Modular combination of endoscope light source and image capture module

Abstract

A modular combination of an endoscope light source and an image capturing module includes a circuit board having a lower plate with a bottom surface having a plurality of bottom electrode pieces and a raised platform with a predetermined height on a top surface of the lower plate, the raised platform having a top end with a plurality of light source electrode pieces electrically connected to the plurality of bottom electrode pieces via a plurality of wires passing through the raised platform and the lower plate, a plurality of light emitting diode chips each covered with a fluorescent glue and fixed on the top surface of the raised platform, an image capturing module having a bottom with a plurality of contacts connected to a plurality of top electrode pieces disposed on the top surface of the lower plate, the image capturing module having a top end higher than a top end of the plurality of light emitting diode chips, and a fixing glue cured and attached to the image capturing module, the raised platform, and the fluorescent glue.

Description

Technical Field

[0001] This invention relates to endoscopes, and in particular to a modular combination of an endoscope light source and an image acquisition module. Background Technology

[0002] Currently, in the field of endoscopy, a metal tube is typically used at the tip of the endoscope, and the image acquisition module and light source combination are installed inside this metal tube. Since the image sensor (commonly using a CCD charge-coupled device) and lens group form an image acquisition module after being combined, while the light-emitting diode (i.e., the light source) is a separately manufactured product composed of a light-emitting diode chip, phosphor, and substrate, the assembly process usually involves mounting the image acquisition module on one circuit board, mounting the light-emitting diode on another circuit board, assembling them together, and finally installing them into the metal tube at the tip of the endoscope.

[0003] To address the aforementioned issues, the applicant in this case applied for Taiwan Patent No. M601086, "Endoscopic Imaging and Light Source Structure." The key technical aspect of this patent is that the image-capturing module and the LED chip are mounted on a single circuit board, and all components are bonded and fixed together using phosphor adhesive to form a unified structure. This reduces the installation steps within the metal tube at the end of the endoscope and achieves a miniaturized overall structure. However, in practical use, it was found that the relative relationship between the light source and the image-capturing module causes shadows to appear in the illuminated area, resulting in poor light pattern. Therefore, the height of the light source needs to be raised to near the front end of the image-capturing module to eliminate shadows and obtain a better light pattern, while also increasing brightness. However, this raises the question of how to elevate the light source while still connecting it to the circuit board below.

[0004] US Patent 9,572,482 discloses an endoscope using a flexible circuit board. While the light source is designed to be closer to the head of the image acquisition module, it primarily uses a U-shaped base frame 20 as the molding base. A flexible circuit board 30 is then placed on this base frame, creating a U-shaped structure. Finally, the image acquisition module is positioned at the bottom of this U-shaped structure. Although this method achieves the effect of bringing the light source closer to the head of the image acquisition module, it lacks a lower circuit board. The main function of the lower circuit board is to provide contacts on its bottom surface for electrical connection to other components, such as the endoscope main unit or operating handle, to achieve operation or control functions. Therefore, US Patent 9,572,482 does not disclose a technology to overcome this problem. Furthermore, the flexible circuit board and the rigid base frame require pre-molding and are difficult to assemble. Summary of the Invention

[0005] The main objective of this invention is to provide a modular combination of an endoscope light source and an image acquisition module. In addition to integrating the circuit board, the light source, and the image acquisition module into a single module, the light source can be raised from the circuit board and placed closer to the top of the image acquisition module, while also being electrically connected to the contacts at the bottom of the circuit board below.

