Display module and display device

Abstract

The present invention provides a display module and a display device, wherein the display module comprises: a display panel, a heat dissipation structure located on the side of the display panel away from the light-emitting surface, a main flexible circuit board located on the side of the heat dissipation structure away from the light-emitting surface, and a driving chip with a certain distance between the main flexible circuit board and the main flexible circuit board, wherein the main flexible circuit board comprises a first protective layer, a first metal layer, an insulating layer, a second metal layer, and a second protective layer stacked in sequence; the main flexible circuit board comprises a copper leakage area and a non-copper leakage area surrounding the copper leakage area, and a spacing area is provided between the copper leakage area and the non-copper leakage area of ​​the first metal layer, for preventing static electricity from being transmitted to the driving chip. The display module provided by the embodiment of the present invention can prevent static electricity from being discharged from the external environment from directly entering the driving chip by setting a spacing area in the metal layer of the main flexible circuit board, thereby preventing display abnormality or damage to the driving chip.

Description

Technical Field

[0001] The present invention relates to the field of display technologies, and particularly to a display module and a display device. Background Art

[0002] In the field of OLED (Organic Light-Emitting Diode) displays, electrostatic discharge (ESD) in the external environment is ubiquitous, and all electronic products need to consider ESD protection design solutions. In a highly competitive market environment, everyone is considering enhancing product competitiveness, and among them, reducing production costs is crucial. Therefore, in the OLED field, reducing the lamination of the main flexible printed circuit (MFPC) is a trend. In related technologies, the MFPC generally adopts a two-layer board design, which results in the grounding point and the bonding layer being on the same layer, and the ESD release path is very short, making it easy to conduct into the drive integrated circuit (Drive-IC), resulting in abnormal display. Summary of the Invention

[0003] Embodiments of the present invention provide a display module and a display device, which can prevent electrostatic discharge from the external environment from directly entering the drive chip, and solve the problems of abnormal display or damage to the drive chip.

[0004] In a first aspect of the present invention, a display module is provided, including:

[0005] A display panel, the display panel includes a display area and a bonding area located on one side of the display area, the bonding area is bent toward a side away from the light-emitting surface of the display panel, and the bonding area includes: a first part connected to the display area, a second part opposite to the first part, and a bent part connecting the first part and the second part;

[0006] A heat dissipation structure, located on a side of the display panel away from the light-emitting surface;

[0007] A main flexible printed circuit board, located on a side of the heat dissipation structure away from the light-emitting surface and connected to the second part;

[0008] A drive chip, located on a side of the second part away from the light-emitting surface and having a certain distance from the main flexible printed circuit board; wherein,

[0009] The main flexible circuit board includes a first protective layer, a first metal layer, an insulating layer, a second metal layer, and a second protective layer stacked in sequence, and the first protective layer is connected to the second part of the display panel;

[0010] The main flexible circuit board includes a copper leakage area and a non-copper leakage area surrounding the copper leakage area. A spacing area is provided between the copper leakage area and the non-copper leakage area of ​​the first metal layer for preventing static electricity from being transmitted to the driving chip.

[0011] Optionally, the display module also includes at least one blind hole, and in the copper leakage area, the at least one blind hole extends from a side of the second metal layer close to the second protective layer to the first metal layer, and the depth of the at least one blind hole is greater than the thickness of the second metal layer and less than or equal to the sum of the thicknesses of the second metal layer, the insulating layer and the first metal layer.

[0012] Optionally, a tip discharge structure is provided at one end of the first metal layer.

[0013] Optionally, the tip discharge structure includes a lead and a tip discharge portion, the tip discharge portion is connected to the first metal layer through the lead, the tip discharge portion includes a main body and a tip extending from the main body, the tip is connected to the main body in a straight line, a bent line or a winding, and the lead intersects with the tip.

[0014] Optionally, the heat dissipation structure includes, in sequence, a first adhesive layer, a foam layer and a third metal layer on a side of the display panel away from the light emitting surface.

[0015] Optionally, the display module further includes: a second adhesive layer for bonding the first protective layer and the third metal layer.

