Refurbishment Method for Light-Emitting Chip after Encapsulation with Adhesive and Display Panel

Abstract

The present application provides a method for repairing a light-emitting chip after encapsulation and a display panel. By detecting and obtaining the position of a faulty chip on a substrate, cutting and removing the sealant covering the faulty chip, placing a new light-emitting chip back at the position where the faulty chip was located, and then re-covering and filling the light-emitting chip after replacement with the cut and removed sealant, damage to the sealant can be avoided, thereby reducing the risk of failure of the light-emitting chip and ensuring the optical consistency between the sealant of the light-emitting chip after covering and filling and the uncut sealant around it.

Description

Technical Field

[0001] This application relates to the field of display manufacturing technology, and in particular, to a repair method for a light-emitting chip after encapsulation with glue and a display panel. Background Art

[0002] With the gradual maturity of the micro & mini light-emitting diode (MLED) technology, its main development directions have been divided into two major fields: backlight and direct display. From the perspective of packaging, current MLEDs are also divided into three fields: surface mounted devices (SMD), integrated matrix devices (IMD), and chips on board (COB). Among them, the IMD and COB solutions are widely used in the direct display field. Due to the short process route and low cost, the COB solution has become the mainstream solution for small-size direct displays.

[0003] Since the COB solution uses a process of first placing components and then encapsulating the entire surface, its fault tolerance rate is relatively low. Once an error occurs in the glue encapsulation process, it is almost impossible to perform repair. As the size of the light-emitting chips in direct display products becomes smaller and the number of light-emitting chips on the substrate increases, the expansion and contraction of the glue material during the glue encapsulation process also increase the possibility of light-emitting chip failure. If repair is not possible, it will greatly increase the cost of the surface mounted technology (SMT) section.

[0004] The existing repair machines for after-glue encapsulation on the market are laser repair machines. The glue material at the position of the defective lamp is removed by laser, and then re-injection and curing are carried out. There are two problems with this solution. One is that the laser heating and vaporization temperature will radiate to the surrounding area, resulting in yellowing of the surrounding glue material or damage to the light-emitting chips. The other is that although the same type of glue material is used during this glue encapsulation, there is still optical inconsistency, and at the same time, due to the secondary heating of the substrate, the risk of substrate failure is also increased.

[0005] In summary, there is a problem of light-emitting chip failure caused by high temperature during the existing repair process for a light-emitting chip after glue encapsulation. Therefore, it is necessary to provide a repair method for a light-emitting chip after glue encapsulation to improve this defect. Summary of the Invention

[0006] The embodiment of this application provides a repair method for a light-emitting chip after glue encapsulation, which is used to solve the problem of light-emitting chip failure caused by high temperature during the existing repair process for a light-emitting chip after glue encapsulation.

[0007] An embodiment of the present application provides a method for repairing a light-emitting chip after encapsulation. A substrate is provided with a plurality of light-emitting chips and a sealing glue layer covering the light-emitting chips. The method for repairing the light-emitting chip after encapsulation includes:

[0008] Identify the faulty chips among the light-emitting chips and obtain the positions of the faulty chips on the substrate;

[0009] Cut and remove the sealing glue covering the faulty chips;

[0010] Remove the faulty chips, fill a new light-emitting chip at the positions where the faulty chips are located; and

[0011] Place the cut and removed sealing glue back to the positions where the faulty chips are located and cover the filled light-emitting chips.

[0012] According to an embodiment of the present application, the step of cutting and removing the sealing glue covering the faulty chips includes:

[0013] Cut the sealing glue covering the faulty chips by physical cutting; and

[0014] Remove the cut sealing glue by negative pressure adsorption.

[0015] According to an embodiment of the present application, the step of cutting the sealing glue covering the faulty chips by physical cutting includes:

[0016] Cut the sealing glue covering the faulty chips along the thickness direction of the sealing glue layer with a tool;

[0017] Wherein, the tool includes a hollow structure in the middle and a tool face surrounding the hollow structure.

[0018] According to an embodiment of the present application, the substrate is provided with a plurality of light-emitting units, and each light-emitting unit includes at least two light-emitting chips with different colors. The method for repairing the light-emitting chip after encapsulation includes:

[0019] Cut and remove the sealing glue covering the light-emitting unit where the faulty chips are located; and

[0020] Place the cut and removed sealing glue back to the positions where the faulty chips are located and cover the light-emitting unit where the filled light-emitting chips are located.

