from the θ-axis drive motor body and extends in the height direction so as to pass through a through-hole in the drive motor mounting plate 11d. A rotation relay part 72 (a second coupling 74 in this example) is fixedly attached to the tip end of the θ-axis drive motor shaft (particularly, the part located above the drive motor mounting plate 11d).

[0049] The θ-axis drive motor 70 is configured to be able to rotate the motor shaft by a desired amount under the control of a control unit (see reference numeral "50" in FIG. 2 described later), as will be described later. The specific configuration of such a θ-axis drive motor 70 is not limited, and the θ-axis drive motor 70 may be configured by a servo motor, for example.

[0050] The turntable 71 is rotated together with the stage 12 in a rotation direction dR by a rotational driving force output from a θ-axis drive motor 70 and transmitted via a rotation relay unit 72 .

[0051] 1, the second stage support 42, which is fixed to the stage 12, is fixedly attached to the upper surface of the turntable 71, and the turntable 71 is fixedly attached to the stage 12 via the second stage support 42. A rotation support shaft extends vertically downward from the lower surface of the turntable 71. Although not visible in FIG. 1, the rotation support shaft extends so as to penetrate the stage movement mechanism 13 (e.g., the first stage support 41 and the X-axis movable table 21) and the upper base portion 11a, and is connected and fixed at one end (upper end) to the second stage support 42 and at the other end (lower end) to the rotation relay unit 72 (first coupling 73 in this example).

[0052] Therefore, when the θ-axis drive motor shaft of the θ-axis drive motor 70 is rotated, the rotary relay unit 72 rotates integrally with the θ-axis drive motor shaft. Then, when the rotary relay unit 72 rotates, the rotary support shaft and the turntable 71 rotate integrally with the rotary relay unit 72, and as a result, the stage 12 rotates integrally with the turntable 71 and second stage support unit 42.

[0053] In particular, the rotation relay unit 72 of this embodiment transmits the driving force output from the θ-axis drive motor 70 to the rotation support unit (the rotation support shaft and the turntable 71), and allows the rotation support unit (the rotation support shaft and the turntable 71) to move in the horizontal direction (X and Y directions) relative to the θ-axis drive motor 70. In other words, regardless of whether there is a horizontal positional deviation between the rotation support unit (the rotation support shaft and the turntable 71) and the θ-axis drive motor 70, the rotation relay unit 72 transmits the rotation driving force from the θ-axis drive motor 70 to the rotation support unit, and thus can rotate the second stage support unit 42 and the stage 12 connected to the rotation support unit in the rotation direction dR.

[0054] 1 has a first coupling 73 fixedly attached to the rotation support shaft, a second coupling 74 fixedly attached to the θ-axis drive motor shaft of the θ-axis drive motor 70, and a turn joint shaft (coupling connector) 75 connected to the first coupling 73 and the second coupling 74. The position of the turn joint shaft 75 changes depending on the relative position between the first coupling 73 and the second coupling 74 in the horizontal direction (XY direction).

[0055] The first coupling 73 moves horizontally together with the rotation support shaft, turntable 71, second stage support part 42, and stage 12. Therefore, when the stage 12 is moved horizontally (in the X and Y directions) by the XY movement device described above, the first coupling 73 also moves horizontally together with the stage 12. Therefore, the horizontal position (position in the X and Y directions) of the first coupling 73 basically always coincides with the horizontal position of the stage 12. On the other hand, the second coupling 74, which is fixedly attached to the θ-axis drive motor 70, does not move horizontally like the θ-axis drive motor 70, and the horizontal position of the second coupling 74 coincides with the horizontal position of the θ-axis drive motor 70.

[0056] Therefore, when the first coupling 73 moves horizontally in accordance with the horizontal movement of the stage 12, a misalignment in the horizontal position may occur between the first coupling 73 and the second coupling 74. Even if a misalignment occurs between the first coupling 73 and the second coupling 74 in this way, the influence of the misalignment is absorbed by the turn joint shaft 75 taking an inclined posture according to the horizontal positions of the first coupling 73 and the second coupling 74. In other words, regardless of the amount of horizontal misalignment between the first coupling 73 and the second coupling 74, the first coupling 73 is appropriately connected while maintaining its relative position and posture (orientation) with respect to the rotation support shaft, turntable 71, second stage support unit 42, and stage 12, and the second coupling 74 is appropriately connected while maintaining its relative position and posture (orientation) with respect to the θ-axis drive motor 70.