[0016] Optionally, the display module further includes: a conductive structure for coupling the third metal layer and the first metal layer through the copper leakage area of ​​the first protective layer.

[0017] Optionally, the material of the insulating layer includes: polyimide.

[0018] Optionally, the material of the first metal layer includes: copper and aluminum;

[0019] The first metal layer, the second metal layer and the third metal layer are made of the same material.

[0020] A second aspect of the present invention provides a display device, comprising the above-mentioned display module.

[0021] The embodiments of the present invention have the following beneficial effects:

[0022] The display module provided by the embodiment of the present invention can prevent the electrostatic discharge in the external environment from directly entering the driving chip by setting an interval area on the metal layer of the main flexible circuit board, thereby preventing display abnormalities or damage to the driving chip. Description of the Drawings

[0023] Figure 1 Schematic diagram of the electrostatic discharge path of the display module in the related art;

[0024] Figure 2 Schematic diagram of the electrostatic discharge path of the first display module provided by the embodiment of the present invention;

[0025] Figure 3 Schematic diagram of the electrostatic discharge path of the second display module provided by the embodiment of the present invention;

[0026] Figure 4 Top view of the main flexible circuit board of the second display module provided by the embodiment of the present invention;

[0027] Figures 4A - 4E Schematic diagrams of the first protective layer, the first metal layer, the insulating layer, the second metal layer, and the second protective layer of the grounding structure of the main flexible circuit board of the second display module provided by the embodiment of the present invention, respectively;

[0028] Figure 5 Schematic diagram of the electrostatic discharge path of the third display module provided by the embodiment of the present invention;

[0029] Figure 6 Top view of the main flexible circuit board of the third display module provided by the embodiment of the present invention;

[0030] Figures 6A - 6E Schematic diagrams of the first protective layer, the first metal layer, the insulating layer, the second metal layer, and the second protective layer of the grounding structure of the main flexible circuit board of the third display module provided by the embodiment of the present invention, respectively;

[0031] Figure 7A The first tip discharge structure diagram of the display module provided by the embodiment of the present invention;

[0032] Figure 7B The second tip discharge structure diagram of the display module provided by the embodiment of the present invention;

[0033] Figure 7C The third tip discharge structure diagram of the display module provided by the embodiment of the present invention;

[0034] Figures 8A - 8E Schematic diagrams of the first protective layer, the first metal layer, the insulating layer, the second metal layer, and the second protective layer of the grounding structure of the main flexible circuit board of the fourth display module provided by the embodiment of the present invention, respectively.

[0035] Reference numerals

[0036] C - Copper leakage area; D - Spacing area

[0037] 1 - Display panel

[0038] 2 - Heat dissipation structure; 21 - First adhesive layer; 22 - Third metal layer

[0039] 3 - Driver chip

[0040] 4 - Grounding structure; 41 - First protective layer; 42 - First metal layer; 43 - Insulating layer; 44 - Second metal layer; 45 - Second protective layer

[0041] 5 - Conductive structure

[0042] 61 - First via hole; 62 - Blind hole

[0043] 7 - Second adhesive layer

[0044] 8 - Corona discharge structure; 81 - Lead; 82 - Corona discharge part; 821 - Body; 822 - Tip

[0045] 9 - Connector Detailed implementation manners

[0046] In order to make the technical problems, technical solutions and advantages to be solved by the embodiments of the present invention clearer, the following will be described in detail with reference to the drawings and specific embodiments.

[0047] When the OLED display screen comes into contact and friction with the outside world, or in dry air, or in contact with the human body, electrostatic discharge (ESD) may occur.