[0021] According to an embodiment of the present application, the width of the tool is greater than the width of the light-emitting unit.

[0022] According to an embodiment of the present application, the ratio of the width of the tool to the width of the light-emitting unit is greater than or equal to 1.2.

[0023] According to an embodiment of the present application, the step of placing the sealant to be cut and removed back to the position where the faulty chip is located and covering the light-emitting chip after filling includes:

[0024] Coating a room-temperature binder on the sealant; and

[0025] Placing the sealant back to the position where the faulty chip is located, covering the light-emitting chip after filling, and bonding the sealant to the light-emitting chip and the uncut sealant around it.

[0026] According to an embodiment of the present application, the refractive indices of both the sealant and the room-temperature binder are greater than or equal to 1.5 and less than or equal to 1.7.

[0027] According to an embodiment of the present application, the material of the room-temperature binder includes any one of vinyl acetate, allyl-based, polyurethane, and acrylate materials.

[0028] According to the method for repairing a light-emitting chip after encapsulation provided by an embodiment of the present application, an embodiment of the present application further provides a display panel, which is repaired by using the method for repairing a light-emitting chip after encapsulation as described above.

[0029] Advantages of the embodiments of the present application: The embodiments of the present application provide a method for repairing a light-emitting chip after encapsulation and a display panel. By detecting and obtaining the position of the faulty chip on the substrate, cutting and removing the sealant covering the faulty chip, and after placing a new light-emitting chip back to the position where the faulty chip is located, re-covering the cut and removed sealant on the light-emitting chip after filling, damage to the sealant can be avoided, thereby reducing the risk of light-emitting chip failure and ensuring the optical consistency between the sealant of the light-emitting chip after filling and the uncut sealant around it. Description of the Drawings

[0030] Figure 1 It is a schematic structural diagram of a light-emitting chip after encapsulation provided by an embodiment of the present application;

[0031] Figure 2 It is a flowchart of the method for repairing a light-emitting chip after encapsulation provided by an embodiment of the present application;

[0032] Figures 3a to 3e It is a schematic flow diagram of the first method for repairing a light-emitting chip after encapsulation provided by an embodiment of the present application; and

[0033] Figures 4a to 4eSchematic flowchart of the second method for repairing a packaged light-emitting chip provided by an embodiment of the present application. Detailed implementation manners

[0034] The following descriptions of the embodiments refer to the attached drawings to illustrate specific embodiments in which the present application can be implemented. The directional terms mentioned in the present application, such as [up], [down], [front], [rear], [left], [right], [inside], [outside], [side], etc., are only references to the directions in the attached drawings. Therefore, the directional terms used are for explaining and understanding the present application, rather than for limiting the present application. In the drawings, units with similar structures are denoted by the same reference numerals.

[0035] The present application will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0036] An embodiment of the present application provides a method for repairing a packaged light-emitting chip. As Figure 1 shown, Figure 1 is a schematic structural diagram of a packaged light-emitting chip provided by an embodiment of the present application. A plurality of light-emitting chips 20 and a sealing glue layer 30 covering the light-emitting chips are arranged on a substrate 10.

[0037] The substrate 10 may be an array substrate. The substrate 10 may include a substrate and a thin-film transistor array layer formed on the substrate. A pixel driving circuit for controlling and driving the light-emitting chip 20 to emit light is formed in the thin-film transistor array layer.

[0038] The light-emitting chip 20 may be any one of a micro light-emitting diode (Micro LED) or a mini light-emitting diode (Mini LED). In an embodiment of the present application, the light-emitting chip 20 is a Micro LED. The light-emitting chip 20 may be directly bonded to the substrate 10 and electrically connected to the pixel driving circuit in the substrate 10.

[0039] The light-emitting chip 20 may include a red light-emitting chip 21, a green light-emitting chip 22, and a blue light-emitting chip 23. The red light-emitting chip 21, the green light-emitting chip 22, and the blue light-emitting chip 23 may be arranged on the substrate 10 according to a preset pixel arrangement manner.

[0040] After transferring the light-emitting chip 20 to the substrate 10, the light-emitting chip 20 can be encapsulated by the sealing glue layer 30 through a chips on board (COB) method by whole-surface coating, so as to prevent the light-emitting chip 20 from being damaged by moisture, oxygen, and other external environments.