[0057] Since a mechanism for absorbing misalignment between the θ-axis drive motor 70 and the rotation support unit (rotation support shaft and turntable 71) using such a rotation relay unit 72 is known, a more detailed explanation of a specific configuration example of the rotation relay unit 72 will be omitted.

[0058] When the stage 12 is to be moved a desired distance in the X direction dX, the X-axis drive motor 20 is driven under the control of a control unit (see reference numeral "50" in FIG. 2 described later), and the X-axis drive motor shaft is rotated by an amount of rotation (desired rotation amount) corresponding to the desired distance. As a result, the X-axis drive cam 22 rotates by the desired amount of rotation, and the X-axis drive cam follower 23 is moved by the desired distance in the X direction dX. By moving the X-axis drive cam follower 23 in this manner, the X-axis movable table 21, the stage Y-axis guide unit 16, and the first stage support 41 connected to the X-axis drive cam follower 23 are also moved integrally by the desired distance in the X direction dX. As a result, the stage 12, which is attached to the first stage support 41 via the second stage support 42 and the turntable 71, is also moved by the desired distance in the X direction dX.

[0059] Similarly, when moving the stage 12 a desired distance in the Y direction dY, the Y-axis drive motor 30 is driven under the control of the control unit, and the Y-axis drive motor shaft is rotated by an amount of rotation (desired rotation amount) corresponding to the desired distance. As a result, the Y-axis drive cam 32 rotates by the desired amount of rotation, moving the Y-axis drive cam follower 33 by the desired distance in the Y direction dY. By moving the Y-axis drive cam follower 33 in this manner, the Y-axis movable table 31, the stage X-axis guide unit 15, and the first stage support part 41 connected to the Y-axis drive cam follower 33 are also moved integrally by the desired distance in the Y direction dY. As a result, the stage 12 attached to the first stage support part 41 is also moved by the desired distance in the Y direction dY.

[0060] Furthermore, when the stage 12 is moved a desired distance in the rotation direction dR (i.e., when it is rotated a desired angle around the rotation axis A), the θ-axis drive motor 70 is driven under the control of the control unit, and the θ-axis drive motor shaft is rotated an amount of rotation (desired amount of rotation) corresponding to the desired angle. As a result, the rotation relay unit 72, the rotation support shaft, the turntable 71, and the second stage support unit 42 rotate by the desired amount of rotation, and thus the stage 12 attached to the second stage support unit 42 is also rotated by the desired amount of rotation and moved by the desired distance (i.e., desired angle) in the rotation direction dR.

[0061] The above-mentioned movement driving of the stage 12 in the X direction dX, the movement driving of the stage 12 in the Y direction dY, and the movement driving (rotation driving) of the stage 12 in the rotation direction dR may be performed simultaneously or at different timings.

[0062] The stage unit 10 of this embodiment further includes a movement measurement sensor 37 that can directly or indirectly measure the amount of movement of the stage 12 .

[0063] The movement measurement sensor 37 in this example indirectly measures the movement amount of the stage 12 by measuring the movement amount of a stage support extension (stage moving body) 43 that is fixed to the first stage support 41 so as to move integrally with the first stage support 41 in the X direction dX and the Y direction dY. The movement measurement sensor 37 shown in FIG. 1 includes an X-direction sensor (first movement measurement sensor) 37x and a Y-direction sensor (second movement measurement sensor) 37y. The X-direction sensor 37x can measure the movement amount of the stage support extension 43 in the X direction dX along the horizontal plane (and thus the movement amount of the stage 12). The Y-direction sensor 37y can measure the movement amount of the stage support extension 43 in the Y direction dY along the horizontal plane (and thus the movement amount of the stage 12).

[0064] The movement measurement sensors 37 (X-direction sensor 37x and Y-direction sensor 37y) may have any configuration, and may directly or indirectly measure the movement amount of the stage 12 using, for example, encoders. When sensors 37x and 37y are configured using optical linear encoders, linear scales extending in the X direction dX and the Y direction dY may be formed on the stage support extension 43 (particularly at the locations facing sensors 37x and 37y). In this case, each of the X-direction sensor 37x and the Y-direction sensor 37y can measure the movement amount of the stage support extension 43 in the X direction dX and the Y direction dY by optically reading the linear scale. The scale interval (slit interval) is not limited, but corresponds to the minimum movement amount of the stage support extension 43 (and therefore the minimum movement amount of the stage 12) that the movement measurement sensor 37 can measure. Therefore, the scale interval is determined according to the minimum measurement resolution required for the movement measurement sensor 37, and may be, for example, 1 μm intervals.