[0048] Figure 1 As shown in the schematic diagram of the electrostatic discharge path of the display module in the related art, Figure 1 as shown, the display module in the related art includes:

[0049] A display panel 1, the display panel 1 includes a display area (Active Area, AA) and a bonding area (Bonding Area, BA) located on one side of the display area, the bonding area is bent toward the side away from the light-emitting surface of the display panel 1, and the bonding area includes: a first part connected to the display area, a second part opposite to the first part, and a bent part connecting the first part and the second part;

[0050] A heat dissipation structure 2, located on the side of the display panel 1 away from the light-emitting surface;

[0051] A main flexible printed circuit board, located on the side of the heat dissipation structure 2 away from the light-emitting surface and connected to the second part;

[0052] A driving chip 3 is located on one side of the second part facing away from the light-emitting surface, and there is a certain distance between the driving chip 3 and the main flexible printed circuit board.

[0053] The main flexible printed circuit board 4 includes a first protective layer 41, a first metal layer 42, an insulating layer 43, a second metal layer 44, and a second protective layer 45 stacked in sequence. The first protective layer 41 is connected to the second part of the display panel 1. Among them, a first via 61 is provided in the insulating layer 43 located between the first metal layer 42 and the second metal layer 44, and the via 61 is filled with metal to realize the electrical connection between the first metal layer 42 and the second metal layer 44.

[0054] Among them, the heat dissipation structure 2 on the side of the display panel 1 facing away from the light-emitting surface sequentially includes: a first adhesive layer 21, a foam layer (not shown in the figure), and a third metal layer 23.

[0055] Among them, the display module further includes: a conductive structure 5 for coupling the third metal layer 22 and the first metal layer 42 through the exposed copper area C of the first protective layer 41. The conductive structure 5 is conductive adhesive.

[0056] There is a second adhesive layer 7 between the first protective layer 41 and the third metal layer 23. The second adhesive layer 7 is non-conductive and is made of PET double-sided adhesive material.

[0057] As Figure 1 shown, external static electricity is transmitted to the first metal layer 42 through the conductive adhesive via the third metal layer 22 of the heat dissipation structure. The first metal layer 42 is coupled to the display panel 1, and the display panel 1 is coupled to the driving chip 3, resulting in the transmission of static electricity to the driving chip, and further resulting in abnormal display.

[0058] An embodiment of the present invention provides a display module and a display device, which can prevent external environmental static electricity from directly entering the driving chip and solve the problems of abnormal display or damage to the driving chip.

[0059] The display module provided by the embodiment of the present invention includes:

[0060] A display panel, the display panel includes a display area and a bonding area located on one side of the display area. The bonding area is bent toward the side facing away from the light-emitting surface of the display panel. The bonding area includes: a first part connected to the display area, a second part opposite to the first part, and a bent part connecting the first part and the second part;

[0061] A heat dissipation structure, located on the side of the display panel facing away from the light-emitting surface;

[0062] A main flexible circuit board, located on a side of the heat dissipation structure away from the light emitting surface, and connected to the second portion;

[0063] The driving chip is located on a side of the second part away from the light emitting surface and has a certain distance from the main flexible circuit board; characterized in that:

[0064] The main flexible circuit board includes a first protective layer, a first metal layer, an insulating layer, a second metal layer, and a second protective layer stacked in sequence, and the first protective layer is connected to the second part of the display panel;

[0065] The main flexible circuit board includes a copper leakage area and a non-copper leakage area surrounding the copper leakage area. A spacing area is provided between the copper leakage area and the non-copper leakage area of ​​the first metal layer for preventing static electricity from being transmitted to the driving chip.

[0066] Figure 2 A schematic diagram of an electrostatic discharge path of a first display module provided by an embodiment of the present invention; Figure 3 As shown, the display module provided by the embodiment of the present invention includes: a display panel 1, a heat dissipation structure 2, a main flexible circuit board 4, and a driving chip 3.

[0067] The display panel 1 includes a display area (Active Area, AA) and a binding area (Bonding Area, BA) located on one side of the display area, the binding area is bent toward a side away from the light-emitting surface of the display panel 1, and the binding area includes: a first part connected to the display area, a second part opposite to the first part, and a bent part connecting the first part and the second part. In the binding area, the signal routing in the display area AA is connected to the driver chip 3.

[0068] The heat dissipation structure 2 is located on a side of the display panel 1 away from the light emitting surface.

[0069] The main flexible circuit board is located on a side of the heat dissipation structure 2 away from the light emitting surface, and is connected to the second portion 2 .