[0041] Combined withFigure 2 and Figures 3a to 3e as shown Figure 2 is a flowchart of a repair method for a light-emitting chip after encapsulation according to an embodiment of the present application. Figures 3a to 3e is a schematic flow diagram of a first repair method for a light-emitting chip after encapsulation according to an embodiment of the present application. The repair method for the light-emitting chip after encapsulation includes:

[0042] Step S10: Identify the faulty chip in the light-emitting chip 20 and obtain the position of the faulty chip on the substrate 10.

[0043] In the embodiment of the present application, the faulty chip refers to a light-emitting chip 20 that exhibits dead light, dim light, or flickering light. Dead light means that the faulty chip does not emit light, and dim light means that the brightness of the light emitted by the faulty chip is lower than the brightness of the light emitted by other normal working light-emitting chips 20.

[0044] In the step S10, the specific operation of identifying the faulty chip in the light-emitting chip 20 and obtaining the position of the faulty chip on the substrate 10 is as follows:

[0045] Perform a lighting test on the light-emitting chips 20 on the substrate 10 through a detection device. The light-emitting chips 20 on the substrate 10 except for the faulty chip start to work normally, and detect and record the position of the faulty chip and the type of the faulty chip.

[0046] For example, Figure 3a only shows that a red light-emitting chip 21 on the substrate 10 is a faulty chip. When there is one or more faulty chips on the substrate 20, the faulty chip can be any one or more of the red light-emitting chip 21, the green light-emitting chip 22, and the blue light-emitting chip 23.

[0047] Step S20: Cut and remove the sealant covering the faulty chip.

[0048] In the step S20, the step of cutting and removing the sealant covering the faulty chip includes: S201: Cut the sealant 31 covering the faulty chip by means of physical cutting; and S202: Remove the cut sealant 31 by means of negative pressure adsorption.

[0049] In the step S201, the specific operation of cutting the sealant 31 covering the faulty chip by means of physical cutting is as follows:

[0050] Use a tool 40 to cut the sealant 31 covering the faulty chip along the thickness direction of the sealant layer 30.

[0051] Combined with Figure 3a andFigure 3b The tool 40 includes a hollow structure in the middle and a tool face surrounding the hollow structure. The hollow structure is used to accommodate the sealant covering the faulty chip, and the tool face is used to cut the sealant 31.

[0052] In Figure 3a the illustrated embodiment, the tool 40 only cuts the sealant covering the faulty chip, which requires relatively high precision and thickness for the tool 40. The thickness of the tool face of the tool 40 needs to be less than the distance between any two adjacent light-emitting chips 20, and the width of the tool 40 is greater than the width of the light-emitting chip, so as to avoid damaging the faulty chip when the tool 40 cuts the sealant.

[0053] It should be noted that in the embodiment of the present application, Figures 3a to 3e only the repair process of 1 faulty chip is illustrated. In practical applications, multiple tools 40 can be used to cut the encapsulant covering multiple faulty chips simultaneously and repair multiple faulty chips simultaneously. For the cutting and repair processes of other faulty chips, reference can be made to Figures 3a to 3e which will not be elaborated here.

[0054] After cutting the sealant with a tool, the cut sealant needs to be removed from the substrate 10. As Figure 3a shown, an adsorption tool 50 can be used to suck the sealant out of the substrate 10 by negative pressure adsorption.

[0055] The adsorption tool 50 can be communicated with the hollow structure of the tool 40. After the tool 40 finishes cutting the sealant 31, the gas in the hollow structure is extracted through the adsorption tool 50, so that the air pressure in the hollow structure is less than the atmospheric pressure in the external environment, so that the cut sealant 31 can be sucked by the tool 40 and the adsorption tool 50, so as to remove the cut sealant from the substrate 10 without damaging the sealant.

[0056] The pressure of the adsorption tool 50 when adsorbing the sealant 31 can be between 10 and 100 Pa.

[0057] It should be noted that in the embodiment of the present application, using a tool as Figure 3a shown to cut the sealant 31 can avoid damaging other normal light-emitting chips due to the high temperature generated by laser cutting the sealant, thus solving the problem of light-emitting chip failure caused by high temperature during the repair process after the light-emitting chip is encapsulated, and at the same time ensuring that the shape and material of the cut sealant 31 will not be damaged.

[0058] In other embodiments, the tool for cutting the sealant 31 is not limited to Figure 3aFor the type shown, a water jet or other physical cutting method can also be used to cut the sealant, so that no high temperature will be generated, and at the same time, the shape and material of the sealant 31 will not be damaged.

[0059] Step S30: Remove the faulty chip and fill a new light-emitting chip at the position where the faulty chip is located.