[0065] 1, the movement measurement sensor 37 may have any configuration capable of directly or indirectly measuring the movement amount of the stage 12. For example, the movement measurement sensor 37 may directly measure the movement amount of the stage 12 instead of the stage support extension 43, or may indirectly measure the movement amount of the stage 12 by measuring the movement amount of one or more other components that move integrally with the stage 12. As an example, the movement measurement sensor 37 may measure the movement amount of the first stage support 41, the second stage support 42, and / or the turntable 71 shown in FIG.

[0066] Furthermore, the movement measurement sensor 37 may indirectly measure the movement amount of the stage 12 in the X direction dX by measuring the movement amount in the X direction dX of a component (for example, the X-axis movable table 21 and / or the LM block of the stage X-axis guide unit 15) that moves integrally with the stage 12 only in the X direction dX. Similarly, the movement measurement sensor 37 may indirectly measure the movement amount in the Y direction dY of a component (for example, the Y-axis movable table 31 and / or the LM block of the stage Y-axis guide unit 16) that moves integrally with the stage 12 only in the Y direction dY.

[0067] FIG. 2 is a functional block diagram showing an example of the relationship between the movement measuring sensor 37, the control unit 50, and the drive motor 63 (the X-axis drive motor 20 and the Y-axis drive motor 30).

[0068] The drive motor 63 shown in FIG. 2 is a servo motor that represents each of the X-axis drive motor 20 and the Y-axis drive motor 30 shown in FIG. 1 and includes a motor driver 64, a motor drive unit 65, and a motor encoder 66. The motor driver 64 outputs a motor drive signal to the motor drive unit 65 based on a movement drive signal P2 input from the stage movement calculation unit 52 of the control unit 50, and the motor drive unit 65 drives and rotates the motor shaft in accordance with the motor drive signal. Meanwhile, the motor encoder 66 detects the rotation speed and rotation angle of the motor drive unit 65 (motor shaft) and outputs a motor detection signal indicating the detection results to the motor driver 64. The motor driver 64 can dynamically adjust the rotation speed and rotation angle of the motor drive unit 65, and in particular outputs the motor drive signal to dynamically adjust the rotation speed and rotation angle of the motor drive unit 65 using a feedback control method (full-closed control method) based on the motor detection signal.

[0069] The amount of movement of the stage 12 measured by the movement measurement sensor 37 is transmitted as a measured movement amount signal C from the movement measurement sensor 37 to a stage movement calculation unit 52 of the control unit 50. A movement instruction command signal P1 sent from the image analysis unit 51 is also input to the stage movement calculation unit 52. The movement instruction command signal P1 is obtained based on the results of analysis of an image (image data) of an electronic component whose position is to be adjusted, as will be described later, and indicates the adjustment position (target placement position) of the electronic component. Note that in this example, the image analysis unit 51 is configured by the control unit 50 together with the stage movement calculation unit 52, but it may be provided separately from the control unit 50 (stage movement calculation unit 52) ​​and may be configured, for example, by a part (e.g., an image processing unit) of an imaging device (see FIG. 5 described later).

[0070] The stage movement calculation unit 52 of the control unit 50 controls the drive motors 63 (X-axis drive motor 20 and Y-axis drive motor 30 in FIG. 1) of the stage movement mechanism 13 based on the movement instruction command signal P1, and moves the stage 12 to the adjustment position indicated by the movement instruction command signal P1. In particular, the stage movement calculation unit 52 (control unit 50) of this embodiment controls the stage movement mechanism 13 based on the movement amount of the stage 12 indicated by the measurement result (measured movement amount signal C) of the movement measurement sensor 37 and the adjustment position indicated by the movement instruction command signal P1. As a result, the electronic component on the stage 12 is positioned at the desired adjustment position with great precision.

[0071] Fig. 3 is a graph showing an example of the ideal state of the rotation angle (horizontal axis) and lift amount (vertical axis) of the cam (see X-axis drive cam 22 and Y-axis drive cam 32 shown in Fig. 1). Fig. 4 is a graph showing an example of actual measurement of a cam manufactured to correspond to Fig. 3, where the horizontal axis indicates the cam rotation angle and the vertical axis indicates the error in the cam lift amount.

