Electronic device comprising a glass-ceramic component

Abstract

This disclosure relates to electronic devices including glass-ceramic components. A glass-ceramic component for an electronic device is disclosed, such as a component comprising a glass-ceramic material. A cover member comprising a glass-ceramic material may be positioned on one or more device components, such as an optical module or a component for wireless communication or charging systems. The cover member may have optical, electrical, magnetic, and / or mechanical properties compatible with the requirements of one or more device components.

Description

[0001] Cross-references to related applications

[0002] This application is a non-provisional application of U.S. Provisional Patent Application No. 63 / 090,375, filed on October 12, 2020, entitled “Electronic Device Including Glass-Ceramic Components,” and claims the benefit of that U.S. Provisional Patent Application, the entire disclosure of which is incorporated herein by reference. Technical Field

[0003] The embodiments described generally relate to components for electronic devices, including glass-ceramic materials. More specifically, embodiments of the invention relate to glass-ceramic housing components. Background Technology

[0004] Many modern portable electronic devices include a display, one or more cameras, and various optical sensors integrated into the device. Typically, the display, as well as at least some of the camera and optical sensors, are positioned beneath a glass or plastic cover. The embodiments described herein relate to electronic device housings that include glass-ceramic components and offer advantages compared to some conventional electronic device housings. Summary of the Invention

[0005] The embodiments described herein generally relate to components for electronic devices that comprise glass-ceramic materials. Components including this glass-ceramic material may be housing components of the electronic device, such as cover members. In some embodiments, the component is a glass-ceramic component.

[0006] The glass-ceramic material can be configured to possess mechanical properties that provide resistance to breakage and scratches. For example, the glass-ceramic material can be strong and tough enough that it will not break when an electronic device is dropped. In some cases, the glass-ceramic material is tougher than typical glass materials used for electronic device housings. Mechanical properties may include one or more of hardness, elastic modulus, fracture toughness, or impact toughness.

[0007] In some cases, a cover member comprising a glass-ceramic material may be configured to have optical properties suitable for use on one or more components of an electronic device. For example, the glass-ceramic cover member may have optical properties suitable for use on a sensing array of an electronic device. The sensing array may include a combination of multiple optical modules, such as sensor modules and camera modules. At least some of these optical modules may be configured to operate within different wavelength ranges, such as the visible wavelength range and the infrared (IR) wavelength range. The glass-ceramic material of the cover member may have optical properties suitable for use in these different wavelength ranges. The glass-ceramic material may also have optical properties suitable for use on a display. These optical properties may include one or more of transmittance values, haze values, or color values.

[0008] Alternatively or otherwise, the covering member comprising a glass-ceramic material may be configured to have electrical and / or magnetic properties suitable for use on other components of an electronic device. For example, the glass-ceramic covering member may be configured to have dielectric properties suitable for use on components of a wireless communication system. Furthermore, the glass-ceramic covering member may be configured to have magnetic properties suitable for use on components of a wireless charging system. For example, the glass-ceramic covering member may be substantially non-magnetic.

[0009] This disclosure provides an electronic device including a housing. The housing includes a housing component defining a side surface of the housing; and a front cover assembly coupled to the housing component and including a front cover member formed of a first glass-ceramic material having a visible light transmittance greater than or equal to 80% and a haze value less than 1%. The housing also includes a rear cover assembly coupled to the housing component and including a rear cover member formed of a second glass-ceramic material having a dielectric constant less than 30. The electronic device further includes a display positioned below the front cover assembly; a forward-facing camera array positioned below the front cover assembly and along one side of the display; and a transceiver component of a wireless communication system positioned below the rear cover assembly.

[0010] This disclosure also provides an electronic device including a display, a forward sensor assembly, and a housing. The forward sensor assembly includes a transmitter module configured to emit light signals in the infrared range and a receiver module configured to detect reflections of the light signals. The housing includes a housing component and a front cover assembly coupled to the housing component and including a glass-ceramic cover member positioned on the display and the sensor assembly, the glass-ceramic cover member having a haze value of less than 0.5% and a transmittance of greater than or equal to 85% in the infrared range. The housing also includes a rear cover assembly including a cover member with a translucent portion. In some cases, the translucent portion may extend substantially over the entire cover member of the rear cover assembly.

[0011] Furthermore, this disclosure provides an electronic device including a display and a housing, the housing including a housing component defining a side surface of the electronic device; and a cover assembly defining a front surface of the electronic device. The cover assembly includes a cover member positioned on the display, the cover member being formed of a glass-ceramic material and having a visible light transmittance greater than or equal to 85%, a haze value less than 0.5%, a color described by an L* value of 90 or greater, an a* value less than 0.5, and a b* value less than 1. Attached Figure Description

[0012] This disclosure will be more readily understood from the following detailed description taken in conjunction with the accompanying drawings, wherein similar reference numerals denote similar elements.

[0013] Figure 1A and Figure 1B A view of an exemplary electronic device is shown.

[0014] Figure 2 An enlarged view of the sensor array of an electronic device is shown.

[0015] Figure 3 A partial cross-sectional view of the sensing array is shown.

[0016] Figure 4 Another partial cross-sectional view of the sensing array is shown.

[0017] Figure 5 An additional partial cross-sectional view of the sensing array is shown.

[0018] Figure 6 An exemplary cross-sectional view of a rearward sensing array of an electronic device is shown.

[0019] Figure 7 An exemplary cross-sectional view of another rearward sensing array of an electronic device is shown.

[0020] Figure 8 An exemplary cross-sectional view of another rearward sensing array of an electronic device is shown.

[0021] Figure 9A and Figure 9B A partial cross-sectional view of the electronic device is shown.

[0022] Figure 10 Another exemplary electronic device including a sensing array is shown.

[0023] Figure 11A and Figure 11B A view of an additional exemplary electronic device including a sensing array is shown.

[0024] Figure 12 A block diagram of a sample electronic device including glass-ceramic components is shown.

[0025] The use of crosshairs or shading in the accompanying drawings is generally provided to clarify the boundaries between adjacent elements and also to improve the readability of the drawings. Therefore, the presence or absence of crosshairs or shading does not indicate or suggest any preference or requirement for a particular material, material properties, element proportions, element dimensions, commonalities of similar illustrated elements, or any other feature, property, or characteristic of any element shown in the accompanying drawings.

[0026] Additionally, it should be understood that the proportions and dimensions (relative or absolute) of the various features and elements (as well as their sets and groups), and the boundaries, spacing, and positional relationships therebetween, are provided in the accompanying drawings solely to facilitate understanding of the various embodiments described herein, and may therefore be unnecessarily presented or shown for scaling and are not intended to indicate any preference or requirement for the illustrated embodiments to exclude embodiments in conjunction with them. Detailed Implementation

[0027] Reference will now be made specifically to the representative embodiments shown in the accompanying drawings. It should be understood that the following description is not intended to limit the embodiments to a single preferred embodiment. Rather, the embodiments are intended to cover alternatives, modifications, and equivalents that may be included within the scope and spirit of this disclosure and the appended claims.

[0028] The following disclosure generally relates to components for electronic devices, including glass-ceramic materials. Components including the glass-ceramic material may be components of the housing of the electronic device, such as cover members. In some embodiments, the component is formed of a glass-ceramic material and may be referred to as a glass-ceramic component. This disclosure also relates to housings including these components and electronic devices including these housings.

[0029] The glass-ceramic material can be configured to provide scratch and impact resistance to the housing. For example, the glass-ceramic material can be both strong and tough. In some cases, the glass-ceramic material is tougher than typical glass materials used for electronic device housings. Furthermore, the glass-ceramic material can be hard enough to resist scratches. Mechanical properties may include one or more of hardness, elastic modulus, fracture toughness, or impact toughness. As mentioned herein, the glass-ceramic material comprises one or more crystalline phases (e.g., crystals) formed through the crystallization of a (precursor) glass material. These crystalline phases can contribute to the advantageous mechanical properties of the glass-ceramic material.

[0030] In some cases, a cover member comprising a glass-ceramic material or formed of a glass-ceramic material may be configured to have optical properties compatible with the requirements of one or more components of an electronic device. For example, the cover member may have optical properties suitable for use on a sensing array of an electronic device. The sensing array may include multiple optical modules, including combinations of, for example, sensor modules and / or camera modules. At least some of these optical modules may be configured to operate within different wavelength ranges, such as the visible wavelength range and the infrared (IR) wavelength range. For example, the optical module may include a visible (light) camera, a visible (light) sensor module, an IR camera module, and / or an IR sensor module. The glass-ceramic material of the cover member may have optical properties suitable for use in these different wavelength ranges. The glass-ceramic material may also have optical properties suitable for use on a display. These optical properties may include one or more of transmittance values, haze values, or color values. In some embodiments, the cover member may be substantially transparent, translucent, opaque, or a combination thereof.

[0031] Additionally or otherwise, the covering member, including or formed of glass-ceramic materials, may be configured to have electrical and / or magnetic properties suitable for use on other components of electronic devices. For example, the covering member may be configured to have dielectric properties suitable for use on components of wireless communication systems. Furthermore, the covering member may be configured to have magnetic properties suitable for use on components of wireless charging systems. For example, the covering member may be substantially non-magnetic.

[0032] In some embodiments, the electronic device housing includes a cover member comprising a glass-ceramic material. In some cases, the cover member may be formed of the glass-ceramic material and may be a glass-ceramic cover member. The cover member may be positioned along the front, rear, or side of the electronic device. As previously discussed, the cover member may be configured to have optical, electrical, and / or magnetic properties compatible with one or more components of the electronic device.

[0033] In an additional embodiment, the electronic device housing includes two cover members, and at least one of the cover members comprises a glass-ceramic material. The other cover member comprises a glass material, a glass-ceramic material, or a combination thereof. The cover member comprising the glass-ceramic material may be a front cover member, a rear cover member, or both. In some examples, one cover member is formed of a glass-ceramic material, and the other cover member is formed of a glass material.

[0034] In an additional example, the electronic device housing includes a front cover member formed of a first glass-ceramic material and a rear cover member formed of a second glass-ceramic material. In some cases, the front cover member may be substantially transparent, or may include one or more transparent portions positioned on a display or other device component configured to operate in the visible wavelength range. In additional cases, the front cover member may define one or more openings, and one or more substantially transparent window members may be positioned on or in one or more openings. In some cases, the rear cover member may be substantially transparent, or may include one or more transparent portions positioned on a device component configured to operate in the visible wavelength range. In additional cases, the rear cover member may define one or more openings, and one or more substantially transparent window members may be positioned on or in one or more openings (e.g., ...). Figures 6 to 8 (As shown). The first glass-ceramic material may be substantially the same as the second glass-ceramic material, or may differ in the composition or amount and / or size of the crystals in the material.

[0035] The following reference Figures 1A to 12 These and other embodiments are discussed. However, those skilled in the art will readily understand that the detailed descriptions given herein with respect to the accompanying drawings are for illustrative purposes only and should not be construed as limiting.

[0036] Figure 1A and Figure 1B An example of an electronic device, or simply "device," 100, is shown. For the purposes of this disclosure, device 100 may be a portable electronic device, including, for example, a mobile phone, tablet computer, portable computer, wearable electronic device, portable music player, health monitoring device, portable terminal, wireless charging device, device accessory, or other portable or mobile device. Figure 1A and Figure 1B In the example, the size and shape factors (including the ratio of its long side length to its short side length) correspond to the size and shape factors of a mobile phone. However, this example is not limiting, and examples of shape factors for other devices are provided. Figure 10 , Figure 11A and Figure 11B As shown in the image.

[0037] like Figure 1A and Figure 1B As shown, the electronic device 100 includes a housing 105. The housing 105 includes a front cover assembly 122, a rear cover assembly 124, and a housing component 110. The internal components of the device may be at least partially enclosed by the front cover assembly 122, the rear cover assembly 124, and the housing component 110, and in some cases, may be positioned within the housing (e.g., Figure 6 Within the internal cavity defined by 601). Figure 1A and Figure 1B The example is not limiting, and in other examples, the internal components of the device may be enclosed by a housing component combined with a single cover or any other suitable construction.

[0038] Housing 105 includes one or more components made of a glass-ceramic material. In some cases, these components are formed of the glass-ceramic material and may be referred to as glass-ceramic components. In some cases, the components including the glass-ceramic material (e.g., glass-ceramic components) are in the form of cover members included in the front cover assembly 122 and / or the rear cover assembly 124. In additional cases, the components including the glass-ceramic material (e.g., glass-ceramic components) may be included in housing component 110. The components including the glass-ceramic material may be positioned on one or more internal components of electronic device 100 such as display 142, camera assembly 144 (which may be part of a camera array), sensor assembly 146 (which may be part of a sensor array), radio frequency (RF) antenna assembly (which may be a directional antenna assembly), components for an inductively coupled wireless charging system, etc.

[0039] The glass-ceramic material can be configured to have sufficient hardness, strength, and toughness to provide scratch and impact resistance to the component and housing 105. As mentioned herein, the glass-ceramic material includes one or more crystalline phases (e.g., crystals) formed through the crystallization of a (precursor) glass material. These crystalline phases contribute to the favorable mechanical properties of the glass-ceramic material. The glass-ceramic material may also include an amorphous (glassy) phase, and crystals may be dispersed within the glassy phase. In some examples, the amount of crystalline phase by weight is greater than 10%, 20% to 90%, 30% to 90%, 40% to 90%, 50% to 90%, 60% to 90%, 70% to 90%, 20% to 40%, 20% to 60%, 20% to 80%, 30% to 60%, or 30% to 80% of the glass-ceramic material. In some cases, these values ​​may correspond to the average or localized amount of crystalline phase in the glass-ceramic component. Residual glassy phase may form the remainder of the material. Relative to Figure 1A and Figure 1BThe description of the glass-ceramic material provided includes, but is not limited to, descriptions of its glass-ceramic composition, crystalline phase content, type and size, as well as its mechanical, optical, electrical and magnetic properties, and is not limited to... Figure 1A and Figure 1B This is not an example, but rather applies generally to this article.

[0040] Components comprising glass-ceramic materials (e.g., glass-ceramic components) may be positioned on internal components of electronic device 100 and may also be configured to allow electromagnetic signals to be transmitted to and / or from the internal components. For example, a covering member comprising glass-ceramic material (e.g., a glass-ceramic covering member) may have a haze value, a transmittance value within a specified wavelength or frequency range, a color, or other optical properties suitable for use in cameras and / or displays. Furthermore, the glass-ceramic material of the component may be configured for RF transmission and may have a dielectric constant suitable for use in radio frequency antennas or wireless charging systems. Also, the glass-ceramic material of the component may have a sufficiently low permeability so that it does not interfere with the transmission of magnetic fields generated by an inductively coupled wireless charging system.