[0060] In the said step S30, the specific operation of removing the faulty chip is as follows:

[0061] Scrape the faulty chip clean to form a part to be filled; clean the pads exposed on the part to be filled. Specifically, the faulty chip can be heated by laser to melt the solder paste on the pads of the substrate 10, and the faulty chip can be taken out by a robotic arm, or the faulty chip can also be taken out from the substrate by blowing, so as to form a part to be filled on the substrate 10.

[0062] In the said step S30, the specific operation of filling a new light-emitting chip at the position where the faulty chip is located is as follows:

[0063] Perform crystal filling treatment on the part to be filled. Specifically, perform single-point crystal filling treatment on each part to be filled through a die bonder, and place a normal light-emitting chip on the part to be filled. The color of the light emitted by the normal light-emitting chip is the same as the color of the light emitted by the faulty chip.

[0064] In the said step S30, the specific operation of performing crystal filling treatment on the part to be filled is as follows:

[0065] Dot solder paste into the part to be filled; specifically, dot the solder paste onto the pads of the substrate at the part to be filled through a die bonder, or other types of solder can also be dotted onto the pads of the substrate at the part to be filled according to needs to replace the function of the solder paste;

[0066] Place a normal light-emitting chip on the part to be filled; specifically, a normal light-emitting chip can be placed on the part to be filled through a die bonder;

[0067] First melt and then solidify the solder paste to realize the operation of performing crystal filling treatment on the part to be filled, so that the normal light-emitting chip placed on the part to be filled is firmly attached to the substrate, thus achieving the effect of repairing the light-emitting chip; specifically, the melting operation of the solder paste can be realized by high-temperature heating methods such as reflow soldering, laser soldering or hot air blowing, and the solder paste cools and solidifies after the above operations stop.

[0068] As Figure 3c shown, after removing the faulty chip, move the normal red light-emitting chip 21' into the position where the faulty red light-emitting chip 21 is located, and bind the normal red light-emitting chip 21' to the substrate 10 by the above method.

[0069] Step S40: Place the cut and removed sealant back to the position where the faulty chip is located, and wrap the filled light-emitting chip.

[0070] As Figures 3d to 3e shown, in the step S40, the steps of placing the cut and removed sealant 31 back to the position where the faulty chip is located and wrapping the filled light-emitting chip include:

[0071] Step S401: Coat a room-temperature binder 32 on the sealant 31; and

[0072] Step S402: Place the sealant 31 back to the position where the faulty chip is located, wrap the filled light-emitting chip, and bond the sealant 31 to the light-emitting chip and the uncut sealant around it.

[0073] The refractive indices of both the sealant 31 and the room-temperature binder 32 are greater than or equal to 1.5 and less than or equal to 1.7. Preferably, the refractive indices of the sealant 31 and the room-temperature binder 32 should be the same or similar, so as to reduce the refraction of light at the interface between the sealant layer 30 and the room-temperature binder 32, thereby ensuring the light utilization rate of the display panel. For example, the refractive indices of both the sealant 31 and the room-temperature binder 32 can be 1.5, 1.6, or 1.7, etc. The refractive indices of the sealant 31 and the room-temperature binder 32 can also be different, as long as they are between 1.5 and 1.7, and there is no limitation here.

[0074] Specifically, in the step S401, the material of the room-temperature binder 32 can include any one of vinyl acetate, allyl-based, polyurethane, and acrylate materials. In the embodiments of the present application, the room-temperature binder can be a common interface adhesive, and the material of the common interface adhesive is vinyl acetate. In other embodiments, the room-temperature binder can also be an ultraviolet curable adhesive, and its materials include at least one of allyl-based, polyurethane, and acrylate.

[0075] It should be noted that in the embodiments of the present application, the cut adhesive material is used to wrap the filled light-emitting chip again. Since the shape and material of the cut adhesive material are not damaged, the cut sealant is bonded to the light-emitting chip and the uncut sealant by using a room-temperature binder, which can avoid the thermal expansion caused by heating the adhesive material and the secondary damage to the substrate caused by high temperature. At the same time, it can also ensure that the optical characteristics of the repaired area of the substrate are consistent with those of other unrepaired areas.