[0072] The "cam rotation angle" represented by the horizontal axis in each of Figures 3 and 4 indicates the rotation angle of the cam from the reference position (0°), with a cam rotation angle of "360°" substantially matching a cam rotation angle of "0°." The "cam lift amount" represented by the vertical axis in Figure 3 indicates the amount of movement of the cam follower pushed and moved by the cam in response to the rotation of the cam, with the cam lift amount at a cam rotation angle of "0°" set to "0 mm." The "cam lift amount error" represented by the vertical axis in Figure 4 indicates the deviation of the actually measured cam lift amount from the cam lift amount under ideal conditions, with a cam lift amount error of "0 μm" meaning that the actually measured cam lift amount matches the ideal cam lift amount.

[0073] Even if a cam is designed and manufactured so that the lift amount increases proportionally to the rotation angle within a certain rotation angle range (a range of 0° to 320° in the example shown in FIG. 3) as shown in FIG. 3, the "rotation angle-lift amount" characteristics of a cam that is actually manufactured and assembled into stage unit 10 usually do not show an ideal proportional relationship due to manufacturing errors and the like (see FIG. 4). In particular, the "rotation angle-lift amount" characteristics of an actual cam can vary for each individual cam, making it difficult to accurately predict the "rotation angle-lift amount" characteristics of each individual cam.

[0074] In this way, the "rotation angle-lift amount" characteristics of the cam are inherently not constant due to manufacturing errors, etc. Therefore, the amount of movement of the stage 12 moved by the stage movement mechanism 13 equipped with such cams (X-axis drive cam 22 and Y-axis drive cam 32 in FIG. 1) also inherently has errors.

[0075] 1 and 2, the stage unit 10 of this embodiment controls the stage moving mechanism 13 based on the actual movement amount of the stage 12 indicated by the measurement result of the movement measurement sensor 37 and the adjustment position (target placement position) indicated by the movement instruction command signal P1. Therefore, the movement amount of the stage 12 by the stage moving mechanism 13 can be adaptively corrected based on the actual movement amount of the stage 12, and as a result, the stage 12 (and thus the electronic components on the stage 12) can be accurately placed at the desired adjustment position (see FIG. 8 described later).

[0076] The stage unit 10 shown in FIGS. 1 and 2 is merely an example, and various modifications may be made to the stage unit 10.

[0077] Next, an example of a processing system 1 including the above-described stage unit 10 will be described.

[0078] FIG. 5 is a diagram showing a schematic configuration of an example of the processing system 1. As shown in FIG.

[0079] In the processing system 1 of this embodiment, each electronic component W to be processed is temporarily placed on the stage 12 while being transported to the subsequent stage, moved together with the stage 12 to correct its position, and then processed (e.g., performance test, etc.) by the inspection device 61.

[0080] The processing system 1 shown in FIG. 5 includes a front stage mounting part 45 provided in the front stage station St1, an imaging device 55 provided in the imaging station St2, and a stage unit 10 and an inspection device 61 provided in the adjustment station St3.

[0081] The target electronic component W is placed on the upstream placement section 45. The electronic component W on the upstream placement section 45 is held by a placement device 46 and intermittently transported from the upstream station St1 to the adjustment station St3 via the imaging station St2, and then placed on the stage 12 of the stage unit 10.

[0082] The placement device 46 of this embodiment includes a pickup nozzle (component holding nozzle) 47 that releasably holds an electronic component W under the control of the control unit 50. The pickup nozzle 47 is a suction nozzle that holds the electronic component W at a nozzle opening by vacuum suction, for example, by making the internal pressure lower than the external pressure, and can release the electronic component W by making the internal pressure equal to or greater than the external pressure.

[0083] Pick-up nozzle 47 moves so as to stop intermittently at a plurality of stations (including stations St1 to St3) in sequence, and circulates through the plurality of stations. In this embodiment, these stations are arranged at equal intervals along a circular path, and placement device 46 is equipped with a plurality of pickup nozzles 47, the same number as the number of stations, and each of the plurality of pickup nozzles 47 stops intermittently at all the stations simultaneously.

[0084] Therefore, at the same time that the preceding pickup nozzle 47 holds an electronic component W at the preceding station St1 and moves together with that electronic component W to place it at the imaging station St2, the next pickup nozzle 47 is placed at the preceding station St1 to hold another electronic component W. In this way, the placement device 46 holds the electronic components W on the preceding placement section 45 one at a time and transports them to the imaging station St2.