[0041] Components comprising glass-ceramic materials (e.g., glass-ceramic parts) can be substantially transparent, translucent, or opaque, or may include transparent, translucent, or opaque portions. For example, a transparent glass-ceramic part may be formed from a crystalline glass-ceramic material having crystals smaller than the wavelength of visible light (e.g., less than about 100 nm). Furthermore, the refractive index difference between the crystals and the glass phase can be relatively small. As mentioned herein, housing components formed from particular materials such as glass-ceramic parts may also include small amounts of another material, such as relatively thin coatings of different materials along one or more surfaces.

[0042] In some cases, glass-ceramic components or portions may be formed from glass-ceramic materials having crystals that produce visible light scattering. Such glass-ceramic components or portions may be configured to influence the direction of light and / or the transmittance of optical components in electronic devices, and / or produce translucent and / or opaque effects. This scattering may be due to the difference between the refractive index of the crystal and another phase present in the material and / or the size of the crystal. For example, a crystal having a size (e.g., diameter) approximately the same as the wavelength of light can produce this scattering. In some examples, even smaller crystals can produce scattering, such as crystals with a size equal to 0.06, 0.1, or 0.3 times the wavelength. Larger crystals can produce more forward scattering of light, so in some cases, it may be advantageous to limit the size of the crystal to a size such as equal to 0.3, 0.7, or 1.0 times the wavelength.

[0043] In some embodiments, at least some of the crystals may have a size that scatters light across the entire or part of the visible spectrum, but to a lesser extent scatters light of longer wavelengths. For example, near-infrared wavelengths, such as from about 800 nm to about 2.5 micrometers, from 900 nm to about 1.6 micrometers, or from about 800 nm to about 1000 nm, may be scattered to a degree smaller than the wavelength of visible light.

[0044] In some cases, glass-ceramic portions or components may be configured to have smaller crystals near the outer surface of the portion or component than near the inner and / or internal surfaces. The difference in crystal size across the thickness of the portion or component may be configured to affect the direction of light and / or the transmittance from optical components of an electronic device, producing an optical effect, or both. For example, smaller crystals near the outer surface may produce less visible light scattering than near the inner and / or internal surfaces of the portion or component, thus creating a depth effect. The difference in crystal size can be achieved through a crystal size gradient over at least a portion of the thickness, by creating regions of different crystal sizes across the thickness, or both. The crystal size gradient may be uniform or stepwise. For example, a translucent glass-ceramic portion or component may have a first crystal size in an outer surface region and a second crystal size larger than the first crystal size in an inner region. In some cases, a translucent glass-ceramic portion or component may include a gradient region between the outer surface region and the inner region, wherein the gradient region has a crystal size gradient. In some cases, the thickness of the outer surface region, the inner region, and / or the gradient region is at least 2 micrometers, at least 5 micrometers, at least 10 micrometers, or at least 20 micrometers.

[0045] For example, crystals at the outer surface of a component (e.g., in an outer surface region) may have dimensions greater than zero and less than about 200 nm or about 100 nm. Furthermore, crystals at the inner and / or inner surfaces of a component (e.g., in an inner surface region) may have dimensions greater than about 200 nm and less than about 1.5 μm, greater than about 200 nm and less than about 1 μm, greater than about 200 nm and less than about 800 nm, greater than about 400 nm and less than 1 μm, or greater than about 600 nm and less than about 1.5 μm. These crystal dimensions may be the average crystal size in a given region of the glass-ceramic component. In some cases, variations in crystal size across the thickness of the portion or component result in haze values ​​of 10% to 50%, 10% to 75%, 20% to 50%, 20% to 75%, or 50% to 80%. In an embodiment, differences in crystal size can be generated in the thicker portion of the glass-ceramic component (e.g., thicker portion 127) by locally heating the thicker portion.

[0046] By way of example, the glass-ceramic material can be an alkaline silicate, alkaline earth silicate, aluminosilicate, boroaluminosilicate, perovskite glass-ceramic, silica-phosphate, iron silicate, fluorosilicate, phosphate, or a glass-ceramic material from another glass-ceramic composition system. In some embodiments, the glass-ceramic portion comprises aluminosilicate glass-ceramic or boroaluminosilicate glass-ceramic. In addition to the main elements of the glass-ceramic material (e.g., aluminum, silicon, and oxygen for aluminosilicates), the glass-ceramic material may also include other elements. For example, the glass-ceramic material (and the precursor glass) may include elements from the nucleating agent of the glass-ceramic material, such as metal oxides (Ti, Zr) or other suitable oxide materials. Aluminosilicate and boroaluminosilicate glass-ceramics may also include monovalent or divalent ions, some of which may compensate for the charge generated due to the introduction of aluminum ions into the material. For example, aluminosilicate glass-ceramics may include alkali metal ions such as Li. + Or Na + .

[0047] Glass-ceramic materials can form a variety of crystalline phases, and can be used in components comprising one or more crystalline phases as described herein. For example, aluminosilicate glasses can form several types of crystalline phases, including β-quartz solid solution crystals, hydrothermal quartz solid solution crystals (β-spodumene solid solution crystals), penelandite crystals, lithium disilicate crystals, and various other silicates. Other silicates include, but are not limited to, silicates comprising aluminum and optionally other elements such as lithium, sodium, potassium, etc. Examples of such silicates include lithium orthoclase, lithium orthosilicate, (Li, Al, Na) orthosilicate (e.g., α or β lithium octanoate), and lithium metasilicate. Some of these crystalline phases can transform into other crystalline phases. For example, β-quartz solid solution crystals can transform into hydrothermal quartz / β-spodumene crystals. Similarly, mixtures of crystalline phases can be transformed into different mixtures.

[0048] In some cases, the glass-ceramic component is chemically strengthened through ion exchange of the glass-ceramic material. For example, the ion-exchange glass material may include monovalent or divalent ions, such as alkali metal ions (e.g., Li). + Na + or K + ) or alkaline earth metal ions (e.g., Ca 2+ or Mg 2+The ion exchange can occur with other alkali metal ions or alkaline earth metal ions. If the glass-ceramic material includes sodium ions, these ions can be exchanged for potassium ions. Similarly, if the glass-ceramic material includes lithium ions, these ions can be exchanged for sodium and / or potassium ions. This ion exchange can occur in the glass phase, the crystalline phase, or both. The exchange of smaller ions with larger ions in the glass-ceramic material can form a compressive stress layer along the surface of the glass-ceramic material. The formation of this compressive stress layer can increase the hardness and impact resistance of the glass-ceramic material. In some cases, the chemically strengthened glass-ceramic component is configured to have a stable composition under typical operating conditions of electronic devices and under processing conditions experienced after chemical strengthening (e.g., during subsequent coating operations). When ion exchange introduces sodium and / or potassium ions, the concentration of sodium and / or potassium ions at or near the surface of the glass-ceramic material can be limited to ensure that the ion concentration is stable under typical operating conditions. For example, in some cases, the sodium concentration in the surface area (e.g., about 2 micrometers deep) can be limited to limit or prevent corrosion by reacting with moisture in the environment. The sodium concentration (expressed as a molar percentage of sodium oxide) may be less than 10% or less than 5%.

[0049] In embodiments, the front cover assembly 122 is substantially transparent or includes one or more substantially transparent portions of the display 142 and / or optical components configured to operate in the visible wavelength range (e.g., optical components of the camera assembly 144). As mentioned herein, a component or material is substantially transparent when light is transmitted through it and the degree of scattering is low. For example, the transmittance in the visible wavelength range (e.g., the visible spectrum) may be at least 80%, 85%, 90%, or 95%, and the haze may be less than about 5% or 1%.

[0050] The front cover assembly 122 may also include one or more translucent and / or opaque portions combined with one or more substantially transparent portions. For example, the front cover assembly 122 may include translucent or opaque portions surrounding the periphery of the front cover assembly (e.g., extending inward from a side surface of the front cover assembly). As another example, the front cover assembly 122 may include translucent or opaque portions surrounding the periphery of an opening (e.g., opening 135) in the front cover assembly 122. Furthermore, the front cover assembly 122 may include translucent or opaque portions on a device component configured to operate in a range other than visible wavelengths or frequency ranges (e.g., infrared (IR) wavelength ranges or radio frequency (RF) ranges). The translucent or opaque portions of the front cover assembly 122 may correspond to the translucent or opaque portions of the cover member 132 and / or may correspond to portions on which a translucent or opaque coating has been applied.

[0051] exist Figure 1A In the example, the front cover assembly 122 includes a cover member 132 (also referred to herein as the front cover member). In some cases, the cover member 132 may be formed of a glass-ceramic material. In additional cases, the cover member 132 may include one or more glass portions and one or more glass-ceramic portions, or may be formed by combining a glass-ceramic layer with one or more of a glass layer, a ceramic layer, or a polymer layer. In some cases, the ceramic layer may be substantially transparent, such as a sapphire layer. Typically, the cover member 132 is substantially transparent or includes one or more substantially transparent portions on a display and / or optical components configured to operate in the visible wavelength range. The cover member 132 may also include one or more translucent and / or opaque portions combined with one or more substantially transparent portions. As previously described with respect to the front cover assembly 122, the cover member 132 may include translucent or opaque portions surrounding the periphery of the cover member or surrounding the periphery of an opening in the cover member. In addition, the covering member 132 may include a semi-transparent or opaque portion on a device component configured to operate in a range other than the visible wavelength or frequency range or on a device component of an inductively coupled wireless charging system.

[0052] For example, the front cover assembly 122 may include an outer coating such as an oleophobic coating and / or an anti-reflective coating. Alternatively or otherwise, the front cover assembly 122 may include an inner coating, such as a mask layer that forms an opaque portion of the front cover assembly 122. Furthermore, the front cover assembly may include a mounting frame coupled to the inner surface of the cover member 132 and to the housing member 110.

[0053] The front cover assembly 122 may at least partially define the front surface 102 of the electronic device. Figure 1A In the example shown, the front cover assembly may define substantially the entire front surface 102 of the electronic device. In some embodiments, the cover member 132 has a thickness of less than 3 mm, less than or equal to 2 mm, less than or equal to 1 mm, about 250 micrometers to about 1 mm, or about 500 micrometers to about 1 mm. The cover member 132 may extend laterally across the cover assembly 122, such as extending substantially across the width and length of the cover assembly.

[0054] In some cases, one of the front cover assembly 122 and the cover member 132 is positioned on the display 142, the camera assembly 144, and the sensor assembly 146. In other cases, the front cover assembly 122 may be positioned on the display 142, the camera assembly 144, and the sensor assembly 146, while the cover member 132 defines an opening (e.g., on one or more of the camera assembly 144 and the sensor assembly 146) on one or more of them. Figure 4(As shown). An opening 135 is provided in the front cover assembly 122 and the cover member 132, and in some cases, a speaker port may be provided. The front cover assembly 122 and the cover member 132 may also be positioned on a component 181, which may be part of a wireless communication system.

[0055] Cover member 132 may be configured to provide optical characteristics suitable for use on display 142, camera assembly 144, and sensor assembly 146. For example, these optical characteristics may include one or more of haze values, color values, or transmittance values. For instance, cover member 132 may be configured to have a sufficiently low haze value such that the optical input to the optical module of camera assembly 144 and / or the optical output provided by display 142 is not significantly degraded. Similarly, cover member 132 may be configured to have a sufficiently neutral color such that the optical input to the optical module of camera assembly 144 and / or the optical output provided by display 142 is not significantly degraded. Additionally, cover member 132 may be configured to have a sufficiently high transmittance value within the wavelength range in which the camera assembly, display, and / or sensor assembly operate. In some cases, different portions of cover member 132 may have different ranges of optical characteristics, as discussed in more detail below. Figure 2 The description of the optical properties provided is generally applicable to this document and will not be repeated here for the sake of brevity.

[0056] Covering member 132 may also be configured to provide electrical characteristics suitable for use on components such as component 181 of a wireless communication device. For example, covering member 132 may be a dielectric covering member and may be formed of a material having a sufficiently low dielectric constant and dissipation factor to allow RF or IR (e.g., near-infrared) signal transmission through the covering member.

[0057] Electronic device 100 includes: a display 142; and a front cover assembly 122 positioned on the display 142. As previously discussed, the front cover assembly 122 may be substantially transparent, or may include one or more substantially transparent portions on the display and / or optical components configured to operate in the visible wavelength range. A housing 105 may at least partially surround and enclose the display 142. The display 142 may produce graphic output transmitted through the substantially transparent portion of the front cover assembly. In some cases, the display 142 is a touch-sensitive display. The display 142 may be a liquid crystal display (LCD), a light-emitting diode (LED) display, an LED-backlit LCD display, an organic light-emitting diode (OLED) display, an active-matrix organic light-emitting diode (AMOLED) display, etc. In some embodiments, the display 142 may be attached to (or adjacent to) the front cover assembly 122.

[0058] Electronic device 100 also includes multiple sensing arrays. As mentioned herein, the sensing arrays may include one or more camera components (e.g., a camera array), one or more sensor components (e.g., a sensor array), illumination components, or combinations thereof. The front sensing array 118 includes a forward-facing camera component 144 and a forward-facing sensor component 146. The front sensing array may also include another sensor component 145, which may in some cases be an ambient light sensor. The rear sensing array 170 includes a rear-facing camera component array and at least one sensor component, as described in more detail below. Illumination components typically include light sources such as floodlights or other emitters, capable of enabling various sensing modes such as facial recognition and digital photography. For example, one or more emitters may emit an array of beams of light reflected from various parts of the face. These reflected beams can be used to create a dot map or depth map of the face and for user authentication.

[0059] The sensing assembly may include one or more optical modules. An optical module may include a photodetector and / or image sensor, associated electronics, one or more optical lenses, an optical cover, a cylinder or shield, and associated optical elements. For example, the optical module may be a camera module, an illumination module, or a sensor module. The sensing assembly may define any number of optical modules, such as one, two, three, four, five, or six optical modules.

[0060] like Figure 1A and Figure 1B As shown, the electronic device 100 includes multiple camera components. For example, the electronic device 100 may include a forward-facing camera component 144 and a rearward-facing camera array. Each camera component may include a camera module (e.g., Figure 1B The optical module 177 shown is an example. A camera module array (also referred to herein as a camera array) typically includes multiple camera modules and one or more illumination modules. When the camera array includes multiple camera modules, each camera module may have a different field of view or other optical characteristics. For example, a camera module may be configured to generate an image from visible or infrared light. Multiple camera modules may also be referred to as a group of camera modules, and in some cases may form a camera module array. In some cases, a camera module includes an optical sensor array and / or optical components such as lenses, filters, or windows. In additional cases, a camera module includes an optical sensor array, optical components, and a camera module housing surrounding the optical sensor array and optical components. A camera module may also include a focusing component. For example, a focusing component may include an actuator for moving a lens of the camera module. In some cases, the optical sensor array may be a complementary metal-oxide-semiconductor (CMOS) array, etc.

