Method for manufacturing rigid-flexible board and rigid-flexible board

Abstract

The present invention discloses a method for manufacturing a rigid-flexible board and a rigid-flexible board, the method comprising: providing an outer soft board to be pressed, an inner rigid board, a first semi-cured sheet, and a second semi-cured sheet; placing the inner rigid board, the first semi-cured sheet, the second semi-cured sheet, and the outer soft board in order from the inside out, and placing a covering module at the through groove to form the rigid-flexible board to be pressed; performing a pressing process on the rigid-flexible board to be pressed, and after the pressing process, performing a post-processing process; performing a molding process on the rigid-flexible board after the post-processing process, extracting the movable part of the covering module located in the through groove to form the rigid-flexible board. This method reduces one pressing process by providing a covering module made of the same material as the dielectric layer of the inner rigid board, and has fewer production processes, and can provide a good processing effect for the rigid-flexible board with the flexible board on the outer layer.

Description

Technical Field

[0001] The present invention relates to the field of circuit boards, and in particular to a method for manufacturing a rigid-flexible board and a rigid-flexible board. Background Art

[0002] Generally speaking, the flexible board layer (i.e. soft board layer) of the rigid-flex board is on the inner layer. During the processing of this design, it is only necessary to use the depth-controlled milling plate to "uncover" the rigid board layer covering the flexible board area to form a rigid-flex board.

[0003] However, for some areas that require special electrical signal transmission, there is a type of rigid-flex PCB that designs the flexible board area on the outer layer, while the rigid layer located in the inner layer of the board needs to be "hollowed out", thus forming a rigid-flex PCB with the flexible board layer designed on the outer layer, and "hollowing out" the inner layer of the rigid board becomes a processing difficulty.

[0004] At present, the general process is to first process one side of the flexible board layer and the rigid board layer that needs to be "hollowed out" to form a "flexible board layer + rigid board layer + rigid board trough" foundation, and then attach release material (such as: silicone pad, polytetrafluoroethylene film, etc.) to the position of the rigid board trough, and then arrange and press the flexible board layer on the other side, and finally remove the release material to form a rigid-flexible composite board with the flexible board layer on the outer layer.

[0005] However, the above process has the following problems:

[0006] (1) The flexible board layers on the upper and lower surfaces are pressed twice. Multiple pressings make it difficult to control the uniformity of expansion and contraction between different layers, which easily leads to the problem of upper and lower deviation.

[0007] (2) Pad with release material. Since the expansion and contraction characteristics of the release material do not match those of the rigid board dielectric layer, it is easy to produce bulges and depressions during pressing, causing the outer layer circuit to open or short-circuit.

[0008] Based on the above problems, it is necessary to provide a method for manufacturing a rigid-flexible board that can effectively solve the problem of the flexible board area being designed on the outer layer. Summary of the Invention

[0009] The main purpose of the present invention is to provide a method for manufacturing a rigid-flexible board and a rigid-flexible board, aiming to solve the problems of the existing rigid-flexible board manufacturing method easily causing upper and lower deviations or easily generating protrusions and depressions.

[0010] To achieve the above objectives, the present invention provides a method for manufacturing a rigid-flexible board, the method comprising:

[0011] Providing an outer layer soft board to be pressed, wherein the outer layer soft board includes a first outer layer soft board and a second outer layer soft board;

[0012] Providing an inner rigid board located between the first outer soft board and the second outer soft board, wherein the inner rigid board is provided with a through groove in a bending area;

[0013] Providing a first prepreg located on both sides of the inner rigid plate, wherein the first prepreg is provided with a first window at the through groove;

[0014] Providing a second prepreg located outside the first prepreg, wherein the second prepreg is provided with a second window at the through groove;

[0015] The inner rigid board, the first prepreg, the second prepreg, and the outer flexible board are placed in order from the inside out, and a cover mold module is placed at the through groove to form a rigid-flexible board to be pressed;

[0016] Performing a lamination process on the rigid-flexible board to be laminated, and performing a post-processing process after the lamination process;

[0017] The rigid-flexible board after the post-processing is subjected to a forming process, and the movable part of the cover module located in the through groove is extracted to form the rigid-flexible board.