[0085] Only one electronic component W may be placed on the upstream placement unit 45 at a time, or multiple electronic components W may be placed on the upstream placement unit 45 at a time. When only one electronic component W is placed on the upstream placement unit 45 at a time, the next electronic component W may be placed on the upstream placement unit 45 by a supply device (not shown) after the electronic component W is transported from the upstream placement unit 45 toward the imaging station St2 by the preceding pickup nozzle 47 (for example, before the next pickup nozzle 47 is placed at the upstream station St1). On the other hand, when multiple electronic components W are placed on the upstream placement unit 45 at a time, the next electronic component W may be moved to a holding position by a moving mechanism (not shown) so that the next electronic component W is placed at a holding position to be held by the next pickup nozzle 47 after the electronic component W is transported from the upstream placement unit 45 toward the imaging station St2 by the preceding pickup nozzle 47 (for example, before the next pickup nozzle 47 is placed at the upstream station St1). Alternatively, the upstream placement unit 45 may be moved by a moving mechanism (not shown).

[0086] In the imaging station St2, the imaging device 55 acquires image data D of the electronic component W before it is placed on the stage 12 of the stage unit 10, and transmits the image data D to the control unit 50. In the example shown in FIG. 5, the imaging station St2 is provided with an annular illumination device 57 having a central light-transmitting portion through which light for photographing the electronic component W can pass, and an imaging optical system 56 that guides the light for photographing the electronic component W to the imaging device (particularly, an image sensor such as a CMOS) 55. The imaging optical system 56 may include, for example, one or more optical elements (e.g., lenses and mirrors) that refract or reflect light. Therefore, although the electronic component W, the pickup nozzle 47, the imaging optical system 56, and the imaging device 55 intermittently arranged in the imaging station St2 are positioned on the same straight line (the same vertical line) in the example shown in FIG. 5, they do not necessarily have to be positioned on the same straight line. For example, imaging light traveling vertically (downward) from the electronic component W may be reflected horizontally by the imaging optical system 56, and the imaging device 55 may receive the imaging light traveling horizontally.

[0087] Illumination light (e.g., visible light) from the illumination device 57 is directed at the electronic component W that stops intermittently together with the pickup nozzle 47 in the imaging station St2, and the reflected light, which is imaging light of the electronic component W, is received by the image sensor of the imaging device 55 via the light-transmitting portion of the illumination device 57 and the imaging optical system 56, thereby acquiring image data D of the electronic component W. The image data D may include an image of the illumination device 57 in addition to the image of the electronic component W, or may not include an image of the illumination device 57.

[0088] The electronic component W held by the pickup nozzle 47 is subjected to imaging processing at the imaging station St2, then moves from the imaging station St2, is intermittently stopped at the adjustment station St3, and is placed on the stage 12 of the stage unit 10.

[0089] In this embodiment, the control unit 50 controls the stage movement mechanism 13 (particularly the X-axis drive motor 20, the Y-axis drive motor 30, and the θ-axis drive motor 70) based on the image data D. That is, the control unit 50 adjusts the position and orientation of the stage 12 by controlling the stage movement mechanism 13 based on status information indicating the status of the electronic component W obtained by analyzing the image data D. The status information referred to here may include various information, and typically includes position information indicating a deviation of the position of the electronic component W from a reference position and orientation information indicating a deviation of the orientation (orientation) of the electronic component W from the reference orientation. The position information of the electronic component W referred to here may include, for example, not only information indicating the geometric position (e.g., outer dimensions) of the electronic component W but also information indicating electrode position deviation of the electronic component W. Therefore, by controlling the stage movement mechanism 13 based on the position information of the electronic component W, the control unit 50 can correct not only the geometric position of the electronic component W but also the electrode position deviation of the electronic component W.

[0090] 5, the control unit 50 includes an image analysis unit 51 that analyzes image data D of the electronic component W output from the imaging device 55, and a stage movement calculation unit 52 that controls the stage movement mechanism 13 based on the analysis results of the image data D. The image analysis unit 51 can analyze the image data D using any method to acquire status information such as position information and orientation information of the electronic component W. The stage movement calculation unit 52 controls the stage movement mechanism 13 based on the status information acquired by the image analysis unit 51, and adjusts the position of the stage 12 relative to the base 11 (and therefore the position of the electronic component W on the stage 12).