[0006] Based on the above objectives, this invention proposes a modular combination of an endoscope light source and image acquisition module, comprising: a circuit board having a lower plate and a raised platform; the bottom surface of the lower plate having multiple bottom electrode plates, and the top surface of the lower plate defining a main component area and a raised platform area that do not overlap; the raised platform being located on the top surface of the lower plate and within the raised platform area and having a predetermined height; the top surface of the lower plate having multiple top electrode plates located in the main component area; the multiple top electrode plates being electrically connected to the multiple bottom electrode plates; the top of the raised platform having multiple light source electrode plates; the multiple light source electrode plates being electrically connected to the multiple bottom electrode plates via multiple wires passing through the raised platform and the lower plate; and multiple light-emitting diode chips, directly or indirectly disposed on the raised platform. The platform has a top surface that is electrically connected to the multiple light source electrode plates, and each of the light-emitting diode chips is covered with phosphor adhesive and fixed to the top surface of the platform; an image acquisition module has an image sensor and a lens group located above the image sensor, and the bottom of the image sensor has multiple contacts connected to the multiple top electrode plates. The image acquisition module is cylindrical in shape and located in the main component area, and there is a predetermined distance between the image acquisition module and the platform. The top of the lens group is higher than the top of the multiple light-emitting diode chips; and a fixing adhesive is cured and attached to the image acquisition module and the platform, and covers the phosphor adhesive on each light-emitting diode chip. The fixing adhesive fixes the spatial relationship between the image acquisition module, the platform and the multiple light-emitting diode chips.

[0007] With the above structure, the present invention integrates the circuit board, light source, and image acquisition module into a single module using the adhesive. Furthermore, the present invention elevates the multiple LED chips from the lower platen closer to the top of the image acquisition module, while also ensuring that the multiple LED chips can be electrically connected to the bottom electrode plate of the circuit board below, thereby facilitating assembly and connection with other components.

[0008] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the present invention. Attached Figure Description

[0009] Figure 1 This is a combined perspective view of the first preferred embodiment of the present invention, wherein both the fixing adhesive and the phosphor adhesive are shown in a transparent state.

[0010] Figure 2 This is a front view of the first preferred embodiment of the present invention.

[0011] Figure 3 This is a partial perspective view of the components of the first preferred embodiment of the present invention, showing the state after the removal of the fixing adhesive and the phosphor adhesive.

[0012] Figure 4 for Figure 3Exploded view.

[0013] Figure 5 This is an assembly diagram of the first preferred embodiment of the present invention.

[0014] Figure 6 This is a combined perspective view of the second preferred embodiment of the present invention, wherein both the fixing adhesive and the phosphor adhesive are shown in a transparent state.

[0015] Figure 7 This is a partial perspective view of the components of the second preferred embodiment of the present invention, showing the state after the fixative and the phosphor adhesive have been removed.

[0016] Figure 8 for Figure 7 Exploded view.

[0017] Figure 9 This is a top view of the third preferred embodiment of the present invention.

[0018] In the attached figures, the following labels are used:

[0019] 10: Modular combination of endoscope light source and image acquisition module

[0020] 11: Circuit board

[0021] 12: Lower the tablet

[0022] 121: Bottom electrode plate

[0023] 122: Top electrode plate

[0024] 12A: Main Component Area

[0025] 12B: Gaotai District

[0026] 14: Raising platform

[0027] 141: Light source electrode plate

[0028] 149: Conductor

[0029] 15: Another raised platform

[0030] 151: Light source electrode plate

[0031] 21: Light Emitting Diode Chip

[0032] 22: Fluorescent powder adhesive

[0033] 31: Image Capture Module

[0034] 32: Image sensor

[0035] 321: Contact

[0036] 34: Lens Group

[0037] 41: Fixative

[0038] 42: Transparent protective layer

[0039] 99: Metal pipe body

[0040] 10': Modular combination of endoscope light source and image acquisition module

[0041] 14': Raised platform

[0042] 141': Light source electrode plate

[0043] 15': Another raised platform

[0044] 151': Light source electrode plate

[0045] 18': Light Emitting Diode Substrate

[0046] 21': Light Emitting Diode Chip

[0047] 22': Phosphor Gel

[0048] 10”: Modular combination of endoscope light source and image acquisition module

[0049] 12A”: Main component area

[0050] 12B”: Gaotai District

[0051] 14”: Elevated platform

[0052] 21”: Light Emitting Diode Chip

[0053] 31”: Image Capture Module Detailed Implementation

[0054] The structural and working principles of the present invention will be described in detail below with reference to the accompanying drawings:

[0055] like Figures 1 to 5 As shown, a preferred embodiment of the present invention proposes a modular combination 10 of an endoscope light source and image acquisition module, mainly composed of a circuit board 11, multiple light-emitting diode chips 21, an image acquisition module 31, and a fixing adhesive 41, wherein:

[0056] The circuit board 11 includes a lower plate 12 and a raised platform 14. The bottom surface of the lower plate 12 has multiple bottom electrode plates 121, and the top surface of the lower plate 12 defines a main component area 12A and a raised platform area 12B that do not overlap. The raised platform 14 is located on the top surface of the lower plate 12, within the raised platform area 12B, and has a predetermined height. The top surface of the lower plate 12 has multiple top electrode plates 122 located in the main component area 12A. The multiple top electrode plates 122 are electrically connected to the multiple bottom electrode plates 121. The top of the raised platform 14 has multiple light source electrode plates 141, which are electrically connected to the multiple bottom electrode plates 121 by multiple wires 149 passing through the raised platform 14 and the lower plate 12. In this embodiment, the lower plate 12 is a rigid circuit board that cannot be bent.

[0057] In this first embodiment, the elevated area 12B is located on one side of the main component area 12A, while the other side of the main component area 12A includes another elevated area 12B. Within this other elevated area 12B, there is another raised platform 15. The top of this other raised platform 15 is provided with multiple light source electrode plates 151. These multiple light source electrode plates 151 are electrically connected to the multiple bottom electrode plates 121 via multiple wires 149 passing through the other raised platform 15 and the lower plate 12. In actual implementation, the raised platform 14 or the other raised platform 15 can be constructed by stacking one or more layers of rigid circuit boards according to their thickness to form a structure that allows for vertical electrical conduction as needed. This allows for the aforementioned implementation structure where multiple wires 149 pass through the raised platform 14. Furthermore, since the lower plate 12 itself is a rigid circuit board, the wires inside it can form electrodes on the top and bottom surfaces that are connected, which is existing technology. Therefore, the wires of the lower plate 12 itself will not be shown in the diagram in this case to avoid making the diagram too complicated.

[0058] Furthermore, in practice, the lower plate 12, the raised platform 14, and the other raised platform 15 can be a single-piece ceramic substrate, a single-piece three-dimensional circuit board, or a combination of multiple rigid circuit boards stacked together. The circuit boards are joined together by electrode sheets using surface mount technology or soldering technology. That is, the joining technology between the lower plate 12, the raised platform 14, and the other raised platform 15 can be either separate assembly or a single-piece molding.

[0059] The plurality of light-emitting diode chips 21 are disposed on the top surface of the raised platform 14 and electrically connected to the plurality of light source electrode plates 141. Each of the light-emitting diode chips 21 is covered with a phosphor adhesive 22 and fixed to the top surface of the raised platform 14. In addition, the plurality of light-emitting diode chips 21 are also disposed on the top of another raised platform 15 and electrically connected to the plurality of light source electrode plates 151 on the other raised platform 15.

[0060] The image-capturing module 31 includes an image sensor 32 and a lens group 34 located above the image sensor 32. The bottom of the image sensor 32 has multiple contacts 321 connected to multiple top electrode plates 122, which can be connected by soldering in practice. The image-capturing module 31 is cylindrical and located within the main component area 12A, with a predetermined distance between it and the raised platform 14. The top of the lens group 34 is higher than the top of the multiple light-emitting diode chips 21. In actual implementation, the top surface of the multiple light-emitting diode chips 21 is higher than half the height of the image-capturing module 31, preferably two-thirds higher, and closer to the top of the image-capturing module 31 is better.

[0061] The adhesive 41 is cured and adhered to the image acquisition module 31 and the raised platform 14, and covers the phosphor adhesive 22 on each of the LED chips 21. The adhesive 41 fixes the spatial relationship between the image acquisition module 31, the raised platform 14, and the plurality of LED chips 21. The adhesive 41 can be transparent or a material that is not completely transparent but allows light to pass through.