[0061] The electronic device 100 also includes one or more sensor components. For example... Figure 1AAs shown, the electronic device 100 includes one or more forward sensor assemblies 146. The device 100 also includes, as relative to... Figure 1B One or more backward sensor components described in more detail. Sensor components may also be referred to simply as sensors herein. Examples of sensors (components) include, but are not limited to, proximity sensors, light sensors (e.g., ambient light sensors), biometric sensors (e.g., facial or fingerprint recognition sensors or health monitoring sensors), depth sensors, or imaging sensors. Other examples of sensors include microphones or similar audio sensing devices, radio frequency identification chips, touch sensors, force sensors, accelerometers, gyroscopes, magnetometers (such as Hall effect sensors or other magnetic sensors), or similar position / orientation sensing devices. When the sensor is an optical sensor, it may operate within a specific wavelength range, such as the visible light wavelength range, the infrared light wavelength range, or the ultraviolet light wavelength range. In some cases, optical sensors are reflective sensors. The electronic device may also include a processing unit (also called a processor) that calculates values ​​based on signals from the sensor.

[0062] In some cases, one or more sensors may be grouped with one or more camera components. For example, these sensors may be depth sensors (e.g., time-of-flight sensors), ambient light sensors, face recognition sensors, infrared sensors, ultraviolet light sensors, health monitoring sensors, biometric sensors (e.g., fingerprint sensors), etc. These sensors may be positioned near one or more optical modules of the camera array, such as... Figure 1B As shown. Relative to Figures 2 to 4 Additional descriptions of the provided sensor components, camera components, and processors are generally applicable to this document and will not be repeated here for the sake of brevity.

[0063] Furthermore, electronic device 100 may include one or more device components, such as device components 181, 183, and 185, which may be part of a wireless communication system. For example, the wireless communication system may be a radio frequency (RF) or infrared (IR) communication system. In some cases, device components 181, 183, and 185 are antenna assemblies, also simply referred to herein as antennas. The RF communication system may operate in one or more of the following frequency ranges: a “low frequency band” (e.g., 600 MHz to 700 MHz), a “mid frequency band” (e.g., frequencies below 6 GHz, 2.5 GHz to 3.5 GHz), or a “high frequency band” (e.g., 24 GHz to 39 GHz, 57 GHz to 64 GHz, or 64 GHz to 71 GHz). As previously discussed, components of the RF communication system may include an RF antenna configured to radiate radio frequency (RF) signals. This RF antenna may be configured to operate in one or more desired RF frequency ranges or RF bands.

[0064] In some cases, electronic device 100 may include one or more antennas comprising elements configured to communicate via 5G wireless protocols, including millimeter-wave and / or 6GHz communication signals. 5G communication can be implemented using various different communication protocols. For example, 5G communication may utilize communication protocols employing frequency bands below 6GHz (also known as sub-6GHz spectrum). Alternatively, 5G communication may utilize communication protocols employing frequency bands above 24GHz (also known as millimeter-wave spectrum). Furthermore, the specific frequency band of any given 5G implementation may differ from other implementations. For example, different wireless communication providers may use different frequency bands in the millimeter-wave spectrum (e.g., one provider may use frequencies of approximately 28GHz to implement a 5G communication network, while another provider may use frequencies of approximately 39GHz). The antenna array may be configured to allow communication via one or more frequency bands in the frequency bands used to implement 5G communication.

[0065] In some cases, electronic device 100 includes one or more directional antennas (or high-gain antennas). Therefore, the antenna gain of the directional antenna can be highest along a specific direction. The directional antenna may include an array of transceiver elements used to form the shape and orientation of the antenna's radiation pattern (or lobes), and the antenna may be a millimeter-wave antenna. (As relative to...) Figure 9A and Figure 9B To further explain, the electronic device 100 may include multiple directional antennas with different main transmission directions.

[0066] The housing member 110 may at least partially define the side surface 106 of the electronic device 100, and may also be referred to herein as a housing. Figure 1A and Figure 1B As shown, the housing component used in conjunction with the front cover assembly and the rear cover assembly may also be referred to as a belt. Housing component 110 may include one or more members. Figure 1A and Figure 1BIn the example, the housing component includes multiple members (e.g., one or more metal segments) formed of a metallic material. Specifically, housing component 110 is formed of a series of metal segments (112a, 112b, 112c, and 112d) separated by dielectric segments (114a, 114b, 114c, and 114d), which provide a degree of electrical isolation between adjacent metal segments (e.g., by preventing electrical conduction through the dielectric segments). For example, a polymer segment (114b) may be disposed between a pair of adjacent metal segments (112a, 112c). One or more of the metal segments may be coupled to the internal circuitry of electronic device 100 and may be used as an antenna for transmitting and receiving wireless communications. In an alternative embodiment, housing component 110 may include one or more members formed of a glass material, one or more members formed of a ceramic material, one or more members formed of a glass-ceramic material, combinations of these, or combinations of these with one or more members formed of a metallic material. Figure 1A and Figure 1B The implementation is not limited, and in other examples, housing component 110 may have a different number of components or may have a single construction (e.g., monolithic). As mentioned herein, housing components or components formed of a particular material such as a metallic material may also include relatively thin coatings of different materials along one or more surfaces, such as anodized layers, physical vapor deposition coatings, paint coatings, primer coatings (which may include coupling agents), etc.

[0067] The housing component 110 may define one or more openings or ports. Figure 1A and Figure 1B In the example, the metal segment 112c of the housing component 110 defines openings 116 and 117. Opening 116 allows (audio) input or output from device components such as a microphone or speaker. Opening 117 may contain an electrical port or connector. Furthermore, the electronic device 100 may include one or more input devices. Figure 1A and Figure 1B In the example, input devices 152 and 154 are in the form of buttons and extend through additional openings in housing component 110. In some cases, electronic device 100 also includes a support plate and / or other internal structural components for supporting internal electronic circuitry or electronic components.

[0068] In some cases, housing component 110 may include one or more components 115 positioned within a metallic component (e.g., 112a). In some cases, component 115 may provide a window for device component 185, may define a portion of a waveguide, and / or allow beamforming or beam guiding functions. For example, component 115 may define an antenna window for transmitting and receiving wireless signals. Component 115 may be configured to transmit wireless signals at one or more of the frequencies previously discussed relative to device components 181, 183, and 185. For example, component 115 may be configured to transmit wireless signals in a frequency band between approximately 25 GHz and 39 GHz.

[0069] Component 115 may include a cover component 136. The cover component 136 may be formed of a transparent material. In some cases, the cover component 136 may be formed of a glass-ceramic material, and may include one or more glass-ceramic portions, or may be formed by combining a glass-ceramic layer with one or more of a glass layer, a ceramic layer, or a polymer layer. In additional cases, the cover component 136 may be formed of a glass material, a ceramic material, a polymeric material, or a combination thereof. The cover component 136 may be substantially transparent, translucent, opaque, or include transparent, translucent, and / or opaque portions. Furthermore, component 115 may also include one or more coatings along the interior and / or exterior of the cover component 136. These coatings may be similar to those described for cover components 132 and 134.

[0070] The rear cover assembly 124 may at least partially define the rear surface 104 of the electronic device. In the example shown in 1B, the rear cover assembly 124 may define substantially the entire rear surface 104 of the electronic device. The rear cover assembly 124 includes a cover member 134. In some cases, the rear cover assembly 124 also includes at least one (optically) transparent window member. Figure 1B In the example, the rear cover component 124 is positioned on device component 182, which can be a wireless charging component, and device component 183, which can be a wireless communication component.

[0071] The rear cover assembly 124 may be substantially transparent or may include one or more substantially transparent portions (e.g., on optical components 177 configured to operate in the visible wavelength range). The rear cover assembly 124 may also include one or more translucent and / or opaque portions combined with one or more substantially transparent portions. For example, the rear cover assembly 124 may include translucent portions on device components configured to operate in a range other than the visible wavelength or frequency range (e.g., the infrared (IR) wavelength range or the radio frequency (RF) range). Similarly, the rear cover assembly 124 may include translucent or opaque portions on device components 182 of an inductively coupled wireless charging system. Furthermore, the rear cover assembly 124 may include translucent or opaque portions surrounding the periphery of a cover member, surrounding the periphery of an opening in the rear cover assembly, and near and / or around the sensing array 170. The translucent or opaque portion of the rear cover assembly 124 may correspond to the translucent or opaque portion of the cover member 134 and / or may correspond to the portion of the cover member 134 to which a translucent or opaque coating has been applied.

[0072] As previously discussed, the rear cover assembly 124 includes a cover member 134 (also referred to herein as the rear cover member). In some cases, the cover member 134 may be formed of a glass-ceramic material. In additional cases, the cover member 134 may be formed of a glass material and may include one or more glass portions and one or more glass-ceramic portions, or may be formed by combining a glass-ceramic layer with one or more of a glass layer, a ceramic layer, or a polymer layer. In some cases, the ceramic layer may be substantially transparent, such as a sapphire layer. The cover member 134 may be substantially transparent, or may include one or more substantially transparent portions (e.g., on an optical component configured to operate in the visible wavelength range). The cover member 134 may also include translucent or opaque portions in a manner similar to that previously described with respect to the rear cover assembly 124. In some cases, the cover member 134 may extend laterally across the cover assembly 124 (e.g., substantially across the width and length of the cover assembly). In other cases, the cover member 134 may define an opening, and the rear cover assembly 124 may include additional cover members positioned on or within the opening, as described below with respect to Figure 7 Further details are provided.

[0073] The rear cover assembly 124 may also include one or more coatings. For example, the rear cover assembly 124 may include an external coating, such as an oleophobic coating. Alternatively or otherwise, the rear cover assembly 124 may include an internal coating that provides a decorative effect, such as an ink layer or a metallic layer. In addition, the rear cover assembly 124 may include a mounting frame that is coupled to the internal surface of the cover member 134 and to the housing member 110.

[0074] exist Figure 1B In the example, the rear cover component 124 defines a thinner portion 125 and a thicker portion 127. For example... Figure 1B As shown, the thicker portion 127 of the cover assembly 124 protrudes or is offset relative to the thinner portion 125 of the cover assembly 124. The portion of the thicker portion 127 that protrudes relative to the thinner portion 125 may also be referred to as the protruding region (e.g., Figure 6 and Figure 7 (As shown in the cross-sectional view). The thicker portion 127 may define the raised surface 128 (also referred to as the top surface) and the side surface 129, while the thinner portion 125 may define the surface 126.

[0075] In some cases, the overlay component 124 is configured to create optical contrast between the raised surface 128 and the surface 126. For example, the raised surface 128 may appear more transparent than the surface 126 (or vice versa). As an additional example, the raised surface 128 may have a different texture than the surface 126, and this texture difference can produce optical effects. For example, a smooth (polished) texture on the raised surface 128 may reflect more light than a rougher texture on the surface 126 (or vice versa). In some cases, the raised surface 128 may have a root-mean-square height smaller than the root-mean-square height of the surface 126, such as relative to... Figure 6 To explain in more detail, and these descriptions generally apply to this document. In additional cases, similar textures may be applied to surfaces 126 and 128.

[0076] In some cases, the cover member 134 may define corresponding thicker and thinner portions, wherein the thicker portion and the thinner portion are integrally formed. In additional cases, the thinner portion 125 may be provided by the cover member 134, while the thicker portion 127 may be provided at least partially by an additional cover member coupled to the thinner portion. For example, the cover member 134 may define an opening, and the rear cover assembly 124 may include, as opposed to... Figure 8 The additional covering member positioned within the opening, or as relative to Figure 7 The additional covering member positioned on and inside the opening.

[0077] In some cases, the thickness of the thicker portion 127 may be greater than about 1 mm and less than or equal to about 2.5 mm, or greater than about 1 mm and less than or equal to about 2 mm, while the thickness of the thinner portion 125 may be about 250 micrometers to about 1 mm, or about 500 micrometers to about 1 mm. The amount of protrusion or offset between the raised surface 128 and the surface 126 may be about 0.5 mm to about 1.5 mm. The size of the thicker portion 127 may depend at least in part on the size of the sensing array 170. In some embodiments, the lateral dimension (e.g., width) of the thicker portion 127 may be about 5 mm to about 30 mm, or about 10 mm to about 20 mm.

[0078] The thicker portion 127 may accommodate one or more components of the sensing array 170. For example, the sensing array 170 may include multiple camera assemblies. Each camera assembly may include optical components, such as optical component 177 or optical component 178. Optical component 177 may be at least partially positioned within an opening in the thicker portion 127, as for... Figure 6 The optical component 677 is shown in the diagram. Optical component 177 can be a camera module, while optical component 178 can be an illumination module.

[0079] Furthermore, the sensing array 170 may include one or more sensor components, such as sensor component 179. In some cases, sensor component 179 may measure the distance to a target, such as a lidar sensor component configured to illuminate an object with light and then detect the reflected light to determine or estimate the distance between an electronic device and an object (e.g., a time-of-flight (TOF) sensor). In some examples, sensor component 179 may be positioned below cover member 134 (and cover member 134 may act as a window to sensor component 179). In these examples, the optical characteristics of cover member 134 may be suitable for use on one or more optical components of the sensor component. For example, one or more optical components may operate within one or more specified wavelength ranges, and cover member 134 may be configured to have suitable transmittance / transmittance within these wavelength ranges. In other examples, cover member 134 may define an opening on the sensor component, and an additional cover member may be placed in or on the opening (and act as a window to the sensor component).

[0080] In some cases, the sensor assembly may include one or more optical modules. For example, the sensor assembly may include a transmitter module, a receiver module, or both. The thicker portion 127 may also include a sensor assembly 180 other than optical components. For example, the sensor assembly 180 may be a microphone, which may be at least partially located within or below an opening in the thicker portion 127. In specific embodiments where the thicker portion 127 serves to protect one or more sensor modules or components, the thicker portion 127 and / or the protruding areas of the thicker portion 127 may be referred to as sensor features, camera features, sensor arrays, camera panels, and / or camera bumps.

[0081] Covering member 134 may be configured to provide electrical characteristics suitable for use on wireless communication components such as component 183. For example, covering member 134 may be a dielectric covering member and may be formed of a material having a sufficiently low dielectric constant and dissipation factor to allow RF or IR (e.g., near-infrared) signal transmission through the covering member.