[0076] As Figures 4a to 4e shown, Figures 4a to 4eFIG. is a schematic flow chart of a second method for repairing a packaged light-emitting chip provided by an embodiment of the present application. It should be noted that the second method for repairing a packaged light-emitting chip provided by an embodiment of the present application is substantially the same as the first method for repairing a packaged light-emitting chip provided by an embodiment of the present application, and the difference is that:

[0077] As Figure 4a shown, a plurality of light-emitting units EU are provided on the substrate 10, and each light-emitting unit EU includes at least two light-emitting chips 20 with different colors. For example, the light-emitting unit EU may be composed of a red light-emitting chip 21, a green light-emitting chip 22, and a blue light-emitting chip 23. In each light-emitting unit EU, the red light-emitting chip 21, the green light-emitting chip 22, and the blue light-emitting chip 23 may be arranged side by side at intervals, or may be distributed in a triangular or other geometric shape.

[0078] In the step S20, the specific operation of cutting and removing the sealant covering the faulty chip is as follows:

[0079] Cut and remove the sealant 31 covering the light-emitting unit EU where the faulty chip is located.

[0080] For example, as shown in Figure 4a and Figure 4b shown, the light-emitting unit EU where the faulty chip is located includes three light-emitting chips, namely a red light-emitting chip 21, a green light-emitting chip 22, and a blue light-emitting chip 23, and the red light-emitting chip 21 is the faulty chip. When using a tool to cut the sealant 31 covering the faulty chip, the sealant 31 covering the light-emitting unit EU where the faulty chip is located can be cut off, so that the requirements for the accuracy of the tool and the thickness of the tool surface can be reduced, thereby reducing the difficulty of cutting the sealant.

[0081] In the embodiment of the present application, the width of the tool 40 needs to be greater than the width of the light-emitting unit EU.

[0082] Furthermore, the ratio of the width of the tool 40 to the width of the light-emitting unit EU should be greater than or equal to 1.2, so as to avoid damage to the normal light-emitting chips 20 in the light-emitting unit EU during the cutting process. At the same time, the thickness of the tool 40 should be less than the spacing between adjacent light-emitting units EU, so as to avoid damage to the light-emitting chips in adjacent light-emitting units EU during the cutting process.

[0083] Step S30: Remove the faulty chip, and fill a new light-emitting chip at the position where the faulty chip is located.

[0084] In the step S30, the specific operation of removing the faulty chip is as follows:

[0085] Scrape the faulty chip clean to form a part to be repaired; clean the pads exposed on the part to be repaired. Specifically, the faulty chip can be heated by laser to melt the solder paste on the pads of the substrate 10, and the faulty chip can be removed by a robotic arm, or the faulty chip can also be removed from the substrate by blowing air, so as to form a part to be repaired on the substrate 10.

[0086] In the step S30, the specific operation of filling a new light-emitting chip at the position where the faulty chip is located is as follows:

[0087] Perform crystal filling treatment on the part to be repaired. Specifically, perform single-point crystal filling treatment on each part to be repaired through a die bonder, place a normal light-emitting chip on the part to be repaired, and the color of the light emitted by the normal light-emitting chip is the same as the color of the light emitted by the faulty chip.

[0088] In the step S30, the specific operation of performing crystal filling treatment on the part to be repaired is as follows:

[0089] Apply solder paste to the part to be repaired; specifically, apply solder paste to the pads of the substrate at the part to be repaired through a die bonder, or other types of solder can also be applied to the pads of the substrate at the part to be repaired according to needs to replace the function of the solder paste;

[0090] Place a normal light-emitting chip on the part to be repaired; specifically, a normal light-emitting chip can be placed on the part to be repaired through a die bonder;

[0091] Melt the solder paste first and then solidify it to realize the operation of performing crystal filling treatment on the part to be repaired, so that the normal light-emitting chip placed on the part to be repaired is firmly attached to the substrate, thus achieving the effect of repairing the light-emitting chip; specifically, the melting operation of the solder paste can be realized by high-temperature heating methods such as reflow soldering, laser soldering or hot air blowing, and the solder paste cools and solidifies after the above operation stops.

[0092] As Figure 4c shown, after removing the faulty chip, move the normal red light-emitting chip 21' into the position where the faulty red light-emitting chip 21 is located, and bind the normal red light-emitting chip 21' to the substrate 10 by the above method.

[0093] As Figures 4d to 4e shown, in the step S40, the specific operation of placing the cut and removed sealant back to the position where the faulty chip is located and covering the filled light-emitting chip is as follows:

[0094] Place the cut and removed sealant back to the position where the faulty chip is located, and cover the light-emitting unit EU where the filled light-emitting chip is located.