[0062] like Figure 2 As shown, a transparent protective layer 42 can be provided on the top surface of the adhesive 41 as needed. This transparent protective layer 42 can be made of existing known resin materials, providing additional protection for the adhesive 41. However, if the entire invention is housed within the metal tube at the end of the endoscope and has other protective mechanisms, the transparent protective layer 42 may not be required. That is, the invention is not limited to the provision of the transparent protective layer 42 as a patent limitation. Figure 1 The structure of the transparent protective layer 42 is not shown in the figure, but is only indicated by the figure number 42 together with the fixing adhesive 41, so as to avoid the lines being too messy.

[0063] The above describes the structure of this first embodiment. In actual installation, because the adhesive 41 fixes the spatial relationship between the image-capturing module 31, the raised platform 14, and the plurality of LED chips 21, the entire assembly forms a modular component, which can be used as follows: Figure 5 As shown, it is conveniently assembled within the metal tube 99 at the end of the endoscope lens and can function as a single component. The plurality of bottom electrode plates 121 on the bottom surface of the lower plate 12 are used to electrically connect it to other components (such as the endoscope main unit or operating handle) via a circuit (not shown). For ease of illustration, ... Figure 5The lower plate 12 is displayed as a circle to conform to the actual installation state. In addition, the present invention also achieves the result of raising the light source (i.e., the plurality of light-emitting diode chips 21) from the circuit board 11 to be closer to the top of the image-capturing module 31, and can also be electrically connected to the plurality of bottom electrode plates 121 on the bottom surface of the circuit board 11 for connection and control of other components.

[0064] like Figures 6 to 8 As shown, the second preferred embodiment of the present invention proposes a modular combination 10' of an endoscope light source and an image acquisition module, which is generally the same as the first embodiment described above, except that:

[0065] In this second embodiment, two light-emitting diode substrates 18' are further included. In actual implementation, a ceramic substrate is selected. The plurality of light-emitting diode chips 21' are disposed on the two light-emitting diode substrates 18'. The two light-emitting diode substrates 18' are respectively disposed on the top surfaces of the raised platform 14' and the other raised platform 15' and electrically connected to the plurality of light source electrode plates 141' and 151'. The plurality of light-emitting diode chips 21' are thus electrically connected to the plurality of light source electrode plates 141' and 151'. The phosphor adhesive 22' covering each light-emitting diode chip 21' is fixed to the top surface of each light-emitting diode substrate 18'. The light-emitting diode chips 21' are indirectly disposed on the top surfaces of the raised platform 14' and the other raised platform 15'.

[0066] The second embodiment of the present invention uses a two-LED substrate 18' which provides the effect of additionally raising the plurality of LED chips 21'. Moreover, the use of a ceramic substrate makes it convenient to place the plurality of LED chips 21' on the two-LED substrate 18' during manufacturing using a chip-scale package (CSP) process, and to pre-cover each of the phosphor adhesives 22' to facilitate subsequent assembly with the platform 14'.

[0067] The remaining structures and effects of this second embodiment are the same as those of the aforementioned first embodiment, and will not be described again.

[0068] like Figure 9 As shown, the third preferred embodiment of the present invention proposes a modular combination 10” of an endoscope light source and an image acquisition module, which is mainly the same as the aforementioned second embodiment, except that:

[0069] There is only one raised platform 14”, and there is no other raised platform as mentioned above. The raised platform 14” is a hollow annular column surrounding the outside of the main component area 12A”, that is, it also surrounds the periphery of the image acquisition module 31”. The raised platform area 12B” is equivalent to the area covered by the raised platform 14”, and it also surrounds the outside of the main component area 12A”.

[0070] In this third embodiment, the raised platform 14” is different in shape from the two embodiments described above. The surrounding arrangement allows multiple light-emitting diode chips 21” to be arranged in a surrounding manner, thereby making the light source more uniform. The top surface of the raised platform 14” also has a larger setting surface that can accommodate more light-emitting diode chips 21 than in the second embodiment described above.

[0071] The remaining structures and effects of this third embodiment are the same as those of the aforementioned second embodiment, and will not be described again.

[0072] Of course, the present invention may have other various embodiments. Without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and modifications according to the present invention, but these corresponding changes and modifications should all fall within the protection scope of the appended claims.