[0018] Furthermore, the width of the first window is 0.6-1.2 mm greater than the width of the through groove; the width of the second window is 2.0-2.8 mm greater than the width of the through groove.

[0019] Furthermore, the covering module includes a covering module body and a first covering film located on both sides of the covering module body and a second covering film located outside the first covering film, wherein the width of the covering module body is less than the width of the through groove by 0.2 mm, and the covering module body and the first covering film form the movable part of the covering module.

[0020] Furthermore, the first covering film includes a first covering film layer and a first covering film adhesive layer, and the second covering film includes a second covering film layer and a second covering film adhesive layer; wherein,

[0021] The first covering film adhesive layer is located on both sides of the covering module body;

[0022] The second cover film adhesive layer is located on the inner side of the outer soft board;

[0023] The first covering film layer and the second covering film layer are arranged adjacent to each other.

[0024] Furthermore, a silicone oil layer is provided between the first covering film layer and the second covering film layer.

[0025] Furthermore, the covering module body includes a first covering module body and a second covering module body, and the first covering module body and the second covering module body are stacked up and down; wherein,

[0026] The first covering module body includes a first long covering module body and a first short covering module body; the second covering module body includes a second long covering module body and a second short covering module body;

[0027] The first long cover-type module body is located above the second short cover-type module body; and the first short cover-type module body is located above the second long cover-type module body.

[0028] Furthermore, the first long cover module body and the second long cover module body are equal in length, the first short cover module body and the second short cover module body are equal in length; the length of the first long cover module body is twice that of the first short cover module body.

[0029] Furthermore, special-shaped structures are provided at both ends of the covering module body for fixing the covering module body.

[0030] Furthermore, the width of the first covering film is smaller than the width of the covering module body by 0.4 mm to 0.6 mm; the width of the second covering film is larger than the width of the through groove by 1.6 mm to 2.4 mm.

[0031] To achieve the above-mentioned object, the present invention provides a rigid-flexible board, which is manufactured by any of the above-mentioned manufacturing methods.

[0032] In the technical solution of the present invention, the method for manufacturing a rigid-flexible board provided by the present invention is aimed at a rigid-flexible board with a flexible area on the outer layer and a "hollowed out" area on the inner layer. By providing a covering module with the same material as the dielectric layer of the inner rigid board, it can effectively utilize the material that expands and contracts consistently with the inner rigid board to form a well-matched filling groove, and utilize the heterogeneity of material properties to provide a processing basis for one-time pressing and typesetting, thereby preventing the problem of upper and lower deviation caused by multiple pressings. This manufacturing method reduces the processing of one pressing process, has fewer manufacturing processes, and can provide good processing effects for the rigid-flexible board with the flexible board on the outer layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0034] Figure 1 A schematic diagram of the process flow of a method for manufacturing a rigid-flexible board according to the present invention;

[0035] Figure 2 This is a structural schematic diagram of an embodiment of a rigid-flex board according to the present invention;

[0036] Figure 3 This is a schematic diagram of a rigid-flex board to be pressed together according to an embodiment of the present invention;

[0037] Figure 4 For the present invention Figure 3 Schematic diagram of the plane structure of the AA part;

[0038] Figure 5 For the present invention Figure 3 A schematic structural diagram of the middle cover module 150;

[0039] Figure 6 This is a schematic diagram of the main body planar structure of another cover module of a rigid-flex board of the present invention;

[0040] Figure 7 This is a schematic diagram of a portion of a rigid-flex board to be pressed together according to another embodiment of the present invention;

[0041] Figure 8 This is a schematic diagram of the cross-sectional structure of another cover module of a rigid-flex board of the present invention.

[0042] Description of Figure Numbers:

[0043] Label name Label name 100 Rigid-Flex PCB 151 Covering module body 110 Inner rigid board 1511 Special-shaped structure 110A Unit board area 1512 First covering module body 110B Invalid area 1513 Second covering module body 111 Through slot 152 First covering film 120 First prepreg 1521 First covering film layer 130 Second prepreg 1522 First covering film adhesive layer 140 Outer soft board 153 Second cover film 141 The first outer soft board 1531 Second covering film layer 142 Second outer soft board 1532 Second covering film layer 150 Overmolded Module 154 Silicone oil layer

[0044] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings and in conjunction with the embodiments. DETAILED DESCRIPTION

[0045] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0046] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0047] In addition, the terms "first," "second," and so on, used in this disclosure are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referenced. Thus, a feature specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this disclosure, "plurality" means at least two, such as two or three, unless otherwise specifically defined.