[0070] The driver chip 3 is located on the side of the second part away from the light emitting surface, and has a certain distance from the main flexible circuit board. The driver chip 3 can be a source driver chip. In other embodiments, the driver chip 3 can be a gate driver chip, or an integrated chip of the source driver chip and the gate driver chip.

[0071] The main flexible circuit board 4 includes a first protective layer 41 , a first metal layer 42 , an insulating layer 43 , a second metal layer 44 , and a second protective layer 45 stacked in sequence, and the first protective layer 41 is connected to the second portion 12 of the display panel 1 .

[0072] The main flexible printed circuit board includes a copper exposed area C and a non - copper - exposed area surrounding the copper exposed area. There is a spacing area D between the copper exposed area C and the non - copper - exposed area of the first metal layer 42, which is used to prevent static electricity from being transmitted to the driving chip.

[0073] By having a spacing area D between the copper exposed area C and the non - copper - exposed area of the first metal layer 42, when ESD occurs, static electricity cannot be directly released towards the driving chip; it can only be released in the opposite direction of the driving chip, leading the ESD out of the MFPC or reducing its impact.

[0074] Among them, the first protective layer 41 includes a covering layer and an electromagnetic shielding layer. The covering layer is made of PI material and a colloid. Among them, the second protective layer 45 includes a covering layer and an electromagnetic shielding layer. The covering layer is made of PI material and a colloid.

[0075] Optionally, the material of the insulating layer includes: polyimide.

[0076] Among them, polyimide has good heat resistance, moisture resistance, and insulation.

[0077] Optionally, the material of the first metal layer includes: copper and aluminum; the materials of the first metal layer, the second metal layer, and the third metal layer are the same. Specifically, the first metal layer and the second metal layer can be copper foil or aluminum foil. Among them, the first metal layer and the second metal layer are entirely copper - plated or entirely aluminum - plated.

[0078] Among them, copper and aluminum have good electrical conductivity.

[0079] Optionally, on the side of the display panel facing away from the light - emitting surface, the heat - dissipation structure sequentially includes: an adhesive layer, a foam layer, and a third metal layer, and the third metal layer is adjacent to the first protective layer of the grounding structure.

[0080] Among them, the adhesive layer 31 is a grid adhesive, which can fit for exhaust and has flexibility, without affecting the flexible design of the display module.

[0081] Among them, the foam layer 32 can be foam, which can not only play a buffering role but also play a light - shielding role.

[0082] Among them, the material of the third metal layer can be one of copper and aluminum or its alloy structure, which plays a heat - dissipation role. Specifically, the third metal layer can be copper foil or aluminum foil.

[0083] As Figure 2 shown, among them, on the side of the display panel 1 facing away from the light - emitting surface, the heat - dissipation structure 2 sequentially includes: a first adhesive layer 21, a foam layer (not shown in the figure), and a third metal layer 22.

[0084] Optionally, the display module further includes: a conductive structure for coupling the third metal layer and the first metal layer through the exposed copper region of the first protective layer.

[0085] By removing the covering layer and the electromagnetic shielding layer of the first protective layer in the exposed copper region and coupling the third metal layer and the first metal layer through the exposed copper region, an electrostatic discharge path can be formed.

[0086] It should be noted that the present application does not limit the shape, number, and position of the conductive region.

[0087] Optionally, the display module further includes at least one blind hole. In the exposed copper region, the at least one blind hole extends from the side of the second metal layer close to the second protective layer to the first metal layer, and the depth of the at least one blind hole is greater than the thickness of the second metal layer and less than or equal to the sum of the thicknesses of the second metal layer, the insulating layer, and the first metal layer.

[0088] In the embodiment of the present invention, by providing at least one blind hole and making the at least one blind hole extend from the side of the second metal layer close to the second protective layer to the first metal layer, two-direction electrostatic discharge paths can be formed on the second metal layer 44.

[0089] Optionally, a tip discharge structure is provided at one end of the first metal layer.