[0082] Alternatively or otherwise, the cover member 134 may be formed of a material having magnetic properties suitable for use in components of an inductively coupled wireless charging system. Specifically, the cover member 134 may be formed of a material with sufficiently low permeability so as not to interfere with the transmission of the electromagnetic field generated by the inductively coupled wireless charging system. In some cases, the cover member 134 may be substantially nonmagnetic. For example, components of the inductively coupled wireless charging system may include wireless receiver components, such as a wireless receiver coil or other features of the wireless charging system. Relative to Figure 2 The description of the magnetic property range provided is generally applicable herein and will not be repeated here for the sake of brevity. In an alternative embodiment, the wireless charging system may be a radio frequency (RF) wireless charging system rather than an inductively coupled wireless charging system. Therefore, the cover member 134 may be configured to have dielectric properties suitable for use with an RF wireless charging system, which in some cases may be similar to those suitable for use with an RF wireless communication system. In some cases, the RF wireless charging system may operate in a frequency range of about 80 kHz to about 300 kHz or about 110 kHz to about 205 kHz. Relative to Figure 2 The description of the range of electrical characteristics provided is generally applicable to this document and will not be repeated here for the sake of brevity.

[0083] Figure 2 An enlarged view of the sensing array of the electronic device is shown. The electronic device 200 may be... Figure 1A and Figure 1BExample of electronic device 100. Electronic device 200 includes a sensing array 218. Sensing array 218 includes a proximity sensor 246, a microphone 247, an ambient light sensor 245, and a camera assembly 244. Figure 2 In the example, proximity sensor 246, ambient light sensor 245, and camera assembly 244 are positioned below cover assembly 222, as schematically indicated by dashed lines. Microphone 247 may be positioned below opening 235. Sensing array 218 may be located on any suitable surface 202 of the electronic device, such as the front or rear surface. Figure 2 In one example, the electronic device includes a display 242, but in other examples, it is not necessary to include a display near the sensing array 218.

[0084] Cover assembly 222 also includes cover member 232. In some cases, cover member 232 may be formed of a glass-ceramic material. In additional cases, cover member 232 may include one or more glass portions and one or more glass-ceramic portions, or may be formed by bonding a glass-ceramic layer with one or more of a glass layer, a ceramic layer, or a polymer layer. Cover assembly 222 is part of housing 205, which also includes housing member 210. Cover assembly 222, cover member 232, housing 205, and housing member 210 may be similar to those relative to... Figure 1A The cover assembly 122, cover member 132, housing 105 and housing component 110 are described, and for the sake of brevity, those details will not be repeated here.

[0085] Camera component 244 typically includes a camera module (e.g., Figure 3 and Figure 4 (Camera modules 377 and 477 in a cross-sectional view). The camera module of camera assembly 244 can generate images from visible light. However, the electronic device 200 may also include an optical module configured to operate in the IR range, such as a near-infrared camera module. In this case, the optical properties of the cover member 232 can be adapted to an optical component configured to operate in both the visible wavelength range and the near-infrared range. Camera assembly 244 may be positioned along one side of display 242.

[0086] In some cases, the camera module includes an optical sensing array and / or optical components such as lenses, filters, or windows. In additional cases, the camera module includes an optical sensing array, optical components, and a camera module housing surrounding the optical sensing array and optical components. The camera module may also include a lens assembly, which may include a moving element and / or a moving lens. For example, a focusing assembly may include an actuator for moving the lens of the camera module. In some cases, the optical sensing array may be a complementary metal-oxide-semiconductor (CMOS) array, etc.

[0087] In some cases, the cover member 232 is suitable for use on a camera module of a camera assembly 244, which is configured to produce an image from visible light. Such a cover member 232 may have a haze value of less than 1%, less than 0.8%, 0.05% to less than 0.8%, 0.1% to less than 0.8%, 0.2% to less than 0.8%, 0.3% to less than 0.8%, 0.4% to less than 0.8%, 0.5% to less than 0.8%, 0.05% to 0.6%, 0.1% to 0.6%, 0.2% to 0.6%, 0.3% to 0.6%, 0.05% to 0.5%, 0.1% to 0.5%, 0.2% to 0.5%, 0.05% to 0.4%, 0.1% to 0.4%, or 0.2% to 0.4%. The haze value may be a transmitted haze value and is generally dependent on the thickness of the cover member. The thickness of the cover member 232 may be any of the thicknesses previously described relative to cover members 132 or 134. The transmitted haze of the cover member 232 may be measured using commercially available equipment and according to ASTM or ISO standard test methods. Transmitted haze may be related to the amount of light subjected to wide-angle scattering (e.g., greater than 2.5 degrees). As a non-limiting example, transmitted haze may be measured using a haze-gard i device available from BYK or a GC 5000L variable photometer available from Nippon Denshoku. The transmitted haze scattering of the cover member may be measured when it is removed from the electronic equipment. In other examples, the transmitted haze scattering of the cover assembly 222 may be measured.

[0088] Furthermore, the cover member 232 suitable for use on the camera module of camera assembly 244 (which generates images from visible light) may have transmittance or light transmittance within a visible light wavelength range (e.g., 400 nm to 700 nm) greater than 80%, greater than 82%, greater than 84%, greater than 85%, greater than 86%, greater than 87%, greater than 88%, greater than 89%, greater than 90%, greater than 91%, greater than 92%, greater than 93%, greater than 94%, or greater than 95%. These transmittance values ​​may be averages over the visible light wavelength range. The transmittance may depend on the thickness of the cover member, and the thickness of the cover member 232 may be any of the thicknesses previously described relative to cover members 132 or 134. The transmittance (or light transmittance) of the cover member 232 may be measured using commercially available equipment and according to ASTM or ISO standard test methods. As a non-limiting example, the efficiency of light transmission (e.g., total transmission) may be measured using a haze-gard i device available from BYK. When the cover member is removed from the electronic device, its transmittance or light transmittance can be measured. Alternatively, the transmittance of the cover assembly 222 can be measured. The transmittance value may depend on the degree to which the material of the cover member (or other component) absorbs electromagnetic signals. For some measurement techniques, the transmittance value may also depend on the scattering of electromagnetic signals by the material of the cover member (or other component).

[0089] Furthermore, the overlay member 232 suitable for use on the camera module of camera assembly 244 (which generates images from visible light) may have a neutral color. In some cases, coordinates in the CIEL*a*b* (CIELAB) color space can be used to characterize the color of the overlay member 232. In the CIEL*a*b* (CIELAB) color space, L* represents luminance, a* represents the position between red / magenta and green, and b* represents the position between yellow and blue. Broadband or half-broadband illuminators can be used to determine the color of the overlay member or portions of the overlay assembly. For example, CIE illuminators or other reference illuminators can be used. When the overlay member 232 is transparent or translucent, the color of the overlay member 232 may be determined by transmitted and / or reflected light. In some embodiments, the CIELAB coordinates of a given illuminator may be calculated from measurements of the transmittance through the overlay member 232. For example, the color may be characterized by an a* value less than 1, less than or equal to 0.5, less than or equal to 0.25, less than or equal to 0.1, or less than or equal to 0.05. Furthermore, color can be characterized by a b* value less than 2, less than or equal to 1.5, less than or equal to 1, less than or equal to 0.75, or less than or equal to 0.5. The L* value can be greater than 85, greater than or equal to 90, or greater than or equal to 95. In some embodiments, haze, transmittance, and / or color values ​​suitable for use on a camera module of camera assembly 244 configured to generate images from visible light are also suitable for use on display 242.

[0090] The proximity sensor 246 may include a light-emitting module and a light-receiving module, such as Figure 5 A cross-sectional view is shown. The light-emitting module of the proximity sensor can generate infrared light. In some embodiments, the light-emitting module generates near-infrared (near IR) light, such as light having wavelengths of about 800 nm to about 2.5 micrometers, 900 nm to about 1.6 micrometers, or about 800 nm to about 1000 nm. In some cases, the proximity sensor may be a time-of-flight sensor.

[0091] In additional cases, the cover member 232 is also suitable for use on optical components configured to generate images from infrared light (e.g., near-infrared light). For example, camera assembly 244 may include an IR camera module, or sensor array 218 may also include a sensor assembly comprising an IR emitting module projecting a spatial pattern (e.g., a dot pattern) other than an IR camera, or a floodlight IR emitting (illumination) module. Such sensor assemblies can be used for biometrics. In these cases, the cover member 232 may have transmittance in an infrared wavelength range (e.g., 770 nm to 1000 nm) greater than 85%, greater than 86%, greater than 87%, greater than 88%, greater than 89%, greater than 90%, greater than 91%, greater than 92%, greater than 93%, greater than 94%, or greater than 95%. These transmittance values ​​may be averages over the infrared wavelength range. The transmittance may depend on the thickness of the cover member, and the thickness of the cover member 232 may be any of the thicknesses previously described relative to cover members 132 or 134.

[0092] The ambient light sensor 245 may include a light sensing module that can provide a measurement of ambient light intensity. In some cases, the ambient light sensor may include color sensing. Although Figure 2 The example shows the ambient light sensor 245 as separate from the proximity sensor 246, but in other examples, the ambient light sensor 245 may be packaged together with the proximity sensor 246.

[0093] In some cases, additional sensors may be located near the sensing array 218. For example, the sensing array 218 may also include sensor components including an IR emitting module that projects a spatial pattern (e.g., a dot pattern), a floodlight IR emitting (illumination) module, and an IR camera. Such sensor components can be used for biometrics. As an additional example, the sensing array 218 may include sensor components that measure the distance to a target, such as a lidar sensor component configured to illuminate the object with light and then determine the distance from the reflected light to the object (e.g., a time-of-flight (TOF) sensor). Such sensor components may include an emitting module (e.g., a laser) and a receiver module, and may be used in conjunction with a camera module. The lidar sensor can provide a digital three-dimensional representation of the object, which can be used in various applications, including augmented reality (AR) and virtual reality (VR). Furthermore, other device components such as speakers may be located within and / or below the sensing array 218.

[0094] Figure 3 A partial cross-sectional view of a sensing array of an electronic device 300 is schematically shown. The sensing array 318 includes a camera assembly 344, which may be part of a camera array. For example, Figure 3 For along Figure 2An exemplary partial cross-sectional view of DD. (e.g.) Figure 3 As shown, camera assembly 344 includes an optical module 377 positioned below cover member 332 of cover assembly 322. Figure 3 In the example, the covering member 332 is substantially uniform in thickness and composition both on and around the optical module 377. However, as Figure 4 and Figures 6 to 8 As shown in the example, this example is not limiting. In some examples, the cover member 332 may be a front cover member or a rear cover member.

[0095] In some cases, the cover member 332 may be formed of a glass-ceramic material. In additional cases, the cover member 332 may include one or more glass portions and one or more glass-ceramic portions, or may be formed by combining a glass-ceramic layer with one or more of a glass layer, a ceramic layer, or a polymer layer. The cover member 332 may be similar in composition, size, and other properties to cover members 132 and 232, and for the sake of simplicity, those details will not be repeated here.

[0096] Figure 3 The camera assembly 344 also includes a support structure 386 configured to hold various components of the camera assembly 344 in place. For example, an optical module 377 may be mounted to the support structure 386. The camera assembly 344 may also include a circuit assembly 388 that can be mounted on a printed circuit board. The support structure 386 may also support the circuit assembly 388.

[0097] In some cases, the optical module 377 is configured to generate an image from visible light. In these cases, the overlay member 332 may have similar optical properties (e.g., haze, transmittance, color) to those previously described with respect to the overlay member 232 for a camera assembly configured to generate an image from visible light. For the sake of brevity, these descriptions will not be repeated here. In some embodiments, the overlay member 332 may have similar optical properties on the optical module 377 (configured to generate an image from visible light) and on the display.

[0098] In an additional configuration, the optical module 377 is configured to generate an image from infrared light (e.g., near-infrared light). The overlay member 332 may have transmittance in an infrared wavelength range (e.g., 770 nm to 1000 nm) greater than 85%, 86%, 87%, 88%, 89%, 90%, 91%, 92%, 93%, 94%, or 95%. In some cases, the covering element 332 may have a haze value of less than 1%, 0.05% to less than 1%, 0.1% to less than 1%, 0.2% to less than 1%, 0.3% to less than 1%, 0.4% to less than 1%, 0.5% to less than 1%, 0.6% to less than 1%, 0.05% to 0.8%, 0.1% to 0.8%, 0.2% to 0.8%, 0.3% to 0.8%, 0.4% to 0.8%, 0.05% to 0.6%, 0.1% to 0.6%, 0.2% to 0.6%, 0.3% to 0.6%, 0.05% to 0.5%, 0.1% to 0.5%, 0.2% to 0.5%, 0.05% to 0.4%, 0.1% to 0.4%, or 0.2% to 0.4%. In some embodiments, the cover member 332 may have similar optical properties to an optical module 377 configured to generate an image from infrared light, as on a display. However, in other embodiments, the cover member 332 may have different optical properties on such an optical module 377 than on a display. For example, the cover member 332 may have a higher haze value and / or a lower transmittance value for visible light on the optical module 377 than on a display (e.g., when the optical module 377 is configured to generate an image from IR light). In some examples, the glass-ceramic portion of the cover member positioned on the optical module 377 may have a crystal that produces a greater amount of scattering than the glass-ceramic portion of the cover member positioned on the display.

[0099] Figure 4 A partial cross-sectional view of a sensing array of an electronic device 400 is schematically shown. The sensing array 418 includes a camera assembly 444, which may be part of a camera array. Figure 4 Can be along Figure 2 An exemplary partial cross-sectional view of DD. (e.g.) Figure 4 As shown, camera assembly 444 includes an optical module 477 positioned below cover assembly 422. Figure 4 In one example, the cover assembly 422 includes a cover member 432 defining an opening 452 on the optical module 477. The cover assembly also includes a cover member 436 defining a window on the optical module 477. In some cases, the cover member 436 has lower haze and / or higher transmittance in the visible light range than the cover member 432. In some examples, the cover member 432 may be a front cover member or a rear cover member.

[0100] In some cases, the cover member 432 may be formed of a glass-ceramic material. In additional cases, the cover member 432 may include one or more glass portions and one or more glass-ceramic portions, or may be formed by combining a glass-ceramic layer with one or more of a glass layer, a ceramic layer, or a polymer layer. The cover member 432 may be similar to the cover members 132 and 232 in composition, size, and one or more other characteristics, and those details will not be repeated here for the sake of simplicity.