[0048] In the present invention, unless otherwise specified or limited, the terms "connection" and "fixation" should be understood in a broad sense. For example, "fixation" can mean fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will be able to understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0049] In addition, the technical solutions between the various embodiments of the present invention can be combined with each other, but it must be based on the fact that ordinary technicians in this field can implement it. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0050] In the existing technology, the processing flow of ordinary circuit boards generally includes: cutting; inner layer graphic process processing (pre-processing micro-etching, film photosensitive layer, exposure, development, etching, and film stripping); typesetting and lamination process processing; drilling process processing; electroplating (copper deposition, board electricity) process processing; outer layer graphic process processing; graphic electroplating process processing; solder mask process processing; surface treatment process processing; molding process processing; electrical testing process processing; FQC appearance inspection process processing; packaging process processing; and shipment. In the existing technology, the structure of a general rigid-flexible board is a structure in which the flexible board layer is in the inner layer. During the processing of this structure, inner layer graphic process processing, typesetting and pressing process processing, drilling process processing, electroplating process processing, outer layer graphic process processing, graphic electroplating process processing; solder mask process processing; surface treatment process processing; forming process processing (including controlled depth milling process processing); electrical testing process processing; FQC appearance inspection process processing; packaging process processing; the key control process for the product form to be transformed from the rigid board form in the processing process to the rigid-flexible board form is the controlled depth milling process processing, which is to "uncover" the rigid board layer covering the flexible board area to form a rigid-flexible board.

[0051] The manufacturing method of the rigid-flexible board of this embodiment focuses on the layout and pressing process.

[0052] Please refer to Figure 1 , Figure 1 This is a process flow diagram of a method for manufacturing a rigid-flexible board according to the present invention. Figure 2 This is a structural schematic diagram of a first embodiment of a rigid-flex board according to the present invention.

[0053] like Figure 2 As shown, the rigid-flex board 100 of this embodiment is composed of Figure 1 The manufacturing method is obtained, and the rigid-flexible composite board 100 includes, from the inside to the outside, an inner rigid board 110, a first semi-cured sheet 120 and a second semi-cured sheet 130 that are integrated into one, an outer soft board 140, and a second covering film 153 located at the through groove 111 in the bendable area, wherein the through groove 111 in the bendable area is located on the inner rigid board 110.

[0054] Please also refer to Figures 1 to 5 The steps of the method for manufacturing a rigid-flex board of the present invention specifically include:

[0055] Step S10: providing an outer layer soft board to be pressed, wherein the outer layer soft board includes a first outer layer soft board and a second outer layer soft board.

[0056] In this example, an outer layer flexible circuit board 140 is provided for lamination. Specifically, the outer layer flexible circuit board 140 is a pre-fabricated outer layer flexible circuit board. A flexible circuit board, also known as a flexible printed circuit board (FPC), is a highly reliable and highly flexible printed circuit board made from a polyimide or polyester film substrate. It features high wiring density, light weight, thin thickness, and excellent bendability, making it suitable for electronics applications requiring specialized signal transmission.

[0057] In this embodiment, outer flexible board 140 includes a first outer flexible board 141 and a second outer flexible board 142. This means that the rigid-flex board of the present invention is a rigid-flex board with flexible boards on both sides. Circuits are provided on first and second outer flexible boards 141, 142. The first and second outer flexible boards 141, 142 are merely for ease of understanding. In this embodiment, the first outer flexible board 141 is positioned at the top and the second outer flexible board 142 is positioned at the bottom, as an example, but this does not constitute a limitation on their characteristics.

[0058] Step S20: providing an inner rigid board located between the first outer soft board and the second outer soft board, wherein the inner rigid board is provided with a through groove in a bending area.