[0091] As an example, the image analysis unit 51 stores reference image data in advance, and is able to acquire status information such as position information and orientation information by comparing image data D of the electronic component W acquired by the imaging device 55 with the reference image data. The reference image data referred to here is image data including an image of the electronic component W placed at a desired appropriate position and orientation, and may be, for example, image data D acquired by the imaging device 55 while the electronic component W is being held by the pickup nozzle 47 at the desired appropriate position and orientation. In this case, the image analysis unit 51 may identify the position and orientation of the target electronic component W in the image data D (e.g., the position and orientation of the entire or part (electrodes, etc.) of the target electronic component W) and compare it with the position and orientation of the electronic component W in the reference image data to acquire status information such as position information and orientation information regarding the target electronic component W. Alternatively, the image analysis unit 51 may acquire status information such as position information and orientation information regarding the target electronic component W by comparing the position and orientation of the electronic component W in the image data D of the electronic component W acquired by the imaging device 55 with a reference position and reference orientation in the image data D (for example, a position and orientation that directly or indirectly indicates the pick-up nozzle 47).

[0092] As will be described later, the pickup nozzle 47 in this example places the electronic component W on the stage 12 that is placed at a predetermined origin position, and temporarily releases the electronic component W. Thereafter, the position of the stage 12 (and thus the position of the electronic component W) is adjusted by the stage moving mechanism 13 under the control of the control unit 50, and the pickup nozzle 47 again holds the electronic component W on the stage 12 after the position adjustment, and transports it from the adjustment station St3 to a subsequent station.

[0093] FIG. 6 shows an example of a processing flow performed by the processing system 1 shown in FIG.

[0094] The electronic component W to be processed is placed on the upstream placement unit 45 of the upstream station St1, and while being held by a pickup nozzle 47 of a placement device 46, is intermittently transported from the upstream station St1 to the imaging station St2.

[0095] Thereafter, the electronic component W is imaged by the imaging device 55 while being intermittently stopped at the imaging station St2, and a movement instruction command signal P1 is generated based on the analysis result of the imaged image (S1 in FIG. 6). That is, image data D of the image of the electronic component W acquired by the imaging device 55 is transmitted to the image analysis unit 51 of the control unit 50. The image analysis unit 51 analyzes the image data D to acquire status information (including position information and orientation information) of the electronic component W, derives a difference (target movement amount) between the current position of the electronic component W and the target placement position, and generates a movement instruction command signal P1 including information on the difference (target movement amount) and orientation information. Note that the pickup nozzle 47 continues to hold the electronic component W at the imaging station St2 without releasing it.

[0096] After undergoing imaging processing by the imaging device 55, the electronic component W is intermittently transported from the imaging station St2 to the adjustment station St3 while being held by the pickup nozzle 47 (S2).

[0097] Meanwhile, stage 12 of stage unit 10 provided in adjustment station St3 undergoes a position adjustment process by stage moving mechanism 13 so as to be positioned at a predetermined origin position (S3). The "origin position" referred to here is not limited, but as an example, by placing stage 12 at the origin position, the central region of stage 12 (the region through which the central axis extending in the vertical direction passes) may be positioned directly below pickup nozzle 47 that is intermittently stopped at adjustment station St3.

[0098] The electronic component W is then placed on the stage 12, which is placed at the origin position, by the pickup nozzle 47, and thereafter the pickup nozzle 47, which has released its hold on the electronic component W, is moved upward and retracted from the stage 12 (S4).

[0099] Thereafter, the stage movement mechanism 13 moves the stage 12 from the origin position based on the movement instruction command signal P1 under the control of the stage movement calculation unit 52 of the control unit 50, thereby adjusting the placement position of the electronic component W on the stage 12 (S5). At this time, the movement amount of the stage 12 is measured directly or indirectly by the movement measurement sensor 37, and the measurement result (measured movement amount) is transmitted as a measured movement amount signal C from the movement measurement sensor 37 to the stage movement calculation unit 52 of the control unit 50 (S6).

[0100] Then, the stage movement calculation unit 52 determines whether or not the difference between the target movement amount based on the movement instruction command signal P1 and the measured movement amount acquired by the movement measurement sensor 37 is within an allowable range (S7). The "allowable range" here can be set appropriately by the administrator (user) of the processing system 1, and is a parameter that affects the accuracy of position adjustment of the electronic component W by the stage unit 10.