[0101] In some cases, the covering member 432 may have relatively high transmittance or light transmittance in the visible wavelength range (e.g., 400 nm to 700 nm), such as greater than 80% and less than 90%, greater than 82% and less than 90%, greater than 84% and less than 90%, or greater than 85% and less than 90%. Similarly, the covering member 432 may have relatively low haze values, such as 0.2% to less than 1%, 0.3% to less than 1%, 0.4% to less than 1%, 0.5% to less than 1%, 0.6% to less than 1%, 0.2% to 0.8%, 0.3% to 0.8%, 0.4% to 0.8%, 0.05% to 0.6%, 0.2% to 0.6%, 0.3% to 0.6%, 0.2% to 0.5%, or 0.2% to 0.4%.

[0102] In other cases, at least a portion of the covering member 432 surrounding the covering member 436 may be configured to produce light scattering within the visible range. For example, this portion of the covering member 432 may be configured to, relative to, produce light scattering within the visible range. Figure 1A and Figure 1B The same manner results in a variation in crystal size throughout the thickness. This portion of the cover member 432 may appear translucent or may appear to have a depth effect. In some cases, this portion of the cover member 432 may have transmittance in the visible wavelength range of less than 80% or 20% to 75%. Alternatively or otherwise, the cover member 432 may have a haze value of greater than about 1%, greater than about 2%, 5% to 50%, 5% to 75%, 5% to 90%, 20% to 50%, 20% to 75%, 20% to 90%, 50% to 80%, or 50% to 90%.

[0103] In some cases, the cover member 436 may be formed of one or more materials having lower haze and / or higher transmittance in a specified wavelength range compared to the cover member 432. For example, the cover member 436 may be formed of a substantially transparent glass material, a substantially transparent glass-ceramic material, or a substantially transparent ceramic material such as sapphire. Furthermore, the cover member 436 may be formed of one or more of a glass layer, a glass-ceramic layer, a ceramic layer, or a polymer layer.

[0104] When the optical module 477 is configured to generate an image from visible light, the cover member 436 may have optical properties (e.g., haze, transmittance, color) similar to those previously described with respect to the cover member 232 (for a camera assembly configured to generate an image from visible light). When the optical module 477 is configured to generate an image from infrared light, the cover member 436 may have optical properties (e.g., haze and transmittance) similar to those previously described with respect to the cover member 332 (for an optical component configured to generate an image from infrared light). For the sake of brevity, these descriptions will not be repeated here. The cover member 436 may be coupled to the cover member 432 using adhesives, mechanical coupling devices, or combinations thereof.

[0105] Figure 4 The camera assembly 444 also includes a support structure 486 configured to hold various components of the camera assembly 444 in place. For example, an optical module 477 may be mounted to the support structure 486. The camera assembly 444 may also include a circuit assembly 488 that can be mounted on a printed circuit board. The support structure 486 may also support the circuit assembly 488.

[0106] Figure 5 A partial cross-sectional view of the sensing array of an electronic device 500 is schematically shown. The sensing array 518 includes a reflective sensor assembly 546. For example, Figure 5 Can be along Figure 2 An exemplary partial cross-sectional view of the EE.

[0107] Electronic device 500 includes a sensor assembly 546 located below cover assembly 522 and including transmitter module 582 and receiver module 584. In some cases, sensor assembly 546 may be configured to operate in a reflective sensing mode, and therefore sensor assembly 546 is a reflective sensor assembly.

[0108] For example, the reflective sensor assembly can be a proximity sensor. The light-emitting module of the proximity sensor can generate infrared light. In some embodiments, the emitter module 582 generates near-infrared light, such as light having wavelengths of about 800 nm to about 2.5 micrometers, about 900 nm to about 1.6 micrometers, or about 800 nm to about 1000 nm. In some cases, the proximity sensor can be a time-of-flight sensor.

[0109] For example, the reflection sensor assembly can be a lidar sensor assembly configured to illuminate an object with light and then determine the distance from the reflected light to the object (e.g., a time-of-flight (TOF) sensor). In some cases, the transmitter module 582 is a laser, which may be an infrared laser. The lidar sensor can provide a digital three-dimensional representation of the object, which can be used in various applications, including augmented reality (AR) and virtual reality (VR). Furthermore, the reflection sensor assembly can be a biometric sensor. For example, the reflection sensor assembly may also include an IR emitting module that projects a spatial pattern (e.g., a dot pattern), a floodlight IR emitting (illumination) module, and an IR camera.

[0110] Figure 5 The operation of the transmitter module and receiver module is also schematically illustrated. For example, light 592 (e.g., an optical signal) from transmitter module 582 can be transmitted to object 515 through cover component 522, and light reflected from object 515 (e.g., an optical signal reflected from the object) can be detected by receiver module 584. In some cases, receiver module 584 may receive only a portion of the light generated by transmitter module 582 (e.g., a first portion of the light).

[0111] Cover assembly 522 includes a cover member 532 extending over sensor assembly 546. In some cases, cover member 532 may be formed of a glass-ceramic material. In additional cases, cover member 532 may include one or more glass portions and one or more glass-ceramic portions, or may be formed by combining a glass-ceramic layer with one or more of a glass layer, a ceramic layer, or a polymer layer. When the reflective sensor is configured to emit and detect infrared light (e.g., near-infrared light), cover member 532 may have optical properties similar to cover member 332 (when disposed on an optical module configured to generate an image from infrared light). Cover member 532 may be similar in composition, size, and other characteristics to cover members 132, 232, and 332, and for the sake of brevity, those details will not be repeated here.

[0112] like Figure 5 As shown, transmitter module 582 and receiver module 584 are spaced apart from cover assembly 522 by gap 561. The size of gap 561 is... Figure 5The image has been enlarged to better illustrate the optical path. The transmitter module may include a light-emitting element 581, which may be a light-emitting diode (LED) or a laser, such as a vertical-cavity surface-emitting laser (VCSEL). The receiver module 584 may include a light-receiving element 585, which may be a photodetector, and may include one or more photodiodes, phototransistors, or other optically sensitive elements. Furthermore, the transmitter module 582 and receiver module 584 may be supported by a support member 587, which may include circuit components or other support structures. It should be understood that the form of the support member 587 is not limiting, and the sensor assembly 546 may include... Figure 5 Additional components not shown, such as circuitry and additional packages for the transmitter and receiver modules.

[0113] Figure 6 An exemplary cross-sectional view of a sensor array of an electronic device is shown. Figure 6 A sensing array 670 is shown, which can be located at the rear of the electronic device 600 and can be along... Figure 1B An exemplary cross-sectional view of BB. Sensing array 670 (which may also be described as a rearward sensing array) includes a rearward camera array 675. At least one optical module of the camera array 675 is configured to operate in the visible wavelength range. Electronic device 600 includes a housing 605 that includes a rear cover assembly 624. The electronic device also includes a housing component 610 defining a side surface of the electronic device. The housing component may include a member 612.

[0114] The rear cover assembly 624 includes a cover member 634. The sensing array 670 includes rearward optical modules 677 and 678. Figure 6 In the example, the rear cover member 634 does not extend over optical modules 667 and 668. Instead, the cover member 634 defines vias 667 and 668, and optical modules 677 and 678 extend at least partially into these vias. Windows 687 and 688 extend over optical modules 677 and 678 (and over vias 667 and 668). Windows 687 and 688 may be formed of transparent glass-ceramic, transparent ceramic such as sapphire, or glass. The rear cover member 634 may extend over components of wireless communication and / or charging systems, such as... Figure 9A As shown. Cover member 634 may include an external coating, an internal coating, or a combination thereof, as described in more detail below.

[0115] The cover member 634 may be formed of a glass material, may be formed of a glass-ceramic material, and may include one or more glass portions and one or more glass-ceramic portions, or may be formed by bonding a glass-ceramic layer with one or more of a glass layer, a ceramic layer, or a polymer layer. In some cases, the cover member 634 comprises a glass-ceramic material.

[0116] Cover member 634 may be positioned on one or more internal components of electronic device 600 and may also be configured to allow electromagnetic signals to be transmitted to and / or from the internal components. For example, the glass-ceramic material of cover member 634 may be configured for RF transmission and may have a dielectric constant suitable for use in an RF antenna or wireless charging system. In some cases, the material or combination of materials of cover member 634 may have a dielectric constant (also referred to as relative dielectric constant) having a value greater than or equal to 1 and less than 30, less than 20, less than 10, less than 7, or less than 5. In some cases, the dielectric constant may be 3 to 7 or 4 to 8. In some cases, the loss tangent may be in the range of about 0.002 to about 0.05, or about 0.002 to about 0.025. In some cases, these values ​​are maximum values, while in others, these values ​​are measured within the frequency range of interest. For example, the frequency range of interest may be about 5 GHz to about 40 GHz. These values ​​may be measured at room temperature. For example, the glass-ceramic material of the covering member 634 may have a sufficiently low magnetic permeability so that it does not interfere with the transmission of the magnetic field generated by the inductively coupled wireless charging system. In some cases, the covering member 634 may be substantially nonmagnetic.

[0117] Cover member 634 may be substantially transparent, translucent, opaque, or include transparent, translucent, and / or opaque portions. In some cases, cover member 634 may have a haze greater than that of cover member 632, such as greater than about 1%, greater than about 2%, 5% to 50%, 5% to 75%, 5% to 90%, 20% to 50%, 20% to 75%, 20% to 90%, 50% to 80%, or 50% to 90%. Furthermore, cover member 634 may have optical properties (e.g., transmittance / transmittance) configured to allow optical signals to be transmitted through cover member 634. For example, when sensing array 670 includes a sensor module that transmits optical signals through cover member 634 within a specified wavelength range, cover member 634 may have a transmittance similar to that of cover members 232, 332, 432, and 532 (for similar wavelength ranges).

[0118] In some cases, glass-ceramic portions or components may be configured to have smaller crystals near the outer surface of the component than near the inner and / or inner surfaces. For example, a glass-ceramic portion or component may have a first crystal size in an outer surface region (along the outer surface) and a second crystal size larger than the first crystal size in an inner region of the glass-ceramic portion or component. For example, the inner region may be located along the inner surface of the portion or component, or it may be located away from both the outer and inner surfaces, such as an inner region location that includes the midpoint of the thickness of the portion or component. Smaller crystals may produce less visible light scattering in the outer surface region than in the inner region, thus creating a depth effect. In some cases, the difference in crystal size in the glass-ceramic portion or component produces haze values ​​of 10% to 50%, 10% to 75%, 20% to 50%, 20% to 75%, or 50% to 80%.

[0119] Differences in crystal size can be achieved by forming regions of different crystal sizes across the entire thickness, by a crystal size gradient from the outer surface to the inner surface, or both. For example, a glass-ceramic portion or component may include a gradient region between an outer surface region and an inner region, wherein the gradient region has a crystal size gradient. The crystal size gradient may be uniform or may be stepped. For example, crystals at the outer surface may have a size greater than zero and less than about 200 nm or about 100 nm. Furthermore, crystals in the inner surface region may have sizes greater than about 200 nm and less than about 1.5 μm, greater than about 200 nm and less than about 1 μm, greater than about 200 nm and less than about 800 nm, greater than about 400 nm and less than 1 μm, or greater than about 600 nm and less than about 1.5 μm. These crystal sizes may be the average crystal size in a given region of the glass-ceramic component. In some cases, the thickness of the outer surface region, the inner region, and / or the gradient region is at least 2 μm, at least 5 μm, at least 10 μm, or at least 20 μm. In embodiments, differences in crystal size may be generated in the thicker portions of the glass-ceramic component, such as in… Figure 6 It is produced in the thicker part of 627.

[0120] exist Figure 6 In the example, the cover member 624 includes a thicker portion 627 and a thinner portion 625, and the sensing array 670 is generally located near the thicker portion 627. The thicker portion 627 is at least partially defined by the thicker portion of the cover member 634, and the thinner portion 625 is at least partially defined by the thinner portion of the cover member 634. The thicker portion 627 also defines a feature 657 that protrudes relative to the thinner portion 625. The feature 657 is also generally referred to herein as a protruding region, a protruding feature, or a bump. The thicker portion of the cover member 634 at least partially defines the protruding feature 657.

[0121] The thinner portion 625 defines an outer surface 626 (also referred to herein as a base surface). The thicker portion 627 defines an outer surface 628 (also referred to herein as a raised surface or top surface). For example, the outer surface 628 may substantially define a platform. Such an outer surface may also be referred to herein as a (raised) platform surface. The feature portion 657 protrudes relative to the outer surface portion 626.

[0122] exist Figure 6 In the example, through-holes 667 and 668 extend through the thicker portion 627 of the cover assembly 624. For clarity, the dimensions of through-holes 667 and 668 have been enlarged. The opening of this hole is located in the outer surface 628. In some cases, the outer surface 628 may have a texture configured to impart an optical contrast with the texture of the outer surface 626, as previously described relative to... Figure 1B As discussed. In some cases, the root mean square (RMS) height of the raised surface 628 may be smaller than that of the surface 626, and in some cases may be a polished surface. The RMS height of the polished surface may, in some cases, be about 1 nm to about 125 nm, about 1 nm to about 100 nm, about 1 nm to about 75 nm, about 1 nm to about 50 nm, about 1 nm to about 25 nm, or about 1 nm to about 10 nm. In some cases, the RMS height of a surface configured to have a texture rougher than that of a polished surface may be about 0.1 μm to about 2 μm, about 0.1 μm to about 1.5 μm, about 0.1 μm to about 1.25 μm, about 0.1 μm to about 1.0 μm, about 0.25 μm to about 2 μm, about 0.25 μm to about 1.5 μm, about 0.25 μm to about 1.25 μm, or about 0.25 μm to about 1.0 μm. Relative to Figure 6 The examples of root mean square heights for different surface textures provided are generally applicable to this document. However, in other cases, the outer surface 628 may have a texture substantially the same as that of surface 626. The via may be referred to as a set of vias, and in some cases may define an array of vias. Similarly, an opening may be referred to as a set of openings, and in some cases may define an array of openings. Modules such as camera modules, sensor modules, or lighting modules may be positioned below or within each opening of the set of openings. Furthermore, at least some of the modules may extend into the corresponding vias in the set of vias.

[0123] Electronic device 600 also includes camera array 675. Figure 6 A partial cross-sectional view shows two optical modules (677, 678) of the camera array 675. The camera array 675 also includes a support structure 671. The support structure 671 can be configured to hold various elements of the camera array 675 in place. For example, one of the optical modules 677 and 678 can be mounted to the support structure 671. Figure 6In the example, the support structure 671 includes a bracket 672 with a non-planar profile. The shape of the bracket 672 is not limited to... Figure 6 This is an example, and in other examples it may have the form of a flat element. The bracket 672 may be coupled to the inner surface of the cover assembly 624. Figure 6 In the example, the support structure 671 also includes a frame 673 that is at least partially nested within the bracket 672 and supports a circuit assembly 674 that can be mounted on a printed circuit board. However, this example is not limiting, and in additional embodiments, the frame 673 may be omitted. The coupling between the support structure 671 and the camera array 675 and the inner surface 642 of the cover assembly 624 may be configured to limit the bending of the cover member 634 near the protruding feature 657.