[0059] Specifically, an inner rigid board 110 is provided between the first outer flexible board 141 and the second outer flexible board 142. The inner rigid board 110 to be pressed together is also an inner rigid board with pre-fabricated circuits. The inner rigid board 110 can be a single-layer or multi-layer circuit board, which is not limited here and is subject to actual needs. The production process of the inner rigid board 110 refers to the production process of a general rigid circuit board and is not described in detail here. In this embodiment, because it is placed in the middle of the outer flexible board 140, it is referred to as the inner rigid board for ease of understanding.

[0060] In this embodiment, the inner rigid plate 110 is provided with a through groove 111 in the bending area. That is, the through groove 111 is formed in the area where the inner rigid plate 110 needs to be "hollowed out". The through groove 111 is formed by milling the plate according to the set size and shape.

[0061] Step S30: providing a first prepreg located on both sides of the inner rigid plate, wherein the first prepreg is provided with a first window at the through groove.

[0062] In this embodiment, the first semi-cured sheets 120 located on both sides of the inner rigid plate 110 include two first semi-cured sheets 120, and the two first semi-cured sheets 120 are arranged close to the inner rigid plate 110. The two first semi-cured sheets 120 are provided with a first window at the through groove 111, wherein the width of the first window is 0.6-1.2 mm greater than the width of the through groove 111. The width of the through groove 111 is set to D, and the width of the first window is set to A1, that is, 0.6 mm ≤ A1-D ≤ 1.2 mm. In specific applications, the through groove 111 is set in the middle of the first window of the first semi-cured sheet, that is, the single-sided window size of the first semi-cured sheet layer is 0.3 mm to 0.6 mm greater than the through groove size.

[0063] Step S40: providing a second prepreg located outside the first prepreg, wherein the second prepreg is provided with a second window at the through groove.

[0064] In this embodiment, the second semi-cured sheet 130 located on the outside of the first semi-cured sheet 120 includes two second semi-cured sheets 130, and the two second semi-cured sheets 130 are arranged close to the outside of the first semi-cured sheet 120. The two second semi-cured sheets 130 are provided with a second window at the through groove 111, wherein the width of the second window is 2.0-2.8mm greater than the width of the through groove 111. The width of the second window is set to A2, that is, 2.0mm≤A2-D≤2.8mm. In a specific application, the through groove 111 is arranged in the middle of the second window of the second semi-cured sheet, that is, the single-sided window size of the second semi-cured sheet 130 is 1.0mm to 1.4mm greater than the through groove size. The window size of the second semi-cured sheet is larger in order to reserve space for subsequent lamination and overflow glue. Furthermore, the first semi-cured sheet 120 and the second semi-cured sheet 130 form a stepped stacked arrangement structure.

[0065] In actual application, there is no particular order for steps S10 to S40.

[0066] Step S50: placing the inner rigid board, the first prepreg, the second prepreg, and the outer flexible board in order from the inside out, and placing a cover mold module at the through groove to form a rigid-flexible board to be pressed.

[0067] like Figure 3 As shown, the inner rigid board 110, the two first prepregs 120, the two second prepregs 130, and the two outer soft boards 140 are placed in sequence from the inside to the outside for pressing and layout, and a cover module 150 is placed at the through groove 110 to form a rigid-flexible board to be pressed.

[0068] Specifically, the cover mold module 150 is made of the same material as the dielectric layer of the inner rigid board. According to the size and shape of the through slot 111 , the cover mold module 150 is made with a slightly smaller size and the same shape.

[0069] In this embodiment, the covering module 150 includes a covering module body 151 and a first covering film 152 located on both sides of the covering module body and a second covering film 153 located on the outer side 152 of the first covering film, wherein the covering module body 151 and the first covering film 152 form the movable part of the covering module.