[0101] If it is determined that the difference between the target movement amount and the measured movement amount is not within the allowable range (N in S7), the stage movement calculation unit 52 transmits a movement drive signal P2 based on the difference between the target movement amount and the measured movement amount to the drive motor 63, and the position of the stage 12 is adjusted again (S8). That is, the stage movement mechanism 13 moves the stage 12 together with the electronic component W based on the difference between the target movement amount and the measured movement amount, so that the stage 12 (and therefore the electronic component W) approaches the placement target position. At this time, the above-mentioned step S6 is performed again, and the movement amount of the stage 12 is measured by the movement measurement sensor 37. Thereafter, the above-mentioned step S7 is performed again, and it is determined whether the difference between the target movement amount and the measured movement amount is within the allowable range.

[0102] On the other hand, if it is determined that the difference between the target movement amount and the measured movement amount is within the allowable range (Y in S7), the electronic component W is held again on the stage 12 by the pickup nozzle 47 (S9). Then, while being held by the pickup nozzle 47, the electronic component W is intermittently transported from the adjustment station St3 to a subsequent station (not shown) (S10).

[0103] Fig. 7 is a diagram showing an example of the relationship between the target movement amount (horizontal axis) of the stage 12 and the movement error amount (vertical axis) representing the difference between the target movement amount and the actual movement amount of the stage 12 when the processing flow shown in Fig. 6 (however, steps S7 and S8 are skipped) is executed by the processing system 1 (see Fig. 3) including the stage unit 10 shown in Fig. 1. Fig. 8 is a diagram showing an example of the relationship between the target movement amount (horizontal axis) of the stage 12 and the movement error amount (vertical axis) representing the difference between the target movement amount and the actual movement amount of the stage 12 when the processing flow shown in Fig. 6 (including steps S7 and S8) is executed by the processing system 1 (see Fig. 3) including the stage unit 10 shown in Fig. 1.

[0104] As the accuracy of position adjustment of the stage 12 (and thus the electronic component W) by the stage movement mechanism 13 increases, the movement error amount (vertical axis) approaches "0 μm" in the graphs of FIGS.

[0105] As shown in Figure 7, when the stage 12 is simply moved from the origin position based on the movement instruction command signal P1 (see S5 in Figure 6) without determining whether the difference between the target movement amount and the measured movement amount of the stage 12 is within the allowable range (S7 in Figure 6) or without readjusting the position of the stage 12 (S8 in Figure 8), a relatively large movement error amount is displayed. In the example shown in Figure 7, a movement error amount (absolute value) of up to about "15 μm" was displayed. Furthermore, the present inventors repeatedly performed similar experiments and confirmed the occurrence of a movement error amount (absolute value) of up to about "26 μm."

[0106] On the other hand, as shown in Fig. 8, when it is determined whether or not the difference between the target movement amount and the measured movement amount of the stage 12 is within the tolerance range (S7 in Fig. 6) and the position of the stage 12 is readjusted (S8 in Fig. 8), the movement error amount becomes very small. In the example shown in Fig. 8, a movement error amount (absolute value) of up to about "1 µm" is shown over the entire target movement amount, and a significant improvement in the position adjustment accuracy of the stage 12 (and therefore the position adjustment accuracy of the electronic component W on the stage 12) is recognized compared to the example shown in Fig. 7.

[0107] As described above, according to the processing system 1 (stage unit 10) and processing method of this embodiment, the control unit 50 controls the stage movement mechanism 13 based on the actual movement amount of the stage 12 indicated by the measurement result of the movement measurement sensor 37 and the adjusted position based on the movement instruction command signal P1. Therefore, the electronic component W on the stage 12 can be positioned at a desired position with high precision.

[0108] Furthermore, the processing system 1 (stage unit 10) and processing method of this embodiment are advantageous in terms of data capacity because they do not require the acquisition and storage of large amounts of data such as correction tables in advance.

[0109] [Variations] The stage unit 10 in the above-described embodiment can adjust not only the position of the stage 12 in the X direction dX and the Y direction dY but also the attitude (orientation) of the stage 12, but the stage unit 10 does not necessarily have to adjust the attitude (orientation) of the stage 12. Therefore, for example, the θ-axis drive motor 70, rotation relay unit 72, rotation support shaft and / or turntable 71 shown in FIG. 1 do not have to be provided.