[0124] The first optical module 677 and the second optical module 678 are aligned with the through holes 667 and 668, respectively. For example... Figure 6 As shown, the first optical module 677 extends substantially through the through-hole 667, and the second optical module 678 extends substantially through the through-hole 668. Figure 6 In one example, the end of one of the optical modules 677 and 678 extends beyond (protrudes beyond) surface 628. In another example, the end of the optical module may be flush with or recessed relative to surface portion 628. In some cases, the electronic device may include at least one optical module that is flush with or extends beyond surface portion 628 and another optical module that is recessed relative to surface portion 628.

[0125] As previously relative Figures 1A to 4 The optical module may include a camera module, an illumination module, an optical sensor, etc. Typically, the camera array 675 includes at least one camera module and may include two, three, four, or five camera modules. The camera module is electrically connected to the circuit assembly 674. Figure 6 As shown, separate windows 687 and 688 are provided on through-holes 667 and 668, and retaining member 686 holds windows 687 and 688 in place. For example, retaining member 686 may be a ring, such as a metal ring, surrounding an end of the optical module. Alternatively, the optical module may include windows as part of its optical components, wherein the windows are positioned within its housing. The windows may protect underlying components (e.g., camera, lens, other sensors) and may define a portion of the outer surface 644 covering assembly 624.

[0126] Figure 6 A coating 660 is shown disposed along the inner surface 652 of the cover member 634. In some cases, the coating 660 may provide the desired color to the cover member 624. In additional cases, the coating 660 may serve as a mask layer.

[0127] like Figure 6 As shown, camera array 675 is coupled to coating 660. In examples where coating 660 does not extend below protruding feature 657, camera array 675 may be coupled more directly to the inner surface 652 of cover member 634. In some cases, camera array 675 may be coupled to the inner surface 642 of cover member 624 using an adhesive bond that can be provided by an adhesive layer. As an additional example, camera array 675 may be coupled to the inner surface 642 of cover member 624 using fasteners or other forms of mechanical attachments.

[0128] In some cases, coating 660 comprises a polymer. Coating 660 may comprise at least 40%, 50%, 60%, or 70% polymer and may therefore be referred to as a polymer-based coating or a polymer coating. When coating 660 also includes a colorant, the polymer may act as a binder for the colorant. The colorant (e.g., a pigment) may be substantially dispersed in a polymer matrix. For example, the polymer may be polyester-based, epoxy-based, or urethane-based, or based on another suitable type of polymer or copolymer. Coating 660 may also include optional additives, such as one or more extenders, diluents, polymerization initiators, and / or stabilizers. In some embodiments, the polymer has a crosslinked structure.

[0129] For example, the coating 660 may include a color layer (e.g., ink, dye, paint, etc.) and / or a metallic layer. As previously described, coating 660 may include at least one color layer. The color layer may include a polymer and a colorant dispersed in the polymer, and may be transparent, translucent, or opaque. More generally, any pigment, paint, ink, dye, sheet, film, or other layer may be used as coating 660 or a portion thereof. In some embodiments, coating 660 is a multilayer coating including a first color layer and a second color layer. Each of the color layers may be transparent, translucent, or opaque. Each of the color layers may include the same colorant, or different color layers may include different colorants. The thickness of each color layer in coating 660 may be from about 2 micrometers to about 10 micrometers. In additional embodiments, in addition to one or more color layers, coating 660 may include a metallic layer.

[0130] The electronic device also includes a front cover assembly 622 and a cover member 632, which may have a shape relative to the previous one. Figures 1A to 5The characteristics of the covering assembly and covering member discussed are similar, and for the sake of brevity, those details will not be repeated here. Electronic device 600 also includes a display 664 and a touch sensor 662 disposed below the front covering assembly 622. The display 664 and touch sensor 662 are coupled to the front covering assembly 622. The display 664 may be a liquid crystal display (LCD), a light-emitting diode (LED) display, an LED-backlit LCD display, an organic light-emitting diode (OLED) display, an active-matrix organic light-emitting diode (AMOLED) display, etc. The touch sensor 662 may be configured to detect or measure a touch position along the outer surface of the front covering assembly 622. The electronic device may also include, for example, Figure 1A The forward-facing camera shown.

[0131] One of the cover components 622 and 624 is coupled to the housing component 610, such as by adhesive, fasteners, or a combination thereof (schematically represented by coupling elements 692 and 694). The housing component 610 may be similar to... Figure 1A Housing component 110. Housing component 610 at least partially defines the internal cavity 601 of electronic device 600.

[0132] Figure 7 An exemplary cross-sectional view of another sensing array of an electronic device is shown. Figure 7 A sensing array 770 is shown, which can be located at the rear of the electronic device 700 and can be along... Figure 1B An exemplary cross-sectional view of the BB. The sensing array 770 includes a camera array 775. The electronics 700 includes a housing 705, which includes a front cover assembly 722 and a rear cover assembly 724. The electronics also includes a housing component 710.

[0133] The rear cover assembly 724 includes a first cover member 734 that may extend over components of a wireless communication system and / or a wireless charging system. The rear cover assembly 724 also includes a second cover member 736 extending over a plurality of optical modules of a sensing array. The second cover member 736 defines windows on optical modules 777 and 778, and may also define windows on additional optical modules of the sensing array 770. The portion of the rear cover assembly 724 including the second cover member 736 is thicker than the portion including the first cover member 734. Therefore, the second cover member 736 is offset relative to the first cover member 734. A coupling ring 785 couples the cover member 736 to the cover member 734. The coupling ring 785 may be formed of a metallic material or another suitable material.

[0134] The first cover member 734 may define an opening 765, in which an insert 738 may be positioned. The insert 738 defines through holes 767 and 768, and optical modules 777 and 778 extend at least partially into these through holes. A protruding feature 757 is defined by the insert 738, the second cover member 736, and a coupling ring 785. For ease of illustration, the dimensions of the through holes 767 and 768 are enlarged. The insert 738 may also be coupled to the coupling ring, the first cover member 734, or both, for example, using an adhesive.

[0135] Similar to cover member 634, first cover member 734 may be formed of a glass material, may be formed of a glass-ceramic material, and may include one or more glass portions and one or more glass-ceramic portions, or may be formed of a glass-ceramic layer combined with one or more of a glass layer, a ceramic layer, or a polymer layer. In some cases, cover member 734 comprises a glass-ceramic material. The optical, electrical, and magnetic properties of first cover member 734 may be similar to those previously described with respect to cover member 634. Furthermore, first cover member 734 may have a texture similar to that previously described with respect to cover member 634.

[0136] In some cases, the cover member 736 is substantially transparent and has lower haze and / or higher transmittance in the visible range than the cover member 734. In additional cases, the cover member 736 may include translucent or opaque portions. When the cover member 736 defines a window on one or more optical components, the optical properties of the cover member 736 may be determined in part by the wavelength range in which the optical component is configured to operate therein. For example, the optical component may be configured to operate in the visible wavelength range, the near-infrared range, or both. For example, the cover member 736 may have one or more optical properties similar to those described for cover members 232 and 436.

[0137] In some embodiments, the cover member 736 may be formed of a glass material, or one or more glass layers bonded to one or more of a glass-ceramic layer, a ceramic layer, or a polymer layer. In additional embodiments, the cover member 736 is formed of a glass-ceramic material, or one or more glass-ceramic layers bonded to one or more of a glass layer, a ceramic layer, or a polymer layer. In additional embodiments, the cover member 736 is formed of a ceramic material such as sapphire.

[0138] In some cases, the insert 738 is substantially transparent, translucent, or opaque. In some embodiments, the insert 738 may be formed of a glass material, or one or more glass layers bonded to one or more of a glass-ceramic layer, a ceramic layer, or a polymer layer. In additional embodiments, the insert 738 is formed of a glass-ceramic material, or one or more glass-ceramic layers bonded to one or more of a glass layer, a ceramic layer, or a polymer layer. In additional embodiments, the insert 738 is formed of a ceramic material.

[0139] In an additional embodiment, a monolithic covering component formed from a single piece of material (instead of) Figure 7 The individual cover members 734 and 736 and insert 738 shown may extend over one or more optical modules of the sensing array and over other components of the electronic device. Such an integral cover member may also be referred to as a monolithic cover member. In some cases, such a cover member may include a first portion having a shape similar to that of the first cover member 734. For example, the first portion may define a substantially planar region surrounding the sensing array. Furthermore, such a cover member may include a second portion having a shape similar to that of the second cover member 736. For example, the second portion may define a substantially planar region extending over the optical module of the sensing array and offset relative to the first portion. The cover member may also include a third portion extending between the first and second portions. Such an integral cover member may be formed of a glass-ceramic material, or may include one or more glass-ceramic layers, which are associated with glass layers, ceramic layers, or as previously described, relative to… Figure 1A and Figure 1B One or more of the polymer layers are combined.

[0140] In some cases, such an integral cover member may have optical properties similar to those of cover member 736, and electrical and magnetic properties similar to those of cover member 734 in all three portions. In additional cases, the cover member may include different optical properties in different portions. For example, the cover member may include substantially transparent portions extending over one or more optical modules of the sensing array, and may also include one or more translucent or opaque portions, which may be similar to those previously described. Figure 1A and Figure 1B The translucent or opaque portion.

[0141] Camera module 775 and optical modules 777 and 778 may be similar to camera module 675 and optical modules 677 and 678. Furthermore, support structure 771, bracket 772, frame 773, and circuit assembly 774 may be similar to support structure 671, bracket 672, frame 673, and circuit assembly 674. Front cover assembly 722, cover member 732, display 764, touch sensor 762, housing member 710, coupling elements 792 and 794, and internal cavity 701 may be similar to front cover assembly 622, cover member 632, display 664, touch sensor 662, housing member 610, coupling elements 692 and 694, and internal cavity 601. The portions 725 and 727, surfaces 726 and 728, protruding features 757, through holes 767 and 768, outer surface 744, and inner surface 742 of the rear cover member 724 may be similar to the portions 625 and 627, surfaces 626 and 628, protruding features 657, through holes 667 and 668, outer surface 644, and inner surface 642 of the rear cover member 624. The inner surface 752 and coating 760 of the rear cover member 734 may be similar to the inner surface 652 and coating 660 of the rear cover member 634. For the sake of simplicity, these details will not be repeated here.

[0142] Figure 8 An exemplary cross-sectional view of another sensing array of an electronic device is shown. Figure 8 A sensing array 870 is shown, which can be located at the rear of the electronic device 800 and can be along... Figure 1B An exemplary cross-sectional view of BB. The sensing array 870 includes a camera array 875. The electronics 800 includes a housing 805, which includes a front cover assembly 822 and a rear cover assembly 824. The electronics also includes a housing component 810.

[0143] The rear cover assembly 824 includes a first cover member 834 that may extend over components of a wireless communication system and / or a wireless charging system. The rear cover assembly 824 also includes a second cover member in the form of an insert 838. A coupling ring 885 couples the first cover member 834 to the insert 838. In some cases, an adhesive may also be used to couple the first cover member 834 to the insert 838. The first cover member 834 may define an opening 865 in which the insert 838 may be positioned. The portion of the rear cover assembly 824 including the insert 838 is thicker than the portion including the first cover member 834. Additionally, a protruding feature 857 is defined by the insert 838 and the coupling ring 885.

[0144] Camera array 875 includes two optical modules (877, 878). Insert 838 defines through holes 867 and 868, and optical modules 877 and 878 extend at least partially into these through holes. Coupling ring 885 may be similar to coupling ring 785. For ease of illustration, the dimensions of through holes 867 and 868 are enlarged.

[0145] Similar to cover members 634 and 734, cover member 834 may be formed of a glass material, may be formed of a glass-ceramic material, and may include one or more glass portions and one or more glass-ceramic portions, or may be formed of a glass-ceramic layer combined with one or more of a glass layer, a ceramic layer, or a polymer layer. In some cases, cover member 834 comprises a glass-ceramic material. The optical, electrical, and magnetic properties of cover member 834 may be similar to those previously described with respect to cover member 634.

[0146] In some embodiments, the insert 838 may be formed of a glass material, or one or more glass layers bonded to one or more of a glass-ceramic layer, a ceramic layer, or a polymer layer. In additional embodiments, the insert 838 may be formed of a glass-ceramic material, or one or more glass-ceramic layers bonded to one or more of a glass layer, a ceramic layer, or a polymer layer. The insert 838 may also include one or more other durable materials, such as metals, ceramics, etc.

[0147] In some cases, insert 838 may be substantially transparent, translucent, or opaque. Insert 838 may have one or more optical properties similar to those of insert 738, and for the sake of simplicity, those details will not be repeated here. (In contrast to the previous...) Figure 1B and Figure 6 In a similar manner, in some cases, surface 828 (defined by insert 838) may have a different texture than surface 826 (defined by cover member 834), while in other cases, surface 828 may have a texture substantially the same as that of surface 826. For example, surface 828 may have a root mean square height smaller than that of surface 826, and in some cases may be a polished surface. Relative to Figure 6 The examples of root mean square heights for different surface textures provided are applicable to surfaces 828 and 826, and will not be repeated here for the sake of simplicity.

[0148] Camera module 875, optical modules 877 and 878, windows 887 and 888, and retaining member 886 may be similar to camera module 675, optical modules 677 and 678, windows 687 and 688, and retaining member 686. Furthermore, support structure 871, bracket 872, frame 873, and circuit assembly 874 may be similar to support structure 671, bracket 672, frame 673, and circuit assembly 674. Front cover assembly 822, cover member 832, display 864, touch sensor 862, housing member 810, coupling elements 892 and 894, and internal cavity 801 may be similar to front cover assembly 622, cover member 632, display 664, touch sensor 662, housing member 610, coupling elements 692 and 694, and internal cavity 601. The portions 825 and 827, surfaces 826 and 828, protruding features 857, through holes 867 and 868, outer surface 844, and inner surface 842 of the rear cover assembly 824 may be similar to the portions 625 and 627, surfaces 626 and 628, protruding features 657, through holes 667 and 668, outer surface 644, and inner surface 642 of the rear cover member 624. The inner surface 852 and coating 860 of the rear cover member 834 may be similar to the inner surface 652 and coating 660 of the rear cover member 634. For the sake of simplicity, these details will not be repeated here.