[0090] By providing a tip discharge structure at one end of the first metal layer, it is convenient for electrostatic discharge. Because the curvature of the tip is larger, under the same potential difference, the electric field intensity is greater, and it is easier to generate a discharge phenomenon.

[0091] Since the electric field generated during tip discharge is strong, the tip is connected to the body in a straight line, bent line, or winding manner, which can increase the impedance of the tip discharge part and weaken the electric field intensity.

[0092] Figure 7A This is the first tip discharge structure diagram of the display module provided by the embodiment of the present invention; the tip discharge part 82 includes a body 821 and a tip 822 extending from the body, and the tip 822 is connected to the body 821 in a straight line. Among them, the body 821 corresponds to the exposed copper region.

[0093] Figure 7B This is the first tip discharge structure diagram of the display module provided by the embodiment of the present invention; the tip discharge part 82 includes a body 821 and a tip 822 extending from the body, and the tip 822 is connected to the body 821 in a broken line manner. Among them, the body 821 corresponds to the exposed copper region.

[0094] Figure 7CThe first tip discharge structure diagram of the display module provided by the embodiment of the present invention; the tip discharge part 82 includes a body 821 and a tip 822 extending from the body, and the tip 822 is connected to the body 821 in a winding manner. Among them, the body 821 corresponds to the copper leakage area.

[0095] Optionally, the display module further includes: a second adhesive layer for bonding the first protective layer and the third metal layer.

[0096] The display module provided by the embodiment of the present invention includes a second adhesive layer, which is not only used to bond the first protective layer and the third metal layer, but also can play a supporting role between the first protective layer and the third metal layer.

[0097] Figure 3 The schematic diagram of the electrostatic discharge path of the second display module provided by the embodiment of the present invention; different from Figure 2 is that the spaced area of the first metal layer not only cuts off the first metal layer in the direction towards the driving chip, but also cuts off the first metal layer in the direction away from the driving chip.

[0098] It should be noted that the spaced area can block the conduction path between the copper foils. However, since the first protective layer will be attached externally and the material of the first protective layer is soft, the step difference of the cut-off structure will be filled after attachment. Therefore, the position of the spaced area will be filled by the first protective layer.

[0099] Figure 4 The top view of the main flexible printed circuit board of the second display module provided by the embodiment of the present invention. Figure 4 The direction of the shown top view is from the first protective layer 41 to the second protective layer 45. As Figure 4 shown, the main flexible printed circuit board 4 includes a connector 9. Among them, during the process of guiding the ESD electrostatic conduction path to the connector 9 for transmission, static electricity will have losses. The copper leakage area C and the blind hole 62 can be seen from the top view.

[0100] Figures 4A - 4E They are respectively the schematic diagrams of the first protective layer, the first metal layer, the insulating layer, the second metal layer and the second protective layer of the grounding structure of the main flexible printed circuit board of the second display module provided by the embodiment of the present invention. Among them, Figure 4A the shown first protective layer 41 includes a copper leakage area C. Figure 4B There is a spaced area D between the copper leakage area and the non-copper leakage area of the shown first metal layer 42, and the blind hole 62 penetrates through the first metal layer. Figure 4C The insulating layer 43 shown has a first via 61. There is a thin copper layer (not shown) between the first via 61 and the blind hole 62. The diameter of the first via 61 is larger than the diameter of the blind hole 62. Figure 4DThere is a spaced area D between the copper leakage area and the non - copper leakage area of the second metal layer 44 shown, and the blind via 62 penetrates through the second metal layer. Figure 4E The second protective layer 45 shown includes a copper leakage area C.

[0101] Figure 5 It is a schematic diagram of the electrostatic discharge path of the third display module provided by the embodiment of the present invention; Figure 5 Different from Figure 2 and Figure 3 is that Figure 5 the blind via 62 is not provided.

[0102] Figure 6 It is a top - view diagram of the main flexible printed circuit board of the third display module provided by the embodiment of the present invention. Figure 6 The direction of the top - view diagram shown is from the first protective layer 41 to the second protective layer 45. As Figure 6 shown, the main flexible printed circuit board 4 includes a connector 9. Among them, during the process of the ESD electrostatic conduction path guiding to the connector 9 for transmission, static electricity will have losses. The copper leakage area C can be seen from the top - view diagram.