[0070] The covering module body 151 in the covering module 150 is made of the same material as the inner rigid board dielectric layer, that is, the part milled off at the through groove 111 can be recycled, or it can be a covering module body 151 made separately according to the process. There is no limitation here, but the covering module body 151 is mainly made according to the size and shape of the through groove 111. Specifically, the covering module body 151 is slightly smaller in size and has the same shape. More specifically, the thickness of the covering module body 151 is 0mm to 0.05mm smaller than the thickness of the inner rigid plate 110, the width of the covering module body 151 is 0.2mm smaller than the width of the through slot 111, and the length of the covering module body 151 is greater than the length of the through slot 111 and extends to the invalid area. In actual application, the covering module body 151 is placed in the middle of the through slot 111, that is, the width of one side of the covering module body 151 is 0.1mm smaller than the width of the through slot 111, and the thickness of one side of the covering module body 151 is 0mm to 0.025mm smaller than the thickness of the through slot 111, so that the covering module body 151 can be easily inserted into the through slot 111, and can be tightly combined with the through slot 111, and reserve a margin for the subsequent removal of the covering module body 151.

[0071] For details, please refer to Figure 4 In a plan view, the length of the first covering film 152 is 2.0 mm to 5.0 mm longer than the length of the covering module body 151. Assuming the length of the covering module body 151 is L1 and the length of the first covering film 152 is L2, that is, 2.0 mm ≤ L2 - L1 ≤ 5.0 mm. In actual application, the covering module body is located in the middle of the first covering film 152, that is, the length of a single side of the covering module body is 1.0 mm to 2.5 mm longer than the length of the covering module body 151. Among them, the covering module body 151 passes through the unit board area 110A of the inner rigid board 110 and extends to the invalid area 110B. The first covering film 152 is attached to the covering module body 151 and extends to the invalid area 110B of the inner rigid board 110. The length of the first covering film 152 toward the invalid area 110B of the inner rigid board 110 is greater than the length of the covering module body 151 toward the invalid area 110B of the inner rigid board 110. The single-side length difference is in the range of 1.0 mm to 2.5 mm. This overlapping design is used to fix the covering module body 151 on the invalid area 110B to prevent the covering module body 151 from falling off.

[0072] Among them, the width of the first covering film 151 is 0.4mm-0.6mm less than the width of the covering module body 151; the width of the second covering layer 153 is 1.6mm-2.4mm greater than the width of the through groove 111. Furthermore, the width of the covering module body 151 is set to E, the width of the first covering film 151 is set to B1, and the width of the second covering layer 153 is set to B2, that is, 0.4mm≤E-B1≤0.6mm, 1.6mm≤B2-D≤2.4mm. In actual application, the covering module body 151 and the first covering film 152 are located in the middle of the through groove 111 after being bonded. The single-side width of the first covering film 152 is 0.2mm to 0.3mm less than the width of the covering module body 151 to prevent glue overflow and bulge during pressing; and the single-side width of the second covering film 153 is 0.8mm to 1.2mm greater than the through groove, and is applied to the outer soft board 140.

[0073] like Figure 5 As shown, the first cover film 152 includes a first cover film layer 1521 and a first cover film adhesive layer 1522, and the second cover film 153 includes a second cover film layer 1531 and a second cover film adhesive layer 1532. Furthermore, the first cover film adhesive layer 1522 is located on both sides of the cover module body 151; the second cover film adhesive layer 1532 is located on the inner side of the outer flexible board 140; the first cover film layer 1521 and the second cover film layer 1531 are arranged adjacent to each other.

[0074] In specific operation, the first cover film adhesive layer 1522 of the first cover film 152 is applied to the molded module body 151, and the second cover film adhesive layer 1532 of the second cover film 153 is applied to the inner side of the outer flexible board 140, that is, toward the inner rigid board 110. The width of the second cover film 153 is greater than the first window width of the first prepreg, so that the first prepreg abuts against the second cover film 153.

[0075] Step S60: performing a lamination process on the rigid-flex board to be laminated, and performing a post-processing process after the lamination process.

[0076] In this embodiment, the rigid-flexible board to be laminated is subjected to a lamination process. This lamination process is a lamination process for a rigid board. The existing lamination process flow is referred to and will not be described in detail here. Similarly, after the lamination process, post-processing is performed. Post-processing may include, but is not limited to, drilling, electroplating (copper plating, board electroplating), outer layer patterning, pattern electroplating, solder mask processing, surface treatment, etc., which refer to the existing post-processing process flow and will not be described in detail here.

[0077] Step S70: performing a forming process on the rigid-flexible board after the post-processing, extracting the movable portion of the overmolding module located in the through groove to form a rigid-flexible board.