[0110] Furthermore, in the processing system 1 of the above-described embodiment, after the electronic component W is placed on the stage 12 arranged at the origin position, the position of the stage 12 is adjusted based on the movement instruction command signal P1 and the measured movement amount signal C, but the position adjustment method is not limited to this. For example, the electronic component W may be placed on the stage 12 in a state in which the position has been adjusted based on the movement instruction command signal P1 and the measured movement amount signal C, and then the stage 12 may be moved to the origin position together with the electronic component W.

[0111] It should be noted that the embodiments and modifications disclosed in this specification are merely illustrative in all respects and should not be construed as limiting. The above-described embodiments and modifications may be omitted, substituted, and modified in various ways without departing from the scope and spirit of the appended claims. For example, the above-described embodiments and modifications may be combined in whole or in part, and embodiments other than those described above may be combined with the above-described embodiments or modifications. Furthermore, the effects of the present disclosure described in this specification are merely illustrative, and other effects may be obtained.

[0112] The technical category that embodies the above technical idea is not limited. For example, the above technical idea may be embodied by a computer program that causes a computer to execute one or more procedures (steps) included in a method of manufacturing or using the above device. The above technical idea may also be embodied by a computer-readable non-transitory recording medium on which such a computer program is recorded. [Explanation of symbols]

[0113] 1 Processing system, 10 Stage unit, 11 Base, 11a Upper base portion, 11b Side base portion, 11c Lower base portion, 11d Drive motor mounting plate, 12 Stage, 13 Stage movement mechanism, 15 Stage X-axis guide unit, 16 Stage Y-axis guide unit, 20 X-axis drive motor, 20a X-axis drive motor body, 21 X-axis movable table, 22 X-axis drive cam, 23 X-axis drive cam follower, 24 X-axis drive spring, 25 Table X-axis guide unit, 30 Y-axis drive motor, 30a Y-axis drive motor body, 31 Y-axis movable table, 32 Y-axis drive cam, 33 Y-axis drive cam follower, 34 Y-axis drive spring, 35 Y-axis guide unit, 37 Movement measurement sensor, 37x X-direction sensor, 37y Y-direction sensor, 41 First stage support portion, 42 Second stage support portion, 43 Stage support extension portion, 45 Previous stage placement unit, 46 placement device, 47 pickup nozzle, 50 control unit, 51 image analysis unit, 52 stage movement calculation unit, 55 imaging device, 56 imaging optical system, 57 lighting device, 61 inspection device, 63 drive motor, 64 motor driver, 65 motor drive unit, 66 motor encoder, 70 θ axis drive motor, 70a θ axis drive motor body, 71 turntable, 72 rotation relay unit, 73 first coupling, 74 second coupling, 75 turn joint shaft, A rotation axis, C measurement movement amount signal, D image data, dX X direction, dY Y direction, dR rotation direction, P1 movement instruction command signal, P2 movement drive signal, St1 previous stage station, St2 imaging station, St3 adjustment station, W electronic component

Claims

1. With the base, a stage on which electronic components can be placed; a stage moving mechanism that moves the stage relative to the base; a movement measurement sensor capable of directly or indirectly measuring the amount of movement of the stage; a control unit that controls the stage moving mechanism based on a movement instruction command signal and moves the stage so as to be positioned at an adjustment position indicated by the movement instruction command signal, the control unit controls the stage movement mechanism based on the amount of movement of the stage indicated by the measurement result of the movement measurement sensor and the adjusted position. Stage unit.

2. the stage moving mechanism has a stage moving body that moves integrally with the stage, the movement measurement sensor measures the movement amount of the stage moving body, thereby indirectly measuring the movement amount of the stage; The stage unit according to claim 1 .

3. the stage moving mechanism is capable of moving the stage two-dimensionally along a plane, the movement measurement sensor includes a first movement measurement sensor capable of measuring the amount of movement of the stage in a first direction along the plane, and a second movement measurement sensor capable of measuring the amount of movement of the stage in a second direction along the plane; The stage unit according to claim 1 .

4. The stage unit according to claim 3 , wherein the stage moving mechanism is capable of rotating the stage about a rotation axis extending in a direction perpendicular to the plane.

5. 2. The stage unit according to claim 1, wherein the stage moving mechanism has a cam and a motor that rotates the cam, and moves the stage based on the rotation of the cam.

6. A stage unit according to any one of claims 1 to 5; a mounting device for mounting an electronic component on the stage; an imaging device that acquires image data of the electronic component before it is placed on the stage, the control unit controls the stage moving mechanism to move the stage to the adjustment position based on the movement instruction command signal obtained as a result of analyzing the image data. Processing system.

Images