[0103] Figures 6A - 6E They are respectively schematic diagrams of the first protective layer, the first metal layer, the insulating layer, the second metal layer, and the second protective layer of the grounding structure of the main flexible printed circuit board of the second display module provided by the embodiment of the present invention. Among them, Figure 6A The first protective layer 41 shown includes a copper leakage area C. Figure 6B The first metal layer 42 shown has a tip - discharge structure 8. Combining Figures 7A - 7C , the tip - discharge structure 8 includes a lead 81 and a tip - discharge part 82. The tip - discharge part 82 is connected to the first metal layer 42 through the lead 81. The tip - discharge part 82 includes a body 821 and a tip 822 extending from the body. The tip 822 is connected to the body 821 in a straight - line, bent - line, or winding manner, and the lead 81 intersects with the tip 822. Figure 6C The insulating layer 43 shown does not have a first via hole opened in the copper leakage area. However, it should be noted that: other parts of the insulating layer are provided with first via holes for making the circuit between the first metal layer and the second metal layer conductive. Figure 4D The second metal layer 44 shown does not have a blind via 62 opened in the copper leakage area. Figure 6E The second protective layer 45 shown includes a copper leakage area C.

[0104] Figures 8A - 8E They are respectively schematic diagrams of the first protective layer, the first metal layer, the insulating layer, the second metal layer, and the second protective layer of the grounding structure of the main flexible printed circuit board of the fourth display module provided by the embodiment of the present invention.

[0105] The fourth display module combines two ways of guiding static electricity, namely, opening blind holes and setting tip discharge. Figure 8A has the same structure as Figure 6A ; Figure 8B is the same as Figure 6B ; Figure 8C is the same as Figure 6C ; Figure 8D is the same as Figure 4B ; Figure 8E is the same as Figure 6E ;

[0106] Among them, taking the first metal layer as copper foil and the first metal layer being realized by copper plating process as an example. The first metal layer includes a copper leakage area and a non - copper leakage area.

[0107] When performing the copper plating process of the first metal layer, for the copper leakage area and the non - copper leakage area, a separate copper plating process is adopted; at the same time, it is required that at the junction of the two areas, the copper cannot overlap each other and a certain distance needs to be left. This distance needs to ensure that no electrical path is formed between the copper foils, so as to achieve that the current cannot conduct between the copper foils of the two areas; the number of copper leakage areas is not limited and is determined according to the actual situation.

[0108] After realizing the copper plating isolation between the copper leakage area and the non - copper leakage area, in the form of blind holes, the copper plating of the copper leakage area is connected to the copper plating of the second metal layer to form a path, and the static electricity is conducted from the copper plating of the copper leakage area to the second metal layer, so as to realize guiding the static electricity to the far - end side of the driving chip.

[0109] The embodiments of the present invention do not limit the position, number, and shape of the blind holes.

[0110] The embodiments of the present invention do not limit the main flexible circuit board to be a multi - layer board, and it is applicable to double - layer boards, multi - layer boards, and other circuit boards.

[0111] The embodiments of the present invention also provide a display device, including the above - mentioned display module.

[0112] The display device includes but is not limited to: a radio frequency unit, a network module, an audio output unit, an input unit, a sensor, a display unit, a user input unit, an interface unit, a memory, a processor, and a power supply, etc. Those skilled in the art can understand that the structure of the above - mentioned display device does not constitute a limitation on the display device. The display device may include more or fewer of the above - mentioned components, or combine some components, or have different component arrangements. In the embodiments of the present invention, the display device includes but is not limited to a display, a mobile phone, a tablet computer, a television, a wearable electronic device, a navigation display device, etc.

[0113] The display device may be: a television, a display, a digital photo frame, a mobile phone, a tablet computer, or any product or component with a display function.