[0078] Specifically, the rigid-flexible board after post-processing is subjected to a forming process, and the movable part of the covering module located in the through groove 111 is pulled out. The movable part is the covering module body 151 and the first covering film 152 of the covering module 150. That is, the covering module body 151 and the first covering film 152 of the covering module 150 are pulled out together, thereby manufacturing the rigid-flexible board 100.

[0079] The present invention provides a method for manufacturing a rigid-flexible board. By providing a covering module 150 made of the same material as the dielectric layer of the inner rigid board 110, it can effectively utilize the material that expands and contracts in the same way as the inner rigid board 110 to form a well-matched filling groove 111, providing a processing basis for one-time pressing and typesetting, and preventing the problem of upper and lower deviation caused by multiple pressings. This manufacturing method reduces the processing of one pressing process, has fewer manufacturing processes, and can provide a good processing effect for the rigid-flexible board with the flexible board on the outer layer.

[0080] See also Figure 6 The manufacturing method of this embodiment is the same as that of the above-mentioned embodiment, except that in the pressing and typesetting process of this embodiment, special-shaped structures 1511 are provided at both ends of the covering module body 151. The special-shaped structures 1511 are arranged axially symmetrically and are used to fix the covering module body; correspondingly, special-shaped grooves (not shown) for placing the special-shaped structures are provided at both ends of the through groove 111. The special-shaped structure is a "T"-shaped special-shaped structure or an "S"-shaped special-shaped structure, etc., and the corresponding special-shaped grooves 1511 are a "T"-shaped special-shaped groove or an "S"-shaped special-shaped groove, etc. Providing the special-shaped structures 1511 at both ends of the covering module body 151 can effectively fix the covering module body 151 and effectively prevent the covering module body 151 from shifting or deviating during the pressing process, thereby improving the pressing alignment accuracy.

[0081] The length of the covering module body 151 is greater than the length of the through slot 111 and extends to the ineffective area. The special-shaped structure 1511 is located in the ineffective area, which is convenient for milling after the final molding process.

[0082] See also Figure 7The manufacturing method of this embodiment is the same as that of the above-mentioned embodiment, except that a silicone oil layer 154 is provided between the first cover film layer 1521 and the second cover film layer 1531 during the lamination and typesetting process. Silicone oil layer 154 provides a better release effect, facilitating subsequent removal of the removable portion of the overmolding module and facilitating operation. Silicone oil layer 154 can be formed by coating, printing, or spraying onto the first cover film layer 1521 or the second cover film layer 1531, or it can be a separate silicone oil paper, without limitation.

[0083] This embodiment also illustrates another implementation in which the overmolded module body 151 includes a first overmolded module body 1512 and a second overmolded module body 1513 disposed one above the other. Specifically, the overmolded module body 151 can be divided into two layers, upper and lower, which facilitates free filling with adhesive during the subsequent lamination process and facilitates subsequent removal of the overmolded module.

[0084] See also Figure 8 The manufacturing method of this embodiment is the same as the manufacturing method of the above embodiment, except that the covering module body 151 in the pressing and typesetting process of this embodiment includes a first covering module body 1512 and a second covering module body 1513, and the first covering module body 1512 and the second covering module body 1513 are stacked up and down.

[0085] The first covering module body 1512 includes a first long covering module body C1 and a first short covering module body C2; the second covering module body 1512 includes a second long covering module body C3 and a second short covering module body C4; the first long covering module body C1 is located above the second short covering module body C4; and the first short covering module body C2 is located above the second long covering module body C3. Specifically, the length of the first long covering module body C1 is equal to the length of the second long covering module body C3, and the length of the first long covering module body C1 is equal to twice the length of the first short covering module body C2. That is, the covering module body 151 can be divided into two layers, and the upper and lower layers are respectively arranged in two sections. The upper layer of the covering module body 151 can be divided into a long section and a short section, and the lower layer of the covering module body 151 can be divided into a long section and a short section, wherein the length of the long section is twice the length of the short section. The long section of the upper layer corresponds to the short section of the lower layer, and is arranged in a staggered and superimposed manner.