[0095] As Figure 4dAs shown, a room-temperature adhesive is coated on the surface of the cut sealant in contact with the light-emitting chip and the surface in contact with the adjacent uncut sealant, and the cut sealant is bonded to the light-emitting chip and the uncut sealant by using the room-temperature adhesive.

[0096] According to the method for repairing a light-emitting chip after encapsulation provided by the embodiments of the present application, the embodiments of the present application further provide a display panel. The display panel is obtained by repairing through the method for repairing a light-emitting chip after encapsulation provided by the above embodiments. The structure of the display panel can be referred to Figure 4e As shown, by repairing the display panel through the repairing method provided by the above embodiments, damage to the sealant covering the faulty chip can be avoided. The sealant covering the faulty chip is used to seal the normal light-emitting chip after filling, which can ensure the optical consistency between the repaired area and the unrepaired area in the display panel.

[0097] The embodiments of the present application provide a method for repairing a light-emitting chip after encapsulation and a display panel. By detecting and obtaining the position of the faulty chip on the substrate, the sealant covering the faulty chip is cut and removed. After placing a new light-emitting chip back at the position where the faulty chip was located, the cut and removed sealant is re-covered on the light-emitting chip after filling, so as to avoid damaging the sealant, thereby reducing the risk of light-emitting chip failure and ensuring the optical consistency between the sealant covering the filled light-emitting chip and the surrounding uncut sealant.

[0098] In summary, although the present application is disclosed above with preferred embodiments, the above preferred embodiments are not intended to limit the present application. Those of ordinary skill in the art can make various changes and modifications without departing from the spirit and scope of the present application. Therefore, the protection scope of the present application is based on the scope defined by the claims.

Claims

1. A method for repairing a light-emitting chip after encapsulation with glue, characterized in that A plurality of light-emitting chips are provided on a substrate, and a sealant layer covering the light-emitting chips. The repair method after encapsulating the light-emitting chips includes: Identifying a faulty chip among the light-emitting chips and obtaining the position of the faulty chip on the substrate; Cutting and removing the sealant covering the faulty chip; Removing the faulty chip and filling a new light-emitting chip at the position where the faulty chip is located; and Placing the cut and removed sealant back at the position where the faulty chip is located and covering the filled light-emitting chip; Wherein the step of placing the cut and removed sealant back at the position where the faulty chip is located and covering the filled light-emitting chip includes: Coating a room-temperature binder on the sealant; and Placing the sealant back at the position where the faulty chip is located, covering the filled light-emitting chip, and bonding the sealant to the light-emitting chip and the uncut sealant around it; Wherein the refractive index of the sealant is the same as that of the room-temperature binder.

2. The repair method for the light-emitting chip after encapsulation as described in claim 1, characterized in that The step of cutting and removing the sealant covering the faulty chip includes: Cutting the sealant covering the faulty chip by a physical cutting method; and Removing the cut sealant by a negative pressure adsorption method.

3. The repair method for the encapsulated light-emitting chip according to claim 2, characterized in that, The step of cutting the sealant covering the faulty chip by a physical cutting method includes: Cutting the sealant covering the faulty chip along the thickness direction of the sealant layer with a tool; Wherein the tool includes a hollow structure in the middle and a tool face surrounding the hollow structure.

4. The repair method for the encapsulated light-emitting chip according to claim 3, wherein, A plurality of light-emitting units are provided on the substrate, and each light-emitting unit includes at least two light-emitting chips with different colors. The repair method after encapsulating the light-emitting chips includes: Cutting and removing the sealant covering the light-emitting unit where the faulty chip is located; and Placing the cut and removed sealant back at the position where the faulty chip is located and covering the light-emitting unit where the filled light-emitting chip is located.

5. The repair method for the light-emitting chip after encapsulation with glue according to claim 4, wherein, The width of the tool is greater than the width of the light-emitting unit.

6. The repair method for the light-emitting chip after encapsulation with adhesive as claimed in claim 5, wherein, The ratio of the width of the tool to the width of the light-emitting unit is greater than or equal to 1.

2.

7. The repair method for the light-emitting chip after encapsulation as described in claim 1, characterized in that, The refractive indices of the sealant and the room-temperature binder are both greater than or equal to 1.5 and less than or equal to 1.

7.

8. The repair method after encapsulating the light-emitting chip as described in claim 1, characterized in that, The material of the room-temperature binder includes any one of vinyl acetate, allyl-based, polyurethane, and acrylate materials.

9. A display panel, characterized in that, Obtained by repairing using the repair method after encapsulating the light-emitting chips as described in any one of claims 1 to 8.

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