[0114] In the method embodiments of the present invention, the sequence numbers of the steps do not limit the order of the steps. For those of ordinary skill in the art, without creative efforts, the changes in the order of the steps are also within the protection scope of the present invention.

[0115] It should be noted that the embodiments in this specification are all described in a progressive manner. For the same or similar parts among the embodiments, reference can be made to each other. Each embodiment focuses on the differences from other embodiments. In particular, for the [specific embodiment] (it seems there is a missing word here, assuming it's a certain type of embodiment), since it is basically similar to the product embodiment, the description is relatively simple. For the relevant parts, reference can be made to the description of the product embodiment.

[0116] Unless otherwise defined, the technical terms or scientific terms used in this disclosure should have the ordinary meaning understood by those of ordinary skill in the art to which this disclosure belongs. The "first", "second" and similar terms used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. The terms such as "comprising" or "including" mean that the elements or objects appearing before this word cover the elements or objects listed after this word and their equivalents, without excluding other elements or objects. The terms such as "connected" or "coupled" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. The terms such as "upper", "lower", "left", "right" are only used to represent relative position relationships. When the absolute position of the object being described changes, the relative position relationship may also change accordingly.

[0117] It can be understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "under" another element, the element can be "directly" on or under the other element, or there may be intermediate elements.

[0118] In the description of the above embodiments, the specific features, structures, materials or characteristics can be combined in a suitable manner in any one or more embodiments or examples.

[0119] As mentioned above, the above are only the specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present disclosure can easily think of changes or substitutions, which should all be covered by the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be subject to the protection scope of the claims.

Claims

1. A display module, comprising: A display panel, the display panel comprising a display area and a binding area located at one side of the display area, the binding area being bent toward a side away from a light emitting surface of the display panel, the binding area comprising: a first portion connected to the display area, a second portion opposite to the first portion, and a bent portion connecting the first portion and the second portion; A heat dissipation structure, located on a side of the display panel away from the light emitting surface; A main flexible circuit board, located on a side of the heat dissipation structure away from the light emitting surface, and connected to the second portion; The driving chip is located on a side of the second part away from the light emitting surface and has a certain distance from the main flexible circuit board; characterized in that: The main flexible circuit board includes a first protective layer, a first metal layer, an insulating layer, a second metal layer, and a second protective layer stacked in sequence, and the first protective layer is connected to the second part of the display panel; The main flexible circuit board includes a copper leakage area and a non-copper leakage area surrounding the copper leakage area, and a spacing area is provided between the copper leakage area and the non-copper leakage area of ​​the first metal layer for preventing static electricity from being transmitted to the driving chip; The display module also includes at least one blind hole. In the copper leakage area, the at least one blind hole extends from a side of the second metal layer close to the second protective layer to the first metal layer, and the depth of the at least one blind hole is greater than the thickness of the second metal layer and less than or equal to the sum of the thicknesses of the second metal layer, the insulating layer and the first metal layer.

2. The display module according to claim 1, wherein A tip discharge structure is disposed at one end of the first metal layer.

3. The display module according to claim 2, wherein The tip discharge structure includes a lead and a tip discharge portion, the tip discharge portion is connected to the first metal layer through the lead, the tip discharge portion includes a main body and a tip extending from the main body, the tip is connected to the main body in a straight line, a bent line or a winding, and the lead intersects with the tip.

4. The display module according to claim 1, wherein The heat dissipation structure comprises, in sequence, a first adhesive layer, a foam layer and a third metal layer on a side of the display panel away from the light emitting surface.

5. The display module according to claim 4, wherein Also includes: A second bonding layer is used for bonding the first protective layer and the third metal layer.

6. The display module according to claim 4, wherein Also includes: The conductive structure is used to couple the third metal layer and the first metal layer through the copper leakage area of ​​the first protection layer.

7. The display module according to claim 1, wherein The material of the insulating layer includes: polyimide.

8. The display module according to claim 4, wherein The material of the first metal layer includes: copper and aluminum; The first metal layer, the second metal layer and the third metal layer are made of the same material.

9. A display device, characterized in that, Comprising the display module as described in any one of claims 1 to 8.

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