[0149] Figure 9A and Figure 9B A partial cross-sectional view of the electronic device is shown. Figure 9A It can be along Figure 1B An example of a partial cross-sectional view of CC, and Figure 9B It can be along Figure 1A An example of a partial cross-sectional view of AA. For example... Figure 9A and Figure 9B As shown, the electronic device 900 includes internal device components 981, 982, 983, and 985 positioned within a housing 905. For example, device components 981, 983, and 985 may be part of a wireless communication system, and device component 982 may be part of a wireless charging system. Additional device components 999 are schematically indicated by dashed lines and may include components relative to... Figure 12 One or more of the components mentioned above.

[0150] Cover assembly 922 includes a cover member 932 extending over internal device component 981. In some cases, cover member 932 may be formed of a glass-ceramic material. In additional cases, cover member 934 may include one or more glass portions and one or more glass-ceramic portions, or may be formed by bonding a glass-ceramic layer with one or more of a glass layer, a ceramic layer, or a polymer layer. Cover member 932 may be substantially transparent, or may include transparent, translucent, and / or opaque portions. Cover member 932 may have similar optical properties to cover member 632, and those descriptions are not repeated here for the sake of brevity.

[0151] Device component 981 may be part of a wireless communication system and, in some cases, may be a directional antenna (assembly). By way of example, device component 981 may have a main transmission direction substantially perpendicular to the front surface of the electronic device. Device component 981, as well as device components 983 and 985, may be similar to device components 181, 183, and 185 and may operate within a similar frequency range. For example, device components 981, 983, and 985 may be compatible with 5G wireless protocols (including millimeter wave and / or 6 GHz communication signals). In some cases, device components 981, 983, and 985 may be configured to transmit wireless signals in a frequency band between approximately 25 GHz and 39 GHz.

[0152] Cover assembly 924 includes a cover member 934 extending over internal device components 982 and 983. In some cases, cover member 934 may be formed of glass or glass-ceramic material. In additional cases, cover member 934 may include one or more glass portions and one or more glass-ceramic portions, or may be formed by bonding a glass-ceramic layer with one or more of a glass layer, a ceramic layer, or a polymer layer. The rear cover member 934 may be substantially transparent, translucent, opaque, or include transparent, translucent, and / or opaque portions. Cover member 934 may have similar optical properties to cover member 634, and for the sake of brevity, those descriptions will not be repeated here.

[0153] When device component 982 is part of an inductively coupled wireless charging system, the cover member 934 may be formed of a material (or combination of materials) with sufficiently low magnetic permeability, such low permeability as to not interfere with the transmission of the magnetic field generated by the inductively coupled wireless charging system. For example, components of the inductively coupled wireless charging system may include wireless receiver components, such as a wireless receiver coil or other features of the wireless charging system. The cover member 934 may have similar magnetic properties to the cover member 634.

[0154] Device component 983 may be part of a wireless communication system and, in some cases, may be a directional antenna (assembly). By way of example, device component 983 may have a main transmission direction substantially perpendicular to the rear surface of the electronic device. Therefore, cover member 934 may be configured to provide electrical characteristics suitable for use on a component of a wireless communication system. For example, cover member 934 may be a dielectric cover member and may be formed of a material having a sufficiently low dielectric constant and dissipation factor to allow RF or IR (e.g., near-infrared) signal transmission through the cover member. Cover member 934 may have dielectric properties similar to cover member 634, and the wireless communication system may be as previously described relative to... Figure 1A and Figure 1B The details mentioned above will not be repeated here for the sake of brevity.

[0155] like Figure 9B As shown, housing 905 also includes cover assembly 915. In some cases, cover assembly 915 may provide a window for device component 985. For example, cover assembly 915 may define an antenna window for transmitting and receiving wireless signals. For example, cover assembly 915 may be configured to transmit wireless signals at one or more of the frequencies previously discussed with respect to device components 181, 183, and 185. For example, cover assembly 915 may be configured to transmit wireless signals in a frequency band between approximately 25 GHz and 39 GHz.

[0156] Covering component 915 may include covering member 936. Covering member 936 may be formed of a dielectric material. In some cases, covering member 936 may be formed of a glass-ceramic material, and may include one or more glass-ceramic portions, or may be formed by bonding a glass-ceramic layer with one or more of a glass layer, a ceramic layer, or a polymer layer. In additional cases, covering member 936 may be formed of a glass material, a ceramic material, a polymer material, or a combination thereof. Covering member 936 may include one or more glass-ceramic portions, or may be formed by bonding a glass-ceramic layer with one or more of a glass layer, a ceramic layer, or a polymer layer. Covering member 936 may be substantially transparent, translucent, opaque, or may include transparent, translucent, and / or opaque portions. Covering member 936 may have similar optical properties to covering member 634, and those descriptions are not repeated here for the sake of brevity.

[0157] Device component 985 may be part of a wireless communication system and, in some cases, may be a directional antenna (assembly). By way of example, device component 985 may have a main transmission direction that is substantially perpendicular to the side surface of the electronic device.

[0158] The housing 905 of the electronic device 900 also includes a housing component 910. The housing component 910 includes members 912a and 912b. Members 912a and 912b may be formed of metal or another conductive material. Alternatively, members 912a and 912b may be made of a material suitable for… Figure 1A and Figure 1B The components 112a, 112b, 112c and 112d are formed of any material described herein.

[0159] Figure 10 Another exemplary electronic device is shown, which includes a sensing array, also referred to as a sensing panel. The electronic device 1000 may be a wearable electronic device such as a watch, and the sensing panel 1070 may be located at the rear of the electronic device.

[0160] Electronic device 1000 includes a rear cover assembly 1024. Figure 10 In the example, the rear cover assembly 1024 includes a cover member 1036 positioned on at least a portion of the sensing panel 1070. The rear cover assembly also includes a cover member 1034. The rear cover assembly 1024 may at least partially define the rear surface 1004 of the wearable electronic device 1000. For example, when the wearable electronic device is worn, the rear surface 1004 of the device may contact the user's skin. Electrodes 1054 may be positioned along the rear surface 1004 and contact the skin of the user wearing the device. The electronic device 1000 also includes a housing component 1010 and input devices 1003 and 1007. Electronic devices typically also include a front cover assembly and a display, as discussed in further detail below.

[0161] like Figure 10 As shown, the electronic device includes a sensing panel 1070. The sensing panel 1070 may include one or more sensor components. For example, the one or more sensor components may be one or more health monitoring sensor components or biosensor components, such as an electrocardiogram (ECG) sensor, a photoplethysmography (PPG) sensor, a heart rate sensor, a pulse oximeter or other oxygen sensor, or other biosensors. In some cases, the sensor components are configured to illuminate the tissue of a user wearing the device and then measure the light transmitted back to the device.

[0162] exist Figure 10 In one example, the sensing panel 1070 includes four optical modules 1082 and four optical modules 1083. In some examples, optical modules 1082 are configured to emit a first optical signal, and optical modules 1083 are configured to detect a second optical signal transmitted back to the device. For example, the second optical signal may include light from the first optical signal that is reflected back to the device 1000, also referred to as a reflection of the first optical signal. Figure 10The examples provided are not limiting, and the electronic device may include more or fewer optical modules. Furthermore, the arrangement of the transmitter and receiver modules is not limited to... Figure 10 The layout shown.

[0163] Electronic devices may include one or more optical modules that emit light, also referred to herein as transmitter modules. The transmitter module may emit light within at least a portion of the visible spectrum (e.g., green and / or red light), in which case the optical signal may be a visible (light) signal. Alternatively or otherwise, the transmitter module may emit light in the near-infrared wavelength range, in which case the optical signal may be a near-infrared (light) signal.

[0164] In some embodiments, the sensing array includes a biosensor assembly comprising one or more transmitter modules and one or more receiver modules. For example, a heart rate biosensor may include transmitter modules that generate visible light signals (e.g., green light) and infrared light signals. As another example, a pulsed oxygenation biosensor (e.g., an SpO2 sensor) may include transmitter modules that generate optical signals within different wavelength ranges (e.g., red light) absorbed by oxyhemoglobin and deoxyhemoglobin, and optical signals within similar wavelength ranges (e.g., green or infrared light) absorbed by oxyhemoglobin and deoxyhemoglobin. The biosensor assembly may include a base positioned below the cover assembly 1024, and the transmitter and receiver modules may be attached to the base.

[0165] In some examples, the cover member 1036 may be positioned on optical modules 1082 and 1083 (and the cover member 1036 may act as a window for optical modules 1082 and 1083). In other examples, the cover member 1036 may define an opening positioned on optical modules 1082 and 1083, and an additional cover member may be placed in or on the opening (and act as a window for optical modules 1082 and 1083).

[0166] In some cases, the cover member 1036 may be formed of a glass-ceramic material. The glass-ceramic cover member may be substantially transparent or may include transparent and translucent portions. The cover member 1036 may have optical properties suitable for use on optical components configured to operate in the visible and near-infrared wavelength ranges. These optical properties may be similar to those described for cover member 734 or other cover members described herein. In some cases, the cover member 1034 may be translucent or opaque or include translucent or opaque portions. The cover member 1036 may be formed of a glass-ceramic material, a ceramic material, a glass material, or a combination thereof, as previously described relative to… Figure 1A and Figure 1B As stated above.

[0167] like Figure 10 As shown, housing 1005 includes housing member 1010 that defines a curved side surface 1006 extending from the bottom surface of the electronic device to the top surface. In some cases, the rear surface 1004 of the electronic device 1000 may be substantially flat, while in others, the cover member 1036 may define a convex outer profile. A strap 1050 may be attached to the housing and configured to secure the wearable electronic device to a user (in...). Figure 10 In the middle, the band 1050 is curved to show the rear surface 1004). The housing 1005 may define a cavity, and the housing member 1010 may define an opening to the cavity.

[0168] The display, such as a touch-sensitive display, may be at least partially disposed within the cavity and may have a visible area. The device may also include a front cover member disposed on the display and including a flat central portion larger than the visible area of ​​the display, and curved edge portions surrounding the flat central portion and coinciding with curved side portions along the periphery of the cavity to form a continuous profile surface. In some cases, the front cover member may be formed of a glass-ceramic material. The front cover member may have similar optical properties to cover members 132 and 232 (as is suitable for use on optical components configured to operate in the visible wavelength range). For the sake of brevity, those descriptions will not be repeated here.

[0169] The electronic device 1000 may also include a crown module, which is at least partially positioned within a hole formed in a curved side portion of the housing. The crown module may include an input member 1003 (e.g., a dial pad) having an external surface configured to receive rotary user input. The crown module may be offset relative to the centerline of the housing between a top portion and a flat bottom portion. This offset may be towards the top portion of the housing. The crown module may include a dial pad, a portion of which is above the interface between the cover and the housing.

[0170] Figure 11A and Figure 11B A view of an additional exemplary electronic device including a sensing array is shown. Figure 11B A sensor array 1170 is shown that can be located at the rear of the electronic device 1100. The sensor array 1170 is associated with a protruding feature 1157 of the housing 1105.

[0171] Electronic device 1100 includes a housing 1105, which includes a front cover assembly 1122 and a rear cover assembly 1124. Housing 1105 also includes a housing component 1110. (This is for...) Figure 1BIn a similar manner, the thicker portion of the rear cover assembly 1124 defines a protruding feature 1157. A sensing array 1170 is located at this thicker portion of the rear cover assembly 1124. A housing 1105 defines the front surface 1102, rear surface 1104, and side surface 1106 of the electronic device 1100.

[0172] The sensing array 1170 includes a sensor module 1154 and a camera module 1152. The sensor module 1154 may be an ambient light sensor, a LiDAR sensor, or a previously configured sensor. Figure 1B Any of the aforementioned optical sensor modules. Each camera module in camera module 1152 can be configured to operate in the visible wavelength range. Relative to Figure 1A and Figure 1B The description of the provided camera module is generally applicable to this document and will not be repeated here for the sake of brevity. The sensing array 1170 also includes another sensor component 1153, such as a microphone, smaller optical components (e.g., a flash), etc.

[0173] The rear cover assembly 1124 includes a cover member 1134 and a cover member 1136. The cover member 1134 extends over the internal component 1182 of the electronic device. The cover member 1134 may be configured to allow electromagnetic signals to be transmitted to and / or from the internal component 1182. In some cases, the internal component 1182 is part of a wireless communication system. For example, the internal component 1182 may be an antenna configured to radiate RF signals. The antenna and the wireless communication system may be previously relative to... Figure 1A and Figure 1B Either the antenna or the wireless communication system.

[0174] In some cases, the cover member 1134 may be formed of a glass material, or a glass-ceramic material, and may include one or more glass portions and one or more glass-ceramic portions, or may be formed by combining a glass-ceramic layer with one or more of a glass layer, a ceramic layer, or a polymer layer. In some cases, the cover member 1134 comprises a glass-ceramic material. The optical, electrical, and magnetic properties of the cover member 1134 may be similar to those previously described for cover members 634, 734, or 834, or other cover members described herein. In additional cases, the cover member 1134 may be formed of a metallic material and integrated with the housing member 1110. In such cases, if desired, an additional RF transmission cover member may be provided on the internal component 1182.

[0175] In some cases, the second covering member 1136 is used in conjunction with the previous one. Figure 7A similar arrangement extends over the sensor module 1154 and camera module 1152 of the sensing array. In other cases, the second cover member 1136 may define a through-hole, and the sensor module 1154 and camera module 1152 may extend into the through-hole, as previously described. Figure 8 As shown. The covering member 1136 at least partially defines the protruding feature 1157, as previously described relative to... Figure 7 The coupling ring 1185 can couple the cover member 1136 to the cover member 1134. The cover member 1136 may have a similar composition and optical and electrical / magnetic properties as the cover member 736. For the sake of brevity, these details will not be repeated here. In an additional embodiment, the integral cover member 1134 may be coupled with a cover member 1134. Figure 6 The protruding feature 1157 is defined in a similar manner.

[0176] The front cover assembly 1122 may be positioned on the display 1142 and may have a substantially transparent window through which the display can be viewed. The front cover assembly 1122 includes a cover member 1132, which may be formed of or may include a glass-ceramic material. In some cases, the cover member 1132 may have similar composition and optical properties as described for cover members 122 and 222, and for the sake of brevity, these descriptions will not be repeated here.