Claims

1. A modular combination of an endoscope light source and an image acquisition module, characterized in that, Includes: A circuit board has a lower plate and a raised platform. The bottom surface of the lower plate has a plurality of bottom electrode plates, and the top surface of the lower plate defines a main component area and a raised platform area that do not overlap with each other. The raised platform is located on the top surface of the lower plate and within the raised platform area and has a predetermined height. The top surface of the lower plate has a plurality of top electrode plates located in the main component area. The plurality of top electrode plates are electrically connected to the plurality of bottom electrode plates. The top of the raised platform is provided with a plurality of light source electrode plates. The plurality of light source electrode plates are electrically connected to the plurality of bottom electrode plates by means of a plurality of wires passing through the raised platform and the lower plate. Multiple light-emitting diode chips are directly or indirectly disposed on the top surface of the raised platform and electrically connected to the multiple light source electrode plates, and each light-emitting diode chip is covered with phosphor adhesive and fixed to the top surface of the raised platform. An image acquisition module includes an image sensor and a lens assembly located above the image sensor. The image sensor has multiple contacts at its bottom that connect to multiple top electrode plates. The image acquisition module is cylindrical and located within the main component area, with a predetermined distance between the image acquisition module and the raised platform. The top of the lens assembly is higher than the top of the multiple light-emitting diode chips. A fixing adhesive is cured and applied to the imaging module and the raised platform, and covers the phosphor adhesive on each of the light-emitting diode chips. The fixing adhesive fixes the spatial relationship between the imaging module, the raised platform and the multiple light-emitting diode chips.

2. The modular combination of the endoscope light source and image acquisition module as described in claim 1, characterized in that, in: The lower plate is a rigid circuit board that cannot be bent.

3. The modular combination of the endoscope light source and image acquisition module as described in claim 1, characterized in that, in: The top surface of the multiple light-emitting diodes is higher than half the height of the imaging module.

4. The modular combination of the endoscope light source and image acquisition module as described in claim 1, characterized in that, in: The top surface of the multiple light-emitting diodes is higher than two-thirds of the height of the imaging module.

5. The modular combination of the endoscope light source and image acquisition module as described in claim 1, characterized in that, in: The top surface of the adhesive is further provided with a transparent protective layer.

6. The modular combination of the endoscope light source and image acquisition module as described in claim 1, characterized in that, in: The raised platform is a hollow ring-shaped column that surrounds the outside of the main component area.

7. The modular combination of the endoscope light source and image acquisition module as described in claim 1, characterized in that, in: The elevated platform area is located on one side of the main component area, while the other side of the main component area includes another elevated platform area. Another raised platform is provided in the other elevated platform area. Multiple light source electrode plates are provided at the top of the other raised platform. The multiple light source electrode plates are electrically connected to the multiple bottom electrode plates by multiple wires passing through the other raised platform and the lower plate. Multiple light-emitting diode chips are provided on the top of the raised platform and the other raised platform, and are electrically connected to the multiple light source electrode plates.

8. The modular combination of the endoscope light source and image acquisition module as described in claim 1, characterized in that, in: It further includes a light-emitting diode substrate, on which a plurality of light-emitting diode chips are disposed. The light-emitting diode substrate is disposed on the top surface of the raised platform and electrically connected to a plurality of light source electrode sheets. The plurality of light-emitting diode chips are thereby electrically connected to the plurality of light source electrode sheets. The phosphor adhesive covering each of the light-emitting diode chips is fixed to the top surface of the light-emitting diode substrate, and each of the light-emitting diode chips is indirectly disposed on the top surface of the raised platform.

9. The modular combination of the endoscope light source and image acquisition module as described in claim 8, characterized in that, in: The elevated platform area is located on one side of the main component area, while the other side of the main component area includes another elevated platform area. Another raised platform is provided in the other elevated platform area. Multiple light source electrode plates are provided at the top of the other raised platform. The multiple light source electrode plates are electrically connected to the multiple bottom electrode plates by multiple wires passing through the other raised platform and the lower plate. Multiple light-emitting diode substrates are provided at the top of the raised platform and the other raised platform, and are electrically connected to the multiple light source electrode plates.

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