[0086] In the longitudinal direction, the arrangement of the upper and lower layers in this embodiment is conducive to the free filling effect formed by the short side of the covering module body following the flow of the colloid; the arrangement of the long and short segments can effectively ensure the free filling effect formed by the flow of the colloid in the rectangular through groove. Therefore, the staggered arrangement of the long and short segments in the upper and lower layers can prevent the problem of board surface depression caused by poor filling at the cut-off position.

[0087] In this embodiment, by coordinating the size settings between the layers, it is possible to effectively prevent insufficient or excessive glue filling during the pressing process; the overall structure and processing method can provide good processing effects for the rigid-flexible board on the outer layer of the flexible board.

[0088] To sum up, in the technical solution of the present invention, the method for manufacturing a rigid-flexible board provided by the present invention, by providing a covering module with the same material as the dielectric layer of the inner rigid board, can effectively utilize the material that expands and contracts consistently with the inner rigid board to form a well-matched filling groove, providing a processing basis for one-time pressing and typesetting, and preventing the problem of upper and lower deviation caused by multiple pressings. The manufacturing method reduces the processing of one pressing process, has fewer manufacturing processes, and can provide a good processing effect for the rigid-flexible board with the flexible board on the outer layer.

[0089] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made by using the contents of the present invention description and drawings under the inventive concept of the present invention, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A method for manufacturing a rigid-flex board, characterized in that: The method comprises: Providing an outer layer soft board to be pressed, wherein the outer layer soft board includes a first outer layer soft board and a second outer layer soft board; Providing an inner rigid board located between the first outer soft board and the second outer soft board, wherein the inner rigid board is provided with a through groove in a bending area; Providing a first prepreg located on both sides of the inner rigid plate, wherein the first prepreg is provided with a first window at the through groove; Providing a second prepreg located outside the first prepreg, wherein the second prepreg is provided with a second window at the through groove; The inner rigid board, the first prepreg, the second prepreg, and the outer flexible board are placed in order from the inside out, and a cover mold module is placed at the through groove to form a rigid-flexible board to be pressed; The covering module includes a covering module body, a first covering film located on both sides of the covering module body, and a second covering film located outside the first covering film, wherein the width of the covering module body is less than the width of the through groove by 0.2 mm, and the covering module body and the first covering film form a movable part of the covering module; The first covering film includes a first covering film layer and a first covering film adhesive layer, and the second covering film includes a second covering film layer and a second covering film adhesive layer; wherein the first covering film adhesive layer is located on both sides of the cover module body; the second covering film adhesive layer is located on the inner side of the outer soft board; the first covering film layer and the second covering film layer are arranged adjacent to each other; The covering module body includes a first covering module body and a second covering module body, wherein the first covering module body and the second covering module body are stacked up and down; wherein, The first covering module body includes a first long covering module body and a first short covering module body; the second covering module body includes a second long covering module body and a second short covering module body; The first long cover module body is located above the second short cover module body; the first short cover module body is located above the second long cover module body; Both ends of the covering module body are provided with special-shaped structures, and the special-shaped structures are "T"-shaped special-shaped structures or "S"-shaped special-shaped structures for fixing the covering module body; Performing a lamination process on the rigid-flexible board to be laminated, and performing a post-processing process after the lamination process; The rigid-flexible board after the post-processing is subjected to a forming process, and the movable part of the cover module located in the through groove is extracted to form the rigid-flexible board.

2. The production method according to claim 1, wherein: The width of the first window is 0.6-1.2 mm greater than the width of the through groove; the width of the second window is 2.0-2.8 mm greater than the width of the through groove.

3. The production method according to claim 1, wherein A silicone oil layer is provided between the first covering film layer and the second covering film layer.

4. The production method according to claim 1, wherein: The first long cover module body and the second long cover module body are of equal length, the first short cover module body and the second short cover module body are of equal length; the length of the first long cover module body is twice that of the first short cover module body.

5. The production method according to claim 1, wherein: The width of the first covering film is 0.4 mm to 0.6 mm smaller than the width of the covering module body; the width of the second covering film is 1.6 mm to 2.4 mm larger than the width of the through groove.

6. A rigid-flex board, characterized in that: The rigid-flex board is manufactured by the manufacturing method according to any one of claims 1 to 5.

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