[0177] The housing component 1110 includes a plurality of members. Members 1112a, 1112b, 1112c, and 1112d may be formed of metal or another conductive material. Alternatively, members 1112a, 1112b, 1112c, and 1112d may be made of a material suitable for use with other conductive materials. Figure 1A and Figure 1B Components 112a, 112b, 112c, and 112d may be formed of any of the materials described above. Components 1114 and 1115 may be formed of a polymer or another dielectric material, as previously described for... Figure 1A and Figure 1B The components 114a, 114b, 114c, and 114d are described. The electronic device also includes input devices 1137 and 1138, which may be similar to those relative to… Figure 1A and Figure 1B The input devices 152 and 154 are described above. For the sake of brevity, those descriptions will not be repeated here.

[0178] Figure 12 A block diagram of a sample electronic device incorporating components of glass-ceramic materials described herein is shown. Figure 12 The schematic diagram shown can correspond to the above. Figures 1A to 11B The components of the device described herein. However, Figure 12 It can also be used more generally to refer to other types of electronic devices as described herein that have components including glass-ceramic materials.

[0179] In an implementation, electronic device 1200 may include sensor 1220 to provide information about the configuration and / or orientation of the electronic device in order to control the output of the display. For example, when all or part of the visible area of ​​display 1208 is blocked or substantially obscured, a portion of display 1208 may be turned off, disabled, or placed in a low-power state. As another example, display 1208 may be adapted to rotate the display of graphic output based on a change in the orientation of device 1200 (e.g., 90 degrees or 180 degrees) in response to rotation of device 1200.

[0180] Electronic device 1200 also includes a processor 1206 operatively connected to computer-readable storage 1202. Processor 1206 may be operatively connected to storage 1202 via an electronic bus or bridge. Processor 1206 may be implemented as one or more computer processors or microcontrollers configured to perform operations in response to computer-readable instructions. Processor 1206 may include the central processing unit (CPU) of device 1200. Additionally or alternatively, processor 1206 may include other electronic circuitry located within device 1200, including application-specific integrated circuits (ASICs) and other microcontroller devices. Processor 1206 may be configured to perform the functions described in the examples above.

[0181] Memory 1202 may include various types of non-transitory computer-readable storage media, including, for example, read-access memory (RAM), read-only memory (ROM), erasable programmable memory (e.g., EPROM and EEPROM), or flash memory. Memory 1202 is configured to store computer-readable instructions, sensor values, and other persistent software elements.

[0182] Electronic device 1200 may include control circuitry 1210. Control circuitry 1210 may be implemented in a single control unit and need not be implemented as a separate circuit element. As used herein, "control unit" will be used synonymously with "control circuitry". Control circuitry 1210 may receive signals from processor 1206 or from other elements of electronic device 1200.

[0183] like Figure 12As shown, electronic device 1200 includes a battery 1214 configured to provide power to components of electronic device 1200. Battery 1214 may include one or more power storage units connected together to provide an internal power supply. Battery 1214 may be operatively coupled to power management circuitry configured to provide appropriate voltage and power levels for individual components or groups of components within electronic device 1200. Battery 1214 may be configured via the power management circuitry to receive power from an external power source, such as an AC power outlet. Battery 1214 may store the received power, enabling electronic device 1200 to operate for extended periods, ranging from several hours to several days, without connection to an external power source.

[0184] In some embodiments, electronic device 1200 includes one or more input devices 1218. Input device 1218 is a device configured to receive input from a user or environment. For example, input device 1218 may include, for example, a push-button, a touch-activated button, a capacitive touch sensor, a touchscreen (e.g., a touch-sensitive display or force-sensitive display), a capacitive touch button, a dial pad, a crown, etc. In some embodiments, input device 1218 may provide dedicated or primary functions, including, for example, a power button, volume buttons, a home button, a scroll wheel, and a camera button.

[0185] Device 1200 may also include one or more sensors or sensor modules 1220, such as force sensors, capacitive sensors, accelerometers, barometers, gyroscopes, proximity sensors, light sensors, etc. In some cases, device 1200 includes a sensor array (also referred to as a sensing array) comprising multiple sensors 1220. For example, a sensor array associated with a protruding feature of a covering member may include an ambient light sensor, a lidar sensor, and a microphone. As previously mentioned relative to... Figure 1BOne or more camera modules may also be associated with the protruding feature structure. Sensor 1220 is operatively coupled to processing circuitry. In some embodiments, sensor 1220 may detect deformation and / or changes in configuration of the electronic device and is operatively coupled to processing circuitry that controls the display based on sensor signals. In some specific embodiments, the output from sensor 1220 is used to reconfigure the display output to correspond to the orientation or folded / unfolded configuration or state of the device. Exemplary sensors 1220 for this purpose include accelerometers, gyroscopes, magnetometers, and other similar types of positioning / orientation sensing devices. Furthermore, sensor 1220 may include microphones, acoustic sensors, light sensors (including ambient light, infrared (IR) light, ultraviolet (UV) light), optical facial recognition sensors, depth measurement sensors (e.g., time-of-flight sensors), health monitoring sensors (e.g., electrocardiogram (ERG) sensors, heart rate sensors, photoplethysmography (PPG) sensors, pulse oximeters), biometric sensors (e.g., fingerprint sensors), or other types of sensing devices.

[0186] In some embodiments, the electronic device 1200 includes one or more output devices 1204 configured to provide output to a user. The output device 1204 may include a display 1208 that displays visual information generated by the processor 1206. The output device 1204 may also include one or more speakers to provide audio output. The output device 1204 may also include one or more tactile devices configured to generate tactile or perceptual outputs along an external surface of the device 1200.

[0187] Display 1208 may include a liquid crystal display (LCD), a light-emitting diode (LED) display, an LED-backlit LCD display, an organic light-emitting diode (OLED) display, an active-matrix organic light-emitting diode (AMOLED) display, an organic electroluminescent (EL) display, an electrophoretic ink display, etc. If display 1208 is a liquid crystal display or an electrophoretic ink display, it may also include a backlight component controllable to provide a variable display brightness level. If display 1208 is an organic light-emitting diode or organic electroluminescent display, the brightness of display 1208 can be controlled by modifying the electrical signals provided to the display element. Furthermore, information regarding the configuration and / or orientation of the electronic device can be used to control the output of the display, as described with respect to input device 1218. In some cases, the display is integrated with a touch sensor and / or force sensor to detect touch and / or force applied along the external surface of device 1200.

[0188] Electronic device 1200 may also include a communication port 1212 configured to transmit and / or receive signals or electrical communications from external devices or individual devices. Communication port 1212 may be configured to couple to an external device via a cable, adapter, or other type of electrical connector. In some embodiments, communication port 1212 may be used to couple electronic device 1200 to a host computer.

[0189] The electronic device 1200 may also include at least one accessory 1216, such as a camera, a flash for the camera, or other such device. The camera may be part of a camera array or sensor array that can be connected to other parts of the electronic device 1200, such as control circuitry 1210.

[0190] As used herein, the terms “about,” “approximately,” “substantially,” “similar,” etc., are used to describe relatively small variations, such as + / -10%, + / -5%, + / -2%, or + / -1%. Furthermore, the term “about” may be used with respect to the endpoints of a range to indicate variations of + / -10%, + / -5%, + / -2%, or + / -1% in the endpoint values. Additionally, disclosing a range in which at least one endpoint is described as “about” a specific value includes disclosing a range in which the endpoint is equal to the specific value.

[0191] As used herein, the phrase "one or more of" or "at least one of" following a series of items separated by the terms "and" or "or" modifies the list as a whole, not each member of the list. The phrase "one or more of" or "at least one of" does not require selection of at least one of each of the listed items; rather, it allows for the inclusion of at least one of any item in the list and / or at least one of any combination of items and / or at least one of each item in the list. For example, the phrases "one or more of A, B, and C" or "one or more of A, B, or C" each refer to only A, only B, or only C; any combination of A, B, and C; and / or one or more of each of A, B, and C. Similarly, it is to be understood that the order of elements presented with respect to the combined or separate lists provided herein should not be construed as limiting this disclosure to the order provided.

[0192] The following discussion applies to the electronic devices described herein, and its scope extends to devices that can be used to acquire personally identifiable information data. It is well known that the use of personally identifiable information should comply with privacy policies and practices that are generally recognized as meeting or exceeding industry or governmental requirements for protecting user privacy. Specifically, personally identifiable information data should be managed and processed to minimize the risk of unintentional or unauthorized access or use, and the nature of authorized use should be clearly explained to the user.

[0193] For illustrative purposes, the foregoing description uses specific names to provide a thorough understanding of the described embodiments. However, it will be apparent to those skilled in the art that specific details are not required to practice the described embodiments. Therefore, the foregoing description of specific embodiments described herein is presented for purposes of illustration and description. They are not intended to be exhaustive or to limit the embodiments to the precise forms disclosed. It will be apparent to those skilled in the art that many modifications and variations are possible in light of the teachings above.

Claims

1. An electronic device, the electronic device comprising: Housing, the housing comprising: A housing component that defines a side surface of the housing; A front cover assembly, coupled to the housing component and including a front cover member formed of a first glass-ceramic material comprising one or more crystalline phases from 70% to 90% by weight, the front cover member having: For an average transmittance of visible light greater than or equal to 85%; and Haze value less than 0.5%; and An average transmittance greater than or equal to 85% in the infrared range; and A rear cover assembly coupled to the housing component and including a rear cover member formed of a second glass-ceramic material having a dielectric constant of less than 30; A display, the display being positioned below the front cover assembly; A forward-facing biometric sensor assembly, positioned below the front cover member, comprising: A transmitter module configured to operate via the front cover member and emit optical signals within the infrared light range; and An infrared image sensor, configured to operate via the front cover member; and A transceiver component of a wireless communication system, the transceiver component being positioned below the rear cover assembly.

2. The electronic device according to claim 1, wherein, The transceiver component is a directional antenna configured to transmit wireless signals in a frequency band between 25 GHz and 39 GHz.

3. The electronic device according to claim 2, wherein: The directional antenna is a first directional antenna; The frequency band is the first frequency band; and The electronic device also includes a second directional antenna positioned below the front cover assembly and configured to transmit wireless signals in a second frequency band between 25 GHz and 39 GHz.

4. The electronic device according to claim 1, wherein: The rear cover member defines a protruding region having a raised platform surface and an array of openings extending into the raised platform surface; and The electronic device further includes a rear sensing array, which includes a camera module array, each camera module in which is positioned in a corresponding opening of the opening array.

5. The electronic device according to claim 4, wherein, The rear sensing array also includes an infrared sensor module configured to estimate the distance between the electronic device and the object.

6. The electronic device according to claim 1, wherein: The front cover member has a color characterized by an a* value of less than 1 and a b* value of less than 2, and the haze value is less than or equal to 0.2%.

7. The electronic device according to claim 1, wherein: The front cover member is positioned on the display and defines an opening on the camera module of the forward-facing camera array; and The front cover assembly also includes a window positioned within the opening, the window comprising a material different from the first glass-ceramic material.

8. An electronic device, the electronic device comprising: monitor; A forward biometric sensor assembly, the forward biometric sensor assembly comprising: A transmitter module configured to emit optical signals in the infrared range; and A receiver module, configured to detect the reflection of the optical signal and including an image sensor; and Housing, the housing comprising: Housing components; A front cover assembly coupled to the housing component and including a glass-ceramic cover member positioned above the display and the forward-facing biometric sensor assembly, the glass-ceramic cover member comprising one or more crystalline phases from 70% to 90% by weight and having: Haze value less than 0.5%; and Average transmittance greater than or equal to 85% in the infrared range; and For an average transmittance of visible light greater than or equal to 85%; and A rear cover assembly coupled to the housing component and including a cover member containing a semi-transparent portion.

9. The electronic device according to claim 8, wherein: The electronic device further includes a rear camera array, which includes a camera module array; The rear cover component defines an array of vias; and Each camera module of the camera module array extends into a corresponding through-hole of the through-hole array.

10. The electronic device according to claim 9, wherein, The rear cover assembly further includes at least one transparent window member coupled to the cover member and positioned on at least one through-hole of the through-hole array.

11. The electronic device according to claim 8, wherein: The glass-ceramic cover component of the front cover assembly is formed of a first glass-ceramic material; and The cover member of the rear cover assembly is formed of a second glass-ceramic material that is different from the first glass-ceramic material.

12. The electronic device according to claim 11, wherein, The semi-transparent portion of the cover member of the rear cover assembly includes a first crystal size in the outer surface region and a second crystal size in the inner region that is larger than the first crystal size.

13. The electronic device according to claim 8, wherein, The glass-ceramic covering component has a thickness of 250 micrometers to 1.5 millimeters.

14. The electronic device according to claim 11, wherein, The semi-transparent portion of the cover member of the rear cover assembly is positioned on the wireless charging component.

15. An electronic device, the electronic device comprising: monitor; A sensing array including a biometric sensor assembly, the biometric sensor assembly including at least one transmitter module and at least one infrared image sensor, the transmitter module being configured to emit light in the infrared range; as well as Housing, the housing comprising: Housing component, the housing defining a side surface of the electronic device; and A cover assembly defining the front surface of the electronic device, the cover assembly including a cover member positioned above the display and the biometric sensor assembly, the cover member being formed of a glass-ceramic material comprising one or more crystalline phases by weight from 70% to 90%, and having: For an average transmittance of visible light greater than or equal to 85%; An average transmittance greater than or equal to 85% in the infrared range; Haze value less than 0.5%; and A color described by an L* value of 90 or greater, an a* value of less than 0.5, and a b* value of less than 1.

16. The electronic device according to claim 15, wherein: The covering component is a first covering component, the covering member is a first covering member, and the glass-ceramic material is a first glass-ceramic material; The housing component defines an opening along the side surface; The electronic device further includes a second cover assembly, the second cover assembly comprising a second cover member formed of a second glass-ceramic material and positioned within the opening; and The electronic device includes a directional antenna assembly positioned below a second coverage assembly and configured to transmit wireless signals in a frequency band between 25 GHz and 39 GHz.

17. The electronic device according to claim 16, wherein: The housing also includes a third cover assembly that defines the rear surface of the electronic device; The third covering assembly includes a third covering member formed of a third glass-ceramic material; and The electronic device also includes a wireless charging component positioned below the third covering member.

18. The electronic device according to claim 17, wherein, Each of the first glass-ceramic material, the second glass-ceramic material, and the third glass-ceramic material has a dielectric constant of 2 to 20 in the RF band.

19. The electronic device according to claim 17, wherein, Each of the second glass-ceramic material and the third glass-ceramic material comprises at least 10% by weight of one or more crystalline phases.

20. The electronic device according to claim 15, wherein: The covering member is chemically strengthened to form a compressive stress layer along the front surface of the covering member; and The molar percentage of sodium oxide in the surface region of the compressive stress layer is less than 5%.

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